Intelligent water cooling device and control system for SVG power module

Through the design of multi-stage water treatment and intelligent water cooling devices, problems such as water pollution, pressure fluctuations and low-temperature freezing in the water cooling system of SVG power modules are solved, achieving efficient and stable cooling effect and convenient installation and maintenance, adapting to the needs of different ambient temperatures.

CN122054524APending Publication Date: 2026-05-15新疆立新能源股份有限公司 +3
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
新疆立新能源股份有限公司
Filing Date
2026-02-11
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

Existing water cooling devices for SVG power modules suffer from several problems, including water quality being susceptible to contamination by impurities leading to pipe blockage and corrosion, large fluctuations in pipe pressure causing leaks, freezing in low-temperature environments, unreasonable cooling structure design, and insufficient ease of installation and maintenance, making it difficult to meet the requirements for efficient heat dissipation.

Method used

It adopts a multi-stage water treatment structure of filtration and deionization, combined with an expansion tank and electric heater. It is designed with efficient water-cooled plates and pipeline connections to ensure the cleanliness and pressure stability of the cooling water. The external radiator works in conjunction with the electric heater to adapt to different ambient temperatures.

Benefits of technology

It effectively removes impurities and ions from cooling water, ensuring long-term stable operation of the cooling system, reducing leakage risk, improving system reliability, adapting to different ambient temperatures, improving heat dissipation efficiency, and facilitating installation and maintenance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of heat dissipation of electronic equipment, in particular to an intelligent water cooling device and control system for an SVG power module, and the device comprises a high-level water tank, a main circulating pump, a two-stage filter, a deionizing device, an external radiator and an electric heater which are arranged in sequence and are sequentially connected through a pipeline. An expansion tank is arranged between the main circulating pump and the two-stage filter in parallel, a main pipeline, a branch pipeline and a confluence pipeline are sequentially connected between the deionizing device and the external radiator, a water cooling plate is arranged on the SVG power module in an attached mode, the branch pipeline penetrates through the water cooling plate, and the external radiator and the electric heater are connected through a water return pipeline. Impurities and ions in cooling water are effectively removed through a filtering and deionizing multi-stage water quality treatment structure, pipeline blockage and corrosion are avoided, and long-term stable operation of a cooling system is guaranteed; the expansion tank is matched with the high-level water tank to doubly guarantee stable pipeline pressure, the leakage risk is reduced, and the operation reliability of the system is improved.
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Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and in particular to an intelligent water cooling device and control system for SVG power modules. Background Technology

[0002] In the field of power electronics, SVG is a key reactive power compensation device. Its power modules generate a lot of heat during operation. If the heat cannot be dissipated in time, the module temperature will rise, which will seriously affect the operational stability, response speed and service life of the SVG device.

[0003] Traditional heat dissipation methods, such as air cooling, have low efficiency and cannot meet the high-efficiency heat dissipation requirements of high-power SVG power modules.

[0004] Existing water cooling devices generally suffer from the following problems: water quality is easily contaminated by impurities, leading to pipe blockage and corrosion, which affects the long-term reliable operation of the cooling system; the internal pressure of the pipes fluctuates greatly, which easily leads to leakage risks; the pipes are prone to freezing in low-temperature environments, causing the system to fail to start normally; the cooling structure design is unreasonable, the heat exchange uniformity is poor, and the installation and maintenance are not convenient enough, making it difficult to adapt to the actual operating requirements of SVG power modules. Summary of the Invention

[0005] Based on this, it is necessary to provide an intelligent water cooling device and control system for SVG power modules to address the above-mentioned technical problems. Through a multi-stage water treatment structure of filtration and deionization, impurities and ions in the cooling water can be effectively removed, avoiding pipe blockage and corrosion, and ensuring the long-term stable operation of the cooling system.

