Glue flushing device, semiconductor equipment and thickness detection method

Abstract

The invention discloses a glue flushing device, semiconductor equipment and a thickness detection method, and the glue flushing device comprises one or more glue flushing platforms which are used for bearing a chip product area of a plastic-packaged packaging structure; the glue flushing mechanism is installed above the glue flushing platform, the glue flushing mechanism comprises a press-fit assembly, and the press-fit assembly is used for fixing the edge of a chip product area of the packaging structure borne on the glue flushing platform; the one or more thickness detection parts are fixedly connected with the glue flushing mechanism or the glue flushing platform, and the thickness detection parts are used for obtaining the thickness of the chip product area. According to the embodiment of the invention, the thickness detection component can detect the thickness of the chip product area of the packaging structure under the condition that the warping rate of the packaging structure is relatively low, so that the influence of the warping rate on a thickness detection result is reduced, the accuracy of the thickness detection result of the chip product area is improved, and the detection efficiency is improved. And correspondingly, the accuracy of the thickness detection result of the packaging structure is also improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing, and more particularly to a die-casting apparatus, semiconductor equipment, and a thickness detection method. Background Technology

[0002] With the development of electronic products, the importance of packaging technology is increasing. Electronic components are encapsulated with molding compounds (such as epoxy resin and other organic adhesives) to protect them and reduce the probability of oxidation or corrosion.

[0003] Furthermore, in order to ensure the reliability of chip products, various parameters of the packaging structure need to be tested during the packaging process.

[0004] However, current methods for inspecting packaging structures still need improvement. Summary of the Invention

[0005] The problem solved by the embodiments of the present invention is to provide a die-casting device, a semiconductor device, and a thickness detection method to improve the accuracy of thickness detection results for packaging structures.

[0006] To address the aforementioned problems, embodiments of the present invention provide a die-cutting apparatus, comprising: one or more die-cutting platforms for supporting the chip product area of ​​the encapsulated structure after molding; a die-cutting mechanism mounted above the die-cutting platforms, the die-cutting mechanism including a pressing component for fixing the edge of the chip product area of ​​the encapsulated structure supported on the die-cutting platform; and one or more thickness detection components fixedly connected to the die-cutting mechanism or the die-cutting platform, the thickness detection components being used to obtain the thickness of the chip product area.

[0007] Optionally, one end of the thickness detection component has a detection probe located above the adhesive application platform and facing the chip product area, and the detection probe is fixedly mounted on the pressing assembly.

[0008] Optionally, the pressing assembly includes a gate cutting plate corresponding to each of the injection molding platform; the gate cutting plate includes: a plate body, the plate body including a first surface and a second surface disposed opposite to each other, the first surface facing the injection molding platform; a protrusion located on the edge region of the first surface, the protrusion being used to press the edge of the chip product area supported on the injection molding platform; the detection probe is fixedly mounted on the plate body on the side of the protrusion.

[0009] Optionally, the pressure plate body on the side of the protrusion has a mounting hole that penetrates the pressure plate body; the detection probe passes through the mounting hole to be exposed on the first surface of the side of the protrusion, and the other end of the thickness detection component is fixedly mounted on the second surface.

[0010] Optionally, the thickness detection component is a contact displacement sensor, and the detection probe of the thickness detection component is located directly above the corresponding position to be detected.

[0011] Optionally, the detection probe protrudes beyond the surface of the protrusion.

[0012] Optionally, the number of thickness detection components is multiple, and they are used to detect multiple locations in the same chip product area.

[0013] Optionally, the detection probe of the thickness detection component is located directly above the corresponding position to be detected.

[0014] Optionally, each of the aforementioned die-casting platforms has a plurality of thickness detection components directly above it. Among the plurality of thickness detection components directly above each of the aforementioned die-casting platforms, the projection pattern of the detection probe of at least one of the thickness detection components is located in the central region of the die-casting platform to obtain the thickness of the central region in the chip product area, and the projection pattern of the detection probe of at least one of the thickness detection components is located in a region near the edge of the die-casting platform to obtain the thickness of the region near the edge in the chip product area.

[0015] Optionally, among the plurality of thickness detection components directly above any one of the adhesive stamping platform, the projection pattern of the detection probe of one of the thickness detection components is located in the central region of the adhesive stamping platform, while the projection patterns of the detection probes of the remaining plurality of thickness detection components are located in regions near the edge of the adhesive stamping platform.

[0016] Optionally, the shape of the adhesive stamping platform is rectangular; the number of thickness detection components directly above any one of the adhesive stamping platforms is 5, the projection pattern of the detection probe of one of the thickness detection components is located in the central area of ​​the adhesive stamping platform, and the projection patterns of the detection probes of the other four thickness detection components correspond one-to-one with the top corners of the adhesive stamping platform, and are respectively located in the area close to each top corner of the adhesive stamping platform.

[0017] Optionally, the glue-applying device further includes a cooling mechanism, which is installed above the glue-applying platform and fixedly connected to the pressing assembly.

[0018] Optionally, the adhesive applicator further includes a controller coupled to the thickness detection component.

[0019] Optionally, the controller is also coupled to a statistical process control system; or, the glue-applying device further includes an indicating component coupled to the controller.

[0020] Optionally, if the glue-applying device further includes an indicator component, the indicator component may include one or both of an indicator light and a buzzer.

[0021] Accordingly, embodiments of the present invention also provide a semiconductor device, including: the die-casting apparatus described in any embodiment of the present invention.

[0022] Accordingly, embodiments of the present invention also provide a thickness detection method, comprising: providing a die-casting apparatus as described in any embodiment of the present invention; providing a molded encapsulated structure and placing the encapsulated structure on the die-casting platform of the die-casting apparatus; fixing the edge of the chip product area carried by the die-casting platform by the pressing component; and after fixing the edge of the chip product area, performing thickness detection on the chip product area by the thickness detection component to obtain the thickness of the chip product area.

[0023] Optionally, the step of measuring the thickness of the chip product area using the thickness detection component to obtain the thickness of the chip product area includes: measuring the thickness of the chip product area using the thickness detection component and obtaining a detection result; processing the detection result to obtain the thickness of the chip product area; or, the step of measuring the thickness of the chip product area using the thickness detection component to obtain the thickness of the chip product area includes: measuring the thickness of the chip product area using the thickness detection component and obtaining a detection result, using the detection result as the thickness of the chip product area.

[0024] Optionally, in the step of providing the sprue applicator, the pressing assembly includes a gate-cutting pressure plate, the gate-cutting pressure plate includes a pressure plate body and a protrusion, the pressure plate body includes a first surface and a second surface disposed opposite to each other, the first surface facing the sprue platform, the protrusion being located on the edge region of the first surface, the protrusion being used to press the edge of the chip product area of ​​the encapsulation structure carried by the sprue platform, the thickness detection component is a contact displacement sensor, the detection probe of the thickness detection component is located directly above the corresponding position to be detected, one end of the thickness detection component has a detection probe located above the sprue platform and facing the chip product area, the detection probe is fixedly mounted on the pressure plate body on the side of the protrusion; in the step of providing the encapsulated encapsulation structure, the encapsulation structure includes a lead frame and an encapsulating material located on the lead frame, the encapsulating material exposing the edge of the lead frame; In the step of fixing the edge of the chip product area carried by the die-casting platform, the protrusion is pressed against the lead frame exposed in the encapsulant. Before obtaining the thickness of the chip product area, the method further includes: obtaining the thickness of the lead frame; obtaining the height difference between the bottom of the detection probe and the surface of the protrusion, wherein the height difference is negative when the detection probe protrudes from the surface of the protrusion, positive when the detection probe is recessed into the surface of the protrusion, and zero when the bottom of the detection probe is flush with the surface of the protrusion; in the step of obtaining the detection result, the thickness of the encapsulant is obtained; the step of processing the detection result to obtain the thickness of the chip product area includes: adding the thickness of the lead frame, the displacement distance of the detection probe, and the height difference, and using the sum as the thickness of the chip product area.

