Terminal and terminal manufacturing method

Abstract

The invention discloses a terminal and a terminal manufacturing method. The terminal comprises a terminal body which is provided with a matching part used for being matched with a matching terminal. A first bottom plating layer and a first silver graphite plating layer formed on the first bottom plating layer are formed on the contact surface of the matching part of the terminal body. Graphite particles are uniformly dispersed in the first silver graphite plating layer, so that the wear resistance and the conductivity of the matching part of the terminal body are improved. According to the invention, the silver graphite plating layer has excellent wear resistance and conductivity, can greatly improve the matching times of the terminal and the matching terminal, and can reduce the plugging resistance between the terminal and the matching terminal.

Description

Technical Field

[0001] This invention relates to a terminal and a method for manufacturing a terminal. Background Technology

[0002] In existing technologies, traditional power and signal terminals typically employ a common silver plating method, electroplating a silver layer onto their surface. However, this silver plating layer suffers from poor wear resistance and high insertion / removal resistance, limiting the number of insertion / removal cycles for ordinary silver-plated terminals to typically only a few dozen, or at most a few hundred. However, in certain applications, frequent insertion / removal of terminals is required, necessitating thousands or even hundreds of thousands of cycles. Ordinary silver-plated terminals can no longer meet these demands.

[0003] Furthermore, because ordinary silver plating has poor wear resistance, ordinary silver-plated terminals will experience severe wear after repeated insertions and removals, and the plating may even peel off, exposing the terminal substrate. The exposed terminal substrate will be oxidized and corroded, which will lead to increased contact resistance when the terminal is mated with the mating terminal. Under energized conditions, this will cause excessive heat generation, and in extreme cases, may even cause a fire. Summary of the Invention

[0004] The purpose of this invention is to solve at least one aspect of the aforementioned problems and defects existing in the prior art.

[0005] According to one aspect of the present invention, a terminal is provided. The terminal includes: a terminal body having a mating portion for mating with a mating terminal. A first base plating layer and a first silver-graphite plating layer formed on the contact surface of the mating portion of the terminal body are formed. Graphite particles are uniformly dispersed in the first silver-graphite plating layer to improve the wear resistance and electrical conductivity of the mating portion of the terminal body.

[0006] According to an exemplary embodiment of the present invention, the Ag content of the first silver-graphite coating is greater than 99%.

[0007] According to another exemplary embodiment of the present invention, the thickness of the first silver graphite coating is 1 to 5 μm.

[0008] According to another exemplary embodiment of the present invention, the terminal body is a copper component, the terminal body serves as a substrate for electroplating the first base layer, the first base layer is a nickel plating layer and the thickness of the first base layer is 1 to 5 μm.

[0009] According to another exemplary embodiment of the present invention, the terminal body is a copper component, the terminal body serves as a substrate for electroplating the first base layer, the first base layer is a silver plating layer and the thickness of the first base layer is 0.1 to 0.5 μm.

[0010] According to another exemplary embodiment of the present invention, the terminal body is an aluminum part, the terminal body serves as a substrate for electroplating the first bottom plating layer, the first bottom plating layer is a copper plating layer and the thickness of the first bottom plating layer is 1 to 3 μm.

[0011] According to another exemplary embodiment of the present invention, the terminal body is an aluminum part, the terminal body serves as a substrate for electroplating the first bottom plating layer, the first bottom plating layer is a nickel plating layer and the thickness of the first bottom plating layer is 1 to 5 μm.

[0012] According to another exemplary embodiment of the present invention, the terminal body is an aluminum part, the terminal body serves as a substrate for electroplating the first base layer, the first base layer is a silver plating layer and the thickness of the first base layer is 0.1 to 0.5 μm.

[0013] According to another exemplary embodiment of the present invention, the terminal further has a first silver alloy plating layer formed between the first base plating layer and the first silver graphite plating layer, the thickness of the first silver alloy plating layer being 1 to 8 μm.

[0014] According to another exemplary embodiment of the present invention, the terminal further has a second silver alloy coating formed on the first silver graphite coating, the thickness of the second silver alloy coating being not less than 1 μm.

