Package structure

Abstract

The invention provides a package structure and a method of manufacturing the package structure. The package structure includes a curved flexible carrier, a first component, and a flexible encapsulation layer. The first component is disposed on the curved flexible carrier. The flexible encapsulation layer encapsulates the first component and the curved flexible carrier.

Description

Technical Field

[0001] This disclosure relates to a packaging module and a method for manufacturing the packaging module. Background Technology

[0002] Flexible electronic devices are widely used in wearable devices. However, the properties of the carrier of these electronic devices may suffer irreparable damage after being stretched. Summary of the Invention

[0003] In some embodiments, an encapsulation module includes a flexible carrier, a first component, and a flexible encapsulation layer. The first component is disposed on the flexible carrier. The flexible encapsulation layer encapsulates the first component and the flexible carrier.

[0004] In some embodiments, an encapsulation module includes a flexible carrier, a first component, and a flexible encapsulation layer. The flexible carrier includes a first flat portion and a plurality of curved portions. The first component is disposed on the first flat portion. The flexible encapsulation layer encapsulates the flexible carrier and the first component. The first component is located between the curved portions.

[0005] In some embodiments, an encapsulation module includes a flexible carrier, a first component, a second component, and a flexible encapsulation layer. The flexible carrier includes a first flat portion and a second flat portion spaced apart from the first flat portion. The first component is disposed on the first flat portion. The second component is disposed on the second flat portion. The flexible encapsulation layer encapsulates the flexible carrier, the first component, and the second component. The relative position of the first component is configured to be adjustable relative to the second component during deformation of the encapsulation structure. Attached Figure Description

[0006] Some aspects of embodiments of this disclosure will be readily understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that the various structures may not be drawn to scale, and the dimensions of the various structures may be arbitrarily increased or decreased for clarity of explanation.

[0007] Figure 1 This is a cross-sectional view of a packaging structure according to some embodiments of the present disclosure.

[0008] Figure 1A This is a cross-sectional view of an encapsulation structure subjected to deformation force according to some embodiments of the present disclosure.

[0009] Figure 1B An enlarged cross-sectional view of a bent portion of an encapsulation structure subjected to deformation force according to some embodiments of the present disclosure.

[0010] Figure 2This is a cross-sectional view of a packaging structure according to some embodiments of the present disclosure.

[0011] Figure 3A , 3B The 3C document illustrates one or more stages of an example of a method for manufacturing a package structure according to some embodiments of the present disclosure.

[0012] Figure 4 This is a cross-sectional view of a packaging structure according to some embodiments of the present disclosure.

[0013] Figure 5 This is a cross-sectional view of a packaging structure according to some embodiments of the present disclosure.

[0014] Figure 6 This is a cross-sectional view of a packaging structure according to some embodiments of the present disclosure.

[0015] Figure 7 This is a cross-sectional view of a packaging structure according to some embodiments of the present disclosure.

[0016] Figure 8 This is a cross-sectional view of an encapsulation structure subjected to deformation force according to some embodiments of the present disclosure.

[0017] Figure 8A An enlarged cross-sectional view of a bent portion of an encapsulation structure subjected to deformation force according to some embodiments of the present disclosure.

[0018] Figure 9 This is a cross-sectional view of a packaging structure according to some embodiments of the present disclosure.

[0019] Figure 10 This is a cross-sectional view of a packaging structure according to some embodiments of the present disclosure.

[0020] Figure 11 This is a top view of a packaging structure according to some embodiments of the present disclosure.

[0021] Figure 12 This is a cross-sectional view of an encapsulation structure subjected to deformation force according to some embodiments of the present disclosure.

[0022] Figure 12A An enlarged cross-sectional view of a bent portion of an encapsulation structure subjected to deformation force according to some embodiments of the present disclosure.

[0023] Figure 13 This is a cross-sectional view of a packaging structure according to some embodiments of the present disclosure.

[0024] Figure 14 This is a top view of a packaging structure according to some embodiments of the present disclosure. Detailed Implementation

[0025] Common reference numerals are used throughout the drawings and detailed description to indicate the same or similar components. Embodiments of this disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0026] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of components and arrangements are described below to explain certain aspects of this disclosure. Of course, these components and arrangements are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature above or on a second feature may include embodiments in which the first and second features are formed or disposed in direct contact, and may also include embodiments in which additional features may be formed or disposed between the first and second features such that the first and second features do not need to be in direct contact. Furthermore, reference numerals and / or letters may be repeated in various instances of this disclosure. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0027] This disclosure relates to an encapsulation structure comprising a flexible carrier having a plurality of curved portions and a plurality of flat portions prior to encapsulation by a flexible encapsulator (e.g., silicone rubber). The curved portions can be formed by intentionally bending the initially flat portions under heat treatment. Because the redistribution layer (e.g., an electroplated metal layer) in the flexible carrier has high resilience to bending, the thermal bending process does not substantially affect the impedance of the redistribution layer (e.g., the electroplated metal layer) in the flexible carrier.

[0028] The flexible carrier may comprise an electroplated metal layer with relatively poor resilience to lateral tensile stress. During the application of lateral tensile stress to the package structure (e.g., a wristband) (e.g., stretching when worn by a user), deformation of the curved portions of the flexible carrier prevents the electroplated metal layer from being stretched laterally. In some embodiments, the curvature of the curved portions may be adjustable in response to lateral tensile stress. This allows the package structure to be stretched without damaging the electroplated metal layer or significantly increasing its impedance. When stretched, the overall flexibility of the package structure may be increased via the deformation of the curved portions. At least one component (semiconductor die, system-in-package (SiP), sensor, or passive component) is disposed at multiple flat portions of the flexible carrier to prevent damage to the connections (e.g., solder balls, solder paste) between the component and the conductive layers in the flexible carrier.

[0029] Figure 1 This is a cross-sectional view of a packaging structure according to some embodiments of the present disclosure. The packaging structure 100 may include a carrier 10, an encapsulation layer 11, a component 14, and a component 15.

[0030] The carrier (or flexible carrier) 10 may be or contain, for example, one or more printed circuit boards, such as paper-based copper foil laminates, composite copper foil laminates, polymer-impregnated glass fiber-based copper foil laminates, etc. In some arrangements, the carrier 10 contains a flexible material. The profile or shape of the carrier 10 may be configured to be adjustable or flexible. For example, the profile of the carrier 10 may be flexible, flexible, bendable, and / or torsionable. For example, the carrier 10 may be adjusted or bent to have a shape that conforms to any structure of an electrical installation (e.g., straight / flat or non-straight / non-flat structure). In some arrangements, the carrier 10 may contain a flexible printed circuit (FPC). The carrier 10 may have a Young's modulus greater than about 1 gigapascal (GPa) or an elastic deformation of less than about 15%.