[0025] Optionally, in the step of providing the adhesive applicator, the detection probe protrudes from the surface of the protrusion; in the step of obtaining the height difference, the height difference is a negative value.

[0026] Optionally, in the step of providing the adhesive applicator, the detection probe of the thickness detection component is located directly above the corresponding position to be detected, and there are multiple thickness detection components directly above each adhesive applicator platform. Among the multiple thickness detection components directly above any adhesive applicator platform, the projected image of the detection probe of at least one thickness detection component is located in the central region of the adhesive applicator platform, and the projected image of the detection probe of at least one thickness detection component is located in the region near the edge of the adhesive applicator platform. In the step of obtaining the thickness of the chip product area, the thickness of the central region of the chip product area and the thickness of the region near the edge of the chip product area are obtained.

[0027] Optionally, in the step of providing the adhesive purging device, among the plurality of thickness detection components directly above any one of the adhesive purging platforms, the projection pattern of the detection probe of one of the thickness detection components is located in the central region of the adhesive purging platform, and the projection patterns of the detection probes of the remaining plurality of thickness detection components are located in regions near the edge of the adhesive purging platform; in the step of obtaining the thickness of the chip product area, the thickness at one location in the central region of the chip product area is obtained, and the thickness at multiple locations in the region near the edge of the chip product area is obtained.

[0028] Optionally, in the step of providing the adhesive applicator, the adhesive applicator platform is rectangular in shape, and the number of thickness detection components directly above any one of the adhesive applicator platforms is 5. The projection pattern of the detection probe of one of the thickness detection components is located in the central region of the adhesive applicator platform, and the projection patterns of the detection probes of the other four thickness detection components correspond one-to-one with the apex corners of the adhesive applicator platform and are respectively located in the regions near each apex corner of the adhesive applicator platform; in the step of obtaining the thickness of the chip product area, the thickness at a position in the central region of the chip product area is obtained, and the thickness at positions near each apex corner of the chip product area is obtained.

[0029] Optionally, in the step of providing the die-casting device, the die-casting device further includes a cooling mechanism installed above the die-casting platform and fixedly connected to the pressing assembly; in the step of cooling the encapsulated structure after molding, the thickness of the chip product area is detected by the thickness detection component.

[0030] Optionally, in the step of providing the die-casting apparatus, the die-casting apparatus further includes a controller coupled to the thickness detection component; in the step of obtaining the thickness of the chip product area, the controller, at fixed time intervals, causes the thickness detection component to automatically detect the thickness of the chip product area of ​​the package structure carried on the die-casting platform, so as to obtain the thickness of the chip product area of ​​each package structure carried on the die-casting platform.

[0031] Optionally, in the step of providing the die-casting device, the die-casting device further includes an indicator component coupled to the controller, the indicator component being used to issue an alarm message when the thickness of the chip product area exceeds a preset value; after obtaining the thickness of the chip product area, the thickness detection method further includes: if the thickness of the chip product area of ​​any of the package structures exceeds the preset value, then the controller causes the indicator component to issue an alarm message.

[0032] Compared with the prior art, the technical solution of the embodiments of the present invention has the following advantages: The adhesive punching device provided in this embodiment of the invention includes an adhesive punching mechanism mounted above an adhesive punching platform and a thickness detection component fixedly connected to the adhesive punching mechanism or the adhesive punching platform. The pressing component of the adhesive punching mechanism is used to fix the edge of the chip product area supported on the adhesive punching platform, so that the thickness detection component can detect the thickness of the chip product area of ​​the package structure when the warpage of the package structure is low. This helps to reduce the influence of warpage on the thickness detection result, thereby improving the accuracy of the thickness detection result of the chip product area and correspondingly improving the accuracy of the thickness detection result of the package structure.

[0033] In the thickness detection method provided in this embodiment of the invention, the edge of the chip product area of ​​the package structure is first fixed, and then the thickness of the chip product area is obtained by the thickness detection component. This allows the thickness detection component to detect the thickness of the chip product area of ​​the package structure when the warpage of the package structure is low, thereby reducing the influence of warpage on the thickness detection result and improving the accuracy of the thickness detection result of the chip product area, which in turn improves the accuracy of the thickness detection result of the package structure. Attached Figure Description

[0034] Figure 1 This is a front view of an embodiment of the glue-removing device of the present invention; Figure 2 This is a left view of an embodiment of the glue-applying device of the present invention; Figure 3 This is a schematic diagram of an embodiment of the adhesive injection device of the present invention when the encapsulation structure is not fixed; Figure 4 yes Figure 3 A magnified view of a portion at point A; Figure 5 yes Figure 3 A magnified view of the area at point B; Figure 6 This is a schematic diagram of an embodiment of the adhesive injection device of the present invention when fixing the packaging structure; Figure 7 yes Figure 6 A magnified view of point C; Figure 8 This is a schematic diagram of the probe projection pattern in the chip product area of ​​an embodiment of the adhesive application device of the present invention. Figure 9 This is a schematic diagram showing the coupling between the thickness detection component and the controller in one embodiment of the adhesive injection device of the present invention; Figure 10 This is a flowchart of an embodiment of the thickness detection method for the packaging structure of the present invention. Detailed Implementation

[0035] In existing technologies, the thickness of the chip product area of ​​the packaged structure is usually measured manually using a spiral measuring instrument after the waste adhesive of the packaged structure has been removed. However, the warpage of the packaged structure has a significant impact on the thickness measurement results, which leads to poor accuracy of the thickness measurement results.

[0036] To address the aforementioned technical problems, this invention provides a die-casting apparatus, including a die-casting mechanism mounted above a die-casting platform and a thickness detection component fixedly connected to the die-casting mechanism or the die-casting platform. The pressing component of the die-casting mechanism is used to fix the edge of the chip product area supported on the die-casting platform, enabling the thickness detection component to detect the thickness of the chip product area of ​​the package structure when the warpage of the package structure is low. This helps to reduce the impact of warpage on the thickness detection results, thereby improving the accuracy of the thickness detection results of the chip product area and, correspondingly, improving the accuracy of the thickness detection results of the package structure.

[0037] To make the above-mentioned objects, features and advantages of the embodiments of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0038] Figure 1 This is a front view of an embodiment of the glue-applying device of the present invention. Figure 2 This is a left view of an embodiment of the glue-applying device of the present invention. Figure 3 This is a schematic diagram of an embodiment of the adhesive injection device of the present invention when the packaging structure is not fixed. Figure 4 yes Figure 3 A magnified view of a portion at point A. Figure 5 yes Figure 3 A magnified view of the area at point B. Figure 6 This is a schematic diagram of an embodiment of the adhesive injection device of the present invention during the fixing of the packaging structure. Figure 7 yes Figure 6 A magnified view of the area at point C. Figure 8 This is a schematic diagram of the probe projection pattern of an embodiment of the adhesive application apparatus of the present invention in the chip product area. Figure 9 This is a schematic diagram showing the coupling between the thickness detection component and the controller in one embodiment of the adhesive application device of the present invention. (Reference) Figures 1 to 9 In this embodiment, the die-cutting apparatus 100 includes: one or more die-cutting platforms 110 for supporting the chip product area 201 of the encapsulated structure 200 after molding; a die-cutting mechanism 120 installed above the die-cutting platform 110, the die-cutting mechanism 120 including a pressing component 121 for fixing the edge of the chip product area 201 of the encapsulated structure 200 supported on the die-cutting platform 110; and one or more thickness detection components 140 fixedly connected to the die-cutting mechanism 120 or the die-cutting platform 110, the thickness detection components 140 for obtaining the thickness of the chip product area 201.

[0039] The die-cutting device 100 provides a process basis for thickness detection and die-cutting of the encapsulated structure 200 after plastic sealing.

[0040] The embossing platform 110 is used to support the chip product area 201 of the encapsulated structure 200, thereby providing an operating platform for thickness detection and embossing of the encapsulated structure 200.