[0015] According to another exemplary embodiment of the present invention, the terminal body further has a crimping portion for crimping onto a cable conductor, wherein a second base plating layer and a second silver-graphite plating layer are formed on the contact surface of the crimping portion that contacts the cable conductor; graphite particles are uniformly dispersed in the second silver-graphite plating layer to improve the wear resistance and conductivity of the crimping portion of the terminal body.

[0016] According to another exemplary embodiment of the present invention, the Ag content of the first silver-graphite coating and the second silver-graphite coating is greater than 99%.

[0017] According to another exemplary embodiment of the present invention, the thickness of the first silver-graphite coating is 1 to 5 μm, and the thickness of the second silver-graphite coating is not less than 1 μm and not greater than the thickness of the first silver-graphite coating.

[0018] According to another exemplary embodiment of the present invention, the terminal body is a copper component, and the terminal body serves as a substrate for electroplating the first base plating layer and the second base plating layer, wherein the first base plating layer and the second base plating layer are nickel plating layers and the thickness of the first base plating layer and the second base plating layer is 1 to 5 μm.

[0019] According to another exemplary embodiment of the present invention, the terminal body is a copper component, and the terminal body serves as a substrate for electroplating the first base plating layer and the second base plating layer. The first base plating layer and the second base plating layer are silver plating layers, and the thickness of the first base plating layer and the second base plating layer is 0.1 to 0.5 μm.

[0020] According to another exemplary embodiment of the present invention, the terminal body is an aluminum part, and the terminal body serves as a substrate for electroplating the first base plating layer and the second base plating layer, wherein the first base plating layer and the second base plating layer are copper plating layers and the thickness of the first base plating layer and the second base plating layer is 1 to 3 μm.

[0021] According to another exemplary embodiment of the present invention, the terminal body is an aluminum part, and the terminal body serves as a substrate for electroplating the first base plating layer and the second base plating layer, wherein the first base plating layer and the second base plating layer are nickel plating layers and the thickness of the first base plating layer and the second base plating layer is 1 to 5 μm.

[0022] According to another exemplary embodiment of the present invention, the terminal body is an aluminum part, and the terminal body serves as a substrate for electroplating the first base plating layer and the second base plating layer. The first base plating layer and the second base plating layer are silver plating layers and the thickness of the first base plating layer and the second base plating layer is 0.1 to 0.5 μm.

[0023] According to another aspect of the present invention, a method for manufacturing a terminal is provided. The terminal manufacturing method includes the following steps:

[0024] S11: Provides terminal body;

[0025] S12: A first base plating layer is formed on the contact surface of the mating portion of the terminal body for mating with the mating terminal;

[0026] S13: A first silver alloy plating layer is formed on the first base plating layer;

[0027] S14: A first silver graphite coating is formed on the first silver alloy coating; and

[0028] S15: A second silver alloy coating is formed on the first silver graphite coating.

[0029] According to an exemplary embodiment of the present invention, step S12 further includes: forming a second bottom plating layer on the contact surface of the crimping portion of the terminal body for crimping onto the cable conductor; step S14 further includes: forming a second silver graphite plating layer on the second bottom plating layer.

[0030] According to another exemplary embodiment of the present invention, the terminal manufacturing method further includes:

[0031] After step S15, the terminal is ultrasonically cleaned and then dried and subjected to anti-oxidation treatment.

[0032] According to another aspect of the present invention, a method for manufacturing a terminal is provided. The terminal manufacturing method includes the following steps:

[0033] S21: Provides terminal body;

[0034] S22: A first base plating layer is formed on the contact surface of the mating portion of the terminal body for mating with the mating terminal; and

[0035] S23: A first silver graphite coating is formed on the first silver alloy coating.

[0036] According to an exemplary embodiment of the present invention, step S22 further includes: forming a second bottom plating layer on the contact surface of the crimping portion of the terminal body for crimping onto the cable conductor; step S23 further includes: forming a second silver graphite plating layer on the second bottom plating layer.

[0037] According to another exemplary embodiment of the present invention, the terminal manufacturing method further includes: after step S23, ultrasonically cleaning the terminal and drying and anti-oxidation treatment of the terminal after cleaning.

[0038] In the aforementioned exemplary embodiments of the present invention, the silver-graphite coating has excellent wear resistance and conductivity, which can greatly increase the number of mating cycles between the terminal and the mating terminal, and can reduce the insertion and extraction resistance between the terminal and the mating terminal.