[0031] Substrate 10 may include interconnect structures, such as a redistribution layer (RDL) and / or grounding elements. The RDL of carrier 10 may include conductive layers 10c1 and 10c2. Carrier 10 may include a dielectric layer (or insulating layer) enclosing or surrounding conductive layers 10c1 and 10c2. In a cross-sectional view, conductive layer 10c1 may have a curved profile. In a cross-sectional view, conductive layer 10c2 may have a generally flat profile. Conductive layer 10c1 may be connected to conductive layer 10c2.

[0032] In some embodiments, conductive layers 10c1 and 10c2 may be formed of metal or metal alloy. Conductive layers 10c1 and 10c2 may comprise metals such as copper, gold, silver, aluminum, titanium, tantalum, etc. Conductive layers 10c1 and 10c2 may comprise electroplated metal layers. Conductive layer 10c1 can be formed by intentionally bending an initially flat conductive layer under heat treatment. Because conductive layer 10c1 (e.g., electroplated metal layer) has high resilience to bending, the hot bending process will not substantially affect the impedance of conductive layer 10c1. The impedances of conductive layer 10c1 and the second conductive layer 10c2 may be substantially the same.

[0033] like Figure 1As shown, the cross-section of the carrier 10 has a wavy or "S" shape. The carrier 10 may have a substantially uniform thickness T10. The carrier 10 may include a plurality of curved portions (or bendable portions) 101, 103, 105, and 107. The carrier 10 may include a plurality of flat portions 102, 104, and 106. Each of the curved portions 101, 103, 105, and 107 and the flat portions 102, 104, and 106 may have a thickness T10. The flat portion 102 may be connected between the curved portions 101 and 103. The flat portion 104 may be connected between the curved portions 103 and 105. The flat portion 106 may be connected between the curved portions 105 and 107. The curved portions 101, 103, 105, and 107 may include a conductive layer 10c1, and the flat portions 102, 104, and 106 may include a conductive layer 10c2. The curved portion 103 can be connected between the flat portions 102 and 104. The curved portion 105 can be connected between the flat portions 104 and 106.

[0034] In some embodiments, the flat portions 102, 104, and 106 may be spaced apart from each other. The curved portions 101, 103, 105, and 107 may be spaced apart from each other.

[0035] In a cross-sectional view, the bent portions 101, 103, 105, and 107 may have a bent profile. The bent portions 101, 103, 105, and 107 can be formed by bending a flat portion of the package structure (see [reference]). Figure 3C The carrier 10 may be bent before being encapsulated by the encapsulation layer 11. The carrier 10 may be a bent flexible carrier (or a pre-bent flexible carrier, which is due to its bending before encapsulation). The flat portions 102, 104, and 106 may have a generally flat profile. The bent portions 101, 103, 105, and 107 may be more curved (or bent) than the flat portions 102, 104, and 106. Each of the bent portions 101, 103, 105, and 107 may have a greater (or higher) curvature than the flat portions 102, 104, and 106. In this disclosure, the “curvature” of the bent portion is defined by a close circle (e.g., Figure 1B As shown in the diagram, the observable circle is defined as the circle of the curve at the closest point. "Curvature" is the reciprocal of the radius of the observable circle.

[0036] The encapsulation structure 100 may further include a plurality of conductive pads 13p1, 13p2, 13p3, and 13p4. Conductive pads 13p1 and 13p2 may be embedded in a flat portion 102 of the carrier 10. Conductive pads 13p1 and 13p2 may be connected to a conductive layer 10c2 in the flat portion 102. Conductive pads 13p3 and 13p4 may be embedded in a flat portion 106. Conductive pads 13p3 and 13p4 may be connected to a conductive layer 10c2 in the flat portion 106.

[0037] The carrier 10 may have a first surface 10s1 and a second surface 10s2 opposite to the first surface 10s1. Conductive pads 13p1, 13p2, 13p3 and 13p4 may be disposed on the first surface 10s1. The curved portions 101, 103, 105 and 107 and the flat portions 102, 104 and 106 may include a portion of the first surface 10s1 and a portion of the second surface 10s2.

[0038] Component 14 may be disposed on a first surface 10s1 of carrier 10. Component 14 may be disposed on a flat portion 102 of carrier 10. Component 14 may be disposed between curved portions 101 and 103. Component 14 may be connected to conductive pads 13p1 and 13p2. The number of conductive pads for the connection between component 14 and carrier 10 may be greater than two. In some embodiments, carrier 10 may include a plurality of pins connected to component 14. In some embodiments, component 14 may be connected to conductive pads 13p1 and 13p2 via a plurality of connection elements, such as solder balls, controlled collapse chip connection (C4) bumps, ball grid array (BGA), or pad grid array (LGA).

[0039] Component 15 may be disposed on a first surface 10s1 of carrier 10. Component 15 may be disposed on a flat portion 106 of carrier 10. Component 15 may be disposed between curved portions 105 and 107. Component 15 may be connected to conductive pads 13p3 and 13p4. The number of conductive pads for the connection between component 15 and carrier 10 may be greater than two. In some embodiments, carrier 10 may include a plurality of pins connected to component 15. In some embodiments, component 15 may be connected to conductive pads 13p3 and 13p4 via a plurality of connection elements, such as solder balls, controlled collapse chip connection (C4) bumps, ball grid array (BGA), or pad grid array (LGA).

[0040] For example, components 14 and 15 may be relatively rigid compared to carrier 10. In some embodiments, components 14 and 15 may include, for example, a central processing unit (CPU), a microprocessor unit (MPU), a graphics processing unit (GPU), a microcontroller unit (MCU), a neural network processing unit (NPU), an application-specific integrated circuit (ASIC), a photonic die, a field-programmable gate array (FPGA), or another type of integrated circuit. In some embodiments, components 14 and 15 may include one or more processing elements and one or more memory elements electrically connected to the processing elements. In some embodiments, the processing elements may be CPU chiplets, MCU chiplets, GPU chiplets, ASIC chiplets, etc. The processing elements and memory elements may be derived from or derived from a single-chip processing unit (e.g., CPU, MPU, GPU, MCU, ASIC, etc.). In some embodiments, components 14 and 15 may be memory units (or data storage units). Components 14 and 15 may include memory. Components 14 and 15 may include dynamic random access memory (DRAM), static random access memory (SRAM), magnetoresistive random access memory (MRAM), flash memory, high bandwidth memory (HBM), or another suitable memory.