[0006] This invention provides an intelligent water-cooling device for SVG power modules, comprising a high-level water tank, a main circulation pump, a two-stage filter, a deionizer, an external heat sink, and an electric heater arranged sequentially and connected by pipelines; an expansion tank is connected in parallel between the main circulation pump and the two-stage filter; a main pipeline, a branch pipeline, and a manifold are sequentially connected between the deionizer and the external heat sink; a water-cooling plate is attached to the SVG power module; the branch pipeline passes through the water-cooling plate; and the external heat sink and the electric heater are connected by a return water pipeline.

[0007] In one embodiment, the water-cooled plate includes a mounting base and a cover plate; the bottom surface of the mounting base is attached to the SVG power module, and a first cooling channel is provided inside the mounting base. The two ends of the first cooling channel pass through the two ends of the mounting base respectively. The other side of the mounting base is set as an open structure. The cover plate is installed at one end of the open structure of the mounting base to close the first cooling channel. The branch pipe is connected to both ends of the first cooling channel.

[0008] In one embodiment, the upper surface of the cover plate is provided with a plurality of slots, the slots being oriented in the same direction as the first cooling channel, and the slots being used to pass through other branch pipes.

[0009] In one embodiment, the fixing base includes a base plate, end plates, side plates, and a first bent plate; two end plates are located at both ends of the upper surface of the base plate, and two side plates are located on both sides of the upper surface of the base plate. The height of the end plates is greater than the height of the side plates. One end of the end plate and one end of the side plate are connected by the first bent plate, which bends toward the center of the base plate. The first bent plate and the base plate form a mounting opening.

[0010] In one embodiment, the cover plate includes a top plate, a second bent plate, and a stop plate; the bottom plate is attached to the top surface of the side plate and located between the two end plates; the second bent plate is disposed at the corner of the top plate, the outer surface of the second bent plate is attached to the inner surface of the first bent plate; the stop plate is disposed on the inner surface of the second bent plate, the bottom surface of the stop plate abuts against the bottom surface of the mounting opening; a cut is provided on one side of the connection between the stop plate and the second bent plate; a first mounting hole and a second mounting hole are respectively provided on the mounting opening and the stop plate, and the central axes of the first mounting hole and the second mounting hole coincide.

[0011] In one embodiment, the end plate has a through opening at its center, and the first cooling channel includes two semi-circular cavities and two spiral flow channels; the planar ends of the two semi-circular cavities are respectively opposite to the two through openings and are connected to the through openings; the two spiral flow channels are symmetrically arranged between the two semi-circular cavities, and the ends of the spiral flow channels are connected to one side of the arc end of the semi-circular cavity; a second cooling channel is also provided on one side of the first cooling channel, the second cooling channel is arranged close to the end plate, the first curved plate and the side plate, and the two ends of the second cooling channel are respectively connected to the two semi-circular cavities.

[0012] In one embodiment, a first partition cavity is provided between the first cooling channel and the second cooling channel, and a second partition cavity is provided between the two spiral flow channels. The second partition cavity includes a cross-shaped portion and a guide portion. The guide portion is located at one end near the semi-circular cavity, and the arc-shaped protrusion of the guide portion can guide the cooling water entering the semi-circular cavity so that it enters the two spiral flow channels respectively. The cross-shaped portion is located between the two guide portions.

[0013] In one embodiment, a plurality of positioning blocks are spaced apart on the upper surface of the top plate. The lower half of the positioning block is a rectangular structure, and the upper half of the positioning block is a semi-circular structure. The slot is arranged along the length direction of the positioning block and passes through both ends of the positioning block. The slot is arranged in a circular columnar structure, and the central axis of the slot coincides with the central axis of one end of the semi-circular structure of the positioning block.

[0014] In one embodiment, a through groove is provided on the inner surface of the slot away from the top plate. The through groove is used for branch pipes to be inserted. Multiple spaced grooves are provided on both sides of the end of the positioning block connected to the top plate. The multiple spaced grooves are spaced apart along the length direction of the positioning block.