[0039] Other objects and advantages of the invention will become apparent from the following description of the invention with reference to the accompanying drawings, and will help to provide a comprehensive understanding of the invention. Attached Figure Description

[0040] Figure 1 A schematic diagram of a terminal body according to a first embodiment of the present invention is shown;

[0041] Figure 2 A schematic diagram of the terminals according to a first embodiment of the present invention is shown;

[0042] Figure 3 This diagram shows a partially enlarged view of the mating portion of the terminals according to a first embodiment of the present invention;

[0043] Figure 4 This diagram shows a partially enlarged view of the crimping portion of a terminal according to a first embodiment of the present invention;

[0044] Figure 5A schematic diagram showing a terminal, a mating terminal, and a cable conductor according to a first embodiment of the present invention is shown, wherein the mating portion of the terminal is mated to the mating terminal, and the crimping portion of the terminal is crimped onto the cable conductor;

[0045] Figure 6 A schematic diagram of a terminal body according to a second embodiment of the present invention is shown;

[0046] Figure 7 A schematic diagram of the terminals according to a second embodiment of the present invention is shown;

[0047] Figure 8 This diagram shows a partially enlarged view of the mating portion of the terminals according to a second embodiment of the present invention;

[0048] Figure 9 This diagram shows a partially enlarged view of the crimping portion of a terminal according to a second embodiment of the present invention;

[0049] Figure 10 A schematic diagram showing a terminal, mating terminal, and cable conductor according to a second embodiment of the present invention is shown, wherein the mating portion of the terminal is mated with the mating terminal, and the crimping portion of the terminal is crimped onto the cable conductor. Detailed Implementation

[0050] The technical solution of the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. In this specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention and should not be construed as a limitation thereof.

[0051] Furthermore, in the following detailed description, numerous specific details are set forth for ease of explanation to provide a thorough understanding of the embodiments disclosed herein. However, it will be apparent that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and apparatuses are illustrated to simplify the figures.

[0052] According to a general technical concept of the present invention, a terminal is provided. The terminal includes: a terminal body having a mating portion for mating with a mating terminal. A first base plating layer and a first silver-graphite plating layer formed on the contact surface of the mating portion of the terminal body are formed. Graphite particles are uniformly dispersed in the first silver-graphite plating layer to improve the wear resistance and electrical conductivity of the mating portion of the terminal body.

[0053] According to another general technical concept of the present invention, a terminal manufacturing method is provided. The terminal manufacturing method includes: providing a terminal body; forming a first base plating layer on a contact surface of a mating portion of the terminal body for mating with a mating terminal; forming a first silver alloy plating layer on the first base plating layer; forming a first silver graphite plating layer on the first silver alloy plating layer; and forming a second silver alloy plating layer on the first silver graphite plating layer.

[0054] According to another general technical concept of the present invention, a terminal manufacturing method is provided. The terminal manufacturing method includes: providing a terminal body; forming a first base plating layer on a contact surface of a mating portion of the terminal body for mating with a mating terminal; and forming a first silver-graphite plating layer on the first silver alloy plating layer.

[0055] First Embodiment

[0056] Figures 1 to 5 A first embodiment according to the present invention is shown. Wherein, Figure 1 A schematic diagram of the terminal body 10 according to a first embodiment of the present invention is shown; Figure 2 A schematic diagram of terminal 1 according to a first embodiment of the present invention is shown; Figure 3 This diagram shows an enlarged view of a portion A of the mating portion 11 of the terminal 1 according to a first embodiment of the present invention; Figure 4 This diagram shows an enlarged view of a portion B of the crimping portion 12 of the terminal 1 according to a first embodiment of the present invention; Figure 5 A schematic diagram showing a terminal 1, a mating terminal 2, and a cable conductor 3 according to a first embodiment of the present invention is shown, wherein the mating portion 11 of the terminal 1 is mated with the mating terminal 2, and the crimping portion 12 of the terminal 1 is crimped onto the cable conductor 3.