[0041] The encapsulated package structure 200 typically includes a lead frame 203 and a molding compound 204 on the lead frame 203. The lead frame 203 includes a base island (not shown) for mounting a chip (not shown) and pins (not shown) connected to the base island. The molding compound 204 covers the base island, the chip mounted on the base island, and the pins, and exposes the edge of the lead frame 203. That is, the lead frame 203 exposed by the molding compound 204 is the edge of the chip product area 201.

[0042] The chip product area 201 of the packaging structure 200 is used to form an independent package after the dicing process to achieve a specific function.

[0043] In some embodiments, the number of die-casting platforms 110 is multiple, thereby enabling them to support a package structure 200 having multiple chip product areas 201.

[0044] In some embodiments, the encapsulated package structure 200 has a gate region 202 located on the side of the chip product area 201. Accordingly, the sprue applicator further includes a gate region top plate 115 located on the side of the sprue platform 110, the gate region top plate 115 being used to support the gate region 202 of the package structure 200.

[0045] Specifically, the top plate 115 of the water inlet area is located between the adjacent glue-filling platforms 110.

[0046] As an example, there are two glue-pressing platforms 110.

[0047] The lead frame 203 is typically rectangular, which results in the chip product area 201, whose main structure is the lead frame 203, also being rectangular. Therefore, in some embodiments, the die-casting platform 110 is also rectangular, which helps to adapt the die-casting platform 110 to the chip product area 201 it supports, thereby making reasonable use of space and making the die-casting device 100 more compact in structure.

[0048] The sprue mechanism 120 is used to fix the chip product area 201 of the encapsulated structure 200 and to perform a sprue operation on the encapsulated structure 200 to remove waste glue from the encapsulated structure 200, that is, to remove the gate area 202 of the encapsulated structure 200.

[0049] The pressing component 121 is used to fix the edge of the chip product area 201 supported on the die-casting platform 110, so as to reduce the probability of damage to the core area of ​​the chip product area 201.

[0050] In some embodiments, the pressing assembly 121 includes a gate cutting plate 122 corresponding to the punching platform 110; the gate cutting plate 122 includes: a plate body 1221, the plate body 1221 including a first surface 1222 and a second surface 1223 disposed opposite to each other, the first surface 1222 facing the punching platform 110; and a protrusion 1224 located on the edge region of the first surface 1222, the protrusion 1224 being used to press the edge of the chip product area 201 carried on the punching platform 110.

[0051] The protrusion 1224 is located on the edge region of the first surface 1222, which makes it easy to maintain a gap between the surface of the package structure 200 facing the pressure plate body 1221 and the pressure plate body 1221 when the edge of the chip product area 201 is pressed, especially when the edge of the lead frame 203 is pressed. This helps to further reduce the probability of the pressure plate body 1221 damaging the core area of ​​the chip product area 201 when the edge of the chip product area 201 is pressed.

[0052] Specifically, the pressure plate body 1221 on the side of the protrusion 1224 has a mounting hole 1225 that penetrates the pressure plate body 1221. The mounting hole 1225 is used to provide space for mounting the thickness detection component 140.

[0053] In some embodiments, the pressing assembly 121 further includes: a fixing member 123, fixedly disposed on the gate cutting plate 122 and fixedly connected to the second surface 1223 of the gate cutting plate 122; a gate top plate 124, disposed above the fixing member 123; a tension spring 125, disposed between the gate cutting plate 122 and the fixing member 123, one end of the tension spring 125 being fixedly connected to the second surface 1223 of the gate cutting plate 122 and the other end being fixedly connected to the top of the fixing member 123; and a compression spring 126, located between the fixing member 123 and the gate top plate 124, one end of the compression spring 126 being fixedly connected to the top of the fixing member 123 and the other end being fixedly connected to the bottom of the gate top plate 124.

[0054] In some embodiments, the side of the gate cutting plate 122 away from the top plate 115 of the gate area can rotate toward the punching platform 110, and the side of the punching platform 110 away from the top plate 115 of the gate area can rotate and move away from the gate cutting plate 122. In the step of separating the gate area 202 from the chip product area 201, after the package structure 200 cools, the protrusion 1224 is pressed onto the chip product area 201, and the protrusion 1224 of the gate cutting plate 122 away from the gate area 115 and the side of the punching platform 110 away from the top plate 115 of the gate area both rotate and move away from the punching mechanism 120, so as to separate the chip product area 201 and the gate area 202 by bending the chip product area 201.

[0055] In some embodiments, the gate area top plate 115 can move up and down in the direction toward the sprue-filling structure 120. It should be noted that, during the rotational movement of the protrusion 1224 of the gate cutting pressure plate 122 away from the gate area top plate 115 and the side of the sprue-filling platform 110 away from the gate area top plate 115 in the direction away from the sprue-filling mechanism 120, the gate area top plate 115 can also move toward the sprue-filling structure 120 to facilitate easier separation of the chip product area 201 and the gate area 202.

[0056] In some embodiments, the glue-applying device 100 further includes a cooling mechanism 130, which is mounted above the glue-applying platform 110 and fixedly connected to the pressing assembly 121.

[0057] The cooling mechanism 130 is used to cool and shape the encapsulation structure 200 supported on the die-casting platform 110.

[0058] Specifically, the cooling mechanism 130 includes: a cooling tank support 132, which passes through the fixing member 123, and one end of the cooling tank support 132 is fixedly connected to the top of the fixing member 123; a cooling tank plate 131, located on the side of the gate cutting pressure plate 122 above the injection platform 110, and fixedly connected to the other end of the cooling tank support 132, wherein a cooling tank (not shown) is provided inside the cooling tank plate 131; wherein the cooling tank is used as a flow channel for cooling gas, and the end of the cooling tank is provided with an air outlet (not shown) facing the injection platform 110, which is used to provide cooling gas to the packaging structure 200 supported on the injection platform 110.

[0059] More specifically, the cooling tank plate 131 is located above the top plate 115 of the sprue area.

[0060] The thickness detection component 140 is used to obtain the thickness h1 of the chip product area.

[0061] Specifically, the pressing component 121 of the die-casting mechanism 120 is used to fix the edge of the chip product area 201 supported on the die-casting platform 110, so that the thickness detection component 140 can detect the thickness h1 of the chip product area 201 of the package structure 200 when the warpage of the package structure 200 is low. This helps to reduce the influence of warpage on the thickness detection result, thereby improving the accuracy of the thickness detection result of the chip product area 201, and correspondingly improving the accuracy of the thickness detection result of the package structure 200.

[0062] In some embodiments, one end of the thickness detection component 140 has a detection probe 141 located above the die-casting platform 110 and facing the chip product area 201, and the detection probe 141 is fixedly mounted on the pressing assembly 121.

[0063] One end of the thickness detection component 140 has a detection probe 141 located above the adhesive application platform 110 and facing the chip product area 201, which makes it easier to reduce the difficulty for the thickness detection component 140 to obtain the thickness of the chip product area 201.

[0064] The detection probe 141 is fixedly installed on the pressing assembly 121, which makes it easier to set the detection probe 141 above the glue-punching platform 110 and facing the glue-punching platform 110, and also helps to reduce structural modifications to the existing glue-punching device.

[0065] Specifically, the detection probe 141 is fixedly mounted on the pressure plate body 1221 on the side of the protrusion 1224, which helps to reduce the distance between the detection probe 141 and the chip product area 201, thereby facilitating the selection of a more precise thickness detection component 140, and thus improving the accuracy of the thickness detection results.

[0066] More specifically, the detection probe 141 passes through the mounting hole 1225 to be exposed on the first surface of the side of the protrusion 1224, and the other end of the thickness detection component 140 is fixedly mounted on the second surface 1223. This helps to reduce the modification of the gate cutting plate 122, so that only the through mounting hole 1225 needs to be added to the gate cutting plate 122 to provide space for the installation of the thickness detection component 140.

[0067] In other embodiments, the thickness detection component may also be fixedly connected to the die-casting platform. For example, the thickness detection component includes a detection probe and a support member, one end of which is fixedly connected to the die-casting platform, and the other end of which is fixedly connected to the detection probe, so that the detection probe is positioned above the die-casting platform and facing the chip product area.