[0015] The present invention also provides an intelligent water-cooling control system for SVG power modules, applied to the intelligent water-cooling device for SVG power modules described in any of the above embodiments, comprising: The elevated water tank stores cooling water and provides a stable initial water pressure, while the expansion tank simultaneously maintains stable pressure inside the pipeline. The main circulation pump draws and pressurizes the cooling water. After impurities are removed by a two-stage filter and the water is purified by a deionization device, the clean cooling water flows through the main pipeline and branch pipelines through the water-cooled plate that has absorbed the heat of the SVG power module. After absorbing heat, the hot water is collected through the manifold and flows into the external radiator for heat dissipation. The cooled water flows through the electric heater, which is activated as needed to prevent the pipes from freezing. The treated cooling water flows back to the high-level water tank to complete the circulation.

[0016] The aforementioned intelligent water-cooling device and control system for SVG power modules effectively removes impurities and ions from the cooling water through a multi-stage water treatment structure involving filtration and deionization, preventing pipe blockage and corrosion and ensuring long-term stable operation of the cooling system. The expansion tank and elevated water tank work together to provide dual protection for stable pipe pressure, reducing leakage risks and improving system reliability. The external radiator and electric heater work in tandem, efficiently dissipating heat while preventing icing in low-temperature environments, making the system adaptable to different ambient temperatures and applicable to a wide range of conditions. The overall piping and water-cooling plate assembly structure is simple, with a clear cooling water circulation path, high heat exchange efficiency, and precise matching of the SVG power module's heat dissipation requirements, while also facilitating installation and maintenance. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the structure of the intelligent water cooling device provided by the present invention; Figure 2 A three-dimensional structural schematic diagram of the water-cooled plate component provided by the present invention; Figure 3 A schematic diagram of the planar structure of the water-cooled plate component provided by the present invention; Figure 4 A three-dimensional structural diagram of the fixing base provided by the present invention; Figure 5 A schematic diagram of the planar structure of the fixing base provided by the present invention; Figure 6 A three-dimensional structural schematic diagram of the cover plate component provided by the present invention; Figure 7 This is a cross-sectional structural diagram of the cover plate provided by the present invention.

[0019] Figure label: 100. High-level water tank; 210. Main circulation pump; 220. Two-stage filter; 230. Expansion tank; 300. Deionization unit; 410. Main pipeline; 420. Branch pipeline; 430. Manifold pipeline; 440. Return water pipeline; 500. Water-cooled plate; 510. Mounting base; 511. Base plate; 5111. First mounting hole; 512. End plate; 513. Side plate; 514. First bending plate; 5141. Mounting port; 515. Through port; 516. First cooling channel; 5161 5162. Semi-circular cavity; 517. Swirling flow channel; 518. Second cooling channel; 519. First partition cavity; 510. Second partition cavity; 5191. Cross intersection; 5192. Flow guide; 520. Cover plate; 521. Top plate; 522. Second curved plate; 523. Backing plate; 5231. Second mounting hole; 5232. Cutout; 524. Positioning block; 5241. Slot; 5242. Through slot; 5243. Spacing slot; 600. External heat sink; 700. Electric heater. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] The following is combined Figures 1 to 7 The present invention describes an intelligent water-cooling device and control system for SVG power modules.

[0022] like Figures 1 to 2As shown, in one embodiment, an intelligent water-cooling device for an SVG power module includes a high-level water tank 100, a main circulation pump 210, a dual-stage filter 220, a deionizer 300, an external radiator 600, and an electric heater 700, which are arranged in sequence and connected by pipelines in sequence. An expansion tank 230 is arranged in parallel between the main circulation pump 210 and the dual-stage filter 220. A main pipeline 410, a branch pipeline 420, and a manifold 430 are connected in sequence between the deionizer 300 and the external radiator 600. A water-cooled plate 500 is attached to the SVG power module. The branch pipeline 420 passes through the water-cooled plate 500. The external radiator 600 and the electric heater 700 are connected by a return water pipeline 440.