[0041] In some embodiments, components 14 and 15 may include a system-in-package (SiP), a photonic module, and / or a fan-out chip-on-a-substrate (FoCoS). In some embodiments, components 14 and 15 may include: passive components, such as resistors; or active components, such as amplifiers.

[0042] An encapsulation layer (or flexible encapsulation layer) 11 may encapsulate the carrier 10 and components 14 and 15. The encapsulation layer 11 may be transparent or opaque. In this disclosure, for ease of explanation of the relationship and structure of the encapsulated elements, the carrier 10 and components 14 and 15 may be viewed in cross-sectional and top views.

[0043] Encapsulation layer 11 may be flexible. For example, the profile of encapsulation layer 11 may be bendable, torsionable, and / or stretchable. Encapsulation layer 11 may contain flexible, soft, or supple materials. Encapsulation layer 11 may contain, but is not limited to, thermosetting or thermoplastic polymers. Carrier 10 may contain, but is not limited to, silicone rubber. Encapsulation layer 11 may contain thermoplastic polyurethane (TPU), silicone, etc. Encapsulation layer 11 may contain molding compounds. Encapsulation layer 11 may contain resins. Encapsulation layer 11 may contain homogeneous materials. Encapsulation layer 11 may be filler-free. Encapsulation layer 11 may be particle-free. Encapsulation layer 11 may have a Young's modulus in the range of about 1 megapascal (MPa) to about 100 MPa. The Young's modulus of carrier 10 may be greater than that of encapsulation layer 11. Carrier 10 is more rigid than encapsulation layer 11.

[0044] The encapsulation layer 11 may have a rectangular shape. The encapsulation layer 11 may have four sides (or outer surfaces) 111, 112, 113, and 114. The outer surface (or first surface) 111 may be opposite to the outer surface (or second surface) 112. The outer surface (or first lateral surface) 113 may be opposite to the outer surface (or second lateral surface 114). The outer surfaces 111 and 112 may extend in a direction generally perpendicular to the outer surfaces 113 and 114 (e.g., the X direction).

[0045] The curved portions 101, 103, 105, and 107 may each include a top portion 101t, 103t, 105t, and 107t, respectively. Top portions 101t and 105t may face side 111. Top portions 103t and 107t may face side 112. The top portion 103t of the curved portion 103 may be spaced apart from side 111 by a first distance D11. The top portion 103t of the curved portion 103 may be spaced apart from side 112 by a second distance D12 different from the first distance D11. The first distance D11 may be greater than the second distance D12. The top portion 101t of the curved portion 101 may be spaced apart from sides 111 and 112 by different distances. The top portion 105t of the curved portion 105 may be spaced apart from sides 111 and 112 by different distances. The top portion 107t of the curved portion 107 may be spaced apart from sides 111 and 112 by different distances. The top portion 105t may be closer to the side 111 than the top portion 101t. The top portion 103t may be closer to the side 111 than the top portion 107t.

[0046] The flat portion 102 may extend in a direction V1 that is not parallel to the four outer sides 111, 112, 113, and 114. Direction V1 may not be perpendicular to the four outer sides 111, 112, 113, and 114. Components 14 and 15 may each have a long side extending in direction V1. Component 14 may have a first surface 14s1 facing the flat portion 102 and inclined towards the four outer sides 111, 112, 113, and 114. Component 15 may have a first surface 15s1 facing the flat portion 106 and inclined towards the four outer sides 111, 112, 113, and 114.

[0047] Figure 1A This is a cross-sectional view of an encapsulation structure (e.g., encapsulation structure 100) subjected to a deformation force F1 according to some embodiments of the present disclosure. The encapsulation structure 100 (wearable device, such as a wristband, earphones, headband, necklace, etc.) can be worn by a user. In order to wear the encapsulation structure 100, the user can temporarily or continuously apply a deformation force F1 to stretch the encapsulation structure 100.

[0048] like Figure 1AAs shown, a deformation force F1 can be applied to the encapsulation structure 100 to adjust the contour of the encapsulation structure 100. The direction of the deformation force F1 can be parallel to the side 111 of the encapsulation layer 11 (or the long side of the encapsulation structure 100). The deformation force F1 can generate lateral tensile stress on the encapsulation structure 100.

[0049] The encapsulation structure 100 in the "initial state" (without applied deformation force F1) is depicted with dashed lines. The encapsulation structure 100 in the "stretched state" (under deformation force F1) is depicted with solid lines.

[0050] A deformation force F1 can be applied to the encapsulation structure 100 to increase the length of the encapsulation layer 11 and decrease its thickness. In the initial state of the encapsulation structure 100, the encapsulation layer 11 may have a length L11 and a thickness T11. In the stretched state of the encapsulation structure 100, the encapsulation layer 11 may have a length L21 and a thickness T11. The length L21 may be greater than the length L11. The thickness T11 may be greater than the thickness T21.

[0051] The relative position of component 14 is configured to be adjustable relative to component 15 during deformation of encapsulation structure 100. Deformation of encapsulation structure 100 may include deformation of encapsulation layer 11. A deformation force F1 may be applied to encapsulation structure 100 to adjust the contours of bent portions 101, 103, 105, and 107. Bent portions 101, 103, 105, and 107 can deform in response to deformation force F1. The curvature of bent portions 101, 103, 105, and 107 can be changed, and details will be... Figure 1B The deformation of the bent portions 101, 103, 105, and 107 can induce an adjustment in the relative position of component 14. The relative position P11 of component 14 to component 15 in the initial state of the encapsulation structure 100 is different from the relative position P21 of component 14 to component 15 in the stretched state of the encapsulation structure 100.

[0052] In some embodiments, the relative positions P11 and P21 of component 14 relative to component 15 may be referred to as vectors. The relative position P11 may have a component (or distance) X11 in the X direction and a component Y11 (or distance) in the Y direction. The X direction may be perpendicular to the Y direction. The relative position P21 may have a component (or distance) X21 in the X direction and a component (or distance) Y21 in the Y direction. Component X21 may be greater than component X11. That is, the distance between components 14 and 15 in the X direction may increase. Component Y21 may be less than component Y11. That is, the distance between components 14 and 15 in the Y direction may decrease. The directions of components X11 and X21 may be the same (e.g., -X). The directions of components X11 and X21 may be the same (e.g., -Y). In some embodiments, the direction of component Y11 may be opposite to the direction of component Y21. In the initial state of the encapsulation structure 100, component 14 may be higher than component 15, while in the stretched state of the encapsulation structure 100, component 14 may be lower than component 15.

[0053] In some embodiments, the relative positions P11 (and P21) may have a component in the Z direction. The deformation force F1 may change the magnitude and / or direction of the component in the Z direction.