[0068] In some embodiments, the detection probe 141 of the thickness detection component 140 is located directly above the corresponding detection position, which helps to simplify the process of obtaining the thickness of the chip product area 201 and also helps to reduce the error of the detection result, thereby helping to further improve the accuracy of the thickness detection result.

[0069] In other embodiments, the thickness detection component may also be located at other positions above the corresponding detection position, for example, by obtaining the thickness of the chip product through laser triangulation.

[0070] In some embodiments, the thickness detection component 140 is a contact displacement sensor, and the detection probe 141 of the thickness detection component 140 is located directly above the corresponding position to be detected.

[0071] Contact displacement sensors have good detection accuracy and anti-interference ability, and are inexpensive.

[0072] Specifically, the end of the detection probe 141 facing away from the adhesive-filling platform 110 is connected to the return spring 142, so that the thickness detection component 140 can be reset promptly after each use (e.g., Figure 9 (As shown).

[0073] In other embodiments, the thickness detection component may also be a non-contact displacement sensor, such as a laser displacement sensor.

[0074] It should be noted that the detection probe 141 may protrude from the surface of the protrusion 1224, that is, the detection probe 141 is exposed on the side of the protrusion 1224 facing the glue-punching platform 110, that is, the bottom of the detection probe 141 is lower than the surface of the protrusion 1224. Alternatively, the detection probe 141 may be recessed into the surface of the protrusion 1224, that is, the bottom of the detection probe 141 is higher than the surface of the protrusion 1224. Or, the bottom of the detection probe 141 may be flush with the surface of the protrusion 1224.

[0075] It should also be noted that when the detection probe 141 can be recessed into the surface of the protrusion 1224, the distance between the bottom of the detection probe 141 and the surface of the protrusion 1224, i.e. the height of the detection probe 141, needs to be adjusted according to the thickness specification of the chip product area 201 to be detected, so as to avoid the distance between the bottom of the detection probe 141 and the surface of the protrusion 1224 being too large, which would have an adverse effect on the thickness detection results.

[0076] As an example, the detection probe 141 protrudes from the surface of the protrusion 1224, which helps to reduce the difficulty of setting up the detection probe 141 and also eliminates the need to adjust the height of the detection probe 141 before performing thickness detection on the chip product area 201.

[0077] In some embodiments, there are multiple thickness detection components 140, which are used to detect multiple positions of the same chip product area 201. That is, multiple thickness detection components 140 correspond to the chip product area 201 carried on the same die-casting platform 110. This is beneficial to obtain the thickness value h1 of the chip product area 201 more comprehensively, avoid errors caused by detection at a single position, and thus help to further improve the accuracy of the thickness detection results of the chip product area 201.

[0078] In one specific embodiment, each of the die-casting platforms 110 has multiple thickness detection components 140 directly above it. Among the multiple thickness detection components 140 directly above each die-casting platform 110, the projection pattern of the detection probe 141 of at least one thickness detection component 140 is located in the central region of the die-casting platform 110 to obtain the thickness h1 of the central region in the chip product area 201. The projection pattern of the detection probe 141 of at least one thickness detection component 140 is located in the region near the edge of the die-casting platform 110 to obtain the thickness h1 of the region near the edge in the chip product area 201. This allows for the acquisition of the thickness h1 of both the central region and the region near the edge in the chip product area 201, which is beneficial for a comprehensive understanding of the thickness h1 of the chip product area 201. This facilitates timely adjustments to the packaging process to improve the yield of the packaging structure 200.

[0079] It is understood that when the package structure 200 is supported on the die-casting platform 110, the projected pattern of at least one detection probe 141 is located in the central region of the chip product area, and the projected pattern of at least one thickness detection component 140 is located in the region near the edge of the die-casting platform 110.

[0080] Specifically, among the multiple thickness detection components 140 directly above any one of the die-casting platforms 110, the projection pattern of the detection probe 141 of one of the thickness detection components 140 is located in the central region of the die-casting platform 110, while the projection patterns of the detection probes of the other multiple thickness detection components 140 are located in the region near the edge of the die-casting platform 110. This is beneficial for obtaining the thickness h1 of multiple regions near the edge in the chip product area 201, thereby facilitating a more comprehensive understanding of the thickness h1 of the region near the edge in the chip product area 201.

[0081] More specifically, there are five thickness detection components 140 directly above any one of the die-casting platforms 110. The projection pattern of the detection probe 141 of one of the thickness detection components 140 is located in the central area of ​​the die-casting platform 110. The projection patterns of the detection probes 141 of the other four thickness detection components 140 correspond one-to-one with the top corners of the die-casting platform 110 and are located in the areas near the top corners of the die-casting platform 110, which is beneficial for obtaining the thickness h1 of the areas near the top corners in the chip product area 201.

[0082] In other words, when the packaging structure 200 is supported on the die-casting platform 110, the projected pattern 141' of one of the detection probes 141 is located in the central region of the chip product area 201, while the projected patterns 141' of the other four thickness detection components are located in areas near the edge of the chip product area 201 (e.g., ...). Figure 8 (As shown).

[0083] In some embodiments, the adhesive applicator 100 further includes a controller 150 coupled to the thickness detection component 140.

[0084] The controller 150 is used to enable the thickness detection component to automatically perform thickness detection on the chip product area.

[0085] The controller 150 can also be used to acquire the detection results of thickness detection of chip product area 201, and to process the detection results to obtain the thickness h1 value of chip product area 201.

[0086] It should be noted that controller 150 is a programmable logic controller (PLC). In other embodiments, the controller may also be a processor, microcontroller, microprocessor, or other suitable control unit.

[0087] It should also be noted that, through the controller 150, the thickness detection component 140 can automatically detect the thickness of the chip product area 201 at fixed intervals, thereby obtaining the thickness h1 of the chip product area 201 of each package structure 200 carried on the die-casting platform 110.

[0088] It should also be noted that the controller 150 is coupled to a statistical process control (SPC) system to monitor the thickness h1 of the chip product area 201 of each package structure 200 carried by the die-casting platform 110, so as to issue an alarm message when the thickness of the chip product area 201 of any package structure 200 exceeds a preset value or issue a prompt message when the thickness trend of the chip product area 201 of the package structure 200 develops in an undesirable direction.

[0089] In other embodiments, the die-casting apparatus further includes an indicator (not shown) coupled to the controller. The indicator is used to issue an alarm message when the thickness of the chip product area acquired by the controller exceeds a preset value.

[0090] Specifically, when the glue-applying device also includes an indicating component, the indicating component includes one or both of an indicator light and a buzzer. Indicator lights and buzzers are inexpensive and widely used.

[0091] Accordingly, the present invention also provides a semiconductor device.

[0092] Reference Figures 1 to 9 In this embodiment, the semiconductor packaging equipment includes the die-casting apparatus 100 according to any embodiment of the present invention.

[0093] The present invention includes a glue-applying mechanism 120 mounted above a glue-applying platform 110, and a thickness detection component 140 fixedly connected to the glue-applying mechanism 120 or the glue-applying platform. The pressing component 121 of the glue-applying mechanism 120 is used to fix the edge of the chip product area 201 supported on the glue-applying platform 110, so that the thickness detection component 140 can detect the thickness of the chip product area 201 of the package structure 200 when the warpage of the package structure 200 is low. This helps to reduce the influence of warpage on the thickness detection result, thereby improving the accuracy of the thickness detection result of the chip product area 201, and correspondingly improving the accuracy of the thickness detection result of the package structure 200.

[0094] For a description of the anti-adhesive device 100, please refer to the detailed description of the foregoing embodiments, which will not be repeated in this embodiment.

[0095] Accordingly, the present invention also provides a method for forming a semiconductor structure. Figure 10 This is a flowchart of an embodiment of the thickness detection method for the packaging structure of the present invention.

[0096] refer to Figure 10 and in conjunction with references Figures 1 to 5 as well as Figure 9 Step S1: Provide the glue-applying device 100.

[0097] The glue-applying device 100 is the glue-applying device described in any embodiment of the present invention.