[0023] The aforementioned intelligent water-cooling device for SVG power modules effectively removes impurities and ions from the cooling water through a multi-stage water treatment structure involving filtration and deionization, preventing pipe blockage and corrosion and ensuring long-term stable operation of the cooling system. The expansion tank 230, in conjunction with the high-level water tank 100, provides dual protection for stable pipe pressure, reducing leakage risks and improving system reliability. The external radiator 600 and electric heater 700 work together to efficiently dissipate heat and prevent icing in low-temperature environments, making the system adaptable to different ambient temperatures and applicable to a wide range of conditions. The overall piping and water-cooled plate assembly structure is simple, with a clear cooling water circulation path, high heat exchange efficiency, and precise matching of the SVG power module's heat dissipation requirements, while also facilitating installation and maintenance.

[0024] like Figure 2 As shown, in one embodiment, the water-cooled plate 500 includes a mounting base 510 and a cover plate 520; the bottom surface of the mounting base 510 is attached to the SVG power module, and a first cooling channel 516 is provided inside the mounting base 510. The two ends of the first cooling channel 516 respectively pass through the two ends of the mounting base 510. The other side of the mounting base 510 is set as an open structure. The cover plate 520 is installed at one end of the open structure of the mounting base 510 to close the first cooling channel 516. The branch pipe 420 is connected to the two ends of the first cooling channel 516.

[0025] Specifically, the bottom surface of the mounting base 510 is attached to the SVG power module to achieve heat conduction, the internal first cooling channel 516 provides a flow path for cooling water, the cover plate 520 closes the open structure of the mounting base 510, allowing the cooling water to flow in a directional manner within the channel, and the branch pipe 420 is connected to both ends of the channel to form a cooling water circulation loop.

[0026] The cooling channel is reliably sealed to prevent cooling water leakage; the mounting base 510 is directly attached to the SVG power module, shortening the heat conduction path and improving heat exchange efficiency; the detachable structure of the cover plate 520 and the mounting base 510 facilitates the cleaning and maintenance of the cooling channel in the future.

[0027] In one embodiment, the upper surface of the cover plate 520 is provided with a plurality of slots 5241, the slots 5241 being oriented in the same direction as the first cooling channel 516, and the slots 5241 being used to pass through other branch pipes 420.

[0028] Specifically, the slot 5241 on the cover plate 520 is aligned with the first cooling channel 516, providing dedicated space for additional branch pipes 420 to pass through, so that multiple branch pipes 420 can be neatly arranged in the same direction.

[0029] The layout of the multi-branch pipe 420 has been optimized to avoid pipe entanglement and crossing, saving installation space; it also serves to limit the branch pipe 420, improving the regularity and stability of the pipe layout and reducing the risk of pipe wear.

[0030] In one embodiment, the mounting base 510 includes a base plate 511, an end plate 512, a side plate 513, and a first bent plate 514. The two end plates 512 are located at both ends of the upper surface of the base plate 511, and the two side plates 513 are located on both sides of the upper surface of the base plate 511. The height of the end plate 512 is greater than the height of the side plate 513. One end of the end plate 512 and one end of the side plate 513 are connected by the first bent plate 514. The first bent plate 514 bends toward the center of the base plate 511, and the first bent plate 514 and the base plate 511 form a mounting opening 5141.

[0031] Specifically, the base plate 511, end plate 512, and side plate 513 constitute the main frame of the fixed seat 510. The end plate 512 and the side plate 513 are connected by the first bent plate 514 to form a closed profile. The mounting opening 5141 formed by the first bent plate 514 and the base plate 511 provides an assembly positioning reference for the cover plate 520.

[0032] The mounting bracket 510 has a stable overall structure and strong load-bearing capacity, and can fit tightly against the SVG power module while maintaining structural integrity; the design of the mounting port 5141 provides precise positioning for the assembly of the cover plate 520, improving assembly efficiency and connection reliability.

