Electronic device

Abstract

The embodiment of the invention provides electronic equipment which comprises a support and an equipment body, and the support is rotationally connected to the side, away from a display screen, of a rear cover of the electronic equipment so as to be switched between a closed state and an open state. The air cooling device is provided with an air inlet and an air outlet, the rear cover is provided with a first air inlet hole and an air outlet hole, when the support is in an open state, the air inlet of the air cooling device is communicated with the outside through the first air inlet hole, and the air outlet of the air cooling device is communicated with the outside through the air outlet hole. The rear cover is provided with a support area and a non-support area, and the first air inlet holes are formed in the support area. When the support is in the closed state, the projection of the support on the rear cover in the thickness direction of the electronic equipment coincides with the support area. According to the air-cooled heat dissipation framework of the electronic equipment provided by the embodiment of the invention, the air inlet holes are hidden below the bracket, and the air outlet holes can be hidden to a certain extent, so that the attractiveness of the whole machine is improved.

Description

[0001] This application claims priority to Chinese Patent Application No. 202510297071.0, filed on March 11, 2025, entitled "Electronic Device", the entire contents of which are incorporated herein by reference.

[0002] This application claims priority to Chinese Patent Application No. 202510405173.X, filed on March 31, 2025, entitled "Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of heat dissipation in electronic devices, and more particularly to an electronic device. Background Technology

[0004] Some electronic devices can be combined with stands to facilitate user use in various scenarios. For example, 2-in-1 products are a new type of laptop that combines the functions of a tablet and a laptop. When the stand of a 2-in-1 product is opened, it helps the device stand upright on a desk, allowing it to be used as a personal computer (PC) for convenience in office work, multimedia entertainment, and more. 2-in-1 products come in two types: tablet-only and integrated stand-only. The tablet-only type does not have a built-in stand and requires an external stand for support. The integrated stand-only type has a built-in stand integrated into the device, resulting in a thinner and lighter design.

[0005] Most 2-in-1 products have high performance requirements and generate significant heat during use, necessitating an air-cooling architecture for heat dissipation. The air-cooling layouts for the two product types mentioned above are basically the same. The fan and heat source are concentrated in the half of the main unit, using a side-intake and side-exhaust airflow method. Both the air intake and exhaust vents are exposed on the side frame of the main unit, disrupting the integrity of the chassis's appearance and resulting in a lack of aesthetic appeal.

[0006] Therefore, in the existing technology, the air intake and exhaust vents of the air-cooled heat dissipation architecture of electronic devices are exposed, which affects the overall aesthetics of the device. Summary of the Invention

[0007] The electronic device provided in this application embodiment solves the problem that the air inlet and outlet holes are exposed in the air-cooled heat dissipation architecture of existing electronic devices, which affects the aesthetics of the whole machine.

[0008] This application provides an electronic device, including a bracket and a device body. The device body includes a display screen and a housing. The housing has a back cover and a side frame. The display screen and the back cover are respectively mounted on both sides of the side frame in the thickness direction of the electronic device. The bracket is rotatably connected to the side of the back cover away from the display screen to switch between a closed state and an open state.

[0009] The electronic device also includes a cooling unit, which is installed inside the housing. The cooling unit has an air inlet and an air outlet, and the rear cover is provided with a first air inlet hole and an air outlet hole. When the bracket is in the open state, the air inlet of the cooling unit is connected to the outside through the first air inlet hole to receive air, and the air outlet of the cooling unit is connected to the outside through the air outlet hole to discharge air.

[0010] The back cover has a support area and a non-support area. The air inlet of the air-cooling device is correspondingly located in the support area of ​​the back cover, and the first air inlet is located in the support area. The support area is the area on the back cover where the support is projected along the thickness direction of the electronic device when it is closed. The area on the back cover outside the support area is the non-support area.

[0011] The electronic device provided in this application includes a stand and a device body. The stand is rotatably connected to the back cover of the device body, making it a two-in-one device with a built-in stand. When the stand is open, it provides support for the device, allowing it to be used on a table. When the stand is closed, it maintains a comfortable grip and is easy to carry.

[0012] The electronic device also includes a fan-cooling unit, which dissipates heat during use, alleviates overheating issues, and improves operating efficiency. The fan-cooling unit has an air inlet and an air outlet. External air enters the device through the air inlet and is then expelled through the air outlet. A first air inlet is located on the back cover of the electronic device. When the bracket is open, this first air inlet connects the fan-cooling unit's air intake to the outside. In other words, the first air inlet is the fan-cooling inlet for the device when the bracket is open, and its location on the back cover indicates a fan-cooling layout with air intake from the back cover. An air outlet is also located on the back cover, connecting the fan-cooling unit's air outlet to the outside. In other words, the air outlet serves as the fan-cooling outlet for the device, and its location on the back cover indicates a fan-cooling layout with air exhaust from the back cover. The overall fan-cooling strategy is "air intake from the back cover, air exhaust from the back cover," eliminating the need for vents on the side frames and ensuring the integrity of the side frame's appearance.

[0013] Furthermore, the back cover has a bracket area and a non-bracket area. The bracket area is the area covered by the projection of the bracket along the thickness direction of the electronic device onto the back cover when the bracket is closed; that is, the area covered when the bracket is closed. The non-bracket area is the other areas not covered by the bracket. The first air intake vent is located within the bracket area. When the bracket is closed, the first air intake vent can be covered by the bracket, and the user cannot see it from the outside. When the bracket is open, the user generally only views the electronic device from the front (i.e., the side where the display screen is located), and will not see the first air intake vent or the air exhaust vent, thus improving the overall aesthetics of the device. Furthermore, the air exhaust vent can also be located within the bracket area and covered by the bracket, or located within the non-bracket area and covered in other ways, further enhancing the overall aesthetics of the device.

[0014] Therefore, in the air-cooled heat dissipation architecture of the electronic device provided in this application embodiment, the air inlet is hidden under the bracket, and the air outlet can also be hidden to a certain extent, which improves the overall aesthetics of the device.

[0015] In one possible implementation, the air vent is located within the bracket area, and when the bracket is in the open state, the projection of the bracket on the back cover along the thickness direction of the electronic device does not overlap or partially overlaps with the air vent.

[0016] With the above solution, the air outlet is also located within the bracket area. When the bracket is closed, it covers the air outlet, making it invisible to the user and further improving aesthetics. When the bracket is open, the projection of the bracket along the thickness direction of the electronic device onto the back cover does not overlap with or only partially overlaps with the air outlet. This means the air outlet can be fully exposed or only partially exposed, allowing for normal airflow and ensuring smooth operation of the air-cooling system when the bracket is open.

[0017] In one possible implementation, when the bracket is open, the air outlet is exposed relative to the bracket, allowing for normal airflow. When the bracket is closed, the air outlet is obscured by the bracket, making it invisible to the user and further improving aesthetics.

[0018] In one possible implementation, the support area and non-support area of ​​the back cover are arranged along the width direction of the electronic device. Multiple first air inlets are spaced apart within the support area. Multiple air outlets are also spaced apart within the support area and located on the side of the multiple first air inlets closer to the non-support area along the width direction of the electronic device. The air outlets are positioned close to the non-support area, thus making it relatively easy for them to be exposed when the support is opened.

[0019] In one possible implementation, when the bracket is in the open state, the projection of the bracket on the back cover along the thickness direction of the electronic device does not overlap with the air outlet, and the air outlet and the first air inlet are located on both sides of the bracket along the thickness direction.

[0020] With the above design, when the bracket is fully opened or opened to a sufficiently large angle, the air outlet is fully exposed, and the bracket as a whole is positioned between the air outlet and the first air inlet. At this time, the bracket can act as a barrier, preventing the exchange of hot air around the air inlet with the cold air around the first air outlet, thereby preventing hot air backflow and optimizing the heat dissipation effect.

[0021] In one possible implementation, the air outlet is located in the non-support area; The electronic device also includes a decorative element, which is fixedly connected to the back cover and is positioned on the side of the air vent facing away from the display screen. The projection of the air vent in the thickness direction of the electronic device is located on the decorative element. The decorative element is provided with ventilation holes that penetrate the decorative element along the thickness direction of the electronic device.

[0022] By adopting the above solution, the air outlet is located in the non-bracket area, so the air outlet width is not affected by the bracket opening angle. The air outlet path is decoupled from the bracket opening and closing, ensuring heat dissipation performance. Furthermore, using decorative parts to cover the air outlets prevents them from being directly exposed, improving aesthetics to some extent. These decorative parts can be designed and manufactured independently, offering diverse shapes and flexible ventilation hole shapes and layouts. The production and processing of the decorative parts and the back cover can be decoupled, making the process relatively easy to implement.

[0023] Furthermore, since the first air inlet and the air outlet are not in the same area, when the bracket is opened, the entire bracket is positioned between the air outlet and the first air inlet. At this time, the bracket can act as a barrier, preventing the exchange of hot air around the air inlet with the cold air around the first air outlet, thereby preventing hot air backflow and optimizing the heat dissipation effect.

[0024] In one possible implementation, there are multiple ventilation holes, and the cross-section of each ventilation hole is any one of a circle, a regular hexagon, or a rectangle.

[0025] In one possible implementation, the support area and non-support area of ​​the back cover are arranged along the width direction of the electronic device. There are multiple first air inlets, spaced apart within the support area. There are also multiple air outlets, spaced apart within the non-support area and located at the edge of the non-support area near the support area.

[0026] With the above solution, the air vents are located near the bracket area, close to heat dissipation components such as the air-cooling device, which shortens the airflow path. Furthermore, the air vents, decorative elements, and bracket area can be grouped together, avoiding any impact on the appearance of other parts of the back cover.

[0027] In one possible implementation, the decorative element has an air outlet area and a non-air outlet area. The air outlet area is the area where the ventilation hole is located, and the area outside the air outlet area is the non-air outlet area. The projection of the ventilation hole in the thickness direction of the electronic device is located within the air outlet area, and the non-air outlet area is fixedly connected to the back cover.

[0028] With the above solution, all ventilation holes on the decorative component are distributed within the air outlet area. The projection of the air outlet holes onto the thickness of the electronic device lies within the air outlet area, thus ensuring smooth airflow. The non-air outlet area is fixedly connected to the back cover. There are no ventilation holes in the non-air outlet area. The decorative component is fixed to the back cover using the non-air outlet area to avoid affecting the airflow and to make reasonable use of the space on the decorative component.

[0029] In one possible implementation, the non-air outlet area includes two bonding areas, which are respectively located on both sides of the air outlet area along the width direction of the decorative part. An adhesive layer is provided between each bonding area and the back cover, and the decorative part is fixedly connected to the back cover through the adhesive layer. The thickness of the decorative part is less than or equal to 0.2 mm, the width of the decorative part is less than or equal to 5 mm, and the width of each bonding area is less than or equal to 0.6 mm.

[0030] Using the above solution, the two bonding areas on the decorative component are symmetrically distributed, and each bonding area is relatively large, resulting in strong adhesion to the back cover and improving the reliability of the bond between the decorative component and the back cover. Making the decorative component thinner reduces the space it occupies on the thickness of the electronic device, which is beneficial for embedded design and improves the overall aesthetics and tactile comfort. Making the bonding area narrower reduces the area of ​​the non-air outlet area, thereby increasing the area of ​​the air outlet area and the layout space of the ventilation holes on the decorative component. This allows for an increase in the number of ventilation holes and the area of ​​each ventilation hole, thus improving the overall airflow of the device.

[0031] In one possible implementation, the electronic device further includes a structural component mounted within the housing and positioned opposite the air outlet. A color-developing layer is provided on the back cover, positioned opposite the non-air outlet area of ​​the decorative component along the thickness direction of the electronic device. The color of the structural component facing the air outlet is the same as the color of the color-developing layer.

[0032] By adopting the above solution, a color-developing layer is set on the back cover in the non-air outlet area opposite the decorative part. The color of the color-developing layer is consistent with the color of the structural part facing the air outlet, which can improve the aesthetics of electronic devices.

[0033] In one possible implementation, the decorative component includes a main body segment and two snap-fit ​​segments, with the two snap-fit ​​segments respectively located at both ends of the main body segment along the length of the decorative component. The back cover has corresponding slots for each snap-fit ​​segment, and each snap-fit ​​segment engages within its corresponding slot. The main body segment is adhesively fixed to the surface of the back cover, and each snap-fit ​​segment is welded to the inner wall of the slot.

[0034] Using the above solution, the decorative piece has a "U"-shaped structure, with both ends snapped onto the back cover via locking sections, enhancing the connection strength between the decorative piece and the back cover. The main body section has a large contact surface and adhesive area with the back cover, ensuring strong adhesion. Welding the locking sections to the inner wall of the slots prevents them from detaching, further improving the connection strength between the decorative piece and the back cover and reducing the risk of the decorative piece falling off.

[0035] In one possible implementation, the surface on the back cover opposite the decorative element includes a flat surface and two curved surfaces, with the two curved surfaces disposed on both sides of the flat surface. The main body segment of the decorative element includes a flat segment and two curved segments. Along the length of the decorative element, the two curved segments are respectively connected to the two ends of the flat segment, and the flat segment is fitted to the flat surface of the back cover, while the two curved segments are fitted to the two curved surfaces of the back cover.

[0036] By adopting the above solution, the shape of the decorative part matches the shape of the back cover, fits better, improves the reliability of bonding and fixing, reduces the risk of the decorative part rebounding and falling off, and has a high production yield.

[0037] In one possible implementation, the width of the air outlet is in the range of 1mm to 2.5mm to ensure a better air outlet effect.

[0038] In one possible implementation, when the air outlet is located within the bracket area and the bracket is in the open state, the minimum distance between the bracket and the non-bracket area of ​​the back cover is in the range of 1.5mm to 5mm.

[0039] Using the above design, the distance between the boundary line of the bracket and the boundary line of the non-bracket area of ​​the back cover is within the range of 1.5mm to 5mm. This distance can be understood as the air outlet width. The air outlet width is greater than the width of the air outlet hole to avoid the bracket obstructing the air outlet path and ensure the air outlet effect. Furthermore, the air outlet width is not too large to prevent the first air inlet and the air outlet hole from being exposed on the same side of the bracket, thus avoiding hot air recirculation.

[0040] In one possible implementation, the electronic device further includes a motherboard and a heat-generating device disposed on the motherboard. The motherboard is installed inside the housing and is disposed in the thickness direction of the electronic device corresponding to the support area of ​​the back cover. Electronic devices also include heat-conducting structures and heat-dissipating structures. The heat-dissipating structure is set to correspond to the air outlet of the air-cooling device. Part of the heat-conducting structure is in contact with the motherboard, and part of it is in contact with the heat-dissipating structure.

[0041] The above solution utilizes a heat-conducting structure to concentrate the heat generated by the heat-generating components on the motherboard to the heat dissipation structure. This structure is located at the air outlet of the air-cooling unit, allowing airflow from the unit to pass directly through it before exiting through the vents on the back cover, carrying away the heat. Furthermore, the motherboard is positioned corresponding to the bracket area, shortening the heat dissipation path and reducing the area required for the heat-conducting structure. This ensures effective heat dissipation while saving materials and costs. On the other hand, by placing the motherboard and its heat-generating components in the bracket area, the bracket also provides insulation, preventing users from experiencing excessively high temperatures when holding the device and resulting in a more comfortable user experience.

[0042] In one possible implementation, there are two air-cooling devices and two heat dissipation structures. The two air-cooling devices are arranged on both sides of the motherboard along the length of the electronic device, and the two heat dissipation structures are arranged corresponding to the two air-cooling devices. The heat-conducting structure includes a main body and two branch parts connected together. The main body is stacked with the motherboard in the thickness direction of the electronic device and contacts the heat-generating device. The two branch parts are spaced apart on both sides of the main body in the length direction of the electronic device, and each branch part is stacked with and contacts the heat dissipation structure on its side in the thickness direction of the electronic device.

[0043] The above-described scheme involves distributing two air-cooling devices along the length of the electronic device, with a heat dissipation structure for each device. The main body of the heat-conducting structure contacts the heat-generating components on the motherboard, while the branches extend to overlap with the various heat dissipation structures, thus uniformly dissipating heat from all parts of the electronic device and optimizing the heat dissipation effect. In some possible implementations, only one air-cooling device may be provided, or three air-cooling devices may be spaced apart along the length of the electronic device, or two air-cooling devices may be spaced apart along the width of the electronic device. The number and location of the heat dissipation structures and the number and location of the branches of the heat-conducting structure correspond to the number of air-cooling devices; this embodiment does not impose any limitations on this.

[0044] In one possible implementation, the heat-conducting structure is a heat pipe or a vapor chamber, and the heat dissipation structure is a heat sink fin. The heat sink fin includes multiple heat dissipation channels, each with an inlet and an outlet. The inlet faces the air outlet of the air-cooling device, and the outlet faces the air outlet on the rear cover. The heat dissipation channels act as air guides, directing the air from the air outlet of the air-cooling device to the air outlet on the rear cover, ensuring efficient airflow.

[0045] In one possible implementation, the electronic device further includes a second air inlet, which is disposed on the side frame of the housing, and the air inlet of the air-cooling device is connected to the outside through the second air inlet.

[0046] Using the above solution, a second air inlet is provided on the side frame of the equipment. This second air inlet is unaffected by the opening and closing of the bracket and remains exposed, serving as an air intake when the bracket is closed, thus establishing a cooling path. When the bracket is open, the second air inlet can also allow airflow, satisfying a larger air volume requirement. Although a second air inlet is provided, since the equipment's cooling demand is lower when the bracket is closed, the number of second air inlets can be appropriately reduced to avoid affecting the integrity of the side frame.