[0054] Figure 1B An enlarged cross-sectional view of a bent portion (e.g., bent portion 103) of an encapsulation structure (e.g., encapsulation structure 100) subjected to a deformation force F1 according to some embodiments of the present disclosure. Figure 1B Can be Figure 1A An enlarged cross-sectional view of box B1 in the image.

[0055] The bent portions 101, 103, 105, and 107 can be configured to change when a deformation force F1 is applied to the encapsulation structure 100. The curvature of the bent portion 103 can be configured to change when a deformation force is applied to the encapsulation structure 100. Adjusting the profile of the bent portion 103 may include changing the curvature of the bent portion 103. The bent portion in the initial state of the encapsulation structure 100 is designated as 103, while the bent portion in the stretched state of the encapsulation structure 100 is designated as 103'.

[0056] In this disclosure, the “curvature” of a curved portion is defined by an observable circle, which is the circle that most closely approximates the curve at a point. The “curvature” is the reciprocal of the radius of the observable circle.

[0057] The curvature of the curved portion 103 can be defined by an exact circle with radius R1. The curvature of the curved portion 103' can be defined by an exact circle with radius R2. The curvatures of the curved portions 103 and 103' are the reciprocals of radii R1 and R2, respectively. Radius R2 is greater than radius R1, and therefore, the curvature of the curved portion 103 (103') decreases.

[0058] The curved portion 103 has a projected region A11 on side 112 of the encapsulation layer 11. The curved portion 103' has a projected region A21 on side 112 of the encapsulation layer 11. The projected region A21 is larger than the projected region A11. The curved portion 103 expands laterally (becoming the curved portion 103') by changing its curvature during the application of the deformation force F1. The deformation of the other curved portions 101, 105, and 107 can also be applied. Figure 1B The description.

[0059] The conductive layers 10c1 and 10c2 (e.g., electroplated metal layers) may have relatively poor resilience to lateral tensile stress. During the application of lateral tensile stress to the package structure 100 (e.g., when stretched by a user wearing it), the bent portions 101, 103, 105, and 107 of the carrier 10 may adjust in response to the lateral tensile stress. The bent portions 101, 103, 105, and 107 may be laterally extended by adjusting (or changing) their curvature. The flexibility of the package structure 100 may be improved by the deformation of the bent portions 101, 103, 105, and 107. This allows the package structure 100 to be stretched without damaging the conductive layers 10c1 and 10c2 or significantly increasing their impedance.

[0060] Furthermore, little or no stress is applied to the flat portions 102, 104, and 106, reducing the risk of delamination between the carrier 10 and components 14 (and 15). The connectors (e.g., solder balls, solder paste) between component 14 (or 15) and carrier 10 are not damaged. Electrical connections between carrier 10 and components 14 and 15 are maintained.

[0061] Figure 2 This is a cross-sectional view of a package structure 100A according to some embodiments of the present disclosure. Figure 2 A portion of the 100A package structure is similar to Figure 1 The package structure 100 is described above. In other words, the package structure 100A can be multiple package structures 100 seamlessly connected in series. Therefore, some detailed descriptions refer to the corresponding preceding paragraphs and are not repeated below for the sake of brevity, with the following differences.

[0062] The encapsulation structure 100A may have a ring structure. The encapsulation layer 11 may have a ring shape. The first surface 111 may be the outer surface of the ring structure, and the second surface 112 opposite to the first surface may be the inner surface of the ring structure. The first surface 111 and the second surface 112 may be covered by the same material (i.e., the flexible encapsulation layer 11). The encapsulation structure 100A (wearable device, such as a wristband, earphone, headband, necklace, etc.) may be worn by a user. In order to wear the encapsulation structure 100A, the user may temporarily or continuously apply a deformation force to stretch the encapsulation structure 100A. The deformation of the encapsulation structure 100A may be similar to that in... Figure 1A and 1B The variations described in the relevant text. In some embodiments, a portion of the package structure 100A may be similar to... Figure 1A and 1B The deformation method is shown in the text. Therefore, some detailed descriptions refer to the corresponding preceding paragraphs and will not be repeated below for the sake of brevity.

[0063] In some embodiments, the length of the inner surface of the ring structure (e.g., the second surface 112) varies in response to the deformation of the encapsulation layer 11.

[0064] Compared to the second surface 112, the curved portions 101 and 105 of the package structure 100A can be closer to the first surface 111. Compared to the second surface 112, the curved portions 103 and 107 of the package structure 100A can be further away from the first surface 111. The curvature of the curved portions 101 and 105 can be greater than that of the curved portions 103 and 107 because when the ring structure of the package structure 100A is manufactured, the curved portions 101 and 105 are stretched, while the curved portions 103 and 107 are compressed.

[0065] In the radial direction, the distance D21 between the curved portion 101 (or 105) and the first surface 111 may be less than the distance D22 between the component 14 (or 15) and the first surface 111. The curved portion 101 (or 105) between the plurality of flat portions may be closer to the first surface 111 than the component 14 (or 15).

[0066] Figure 3A , 3B The 3C document illustrates one or more stages of an example of a method for manufacturing a package structure according to some embodiments of the present disclosure.

[0067] like Figure 3A As shown, a carrier 10 is provided. In a cross-sectional view, the carrier 10 may have a generally flat profile. Components 14 and 15 may be mounted to the carrier 10. Component 14 may be connected to the carrier 10 via a plurality of conductive pads 13p1 and 13p2. Component 15 may be connected to the carrier 10 via a plurality of conductive pads 13p3 and 13p4.

[0068] like Figure 3B As shown, heat treatment can be applied to the carrier 10. The carrier 10 can be more flexible than when it is placed at room temperature.

[0069] like Figure 3C As shown, the carrier 10 can be fixed to a bending tool (not shown) to intentionally bend a portion of the carrier 10 into multiple bent sections 101, 103, 105, and 107. Another portion of the support components 14 and 15 of the carrier 10 will remain as flat sections 102, 104, and 106. Subsequently, an encapsulation layer can be formed to encapsulate the carrier 10 and components 14 and 15 to form a shape as shown... Figure 1 The packaging structure 100 shown in the figure.

[0070] Figure 4 This is a cross-sectional view of a packaging structure 200 according to some embodiments of the present disclosure. Figure 4 The packaging structure 200 is similar to Figure 1 and 2 The encapsulation structure 100 is described in the text. Therefore, some detailed descriptions refer to the corresponding preceding paragraphs and are not repeated below for the sake of brevity, with the following differences.

[0071] The package structure 200 may further include components (or input / output (I / O) units) 161 and 162 disposed on a first surface 10s1 of the carrier 10. I / O units 161 and 162 may be encapsulated by an encapsulation layer 11. I / O units 161 and 162 may be exposed through sides 111 of the encapsulation layer 11.

