Electronic device

Abstract

The invention discloses an electronic device which comprises a first substrate, a circuit layer, at least one electronic unit, a second substrate, a reflecting layer and an optical layer. The circuit layer is arranged on the first substrate; the electronic unit is arranged on the first substrate and is electrically connected with the circuit layer; the second substrate is arranged opposite to the first substrate and comprises at least one light-transmitting area and at least one light-reflecting area, the light-transmitting area is adjacent to the light-reflecting area, and the light-transmitting area is arranged corresponding to the electronic unit; the reflecting layer is arranged on the side, close to the first substrate, of the second substrate and corresponds to the light reflecting area. The optical layer is arranged between the second substrate and the electronic unit and at least corresponds to the light-transmitting area.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to a micro light-emitting diode (micro LED) mirror display device. Background Technology

[0002] With the development of digital technology, display devices have been widely used in all aspects of daily life, such as modern information products like televisions, computers, and mobile phones. Among common display devices, micro LED displays are currently one of the mainstream products. In addition, display devices with a mirror effect have emerged and gradually become popular in recent years, but the mirror image of micro LED mirror displays may produce grainy color shifts. Summary of the Invention

[0003] The present invention provides an electronic device that can effectively reduce the intensity of reflected light with color shift at the locations of light-emitting diodes and traces, thereby improving the grainy color shift phenomenon in mirror images.

[0004] An electronic device according to the present invention includes a first substrate, a circuit layer, at least one electronic unit, a second substrate, a reflective layer, and an optical layer. The circuit layer is disposed on the first substrate; the electronic unit is disposed on the first substrate and electrically connected to the circuit layer; the second substrate is disposed relative to the first substrate and includes at least one light-transmitting area and at least one reflective area, the light-transmitting area being adjacent to the reflective area and corresponding to the electronic unit; the reflective layer is disposed on the side of the second substrate adjacent to the first substrate and corresponding to the reflective area; the optical layer is disposed between the second substrate and the electronic unit and at least corresponding to the light-transmitting area.

[0005] An electronic device according to the present invention includes a first substrate, a circuit layer, at least one electronic unit, a second substrate, a reflective layer, and a reflective enhancement layer. The circuit layer is disposed on the first substrate; the electronic unit is disposed on the first substrate and electrically connected to the circuit layer; the second substrate is disposed relative to the first substrate and includes at least one light-transmitting area and at least one reflective area, the light-transmitting area being adjacent to the reflective area and corresponding to the electronic unit; the reflective layer is disposed on the side of the second substrate adjacent to the first substrate and corresponding to the reflective area; the reflective enhancement layer is disposed on the side of the second substrate away from the first substrate for at least reflecting a portion of ambient light. Attached Figure Description

[0006] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings, wherein:

[0007] Figure 1 This is a cross-sectional schematic diagram of the electronic device according to the first embodiment of the present invention.

[0008] Figures 2A to 2E and Figures 3A to 3D This is a cross-sectional schematic diagram of an electronic device in different embodiments of the first embodiment of the present invention.

[0009] Figure 4 This is a cross-sectional schematic diagram of an electronic device according to a second embodiment of the present invention.

[0010] Figures 5A to 5D This is a cross-sectional schematic diagram of an electronic device in different embodiments of the second embodiment of the present invention.

[0011] Figures 6A to 6D This is a cross-sectional schematic diagram of an electronic device in different embodiments of the third embodiment of the present invention.

[0012] Figure 7 This is a cross-sectional schematic diagram of an electronic device according to the fourth embodiment of the present invention.

[0013] Figure 8 This is a cross-sectional schematic diagram of an electronic device according to the fifth embodiment of the present invention.

[0014] Figure 9A and 9B This is a cross-sectional schematic diagram of an electronic device of a different form according to the sixth embodiment of the present invention.

[0015] Figure 10 This is a cross-sectional schematic diagram of an electronic device according to the seventh embodiment of the present invention. Detailed Implementation

[0016] The following description, with reference to the accompanying drawings, will illustrate an electronic device according to a preferred embodiment of the present invention, wherein the same components will be described using the same reference numerals. It should be understood that the following description provides many different embodiments for implementing various embodiments of the present invention. The specific components and arrangements described below are merely for the simple and clear description of some embodiments of the present invention. Of course, these various embodiments are only illustrative and not intended to limit the scope of the present invention. Furthermore, repeated reference numerals or designations may be used in different embodiments; these repetitions are only for the simple and clear description of some embodiments of the present invention and do not represent any association between the different embodiments and / or structures discussed. Moreover, when it is mentioned that a component is located on or above another component, this includes a situation where one component is in direct contact with another component; or, it may also include a situation where one or more other components are spaced apart, in which case one component may not be in direct contact with another component.

[0017] Furthermore, relative terms such as "lower" or "bottom" and "higher" or "top" may be used in the embodiments to describe the relative relationship of one component of the figures to another component. It is understood that if the apparatus in the figures is flipped so that it is upside down, the component described as being on the "lower" side will become the component on the "higher" side.

[0018] Here, the terms "about," "approximately," and "roughly" generally indicate within 20% of a given value or range, preferably within 10%, and even more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5%. The quantities given here are approximate quantities, meaning that the meaning of "about," "approximately," and "roughly" may be implied even without specific mention of them.

[0019] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, constituent parts, regions, layers, and / or portions, these components, constituent parts, regions, layers, and / or portions should not be limited by these terms, and these terms are only used to distinguish different components, constituent parts, regions, layers, and / or portions. Therefore, a first component, constituent part, region, layer, and / or portion discussed below may be referred to as a second component, constituent part, region, layer, and / or portion without departing from the teachings of some embodiments of the present invention.

[0020] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant art and this invention, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of the invention.