[0047] In one possible implementation, there is a gap between the air-cooling device and the rear cover, and a guide structure is provided inside the housing. The guide structure has a guide surface, one end of which is aligned with the second air inlet on the side frame along its extension direction, and the other end is aligned with the gap.

[0048] Using the above solution, a gap is created between the air-cooling device and the rear cover, allowing air entering the device from the side frame to reach the air inlet of the air-cooling device through this gap. A guide structure is installed inside the housing to guide the airflow, ensuring that air entering through the second air inlet flows smoothly into the gap between the air-cooling device and the rear cover.

[0049] In one possible implementation, the guide structure is made of plastic. Plastic is not only highly malleable but also has low density and is relatively lightweight, thus avoiding adding too much weight to the equipment.

[0050] In one possible implementation, when the air outlet is located within the bracket area and the bracket is in a closed state, there is a gap between the bracket and the non-bracket area of ​​the back cover, and the air outlet communicates with the outside through the gap.

[0051] With the above solution, when the bracket is closed, the bracket and the non-bracket area of ​​the back cover are not completely sealed, but a gap of a certain width is opened to allow air to blow out from the vent, thus forming a complete air-cooling heat dissipation path to cool the equipment.

[0052] In one possible implementation, the projection of the gap onto the back cover along the thickness direction of the electronic device is located in the non-bracket area, and when the bracket is in the closed state, the surface of the bracket on the side opposite to the back cover covers the air vent in the thickness direction of the electronic device.

[0053] With the above solution, when the bracket is in the closed state, the air outlet can be completely covered by the bracket, which can ensure both the air outlet effect and the aesthetics of the equipment.

[0054] In one possible implementation, a first inclined surface is provided at the end of the bracket near the non-bracket area, the first inclined surface being inclined relative to the thickness direction of the electronic device, and a second inclined surface is provided at the end of the non-bracket area of ​​the back cover near the bracket, the second inclined surface being inclined relative to the thickness direction of the electronic device.

[0055] The first inclined surface and the second inclined surface are opposite to each other and spaced apart, and the angle at which the first inclined surface is tilted relative to the thickness direction of the electronic device is the same as the angle at which the second inclined surface is tilted relative to the thickness direction of the electronic device.

[0056] Using the above solution, the end face of the bracket and the end face of the non-bracket area of ​​the back cover are fitted together by bevels on both sides of the gap. The two bevels are tilted at the same angle relative to the thickness direction of the electronic device, forming a uniform air duct for the air to be blown out from the vent. The first bevel is set at the end of the bracket, and the tilt of the first bevel can also be used to cover the air outlet, so as to achieve full coverage of the air outlet when the bracket is closed.

[0057] In one possible implementation, the angles at which the first inclined surface is tilted relative to the thickness direction of the electronic device and the angles at which the second inclined surface is tilted relative to the thickness direction of the electronic device are both within the range of 25° to 60°, within which the air outlet effect is better.

[0058] In one possible implementation, the width of the gap is in the range of 0.5mm to 2mm. Within this range, the gap width is neither too large nor too small, balancing airflow efficiency and the aesthetics of the device.

[0059] In one possible implementation, the bracket can rotate relative to the back cover about a first axis. When the air vent is set entirely within the bracket area, the first axis is spaced apart from the back cover and is located on the side of the back cover away from the display screen.

[0060] Using the above scheme, there is a certain distance between the first axis and the back cover, and the rotation trajectory of the bracket near the non-bracket area of ​​the back cover is an arc. When the bracket switches from the closed state to the open state, it moves away from the back cover in the thickness direction of the electronic device, and also gradually moves away from the non-bracket area of ​​the back cover in the width direction of the electronic device. Therefore, when the air outlet is set in the bracket area, as the opening angle of the bracket increases, the air outlet width gradually increases, and the air outlet can be slowly exposed.

[0061] In one possible implementation, when the air vent is located in the non-bracket area, the first axis is located on the surface of the back cover on the side away from the display screen.

[0062] Using the above solution, the rotation trajectory of the end of the bracket near the non-bracket area of ​​the back cover is a point. Regardless of the angle the bracket is opened, the distance between it and the non-bracket area of ​​the back cover remains constant. The bracket and the non-bracket area of ​​the back cover can always fit tightly together, thus ensuring that the bracket covers the bracket area on the back cover in all states, improving aesthetics. Furthermore, it reduces the design complexity of the hinge assembly, allowing for a more compact overall hinge assembly.

[0063] In one possible implementation, the bracket is rotatably connected to the back cover via a pivot assembly; the pivot assembly includes a base and a rotating seat, the base being fixedly connected to the back cover and the rotating seat being fixedly connected to the bracket; An arc-shaped sliding structure is provided between the base and the rotating seat. The arc-shaped sliding structure includes an arc-shaped slider and an arc-shaped groove that are slidably connected to each other. One of the arc-shaped slider and the arc-shaped groove is located on the base, and the other is located on the rotating seat, so that the rotating seat is slidably connected to the base. The center of the extended trajectory of the arc-shaped groove is located on the first axis.

[0064] Using the above scheme, the base and the rotating seat are rotatably connected via a virtual axis. The base is fixed to the back cover, and the bracket is fixed to the rotating seat; thus, the bracket and the back cover are also rotatably connected via a virtual axis. The virtual axis between the base and the rotating seat is the straight line containing the center of the extended trajectory of the arc-shaped groove. Setting the virtual axis at a predetermined position on the first axis can achieve the desired rotational effect. Furthermore, the virtual axis has a simple structure and saves more space.

[0065] In one possible implementation, the rotating shaft assembly further includes a damping shaft and a damping block. The damping block includes a first rotating part and a second rotating part spaced apart. The first rotating part is rotatably connected to the rotating seat, the second rotating part is rotatably connected to the damping shaft, and the damping shaft is slidably connected to the base.

[0066] The above scheme incorporates a damping shaft and a damping block within the rotating shaft assembly. The damping shaft is pivotally connected to the rotating seat via a first rotating part and to the damping base via a second rotating part. Furthermore, the damping shaft is slidably connected to the base, allowing the damping block to slide relative to the base. During the opening and closing of the bracket, the rotating seat rotates relative to the base. Simultaneously, the damping block rotates relative to the rotating seat's axis, the damping shaft, and the base. The damping block assists the rotating seat's rotation. As the damping block and damping shaft rotate relative to each other, they rub against each other, generating a constantly changing damping force. This improves the stability of the bracket's rotation, provides a comfortable feel for the user, and allows the damping force to be designed to suspend the bracket at the desired angle.

[0067] In one possible implementation, the air-cooling device is a fan, which includes a housing and fan blades, with the fan blades disposed inside the housing.

[0068] The housing includes an upper cover, a lower cover, and a side wall. The upper cover and the lower cover are spaced apart in the thickness direction of the electronic device, with the lower cover facing the display screen. The side wall is located between the upper cover and the lower cover and surrounds the outer periphery of the fan blade. The air inlet is located on the upper cover, and the air outlet is located on the side wall. The back cover of the electronic device has a fan area, which serves as the top cover for the fan. The first air inlet in the fan area serves as the air inlet for the fan. The fan area is the region on the back cover in which the fan is projected along the thickness direction of the electronic device.

[0069] With the above design, since the first air intake is located on the rear cover, and the fan's air intake is located on the upper cover of the fan with the upper cover facing the rear cover, the fan's air intake can directly face the first air intake, resulting in a shorter air intake path and higher air intake efficiency. The fan's air outlet is located on the side wall to ensure smooth airflow. The area on the rear cover corresponding to the fan serves as both the rear cover structure and the fan's upper cover. Combining the upper cover and part of the rear cover structure into one increases the fan's thickness, improves fan performance, and further optimizes heat dissipation.

[0070] In one possible implementation, the fan area in the back cover is integrated with other areas of the back cover in the electronic device.

[0071] The above solution uses a coverless design for the fan, with the fan area on the back cover serving as the top cover. Compared to a solution where the fan top cover is separate from the back cover of the electronic device, the fan thickness can be increased by about 0.4mm without changing the overall thickness of the device, thus achieving a benefit in heat dissipation efficiency.

[0072] In one possible implementation, foam is provided between the fan sidewall and the back cover. The fan sidewall rests against the foam, providing cushioning and preventing compression damage between the fan sidewall and the back cover.

[0073] In one possible implementation, the fan area in the back cover is set as a separate structure from other areas of the back cover in the electronic device.

[0074] The above solution involves retaining the top cover of the fan in a complete design, while hollowing out the fan area on the back cover and embedding the entire fan into that area. The fan top cover replaces this part of the structure in the back cover. Compared to solutions where the fan top cover and the back cover of the electronic device are separate, the fan thickness can be increased by 0.8mm to 1mm without changing the overall thickness of the device, resulting in higher heat dissipation efficiency.

[0075] In one possible implementation, the top cover includes a bottom and a rim that are connected together, with the rim surrounding the outer periphery of the bottom; the surface of the bottom facing away from the display screen is flush with the surface of other areas of the back cover facing away from the display screen; the rim is located on the side of the bottom near the display screen in the thickness direction of the electronic device; and in a direction perpendicular to the thickness direction of the electronic device, at least a portion of the structure of the rim is stacked with the sidewall of the fan.

[0076] Using the above solution, the back of the fan top cover is flush with the back of other areas on the rear cover, ensuring the flatness of the rear cover's back surface and maintaining consistent coating throughout. In a direction perpendicular to the thickness direction of the electronic device, at least a portion of the edge of the fan top cover is layered with the fan sidewall. For example, the edge can be embedded inside the sidewall or surround the outside of the sidewall, thereby creating a sealed environment between the edge and the sidewall, preventing air leakage between the fan top cover and the electronic device's rear cover, and avoiding impact on fan operating efficiency. It also strengthens the connection between the top cover and the sidewall.

[0077] In one possible implementation, multiple first air inlets are provided in the fan area of ​​the rear cover, and the multiple first air inlets are arranged in a multi-layered nested ring shape.

[0078] The above scheme involves setting multiple rings of nested first air inlets within the fan area. These first air inlets are distributed within a circular area, similar in shape to the fan area, thus making efficient use of space. Furthermore, the close arrangement of these multiple rings of first air inlets maximizes space utilization, allowing for the installation of more first air inlets and increasing the airflow.

[0079] In one possible implementation, the diameter of the circular area containing multiple first air inlets within the fan area is in the range of 30mm to 40mm, each first air inlet is a circular hole, and the diameter of each first air inlet is in the range of 0.8mm to 1.2mm.

[0080] By adopting the above solution, the shape, size, and distribution area of ​​the first air inlet are limited to the above range, which can ensure the air intake volume while taking into account aesthetics and simple production process.

[0081] In one possible implementation, the sidewall of the fan is fixedly connected to the back cover of the electronic device by multiple fixing structures, which are spaced apart along the outer periphery of the fan. Each fixing structure includes a first fixing part, a second fixing part, and a fastener. The first fixing part is disposed on the outer wall surface of the side wall of the fan, and the second fixing part is disposed on the back cover of the electronic device and located on the side of the back cover facing the display screen. The first fixing part and the second fixing part are stacked in the thickness direction of the electronic device and are fixedly connected by the fastener.

[0082] Using the above solution, the fan sidewall is fixed to the back cover as a whole by fasteners, which has high connection strength and reduces the risk of the fan becoming loose from the back cover due to vibration during operation. Attached Figure Description

[0083] Figure 1 This is a schematic diagram of the electronic device in the first reference design; Figure 2 This is a schematic diagram of the electronic device in the second reference design; Figure 3a This is a schematic diagram of the air-cooled heat dissipation architecture of the electronic device in the second reference design; Figure 3b for Figure 3a A schematic diagram of the cross-sectional structure at position AA in the middle; Figure 4a This is a schematic diagram of the rear structure of the electronic device according to a first embodiment of the present application, wherein the bracket is in a closed state; Figure 4b This is a side view of the first embodiment of the electronic device according to the present application, wherein the bracket is in a closed state; Figure 5a This is a schematic diagram of the rear structure of the electronic device according to a first embodiment of the present application, wherein the bracket is in the open state; Figure 5b This is a three-dimensional structural diagram of the first embodiment of the electronic device according to the present application, wherein the bracket is in an open state; Figure 5c This is a side view of the first embodiment of the electronic device according to the present application, wherein the bracket is in the open state; Figure 6 This is a schematic diagram of the back structure of the electronic device according to the first embodiment of this application, with the bracket removed. Figure 7 This is a schematic diagram illustrating the principle structure of the air-cooled heat dissipation architecture in the first embodiment of the electronic device of this application. Figure 8 This is a schematic diagram of the heat conduction principle of the air-cooled heat dissipation architecture in the first embodiment of the electronic device of this application. Figure 9a This is a schematic diagram of the layout of the air-cooled heat dissipation architecture in the first embodiment of the electronic device of this application; Figure 9b This is a schematic diagram of the layout of the air-cooled heat dissipation architecture from another perspective in the first embodiment of the electronic device of this application. Figure 9c This is a schematic diagram of another layout of the air-cooled heat dissipation architecture in the first embodiment of the electronic device of this application; Figure 10This is a schematic diagram of the structure of a fan in an electronic device according to an embodiment of this application; Figure 11 This is a schematic diagram of the heat sink structure in the electronic device according to an embodiment of this application; Figure 12 This is a schematic diagram of the cooperation structure between the fan and the heat sink fins in the electronic device of this application embodiment; Figure 13 This is a schematic diagram of the rear structure of a second embodiment of the electronic device according to the present application, wherein the bracket is in a closed state; Figure 14 This is a schematic diagram of the disassembly structure of the decorative component in the second embodiment of the electronic device of this application. Figure 15 This is a three-dimensional structural diagram of a second embodiment of the electronic device according to the present application, wherein the bracket is in an open state; Figure 16 This is a schematic diagram illustrating the principle structure of the air-cooled heat dissipation architecture in the second embodiment of the electronic device of this application. Figures 17a to 17c This is a schematic diagram of the decorative element in a second embodiment of the electronic device according to the present application. Figure 17d This is a schematic diagram of the connection structure between the decorative part and the back cover in an electronic device according to an embodiment of this application; Figure 17e This is a schematic diagram showing the shape of the decorative component in the electronic device according to an embodiment of this application; Figure 18a This is a schematic diagram of the air-cooled heat dissipation architecture in the second embodiment of the electronic device of this application. Figure 1 ; Figure 18b This is a schematic diagram of the air-cooled heat dissipation architecture in the second embodiment of the electronic device of this application. Figure 2 ; Figure 19a This is a schematic diagram of the side frame structure in the third embodiment of the electronic device according to the present application; Figure 19b This is a structural schematic diagram of the side frame from another perspective in the third embodiment of the electronic device according to the present application. Figure 20a This is a schematic diagram of the layout of the air-cooled heat dissipation architecture in the third embodiment of the electronic device of this application; Figure 20b for Figure 20a A magnified view of part B in the middle section; Figure 21 This is a schematic diagram illustrating the principle structure of the air-cooled heat dissipation architecture in the third embodiment of the electronic device of this application. Figure 22a for Figure 20bA partial sectional view at position CC; Figure 22b for Figure 20b A partial sectional view of the DD position in the middle; Figure 23 This is a schematic diagram of the rear structure of the electronic device according to the fourth embodiment of the present application, wherein the bracket is in a closed state; Figure 24 This is a schematic diagram of the gap between the bracket and the non-bracket area of ​​the back cover in the fourth embodiment of the electronic device of this application. Figure 25 This is a schematic diagram of another structure of the gap between the bracket and the non-bracket area of ​​the back cover in the fourth embodiment of the electronic device of this application; Figure 26a This is a three-dimensional schematic diagram of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is in a closed state; Figure 26b This is a side view of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is in a closed state; Figure 27a This is a three-dimensional schematic diagram of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 30°; Figure 27b This is a side view of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 30°; Figure 28a This is a three-dimensional schematic diagram of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 90°; Figure 28b This is a side view of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 90°; Figure 29 This is a schematic diagram of the rotation trajectory of the bracket in the fifth embodiment of the electronic device of this application. Figure 30a This is a perspective view of the bracket and the back cover cooperating in a sixth embodiment of the electronic device according to the present application, wherein the bracket is in a closed state; Figure 30b This is a side view of the bracket and the back cover cooperating in the sixth embodiment of the electronic device of this application, wherein the bracket is in a closed state; Figure 31a This is a perspective view of the bracket and the back cover cooperating in the sixth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 30°; Figure 31b This is a side view of the bracket and the back cover cooperating in the sixth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 30°; Figure 32a This is a perspective view of the bracket and the back cover cooperating in the sixth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 90°; Figure 32b This is a side view of the bracket and the back cover cooperating in the sixth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 90°; Figure 33 This is a schematic diagram of the rotation trajectory of the bracket in the sixth embodiment of the electronic device of this application. Figure 34 This is a three-dimensional structural diagram of the hinge assembly in the electronic device according to an embodiment of this application; Figure 35 This is an exploded structural diagram of the hinge assembly in the electronic device according to an embodiment of this application; Figures 36a to 36f This is a schematic diagram illustrating the assembly process of the hinge assembly in the electronic device according to an embodiment of this application; Figure 37 This is a schematic diagram illustrating the principle structure of the seventh embodiment of the electronic device according to this application. Figure 38 This is a schematic diagram of the back structure of the electronic device according to the seventh embodiment of the present application, with the bracket removed; Figure 39 This is a schematic diagram of the mating structure between the fan sidewall and the rear cover in the seventh embodiment of the electronic device of this application. Figure 40 for Figure 39 A partial sectional view of the EE location; Figure 41 This is a schematic diagram of the principle structure of the eighth embodiment of the electronic device of this application; Figure 42 This is a schematic diagram of the mating structure between the fan top cover and the rear cover in the eighth embodiment of the electronic device of this application. Figure 43 This is a schematic diagram of the mating structure between the fan sidewall and the rear cover in the eighth embodiment of the electronic device of this application. Figure 44 for Figure 43 A partial cross-sectional view of the FF position in the middle; Figure 45 This is a schematic diagram showing the distribution of the first air inlet in the fan area of ​​the back cover in the eighth embodiment of the electronic device of this application.