[0057] like Figures 1 to 5 As shown, in an exemplary embodiment of the present invention, a terminal 1 is disclosed. The terminal 1 includes a terminal body 10. The terminal body 10 has a mating portion 11 for mating with a mating terminal 2. A first base plating layer 11a is formed on the contact surface of the mating portion 11 of the terminal body 10, and a first silver alloy plating layer 11b is formed on the first base plating layer 11a. For example, the first silver alloy plating layer 11b can be a silver-antimony (AgSb) alloy plating layer. A first silver graphite plating layer (or referred to as a first Ag-C plating layer) 11c is formed on the first silver alloy plating layer 11b, and a second silver alloy plating layer 11d is formed on the first silver graphite plating layer 11c. For example, the second silver alloy plating layer 11d can be a silver-antimony alloy plating layer.

[0058] like Figures 1 to 5As shown in the illustrated embodiment, graphite particles are uniformly dispersed in the first silver graphite coating 11c, thereby improving the wear resistance and conductivity of the mating portion 11 of the terminal 1, and reducing the insertion and extraction resistance between the mating portion 11 of the terminal 1 and the mating terminal 2.

[0059] like Figures 1 to 5 As shown in the illustrated embodiment, the first silver-graphite coating 11c contains more than 99% Ag by weight, and the thickness of the first silver-graphite coating 11c is 1 to 5 μm.

[0060] like Figures 1 to 5 As shown, in an exemplary embodiment of the present invention, the terminal body 10 is a copper component, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a. The first bottom plating layer 11a is a nickel plating layer and the thickness of the first bottom plating layer 11a is 1 to 5 μm.

[0061] like Figures 1 to 5 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is a copper component, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a. The first bottom plating layer 11a is a silver plating layer and the thickness of the first bottom plating layer 11a is 0.1 to 0.5 μm.

[0062] like Figures 1 to 5 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a. The first bottom plating layer 11a is a copper plating layer and the thickness of the first bottom plating layer 11a is 1 to 3 μm.

[0063] like Figures 1 to 5 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a. The first bottom plating layer 11a is a nickel plating layer and the thickness of the first bottom plating layer 11a is 1 to 5 μm.

[0064] like Figures 1 to 5 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a. The first bottom plating layer 11a is a silver plating layer and the thickness of the first bottom plating layer 11a is 0.1 to 0.5 μm.

[0065] like Figures 1 to 5 As shown, in another exemplary embodiment of the present invention, the thickness of the first silver alloy plating layer 11b is 1 to 8 μm, and the thickness of the second silver alloy plating layer 11d is not less than 1 μm.

[0066] like Figures 1 to 5As shown in the illustrated embodiment, the terminal body 10 further includes a crimping portion 12 for crimping onto the cable conductor 3. A second base plating layer 12a and a second silver-graphite plating layer 12c are formed on the contact surface of the crimping portion 12 that contacts the cable conductor 3. Graphite particles are uniformly dispersed in the second silver-graphite plating layer 12c to improve the wear resistance and conductivity of the crimping portion 12 of the terminal body 10.

[0067] like Figures 1 to 5 As shown in the illustrated embodiment, the Ag content of the first silver-graphite coating 11c and the second silver-graphite coating 12c is greater than 99%. The thickness of the first silver-graphite coating 11c is 1–5 μm, and the thickness of the second silver-graphite coating 12c is not less than 1 μm and not greater than the thickness of the first silver-graphite coating 11c.

[0068] like Figures 1 to 5 As shown, in an exemplary embodiment of the present invention, the terminal body 10 is a copper component, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a and the second bottom plating layer 12a. The first bottom plating layer 11a and the second bottom plating layer 12a are nickel plating layers, and the thickness of the first bottom plating layer 11a and the second bottom plating layer 12a is 1 to 5 μm.

[0069] like Figures 1 to 5 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is a copper component, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a and the second bottom plating layer 12a. The first bottom plating layer 11a and the second bottom plating layer 12a are silver plating layers, and the thickness of the first bottom plating layer 11a and the second bottom plating layer 12a is 0.1 to 0.5 μm.

[0070] like Figures 1 to 5 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a and the second bottom plating layer 12a. The first bottom plating layer 11a and the second bottom plating layer 12a are copper plating layers, and the thickness of the first bottom plating layer 11a and the second bottom plating layer 12a is 1 to 3 μm.