[0098] The die-cutting device 100 provides a process basis for thickness detection and die-cutting of the encapsulated structure 200 after plastic sealing.

[0099] The embossing platform 110 is used to support the packaged chip product area 201 after molding, thereby providing an operating platform for thickness detection and embossing of the packaged structure 200 after molding.

[0100] The encapsulated package structure 200 typically includes a lead frame 203 and a molding compound 204 on the lead frame 203. The lead frame 203 includes a base island (not shown) for mounting a chip (not shown) and pins (not shown) connected to the base island. The molding compound 204 covers the base island, the chip mounted on the base island, and the pins, and exposes the edge of the lead frame 203. That is, the lead frame 203 exposed by the molding compound 204 is the edge of the chip product area 201.

[0101] The chip product area 201 of the package structure 200 is used to form a chip product after the dicing process to achieve a specific function.

[0102] In some embodiments, the number of die-casting platforms 110 is multiple, thereby enabling them to support a package structure 200 having multiple chip product areas 201.

[0103] In some embodiments, the encapsulated package structure 200 has a gate region 202 located on the side of the chip product area 201. Accordingly, the sprue applicator further includes a gate region top plate 115 located on the side of the sprue platform 110, the gate region top plate 115 being used to support the gate region 202 of the package structure 200.

[0104] Specifically, the top plate 115 of the water inlet area is located between the adjacent glue-filling platforms 110.

[0105] As an example, there are two glue-pressing platforms 110.

[0106] The lead frame 203 is typically rectangular, which results in the chip product area 201, whose main structure is the lead frame 203, also being rectangular. Therefore, in some embodiments, the die-casting platform 110 is also rectangular, which helps to adapt the die-casting platform 110 to the chip product area 201 it supports, thereby making reasonable use of space and making the die-casting device 100 more compact in structure.

[0107] The sprue mechanism 120 is used to fix the chip product area 201 of the encapsulated structure 200 and to perform a sprue operation on the encapsulated structure 200 to remove waste glue from the encapsulated structure 200, that is, to remove the gate area 202 of the encapsulated structure 200.

[0108] The pressing component 121 is used to fix the edge of the chip product area 201 supported on the die-casting platform 110, so as to reduce the probability of damage to the core area of ​​the chip product area 201.

[0109] In some embodiments, in the step of providing the die-cutting apparatus 100, the pressing assembly 121 includes a gate-cutting pressure plate 122, which includes a pressure plate body 1221 and a protrusion 1224. The pressure plate body 1221 includes a first surface 1222 and a second surface 1223 disposed opposite to each other. The first surface 1222 faces the die-cutting platform 110, and the protrusion 1224 is located on the edge region of the first surface 1222. The protrusion 1224 is used to press the edge of the chip product area 201 of the packaging structure 200 carried by the die-cutting platform 110. The thickness detection component 140 is a contact displacement sensor. The detection probe 141 of the thickness detection component 140 is located directly above the corresponding position to be detected. One end of the thickness detection component 140 has a detection probe 141 located above the die-cutting platform 110 and facing the chip product area 201. The detection probe 141 is fixedly installed on the pressure plate body 1221 on the side of the protrusion 1224.

[0110] The protrusion 1224 is located on the edge region of the first surface 1222, which makes it easy to maintain a gap between the surface of the package structure 200 facing the pressure plate body 1221 and the pressure plate body 1221 when the edge of the chip product area 201 is pressed, especially when the edge of the lead frame 203 is pressed. This helps to further reduce the probability of the pressure plate body 1221 damaging the core area of ​​the chip product area 201 when the edge of the chip product area 201 is pressed.

[0111] Contact displacement sensors offer superior detection accuracy and interference resistance, and are inexpensive. In other embodiments, the thickness detection component can also be a non-contact displacement sensor, such as a laser displacement sensor.

[0112] It should be noted that the detection probe 141 may protrude from the surface of the protrusion 1224, that is, the detection probe 141 is exposed on the side of the protrusion 1224 facing the glue-punching platform 110, that is, the bottom of the detection probe 141 is lower than the surface of the protrusion 1224. Alternatively, the detection probe 141 may be recessed into the surface of the protrusion 1224, that is, the bottom of the detection probe 141 is higher than the surface of the protrusion 1224. Or, the bottom of the detection probe 141 may be flush with the surface of the protrusion 1224.

[0113] It should also be noted that when the detection probe 141 can be recessed into the surface of the protrusion 1224, the distance between the bottom of the detection probe 141 and the surface of the protrusion 1224, i.e. the height of the detection probe 141, needs to be adjusted according to the thickness specification of the chip product area 201 to be detected, so as to avoid the distance between the bottom of the detection probe 141 and the surface of the protrusion 1224 being too large, which would have an adverse effect on the thickness detection results.

[0114] One end of the thickness detection component 140 has a detection probe 141 located above the die-casting platform 110 and facing the chip product area 201, which reduces the difficulty for the thickness detection component 140 to obtain the thickness of the chip product area 201.

[0115] The detection probe 141 is fixedly installed on the pressing assembly 121, which makes it easier to set the detection probe 141 above the glue-punching platform 110 and facing the glue-punching platform 110, and also helps to reduce structural modifications to the existing glue-punching device.

[0116] Furthermore, the detection probe 141 is fixedly mounted on the pressure plate body 1221 on the side of the protrusion 1224, which helps to reduce the distance between the detection probe 141 and the chip product area 201, thereby facilitating the selection of a more precise thickness detection component 140, and thus improving the accuracy of the thickness detection results.

[0117] In some embodiments, during the step of providing the die-casting apparatus 100, the detection probe 141 protrudes from the surface of the protrusion 1224, which helps to reduce the difficulty of setting the detection probe 141 and also helps to eliminate the step of adjusting the height of the detection probe 141 before performing thickness detection on the chip product area 201.

[0118] In some embodiments, during the step of providing the glue-applying device 100, the glue-applying device 100 further includes a cooling mechanism 130 mounted above the glue-applying platform 110 and fixedly connected to the pressing assembly 121.

[0119] The cooling mechanism 130 is used to cool and shape the encapsulation structure 200 supported on the die-casting platform 110.

[0120] In some embodiments, in the step of providing the die-casting apparatus 100, there are multiple thickness detection components 140, which are used to detect multiple positions of the same chip product area 201. That is, multiple thickness detection components 140 correspond to the chip product area 201 carried on the same die-casting platform 110. This is beneficial for obtaining the thickness value h1 of the chip product area 201 more comprehensively in the future, avoiding errors caused by detection at a single position, and thus helping to further improve the accuracy of the thickness detection results of the chip product area 201.

[0121] In some embodiments, during the step of providing the die-casting apparatus 100, the detection probe 141 of the thickness detection component 140 is located directly above the corresponding position to be detected, which helps to simplify the process of obtaining the thickness of the chip product area 201 and also helps to reduce the error of the detection result, thereby helping to further improve the accuracy of the thickness detection result.

[0122] In other embodiments, during the step of providing the adhesive applicator, the thickness detection component may also be located at other positions above the corresponding position to be detected, and the thickness of the chip product can be obtained subsequently by trigonometric function calculation.

[0123] In one specific embodiment, in the step of providing the die-casting apparatus 100, the detection probe 141 of the thickness detection component 140 is located directly above the corresponding detection position, and a plurality of thickness detection components 140 are located directly above each die-casting platform 110. Among the plurality of thickness detection components 140 directly above any die-casting platform 110, the projection pattern of the detection probe 141 of at least one thickness detection component 140 is located in the central region of the die-casting platform 110, and the projection pattern of the detection probe 141 of at least one thickness detection component 140 is located in the region near the edge of the die-casting platform 110. This allows for the acquisition of not only the thickness h1 of the central region in the chip product area 201, but also the thickness h1 of the region near the edge in the chip product area 201. This facilitates a comprehensive understanding of the thickness h1 of the chip product area 201, thereby enabling timely adjustments to the packaging process to improve the yield of the packaging structure 200.