[0021] Some embodiments of the present invention can be used in conjunction with the appendix. Figure 1 It should be understood that the accompanying drawings of the embodiments of the present invention are also considered part of the description of the embodiments of the present invention. It should be understood that the drawings of the embodiments of the present invention are not shown to scale of the actual devices and components. The shape and thickness of the embodiments may be exaggerated in the drawings to clearly illustrate the features of the embodiments of the present invention. Furthermore, the structures and devices in the drawings are shown schematically to clearly illustrate the features of the embodiments of the present invention.

[0022] In some embodiments of the present invention, relative terms such as "down," "up," "parallel," "vertical," "below," "above," "top," "bottom," etc., should be understood as the orientation shown in the paragraph and related drawings. These relative terms are for illustrative purposes only and do not imply that the described device must be manufactured or operated in a specific orientation. Terms related to joining or connecting, such as "connected" or "linked," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact but with another structure disposed between them. Furthermore, these terms related to joining or connecting may also include cases where both structures are movable or both structures are fixed.

[0023] Please refer to Figure 1 As shown, Figure 1 This is a cross-sectional schematic diagram of the electronic device 10 according to the first embodiment of the present invention.

[0024] In this embodiment, the electronic device 10 can be, for example, a mirror display device, particularly a miniature light-emitting diode mirror display device; for example, Figure 1 For example, a cross-sectional view of a pixel range of the display electronic device 10 is defined as a plane formed by a first direction X and a second direction Y.

[0025] like Figure 1 As shown, the electronic device 10 includes a first substrate 11, a circuit layer 12, at least one electronic unit 13, a second substrate 14, a reflective layer 15, an optical layer 16, and an interposer layer 17.

[0026] The first substrate 11 may include, but is not limited to, transparent or opaque organic and / or inorganic materials, which may include rigid or flexible materials. Organic materials may include polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), other known suitable materials, or combinations thereof, but are not limited thereto. Inorganic materials may include glass, quartz, sapphire, or ceramic, but are not limited thereto. In this embodiment, the first substrate 11 is exemplified by glass; that is, the first substrate 11 is a glass substrate.

[0027] A circuit layer 12 is disposed on a first substrate 11 along a first direction X. The circuit layer 12 may include various passive and / or active components, such as resistors, capacitors, inductors, diodes, MOSFETs, CMOS transistors, BJTs, laterally diffused MOSFETs, high-power MOSFETs, thin-film transistors (TFTs), or other types of transistors. Furthermore, the first substrate 11 and the circuit layer 12 may together constitute a driving substrate for driving the electronic unit 13, such as a CMOS substrate, a liquid crystal on silicon (LCOS) substrate, a thin-film transistor substrate, or other circuit substrates with operating circuitry; this invention is not limited thereto. In this embodiment, the first substrate 11 and the circuit layer 12, for example, constitute a thin-film transistor substrate. It should be noted that the above description is merely illustrative and not intended to limit the scope of the invention.

[0028] Electronic unit 13 is disposed on the first substrate 11 and electrically connected to the circuit layer 12. In this embodiment, electronic unit 13 may be disposed directly on the circuit layer 12 and electrically connected to the circuit layer 12, for example. In one embodiment, electronic unit 13 may be, for example, but not limited to, a light-emitting unit. In this case, a unit definition layer 130 may be formed on the circuit layer 12, which may be, for example, a negative photoresist and has a plurality of accommodating spaces opened along the second direction Y. Each electronic unit 13 (light-emitting unit) may include, for example, three light-emitting components 131, 132, and 133, which are respectively disposed in the accommodating spaces of the unit definition layer 130. In other embodiments, each electronic unit 13 may include any suitable active or passive component. For example, each light-emitting component 131, 132, and 133 may include, for example, an organic light-emitting diode (OLED), an inorganic light-emitting diode (LED) (e.g., a mini LED, a micro LED), or a quantum dot light-emitting diode (QLED), but the present invention is not limited thereto. In this embodiment, the three light-emitting components 131, 132, and 133 can be, for example, a red micro-light-emitting diode, a green micro-light-emitting diode, and a blue micro-light-emitting diode, respectively. The above description is merely illustrative and is not intended to limit the scope of the invention.

[0029] The second substrate 14 is disposed relative to the first substrate 11 and includes at least one light-transmitting area 141 and at least one reflective area 142, with the light-transmitting area 141 adjacent to the reflective area 142. In this embodiment, the second substrate 14 includes a plurality of light-transmitting areas 141 and a plurality of reflective areas 142, which are adjacent and staggered, and the plurality of light-transmitting areas 141 correspond to a plurality of light-emitting components 131, 132, and 133 of the electronic unit 13. The second substrate 14 may be, for example, but not limited to, a transparent substrate, such as a glass substrate. Furthermore, the width of the light-transmitting area 141 may be equal to, slightly greater than, or slightly smaller than the width of the corresponding electronic unit 13; this invention does not limit this.

[0030] The reflective layer 15 is disposed on the side of the second substrate 14 adjacent to the first substrate 11 and corresponding to the reflective area 142. In this embodiment, a reflective material layer can be formed on one side of the second substrate 14 first, and then the portion of the reflective material layer corresponding to the plurality of light-transmitting areas 141 can be removed, leaving the portion corresponding to the plurality of reflective areas 142, thereby forming the reflective layer 15. The reflective layer 15 can be made of a single metal layer, a composite metal layer, a multilayer film material, or other suitable material layers. The single metal layer can include, for example, silver or aluminum. The composite metal layer can include, for example, a composite structure of metals or metal oxides, such as, but not limited to, indium tin oxide / silver / indium tin oxide (ITO / Ag / ITO), silver / indium tin oxide (Ag / ITO), aluminum / silver / aluminum (Al / Ag / Al), silver / aluminum (Ag / Al), etc. The multilayer film material can include, for example, a multilayer film with at least three overlapping layers of high and low refractive indices, wherein the low refractive index material can be, for example, silicon oxide (SiOx), and the high refractive index material can be, for example, silicon nitride (SiNx), niobium oxide (Nb2O5), etc., but the present invention is not limited thereto.