[0084] Explanation of reference numerals in the attached figures: First reference design: 100', Electronic device; 1', Stand; 2', Body.

[0085] Second reference design: 100'', Electronic device; 1'', Stand; 2'', Device body; 221'', Side frame; 222'', Back cover; 225'' air inlet; 224'' air outlet; 3'', Fan; 31'', Air inlet; 32'', Air outlet; 52'' Battery module; 227'' Audio opening; 228'' Audio module; 51'', Mainboard; 511'', Heating components; 61'', Thermal conductive structure; 62'', Heat dissipation fins; 71'', Gap.

[0086] This application: 100. Electronic equipment; 1. Stand; 2. Equipment body; 21. Display screen; 22. Housing; 221. Side frame; 222. Back cover; 222A. Bracket area; 222B. Non-bracket area; 222C, Fan area; 222D, Protruding area; 2220, Slot; 2221, Flat surface; 2222, Curved surface; 223. First air inlet; 224. Air outlet; 225. Second air inlet; 226. Recess; 227. Audio opening; 3. Air-cooled unit; 31. Air inlet; 32. Air outlet; 33. Fan blades; 34. Outer casing; 341. Top cover; 3411. Bottom; 3412. Edge binding; 343. Bottom cover; 344. Side wall; 345. Foam; 4. Decorative parts; 41. Ventilation holes; 421. Air outlet area; 422. Non-air outlet area; 423. Bonding area; 431. Main body section; 4311. Flat section; 4312. Curved section; 432. Snap-fit ​​section; 51. Mainboard; 511. Heating element; 52. Battery module; 53. Adhesive layer; 54. Color development layer; 55. Structural component; 61. Thermally conductive structure; 611. Main body; 612. Branch section; 62. Heat dissipation structure; 621. Heat dissipation channel; 6211. Inlet; 6212. Outlet; 71. Clearance; 72. Guide structure component; 721. Guide surface; 73. Gap; 731. First inclined plane; 732. Second inclined plane; 733. Notch; 734. Curved surface; 735. Vertical surface; 8. Rotating shaft assembly; 81. Base; 811. First part; 812. Second part; 82. Rotating seat; 83. Arc-shaped sliding structure; 831. Arc-shaped slider; 832. Arc-shaped groove; 84. Straight groove; 85. Damping shaft; 86. Damping block; 861. First rotating part; 862. Second rotating part; 87. Slider; 881. First screw; 882. Second screw; 89. Fixing structure; 891. First fixing part; 892. Second fixing part; 893. Fastener; Z: Thickness direction of the electronic device; X: Length direction of the electronic device; Y: Width direction of the electronic device; L, thickness direction of the support; O, first axis. Detailed Implementation

[0087] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application will be presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0088] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0089] The following explains the terminology that may appear in the embodiments of this application.

[0090] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0091] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0092] The limitations such as parallel, perpendicular, and identical (e.g., identical length, identical width, etc.) mentioned in the embodiments of this application are all relative to the current technological level, and not absolute and strict definitions in a mathematical sense. There may be a deviation within a predetermined angular range between two mutually parallel or perpendicular radiators. In one embodiment, the predetermined angle is 10°, and for example, the deviation may be within the range of ±5°.

[0093] The limitations mentioned in the embodiments of this application, such as collinearity, coaxiality, coplanarity, symmetry (e.g., axial symmetry, or central symmetry), parallelism, perpendicularity, and similarity (e.g., same length, same width, etc.), are all relative to the current technological level and are not absolutely strict mathematical definitions. There may be a predetermined angle (e.g., ±5°, ±10°) deviation between two mutually parallel or perpendicular structures.

[0094] In the description of this application, it should be understood that "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in a circuit structure are connected through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB).

[0095] Relative / Relative Setting: A relative setting with B can refer to A and B being face-to-face. For example, when two components are set relative to each other, these two components overlap in at least a portion of their area along a certain direction.

[0096] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0097] Some electronic devices can be combined with stands to facilitate user use in various scenarios. For example, 2-in-1 products are a new type of laptop that combines the functions of a tablet and a laptop. When the stand of a 2-in-1 product is opened, it helps the device stand upright on a desktop, allowing it to be used as a personal computer (PC), providing convenience for office work, multimedia entertainment, and more. 2-in-1 products include two types: tablet-based and stand-in integrated.

[0098] Please see Figures 1 to 3b , Figure 1 This is a schematic diagram of the electronic device in the first reference design; Figure 2 This is a schematic diagram of the electronic device in the second reference design; Figure 3a This is a schematic diagram of the air-cooled heat dissipation architecture of the electronic device in the second reference design; Figure 3b for Figure 3a A schematic diagram of the cross-sectional structure at position AA.

[0099] like Figure 1 As shown, in the first reference design, the electronic device 100' is a host-tablet hybrid device, including a body 2'. The body 2' itself does not include a stand; instead, it is supported by an external stand 1'. In this type of device, the body 2' and stand 1' are separate, making it inconvenient to carry. Furthermore, when the stand 1' is mounted on the device, the overall thickness is relatively large, resulting in poor hand comfort. For example... Figure 2 As shown, in the second reference design, the electronic device 100'' is a two-in-one device with an integrated host and stand. Its body includes the device body 2'' and the stand 1''. The stand 1'' is directly integrated into the body, making it easy to carry and giving it a lighter and thinner feel.

[0100] Those skilled in the art will understand that 2-in-1 devices are typically equipped with heat dissipation architectures such as heat conduction and liquid cooling. For example, heat is conducted to the outside of the device through thermally conductive materials, or coolant is circulated to remove heat from the heat source and dissipate it into the environment through a heat sink. However, many users use 2-in-1 products as PCs, combining them with external devices such as keyboards for office work. Therefore, the performance requirements for 2-in-1 products are high, and the devices carry a lot of hardware and software, resulting in significant heat generation during use. Therefore, a fan-cooled architecture is also necessary to improve heat dissipation efficiency. The fan-cooled heat dissipation layouts for the two product types mentioned above are basically the same: the fan and heat source are concentrated in one half of the main unit, using a side-intake and side-exhaust airflow method. Both the air intake and exhaust vents are exposed on the side frame of the main unit, disrupting the integrity of the chassis appearance and resulting in insufficient aesthetics.

[0101] like Figures 2 to 3bAs shown, taking the integrated stand type device as an example, its air-cooled heat dissipation architecture includes a fan 3'', and the device casing 34'' has an air inlet 225'' and an air outlet 224''. External air enters the device through the air inlet 225'', passes through the fan 3'' and is blown out through the air outlet 224'', thus carrying away the heat generated by the heat source. Figure 3a In the diagram, the dashed line marks the boundary of bracket 1''. The area below the dashed line is where bracket 1'' is located, or it can be understood as the area covered by bracket 1'' in the thickness direction of the electronic device when it is in a closed state; this is simply referred to as the bracket area. The area above the dashed line is the non-bracket area, i.e., the area not covered by bracket 1. For example... Figures 2 to 3a As shown, the battery module 52'', audio module and other components are placed in the bracket area, while the heat source and fan 3'' are concentrated in the non-bracket area. The heat source includes the motherboard 51'' and the heat-generating components 511'' (such as CPU (Central Processing Unit)) mounted on the motherboard 51''.

[0102] like Figures 3a to 3b As shown, the electronic device 100'' also includes a heat-conducting structure 61'' and heat dissipation fins 62'', which are also located in the non-support area. The heat-conducting structure 61'' is, for example, a heat pipe or vapor chamber (VC, also known as a planar heat pipe or vapor chamber). The heat-conducting structure 61'' contacts heat-generating components 511'' such as the CPU on the motherboard 51'', transferring the heat dissipated by the heat-generating components 511'' to the heat dissipation fins 62'' near the fan 3'' exhaust vent 32''.

[0103] Furthermore, the air inlet 31'' and air outlet 32'' of the electronic device 100'' are both located on the side frame 221'', and the air inlet 225'' and air outlet 224'' are located on two adjacent side frames of the side frame 221''. The fan 3'' has an air inlet 31'' facing the rear cover 222'' of the electronic device 100'', and a gap 71'' is left between the fan 3'' and the rear cover 222''. External air enters the device from the air inlet 225'' on one side frame, and is then drawn into the air inlet 31'' of the fan 3''. Driven by the fan blades of the fan 3'', it is blown out of the fan 3'' from the air outlet 32'', passes through the heat dissipation fins 62'', and is blown out from the air outlet 224'' on the other side frame, carrying away the heat gathered on the heat dissipation fins 62'', thus achieving a "side air intake, side air exhaust" air-cooling heat dissipation cycle.

[0104] like Figure 2As shown, the presence of multiple air inlets 225'' and multiple air outlets 224'' on the side frame of the device body 2'' disrupts the integrity of the device's appearance. Furthermore, as... Figure 3a As shown, in one possible implementation, to improve heat dissipation, the electronic device 100'' is equipped with two fans 3'', and each fan 3'' has an air inlet 225'' and an air outlet 224'' near its frame, resulting in a large number of air vents on the side frame. For example... Figure 2 As shown, the electronic device 100'' also includes an audio module 228'', and multiple audio openings 227'' are provided on the side frame 221'' to ensure the device's sound reception and audio output performance. The large number of audio openings 227'' and vents significantly impacts the device's aesthetic appearance.

[0105] Therefore, in the existing technology, the air intake and exhaust vents of the air-cooled heat dissipation architecture of electronic devices are exposed, which affects the overall aesthetics of the device.

[0106] To address the aforementioned problems, this application provides an electronic device that adjusts the overall air-cooling layout and cleverly utilizes a bracket to cover the air vents, thereby improving the overall aesthetics of the device. The solution described in this application will be detailed below.

[0107] Please see Figures 4a to 5c , Figure 4a This is a schematic diagram of the rear structure of the electronic device according to a first embodiment of the present application, wherein the bracket is in a closed state; Figure 4b This is a side view of the first embodiment of the electronic device according to the present application, wherein the bracket is in a closed state; Figure 5a This is a schematic diagram of the rear structure of the electronic device according to a first embodiment of the present application, wherein the bracket is in the open state; Figure 5b This is a three-dimensional structural diagram of the first embodiment of the electronic device according to the present application, wherein the bracket is in an open state; Figure 5c This is a side view of the first embodiment of the electronic device according to the present application, wherein the bracket is in the open state.

[0108] This application provides an electronic device 100, which may be, but is not limited to, a mobile phone, notebook computer, tablet computer, e-book reader, laptop computer, monitor, personal digital assistant (PDA), personal computer (PC), and other electronic products. This does not limit the scope of protection of this application. The following description uses a tablet computer as an example to illustrate the structure of the electronic device 100.

[0109] like Figures 4a to 5c As shown, the electronic device 100 includes a bracket 1 and a device body 2. The bracket 1 is rotatably connected to the device body 2 to switch between a closed state and an open state. Alternatively, it can be understood that the electronic device 100 is a two-in-one device with the bracket 1 integrated into the body 2. When the bracket 1 is in a closed state... Figures 4a to 4b When in the closed position as shown, the entire device maintains a flat shape, ensuring a comfortable grip and easy portability. When stand 1 is in the [position missing]... Figures 5a to 5c When in the open state, the stand 1 can support the device body 2, allowing the device to be placed on a desktop or other platform for use as a PC. At this time, the user can use the device for entertainment such as watching videos or movies, or for office work in conjunction with external devices such as a keyboard and mouse.

[0110] It should be noted that when the bracket 1 is in the open state, this embodiment does not limit the angle at which it is open relative to the device body 2 (which can be understood as the angle at which the bracket 1 rotates from the closed state to the open state). For example, when the bracket 1 is in the open state (specifically, when the bracket 1 is fully open, i.e., rotated to the maximum angle), its angle at which it is open relative to the device body 2 can be 120°, 90°, 65°, 45°, 30°, etc. When the bracket 1 is between the closed and open states (or can be understood as not fully open), it can hover at a preset angle, such as 30°, 60°, etc., or it can hover at any angle between 0° and the maximum angle. The maximum angle of rotation and the preset hovering angle of the bracket 1 can be set according to actual needs, and this embodiment does not limit this.

[0111] Furthermore, the device body 2 includes a display screen 21 and a housing 22. The housing 22 has an internal space for accommodating, mounting, and protecting internal electronic components, while the display screen 21 is used to display images. The housing 22 has a back cover 222 and side frames 221. The display screen 21 and the back cover 222 are respectively mounted on both sides of the side frame 221 in the thickness direction Z of the electronic device. A bracket 1 is rotatably connected to the side of the back cover 222 opposite to the display screen 21 to switch between a closed state and an open state.

[0112] It should be noted that the specific shapes of the bracket 1, side frame 221, and back cover 222 are not limited in this embodiment. For example... Figure 4b , Figure 5b As shown, in one possible implementation, the area on the back cover 222 corresponding to the bracket 1 is recessed towards the side where the display screen 21 is located, forming a groove 226 for accommodating the bracket 1. When the bracket 1 is in the closed state, it can be completely housed within the groove 226, and the back of the bracket 1 (the surface facing away from the display screen 21) and the back of the back cover 222 (the surface facing away from the display screen 21) remain flush, improving the comfort of holding the bracket. In some possible implementations, the bracket 1 may also protrude from the back cover 222 when closed; this embodiment does not limit this.

[0113] It should be noted that the specific structure and type of the display screen 21 are not limited in the embodiments of this application. The display screen 21 may be, but is not limited to, an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, or a quantum dot light-emitting diode (QLED) display screen, etc.

[0114] It should be noted that the embodiments of this application do not limit the specific types, quantities, and locations of electronic components inside the electronic device 100. For example, the electronic device 100 may include a battery module 52 (see reference). Figure 9a This is used to store electrical energy and power other electronic components. In one possible implementation, the electronic device 100 also includes a motherboard 51 (see reference). Figure 8 The motherboard 51 is used to integrate electronic components and circuits. For example, it can house a central processing unit (CPU), a graphics processing unit (GPU), random access memory (RAM), a communication module, a data interface, a display control chip, a power management chip, a camera interface, an audio processing module, a sensor interface, and so on. Furthermore, the electronic device 100 may include one or more sub-boards to expand the functionality of the motherboard 51, providing additional interfaces or connecting other peripheral devices. For example, a radio frequency management module, a SIM card interface, and a button interface may be mounted on the sub-board. Alternatively, the electronic device 100 may not have sub-boards and may integrate all functional modules onto the motherboard 51; this application does not impose any restrictions on this.

[0115] In one possible implementation, the electronic device 100 includes an audio module (not shown in the figure), which may include a speaker module, a microphone module, etc. The microphone module is used to receive external sounds, and the speaker module is used for audio output. Figure 4b As shown, the side frame 221 of the electronic device 100 is provided with a plurality of audio openings 227, some of which are sound receiving holes (or pickup holes), which are the inlet 6211 for external sound to enter the microphone module and are connected to the sound guide tube of the microphone module. The other part serves as a sound outlet (or speaker opening), which is the outlet 6212 for sound and is connected to the sound cavity of the speaker module. It should be noted that the embodiments of this application do not limit the number, position, and shape of the audio openings 227; the accompanying drawings are for illustrative purposes only.

[0116] Please see Figures 6 to 7 , Figure 6 This is a schematic diagram of the back structure of the electronic device according to the first embodiment of this application, with the bracket removed. Figure 7 This is a schematic diagram of the principle structure of the air-cooled heat dissipation architecture in the first embodiment of the electronic device of this application.

[0117] like Figures 6 to 7 As shown, the electronic device 100 also includes a cooling device 3, which is installed inside the housing 22. The cooling device 3 has an air inlet 31 and an air outlet 32. The rear cover 222 is provided with a first air inlet 223 and an air outlet 224. When the bracket 1 is in the open state, the air inlet 31 of the cooling device 3 communicates with the outside through the first air inlet 223 to receive air, and the air outlet 32 ​​of the cooling device 3 communicates with the outside through the air outlet 224 to discharge air.

[0118] The air-cooling device 3 can dissipate heat from the equipment, alleviating the heat generation problem during use and improving operating efficiency. The air-cooling device 3 has an air inlet 31 and an air outlet 32. External air enters the equipment and then enters the air-cooling device 3 through the air inlet 31, and is then blown out through the air outlet 32. The rear cover 222 of the electronic device 100 is provided with a first air inlet 223. When the bracket 1 is open, the first air inlet 223 connects the air inlet of the air-cooling device 3 with the outside. It can be understood that the first air inlet 223 is the air-cooling inlet of the equipment when the bracket 1 is open. The placement of the first air inlet 223 on the rear cover 222 is a heat dissipation layout that allows air to enter from the rear cover 222. An air outlet 224 is also provided on the rear cover 222. The air outlet 224 connects the air outlet 32 ​​of the air-cooling device 3 to the outside. It can be understood that the air outlet 224 can serve as the air-cooling outlet of the device. The air outlet 224 is also located on the rear cover 222, which means that the heat dissipation layout adopts the air outlet of the rear cover 222. The air-cooling strategy of the whole machine is "air intake and air exhaust through the rear cover". Both the air intake and air outlet 224 are located on the rear cover 222, eliminating the need to open air vents on the side frame and ensuring the integrity of the side frame appearance.