[0033] In one embodiment, the cover plate 520 includes a top plate 521, a second bent plate 522, and abutment plate 523; the bottom plate 511 is attached to the top surface of the side plate 513 and is located between the two end plates 512; the second bent plate 522 is disposed at the corner of the top plate 521; the outer surface of the second bent plate 522 is attached to the inner surface of the first bent plate 514; the abutment plate 523 is disposed on the inner surface of the second bent plate 522; the bottom surface of the abutment plate 523 abuts against the bottom surface of the mounting opening 5141; a cut 5232 is provided on one side of the connection between the abutment plate 523 and the second bent plate 522; a first mounting hole 5111 and a second mounting hole 5231 are respectively provided on the mounting opening 5141 and the abutment plate 523; the central axes of the first mounting hole 5111 and the second mounting hole 5231 coincide.

[0034] Specifically, the top plate 521 fits against the top surface of the side plate 513 to form a closed structure. The fit between the second bent plate 522 and the first bent plate 514 and the abutment plate 523 abuts against the mounting port 5141, so as to achieve precise alignment between the cover plate 520 and the fixing seat 510. The fixed connection is completed through the coaxial mounting hole, and the cutout 5232 is adapted to the assembly space.

[0035] The assembly precision and sealing performance of the cover plate 520 and the mounting base 510 are greatly improved, further preventing cooling water leakage; the connection structure is robust and can withstand the pressure impact during the cooling water circulation process, extending the service life of the water-cooled plate 500.

[0036] In one embodiment, the end plate 512 has a through opening 515 at its center. The first cooling channel 516 includes two semi-circular cavities 5161 and two spiral flow channels 5162. The flat ends of the two semi-circular cavities 5161 are respectively opposite to the two through openings 515 and are connected to the through openings 515. The two spiral flow channels 5162 are symmetrically arranged between the two semi-circular cavities 5161, and the ends of the spiral flow channels 5162 are connected to one side of the arc end of the semi-circular cavity 5161. A second cooling channel 517 is also provided on one side of the first cooling channel 516. The second cooling channel 517 is arranged close to the end plate 512, the first bent plate 514 and the side plate 513, and the two ends of the second cooling channel 517 are respectively connected to the two semi-circular cavities 5161.

[0037] Specifically, after the cooling water enters the semi-circular cavity 5161 through the through-hole 515, it flows into the symmetrically arranged spiral flow channel 5162 and the second cooling channel 517 that is close to the inner wall of the fixed base 510, forming a multi-path cooling circuit that fully covers the internal area of ​​the fixed base 510.

[0038] The cooling channels have a wide coverage area, which can evenly remove heat from different areas of the SVG power module and avoid local overheating; the multi-path design improves the efficiency of cooling water flow and further enhances the heat dissipation effect.

[0039] like Figures 3 to 5 As shown, in one embodiment, a first partition cavity is provided between the first cooling channel 516 and the second cooling channel 517, and a second partition cavity 519 is provided between the two spiral flow channels 5162. The second partition cavity 519 includes a cross-shaped portion 5191 and a guide portion 5192. The guide portion 5192 is located near one end of the semi-circular cavity 5161, and the arc-shaped protrusion of the guide portion 5192 can guide the cooling water entering the semi-circular cavity 5161 so that it enters the two spiral flow channels 5162 respectively. The cross-shaped portion 5191 is located between the two guide portions 5192.

[0040] Specifically, the first partition cavity 518 separates the first and second cooling channels 517 to avoid heat interference between the two channels; the guide section 5192 of the second partition cavity 519 guides the cooling water to be evenly distributed to the two swirling flow channels 5162, and the cross section 5191 optimizes the flow field distribution to make the water flow smoother.

[0041] Ensure the independent heat dissipation of each cooling channel and improve the uniformity of heat dissipation; the guide section 5192 realizes the rational distribution of cooling water, avoids local water flow blockage, improves circulation efficiency, and further optimizes the heat dissipation effect.