[0031] An optical layer 16 is disposed between the second substrate 14 and the electronic unit 13, and is disposed at least corresponding to the light-transmitting area 141; an intermediary layer 17 is disposed between the first substrate 11 and the second substrate 14. In this embodiment, as... Figure 1 As shown, the optical layer 16 is disposed on the intermediate layer 17 along the first direction X, that is, the optical layer 16 is located relatively close to the second substrate 14, while the intermediate layer 17 is located relatively close to the first substrate 11.

[0032] The optical layer 16 is mainly used to scatter, polarize, and refract incident ambient light, effectively reducing the intensity of reflected light with color shift corresponding to the electronic unit 13 and the circuit layer 12, thereby improving the grainy color shift phenomenon of the mirror image. For example, the optical layer 16 may include scattering particles, a circular polarizer, a low-refractive-index material containing scattering microstructures, or a microlens structure with a high refractive index.

[0033] Intermediate layer 17 can be, for example, but not limited to, an air medium, an optically transparent adhesive (OCA), or an optically transparent resin (OCR), etc., and is not limited thereto in this invention. In one embodiment, when manufacturing electronic device 10, circuit layer 12 and electronic unit 13 can be disposed on first substrate 11, and reflective layer 15 and optical layer 16 can be disposed on second substrate 14. Then, sealant can be used to bond the structure on first substrate 11 and the structure on second substrate 14. In this case, intermediate layer 17 can be, for example, an air medium. In another embodiment, an adhesive material layer can be used to bond the structure on first substrate 11 and the structure on second substrate 14. The adhesive material layer can be, for example, an optically transparent adhesive or an optically transparent resin. In this case, intermediate layer 17 can be, for example, a film layer including optically transparent adhesive or optically transparent resin.

[0034] In addition, the electronic device 10 may also include a light-absorbing layer 18 disposed between the reflective layer 15 and the interlayer 17. For example... Figure 1 As shown, the light-absorbing layer 18 is disposed adjacent to the side of the reflective layer 15 away from the second substrate 14, and is disposed corresponding to the reflective layer 15. The light-absorbing layer 18 may be, for example, but not limited to, a black photoresist layer, which may form a black matrix layer (BM).

[0035] like Figure 1 As shown, when ambient light L2 is incident from the reflective area 142 of the second substrate 14, it will be reflected by the reflective layer 15 located below the reflective area 142. In addition, when ambient light L1 is incident from the light-transmitting area 141 of the second substrate 14, it will first pass through the optical layer 16 and then be reflected by the electronic unit 13 (or the trace of the circuit layer 12) located below the light-transmitting area 141. This reflected light will be color-shifted due to the electronic unit 13. At this time, by means of the scattering, polarization, and refraction of ambient light L1 by the optical layer 16, the intensity of reflected light of ambient light L1 can be effectively reduced, thereby improving the grainy color shift phenomenon of the mirror image.

[0036] The following description, in conjunction with the accompanying drawings, illustrates the forms of the optical layer 16 with different materials and configurations in this embodiment.

[0037] Figures 2A to 2E This is a cross-sectional schematic diagram of an electronic device in different embodiments of the first embodiment of the present invention, wherein the optical layer 16 is, for example, a circular polarizer.

[0038] like Figure 2A The configuration and connection relationships of the components of the electronic device 10a shown are as follows: Figure 1The components of the electronic device 10 shown are configured and connected in a generally similar manner. The difference lies in that the optical layer 16 of the electronic device 10a employs a circular polarizer 16a. The circular polarizer 16a can eliminate ambient light L1 by polarizing it, effectively reducing the intensity of reflected light from ambient light L1 and thus improving the grainy color shift phenomenon in the mirror image. In this embodiment, the circular polarizer 16a can be formed on the second substrate 14, the reflective layer 15, and the light-absorbing layer 18 using a coating process. It can then be patterned using laser etching, photolithography, or other processes to form the circular polarizer 16a. The thickness of the circular polarizer 16a is, for example, but not limited to, between 1 μm and 20 μm. The material of the circular polarizer 16a can, for example, comprise a stack of lyotropic liquid crystals, a mixture of lyotropic liquid crystals and dichroic dyes, which can, for example, form a phase retardation layer and a linear polarization layer. The above description is merely illustrative and is not intended to limit the scope of the invention.

[0039] like Figure 2B The configuration and connection relationships of the components of the electronic device 10b shown are as follows: Figure 2A The components of the electronic device 10a shown are configured and connected in a generally similar manner. The difference between the two is that in the electronic device 10b, the circular polarizer 16b is disposed below the second substrate 14 and the reflective layer 15, while the light-absorbing layer 18 is disposed below the circular polarizer 16b, that is, the circular polarizer 16b is disposed between the reflective layer 15 and the light-absorbing layer 18.

[0040] like Figure 2C The configuration and connection relationships of the components of the electronic device 10c shown are as follows: Figure 2A The components of the illustrated electronic device 10a are configured and connected in a generally similar manner. The difference lies in that, in electronic device 10c, the circular polarizer 16c is disposed below the second substrate 14 and located between adjacent sets of reflective layers 15 and light-absorbing layers 18. In one embodiment, the circular polarizer 16c does not extend below the light-absorbing layer 18. In another embodiment, the circular polarizer 16c extends below a portion of the light-absorbing layer 18.

[0041] like Figure 2D The configuration and connection relationships of the components of the electronic device 10d shown are as follows: Figure 2A The components of the electronic device 10a shown are configured and connected in a similar manner. The difference between the two is that the electronic device 10d does not have a light-absorbing layer 18, and the circular polarizer 16d is disposed below the second substrate 14 and the reflective layer 15.