[0124] Specifically, in the step of providing the adhesive application apparatus 100, among the multiple thickness detection components 140 directly above any adhesive application platform 110, the projection pattern of the detection probe 141 of one of the thickness detection components 140 is located in the central region of the adhesive application platform 110, while the projection patterns of the detection probes 141 of the remaining multiple thickness detection components 140 are located in the region near the edge of the adhesive application platform 110. This is beneficial for subsequently obtaining the thickness h1 of multiple regions near the edge in the chip product area 201, thereby facilitating a more comprehensive understanding of the thickness h1 of the region near the edge in the chip product area 201.

[0125] More specifically, in the step of providing the die-casting device 100, the die-casting platform is rectangular in shape, and there are 5 thickness detection components directly above any die-casting platform. The projection pattern of the detection probe 141 of one of the thickness detection components 140 is located in the central area of ​​the die-casting platform 110, and the projection patterns of the detection probes 141 of the other four thickness detection components 140 correspond one-to-one with the top corners of the die-casting platform 110, and are respectively located in the area near each top corner of the die-casting platform 110, which is beneficial for subsequently obtaining the thickness h1 of the area near each top corner in the chip product area 201.

[0126] In some embodiments, during the step of providing the glue-applying device 100, the glue-applying device 100 further includes a controller 150 coupled to the thickness detection component 140.

[0127] Controller 150 is used to subsequently enable the thickness detection component to automatically perform thickness detection on the chip product area. The controller 150 can also be used to subsequently acquire the detection results of thickness detection of the chip product area 201, and to process the detection results to obtain the thickness h1 value of the chip product area 201.

[0128] It should be noted that controller 150 is a programmable logic controller (PLC). In other embodiments, the controller may also be a processor, microcontroller, microprocessor, or other suitable control unit.

[0129] It should also be noted that the controller 150 is also coupled to the statistical process control system for monitoring the thickness h1 of the chip product area 201 of each package structure 200 carried by the punching platform 110, so as to issue an alarm message when the thickness of the chip product area 201 of any package structure 200 exceeds a preset value or issue a prompt message when the thickness trend of the chip product area 201 of the package structure 200 develops in an undesirable direction.

[0130] In other embodiments, in the step of providing the die-casting apparatus, the die-casting apparatus further includes an indicator component coupled to the controller, the indicator component being used to issue an alarm message when the thickness of the chip product area exceeds a preset value; Specifically, when the glue-applying device also includes an indicating component, the indicating component includes one or both of an indicator light and a buzzer. Indicator lights and buzzers are inexpensive and widely used.

[0131] For a description of the anti-adhesive device 100, please refer to the detailed description of the foregoing embodiments, which will not be repeated in this embodiment.

[0132] refer to Figure 10 and in conjunction with references Figures 1 to 5 as well as Figure 9 Step S2: Provide the encapsulated packaging structure 200 and place the packaging structure 200 on the adhesive punching platform 110 of the adhesive punching device 100.

[0133] The encapsulated package structure 200 typically includes a lead frame 203 and a molding compound 204 on the lead frame 203. The lead frame 203 includes a base island (not shown) for mounting a chip (not shown) and pins (not shown) connected to the base island. The molding compound 204 covers the base island, the chip mounted on the base island, and the pins, and exposes the edges of the lead frame 203. That is, the lead frame 203 exposed by the molding compound 204 is the edge of the chip product area 201. Accordingly, in the step of providing the encapsulated package structure 200, the package structure 200 includes a lead frame 203 and a molding compound 204 on the lead frame 203, with the molding compound 204 exposing the edges of the lead frame 203.

[0134] In one specific embodiment, in the step of providing the die-casting apparatus 100, the detection probe 141 of the thickness detection component 140 is located directly above the corresponding position to be detected, and a plurality of thickness detection components 140 are provided directly above each die-casting platform 110. Among the plurality of thickness detection components 140 directly above any die-casting platform 110, the projected pattern of the detection probe 141 of at least one thickness detection component 140 is located in the central region of the die-casting platform 110, and the projected pattern of the detection probe 141 of at least one thickness detection component 140 is located in the region near the edge of the die-casting platform 110. Correspondingly, when the package structure 200 is carried on the die-casting platform 110, the projected pattern of at least one detection probe 141 is located in the central region of the chip product area, and the projected pattern of at least one thickness detection component 140 is located in the region near the edge of the die-casting platform 110.

[0135] Specifically, in the step of providing the die-casting apparatus 100, the die-casting platform is rectangular in shape, and there are five thickness detection components directly above any one die-casting platform. The projection pattern of the detection probe 141 of one thickness detection component 140 is located in the central region of the die-casting platform 110, and the projection patterns of the detection probes 141 of the other four thickness detection components 140 correspond one-to-one with the apex corners of the die-casting platform 110, and are respectively located in the region near each apex corner of the die-casting platform 110, which is beneficial for subsequently obtaining the thickness h1 of the region near each apex corner in the chip product area 201. Correspondingly, when the packaging structure 200 is supported on the die-casting platform 110, the projection pattern 141′ of one detection probe 141 is located in the central region of the chip product area 201, and the projection patterns 141′ of the other four thickness detection components are located in the region near the edge of the chip product area 201 (e.g., Figure 8 (As shown).

[0136] refer to Figure 10 and in conjunction with references Figures 1 to 9 Step S3: The edge of the chip product area 201 carried by the punching platform 110 is fixed by the pressing component 121, so that the edge of the chip product area 201 is not easy to warp, which helps to reduce the warpage rate of the encapsulated structure 200 after molding.

[0137] In some embodiments, in the step of providing the encapsulated package structure 200, the package structure 200 includes a lead frame 203 and a molding compound 204 located on the lead frame 203, the molding compound 204 exposing the edges of the lead frame 203. Correspondingly, in the step of fixing the edge of the chip product area 201 carried by the die-casting platform 110, the protrusion 1224 is pressed against the lead frame 203 exposed in the molding compound 204.

[0138] refer to Figure 10 and in conjunction with references Figures 1 to 9 Step S4: After fixing the edge of the chip product area 201, the thickness of the chip product area 201 is detected by the thickness detection component 140 to obtain the thickness h1 of the chip product area 201.

[0139] First, the edge of the chip product area 201 of the packaging structure 200 is fixed. Then, the thickness h1 of the chip product area 201 is obtained by the thickness detection component 140. This allows the thickness detection component 140 to detect the thickness h1 of the chip product area 201 of the packaging structure 200 when the warpage of the packaging structure 200 is low. This helps to reduce the influence of warpage on the thickness detection result, thereby improving the accuracy of the thickness detection result of the chip product area 201 and, correspondingly, improving the accuracy of the thickness detection result of the packaging structure 200.

[0140] In some embodiments, the step of performing thickness detection on the chip product area 201 by the thickness detection component 140 to obtain the thickness h1 of the chip product area 201 includes: performing thickness detection on the chip product area 201 by the thickness detection component 140 to obtain the detection result; and performing data processing on the detection result to obtain the thickness h1 of the chip product area 201.

[0141] First, the thickness of the chip product area 201 is detected by the thickness detection component 140 and the detection result is obtained. Then, the detection result is processed to obtain the thickness h1 of the chip product area 201, which helps to reduce the difficulty of obtaining the thickness h1 of the chip product area 201.

[0142] Specifically, before obtaining the thickness h1 of the chip product area 201, the method further includes: obtaining the thickness h2 of the lead frame 203; obtaining the height difference h3 between the bottom of the detection probe 141 and the surface of the protrusion 1224, wherein the height difference h3 is negative when the detection probe 141 protrudes from the surface of the protrusion 1224, positive when the detection probe 141 is recessed into the surface of the protrusion 1224, and zero when the bottom of the detection probe 141 is flush with the surface of the protrusion 1224; in the step of obtaining the detection result, obtaining the thickness of the encapsulant 204; and processing the detection result to obtain the thickness h1 of the chip product area 201 includes: adding the thickness h2 of the lead frame 203, the displacement distance h4 of the detection probe, and the height difference h3, and using the sum as the thickness h1 of the chip product area 201.