[0072] I / O units 161 and 162 can be electrically connected to components 14 and 15 via carrier 10. I / O units 161 and 162 can be electrically connected to external devices.

[0073] The carrier 10 may include a flat portion 108 connected to the curved portion 101 and a flat portion 110 connected to the curved portion 107. An I / O unit 161 may be disposed on the flat portion 108. An I / O unit 162 may be disposed on the flat portion 110.

[0074] Figure 5 This is a cross-sectional view of a packaging structure 210 according to some embodiments of the present disclosure. Figure 5 The packaging structure 210 in the middle is similar to Figure 4 The encapsulation structure in 200. Therefore, some detailed descriptions may refer to the corresponding preceding paragraphs, and for the sake of brevity, they will not be repeated below, with the following differences.

[0075] The encapsulation structure 210 further includes a reinforcement 17 disposed on a second surface 10s2 of the carrier 10. The reinforcement 17 may be encapsulated by an encapsulation layer 11. The reinforcement 17 may be disposed on the flat portions 108 and 110. The reinforcement 17 may be configured to reduce deformation of the flat portions 108 and 110. The reinforcement 17 may be disposed below I / O units 161 and 162. The projection of the reinforcement 17 onto the carrier 10 may overlap with the projection of the I / O unit 161 (or 162) onto the carrier 10. The reinforcement 17 may be configured to prevent delamination between the I / O units 161 and 162 and the carrier 10. In some embodiments, the reinforcement may be disposed on the flat portions 102 or 106, the reinforcement being configured to reduce deformation of the flat portions and prevent delamination between the components 14 or 15 and the carrier 10.

[0076] Figure 6 This is a cross-sectional view of a packaging structure 220 according to some embodiments of the present disclosure. Figure 6 The packaging structure 220 in the middle is similar to Figure 4 The encapsulation structure in 200. Therefore, some detailed descriptions may refer to the corresponding preceding paragraphs, and for the sake of brevity, they will not be repeated below, with the following differences.

[0077] The encapsulation structure 220 may further include a component 24 disposed on the flat portion 102. Component 24 may be disposed on a second surface 10s2 of the carrier 10. Component 24 may be disposed on a side of the flat portion 102 (e.g., the second surface 10s2), opposite to the other side on which component 14 is disposed (e.g., the first surface 10s1). Component 24 may be electrically connected to the carrier 10. Component 24 may be encapsulated by an encapsulation layer 11. Component 24 may have a surface 24s1 facing the flat portion 102. Surfaces 24s1 of component 24 and surface 15s1 of component 15 face opposite directions. Component 24 may be located between curved portions 101 and 103.

[0078] The encapsulation structure 220 may further include a component 25 disposed on the flat portion 104. The component 25 may be disposed on a first surface 10s1 of the carrier 10. The component 25 may be electrically connected to the carrier 10. The component 25 may be encapsulated by an encapsulation layer 11.

[0079] Figure 7 This is a cross-sectional view of a packaging structure 300 according to some embodiments of the present disclosure. Figure 7 The packaging structure 300 in the middle is similar to Figure 1 and 2 The encapsulation structure 100 is described in the text. Therefore, some detailed descriptions refer to the corresponding preceding paragraphs and are not repeated below for the sake of brevity, with the following differences.

[0080] The encapsulation structure 300 may include a carrier 20 instead of a carrier 10. The carrier 20 may have a material similar to that of the carrier 10 in the encapsulation structure 100. The carrier 20 may be encapsulated by an encapsulation layer 11. The carrier 20 may include a curved portion (or flexible portion) 201 and a plurality of flat portions 202 and 204. The curved portion 201 may be connected between the flat portions 202 and 204. The flat portions 202 and 204 may extend in directions parallel to the sides 111 and 112 of the encapsulation layer 11. Component 14 may be disposed on the flat portion 202, and component 15 may be disposed on the flat portion 204.

[0081] In a cross-sectional view, the bent portion 201 may have an "S-shaped" profile. The bent portion 201 may have a bent profile. The bent portion 201 can be formed by bending a flat portion of the package structure. The bending direction of the bent portion 201 may differ from the bending directions of the bent portions 101, 103, 105, and 107, and therefore, the package structure 300 may have a smaller thickness than the package structure 200. The flat portions 202 and 204 may have generally flat profiles. The bent portion 201 may be more curved (or bent) than the flat portions 202 and 204. The bent portion 201 may have a greater (or higher) curvature than the flat portions 202 and 204.

[0082] Substrate 20 may include interconnect structures, such as a redistribution layer (RDL) and / or grounding elements. The RDL of carrier 20 may include conductive layers 20c1 and 20c2. Carrier 20 may include a dielectric layer (or insulating layer) enclosing or surrounding conductive layers 20c1 and 20c2. In a cross-sectional view, conductive layer 20c1 may have a curved profile. In a cross-sectional view, conductive layer 20c2 may have a generally flat profile. Conductive layer 20c1 may be connected to conductive layer 20c2.

[0083] In some embodiments, conductive layers 20c1 and 20c2 may be formed of metal or metal alloy. Conductive layers 20c1 and 20c2 may comprise metals such as copper, gold, silver, aluminum, titanium, tantalum, etc. Conductive layers 20c1 and 20c2 may comprise electroplated metal layers. Conductive layer 20c1 can be formed by intentionally bending an initially flat conductive layer under heat treatment. Because conductive layer 20c1 (e.g., electroplated metal layer) has high resilience to bending, the hot bending process will not substantially affect the impedance of conductive layer 20c1. The impedances of conductive layer 20c1 and the second conductive layer 20c2 may be substantially the same.

[0084] Figure 8This is a cross-sectional view of an encapsulation structure 300 subjected to a deformation force F2 according to some embodiments of the present disclosure. The encapsulation structure 200 (wearable device, such as a wristband, earphone, headband, necklace, etc.) can be worn by a user. In order to wear the encapsulation structure 300, the user can temporarily or continuously apply a deformation force F2 to stretch the encapsulation structure 300.

[0085] like Figure 8 As shown, a deformation force F2 can be applied to the encapsulation structure 300 to adjust its contour. The direction of the deformation force F2 can be parallel to the side 111 of the encapsulation layer 11 (or the long side of the encapsulation structure 300). The deformation force F2 can generate lateral tensile stress on the encapsulation structure 300.

[0086] The encapsulation structure 300 in its "initial state" (without applied deformation force F2) is depicted with dashed lines. The encapsulation structure 300 in its "stretched state" (under deformation force F2) is depicted with solid lines.