[0042] like Figure 2E The configuration and connection relationships of the components of the electronic device 10e shown are as follows: Figure 2CThe components of the illustrated electronic device 10c are configured and connected in a generally similar manner. The difference lies in that the electronic device 10e does not have a light-absorbing layer 18, and the circular polarizer 16e is disposed below the second substrate 14 and between adjacent reflective layers 15. In one embodiment, the circular polarizer 16e does not extend below the reflective layers 15. In another embodiment, the circular polarizer 16e extends below a portion of the reflective layers 15.

[0043] Figures 3A to 3D This is a cross-sectional schematic diagram of an electronic device in different embodiments of the first embodiment of the present invention, wherein the optical layer 16 is, for example, a scattering layer.

[0044] like Figure 3A The configuration and connection relationships of the components of the electronic device 10f shown are as follows: Figure 1 The components of the electronic device 10 shown are configured and connected in a generally similar manner. The difference lies in that the optical layer 16 of the electronic device 10f is a scattering layer 16f. The scattering layer 16f scatters ambient light L1, effectively reducing the intensity of reflected light from L1 and thus improving the grainy color shift phenomenon in the mirror image. In this embodiment, the scattering layer 16f can be formed on the second substrate 14, the reflective layer 15, and the light-absorbing layer 18 using a coating process, and then patterned using laser etching, photolithography, or other processes to form the scattering layer 16f. The thickness of the scattering layer 16f is, for example, but not limited to, between 1 μm and 20 μm. The material of the scattering layer 16f can be, for example, a transparent scattering material, which may include, for example, a mixture of titanium dioxide (TiO2) particles, air particles, and polymer resin. The above description is merely illustrative and is not intended to limit the scope of the invention.

[0045] like Figure 3B The configuration and connection relationships of the components of the electronic device 10g shown are as follows: Figure 3A The components of the electronic device 10f shown are configured and connected in a generally similar manner. The difference between the two is that in the electronic device 10g, the scattering layer 16g is disposed below the second substrate 14 and the reflective layer 15, while the light-absorbing layer 18 is disposed below the scattering layer 16g, that is, the scattering layer 16g is disposed between the reflective layer 15 and the light-absorbing layer 18.

[0046] like Figure 3C The configuration and connection relationships of the components of the electronic device 10h shown are as follows: Figure 3AThe components of the illustrated electronic device 10f are configured and connected in a generally similar manner. The difference lies in that, in electronic device 10h, the scattering layer 16h is disposed below the second substrate 14 and located between adjacent sets of reflective layers 15 and light-absorbing layers 18. In one embodiment, the scattering layer 16h does not extend below the light-absorbing layer 18. In another embodiment, the scattering layer 16h extends below a portion of the light-absorbing layer 18.

[0047] like Figure 3D The configuration and connection relationships of the components of the electronic device 10i shown are as follows: Figure 3A The components of the electronic device 10f shown are configured and connected in a generally similar manner. The difference lies in that the electronic device 10i further includes a color filter layer 19, disposed between the light-transmitting area 141 of the second substrate 14 and the scattering layer 16i (optical layer). In a pixel of the electronic device 10i, each color filter layer 19 includes, for example, three color filter components 191, 192, and 193, respectively disposed above each light-emitting component 131, 132, and 133. In this embodiment, the three color filter components 191, 192, and 193 may be, for example, a red filter component, a green filter component, and a blue filter component, respectively, corresponding to a red micro-light-emitting diode, a green micro-light-emitting diode, and a blue micro-light-emitting diode. The above description is merely illustrative and is not intended to limit the scope of the invention. It should be noted that the color filter layer of this embodiment can be applied to any of the aforementioned electronic devices, and the invention is not limited thereto.

[0048] In practice, such as Figure 3D As shown, a circuit layer 12, a unit definition layer 130, and an electronic unit 13 can be formed on the first substrate 11. A reflective layer 15 and a light-absorbing layer 18 are sequentially formed on the reflective area 142 of the second substrate 14. A color filter layer 19 (e.g., including three color filter components 191, 192, and 193) is formed on the light-transmitting area 141 of the second substrate 14. Then, a bank layer 160 is formed on the light-absorbing layer 18. The bank layer 160 is patterned to form multiple accommodating spaces. Then, an optical layer 16 is filled into the multiple accommodating spaces of the bank layer 160. Finally, the structure on the first substrate 11 and the structure on the second substrate 14 are bonded together using a frame adhesive or an adhesive material layer to form an electronic device 10i.

[0049] Please refer to Figure 4 As shown, Figure 4 This is a cross-sectional schematic diagram of the electronic device 10j according to the second embodiment of the present invention.

[0050] like Figure 4 The configuration and connection relationships of the components of the electronic device 10j shown are as follows: Figure 1The components of the electronic device 10 shown are configured and connected in a largely similar manner. The difference lies in that the optical layer 16 of the electronic device 10j is disposed between the intermediate layer 17 and the electronic unit 13. Figure 4 As shown, when ambient light L2 is incident from the reflective area 142 of the second substrate 14, it will be reflected by the reflective layer 15 located below the reflective area 142. In addition, when ambient light L1 is incident from the light-transmitting area 141 of the second substrate 14, it will first pass through the interposer layer 17 and the optical layer 16, and then be reflected by the electronic unit 13 (or the trace of the circuit layer 12) located below the light-transmitting area 141. This reflected light will produce color shift due to the electronic unit 13. At this time, by means of the scattering, polarization, and refraction of ambient light L1 by the optical layer 16, the intensity of reflected light of ambient light L1 can be effectively reduced, thereby improving the grainy color shift phenomenon of the mirror image.

[0051] The following description, in conjunction with the accompanying drawings, illustrates the forms of the optical layer 16 with different materials and configurations in this embodiment.