[0143] It is understandable that the sum of the displacement distance h4 of the detection probe and the height difference h3 is the thickness of the encapsulant 204, and the thickness h1 of the chip product area 201 is the sum of the thickness h2 of the lead frame 203 and the thickness of the encapsulant 204. Therefore, by adding the thickness h2 of the lead frame 203, the displacement distance h4 of the detection probe, and the height difference h3, the thickness h1 of the chip product area 201 can be obtained.

[0144] Moreover, the method of obtaining the thickness h1 of the chip product area 201 by adding the thickness h2 of the lead frame 203, the displacement distance h4 of the detection probe, and the height difference h3 is simpler in calculation process, which helps to reduce the difficulty of obtaining the thickness h1 of the chip product area 201.

[0145] More specifically, since the detection probe 141 protrudes from the surface of the protrusion 1224 during the step of providing the glue-filling device 100, the height difference h3 is negative during the step of obtaining the height difference h3.

[0146] It should also be noted that the test results can be processed using empirical formulas to convert the test results into the thickness of the chip product area.

[0147] In other embodiments, the step of measuring the thickness of the chip product area using a thickness detection component to obtain the thickness of the chip product area includes: measuring the thickness of the chip product area using a thickness detection component, obtaining the detection result, and using the detection result as the thickness of the chip product area.

[0148] In other embodiments, the step of measuring the thickness of the chip product area using a thickness detection component to obtain the thickness of the chip product area includes: obtaining a first detection value when the packaging structure is not supported on the die-casting platform using the thickness detection component; obtaining a second detection value when the packaging structure is supported on the die-casting platform using the thickness detection component; and using the difference between the first detection value and the second detection value as the thickness of the chip product area; wherein the height of the thickness detection component is the same when obtaining the first detection value and when obtaining the second detection value.

[0149] In some embodiments, during the step of providing the die-casting apparatus 100, the detection probe 141 of the thickness detection component 140 is located directly above the corresponding detection position, and a plurality of thickness detection components 140 are provided directly above each die-casting platform 110. Among the plurality of thickness detection components 140 directly above any die-casting platform 110, the projected pattern of the detection probe 141 of at least one thickness detection component 140 is located in the central region of the die-casting platform 110, and the projected pattern of the detection probe 141 of at least one thickness detection component 140 is located in the region near the edge of the die-casting platform 110. Correspondingly, in the step of obtaining the thickness h1 of the chip product area 201, the thickness h1 of the central region of the chip product area 201 is obtained, and the thickness h1 of the region near the edge of the chip product area 201 is obtained.

[0150] Specifically, in the step of providing the die-casting apparatus 100, among the plurality of thickness detection components 140 directly above any die-casting platform 110, the projection pattern of the detection probe 141 of one of the thickness detection components 140 is located in the central region of the die-casting platform 110, while the projection patterns of the detection probes 141 of the remaining plurality of thickness detection components 140 are located in regions near the edge of the die-casting platform 110. Correspondingly, in the step of obtaining the thickness h1 of the chip product area 201, the thickness h1 at one location in the central region of the chip product area 201 is obtained, as well as the thickness h1 at multiple locations in the regions near the edge of the chip product area 201.

[0151] More specifically, in the step of providing the die-casting device 100, the die-casting platform is rectangular in shape, and there are 5 thickness detection components directly above any die-casting platform. The projection pattern of the detection probe 141 of one of the thickness detection components 140 is located in the central region of the die-casting platform 110, and the projection patterns of the detection probes 141 of the other four thickness detection components 140 correspond one-to-one with the top corners of the die-casting platform 110, and are respectively located in the regions near the top corners of the die-casting platform 110. Correspondingly, in the step of obtaining the thickness of the chip product area 201, the thickness h1 at a position in the central region of the chip product area 201 is obtained, as well as the thickness h1 at positions near the top corners of the chip product area 201 is obtained.

[0152] In some embodiments, during the cooling process of the encapsulated package structure, the thickness of the chip product area is detected by a thickness detection component. This allows the thickness detection step of the chip product area to be combined with the cooling process, thereby reducing the total processing time and improving process efficiency.

[0153] In other embodiments, the thickness of the chip product area can be detected by a thickness detection component after the edge of the chip product area is fixed and before the cooling process of the encapsulated package structure; or, the thickness of the chip product area can be detected by a thickness detection component after the cooling process of the encapsulated package structure. As an example, the thickness detection component 140 can be automatically used by the controller 150 to detect the thickness of the chip product area 201.

[0154] Specifically, the controller 150 can also acquire the detection results and process the data to obtain the value of the thickness h1 of the chip product area 201.

[0155] As another example, in the step of obtaining the thickness h1 of the chip product area 201, the controller 150 automatically detects the thickness of the chip product area of ​​the package structure carried on the die-casting platform at fixed time intervals to obtain the thickness of the chip product area of ​​each package structure carried on the die-casting platform. This facilitates real-time monitoring of the thickness change of the chip product area 201, thereby helping to ensure the quality of the package structure 200.

[0156] It should be noted that the controller 150 is also coupled to the statistical process control system for monitoring the thickness h1 of the chip product area 201 of each package structure 200 carried by the die-casting platform 110, so as to issue an alarm message when the thickness of the chip product area 201 of any package structure 200 exceeds a preset value or issue a prompt message when the thickness trend of the chip product area 201 of the package structure 200 develops in an undesirable direction.

[0157] In other embodiments, in the step of providing the die-casting device, the die-casting device further includes an indicator component coupled to the controller, the indicator component being used to issue an alarm message when the thickness of the chip product area exceeds a preset value; correspondingly, after obtaining the thickness of the chip product area, the thickness detection method further includes: if the thickness of the chip product area of ​​any package structure exceeds the preset value, the controller causes the indicator component to issue an alarm message, which is beneficial to timely detection of defective products and prevent defective products from flowing into subsequent processes.

[0158] It should be noted that the preset values ​​include a preset maximum value and a preset minimum value. In other words, when the thickness of the chip product area of ​​the package structure is greater than the preset maximum value or less than the preset minimum value, the indicator component will issue an alarm message to indicate that a defective product has been found.

[0159] It is understandable that after performing thickness detection on the chip product area 201 to obtain the thickness of the chip product area 201, a purging operation can be performed on the packaging structure 200 to remove waste adhesive on the packaging structure 200.

[0160] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A glue-applying device, characterized in that, include: One or more die-casting platforms are used to support the chip product area after molding and encapsulation of the packaged structure. A die-casting mechanism is installed above the die-casting platform. The die-casting mechanism includes a pressing assembly for fixing the edge of the chip product area of ​​the packaging structure supported on the die-casting platform. One or more thickness detection components are fixedly connected to the adhesive punching mechanism or adhesive punching platform, and the thickness detection components are used to obtain the thickness of the chip product area.

2. The glue-applying device as described in claim 1, characterized in that, One end of the thickness detection component has a detection probe located above the adhesive application platform and facing the chip product area, and the detection probe is fixedly mounted on the lamination assembly.

3. The glue-applying device as described in claim 2, characterized in that, The pressing assembly includes gate cutting plates corresponding one-to-one with the injection platform; the gate cutting plate includes: a plate body, the plate body including a first surface and a second surface disposed opposite to each other, the first surface facing the injection platform; and a protrusion located on the edge area of ​​the first surface, the protrusion being used to press the edge of the chip product area supported on the injection platform. The detection probe is fixedly installed on the pressure plate body on the side of the protrusion.

4. The glue-applying device as described in claim 3, characterized in that, The pressure plate body on the side of the protrusion has a mounting hole that penetrates the pressure plate body; The detection probe passes through the mounting hole to expose the first surface on the side of the protrusion, and the other end of the thickness detection component is fixedly mounted on the second surface.

5. The glue-applying device as described in claim 3 or 4, characterized in that, The thickness detection component is a contact displacement sensor, and the detection probe of the thickness detection component is located directly above the corresponding position to be detected.

6. The glue-refilling device as described in claim 5, characterized in that, The detection probe protrudes from the surface of the protrusion.

7. The glue-applying device as described in claim 1, characterized in that, The thickness detection components are multiple and are used to detect multiple locations within the same chip product area.