[0087] The deformation force F2 can be applied to the encapsulation structure 300 to increase the length of the encapsulation layer 11 and reduce its thickness.

[0088] The relative position of component 14 is configured to be adjustable relative to component 15 during deformation of the encapsulation structure 300. A deformation force F2 can be applied to the encapsulation structure 300 to adjust the profile of the bent portion 201. The bent portion 201 can deform in response to the deformation force F2. The curvature of the bent portion 201 can be changed, and details will be... Figure 8A The deformation of the bent portion 201 can induce an adjustment in the relative position of component 14. The relative position P31 of component 14 to component 15 in the initial state of the encapsulation structure 300 is different from the relative position P41 of component 14 to component 15 in the stretched state of the encapsulation structure 300.

[0089] In some embodiments, the relative positions P31 and P41 of component 14 relative to component 15 may be referred to as vectors. The relative position P31 may have a component (or distance) X31 in the X direction and a component Y31 (or distance) in the Y direction. The X direction may be perpendicular to the Y direction. The relative position P41 may have a component (or distance) X41 in the X direction and a component (or distance) Y41 in the Y direction. Component X41 may be greater than component X31. That is, the distance between components 14 and 15 in the X direction may increase. Component Y41 may be less than component Y31. That is, the distance between components 14 and 15 in the Y direction may decrease. The directions of components X31 and X41 may be the same (e.g., -X). The directions of components Y31 and Y41 may be the same (e.g., -Y).

[0090] In some embodiments, the relative position P31 (or P41) may have a component in the Z direction. The deformation force F1 may change the magnitude and / or direction of the component in the Z direction.

[0091] Figure 8A An enlarged cross-sectional view of a bent portion (e.g., bent portion 201) of an encapsulation structure (e.g., encapsulation structure 300) subjected to a deformation force F2 according to some embodiments of the present disclosure. Figure 8A Can be Figure 8 An enlarged cross-sectional view of box B2 in the image.

[0092] The bent portion 201 can be configured to change when a deformation force F2 is applied to the encapsulation structure 300. The curvature of the bent portion 201 can be configured to change when a deformation force is applied to the encapsulation structure 300. Adjusting the profile of the bent portion 201 may include changing the curvature of the bent portion 201. The bent portion in the initial state of the encapsulation structure 300 is denoted as 201, while the bent portion in the stretched state of the encapsulation structure 300 is denoted as 201'.

[0093] The curvature of the curved portion 201 can be defined by an osculating circle with radius R3. The curvature of the curved portion 201' can be defined by an osculating circle with radius R4. The curvatures of the curved portions 201 and 201' are the reciprocals of radii R3 and R4, respectively. Radius R4 is smaller than radius R3, and therefore, the curvature of the curved portion 201 (201') increases.

[0094] The curved portion 201 has a projected region A31 on side 112 of the encapsulation layer 11. The curved portion 201' has a projected region A41 on side 112 of the encapsulation layer 11. The projected region A41 is larger than the projected region A31. The curved portion 201 expands laterally (becoming the curved portion 201') by changing its curvature during the application of the deformation force F2.

[0095] The conductive layers 20c1 and 20c2 (e.g., electroplated metal layers) may have relatively poor resilience to lateral tensile stress. During the application of lateral tensile stress to the package structure 300 (e.g., stretching when worn by a user), the bent portion 201 of the carrier 20 may be adjustable in response to the lateral tensile stress. The bent portion 201 can be laterally extended by adjusting (or changing) its curvature. The flexibility of the package structure 300 can be improved by the deformation of the bent portion 201. This allows the package structure 300 to be stretched without damaging the conductive layers 20c1 and 20c2 or significantly increasing its impedance.

[0096] Furthermore, little or no stress is applied to the flat portions 202 and 204, reducing the risk of delamination between the carrier 20 and components 14 (and 15). The connections (e.g., solder balls, solder paste) between component 14 (or 15) and carrier 10 are not damaged. Electrical connection between carrier 20 and components 14 and 15 is maintained.

[0097] Figure 9 This is a cross-sectional view of a packaging structure according to some embodiments of the present disclosure. Figure 9 The packaging structure 310 in the middle is similar to Figure 7 , 8 And the package structure 300 in 8A. Therefore, some detailed descriptions refer to the corresponding preceding paragraphs, and for the sake of brevity, they will not be repeated below, with the following differences.

[0098] The package structure 310 may further include a bent portion (or flexible portion) 203 and a flat portion 206. The bent portion 204 is connected to the flat portion 202. The bent portion 204 may be connected between the flat portion 202 and the flat portion 206. The package structure 310 may further include a component 24 disposed on the flat portion 202 and a component 25 disposed on the flat portion 206.

[0099] In a cross-sectional view, the bent portion 203 may have an "S-shaped" profile. The bent portion 203 may have a bent profile. The bent portion 203 may be formed by bending a flat portion of the encapsulation structure. The flat portion 206 may have a generally flat profile. The bent portion 203 may be more curved (or bent) than the flat portions 202 and 206. The bent portion 203 may have a greater (or higher) curvature than the flat portions 202 and 206. In a cross-sectional view, the carrier 20 may have a mirror-symmetrical profile.

[0100] Figure 10 This is a cross-sectional view of a packaging structure 400 according to some embodiments of the present disclosure. Figure 10 The packaging structure 400 is similar to Figure 1 and 2 The encapsulation structure 100 is described in the text. Therefore, some detailed descriptions refer to the corresponding preceding paragraphs and are not repeated below for the sake of brevity, with the following differences.

[0101] Encapsulation structure 400 may include a carrier 30 instead of a carrier 10. The carrier 30 may have a material similar to that of the carrier 10 in encapsulation structure 100. The carrier 30 may be encapsulated by an encapsulation layer 11. The carrier 30 may include a curved portion (or flexible portion) 301 and a plurality of flat portions 302 and 304. The curved portion 301 may be connected between the flat portions 302 and 304. The flat portions 302 and 304 may extend in directions parallel to the sides 111 and 112 of the encapsulation layer 11. Encapsulation structure 400 may include a component 34 disposed on the flat portion 302 and a component 35 disposed on the flat portion 304. Components 34 and 35 may be similar to component 14, and detailed descriptions may refer to the corresponding preceding paragraphs.

[0102] In a cross-sectional view, the bent portion 301 may have a circular profile. The bent portion 301 may be formed by bending a flat portion of the package structure. The flat portions 302 and 304 may have generally flat profiles. The bent portion 301 may be more curved (or bent) than the flat portions 302 and 304. The bent portion 301 may have a greater (or higher) curvature than the flat portions 302 and 304.