[0052] Figures 5A to 5D This is a cross-sectional schematic diagram of an electronic device in a different embodiment of the second embodiment of the present invention. The optical layer 16 includes, for example, a transparent organic material, whose refractive index may be less than that of the intermediate layer 17. In addition, the optical layer 16 may include multiple air bubbles. Therefore, the optical layer 16 can provide refraction, scattering and other effects on ambient light, and can effectively reduce the intensity of reflected ambient light.

[0053] like Figure 5A The configuration and connection relationships of the components of the electronic device 10k shown are as follows: Figure 4 The components of the electronic device 10j shown are configured and connected in a generally similar manner. The difference lies in that the optical layer 16 of the electronic device 10k is made of a low-refractive-index material layer 16k. The refractive index of the low-refractive-index material layer 16k is relatively lower than that of the intermediate layer 17. For example, the refractive index of the low-refractive-index material layer 16k may be between 1.0 and 1.5, such as 1.3, while the refractive index of the intermediate layer 17 may be 1.5 or higher, for example, which is not limited in this invention. Therefore, the low-refractive-index material layer 16k can provide a refractive effect on ambient light, thereby reducing the component of color-distorted reflected light emitted outward by the traces of the electronic unit 13 or the circuit layer 12, thereby reducing the intensity of reflected ambient light.

[0054] As described above, the low-refractive-index material layer 16k can be, for example, a material containing a mixture of air particles (bubbles) and polymer resin (transparent organic material), which can be patterned using a photolithography process, and its thickness can be, for example, but not limited to, between 1 μm and 20 μm. Furthermore, the low-refractive-index material layer 16k can also increase the light extraction efficiency of the underlying electronic unit 13, for example, by at least 10%.

[0055] like Figure 5B The configuration and connection relationships of the components of the electronic device 10l shown are as follows: Figure 5A The components of the electronic device 10k shown are configured and connected in a generally similar manner. The difference lies in that, in the electronic device 10k, the low-refractive-index material layer 16l is disposed in the light-transmitting area 141 and only on the electronic unit 13; that is, the low-refractive-index material layer 16l is not disposed below the light-absorbing layer 18. In another embodiment, the low-refractive-index material layer 16l may extend and be disposed below a portion of the light-absorbing layer 18.

[0056] like Figure 5C The configuration and connection relationships of the components of the electronic device 10m shown are as follows: Figure 5A The components of the electronic device 10k shown are configured and connected in a largely similar manner. The difference lies in that the electronic device 10m further includes a color filter layer 19, disposed between the light-transmitting area 141 of the second substrate 14 and the interposer layer 17. For a detailed description of the color filter layer 19, please refer to... Figure 3D The electronic device 10i shown will not be described in detail here.

[0057] like Figure 5D The configuration and connection relationships of the components of the electronic device 10n shown are as follows: Figure 5B The components of the electronic device 101 shown are configured and connected in a largely similar manner. The difference lies in that the electronic device 10n further includes a color filter layer 19, for example, comprising three color filter components 191, 192, and 193, disposed between the light-transmitting area 141 of the second substrate 14 and the interposer layer 17. For a detailed description of the color filter layer 19, please refer to... Figure 3D The electronic device 10i shown will not be described in detail here.

[0058] Figures 6A to 6D This is a cross-sectional schematic diagram of an electronic device in different embodiments of the third embodiment of the present invention.

[0059] like Figure 6A The configuration and connection relationships of the components of the electronic device 10p shown are as follows: Figure 1The components of the electronic device 10 shown are configured and connected in a generally similar manner. The difference lies in that the optical layer of the electronic device 10p includes at least one microlens structure 16p, and the electronic device 10p further includes a flattening layer 20 disposed between the microlens structure 16p and the second substrate 14, and the flattening layer 20 covers the reflective layer 15 and the light-absorbing layer 18. In one pixel of the electronic device 10p, the electronic device 10p includes, for example, three microlens structures 16p, respectively disposed below the light-transmitting area 141 and above the light-emitting components 131, 132, and 133; the side of the flattening layer 20 away from the second substrate 14 can be, for example, a planarized surface S1, and the plurality of microlens structures 16p are disposed on this planarized surface S1. By using the microlens structure 16p to refract or reflect the ambient light L1, for example, the ambient light L1 can be refracted or reflected to a non-user observation position or absorbed by the light-absorbing layer 18, which can effectively reduce the intensity of reflected light from the ambient light L1, thereby improving the grainy color shift phenomenon of the mirror image.

[0060] In this embodiment, the refractive index of the microlens structure 16p can be designed to be greater than that of the intermediate layer 17 and the leveling layer 20, thereby achieving the aforementioned refraction or total internal reflection effect. Furthermore, on the projection plane perpendicular to the first direction X, the projection of the microlens structure 16p can, for example, at least completely cover the projections of the light-emitting components 131, 132, and 133. That is, the length of the projection of the microlens structure 16p can be greater than or equal to the length of the projections of the light-emitting components 131, 132, and 133, and the width of the projection of the microlens structure 16p can be greater than or equal to the width of the projections of the light-emitting components 131, 132, and 133. In addition, the length or width of the projection of the microlens structure 16p can, for example, be less than the pitch of the light-emitting components 131, 132, and 133 in the length or width direction, meaning that adjacent microlens structures 16p will not overlap. In this embodiment, the thickness of the microlens structure 16p can be, for example, less than or equal to the distance between each light-emitting component 131, 132, 133 and the leveling layer 20, that is, the thickness of the microlens structure 16p can be, for example, less than or equal to the thickness of the interposer layer 17; wherein, the thickness of the microlens structure 16p can be, for example, between 1 μm and 30 μm. It should be noted that the above description is merely an example and is not intended to limit the scope of the present invention.

