Package structure
By using a flexible carrier and flexible encapsulation layer in the packaging module design of flexible electronic devices, the problem of damage to flexible electronic devices after stretching is solved, and the stability of the conductive layer and the reliability of component connection are achieved during stretching.
CN122028772APending Publication Date: 2026-05-12ADVANCED SEMICON ENG INC
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Patent Information
- Application Number
- CN202510308537.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-11-08
- Filing Date
- 2025-03-17
- Publication Date
- 2026-05-12
AI Technical Summary
Technical Problem
The carrier of flexible electronic devices is easily damaged beyond repair after being stretched, affecting its service life and reliability.
Method used
The encapsulation module design incorporates a flexible carrier and a flexible encapsulation layer. The bent portion has high resilience and can adjust the relative position of the components when stretched, avoiding damage to the conductive layer and increased impedance.
Benefits of technology
During the stretching process, the flexibility of the packaging structure is enhanced, the impedance of the conductive layer remains stable, the component connection is not damaged, and the durability and reliability of electronic devices are improved.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention provides a package structure and a method of manufacturing the package structure. The package structure includes a curved flexible carrier, a first component, and a flexible encapsulation layer. The first component is disposed on the curved flexible carrier. The flexible encapsulation layer encapsulates the first component and the curved flexible carrier.
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