[0119] Furthermore, the back cover 222 has a support area 222A and a non-support area 222B. The air inlet 31 of the air-cooling device 3 is correspondingly arranged with the support area 222A of the back cover 222, and the first air inlet 223 is arranged within the support area 222A. When the support 1 is in the closed state, the projection of the support 1 along the thickness direction Z of the electronic device on the back cover 222 coincides with the support area 222A, and the area on the back cover 222 other than the support area 222A is the non-support area 222B.

[0120] The bracket area 222A is the area covered by the projection of the bracket 1 along the thickness direction Z of the electronic device onto the back cover 222 when the bracket 1 is closed; that is, the area covered when the bracket 1 is closed. The non-bracket area 222B is the other area not covered by the bracket 1. The air inlet 31 of the air-cooling device 3 is correspondingly arranged to the bracket area 222A of the back cover 222. This can be understood as the air-cooling device 3 being located at a position corresponding to the bracket area 222A, and the first air inlet 223 is also located within the bracket area 222A. Figure 4a As shown, when the bracket 1 is in the closed state, the first air inlet 223 can be covered by the bracket 1, and the user cannot see the first air inlet 223 from the outside. Figures 5a to 5c As shown, when the bracket 1 is in the open state, the user generally only observes the electronic device 100 from the front (i.e., the side where the display screen 21 is located), and will not see the first air inlet 223 and the air outlet 224, thus improving the overall aesthetics of the device. Furthermore, the air outlet 224 can also be located within the bracket area 222A and concealed by the bracket 1 (e.g., Figure 4a(as shown), or set within the non-bracket area 222B, and use other methods to cover it (e.g.) Figure 13 (As shown in the image), further enhancing the overall aesthetics of the machine.

[0121] Therefore, in the air-cooled heat dissipation architecture of the electronic device 100 provided in this application embodiment, the air inlet is hidden below the bracket 1, and the air outlet 224 can also be hidden to a certain extent, which improves the overall aesthetics of the device.

[0122] It should be noted that the specific ranges of the stent region 222A and the non-stent region 222B are not limited in this embodiment. Figure 4a , Figure 6 As shown, in one possible implementation, the support region 222A and the non-support region 222B of the back cover 222 are arranged along the width direction Y of the electronic device. Specifically, the support 1 can rotate relative to the back cover 222 about a first axis O, which is parallel to the length direction X of the electronic device. In the width direction Y of the electronic device, a boundary line of the support 1 away from the side frame 221 in the closed state (… Figure 6 The dashed line P in the diagram serves as the dividing line, and the area on one side of it ( Figure 6 The area below the dashed line P is entirely the support area 222A, and the area on the other side ( Figure 6 The entire area above the dashed line P is the non-support region 222B. In some possible implementations, the non-support region 222B can also be a ring-shaped region, surrounding the support region 222A inside it. Alternatively, the first axis O of the support 1 can be parallel to the width direction Y of the electronic device, dividing the support region 222A and the non-support region 222B along the length direction X of the electronic device. There are many other ways to divide the support region 222A and the non-support region 222B, which will not be listed in this application.

[0123] It should be noted that this application embodiment does not limit the number, shape, or specific arrangement of the first air inlet 223 and air outlet 224. For example... Figure 6 As shown, in one possible implementation, there are multiple first air inlets 223, which are arranged at intervals within the bracket area 222A. Specifically, dozens, hundreds, or even thousands of first air inlets 223 can be provided. While ensuring sufficient airflow, the more first air inlets 223 there are, the smaller the size of each first air inlet 223 can be, preventing users from seeing the internal components of the electronic device 100 through the holes, and also providing a certain degree of dust and dirt prevention. Figure 6 As shown, in one possible implementation, multiple first air inlets 223 can be distributed within a rectangular area. Alternatively, the first air inlets 223 can also be arranged only within the area corresponding to the air inlets of the air-cooling device 3 (e.g., Figure 39(The effect shown is not limited to this embodiment.) Figure 6 As shown, in one possible implementation, each first air inlet 223 is a circular hole, which facilitates manufacturing. Furthermore, the first air inlet 223 can also be a square hole, a triangular hole, a polygonal hole, etc., and the shape of each first air inlet 223 can be different; this application embodiment does not impose any limitations on this.

[0124] like Figure 6 As shown, in one possible implementation, there are multiple air outlets 224, arranged at intervals. Specifically, in one possible implementation, the multiple air outlets 224 are arranged at intervals along the length direction X of the electronic device. In other possible implementations, the multiple air outlets 224 may also be arranged at intervals along the width direction Y of the electronic device, or distributed in an array, etc. Those skilled in the art will understand that the position and arrangement of the air outlets 224 are related to the position of the air outlet 32 ​​of the air-cooling device 3, and the shape and position of the bracket 1, and can be flexibly set according to actual needs. Figure 6 As shown, in one possible implementation, each air outlet 224 is a racetrack-shaped hole (the cross-section of the hole approximates a circular racetrack), and the length of the air outlet 224 is parallel to the width direction Y of the electronic device. This allows the area of ​​the air outlet 224 to be maximized without affecting the appearance of the back cover 222, thereby improving airflow efficiency. Furthermore, the air outlet 224 can also be a square hole, a triangular hole, a polygonal hole, etc., and the shape of each first air inlet 223 can be different; this embodiment does not impose any limitations on this.

[0125] like Figure 6 As shown, the rear cover 222 has a larger layout area compared to the side frame 221. Therefore, the number of vents in the solution provided in this application embodiment is greater than that in the rear cover 222. Figure 2 The illustrated scheme can be more varied, and the total area of ​​the air vents can be larger, increasing the air intake efficiency and air exhaust efficiency. Therefore, the electronic device 100 provided in this application embodiment also has an improved air cooling effect.

[0126] like Figures 4a to 7 As shown, in one possible implementation, the air outlet 224 is disposed within the bracket area 222A. When the bracket 1 is in the open state, the projection of the bracket 1 along the thickness direction Z of the electronic device onto the back cover 222 does not overlap or partially overlaps with the air outlet 224. By also disposing the air outlet 224 within the bracket area 222A, when the bracket 1 is in the open state... Figure 4aIn the closed state, the bracket 1 can cover the air outlet 224, making it invisible to the user. Only a seam separates the bracket 1 from the back cover 222, further enhancing aesthetics. When the bracket 1 is open, its projection along the thickness direction Z of the electronic device onto the back cover 222 does not overlap with or only partially overlaps with the air outlet 224. This means the air outlet 224 can be fully exposed or only partially exposed, allowing for normal airflow and smooth operation of the air-cooling system when the bracket 1 is open. Those skilled in the art will understand that the size of the exposed area of ​​the air outlet 224 when the bracket 1 is open is related to the degree to which the bracket 1 is open. For example, when the bracket 1 is fully open or opened to a specific angle, the air outlet 224 can be fully exposed. When the angle of the bracket 1 is between 0° and that specific angle, only a portion of the air outlet 224 may be exposed, while the other portion remains covered by the bracket 1. The specific angle can be 20°, 40°, 55°, etc., and the embodiments of this application do not limit it.

[0127] like Figure 6 As shown, in one possible implementation, multiple air outlets 224 are arranged at intervals within the bracket region 222A, and are located on the side of the multiple first air inlets 223 near the non-bracket region 222B in the width direction Y of the electronic device. Alternatively, the air outlets 224 can be understood as being positioned near the non-bracket region 222B, thus making it relatively easy for the air outlets 224 to be exposed when the bracket 1 is opened. In some possible implementations, the air outlets 224 can also be positioned in other locations, as long as normal airflow is ensured when the bracket 1 is opened; this embodiment does not impose any limitations on this.

[0128] like Figure 7 As shown, in one possible implementation, when the bracket 1 is in the open state, the projection of the bracket 1 along the thickness direction Z of the electronic device onto the back cover 222 does not overlap with the air outlet 224, and the air outlet 224 and the first air inlet 223 are located on opposite sides of the bracket 1 along the thickness direction L. Alternatively, it can be understood that when the bracket 1 is fully open or opened to a sufficiently large angle, the air outlet 224 is fully exposed, and the bracket 1 as a whole is positioned between the air outlet 224 and the first air inlet 223. At this time, the bracket 1 can act as a barrier, preventing the exchange of hot air around the air inlet 31 with the cold air around the first air outlet 224, thereby preventing hot air recirculation and optimizing heat dissipation. It can be seen that compared to... Figure 2The air-cooled heat dissipation layout provided in this application embodiment can also solve the problem of hot air recirculation, improve the air-cooling efficiency of the system, and achieve higher performance. In some possible implementations, when the bracket 1 is in the open state, the air outlet 224 and the first air inlet 223 can also be partially located on the same side of the bracket 1, as long as the heat dissipation efficiency can be guaranteed. This application embodiment does not impose any restrictions on this.

[0129] like Figure 6 As shown, in one possible implementation, the width c1 of the air outlet 224 is in the range of 1mm to 2.5mm, such as 1mm, 1.1mm, 1.5mm, 2.3mm, 2.5mm, etc., and is not specifically limited. In some possible implementations, the width of the air outlet 224 may also be less than 1mm or greater than 2.5mm. This application embodiment does not limit this, and the specific design should be based on the required air outlet effect. The width direction of the air outlet 224 is parallel to the width direction Y of the electronic device. In some possible implementations, the width direction of the air outlet 224 may also be designed to be parallel to the length direction X of the electronic device. This application embodiment does not limit this.

[0130] like Figure 5c As shown, in one possible implementation, when the air outlet 224 is located within the bracket area 222A and the bracket 1 is in the open state (meaning fully open), the minimum distance c2 between the bracket 1 and the non-bracket area 222B of the rear cover 222 is within the range of 1.5mm to 5mm. Alternatively, it can be understood that the distance between the boundary line of the bracket 1 and the boundary line of the non-bracket area 222B of the rear cover 222 is within the range of 1.5mm to 5mm. This distance can be understood as the air outlet width, i.e., the lateral dimension of the air outlet opening, whose size directly affects the airflow distribution and heat dissipation effect of the air-cooled heat dissipation system. The range of the air outlet width is greater than the range of the width of the air outlet 224 to avoid the bracket 1 blocking the air outlet path and ensure the air outlet effect. Furthermore, the air outlet width will not be too large to prevent the first air inlet 223 and the air outlet 224 from being exposed on the same side of the bracket 1, causing hot air recirculation. In some possible implementations, the air outlet width can also be less than 1.5mm or greater than 5mm without affecting the heat dissipation efficiency; this embodiment does not impose any limitations on this.

[0131] It should be noted that the embodiments of this application do not limit the specific location and structure of heat dissipation components such as the air-cooling device 3 in the electronic device 100. Several possible solutions are illustrated below with reference to the accompanying drawings.

[0132] Please see Figures 8 to 12 , Figure 8 This is a schematic diagram of the heat conduction principle of the air-cooled heat dissipation architecture in the first embodiment of the electronic device of this application. Figure 9aThis is a schematic diagram of the layout of the air-cooled heat dissipation architecture in the first embodiment of the electronic device of this application; Figure 9b This is a schematic diagram of the layout of the air-cooled heat dissipation architecture from another perspective in the first embodiment of the electronic device of this application. Figure 9c This is a schematic diagram of another layout of the air-cooled heat dissipation architecture in the first embodiment of the electronic device of this application; Figure 10 This is a schematic diagram of the structure of a fan in an electronic device according to an embodiment of this application; Figure 11 This is a schematic diagram of the heat sink structure in the electronic device according to an embodiment of this application; Figure 12 This is a schematic diagram of the cooperation structure between the fan and the heat sink fins in the electronic device of this application embodiment.

[0133] in, Figure 8 The perspective shows the stacking relationship of the display screen 21, the heat conduction structure 61, the motherboard 51, and the back cover 222 in the thickness direction Z of the electronic device; Figure 9a The viewpoint is that of the electronic device viewed from the front after the display screen is removed, and the position of the air vent 224 is indicated by a dotted line. Figure 9b and Figure 9c The perspectives shown are all from the back of the electronic device, and the positions of the air-cooling device 3 and the heat dissipation structure 62 are indicated by dashed lines. Figure 9c The location of the motherboard 51 is indicated by a dashed line, but the location of the heat-conducting structure 61 is not shown. It should be noted that the shapes, structures, and positional relationships of the components in the above figures are for illustrative purposes only.

[0134] like Figures 8 to 9b As shown, in one possible implementation, the electronic device 100 further includes a motherboard 51 and a heat-generating device 511 disposed on the motherboard 51. The motherboard 51 is installed inside the housing 22 and is correspondingly positioned in the thickness direction Z of the electronic device to the support area 222A of the rear cover 222. The heat-generating device 511 can be a CPU or other device with a high operating load, and there are no specific limitations. It should be noted that multiple heat-generating devices 511 can be disposed on the motherboard 51; only one is shown in the figure for illustration and does not limit the solution of this application. The electronic device 100 also includes a heat-conducting structure 61 and a heat-dissipating structure 62. The heat-dissipating structure 62 is correspondingly positioned to the air outlet 32 ​​of the air-cooling device 3. A portion of the heat-conducting structure 61 contacts the motherboard 51, and a portion contacts the heat-dissipating structure 62. "Contact" can be understood as a surface-to-surface fit, meaning that a portion of the heat-conducting structure 61 abuts against the motherboard 51.

[0135] This can be understood as follows: the heat generated by the heat-generating components 511 on the motherboard 51 is concentrated and transferred to the heat dissipation structure 62 using the heat-conducting structure 61. The heat dissipation structure 62 is located at the air outlet 32 ​​of the air-cooling device 3. The air blown out from the air-cooling device 3 can directly pass through the heat dissipation structure 62 and then be blown out from the air outlet 224 on the back cover 222, carrying away the heat on the heat dissipation structure 62. Furthermore, the motherboard 51 is also positioned corresponding to the bracket area 222A, which shortens the heat dissipation path and the layout area of ​​the heat-conducting structure 61, ensuring heat dissipation while saving materials and costs. On the other hand, by placing the motherboard 51 and the heat-generating components 511 on the motherboard 51 at the position corresponding to the bracket area 222A, the bracket 1 can also provide heat insulation, so that users will not feel excessively high temperatures when holding the device, resulting in a more comfortable experience.

[0136] like Figure 9a and Figure 9b As shown, in one possible implementation, the heat source (motherboard 51 and its heat-generating device 511), heat-conducting structure 61, and heat-dissipating structure 62 are all located at positions corresponding to the bracket area 222A. This compact structure shortens the heat conduction path between the heat-conducting structure 61 and the heat source, improving heat dissipation. It should be noted that the components in the motherboard 51, heat-conducting structure 61, and heat-dissipating structure 62 can also be located at positions corresponding to the non-bracket area 222B, or a portion can correspond to the bracket area 222A and another portion to the non-bracket area 222B. This embodiment does not impose such limitations.

[0137] like Figure 8 As shown, in one possible implementation, the heat-conducting structure 61 is in direct contact with the heat-generating device 511 on the motherboard 51, and the heat generated by the heat-generating device 511 can be directly conducted to the heat-conducting structure 61. In some possible implementations, the heat-conducting structure 61 may also be in contact with the substrate of the motherboard 51 or other non-heat-generating devices 511, and the heat from the heat-generating device 511 can be indirectly conducted to the heat-conducting structure 61. Alternatively, the heat-conducting structure 61 may simultaneously be in contact with the heat-generating device 511, the substrate of the motherboard 51, and other non-heat-generating devices 511, etc., and this application embodiment does not limit this.

[0138] It should be noted that the embodiments of this application do not limit the number, location, or shape of the heat dissipation components. For example... Figures 9a to 9bAs shown, in one possible implementation, there are two air-cooling devices 3 and two heat dissipation structures 62. The two air-cooling devices 3 are disposed on both sides of the motherboard 51 along the length X direction of the electronic device, and the two heat dissipation structures 62 are disposed corresponding to the two air-cooling devices 3. The heat conduction structure 61 includes a main body 611 and two branch parts 612 connected together. The main body 611 is stacked with the motherboard 51 along the thickness Z direction of the electronic device and contacts the heat-generating device 511. The two branch parts 612 are spaced apart on both sides of the main body 611 along the length X direction of the electronic device, and each branch part 612 is stacked with and contacts the heat dissipation structure 62 on its corresponding side along the thickness Z direction of the electronic device.

[0139] This can be understood as follows: two air-cooling devices 3 are distributed along the length X of the electronic device, and a heat dissipation structure 62 is provided for each air-cooling device 3. The main body 611 of the heat-conducting structure 61 is used to contact the heat-generating device 511 on the motherboard 51, and the branch 612 extends to the position where it overlaps with each heat dissipation structure 62, thereby uniformly dissipating heat from various parts of the electronic device 100 and optimizing the heat dissipation effect. In some possible implementations, only one air-cooling device 3 may be provided, or three air-cooling devices 3 may be arranged at intervals along the length X of the electronic device, or two air-cooling devices 3 may be arranged at intervals along the width Y of the electronic device, etc. The number and position of the heat dissipation structures 62 and the number and position of the branch 612 of the heat-conducting structure 61 can correspond to the air-cooling devices 3, and this application embodiment does not limit this.