[0071] like Figures 1 to 5 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a and the second bottom plating layer 12a. The first bottom plating layer 11a and the second bottom plating layer 12a are nickel plating layers, and the thickness of the first bottom plating layer 11a and the second bottom plating layer 12a is 1 to 5 μm.

[0072] like Figures 1 to 5As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a and the second bottom plating layer 12a. The first bottom plating layer 11a and the second bottom plating layer 12a are silver plating layers and the thickness of the first bottom plating layer 11a and the second bottom plating layer 12a is 0.1 to 0.5 μm.

[0073] like Figures 1 to 5 As shown, in another exemplary embodiment of the present invention, a terminal manufacturing method is also disclosed. This terminal manufacturing method includes the following steps:

[0074] S11: Provide terminal body 10;

[0075] S12: A first bottom plating layer 11a is formed on the contact surface of the mating part 11 of the terminal body 10 for mating with the mating terminal 2;

[0076] S13: A first silver alloy plating layer 11b is formed on the first base plating layer 11a;

[0077] S14: A first silver graphite coating 11c is formed on the first silver alloy coating 11b; and

[0078] S15: A second silver alloy coating 11d is formed on the first silver graphite coating 11c.

[0079] like Figures 1 to 5 As shown in the illustrated embodiment, step S12 further includes forming a second bottom plating layer 12a on the contact surface of the crimping portion 12 of the terminal body 10 for crimping onto the cable conductor 3. Step S14 further includes forming a second silver-graphite plating layer 12c on the second bottom plating layer 12a.

[0080] like Figures 1 to 5 As shown in the illustrated embodiment, the aforementioned terminal manufacturing method further includes: after step S15, ultrasonically cleaning the terminal 1 and drying and anti-oxidation treatment of the terminal 1 after cleaning.

[0081] In the foregoing embodiments, the silver-graphite (Ag-C) coating not only possesses all the characteristics of a pure silver coating, but also acquires chemical and mechanical properties that a pure silver coating cannot obtain. This significantly reduces the insertion and extraction resistance of the terminals. Furthermore, the silver-graphite coating is non-brittle and exhibits higher wear resistance and conductivity than a pure silver coating. It is also maintenance-free and self-lubricating, improving efficiency and reducing costs. The appearance color is blackish-gray.

[0082] Second Embodiment

[0083] Figures 6 to 10 A second embodiment according to the present invention is shown. Wherein, Figure 6A schematic diagram of the terminal body 10 according to a second embodiment of the present invention is shown; Figure 7 A schematic diagram of terminal 1 according to a second embodiment of the present invention is shown; Figure 8 This diagram shows an enlarged view of a portion A of the mating portion 11 of the terminal 1 according to a second embodiment of the present invention; Figure 9 This is an enlarged schematic diagram showing a portion B of the crimping portion 12 of the terminal 1 according to a second embodiment of the present invention; Figure 10 A schematic diagram showing a terminal 1, a mating terminal 2, and a cable conductor 3 according to a second embodiment of the present invention is shown, wherein the mating portion 11 of the terminal 1 is mated with the mating terminal 2, and the crimping portion 12 of the terminal 1 is crimped onto the cable conductor 3.

[0084] like Figures 6 to 10 As shown, in an exemplary embodiment of the present invention, a terminal 1 is also disclosed. The terminal 1 includes a terminal body 10. The terminal body 10 has a mating portion 11 for mating with a mating terminal 2. A first base plating layer 11a and a first silver-graphite plating layer 11c are formed on the contact surface of the mating portion 11 of the terminal body 10. Graphite particles are uniformly dispersed in the first silver-graphite plating layer 11c to improve the wear resistance and electrical conductivity of the mating portion 11 of the terminal 1.

[0085] like Figures 6 to 10 As shown in the illustrated embodiment, the first silver-graphite coating 11c contains more than 99% Ag. The thickness of the first silver-graphite coating 11c is 1–5 μm.

[0086] like Figures 6 to 10 As shown, in an exemplary embodiment of the present invention, the terminal body 10 is a copper component, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a. The first bottom plating layer 11a is a nickel plating layer and the thickness of the first bottom plating layer 11a is 1 to 5 μm.