[0042] like Figure 6 and Figure 7 As shown, in one embodiment, a plurality of positioning blocks 524 are spaced apart on the upper surface of the top plate 521. The lower half of the positioning block 524 is a rectangular structure and the upper half of the positioning block 524 is a semi-circular structure. The slot 5241 is arranged along the length direction of the positioning block 524 and passes through both ends of the positioning block 524. The slot 5241 is arranged in a circular columnar structure, and the central axis of the slot 5241 coincides with the central axis of one end of the semi-circular structure of the positioning block 524.

[0043] Specifically, positioning blocks 524 are spaced apart on the top plate 521, and their slots 5241 are circular columnar structures that fit the shape of the branch pipes 420. The corresponding design of the central axis ensures that the pipe running direction is consistent with the cooling channel.

[0044] The positioning block 524 provides precise positioning and stable support for the branch pipe 420, preventing the pipe from shifting or shaking during operation; the structural design of the positioning block 524 is adapted to the pipe installation requirements, improving the regularity of the pipe layout.

[0045] In one embodiment, a through groove 5242 is provided on the inner surface of the slot 5241 away from the top plate 521. The through groove 5242 is used for the branch pipe 420 to be inserted. Multiple interval grooves 5243 are provided on both sides of the end of the positioning block 524 connected to the top plate 521. The multiple interval grooves 5243 are spaced apart along the length direction of the positioning block 524.

[0046] Specifically, the through groove 5242 provides a convenient insertion path for the branch pipe 420 without complicated assembly operations; the spacer groove 5243 optimizes the connection compatibility between the positioning block 524 and the top plate 521, while reserving a certain adjustment space for pipe installation.

[0047] The installation and disassembly process of the branch pipe 420 is simplified, improving the convenience of maintenance; the spacer groove 5243 enhances the structural flexibility of the positioning block 524, enabling it to better adapt to different installation scenarios and improve the overall adaptability of the device.

[0048] In one embodiment, an intelligent water-cooling control system for an SVG power module, applied to the intelligent water-cooling device for an SVG power module according to any of the above embodiments, includes the following steps: The elevated water tank 100 stores cooling water and provides a stable initial water pressure, while the expansion tank 230 simultaneously maintains stable pressure inside the pipeline. The main circulation pump 210 draws and pressurizes the cooling water. After impurities are removed by the dual-stage filter 220 and the water quality is purified by the deionizer 300, the clean cooling water flows through the main pipeline 410 and the branch pipeline 420 through the water-cooled plate 500 that has absorbed the heat of the SVG power module. After absorbing heat, the hot water is collected through the manifold 430 and flows into the external radiator 600 for heat dissipation. The cooled water flows through the electric heater 700, which starts heating as needed to prevent the pipes from freezing. The treated cooling water flows back to the high-level water tank 100 to complete the circulation.

[0049] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A smart water-cooling device for SVG power modules, characterized in that, The system includes a high-level water tank, a main circulation pump, a dual-stage filter, a deionizer, an external radiator, and an electric heater, arranged in sequence and connected by pipelines. An expansion tank is connected in parallel between the main circulation pump and the dual-stage filter. A main pipeline, a branch pipeline, and a manifold are connected in sequence between the deionizer and the external radiator. A water-cooled plate is attached to the SVG power module. The branch pipeline passes through the water-cooled plate. The external radiator and the electric heater are connected by a return water pipeline.

2. The intelligent water-cooling device for SVG power modules according to claim 1, characterized in that, The water-cooled plate includes a mounting base and a cover plate. The bottom surface of the mounting base is attached to the SVG power module. A first cooling channel is provided inside the mounting base. The two ends of the first cooling channel pass through the two ends of the mounting base respectively. The other side of the mounting base is set as an open structure. The cover plate is installed at one end of the open structure of the mounting base to close the first cooling channel. The branch pipe is connected to both ends of the first cooling channel.

3. The intelligent water-cooling device for SVG power modules according to claim 2, characterized in that, The upper surface of the cover plate is provided with multiple slots, the orientation of which is the same as that of the first cooling channel, and the slots are used to pass through other branch pipes.