[0061] like Figure 6B The configuration and connection relationships of the components of the electronic device 10q shown are as follows: Figure 6AThe components of the electronic device 10p shown are configured and connected in a largely similar manner. The difference lies in that the electronic device 10q further includes a color filter layer 19, for example, comprising three color filter components 191, 192, and 193, disposed between the light-transmitting area 141 of the second substrate 14 and the leveling layer 20. For a detailed description of the color filter layer 19, please refer to... Figure 3D The electronic device 10i shown will not be described in detail here.

[0062] like Figure 6C The configuration and connection relationships of the components of the electronic device 10r shown are as follows: Figure 4 The components of the electronic device 10j shown are configured and connected in a generally similar manner. The difference lies in that the optical layer 16 of the electronic device 10r includes at least one microlens structure 16r, and the electronic device 10r further includes a flattening layer 20 disposed between the microlens structure 16r and the first substrate 11, and the flattening layer 20 covers the light-emitting components 131, 132, and 133. In one pixel of the electronic device 10r, the electronic device 10r includes, for example, three microlens structures 16r, respectively disposed below the light-transmitting area 141 and above the light-emitting components 131, 132, and 133; the side of the flattening layer 20 away from the first substrate 11 can be, for example, a planarized surface S1, and the plurality of microlens structures 16r are disposed on this planarized surface S1. In this embodiment, the thickness of the microlens structure 16r can be, for example, less than or equal to the distance between the leveling layer 20 and the light-absorbing layer 18, that is, the thickness of the microlens structure 16r can be, for example, less than or equal to the thickness of the intermediate layer 17; wherein, the thickness of the microlens structure 16r can be, for example, between 1 μm and 30 μm. It should be noted that the above description is only an example and is not intended to limit the scope of the present invention. By means of the refraction or total reflection of ambient light L1 by the microlens structure 16r, for example, the ambient light L1 can be refracted or total reflected to a non-user observation position or absorbed by the light-absorbing layer 18, the intensity of reflected light from ambient light L1 can be effectively reduced, thereby improving the grainy color shift phenomenon of the mirror image.

[0063] like Figure 6D The configuration and connection relationships of the components of the electronic device 10s shown are as follows: Figure 6C The components of the electronic device 10r shown are configured and connected in a generally similar manner. The difference lies in that the electronic device 10r further includes a color filter layer 19, for example, comprising three color filter components 191, 192, and 193, disposed between the light-transmitting area 141 of the second substrate 14 and the interposer layer 17. In this embodiment, the thickness of the microlens structure 16r can, for example, be less than or equal to the distance between the leveling layer 20 and the light-absorbing layer 18 or the color filter layer 19; that is, the thickness of the microlens structure 16r can, for example, be less than or equal to the thickness of the interposer layer 17. A detailed description of the color filter layer 19 can be found in [reference needed]. Figure 3D The electronic device 10i shown will not be described in detail here.

[0064] In other embodiments, each microlens structure 16r may also be directly disposed on the upper surface of the corresponding light-emitting components 131, 132, and 133, which is not limited by the present invention; in this case, the planarized surface S1 of the leveling layer 20 may be coplanar with the upper surface of the light-emitting components 131, 132, and 133, or the leveling layer 20 may be omitted. It should be noted that the above description is only an example and is not intended to limit the scope of the present invention.

[0065] In summary, the electronic device of the present invention includes a first substrate, a circuit layer, an electronic unit, a second substrate, a reflective layer, an optical layer, and an interposer. The circuit layer is disposed on the first substrate; the electronic unit is disposed on the first substrate and electrically connected to the circuit layer; the second substrate is disposed relative to the first substrate and includes adjacent light-transmitting and reflective areas, with the light-transmitting area corresponding to the electronic unit; the reflective layer is disposed on the side of the second substrate adjacent to the first substrate and corresponds to the reflective area; the optical layer is disposed between the second substrate and the electronic unit and at least corresponds to the light-transmitting area; and the interposer is disposed between the first substrate and the second substrate. By utilizing the scattering, polarization, and refraction of incident ambient light by the optical layer, the intensity of reflected light with color shift corresponding to the light-emitting diode and the wiring can be effectively reduced, thereby improving the grainy color shift phenomenon of the mirror image.

[0066] Please refer to Figure 7 As shown, Figure 7 This is a cross-sectional schematic diagram of the electronic device 40 according to the fourth embodiment of the present invention.

[0067] In this embodiment, the electronic device 40 can be, for example, a mirror display device, particularly a miniature light-emitting diode mirror display device; for example, Figure 7 For example, a cross-sectional view of a pixel range of the display electronic device 40 is defined as a plane formed by a first direction X and a second direction Y.

[0068] like Figure 7 As shown, the electronic device 40 includes a first substrate 41, a circuit layer 42, at least one electronic unit 43, a second substrate 44, a reflective layer 45, a reflective enhancement layer 46, and an interposer layer 47.

[0069] The first substrate 41 may include, for example, but not limited to, transparent or opaque organic and / or inorganic materials, which may include rigid materials or flexible soft materials. Organic materials may include polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), other known suitable materials, or combinations thereof, but are not limited thereto. Inorganic materials may include glass, quartz, sapphire, or ceramic, but are not limited thereto. In this embodiment, the first substrate 41 is exemplified by glass, that is, the first substrate 41 is a glass substrate.

[0070] A circuit layer 42 is disposed on a first substrate 41 along a first direction X. The circuit layer 42 may include various passive and / or active components, such as resistors, capacitors, inductors, diodes, MOSFETs, CMOS transistors, BJTs, laterally diffused MOSFETs, high-power MOSFETs, thin-film transistors (TFTs), or other types of transistors. Furthermore, the first substrate 41 and the circuit layer 42 may together constitute a driving substrate for driving the electronic unit 43, such as a CMOS substrate, a liquid crystal on silicon (LCOS) substrate, a thin-film transistor substrate, or other circuit substrates with operating circuitry; this invention is not limited thereto. In this embodiment, the first substrate 41 and the circuit layer 42, for example, constitute a thin-film transistor substrate. It should be noted that the above description is merely illustrative and not intended to limit the scope of the invention.