[0087] like Figures 6 to 10 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is a copper component, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a. The first bottom plating layer 11a is a silver plating layer and the thickness of the first bottom plating layer 11a is 0.1 to 0.5 μm.

[0088] like Figures 6 to 10 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a. The first bottom plating layer 11a is a copper plating layer and the thickness of the first bottom plating layer 11a is 1 to 3 μm.

[0089] like Figures 6 to 10As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a. The first bottom plating layer 11a is a nickel plating layer and the thickness of the first bottom plating layer 11a is 1 to 5 μm.

[0090] like Figures 6 to 10 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a. The first bottom plating layer 11a is a silver plating layer and the thickness of the first bottom plating layer 11a is 0.1 to 0.5 μm.

[0091] like Figures 6 to 10 As shown, in another exemplary embodiment of the present invention, the terminal body 10 further includes a crimping portion 12 for crimping onto the cable conductor 3. A second base plating layer 12a and a second silver-graphite plating layer 12c are formed on the contact surface of the crimping portion 12 that contacts the cable conductor 3. Graphite particles are uniformly dispersed in the second silver-graphite plating layer 12c to improve the wear resistance and conductivity of the crimping portion 12 of the terminal body 10.

[0092] like Figures 6 to 10 As shown, in another exemplary embodiment of the present invention, the Ag content of the first silver-graphite coating 11c and the second silver-graphite coating 12c is greater than 99%.

[0093] like Figures 6 to 10 As shown, in another exemplary embodiment of the present invention, the thickness of the first silver-graphite coating 11c is 1–5 μm, and the thickness of the second silver-graphite coating 12c is not less than 1 μm and not greater than the thickness of the first silver-graphite coating 11c.

[0094] like Figures 6 to 10 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is a copper component, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a and the second bottom plating layer 12a. The first bottom plating layer 11a and the second bottom plating layer 12a are nickel plating layers, and the thickness of the first bottom plating layer 11a and the second bottom plating layer 12a is 1 to 5 μm.

[0095] like Figures 6 to 10 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is a copper component, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a and the second bottom plating layer 12a. The first bottom plating layer 11a and the second bottom plating layer 12a are silver plating layers, and the thickness of the first bottom plating layer 11a and the second bottom plating layer 12a is 0.1 to 0.5 μm.

[0096] like Figures 6 to 10As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a and the second bottom plating layer 12a. The first bottom plating layer 11a and the second bottom plating layer 12a are copper plating layers, and the thickness of the first bottom plating layer 11a and the second bottom plating layer 12a is 1 to 3 μm.

[0097] like Figures 6 to 10 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a and the second bottom plating layer 12a. The first bottom plating layer 11a and the second bottom plating layer 12a are nickel plating layers, and the thickness of the first bottom plating layer 11a and the second bottom plating layer 12a is 1 to 5 μm.

[0098] like Figures 6 to 10 As shown, in another exemplary embodiment of the present invention, the terminal body 10 is an aluminum part, and the terminal body 10 serves as the substrate for electroplating the first bottom plating layer 11a and the second bottom plating layer 12a. The first bottom plating layer 11a and the second bottom plating layer 12a are silver plating layers and the thickness of the first bottom plating layer 11a and the second bottom plating layer 12a is 0.1 to 0.5 μm.

[0099] like Figures 6 to 10 As shown, in another exemplary embodiment of the present invention, a terminal manufacturing method is also disclosed. This terminal manufacturing method includes the following steps:

[0100] S21: Provide terminal body 10;

[0101] S22: A first bottom plating layer 11a is formed on the contact surface of the mating portion 11 of the terminal body 10 for mating with the mating terminal 2; and

[0102] S23: A first silver graphite coating 11c is formed on the first silver alloy coating 11b.

[0103] like Figures 6 to 10 As shown in the illustrated embodiment, step S22 further includes forming a second bottom plating layer 12a on the contact surface of the crimping portion 12 of the terminal body 10 for crimping onto the cable conductor 3. Step S23 further includes forming a second silver-graphite plating layer 12c on the second bottom plating layer 12a.

[0104] like Figures 6 to 10 As shown in the illustrated embodiment, the aforementioned terminal manufacturing method further includes: after step S23, ultrasonic cleaning of terminal 1 and drying and anti-oxidation treatment of terminal 1 after cleaning.