[0140] It should be noted that the embodiments of this application do not limit the specific type and structure of the air-cooling device 3, the heat-conducting structure 61, and the heat dissipation structure 62. In one possible implementation, the air-cooling device 3 is a fan. Specifically, the fan can be a centrifugal fan, an axial fan, a mixed-flow fan, a blower fan, etc. The embodiments of this application do not limit the specific type and structure of the fan. In addition to a fan, the air-cooling device 3 can also be, for example, a piezoelectric heat sink (a solid-state active heat sink based on piezoelectric microelectromechanical technology, which generates a powerful airflow by vibrating a tiny piezoelectric film at an ultrasonic frequency, thereby achieving efficient heat dissipation), etc. The embodiments of this application will not list them all.

[0141] In one possible implementation, the heat-conducting structure 61 is a heat pipe or a vapor chamber. Heat pipes have high thermal conductivity and good isothermal properties, and their shape is flexible and easy to manufacture. Specifically, they can be cored heat pipes, gravity heat pipes, flat plate heat pipes, radial heat pipes, etc., and this application embodiment does not limit this. The material of the heat pipe can be carbon steel, stainless steel, etc., and this application embodiment does not limit this. The vapor chamber utilizes the principle of phase change (liquid evaporation and condensation) for heat dissipation, and its thermal conductivity is higher than that of traditional heat dissipation materials such as copper and aluminum, and it can diffuse heat more evenly and quickly. Specifically, it can be a solid vapor chamber, a water-based vapor chamber, an organic solvent vapor chamber, a nanofluid vapor chamber, a microchannel vapor chamber, etc., and this application embodiment does not limit this. In one possible implementation, the heat dissipation structure 62 is a heat dissipation fin. Heat dissipation fins have a large heat dissipation area and good heat dissipation effect. The heat dissipation structure 62 can also be a heat sink or other heat dissipation component, and this application embodiment does not limit this.

[0142] It should be noted that when the air-cooling device 3 is a fan, the embodiments of this application do not limit the structure of the fan or the specific positions of the air inlet 31 and air outlet 32 ​​on the fan.

[0143] like Figure 7 , Figure 10 As shown, in one possible implementation, the fan includes a housing 34 and fan blades 33, with the fan blades 33 disposed within the housing 34. The housing 34 includes an upper cover 341, a lower cover 343, and a side wall 344. The upper cover 341 and the lower cover 343 are spaced apart along the thickness direction Z of the electronic device, with the lower cover 343 facing the display screen 21 (i.e., the upper cover 341 facing the rear cover 222). The side wall 344 is disposed between the upper cover 341 and the lower cover 343, surrounding the outer periphery of the fan blades 33. An air inlet 31 is disposed on the upper cover 341, and an air outlet 32 ​​is disposed on the side wall 344.

[0144] Since the first air inlet 223 is located on the rear cover 222, the fan air inlet 31 is located on the upper cover 341 of the fan, with the upper cover 341 facing the rear cover 222. The fan air inlet 31 can directly face the first air inlet 223, resulting in a shorter air intake path and higher air intake efficiency. The fan air outlet 32 ​​is located on the side wall 344 to ensure smooth airflow.

[0145] It should be noted that this application embodiment does not limit the specific number and distribution of the air outlets 32 on the fan. For example... Figure 9b As shown, in one possible implementation, an air outlet 32 ​​can be provided only on one side of the fan sidewall 344, and this side with the air outlet 32 ​​faces the heat dissipation structure 62. With this solution, the air outlet 32 ​​is located directly above the fan (…). Figure 9bThe several air vents 224 (from a certain angle) can directly exhaust air under the airflow of the fan and the airflow guided by the heat dissipation structure 62, while the several air vents 224 located on the side of the fan (for example, Figure 9b The air outlets 224 between the two fans can achieve airflow through natural convection.

[0146] like Figure 9c As shown, in an alternative implementation, air vents 32 can be provided on multiple sides of the fan sidewall 344. For example, air vents 32 can be provided on the side of the fan sidewall 344 facing the heat dissipation structure 62 and on the side closer to the motherboard 51. The air blown from the air vent 32 on the side facing the heat dissipation structure 62 mainly flows towards the air vents 224 directly above the fan, while the air blown from the air vent 32 on the side closer to the motherboard mainly flows towards the air vents 224 on the side of the fan. For example... Figure 9c Several air vents 224 are located between the two fans. The air vent 32 on the side of the fan closest to the motherboard 51 can directly blow air onto the motherboard 51 to dissipate heat. Alternatively, it can blow air onto the heat-conducting structure 61 above the motherboard (see reference). Figure 9a The air can be blown on, or blown on both the motherboard 51 and the heat-conducting structure 61 at the same time. This application embodiment does not limit this.

[0147] like Figure 7 As shown, in one possible implementation, the fan's lower cover 343 and the heat-conducting structure 61 can be located at the same height in the thickness direction Z of the electronic device, or it can be understood that the fan's lower cover 343 and the heat-conducting structure 61 are at the same distance from the display screen 21. In some possible implementations, the fan's lower cover 343 can be closer to the display screen 21 or farther away from the display screen 21 than the heat-conducting structure 61; this application embodiment does not impose any limitations on this.

[0148] like Figures 11 to 12 As shown, in one possible implementation, the heat dissipation fins include multiple heat dissipation channels 621, each having an inlet 6211 and an outlet 6212. The inlet 6211 faces the air outlet 32 ​​of the air-cooling device 3, and the outlet 6212 faces the air outlet 224 on the rear cover 222. Alternatively, the heat dissipation channels 621 can act as air guides, directing the airflow from the air outlet 32 ​​of the air-cooling device 3 to the air outlet 224 on the rear cover 222, ensuring efficient airflow. This application does not limit the shape of the heat dissipation channels 621. Figure 12 As shown, since the air outlet 32 ​​of the air-cooling device 3 and the air outlet 224 on the rear cover 222 are not in the same direction (they are perpendicular to each other in the figure), in order to facilitate airflow, a section of the heat dissipation channel 621 near the air outlet 32 ​​is designed to extend in an arc shape to change the direction of airflow. The specific number of heat dissipation channels 621 in the heat dissipation fins is not limited and can be designed according to actual needs.

[0149] like Figure 9a As shown, in one possible implementation, only a portion of the air outlet 224 faces the outlet 6212 of the heat sink fins, serving as the main air outlet 224 for air cooling. Another portion (e.g., the air outlet 224 between the two heat sink fins in the figure) cannot directly face the outlet 6212 of the heat sink fins and can serve as self-heating holes. Regardless of whether the air cooling device 3 is running, air inside and outside the electronic device 100 can circulate through these air outlets 224. In some possible implementations, the air outlet 224 may only be provided at positions opposite to the outlet 6212 of the heat sink fins to reduce the number of openings on the back cover 222; this embodiment does not limit this.

[0150] The first embodiment described above all involves placing the air outlet 224 in the bracket area 222A, meaning that the air outlet 224 is blocked when the bracket 1 is closed. Those skilled in the art will understand that the air outlet 224 can also be located in the non-bracket area 222B, and this latter embodiment will be described below as the second embodiment.

[0151] Please see Figures 13 to 17c , Figure 13 This is a schematic diagram of the rear structure of a second embodiment of the electronic device according to the present application, wherein the bracket is in a closed state; Figure 14 This is a schematic diagram of the disassembly structure of the decorative component in the second embodiment of the electronic device of this application. Figure 15 This is a three-dimensional structural diagram of a second embodiment of the electronic device according to the present application, wherein the bracket is in an open state; Figure 16 This is a schematic diagram illustrating the principle structure of the air-cooled heat dissipation architecture in the second embodiment of the electronic device of this application. Figures 17a to 17c This is a schematic diagram of the decorative element in a second embodiment of the electronic device of this application.

[0152] like Figures 13 to 16 As shown, in one possible implementation, the air outlet 224 is located within the non-support area 222B. The electronic device 100 also includes a decorative element 4, which is fixedly connected to the back cover 222 and is correspondingly located on the side of the air outlet 224 facing away from the display screen 21. The projection of the air outlet 224 in the thickness direction Z of the electronic device is located on the decorative element 4. The decorative element 4 is provided with a ventilation hole 41, which penetrates the decorative element 4 along the thickness direction Z of the electronic device.

[0153] like Figure 13 and Figure 14 As shown, the dashed line P is the boundary line between the support area 222A and the non-support area 222B on the back cover 222, and it is also the uppermost part of the area that the support 1 can cover in the closed state. Figure 13As can be seen from the dividing line of the perspective, in the second embodiment, the bracket 1 does not block the air outlet 224 when it is closed, and the air outlet 224 is always exposed.

[0154] The air outlet 224 is located within the non-bracket area 222B, so the air outlet width is not affected by the opening angle of the bracket 1. The air outlet path is decoupled from the opening and closing of the bracket 1, ensuring heat dissipation performance. Furthermore, a decorative element is used to cover the air outlet 224, preventing it from being directly exposed and improving aesthetics. The decorative element 4 can be independently designed and manufactured, offering diverse shapes and flexible shapes and layouts for the ventilation holes 41. Moreover, the manufacturing process of the decorative element 4 and the back cover 222 can be decoupled, making it relatively easy to implement.

[0155] Furthermore, since the first air inlet 223 and the air outlet 224 are not in the same area, when the bracket 1 is opened, the entire bracket 1 is positioned between the air outlet 224 and the first air inlet 223. At this time, the bracket 1 can act as a barrier to prevent the hot air around the air inlet 31 from exchanging with the cold air around the first air outlet 224, thereby preventing hot air backflow and optimizing the heat dissipation effect.

[0156] The number of ventilation holes 41 on the decorative part 4 is unlimited. For example... Figures 17a to 17c As shown, in one possible implementation, there are multiple ventilation holes 41. Specifically, dozens, hundreds, or even thousands of ventilation holes 41 can be set. Under the premise of ensuring heat dissipation efficiency, the more ventilation holes 41 there are, the smaller the size of each ventilation hole 41, and the more delicate the structure of the decorative part 4. This can prevent users from seeing the internal parts of the electronic device 100 through the ventilation holes 41, and also play a certain role in preventing dust and dirt.

[0157] like Figure 17a As shown, in one possible implementation, the cross-section of each ventilation hole 41 is circular. (As illustrated...) Figure 17b As shown, in one possible implementation, the cross-section of each ventilation hole 41 is a regular hexagon (or can be understood as a honeycomb structure). For example... Figure 17c As shown, in one possible implementation, the cross-section of each ventilation hole 41 is rectangular (or can be understood as a grille). Furthermore, the cross-section of each ventilation hole 41 can also be triangular, trapezoidal, irregular, etc., and this application embodiment does not impose any limitations on this. Appropriate opening shapes and perforation ratios can be designed according to the airflow performance requirements of the product. The ventilation holes 41 on the decorative part 4 can be formed by laser processing, etching, injection molding, lathe machining, etc., and this application embodiment does not impose any limitations on the processing method.

[0158] Please see Figures 17d to 17e , Figure 17d This is a schematic diagram of the connection structure between the decorative part and the back cover in an electronic device according to an embodiment of this application; Figure 17eThis is a schematic diagram of the shape of a decorative component in an electronic device according to an embodiment of this application.

[0159] like Figure 17d As shown, in one possible implementation, the decorative element 4 has an air outlet area 421 and a non-air outlet area 422. The air outlet area 421 is the area where the ventilation holes 41 are located. Alternatively, it can be understood that all the ventilation holes 41 on the decorative element 4 are distributed within the air outlet area 421, and the area outside the air outlet area 421 is the non-air outlet area 422. The projection of the air outlet 224 in the thickness direction Z of the electronic device is located within the air outlet area 421, thus allowing for smooth airflow. The non-air outlet area 422 is fixedly connected to the back cover 222. There are no ventilation holes 41 in the non-air outlet area 422. The decorative element 4 is fixed to the back cover 222 using the non-air outlet area 422 to avoid affecting the airflow and to make reasonable use of the space on the decorative element 4.

[0160] The specific method of fixing the non-air outlet area 422 to the back cover 222 is not limited; for example, it can be fixed by adhesive, welding, screwing, etc. Figure 17d As shown, in one possible implementation, the non-air outlet area 422 includes two adhesive areas 423. These two adhesive areas 423 are respectively located on both sides of the air outlet area 421 along the width direction of the decorative element 4. An adhesive layer 53 is provided between each adhesive area 423 and the back cover 222, and the decorative element 4 is fixedly connected to the back cover 222 through the adhesive layer 53. Here, the width direction of the decorative element 4 refers to the extension direction of its shorter side, for example... Figure 17c The width direction of the decorative part 4 can correspond to the width direction Y or the length direction X of the electronic device 100, depending on its position and layout within the electronic device 100. The length direction of the decorative part 4 is perpendicular to its width direction. With this structure, the two adhesive areas 423 are symmetrically distributed on the decorative part 4, and each adhesive area 423 has a large area, resulting in strong adhesion to the back cover 222 and improving the reliability of the bond between the decorative part 4 and the back cover 222. In some possible implementations, the decorative part 4 may have only one adhesive area 423, or more than two adhesive areas 423, or a ring-shaped adhesive area 423 may be provided along the circumference of the decorative part 4. This embodiment does not limit this. The adhesive layer 53 can be a backing adhesive or a cured flow adhesive; the specific type is not limited.

[0161] In one possible implementation, the thickness of the decorative element 4 is less than or equal to 0.2 mm. The thickness direction of the decorative element 4 is parallel to the thickness direction Z of the electronic device, and its thickness is... Figure 17dThe thickness in the vertical direction. Making the decorative element 4 thinner reduces the space it occupies within the thickness of the electronic device 100, which is beneficial for embedded design. This makes the back of the non-bracket area 222B of the back cover 222, the back of the decorative element 4, and the back of the bracket 1 in the closed state coplanar. Alternatively, it can be understood as... Figure 17d The lower edges of the middle rear cover 222, decorative piece 4, and bracket 1 are aligned to enhance the overall aesthetics and ergonomics of the device. In some possible implementations, the thickness of the decorative piece 4 may also be greater than 0.2mm; this embodiment does not impose any limitations on this.

[0162] like Figure 17d As shown, in one possible implementation, the width of the decorative part 4 is less than or equal to 5 mm, and the width of each bonding area 423 is less than or equal to 0.6 mm. By making the bonding areas 423 narrower, the area of ​​the non-air outlet area 422 is reduced, thereby increasing the area of ​​the air outlet area 421 and the layout space of the ventilation holes 41 on the decorative part 4. This, in turn, increases the number of ventilation holes 41 and the area of ​​each ventilation hole 41, improving the overall airflow of the unit. In some possible implementations, the width of the decorative part 4 may also be greater than 5 mm, and the width of each bonding area 423 may also be greater than 0.6 mm; this embodiment does not impose such limitations.

[0163] like Figure 17d As shown, in one possible implementation, the electronic device 100 further includes a structural component 55, which is installed inside the housing 22 and is positioned opposite to the air outlet 224. The back cover 222 is provided with a color-developing layer 54, which is positioned opposite to the non-air outlet area 422 of the decorative component 4 in the thickness direction Z of the electronic device. The color of the structural component 55 facing the air outlet 224 is the same as the color of the color-developing layer 54. The structural component 55 can be understood as a general term for components disposed inside the housing 22 and facing the air outlet 224, such as the heat dissipation structure 62 mentioned above. It is understood that the structural component 55 faces the air outlet 224, and the air outlet 224 faces the ventilation hole 41 on the decorative component 4; therefore, the user can observe the color of the structural component 55 through the ventilation hole 41. The decorative element 4 is mounted on the back cover 222, and there are inevitably some gaps 73 between it and the back cover 222. Users can observe the color of the area on the back cover 222 opposite to the decorative element 4 through these gaps 73. If the color of this area is inconsistent with the color of the structural component 55, it will affect the overall aesthetics of the electronic device 100. Therefore, a color-displaying layer 54 is set on the back cover 222 at the position opposite the non-air outlet area 422 of the decorative element 4. The color of the color-displaying layer 54 is consistent with the color of the side of the structural component 55 facing the air outlet 224, which can improve the aesthetics of the electronic device 100.

[0164] The color of the display layer and structural component 55 facing the air outlet 224 is determined by the overall appearance design of the unit and can be gold, silver, white, black, etc., with no specific restrictions. In one possible implementation, both the display layer and structural component 55 facing the air outlet 224 are black, resulting in an all-black design. The method of forming the color layer 54 is not limited. In one possible implementation, the back cover 222 is made entirely of aluminum alloy, and the color layer 54 can be formed on the back cover 222 facing the non-air outlet area 422 through processes such as secondary anodizing. Alternatively, black ink can be directly sprayed on. Furthermore, the color layer 54 can also be formed through methods such as film application, which will not be listed here.

[0165] It should be noted that the overall shape of the decorative component 4 is not limited. In one possible implementation, the decorative component 4 can be a strip structure; alternatively, it can be a circular structure, a hexagonal structure, etc. The strip-shaped decorative component 4 can also comprise multiple parts, such as... Figure 17e As shown, in one possible implementation, the decorative component 4 includes a main body segment 431 and two snap-fit ​​segments 432. Along the length of the decorative component 4, the two snap-fit ​​segments 432 are respectively located at both ends of the main body segment 431. The back cover 222 has corresponding slots 2220 on each snap-fit ​​segment 432, and each snap-fit ​​segment 432 engages within its corresponding slot 2220. Alternatively, the decorative component 4 can be understood as having a "V" shaped structure, with its two ends snapped onto the back cover 222 via the snap-fit ​​segments 432, thus enhancing the connection strength between the decorative component 4 and the back cover 222. Furthermore, the main body segment 431 of the decorative component 4 can be adhesively fixedly connected to the surface of the back cover 222, and each snap-fit ​​segment 432 can be welded fixedly connected to the inner wall of the slot 2220. The contact surface between the main body segment 431 and the back cover 222 is large, and the bonding area is also large, ensuring strong adhesion by bonding the main body segment 431 to the back cover 222. The snap-fit ​​segment 432 is welded to the inner wall of the slot 2220 to prevent the snap-fit ​​segment 432 from detaching from the slot 2220, thereby further improving the connection strength between the decorative part 4 and the back cover 222 and reducing the risk of the decorative part 4 falling off.