[0071] Electronic unit 43 is disposed on the first substrate 41 and electrically connected to the circuit layer 42. In this embodiment, electronic unit 43 may be disposed directly on the circuit layer 42 and electrically connected to the circuit layer 42, for example. In one embodiment, electronic unit 43 may be, for example, but not limited to, a light-emitting unit. In this case, a unit definition layer 430 may be formed on the circuit layer 42, which may be, for example, a negative photoresist and has a plurality of accommodating spaces opened along the second direction Y. Each electronic unit 43 (light-emitting unit) may include, for example, three light-emitting components 431, 432, and 433, which are respectively disposed in the accommodating spaces of the unit definition layer 430. In other embodiments, each electronic unit 43 may include any suitable active or passive component. For example, each light-emitting component 431, 432, and 433 may include, for example, an organic light-emitting diode (OLED), an inorganic light-emitting diode (LED) (e.g., a mini LED, a micro LED), or a quantum dot light-emitting diode (QLED), but the present invention is not limited thereto. In this embodiment, the three light-emitting components 431, 432, and 433 can be, for example, a red micro-light-emitting diode, a green micro-light-emitting diode, and a blue micro-light-emitting diode, respectively. The above description is merely illustrative and is not intended to limit the scope of the invention.

[0072] The second substrate 44 is disposed relative to the first substrate 41 and includes at least one light-transmitting area 441 and at least one reflective area 442, with the light-transmitting area 441 adjacent to the reflective area 442. In this embodiment, the second substrate 44 includes multiple light-transmitting areas 441 and multiple reflective areas 442, which are adjacent and staggered, and the multiple light-transmitting areas 441 correspond to multiple light-emitting components 431, 432, and 433 of the electronic unit 43. The second substrate 44 may be, for example, but not limited to, a transparent substrate, such as a glass substrate. Furthermore, the width of the light-transmitting area 441 may be equal to, slightly greater than, or slightly smaller than the width of the corresponding electronic unit 43; this invention does not limit this.

[0073] The reflective layer 45 is disposed on the side of the second substrate 44 adjacent to the first substrate 41 and corresponding to the reflective area 442. In this embodiment, a reflective material layer can be formed on one side of the second substrate 44 first, and then the portion of the reflective material layer corresponding to the plurality of light-transmitting areas 441 can be removed, leaving the portion corresponding to the plurality of reflective areas 442, thereby forming the reflective layer 45. The reflective layer 45 can be made of a single metal layer, a composite layer, a multilayer film material, or other suitable material layers. The single metal layer can include, for example, silver or aluminum. The composite layer can include, for example, a composite structure of metals or metal oxides, such as, but not limited to, indium tin oxide / silver / indium tin oxide (ITO / Ag / ITO), silver / indium tin oxide (Ag / ITO), aluminum / silver / aluminum (Al / Ag / Al), silver / aluminum (Ag / Al), etc. The multilayer film material can include, for example, a multilayer film with at least three overlapping layers of high and low refractive indices, wherein the low refractive index material can be, for example, silicon oxide (SiOx), and the high refractive index material can be, for example, silicon nitride (SiNx), niobium oxide (Nb2O5), etc., but the present invention is not limited thereto.

[0074] A reflective enhancement layer 46 is disposed on the side of the second substrate 44 away from the first substrate 41 to reflect at least a portion of the ambient light. For example, the reflective enhancement layer 46 may be a multilayer thin film comprising at least two materials stacked together, the two materials having different refractive indices, such that the multilayer thin film formed by them has an alternating high and low refractive index configuration, thereby effectively reflecting the first polarized light portion of the incident ambient light and allowing the second polarized light portion of the incident ambient light to pass through; wherein, the two materials comprising the reflective enhancement layer 46 may, for example, include polyethylene naphthalate (PEN) and polyethylene naphthalate copolymer (coPEN), the first polarized light portion may, for example, be S-polarized light (or S-polarized light), and the second polarized light portion may, for example, be P-polarized light (or P-polarized light), the present invention is not limited thereto.

[0075] An interposer layer 47 is disposed between the first substrate 41 and the second substrate 44. In this embodiment, as... Figure 7As shown, the reflective layer 45 is disposed on the lower surface of the second substrate 44 along the first direction X. Therefore, at the location relative to the reflective area 442, the interposer layer 47 is located between the reflective layer 45 and the first substrate 41, while at the location relative to the light-transmitting area 441, the interposer layer 47 is located between the first substrate 41 and the second substrate 44. The interposer layer 47 can be, for example, but not limited to, an air medium, an optically transparent adhesive (OCA), or an optically transparent resin (OCR), etc., and is not limited thereto in this invention. In one embodiment, when manufacturing the electronic device 40, the circuit layer 42 and the electronic unit 43 can be disposed on the first substrate 41, and the reflective layer 45 can be disposed on the second substrate 44. Then, the structure on the first substrate 41 and the structure on the second substrate 44 can be bonded together using a sealant. At this time, the intermediary layer 47 can be, for example, an air medium. The reflective layer 45 is located between the first substrate 41 and the second substrate 44. Finally, the reflective enhancement layer 46 is disposed on the side of the second substrate 44 away from the first substrate 41. In another embodiment, an adhesive material layer can be used to bond the structure on the first substrate 41 and the structure on the second substrate 44. The adhesive material layer can be, for example, an optically transparent adhesive or an optically transparent resin. The adhesive material layer can be cured to form the intermediary layer 47. At this time, the intermediary layer 47 can be, for example, a film layer including optically transparent adhesive or optically transparent resin.