[0105] In the foregoing embodiments, the silver-graphite (Ag-C) coating not only possesses all the characteristics of a pure silver coating, but also acquires chemical and mechanical properties that a pure silver coating cannot obtain. This significantly reduces the insertion and extraction resistance of the terminals. Furthermore, the silver-graphite coating is non-brittle and exhibits higher wear resistance and conductivity than a pure silver coating. It is also maintenance-free and self-lubricating, improving efficiency and reducing costs. The appearance color is blackish-gray.

[0106] Those skilled in the art will understand that the embodiments described above are exemplary and can be improved upon. The structures described in the various embodiments can be freely combined without causing structural or principle conflicts, and these changes should fall within the protection scope of this invention.

[0107] Although the invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to illustrate preferred embodiments of the invention and should not be construed as limiting the invention.

[0108] While some embodiments of the general concept of the invention have been shown and described, those skilled in the art will understand that changes may be made to these embodiments without departing from the principles and spirit of the general concept of the invention, the scope of which is defined by the claims and their equivalents.

[0109] It should be noted that the word "comprising" does not exclude other elements or steps, and the words "a" or "an" do not exclude multiple elements. Furthermore, any reference numerals in the claims should not be construed as limiting the scope of the invention.

Claims

1. A terminal, characterized in that, include: Terminal body (10) has mating part (11) for mating with mating terminal (2). A first base plating layer (11a) and a first silver-graphite plating layer (11c) formed on the contact surface of the mating portion (11) of the terminal body (10) are formed. Graphite particles are uniformly dispersed in the first silver-graphite coating (11c) to improve the wear resistance and electrical conductivity of the mating part (11) of the terminal body (10).

2. The terminal according to claim 1, characterized in that: The first silver-graphite coating (11c) contains more than 99% Ag.

3. The terminal according to claim 1, characterized in that: The thickness of the first silver-graphite coating (11c) is 1–5 μm.

4. The terminal according to claim 1, characterized in that: The terminal body (10) is made of copper and serves as the substrate for electroplating the first bottom plating layer (11a). The first bottom plating layer (11a) is a nickel plating layer and has a thickness of 1 to 5 μm.

5. The terminal according to claim 1, characterized in that: The terminal body (10) is made of copper and serves as the substrate for electroplating the first bottom plating layer (11a). The first bottom plating layer (11a) is a silver plating layer and the thickness of the first bottom plating layer (11a) is 0.1 to 0.5 μm.

6. The terminal according to claim 1, characterized in that: The terminal body (10) is made of aluminum and serves as the substrate for electroplating the first bottom plating layer (11a). The first bottom plating layer (11a) is a copper plating layer and has a thickness of 1 to 3 μm.

7. The terminal according to claim 1, characterized in that: The terminal body (10) is made of aluminum and serves as the substrate for electroplating the first bottom plating layer (11a). The first bottom plating layer (11a) is a nickel plating layer and has a thickness of 1 to 5 μm.

8. The terminal according to claim 1, characterized in that: The terminal body (10) is made of aluminum and serves as the substrate for electroplating the first bottom plating layer (11a). The first bottom plating layer (11a) is a silver plating layer and the thickness of the first bottom plating layer (11a) is 0.1 to 0.5 μm.

9. The terminal according to claim 1, characterized in that: The terminal also has a first silver alloy plating layer (11b) formed between the first base plating layer (11a) and the first silver graphite plating layer (11c), the first silver alloy plating layer (11b) having a thickness of 1 to 8 μm.

10. The terminal according to claim 1 or 9, characterized in that: The terminal also has a second silver alloy plating layer (11d) formed on the first silver graphite plating layer (11c), the thickness of the second silver alloy plating layer (11d) being not less than 1 μm.

11. The terminal according to claim 1, characterized in that: The terminal body (10) also has a crimping portion (12) for crimping onto the cable conductor (3), wherein a second bottom plating layer (12a) and a second silver-graphite plating layer (12c) are formed on the contact surface of the crimping portion (12) that contacts the cable conductor (3). Graphite particles are uniformly dispersed in the second silver-graphite coating (12c) to improve the wear resistance and electrical conductivity of the crimping portion (12) of the terminal body (10).