[0166] Those skilled in the art will understand that the back cover 222 of some electronic devices 100 may have a special shape design, and a curved surface design is one common method. When the back cover 222 has a curved surface, the decorative part 4 can also be designed with a curved shape (i.e., pre-bent) at the corresponding position, so that the shape of the decorative part 4 fits the back cover 222 more closely, preventing the decoration from springing off under the action of adhesive stress and improving the production yield.

[0167] like Figure 17eAs shown, in one possible implementation, the surface of the back cover 222 opposite to the decorative element 4 includes a flat surface 2221 and two arcuate surfaces 2222, with the two arcuate surfaces 2222 disposed on both sides of the flat surface 2221. The main body segment 431 of the decorative element 4 includes a flat segment 4311 and two arcuate segments 4312. Along the length of the decorative element 4, the two arcuate segments 4312 are respectively connected to the two ends of the flat segment 4311. Furthermore, the flat segment 4311 fits against the flat surface 2221 of the back cover 222, and the two arcuate segments 4312 fit against the two arcuate surfaces 2222 of the back cover 222. With this design, the shape of the decorative element 4 matches the shape of the back cover 222, resulting in a more secure fit, improved adhesion and fixation reliability, reduced risk of the decorative element 4 springing off, and higher production yield. The flat section 4311 and the two curved sections 4312 of the decorative part 4 can be fixed to the back cover 222 using different bonding methods. For example, the flat section 4311 can be fixed to the flat surface 2221 of the back cover 222 by applying glue over a large area, and the two curved sections 4312 can be fixed to the back cover 222 by hot melt adhesive to strengthen the bonding and prevent the curved sections 4312 from springing back and falling off.

[0168] It should be noted that the descriptions of the shape, structure, and fixing method of the decorative part 4 to the back cover 222 in the above text are only examples and do not impose any restrictions on the actual structure.

[0169] like Figure 14 As shown, in one possible implementation, multiple air vents 224 are arranged at intervals within the non-support area 222B, and are located at the edge of the non-support area 222B near the support area 222A. Alternatively, the air vents 224 can be understood as being positioned close to the support area 222A, near heat dissipation components such as the air-cooling device 3, thus shortening the airflow path. Furthermore, the air vents 224, decorative elements, and support area 222A can be grouped together to avoid affecting the appearance of other parts of the back cover 222.

[0170] Please see Figures 18a to 18b , Figure 18a This is a schematic diagram of the air-cooled heat dissipation architecture in the second embodiment of the electronic device of this application. Figure 1 ; Figure 18b This is a schematic diagram of the air-cooled heat dissipation architecture in the second embodiment of the electronic device of this application. Figure 2 .

[0171] like Figures 18a to 18b As shown, for the scheme where the air outlet 224 is located in the non-support area 222B, the layout of the heat dissipation device in the electronic device 100 can be the same as... Figures 8 to 9bThe solution shown is similar. Only the shape and position of each component need to be slightly adjusted so that the outlet 6212 of the heat sink fins corresponds to the non-bracket area 222B on the back cover 222. This application will not elaborate further on this.

[0172] It is understandable that the first air inlet 223 is located within the bracket area 222A. When the bracket 1 is open, air can enter through the first air inlet 223. However, when the bracket 1 is closed, the first air inlet 223 is blocked by the bracket 1 and cannot enter air normally. Therefore, the first and second embodiments described above are both air-cooling solutions for the bracket 1 when it is open. In order to achieve air-cooling even when the bracket 1 is closed, additional air inlets can be provided on the electronic device 100 as air inlets when the bracket 1 is closed. This solution will be described below as the third embodiment. It should be noted that the solution in the third embodiment is applicable to both the first embodiment (air outlet 224 is located in the bracket area 222A) and the second embodiment (air outlet 224 is located in the non-bracket area 222B).

[0173] Please see Figures 19a to 22b , Figure 19a This is a schematic diagram of the side frame structure in the third embodiment of the electronic device according to the present application; Figure 19b This is a structural schematic diagram of the side frame from another perspective in the third embodiment of the electronic device according to the present application. Figure 20a This is a schematic diagram of the layout of the air-cooled heat dissipation architecture in the third embodiment of the electronic device of this application; Figure 20b for Figure 20a A magnified view of part B in the middle section; Figure 21 This is a schematic diagram illustrating the principle structure of the air-cooled heat dissipation architecture in the third embodiment of the electronic device of this application. Figure 22a for Figure 20b A partial sectional view at position CC; Figure 22b for Figure 20b A partial sectional view of the DD position in the middle.

[0174] like Figures 19a to 21 As shown, in one possible implementation, the electronic device 100 further includes a second air inlet 225. The second air inlet 225 is disposed on the side frame 221 of the housing 22, and the air inlet 31 of the air-cooling device 3 communicates with the outside through the second air inlet 225. The second air inlet 225 is disposed on the side frame 221 of the device. The second air inlet 225 is always exposed to the outside, unaffected by the opening and closing of the bracket 1, and can serve as an air inlet 6211 when the bracket 1 is closed, realizing the air-cooling heat dissipation path when the bracket 1 is closed. When the bracket 1 is open, the second air inlet 225 can also allow air to enter, satisfying a larger air intake volume.

[0175] Those skilled in the art will understand that 2-in-1 devices typically operate under heavy loads and for extended periods when the bracket 1 is open. Therefore, air cooling is primarily for improving heat dissipation efficiency when the bracket 1 is open. When the bracket 1 is closed, users typically do not operate the device under high loads, and the usage time is shorter, resulting in less component overheating. Self-heating or other liquid cooling circulation, heat conduction, or other heat dissipation architectures can meet the heat dissipation requirements. Therefore, providing a second air inlet 225 on the side frame 221 is not necessary. In some possible implementations, the second air inlet 225 can be omitted, leaving only the audio opening 227 visible on the side frame 221, which improves aesthetics. However, even with the second air inlet 225, since the heat dissipation requirements are lower when the bracket 1 is closed, the number of second air inlets 225 can be appropriately reduced to avoid affecting the integrity of the side frame 221. In some possible implementations, the shape of the second air inlet 225 can be consistent with the audio opening 227, for example, having the same shape and size, to avoid clutter and improve the device's aesthetics. The shape of the second air inlet 225 may also be different from that of the audio opening 227, and this application embodiment does not limit this.

[0176] The number and location of the second air inlet 225 are not limited and can be designed according to the number and location of the air-cooling device 3. For example Figures 19a to 21 As shown, in one possible implementation, second air inlets 225 are provided on two adjacent frame sides near each air-cooling device 3, improving air intake efficiency. Alternatively, second air inlets 225 can be provided on only one frame side; this embodiment does not limit this.

[0177] like Figures 20b to 22b As shown, in one possible implementation, a gap 71 exists between the air-cooling device 3 and the rear cover 222. A guide structure 72 is provided inside the housing 22, and the guide structure 72 has a guide surface 721. One end of the guide surface 721 along its extending direction corresponds to the second air inlet 225 on the side frame 221, and the other end corresponds to the gap 71. The gap 71 between the air-cooling device 3 and the rear cover 222 allows air entering the device from the side frame to reach the air inlet 31 of the air-cooling device 3 through the gap 71. The guide structure 72 inside the housing 22, using the guide surface 721 to guide the airflow, allows the air entering through the second air inlet 225 to flow smoothly into the gap 71 between the air-cooling device 3 and the rear cover.

[0178] It should be noted that the specific shape and position of the guide structure 72 are not limited, and can be flexibly designed according to the shape and position of the second air inlet 225 and the air-cooling device 3. For example... Figure 20bAs shown, in one possible implementation, the guide structure 72 is disposed near the air-cooling device 3 and located between the air-cooling device 3 and the side frame 221 of the electronic device 100. Since the two adjacent side frames near the air-cooling device 3 are provided with second air inlets 225, the guide structure 72 is configured as an "L-shaped" structure in a plane perpendicular to the thickness direction Z of the electronic device, surrounding part of the side wall of the air-cooling device 3.

[0179] like Figure 21 As shown, in one possible implementation, the guide surface 721 can extend in a straight line from one end near the second air inlet 225 to one end near the gap 71. Figures 22a to 22b As shown, in one possible implementation, the guide surface 721 can extend along a broken line or a curve from one end near the second air inlet 225 to the other end near the gap 71. With this design, the guide structure 72 can flexibly avoid other structural components within the electronic device 100; the specific extension path is not limited in this embodiment.

[0180] In one possible implementation, the guide structure 72 is made of plastic. Plastic is not only highly malleable but also has low density, making it lightweight and avoiding adding excessive weight to the equipment. In some possible implementations, the guide structure 72 may also be made of foam, or a low-density metal, or may be directly processed into a hollow structure to reduce weight. This application embodiment does not limit this.

[0181] It should be noted that the guide structure 72 can be set separately in the electronic device 100, or other components of the electronic device 100 can be reused as the guide structure 72 to reduce the number of parts and the overall weight of the electronic device 100. For example, the antenna cavity can be used as the guide structure 72, and this embodiment does not limit this.

[0182] Those skilled in the art will understand that, for the air-cooled scenario when the bracket 1 is closed, the second air inlet 225 serves as the air inlet for the entire device. When the air outlet 224 is located in the non-bracket area 222B, the air outlet 224 can directly discharge air. However, when the air outlet 224 is located in the bracket area 222A, the device structure needs to be modified to ensure that the air outlet 224 can discharge air smoothly. The air discharge scheme when the air outlet 224 is located in the bracket area 222A and the bracket 1 is in a closed state will be described below as the fourth embodiment. The fourth embodiment is applicable to the first embodiment (air outlet 224 is located in the bracket area 222A) and the third embodiment (a second air inlet 225 is opened on the side frame 221 of the electronic device 100) mentioned above.

[0183] Please see Figures 23 to 25 , Figure 23This is a schematic diagram of the rear structure of the electronic device according to the fourth embodiment of the present application, wherein the bracket is in a closed state; Figure 24 This is a schematic diagram of the gap between the bracket and the non-bracket area of ​​the back cover in the fourth embodiment of the electronic device of this application. Figure 25 This is a schematic diagram of another structure of the gap between the bracket and the non-bracket area of ​​the back cover in the fourth embodiment of the electronic device of this application.

[0184] like Figures 23 to 25 As shown, in one possible implementation, when the air outlet 224 is located within the bracket area 222A and the bracket 1 is in a closed state, there is a gap 73 between the bracket 1 and the non-bracket area 222B of the rear cover 222, through which the air outlet 224 communicates with the outside. Alternatively, it can be understood that when the bracket 1 is closed, the bracket 1 and the non-bracket area 222B of the rear cover 222 are not completely sealed, but rather have a gap 73 of a certain width, allowing air to escape from the air outlet 224, thus forming a complete air-cooling heat dissipation path for heat dissipation of the equipment.

[0185] The width of the gap 73 is unlimited. For example... Figure 23 As shown, in one possible implementation, the width w of the gap 73 is in the range of 0.5mm to 2mm, such as 0.5mm, 0.7mm, 1.3mm, 2mm, etc., and there is no specific limitation. Within this range, the width of the gap 73 is neither too large nor too small, balancing airflow efficiency and the aesthetics of the device. In some possible implementations, the width of the gap 73 may also be less than 0.5mm or greater than 2mm, and this application embodiment does not impose any limitations on this.

[0186] like Figure 24 As shown, in one possible implementation, the projection of the gap 73 along the thickness direction Z of the electronic device onto the back cover 222 is located within the non-support area 222B. When the support 1 is in the closed state, the surface of the support 1 facing away from the back cover 222 covers the air outlet 224 along the thickness direction Z of the electronic device. With this structure, when the support 1 is in the closed state, the air outlet 224 can be completely covered by the support 1, ensuring both airflow performance and the aesthetics of the device.

[0187] The specific implementation of the above structure is not limited. For example... Figure 24As shown, in one possible implementation, a first inclined surface 731 is provided at one end of the bracket 1 near the non-bracket area 222B. The first inclined surface 731 is inclined relative to the thickness direction Z of the electronic device. A second inclined surface 732 is provided at one end of the non-bracket area 222B of the back cover 222 near the bracket 1. The second inclined surface 732 is inclined relative to the thickness direction Z of the electronic device. The first inclined surface 731 and the second inclined surface 732 are arranged opposite to each other and spaced apart. Furthermore, the angle at which the first inclined surface 731 is inclined relative to the thickness direction Z of the electronic device is the same as the angle at which the second inclined surface 732 is inclined relative to the thickness direction Z of the electronic device.

[0188] This can be understood as follows: on both sides of the gap 73, the end face of the bracket 1 and the end face of the non-bracket area 222B of the back cover 222 are engaged by bevels. The two bevels are tilted at the same angle relative to the thickness direction Z of the electronic device, forming a uniform second end air duct for the air outlet 32 ​​to blow out. The first bevel 731 is provided at the end of the bracket 1, and the inclination of the first bevel 731 can also be used to cover the air outlet 224, so that the bracket 1 can fully cover the air outlet 224 when it is closed.

[0189] The inclination angles of the first inclined plane 731 and the second inclined plane 732 are not limited. For example... Figure 24 As shown, in one possible implementation, the angle α1 of the first inclined surface 731 relative to the thickness direction Z of the electronic device and the angle α2 of the second inclined surface 732 relative to the thickness direction Z of the electronic device are both within the range of 25° to 60°, within which the air outlet effect is better. For example, it can be 25°, 30°, 55°, etc., and there is no specific limitation. In some possible implementations, the angle α1 of the first inclined surface 731 relative to the thickness direction Z of the electronic device and the angle α2 of the second inclined surface 732 relative to the thickness direction Z of the electronic device can also be less than 25° or greater than 60°, and this application embodiment does not limit this.

[0190] like Figure 24 As shown, in some possible implementations, a notch 733 can be provided on the side of the bracket 1 near the air outlet 32 ​​to provide a larger air outlet space for the air outlet 32. In some possible implementations, the angle α1 of the first inclined surface 731 relative to the thickness direction Z of the electronic device and the angle α2 of the second inclined surface 732 relative to the thickness direction Z of the electronic device can also be different, as long as air can be vented.

[0191] like Figure 25As shown, in one possible implementation, a curved surface 734 can be provided at one end of the bracket 1 near the non-bracket area 222B, and a vertical surface 735 can be provided on the back cover 222 at one end of the non-bracket area 222B near the bracket 1. The vertical surface 735 is parallel to the thickness direction Z of the electronic device. The curved surface 734 and the vertical surface 735 form an air duct between the bracket 1 and the non-bracket area 222B of the back cover 222, which can also achieve air outlet. Or it can be understood as... Figure 25 The proposed solution is to Figure 24 The first inclined surface 731 is replaced with a curved surface 734, and the second inclined surface 732 is replaced with a vertical surface 735. In addition, the two opposing end faces of the non-support area 222B of the bracket 1 and the back cover 222 can be vertical surfaces, curved surfaces, inclined surfaces, etc., and this application embodiment does not limit this.

[0192] It is understandable that when the air outlet 224 is located within the bracket area 222A, the bracket 1 must expose the air outlet 224 in the open state to achieve a good airflow effect. Therefore, the rotational connection between the bracket 1 and the back cover 222 can be improved so that the air outlet 224 is gradually exposed as the bracket 1 opens. This solution will be described below as the fifth embodiment. The fifth embodiment applies to the first embodiment (air outlet 224 is located within the bracket area 222A), the third embodiment (a second air inlet 225 is provided on the side frame 221 of the electronic device 100), and the fourth embodiment (a gap 73 is provided between the bracket 1 and the non-bracket area 222B of the back cover 222 when the bracket is closed). Furthermore, the fifth embodiment also applies to the second embodiment (air outlet 224 is located within the non-bracket area 222B), and the path of the bracket's rotation and opening does not conflict with the position of the air outlet 224.

[0193] Please see Figures 26a to 29 , Figure 26a This is a three-dimensional schematic diagram of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is in a closed state; Figure 26b This is a side view of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is in a closed state; Figure 27a This is a three-dimensional schematic diagram of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 30°; Figure 27b This is a side view of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 30°; Figure 28a This is a three-dimensional schematic diagram of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 90°; Figure 28bThis is a side view of the bracket and the back cover cooperating in the fifth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 90°; Figure 29 This is a schematic diagram of the rotation trajectory of the bracket in the fifth embodiment of the electronic device according to this application. Wherein, Figure 26a This is the view of the back cover 222 from inside the electronic device 100.

[0194] like Figures 26a to 29 As shown, in one possible implementation, the bracket 1 can rotate relative to the back cover 222 around the first axis O. When the air outlet 224 is entirely located within the bracket area 222A, the first axis O is spaced apart from the back cover 222 and is located on the side of the back cover 222 away from the display screen 21. There is a certain distance between the first axis O and the back cover 222, and the rotation trajectory of the bracket 1 near the non-bracket area 222B of the back cover 222 is an arc. When the bracket 1 switches from a closed state to an open state, it moves away from the back cover 222 in the thickness direction Z of the electronic device, and also gradually moves away from the non-bracket area 222B of the back cover 222 in the width direction Y of the electronic device. Therefore, when the air outlet 224 is located within the bracket area 222A, as the opening angle of the bracket 1 increases, the air outlet width gradually increases, and the air outlet 224 can be slowly exposed. It should be noted that the embodiments of this application do not limit the size of the distance h between the first axis O and the back cover 222, and can be designed according to actual needs.