[0103] Substrate 30 may include interconnect structures, such as a redistribution layer (RDL) and / or grounding elements. The RDL of carrier 30 may include conductive layers 30c1 and 30c2. Carrier 30 may include a dielectric layer (or insulating layer) enclosing or surrounding conductive layers 30c1 and 30c2. In a cross-sectional view, conductive layer 30c1 may have a curved profile. In a cross-sectional view, conductive layer 30c2 may have a generally flat profile. Conductive layer 30c1 may be connected to conductive layer 30c2.

[0104] In some embodiments, conductive layers 30c1 and 30c2 may be formed of metal or metal alloy. Conductive layers 30c1 and 30c2 may comprise metals such as copper, gold, silver, aluminum, titanium, tantalum, etc. Conductive layers 30c1 and 30c2 may comprise electroplated metal layers. Conductive layer 30c1 may be formed by intentionally bending an initially flat conductive layer under heat treatment. Because conductive layer 30c1 (e.g., electroplated metal layer) has high resilience to bending, the hot bending process will not substantially affect the impedance of conductive layer 30c1. The impedances of conductive layer 30c1 and the second conductive layer 30c2 may be substantially the same.

[0105] Figure 11 This is a top view of an encapsulation structure 400 according to some embodiments of the present disclosure. In the top view, the carrier 30 may have a Z-shaped shape. The encapsulation layer 11 may have a side 115 and a side 116 opposite to side 115. Sides 115 and 116 may be connected to sides 113 and 114. Component 34 may be closer to side 116 than side 115. Component 35 may be closer to side 115 than side 116.

[0106] Figure 12 This is a cross-sectional view of an encapsulation structure (e.g., encapsulation structure 400) subjected to a deformation force F3 according to some embodiments of the present disclosure. The encapsulation structure 400 (wearable device, such as a wristband, earphone, headband, necklace, etc.) can be worn by a user. In order to wear the encapsulation structure 400, the user can temporarily or continuously apply a deformation force F3 to stretch the encapsulation structure 400.

[0107] like Figure 12 As shown, a deformation force F3 can be applied to the package structure 400 to adjust the contour of the package structure 400. The direction of the deformation force F3 can be parallel to the side 111 of the encapsulation layer 11 (or the long side of the package structure 400). The deformation force F3 can generate lateral tensile stress on the package structure 400.

[0108] The encapsulation structure 400 in its initial state (without applied deformation force F3) is depicted with dashed lines. The encapsulation structure 400 in its stretched state (under deformation force F3) is depicted with solid lines.

[0109] The deformation force F3 can be applied to the encapsulation structure 400 to increase the length of the encapsulation layer 11 and reduce its thickness.

[0110] The relative position of component 34 is configured to be adjustable relative to component 35 during deformation of the encapsulation structure 400. A deformation force F3 can be applied to the encapsulation structure 400 to adjust the profile of the bent portion 301. The bent portion 301 can deform in response to the deformation force F3. The curvature of the bent portion 301 can be changed, and details will be... Figure 12A The deformation of the bent portion 301 can induce an adjustment in the relative position of component 34. The relative position P51 of component 34 to component 35 in the initial state of the encapsulation structure 400 is different from the relative position P61 of component 34 to component 35 in the stretched state of the encapsulation structure 400.

[0111] In some embodiments, the relative positions P51 and P61 of component 34 relative to component 35 may be referred to as vectors. The relative position P51 may have a component (or distance) X51 in the X direction or no component. The X direction may be perpendicular to the Y direction. The relative position P61 may have a component (or distance) X61 in the X direction or no component. The component X61 may be greater than the component X51. That is, the distance between components 34 and 35 in the X direction may increase. The directions of components X51 and X61 may be the same (e.g., -X).

[0112] In some embodiments, the relative position P51 (or P61) may have a component in the Z direction. The deformation force F3 may change the magnitude and / or direction of the component in the Z direction.

[0113] Figure 12A An enlarged cross-sectional view of a bent portion (e.g., bent portion 301) of an encapsulation structure (e.g., encapsulation structure 400) subjected to a deformation force F3 according to some embodiments of the present disclosure. Figure 12A Can be Figure 12 An enlarged cross-sectional view of box B3 in the image.

[0114] The bent portion 301 can be configured to change when the deformation force F3 is applied to the encapsulation structure 400. One or more curvatures of the bent portion 301 can be configured to change when the deformation force is applied to the encapsulation structure 400. Adjusting the profile of the bent portion 301 may involve changing one or more curvatures of the bent portion 301. The bent portion in the initial state of the encapsulation structure 300 is denoted as 301, while the bent portion in the stretched state of the encapsulation structure 300 is denoted as 301'.

[0115] The curvature of the curved portion 301 can be defined by an approximate circle with radius R5. The first curvature of the bottom (or top) segment of the curved portion 301' can be defined by an approximate circle with radius R6. The second curvature of the lateral segment of the curved portion 301' can be defined by an approximate circle with radius R7. The curvature of the curved portion 301 is the reciprocal of radius R5. The curved portion 301' may have multiple curvatures. Radius R6 is smaller than radius R5, and therefore, the curvature of the lateral segment of the curved portion 301 (301') increases. Radius R7 is larger than radius R5, and therefore, the curvature of the bottom (or top) segment of the curved portion 301 (301') decreases.

[0116] The curved portion 301 has a projected region A51 on side 112 of the encapsulation layer 11. The curved portion 301' has a projected region A61 on side 112 of the encapsulation layer 11. The projected region A61 is larger than the projected region A51. The curved portion 301 expands laterally (becoming the curved portion 301') by changing its curvature during the application of the deformation force F3.

[0117] The conductive layers 30c1 and 30c2 (e.g., electroplated metal layers) may have relatively poor resilience to lateral tensile stress. During the application of lateral tensile stress to the package structure 400 (e.g., stretching when worn by a user), the bent portion 301 of the carrier 30 may be adjustable in response to the lateral tensile stress. The bent portion 301 can be laterally extended by adjusting (or changing) its curvature. The flexibility of the package structure 400 can be improved by the deformation of the bent portion 301. This allows the package structure 400 to be stretched without damaging the conductive layers 30c1 and 30c2 or significantly increasing its impedance.

[0118] Furthermore, little or no stress is applied to the flat portions 302 and 304, reducing the risk of delamination between the carrier 30 and components 34 and 35. The connectors (e.g., solder balls, solder paste) between component 14 (or 15) and carrier 10 are not damaged. Electrical connection between carrier 30 and components 34 and 35 is maintained.