12. The terminal according to claim 11, characterized in that: The first silver-graphite coating (11c) and the second silver-graphite coating (12c) contain more than 99% Ag.

13. The terminal according to claim 11, characterized in that: The thickness of the first silver-graphite coating (11c) is 1 to 5 μm, and the thickness of the second silver-graphite coating (12c) is not less than 1 μm and not greater than the thickness of the first silver-graphite coating (11c).

14. The terminal according to claim 11, characterized in that: The terminal body (10) is made of copper and serves as the substrate for electroplating the first bottom plating layer (11a) and the second bottom plating layer (12a). The first bottom plating layer (11a) and the second bottom plating layer (12a) are nickel plating layers and the thickness of the first bottom plating layer (11a) and the second bottom plating layer (12a) is 1 to 5 μm.

15. The terminal according to claim 11, characterized in that: The terminal body (10) is made of copper and serves as the substrate for electroplating the first bottom plating layer (11a) and the second bottom plating layer (12a). The first bottom plating layer (11a) and the second bottom plating layer (12a) are silver plating layers and the thickness of the first bottom plating layer (11a) and the second bottom plating layer (12a) is 0.1 to 0.5 μm.

16. The terminal according to claim 11, characterized in that: The terminal body (10) is made of aluminum and serves as the substrate for electroplating the first bottom plating layer (11a) and the second bottom plating layer (12a). The first bottom plating layer (11a) and the second bottom plating layer (12a) are copper plating layers and the thickness of the first bottom plating layer (11a) and the second bottom plating layer (12a) is 1 to 3 μm.

17. The terminal according to claim 11, characterized in that: The terminal body (10) is made of aluminum and serves as the substrate for electroplating the first bottom plating layer (11a) and the second bottom plating layer (12a). The first bottom plating layer (11a) and the second bottom plating layer (12a) are nickel plating layers and the thickness of the first bottom plating layer (11a) and the second bottom plating layer (12a) is 1 to 5 μm.

18. The terminal according to claim 11, characterized in that: The terminal body (10) is made of aluminum and serves as the substrate for electroplating the first bottom plating layer (11a) and the second bottom plating layer (12a). The first bottom plating layer (11a) and the second bottom plating layer (12a) are silver plating layers and the thickness of the first bottom plating layer (11a) and the second bottom plating layer (12a) is 0.1 to 0.5 μm.

19. A terminal manufacturing method, comprising the following steps: S11: Provide terminal body (10); S12: A first bottom plating layer (11a) is formed on the contact surface of the mating part (11) of the terminal body (10) for mating with the mating terminal (2); S13: A first silver alloy plating layer (11b) is formed on the first base plating layer (11a); S14: A first silver graphite coating (11c) is formed on the first silver alloy coating (11b); and S15: A second silver alloy coating (11d) is formed on the first silver graphite coating (11c).

20. The terminal manufacturing method according to claim 19, characterized in that: Step S12 further includes: forming a second bottom plating layer (12a) on the contact surface of the crimping portion (12) of the terminal body (10) for crimping onto the cable conductor (3); and Step S14 further includes forming a second silver graphite coating (12c) on the second bottom coating (12a).

21. The terminal manufacturing method according to claim 19, characterized in that, Also includes: After step S15, the terminal (1) is ultrasonically cleaned and then dried and subjected to anti-oxidation treatment.

22. A terminal manufacturing method, comprising the following steps: S21: Provide terminal body (10); S22: A first bottom plating layer (11a) is formed on the contact surface of the mating portion (11) of the terminal body (10) for mating with the mating terminal (2); and S23: A first silver graphite coating (11c) is formed on the first silver alloy coating (11b).

23. The terminal manufacturing method according to claim 22, characterized in that: Step S22 further includes: forming a second bottom plating layer (12a) on the contact surface of the crimping portion (12) of the terminal body (10) for crimping onto the cable conductor (3); and Step S23 further includes forming a second silver-graphite coating (12c) on the second bottom coating (12a).

24. The terminal manufacturing method according to claim 22, characterized in that, Also includes: After step S23, the terminal (1) is ultrasonically cleaned and then dried and subjected to anti-oxidation treatment.

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