8. The glue-refilling device as described in claim 2, characterized in that, The detection probe of the thickness detection component is located directly above the corresponding position to be detected.

9. The glue-removing device as described in claim 8, characterized in that, Each of the aforementioned adhesive-removing platforms has a plurality of thickness detection components directly above it. Among the plurality of thickness detection components directly above each of the aforementioned adhesive-removing platforms, the projection pattern of the detection probe of at least one of the thickness detection components is located in the central region of the adhesive-removing platform to obtain the thickness of the central region in the chip product area, and the projection pattern of the detection probe of at least one of the thickness detection components is located in a region near the edge of the adhesive-removing platform to obtain the thickness of the region near the edge in the chip product area.

10. The glue-refilling device as described in claim 9, characterized in that, Of the plurality of thickness detection components directly above any one of the adhesive stamping platforms, the projection pattern of the detection probe of one of the thickness detection components is located in the central region of the adhesive stamping platform, while the projection patterns of the detection probes of the remaining plurality of thickness detection components are located in regions near the edge of the adhesive stamping platform.

11. The glue-refilling device as described in claim 10, characterized in that, The adhesive application platform is rectangular in shape. The number of thickness detection components directly above any of the adhesive stamping platforms is 5. The projection pattern of the detection probe of one of the thickness detection components is located in the central area of ​​the adhesive stamping platform, and the projection patterns of the detection probes of the other four thickness detection components correspond one-to-one with the top corners of the adhesive stamping platform, and are respectively located in the area close to each top corner of the adhesive stamping platform.

12. The glue-applying device as described in claim 1, characterized in that, The glue-applying device further includes a cooling mechanism, which is installed above the glue-applying platform and fixedly connected to the pressing assembly.

13. The glue-applying device as described in claim 1, characterized in that, The adhesive sizing device further includes a controller coupled to the thickness detection component.

14. The glue-refilling device as described in claim 13, characterized in that, The controller is also coupled to a statistical process control system; or, The adhesive rinsing device further includes an indicating component coupled to the controller.

15. The glue-refilling device as described in claim 14, characterized in that, If the glue-applying device also includes an indicator component, the indicator component may include one or both of an indicator light and a buzzer.

16. A semiconductor packaging device, characterized in that, The adhesive applicator includes any one of claims 1 to 15.

17. A thickness detection method, characterized in that, include: Provide a glue-removing apparatus as described in any one of claims 1 to 16; Provide a plastic-encapsulated packaging structure, and place the packaging structure on the die-casting platform of the die-casting device; The edge of the chip product area carried by the bonding assembly is fixed by the bonding assembly. After fixing the edge of the chip product area, the thickness of the chip product area is detected by the thickness detection component to obtain the thickness of the chip product area.

18. The thickness detection method as described in claim 17, characterized in that, The step of measuring the thickness of the chip product area using the thickness detection component to obtain the thickness of the chip product area includes: The thickness of the chip product area is measured using the thickness detection component, and the detection result is obtained. The detection results are processed to obtain the thickness of the chip product area; or, The step of measuring the thickness of the chip product area using the thickness detection component to obtain the thickness of the chip product area includes: The thickness of the chip product area is detected by the thickness detection component, and the detection result is used as the thickness of the chip product area.

19. The thickness detection method as described in claim 18, characterized in that, In the step of providing the gating device, the pressing assembly includes a gate cutting plate, the gate cutting plate includes a plate body and a protrusion, the plate body includes a first surface and a second surface disposed opposite to each other, the first surface faces the gating platform, the protrusion is located on the edge area of ​​the first surface, the protrusion is used to press the edge of the chip product area of ​​the packaging structure carried by the gating platform, the thickness detection component is a contact displacement sensor, the detection probe of the thickness detection component is located directly above the corresponding position to be detected, one end of the thickness detection component has a detection probe located above the gating platform and facing the chip product area, the detection probe is fixedly installed on the plate body on the side of the protrusion; In the step of providing a molded encapsulation structure, the encapsulation structure includes a lead frame and a molding compound located on the lead frame, the molding compound exposing the edges of the lead frame; In the step of fixing the edge of the chip product area carried by the molding platform, the protrusion is pressed against the lead frame exposed in the molding compound; Before obtaining the thickness of the chip product area, the method further includes: obtaining the thickness of the lead frame; obtaining the height difference between the bottom of the detection probe and the surface of the protrusion, wherein the height difference is negative when the detection probe protrudes from the surface of the protrusion, positive when the detection probe is recessed into the surface of the protrusion, and zero when the bottom of the detection probe is flush with the surface of the protrusion. In the step of obtaining the test results, the thickness of the encapsulating material is obtained; The step of processing the detection results to obtain the thickness of the chip product area includes: adding the thickness of the lead frame, the displacement distance of the detection probe, and the height difference, and using the sum as the thickness of the chip product area.

20. The thickness detection method as described in claim 19, characterized in that, In the step of providing the adhesive injection device, the detection probe protrudes from the surface of the protrusion; In the step of obtaining the height difference, the height difference is a negative value.

21. The thickness detection method as described in claim 17, characterized in that, In the step of providing the glue-filling device, the detection probe of the thickness detection component is located directly above the corresponding position to be detected, and there are multiple thickness detection components directly above each glue-filling platform. Among the multiple thickness detection components directly above any glue-filling platform, the projected image of the detection probe of at least one thickness detection component is located in the central region of the glue-filling platform, and the projected image of the detection probe of at least one thickness detection component is located in the region near the edge of the glue-filling platform. In the step of obtaining the thickness of the chip product area, the thickness of the central region of the chip product area and the thickness of the region near the edge of the chip product area are obtained.

22. The thickness detection method as described in claim 21, characterized in that, In the step of providing the adhesive sizing device, among the plurality of thickness detection components directly above any one of the adhesive sizing platforms, the projection pattern of the detection probe of one of the thickness detection components is located in the central region of the adhesive sizing platform, and the projection patterns of the detection probes of the remaining plurality of thickness detection components are located in the region near the edge of the adhesive sizing platform. In the step of obtaining the thickness of the chip product area, the thickness of a location in the central region of the chip product area is obtained, and the thickness of multiple locations in the region near the edge of the chip product area is obtained.

23. The thickness detection method as described in claim 22, characterized in that, In the step of providing the glue-filling device, the glue-filling platform is rectangular in shape, and there are 5 thickness detection components directly above any one of the glue-filling platforms. The projection pattern of the detection probe of one of the thickness detection components is located in the central area of ​​the glue-filling platform, and the projection patterns of the detection probes of the other four thickness detection components correspond one-to-one with the top corners of the glue-filling platform, and are respectively located in the area close to each top corner of the glue-filling platform. In the step of obtaining the thickness of the chip product area, the thickness of a position in the central region of the chip product area is obtained, as well as the thickness of positions near each corner of the chip product area is obtained.

24. The thickness detection method as described in claim 17, characterized in that, In the step of providing the glue-applying device, the glue-applying device further includes a cooling mechanism installed above the glue-applying platform and fixedly connected to the pressing assembly; In the step of cooling the encapsulated structure after molding, the thickness of the chip product area is detected by the thickness detection component.

25. The thickness detection method according to any one of claims 17 to 24, characterized in that, In the step of providing the glue-punching device, the glue-punching device further includes a controller coupled to the thickness detection component; In the step of obtaining the thickness of the chip product area, the controller automatically detects the thickness of the chip product area of ​​the package structure carried on the die-casting platform at fixed time intervals to obtain the thickness of the chip product area of ​​each package structure carried on the die-casting platform.

26. The thickness detection method as described in claim 25, characterized in that, In the step of providing the adhesive applicator, the adhesive applicator further includes an indicator component coupled to the controller, the indicator component being used to issue an alarm message when the thickness of the chip product area exceeds a preset value; After obtaining the thickness of the chip product area, the thickness detection method further includes: if the thickness of the chip product area of ​​any of the packaging structures exceeds a preset value, then the controller causes the indicating component to issue an alarm message.

Images