[0119] Figure 13 This is a cross-sectional view of a packaging structure 410 according to some embodiments of the present disclosure. Figure 13 The packaging structure 410 in the middle is similar to Figure 10 , 12 And the package structure 400 in 12A. Therefore, some detailed descriptions refer to the corresponding preceding paragraphs, and for the sake of brevity, they will not be repeated below, with the following differences.

[0120] The carrier 30 of the encapsulation structure 410 may further include a bent portion (or flexible portion) 303 connected to the bent portion 301. The profile or structure of the bent portion 303 may be similar to that of the bent portion 301. Variations of the bent portion 303 may also be adapted to... Figure 12A The description is as follows. In a cross-sectional view, the curved portion 301 and the second curved portion 303 of the carrier 30 can form a multi-circular profile between the flat portions 302 and 304 of the carrier 30. In a cross-sectional view, the curved portions 301 and 303 can together form a spring shape.

[0121] Figure 14 This is a top view of a packaging structure 410 according to some embodiments of the present disclosure. In the top view, the carrier 30 may have a multi-Z shape.

[0122] Unless otherwise specified, spatial descriptions such as “above,” “below,” “up,” “left,” “right,” “lower,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “above,” “below,” “upper,” “above,” and “below” are relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and embodiments of the structures described herein can be arranged in space in any orientation or manner, provided that the advantages of the embodiments of this disclosure are not compromised by such arrangement.

[0123] As used herein, the terms “approximately,” “generally,” “roughly,” “about,” and “approximately” are used to describe and explain minor variations. When used in conjunction with an event or situation, these terms may refer to examples where the event or situation occurred precisely or very approximately. For example, when used in conjunction with a numerical value, these terms may refer to a range of variation less than or equal to ±10% of the stated value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first value is within a range of variation less than or equal to ±10% of a second value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first value may be considered “generally” the same as or equal to the second value. For example, "roughly" vertical can refer to an angle variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0124] If the displacement between two surfaces is no greater than 5 μm, 2 μm, 1 μm, or 0.5 μm, then the two surfaces can be considered coplanar or substantially coplanar. If the displacement between the highest and lowest points of a surface does not exceed 5 μm, 2 μm, 1 μm, or 0.5 μm, then the surface can be considered substantially flat.

[0125] As used herein, unless the context clearly indicates otherwise, the singular forms “a / an” and “the” may contain a plural or multiple indicators.

[0126] As used herein, the terms “conductive,” “electrically conductive,” and “conductivity” refer to the ability to conduct electric current. Conductive materials are those that offer little or no resistance to the flow of electric current. A unit of measurement for conductivity is Siemens per meter (S / m). Typically, conductive materials have a conductivity greater than approximately 10. 4 S / m, for example, at least 10 5 S / m or at least 10 6 A material with S / m. The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0127] In addition, quantities, ratios, and other numerical values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and brevity, and should be flexibly interpreted as including not only the numerical values ​​explicitly specified as the limits of the range, but also all individual numerical values ​​or subranges covered within the range, as if each numerical value and subrange were explicitly specified.

[0128] While this disclosure has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting. Those skilled in the art will understand that various changes and alternative equivalents may be made without departing from the true spirit and scope of this disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Due to manufacturing processes and tolerances, the process reproduction in this disclosure may differ from actual equipment. Other embodiments may exist that are not specifically described in this disclosure. The description and drawings should be considered illustrative rather than limiting. Modifications may be made to suit particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of this disclosure. All such modifications are considered to be included within the scope of the appended claims. Although the disclosed methods have been described herein with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of this disclosure.

Claims

1. A packaging structure comprising: Flexible carrier; The first component is mounted on the curved flexible carrier; and A flexible encapsulation layer that encapsulates the first component and the curved flexible carrier.

2. The packaging structure according to claim 1, wherein the flexible carrier includes a flat portion, wherein, In a cross-sectional view, the flexible encapsulation layer has four outer sides, and the flat portion extends in a direction not parallel to the four outer sides.

3. The packaging structure according to claim 2, wherein the direction is not perpendicular to the four outer sides.

4. The packaging structure of claim 2, wherein the first component has a first surface facing the flat portion and inclined outwards on the four sides.

5. The packaging structure according to claim 1, wherein the curved portion of the flexible carrier is formed by bending the flat portion of the packaging structure.

6. The packaging structure according to claim 1, wherein, in a cross-sectional view, the first curved portion of the curved flexible carrier has a curved profile.

7. The packaging structure according to claim 6, wherein, in a top view, the first curved portion has a Z-shaped form.

8. The packaging structure according to claim 6, wherein, In a cross-sectional view, the first curved portion and the second curved portion of the curved flexible carrier form a multi-circular profile between the plurality of flat portions of the curved flexible carrier.

9. The encapsulation structure according to claim 1, wherein the flexible carrier has a substantially uniform thickness.

10. A packaging structure comprising: A flexible carrier, comprising a first flat portion and multiple curved portions; A first component is disposed on the first flat portion; and A flexible encapsulation layer that encapsulates the flexible carrier and the first component. The first component is located between the curved portions.

11. The packaging structure of claim 10, wherein the bent portion is configured to change when a deformation force is applied to the packaging structure.

12. The packaging structure of claim 11, wherein the first curvature of at least one of the bent portions is configured to change when the deformation force is applied to the packaging structure.

13. The packaging structure of claim 12, wherein the second curvature of at least one of the bent portions is configured to change when the deformation force is applied to the packaging structure, and wherein the first curvature increases and the second curvature decreases.

14. The packaging structure of claim 10, further comprising a second component disposed on a first surface of the first flat portion, the first surface being opposite to a second surface on which the first component is disposed.

15. The packaging structure of claim 14, wherein the second component is located between the curved portions.

16. The packaging structure of claim 10, further comprising a reinforcement disposed on a first surface of the first flat portion, the first surface being opposite to a second surface on which the first component is disposed.

17. A packaging structure comprising: A flexible carrier, comprising a first flat portion and a second flat portion spaced apart from the first flat portion; A first component is disposed on the first flat portion; The second component is disposed on the second flat portion; and A flexible encapsulation layer encapsulates the flexible carrier, the first component, and the second component. The relative position of the first component is configured to be adjustable relative to the second component during deformation of the encapsulation structure.

18. The packaging structure according to claim 17, wherein the packaging structure has a ring structure.

19. The encapsulation structure of claim 18, wherein the ring structure has an inner surface, and the length of the inner surface varies in response to deformation of the flexible encapsulation layer.

20. The packaging structure of claim 18, wherein the ring structure has an outer surface, and the flexible carrier includes a curved portion between the first flat portion and the second flat portion, wherein the curved portion is closer to the outer surface than the first component in the radial direction.

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