4. The intelligent water-cooling device for SVG power modules according to claim 3, characterized in that, The fixing base includes a base plate, end plates, side plates, and a first bent plate; the two end plates are located at both ends of the upper surface of the base plate, and the two side plates are located on both sides of the upper surface of the base plate. The height of the end plates is greater than the height of the side plates. One end of the end plate and one end of the side plate are connected by the first bent plate. The first bent plate is bent towards the center of the base plate, and the first bent plate and the base plate form a mounting opening.

5. The intelligent water-cooling device for SVG power modules according to claim 4, characterized in that, The cover plate includes a top plate, a second bent plate, and a stop plate; the bottom plate is attached to the top surface of the side plate and located between the two end plates; the second bent plate is disposed at the corner of the top plate, the outer surface of the second bent plate is attached to the inner surface of the first bent plate; the stop plate is disposed on the inner surface of the second bent plate, the bottom surface of the stop plate abuts against the bottom surface of the mounting opening; a cut is provided on one side of the connection between the stop plate and the second bent plate; a first mounting hole and a second mounting hole are respectively provided on the mounting opening and the stop plate, and the central axes of the first mounting hole and the second mounting hole coincide.

6. The intelligent water-cooling device for SVG power modules according to claim 5, characterized in that, The end plate has a through opening at its center. The first cooling channel includes two semi-circular cavities and two spiral flow channels. The planar ends of the two semi-circular cavities are respectively opposite to the two through openings and are connected to the through openings. The two spiral flow channels are symmetrically arranged between the two semi-circular cavities, and the ends of the spiral flow channels are connected to one side of the arc end of the semi-circular cavity. A second cooling channel is also provided on one side of the first cooling channel. The second cooling channel is arranged close to the end plate, the first curved plate and the side plate, and the two ends of the second cooling channel are respectively connected to the two semi-circular cavities.

7. The intelligent water-cooling device for SVG power modules according to claim 6, characterized in that, A first partition cavity is provided between the first cooling channel and the second cooling channel, and a second partition cavity is provided between the two spiral flow channels. The second partition cavity includes a cross-shaped part and a flow guide part. The flow guide part is located at one end close to the semi-circular cavity, and the arc-shaped protrusion of the flow guide part can guide the cooling water entering the semi-circular cavity so that it enters the two spiral flow channels respectively. The cross-shaped part is located between the two flow guide parts.

8. The intelligent water-cooling device for SVG power modules according to claim 7, characterized in that, Multiple positioning blocks are spaced apart on the upper surface of the top plate. The lower half of the positioning block is rectangular and the upper half is semi-circular. The slot is arranged along the length of the positioning block and passes through both ends of the positioning block. The slot is arranged in a circular columnar structure, and the central axis of the slot coincides with the central axis of one end of the semi-circular structure of the positioning block.

9. The intelligent water-cooling device for SVG power modules according to claim 8, characterized in that, A through groove is provided on the inner surface of the slot away from the top plate. The through groove is used for branch pipes to be inserted. Multiple spaced grooves are provided on both sides of the end of the positioning block connected to the top plate. The multiple spaced grooves are spaced apart along the length direction of the positioning block.

10. An intelligent water-cooling control system for an SVG power module, applied to the intelligent water-cooling device for an SVG power module as described in any one of claims 1 to 9, characterized in that, include: The elevated water tank stores cooling water and provides a stable initial water pressure, while the expansion tank simultaneously maintains stable pressure inside the pipeline. The main circulation pump draws and pressurizes the cooling water. After impurities are removed by a two-stage filter and the water is purified by a deionization device, the clean cooling water flows through the main pipeline and branch pipelines through the water-cooled plate that has absorbed the heat of the SVG power module. After absorbing heat, the hot water is collected through the manifold and flows into the external radiator for heat dissipation. The cooled water flows through the electric heater, which is activated as needed to prevent the pipes from freezing. The treated cooling water flows back to the high-level water tank to complete the circulation.