[0195] For example, such as Figures 26a to 26b As shown, in one possible implementation, when the bracket 1 is closed (opening angle is 0°), the air outlet width is a1. Depending on product requirements, a1 can be designed to be 0 or have a certain positive value. When a1 is 0, the air outlet 224 is completely covered by the bracket 1, resulting in the most aesthetically pleasing appearance when viewed from the back. When a1 is positive, there is a gap 73 between the bracket 1 and the non-bracket area 222B of the back cover 222, suitable for air-cooling solutions when the bracket 1 is closed. The air outlet path is referenced... Figure 26b Arrow direction. (e.g., arrow direction) Figures 27a to 27b As shown, in one possible implementation, when the bracket 1 is opened to 30°, the air outlet width is a2. Part of the air outlet 224 is exposed, while part is covered by the bracket 1, yet air can still be discharged smoothly. The value of a2 can be designed to meet the required heat dissipation performance. For example... Figures 28a to 28b As shown, in one possible implementation, when the bracket 1 is opened to a greater than 30° (e.g., 90°), the air outlet width continues to increase to a3, and the air outlet 224 is fully exposed, maximizing the heat dissipation performance. The above angles are merely examples and do not limit the solutions of the embodiments of this application.

[0196] The first axis O is positioned at a certain distance from the back cover 222 so that the air outlet 224 is gradually exposed as the bracket 1 is opened. When the air outlet 224 can be exposed without the bracket 1 being opened (e.g., in the second embodiment), this design can be omitted, and the first axis O can be directly positioned on the back cover 222. The solution of positioning the first axis O on the back cover 222 will be described below as the sixth embodiment. The sixth embodiment is applicable to the second embodiment (the air outlet 224 is located in the non-bracket area 222B), the third embodiment (a second air inlet 225 is opened on the side frame 221 of the electronic device 100), and the fourth embodiment (a gap 73 is provided between the bracket 1 and the non-bracket area 222B of the back cover 222 when the bracket 1 is closed).

[0197] Please see Figures 30a to 33 , Figure 30a This is a perspective view of the bracket and the back cover cooperating in a sixth embodiment of the electronic device according to the present application, wherein the bracket is in a closed state; Figure 30b This is a side view of the bracket and the back cover cooperating in the sixth embodiment of the electronic device of this application, wherein the bracket is in a closed state; Figure 31a This is a perspective view of the bracket and the back cover cooperating in the sixth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 30°; Figure 31b This is a side view of the bracket and the back cover cooperating in the sixth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 30°; Figure 32a This is a perspective view of the bracket and the back cover cooperating in the sixth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 90°; Figure 32b This is a side view of the bracket and the back cover cooperating in the sixth embodiment of the electronic device of this application, wherein the bracket is opened at an angle of 90°; Figure 33 This is a schematic diagram of the rotation trajectory of the bracket in the sixth embodiment of the electronic device of this application.

[0198] like Figures 30a to 33 As shown, in one possible implementation, when the air outlet 224 is located within the non-support area 222B, the first axis O lies on the surface of the back cover 222 facing away from the display screen 21. With this structure, the rotation trajectory of the bracket 1 near the end of the non-support area 222B of the back cover 222 is a point, and the distance between the bracket 1 and the non-support area 222B of the back cover 222 remains constant regardless of the angle at which the bracket 1 is opened. For example, as... Figures 30a to 32b As shown, the bracket 1 and the non-bracket area 222B of the back cover 222 can always fit tightly together, so that the bracket 1 can cover the components below it in any state, improving the aesthetics. In addition, it reduces the design difficulty of the hinge assembly 8.

[0199] In one possible implementation, the bracket 1 is rotatably connected to the back cover 222 via a pivot assembly 8. It should be noted that the specific structure of the pivot assembly 8 is not limited; possible structures are illustrated below with reference to the accompanying drawings. It should also be noted that the structure of the pivot assembly 8, which will be described later, can be used regardless of whether the first axis O is located on the back cover 222. The design scheme of the pivot assembly 8 is applicable to all the aforementioned implementation methods.

[0200] Please see Figures 34 to 36f , Figure 34 This is a three-dimensional structural diagram of the hinge assembly in the electronic device according to an embodiment of this application; Figure 35 This is an exploded structural diagram of the hinge assembly in the electronic device according to an embodiment of this application; Figures 36a to 36f This is a schematic diagram of the assembly process of the rotating shaft assembly in the electronic device of this application embodiment.

[0201] like Figures 34 to 35 As shown, in one possible implementation, the rotating shaft assembly 8 includes a base 81 and a rotating seat 82. The base 81 is fixedly connected to the rear cover 222, and the rotating seat 82 is fixedly connected to the bracket 1. An arc-shaped sliding structure 83 is provided between the base 81 and the rotating seat 82. The arc-shaped sliding structure 83 includes an arc-shaped slider 831 and an arc-shaped groove 832 that are slidably connected to each other. One of the arc-shaped slider 831 and the arc-shaped groove 832 is provided on the base 81, and the other is provided on the rotating seat 82, so that the rotating seat 82 is slidably connected to the base 81. The center of the extension trajectory of the arc-shaped groove 832 is located on the first axis O.

[0202] This can be understood as follows: the base 81 and the rotating seat 82 are rotatably connected via a virtual axis. With the base 81 fixed to the back cover 222 and the bracket 1 fixed to the rotating seat 82, the bracket 1 and the back cover 222 are also rotatably connected via a virtual axis. The virtual axis between the base 81 and the rotating seat 82 is the straight line containing the center of the extended trajectory of the arc-shaped groove 832. Setting the virtual axis at a predetermined position on the first axis O can achieve the desired rotational effect. For example, if the virtual axis is set at a certain height above the back cover 222, it can achieve... Figure 29 The effect shown is achieved by setting the virtual axis on the surface of the back cover 222 that faces away from the display screen 21. Figure 33 The rotation effect is shown. Furthermore, the virtual axis has a simple structure, saving more space.

[0203] like Figures 34 to 35 As shown, in one possible implementation, the arc-shaped slider 831 is disposed on the rotating seat 82, and the arc-shaped groove 832 is disposed on the base 81. In another possible implementation, the arc-shaped slider 831 can also be disposed on the base, and the arc-shaped groove 832 can also be disposed on the rotating seat 82. This application embodiment does not limit this.

[0204] like Figure 35 As shown, in one possible implementation, the rotating shaft assembly 8 further includes a damping shaft 85 and a damping block 86. The damping block 86 includes a first rotating part 861 and a second rotating part 862 that are spaced apart. The first rotating part 861 is rotatably connected to the rotating seat 82, and the second rotating part 862 is rotatably connected to the damping shaft 85. The damping shaft 85 is slidably connected to the base 81.

[0205] A damping shaft 85 and a damping block 86 are provided in the rotating shaft assembly 8. The damping block 86 is pivotally connected to the rotating seat 82 via a first rotating part 861 and to the damping shaft 85 via a second rotating part 862. Furthermore, the damping shaft 85 is slidably connected to the base 81, allowing the damping block 86 to slide relative to the base. During the opening and closing of the bracket 1, the rotating seat 82 rotates relative to the base. Simultaneously, the damping block 86 rotates relative to the rotating seat 82's axis of rotation, relative to the damping shaft 85, and slides relative to the base. The damping block 86 assists in the rotation of the rotating seat 82. When the damping block 86 and the damping shaft 85 rotate relative to each other, they rub against each other, generating a constantly changing damping force. This improves the stability of the bracket 1's rotation, provides a comfortable feel for the user, and allows the damping force to be designed to suspend the bracket 1 at a desired angle.

[0206] like Figure 35 As shown, in one possible implementation, the second rotating part 862 of the damping block 86 is configured as a sleeve (or a circumferential sleeve), and the damping shaft 85 is sleeved inside the sleeve. During rotation, the sleeve of the damping block 86 and the outer circle of the damping shaft 85 rub against each other to generate damping force. In some possible implementations, other structures may also be used to provide damping force, and this application embodiment does not limit this.

[0207] like Figure 35 As shown, in one possible implementation, sliders 87 are fitted at both ends of the damping shaft 85, and the shaft is slidably connected to the base 81 via the sliders 87. In some possible implementations, the damping shaft 85 can also be directly slidably connected to the base 81; this embodiment does not limit this. In one possible implementation, a linear groove 84 is provided on the base 81, and the slider 87 can slide within the linear groove 84. The extending direction of the linear groove 84 is the sliding direction of the slider 87, and its extending direction is perpendicular to the direction of the first axis O, such as the width direction Y of the electronic device. The linear groove 84 serves as a sliding guide, which can limit the rotation arc length of the rotating seat 82 and prevent the rotating part from slipping off.

[0208] like Figures 34 to 35As shown, in one possible implementation, the base 81 includes a first part 811 and a second part 812. The first part 811 and the second part 812 are separate structures. An arc-shaped sliding groove 832 is disposed in the first part 811, and a straight sliding groove 84 is formed by assembling the first part 811 and the second part 812. Disassembling the base 81 into two parts facilitates assembly and manufacturing. In some possible implementations, the base 81 can also be a one-piece structure; this application embodiment does not limit this.

[0209] like Figures 36a to 36f As shown, in one possible implementation, the assembly steps of the pivot assembly 8 may include: 1. For example Figure 36a As shown, the damping shaft 85 is sleeved inside the sleeve (second rotating part 862) of the damping block 86, and the two are interference-fitted to generate sufficient friction during relative rotation.

[0210] 2. For example Figure 36b As shown, the two ends of the damping shaft 85 are fixedly connected to the slider 87, for example, by riveting or other means, without any specific limitation.

[0211] 3. For example Figure 36c As shown, the first rotating part 861 of the damping block 86 is installed on the rotating seat 82 to form a hinge relationship. For example, the rotational connection between the two can be achieved by the cooperation of the groove 226 and the convex shaft, and the specific connection is not limited.

[0212] 4. For example Figure 36d As shown, the first part 811 of the base 81 is assembled with the rotating seat 82 through the arc-shaped slide groove 832.

[0213] 5. For example Figure 36e As shown, the second part 812 of the base 81 is assembled with the first part 811, forming a straight groove 84 between them, and the slider 87 is engaged in the straight groove 84.

[0214] 6. For example Figure 36f As shown, fastening devices are used to secure the assembled parts together, strengthening the connection. For example, the first part 811 and the second part 812 of the base 81 are locked and fixed by the first screw 887. The number and distribution of the first screw 887 are not limited; the attached figure is for illustrative purposes only. The first screw 887 can also be a bolt, nut, or other fastener 893, and this embodiment does not limit this. The fixing between components can also be achieved by welding, riveting, bonding, etc., and this embodiment does not limit this.

[0215] like Figures 34 to 35As shown, in one possible implementation, after completing the above assembly steps, the base 81 of the rotating shaft assembly 8 can be fixed to the rear cover 222 of the electronic device 100 by a second screw 882. The number and distribution of the second screws 882 are not limited; the attached figure is for illustrative purposes only. The second screw 882 can also be a bolt, nut, or other fastener 893, and this embodiment does not impose any limitations on this. The fixing between the base 81 and the rear cover 222 can also be achieved by welding, riveting, bonding, etc., and this embodiment does not impose any limitations on this.

[0216] After the base 81 of the rotating shaft assembly 8 is fixedly connected to the back cover 222 of the electronic device 100, the bracket 1 and the rotating seat 82 can be fixedly connected by fasteners 893, welding, riveting, etc. This application embodiment does not limit this.

[0217] It should be noted that the above assembly steps are merely examples and do not represent the actual assembly steps of the pivot assembly 8. The pivot assembly 8 may include more or fewer structures than those shown in the accompanying drawings, and this application embodiment does not impose any limitations on this.

[0218] Those skilled in the art will understand that the structure and size design of the air-cooling device 3 are very important for the effectiveness of air-cooling heat dissipation. The following describes two solutions that can optimize heat dissipation, using the seventh and eighth embodiments as examples. The seventh and eighth embodiments are applicable to all the preceding embodiments, but they are different solutions.

[0219] Please see Figures 37 to 40 , Figure 37 This is a schematic diagram illustrating the principle structure of the seventh embodiment of the electronic device according to this application. Figure 38 This is a schematic diagram of the back structure of the electronic device according to the seventh embodiment of the present application, with the bracket removed; Figure 39 This is a schematic diagram of the mating structure between the fan sidewall and the rear cover in the seventh embodiment of the electronic device of this application. Figure 40 for Figure 39 A partial cross-sectional view of the EE location.

[0220] like Figures 37 to 40As shown, in one possible implementation, the air-cooling device 3 is a fan, and the rear cover 222 of the electronic device 100 has a fan region 222C, which serves as the upper cover 341 of the fan. The first air inlet 223 within the fan region 222C serves as the air inlet 31 of the fan. The projection of the fan along the thickness direction Z of the electronic device onto the rear cover 222 coincides with the fan region 222C. Alternatively, it can be understood that the area on the rear cover 222 corresponding to the fan serves both as the structure of the rear cover 222 and as the upper cover 341 of the fan. Combining the upper cover 341 of the fan with a portion of the structure of the rear cover 222 increases the thickness of the fan. Those skilled in the art will understand that increasing the fan thickness increases the internal space of its outer casing 34 and the thickness of the fan blades 33, which is beneficial for improving fan performance and further optimizing heat dissipation.

[0221] like Figures 37 to 40 As shown, in one possible implementation, the fan area 222C in the back cover 222 is integrated with other areas. This can be understood as the fan employing a coverless design 341, with the fan area 222C of the back cover 222 serving as the cover 341. Compared to a design where the fan cover 341 is separate from the back cover 222 of the electronic device 100, the fan thickness M1 can be increased by approximately 0.4mm while maintaining the same overall thickness, resulting in improved heat dissipation efficiency.

[0222] like Figure 37 As shown, in one possible implementation, foam 345 is provided between the fan sidewall 344 and the rear cover 222. The fan sidewall 344 rests against the foam 345 to provide cushioning and prevent compression damage between the fan sidewall 344 and the rear cover 222. In some possible implementations, the foam 345 can also be replaced with cushioning materials such as rubber, and this application embodiment does not limit this.

[0223] Please see Figures 41 to 45 , Figure 41 This is a schematic diagram of the principle structure of the eighth embodiment of the electronic device of this application; Figure 42 This is a schematic diagram of the mating structure between the fan top cover and the rear cover in the eighth embodiment of the electronic device of this application. Figure 43 This is a schematic diagram of the mating structure between the fan sidewall and the rear cover in the eighth embodiment of the electronic device of this application. Figure 44 for Figure 43 A partial cross-sectional view of the FF position in the middle; Figure 45 This is a schematic diagram showing the distribution of the first air inlet in the fan area of ​​the back cover in the eighth embodiment of the electronic device of this application.

[0224] like Figures 41 to 45As shown, in one possible implementation, the fan area 222C in the back cover 222 is set as a separate structure from other areas. Alternatively, the seventh embodiment can be understood as removing the fan's own top cover and using the fan area 222C of the back cover 222 as the fan's top cover 341. The eighth embodiment is the opposite: the fan adopts a complete design retaining the top cover 341, the fan area 222C of the back cover 222 is hollowed out, and the entire fan is embedded in the fan area 222C. The fan top cover 341 replaces this part of the structure in the back cover 222. Compared to the scheme where the fan top cover 341 is separately set from the back cover 222 of the electronic device 100, the thickness M2 of the fan can be increased by 0.8mm to 1mm without changing the overall thickness of the device, resulting in higher heat dissipation efficiency.

[0225] like Figures 43 to 44 As shown, in one possible implementation, the top cover 341 includes a bottom 3411 and a rim 3412 disposed adjacent to each other, with the rim 3412 surrounding the outer periphery of the bottom 3411. The surface of the bottom 3411 facing away from the display screen 21 is flush with the surface of other areas of the back cover 222 facing away from the display screen 21. The rim 3412 is located on the side of the bottom 3411 closer to the display screen 21 in the thickness direction Z of the electronic device. In a direction perpendicular to the thickness direction Z of the electronic device, at least a portion of the structure of the rim 3412 is stacked with the sidewall 344 of the fan.

[0226] With this structure, the back of the fan top cover 341 is flush with the back of other areas on the rear cover 222, ensuring the flatness of the back of the rear cover 222 and maintaining consistency in the overall back coating of the rear cover 222. In a direction perpendicular to the thickness direction Z of the electronic device, at least a portion of the edge 3412 of the fan top cover 341 is stacked with the fan sidewall 344. For example, the edge 3412 can be embedded inside the sidewall 344, or it can surround the outside of the sidewall 344 (e.g., Figures 43 to 44 The structure shown creates a sealed environment between the edging 3412 and the side wall 344, preventing air leakage from the gap 73 between the fan top cover 341 and the rear cover 222 of the electronic device 100, thus avoiding affecting the fan's operating efficiency. It also strengthens the connection between the top cover 341 and the side wall 344. In some possible implementations, the edging 3412 may not be provided; instead, a seal may be achieved through other means such as a rubber ring. This embodiment does not limit this approach.

[0227] like Figures 39 to 40 , Figures 43 to 44As shown, in one possible implementation, the sidewall 344 of the fan and the rear cover 222 of the electronic device 100 are fixedly connected by a plurality of fixing structures 89, which are spaced apart along the outer periphery of the fan. Each fixing structure 89 includes a first fixing part 891, a second fixing part 892, and a fastener 893. The first fixing part 891 is disposed on the outer wall surface of the sidewall 344 of the fan, and the second fixing part 892 is disposed on the rear cover 222 of the electronic device 100, and is located on the side of the rear cover 222 facing the display screen 21. The first fixing part 891 and the second fixing part 892 are stacked in the thickness direction Z of the electronic device and are fixedly connected by the fastener 893.

[0228] In this structure, the fan sidewall 344 is integrally locked to the rear cover 222 by fasteners 893, resulting in high connection strength and reducing the risk of the fan becoming detached from the rear cover 222 due to vibration during operation. The fasteners 893 can be screws or bolts, etc., and this embodiment does not limit their use. The specific number of fixing structures 89 is not limited, such as... Figure 39 , Figure 43 As shown, in one possible implementation, three fixing structures 89 can be arranged at intervals around the side wall 344 of the fan. In other possible implementations, two, four or more fixing structures 89 can be arranged, or only one fixing structure 89 can be arranged. In some possible implementations, the side wall 344 of the fan can also be directly fixed to the back cover 222 by welding or other methods, or the side wall 344 of the fan can be directly formed on the back cover 222 by integral injection molding or other methods. This application embodiment does not limit this.

[0229] Because the fan is fastened to the back cover 222 by fastener 893, and there is compression between the fan sidewall 344 and the back cover 222, the structural components need to be thickened to ensure the reliability of the compression in the fan area 222C. For example, for Figure 37 The solution of removing the top cover 341 from the fan (compared to the solution where the fan top cover 341 and the rear cover 222 of the electronic device 100 are separate) can increase the thickness of the fan area 222C on the rear cover 222 by 0.2mm~0.3mm, ensuring reliable strength. For Figure 41 The design of embedding the fan entirely into the back cover 222 (compared to the design where the fan top cover 341 and the electronic device 100 back cover 222 are separately set) can increase the thickness of the fan top cover 341 by approximately 0.2mm, ensuring reliable strength. It should be noted that the above-mentioned increase in thickness is only an example, and the embodiments of this application do not limit it.

[0230] like Figure 45As shown, in one possible implementation, the fan area 222C of the rear cover 222 is provided with multiple first air inlets 223. These multiple first air inlets 223 are arranged in a multi-layered nested ring shape, or, as can be understood, multiple rings of first air inlets 223 are arranged within the fan area 222C. With this arrangement, the first air inlets 223 are distributed within a circular area, similar in shape to the fan area 222C, making reasonable use of space. Furthermore, the close arrangement of multiple rings of first air inlets 223 results in high space utilization, allowing for a larger number of first air inlets 223 and increasing the airflow. The number of first air inlets 223 within the fan area 222C can be dozens or hundreds; this embodiment does not limit this.

[0231] like Figure 45 As shown, in one possible implementation, the diameter of the circular area containing the multiple first air inlets 223 within the fan area 222C is in the range of 30mm to 40mm. That is, the diameter D of the outermost dashed circle in the figure is in the range of 30mm to 40mm. Specifically, it can be 30mm, 35mm, 40mm, etc., and this embodiment does not limit this. Each first air inlet 223 is a circular hole, and the diameter of each first air inlet 223 is in the range of 0.8mm to 1.2mm. Specifically, it can be 0.8mm, 0.9mm, 1.2mm, etc., and this embodiment does not limit this. Displaying the shape, size, and distribution area of ​​the first air inlets 223 within the above range ensures air intake while also considering aesthetics and a simple manufacturing process. In some possible implementations, the diameter of the circular area containing the plurality of first air inlets 223 in the fan area 222C may be less than 30 mm or greater than 40 mm, and the diameter of each first air inlet 223 may be less than 0.8 mm or greater than 1.2 mm. This application embodiment does not impose any restrictions on this.

[0232] It should be noted that, Figures 38 to 45 The design shown, which integrates the fan cover 341 with the fan area 222C of the rear shell of the electronic device 100, can also be implemented independently in other scenarios. Its purpose is to achieve a thicker fan, and it does not necessarily have to be coupled with a hidden air-cooling architecture. For example, Figures 1 to 3b The several reference designs shown can also be designed as a two-in-one design of the fan cover 341 and the fan area 222C of the rear shell of the electronic device 100.

[0233] Besides combining the fan cover 341 with the fan area 222C on the electronic device and rear cover 222, other methods can be used to increase the fan thickness. For example, such as... Figure 42As shown, in one possible implementation, a protruding area 222D can also be provided on the back cover 222, and all fan areas 222C are covered within the protruding area 222D. The protruding area 222D protrudes from other parts on the side away from the display screen 21, thereby providing more space for the fan and increasing the fan thickness. Correspondingly, the surface of the bracket 1 on the side near the back cover 222 corresponding to the protruding area 222D can be recessed to avoid the protruding area 222D on the back cover 222.

[0234] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An electronic device, characterized in that, The device includes a bracket and a device body. The device body includes a display screen and a housing. The housing has a back cover and a side frame. The display screen and the back cover are respectively mounted on both sides of the side frame in the thickness direction of the electronic device. The bracket is rotatably connected to the side of the back cover away from the display screen to switch between a closed state and an open state. The electronic device also includes a cooling device, which is installed inside the housing. The cooling device has an air inlet and an air outlet. The rear cover is provided with a first air inlet and an air outlet. When the bracket is in the open state, the air inlet of the cooling device is connected to the outside through the first air inlet, and the air outlet of the cooling device is connected to the outside through the air outlet. The back cover has a support area and a non-support area. The air inlet of the air-cooling device is correspondingly arranged with the support area of ​​the back cover. The first air inlet hole is arranged in the support area. The support area is the area on the back cover where the support is projected along the thickness direction of the electronic device in the closed state. The area on the back cover other than the support area is the non-support area.

2. The electronic device as claimed in claim 1, characterized in that, The air outlet is located within the bracket area. When the bracket is in the open state, the projection of the bracket on the back cover along the thickness direction of the electronic device does not overlap with or partially overlaps with the air outlet.

3. The electronic device as described in claim 2, characterized in that, When the bracket is in the open state, the projection of the bracket on the back cover along the thickness direction of the electronic device does not overlap with the air outlet, and the air outlet and the first air inlet are located on both sides of the bracket along the thickness direction of the bracket.

4. The electronic device as described in claim 2 or 3, characterized in that, When the bracket is in the open state, the air outlet is exposed relative to the bracket; when the bracket is in the closed state, the air outlet is blocked by the bracket.

5. The electronic device as described in any one of claims 2-4, characterized in that, The bracket area and the non-bracket area of ​​the back cover are arranged along the width direction of the electronic device; There are multiple first air inlets, which are spaced apart within the bracket area; there are multiple air outlets, which are spaced apart within the bracket area and located on the side of the multiple first air inlets closer to the non-bracket area in the width direction of the electronic device.

6. The electronic device as claimed in claim 1, characterized in that, The air outlet is located in the non-support area; The electronic device also includes a decorative component, which is fixedly connected to the back cover and is correspondingly disposed on the side of the air vent away from the display screen. The projection of the air vent in the thickness direction of the electronic device is located on the decorative component. The decorative component is provided with a ventilation hole that penetrates the decorative component along the thickness direction of the electronic device.

7. The electronic device as claimed in claim 6, characterized in that, There are multiple ventilation holes, and the cross-section of each ventilation hole is any one of a circle, a regular hexagon, or a rectangle.

8. The electronic device as claimed in claim 6 or 7, characterized in that, The bracket area and the non-bracket area of ​​the back cover are arranged along the width direction of the electronic device; There are multiple first air inlets, and the multiple first air inlets are arranged at intervals within the bracket area; There are multiple air outlets, which are arranged at intervals in the non-support area and located at the edge of the non-support area near the support area.

9. The electronic device according to any one of claims 6-8, characterized in that, The decorative component has an air outlet area and a non-air outlet area. The air outlet area is the area where the ventilation hole is located, and the area outside the air outlet area is the non-air outlet area. The projection of the ventilation hole in the thickness direction of the electronic device is located within the air outlet area, and the non-air outlet area is fixedly connected to the back cover.

10. The electronic device as claimed in claim 9, characterized in that, The non-air outlet area includes two bonding areas, which are respectively located on both sides of the air outlet area in the width direction of the decorative piece. An adhesive layer is provided between each bonding area and the back cover, and the decorative piece is fixedly connected to the back cover through the adhesive layer. The thickness of the decorative component is less than or equal to 0.2 mm, the width of the decorative component is less than or equal to 5 mm, and the width of each adhesive area is less than or equal to 0.6 mm.

11. The electronic device as claimed in claim 9 or 10, characterized in that, The electronic device also includes a structural component installed inside the housing and positioned opposite to the air outlet; the rear cover is provided with a color-developing layer, which is positioned opposite to the non-air outlet area of ​​the decorative component in the thickness direction of the electronic device. The color of the structural component facing the air outlet is the same as the color of the color-developing layer.

12. The electronic device according to any one of claims 6-11, characterized in that, The decorative component includes a main body segment and two snap-fit ​​segments, wherein the two snap-fit ​​segments are respectively disposed at both ends of the main body segment along the length direction of the decorative component; The rear cover is provided with slots corresponding to the positions of each of the snap-fit ​​segments, and each snap-fit ​​segment snaps into the corresponding slot; The main body segment is fixedly connected to the surface of the back cover by adhesive bonding, and each of the snap-fit ​​segments is fixedly connected to the inner wall of the slot by welding.

13. The electronic device as claimed in claim 12, characterized in that, The surface on the back cover opposite to the decorative element includes: a flat surface and two arc-shaped surfaces, the two arc-shaped surfaces being disposed on both sides of the flat surface; The main body segment of the decorative component includes a planar segment and two arc-shaped segments. In the length direction of the decorative component, the two arc-shaped segments are respectively connected to the two ends of the planar segment. Furthermore, the planar segment is attached to the plane of the back cover, and the two arc-shaped segments are attached to the two arc-shaped surfaces of the back cover.

14. The electronic device according to any one of claims 1-13, characterized in that, The width of the air outlet is in the range of 1mm to 2.5mm.

15. The electronic device as claimed in claim 14, characterized in that, When the air outlet is located within the bracket area and the bracket is in the open state, the minimum distance between the bracket and the non-bracket area of ​​the back cover is in the range of 1.5mm to 5mm.

16. The electronic device according to any one of claims 1-15, characterized in that, The electronic device also includes a motherboard and a heat-generating device disposed on the motherboard. The motherboard is installed inside the housing and is disposed in the thickness direction of the electronic device corresponding to the bracket area of ​​the rear cover. The electronic device further includes a heat-conducting structure and a heat-dissipating structure. The heat-dissipating structure is configured to correspond to the air outlet of the air-cooling device. A portion of the heat-conducting structure contacts the motherboard, and a portion contacts the heat-dissipating structure.

17. The electronic device as claimed in claim 16, characterized in that, There are two air-cooling devices and two heat dissipation structures. The two air-cooling devices are arranged on both sides of the motherboard along the length of the electronic device, and the two heat dissipation structures are arranged corresponding to the two air-cooling devices. The heat-conducting structure includes a main body and two branch parts connected together. The main body is stacked with the motherboard in the thickness direction of the electronic device and contacts the heat-generating device. The two branch parts are spaced apart on both sides of the main body in the length direction of the electronic device, and each branch part is stacked with and contacts the heat dissipation structure on one side of the electronic device in the thickness direction.

18. The electronic device as claimed in claim 16 or 17, characterized in that, The heat-conducting structure is a heat pipe or a heat spreader, and the heat dissipation structure is a heat dissipation fin. The heat dissipation fins include multiple heat dissipation channels, each of which has an inlet and an outlet. The inlet faces the air outlet of the air-cooling device, and the outlet faces the air outlet hole on the rear cover.

19. The electronic device according to any one of claims 1-18, characterized in that, The electronic device further includes a second air inlet, which is disposed on the side frame of the housing, and the air inlet of the air-cooling device communicates with the outside through the second air inlet.

20. The electronic device as claimed in claim 19, characterized in that, There is a gap between the air-cooling device and the rear cover. A guide structure is provided inside the housing. The guide structure has a guide surface. One end of the guide surface along its extension direction is corresponding to the second air inlet on the side frame, and the other end is corresponding to the gap.

21. The electronic device as claimed in claim 20, characterized in that, The guide structure is made of plastic.

22. The electronic device according to any one of claims 19-21, characterized in that, When the air outlet is located within the bracket area and the bracket is in a closed state, there is a gap between the bracket and the non-bracket area of ​​the back cover, and the air outlet communicates with the outside through the gap.

23. The electronic device as claimed in claim 22, characterized in that, The projection of the gap onto the back cover along the thickness direction of the electronic device is located within the non-bracket area. When the bracket is in a closed state, the surface of the bracket facing away from the back cover covers the air vent in the thickness direction of the electronic device.

24. The electronic device as claimed in claim 23, characterized in that, The bracket has a first inclined surface at one end near the non-bracket area, the first inclined surface being inclined relative to the thickness direction of the electronic device; the back cover has a second inclined surface at one end near the bracket in the non-bracket area, the second inclined surface being inclined relative to the thickness direction of the electronic device. The first inclined surface and the second inclined surface are opposite to each other and spaced apart, and the angle at which the first inclined surface is inclined relative to the thickness direction of the electronic device is the same as the angle at which the second inclined surface is inclined relative to the thickness direction of the electronic device.

25. The electronic device as claimed in claim 24, characterized in that, The angle at which the first inclined surface is tilted relative to the thickness direction of the electronic device and the angle at which the second inclined surface is tilted relative to the thickness direction of the electronic device are both within the range of 25° to 60°.

26. The electronic device according to any one of claims 22-25, characterized in that, The width of the gap is in the range of 0.5mm to 2mm.

27. The electronic device according to any one of claims 1-26, characterized in that, The bracket can rotate relative to the back cover around a first axis. When the air vent is entirely located within the bracket area, the first axis is spaced apart from the back cover and is located on the side of the back cover away from the display screen.

28. The electronic device as claimed in claim 27, characterized in that, When the air vent is located in the non-support area, the first axis is located on the surface of the back cover on the side opposite to the display screen.

29. The electronic device as claimed in claim 27 or 28, characterized in that, The bracket is rotatably connected to the back cover via a rotating shaft assembly; the rotating shaft assembly includes a base and a rotating seat, the base is fixedly connected to the back cover, and the rotating seat is fixedly connected to the bracket; An arc-shaped sliding structure is provided between the base and the rotating seat. The arc-shaped sliding structure includes an arc-shaped slider and an arc-shaped groove that are slidably connected to each other. One of the arc-shaped slider and the arc-shaped groove is provided on the base, and the other is provided on the rotating seat, so that the rotating seat is slidably connected to the base. The center of the extension trajectory of the arc-shaped groove is located on the first axis.

30. The electronic device as claimed in claim 29, characterized in that, The rotating shaft assembly further includes a damping shaft and a damping block. The damping block includes a first rotating part and a second rotating part that are spaced apart. The first rotating part is rotatably connected to the rotating seat, and the second rotating part is rotatably connected to the damping shaft. The damping shaft is slidably connected to the base.

31. The electronic device according to any one of claims 1-30, characterized in that, The air-cooling device is a fan, which includes a housing and fan blades, with the fan blades disposed inside the housing; The housing includes an upper cover, a lower cover, and a side wall. The upper cover and the lower cover are spaced apart in the thickness direction of the electronic device, and the lower cover faces the display screen. The side wall is disposed between the upper cover and the lower cover and surrounds the outer periphery of the fan blade. The air inlet is disposed on the upper cover, and the air outlet is disposed on the side wall. The rear cover of the electronic device has a fan area, which serves as the upper cover of the fan, and the first air inlet in the fan area serves as the air inlet of the fan; wherein, the fan area is the region where the projection of the fan on the rear cover is along the thickness direction of the electronic device.

32. The electronic device as claimed in claim 31, characterized in that, In the back cover, the fan area is integrated with other areas of the back cover in the electronic device.

33. The electronic device as claimed in claim 32, characterized in that, Foam is provided between the side wall of the fan and the rear cover.

34. The electronic device as claimed in claim 31, characterized in that, In the back cover, the fan area is configured as a separate structure from other areas of the back cover in the electronic device.

35. The electronic device as claimed in claim 34, characterized in that, The top cover includes a bottom and a rim that are connected together, the rim surrounding the outer periphery of the bottom; the surface of the bottom facing away from the display screen constitutes part of the outer surface of the electronic device, the surface of the bottom facing away from the display screen is flush with the surface of other areas of the back cover facing away from the display screen, and at least a portion of the structure of the rim is stacked with the sidewall of the fan in a direction perpendicular to the thickness direction of the electronic device.

36. The electronic device according to any one of claims 31-35, characterized in that, The fan area of ​​the rear cover is provided with a plurality of first air inlets, which are arranged in a multi-layered nested annular pattern.

37. The electronic device as claimed in claim 36, characterized in that, The diameter of the circular area containing the multiple first air inlets within the fan area is in the range of 30mm to 40mm, each first air inlet is a circular hole, and the diameter of each first air inlet is in the range of 0.8mm to 1.2mm.

38. The electronic device according to any one of claims 31-37, characterized in that, The sidewall of the fan and the rear cover of the electronic device are fixedly connected by a plurality of fixing structures, which are spaced apart along the outer periphery of the fan. Each of the aforementioned fixing structures includes a first fixing part, a second fixing part, and a fastener. The first fixing part is disposed on the outer wall surface of the side wall of the fan, and the second fixing part is disposed on the rear cover of the electronic device and located on the side of the rear cover facing the display screen. The first fixing part and the second fixing part are stacked in the thickness direction of the electronic device and are fixedly connected by the fastener.

Images