[0076] like Figure 7As shown, one side of the reflective enhancement layer 46 is in direct contact with the second substrate 44, while the other side is in contact with the ambient medium. Therefore, when ambient light L3 and L4 travel in the ambient medium and are incident on the electronic device 40, they first strike the reflective enhancement layer 46. The reflective enhancement layer 46 can reflect a portion of the ambient light L3 and L4, for example, it can reflect the first polarized light portion L31 of ambient light L3 and the first polarized light portion L41 of ambient light L4. The second polarized light portion L32 of ambient light L3 and the second polarized light portion L42 of ambient light L4 can penetrate the reflective enhancement layer 46. Then, the second polarized light portion L42 incident on the reflective area 442 of the second substrate 44 is reflected by the reflective layer 45 located below the reflective area 442. At this time, the first polarized light portion L41 and the second polarized light portion L42 are reflected. Both L42 and L32 do not have color shift. In addition, the second polarized light portion L32 incident on the light-transmitting area 441 of the second substrate 44 first passes through the interposer layer 47 and is then reflected by the electronic unit 43 (or the traces of the circuit layer 42) located below the light-transmitting area 441. This reflected light will have color shift due to the electronic unit 43 (or the traces of the circuit layer 42). At this time, since part of the ambient light L3 (such as the first polarized light portion L31) is directly reflected by the reflection enhancement layer 46, the reflected first polarized light portion L31 does not have color shift. The electronic unit 43 (or the traces of the circuit layer 42) only reflects part of the ambient light L3 (such as the second polarized light portion L32), so the intensity of the color-shifted reflected light (such as the second polarized light portion L32) can be effectively reduced, thereby improving the grainy color shift phenomenon of the mirror image. Furthermore, when the reflection enhancement layer 46 is configured, the total reflectivity of ambient light L4 at the reflective area 442 is greater than the total reflectivity of ambient light at this location when the reflection enhancement layer 46 is not configured, and the total reflectivity of ambient light L3 at the light-transmitting area 441 is greater than the total reflectivity of ambient light at this location when the reflection enhancement layer 46 is not configured.

[0077] Please refer to Figure 8 As shown, Figure 8 This is a cross-sectional schematic diagram of the electronic device 40a according to the fifth embodiment of the present invention.

[0078] like Figure 8 The configuration and connection relationships of the components of the electronic device 40a shown are as follows: Figure 7 The components of the electronic device 40 shown are configured and connected in a generally similar manner. The difference lies in that the electronic device 40a further includes a light-absorbing layer 48, disposed on the side of the reflective layer 45 away from the second substrate 44. Figure 8As shown, the light-absorbing layer 48 is disposed adjacent to the side of the reflective layer 45 away from the second substrate 44, and is disposed corresponding to the reflective layer 45. The light-absorbing layer 48 may be, for example, but not limited to, a black photoresist layer, which may include a black matrix layer (BM), and the width of the light-absorbing layer 48 along the second direction Y may be, for example, slightly greater than, slightly less than, or equal to the width of the opposite reflective layer 45 along the second direction Y, which is not limited in this invention.

[0079] For detailed descriptions of other components of the electronic device 40a, please refer to the foregoing embodiments, and they will not be repeated here.

[0080] Please refer to Figure 9A As shown, Figure 9A This is a cross-sectional schematic diagram of an electronic device 40b according to a sixth embodiment of the present invention.

[0081] like Figure 9A The configuration and connection relationships of the components of the electronic device 40b shown are as follows: Figure 7 The components of the electronic device 40 shown are configured and connected in a generally similar manner. The difference is that in the electronic device 40b, the electronic unit 43 includes a polarized electronic unit. The polarized electronic unit has a microstructure disposed on the side of the polarized electronic unit adjacent to the second substrate 44. In this embodiment, each electronic unit 43 can be, for example, a polarized light-emitting unit, which includes, for example, three polarized light-emitting components 431', 432', and 433', respectively disposed in the accommodating space of the unit definition layer 430. The polarized light-emitting component 431' includes a microstructure 431a, the polarized light-emitting component 432' includes a microstructure 432a, and the polarized light-emitting component 433' includes a microstructure 433a. The multiple microstructures 431a, 432a, and 433a are wire grid structures. The wire grid structure is, for example, a grating structure composed of multiple parallel metal lines. The spacing between two adjacent metal lines along the second direction Y is, for example, between 30nm and 300nm, and the height of each metal line along the first direction X is, for example, between 20nm and 200nm. The material of the metal lines includes, for example, silver and aluminum. The wire grid structure can be formed by patterning a metal material layer using laser etching, photolithography, or other processes. This invention does not limit this.

[0082] In this embodiment, by setting the plurality of microstructures 431a, 432a, and 433a with a wire grid structure, the electronic unit 43 includes, for example, polarized light-emitting components 431', 432', and 433', whose polarization direction can be the same as the polarization direction (e.g., P-polarized light) that the reflective enhancement layer 46 allows to penetrate. This allows the light emitted by the polarized light-emitting components 431', 432', and 433' to penetrate the reflective enhancement layer, thereby ensuring that the intensity of the light emitted by the polarized light-emitting components 431', 432', and 433' hardly decreases when passing through the reflective enhancement layer 46.

[0083] Additionally, please refer to Figure 9B As shown, where Figure 9B This is a cross-sectional schematic diagram of an electronic device 40c according to another embodiment of the sixth embodiment of the present invention.

[0084] like Figure 9B The configuration and connection relationships of the components of the electronic device 40c shown are as follows: Figure 9A The components of the electronic device 40b shown are configured and connected in a generally similar manner. The difference lies in that, in the electronic device 40c, the polarized light-emitting component 431' includes a microstructure 431b, the polarized light-emitting component 432' includes a microstructure 432b, and the polarized light-emitting component 433' includes a microstructure 433b. These multiple microstructures 431b, 432b, and 433b are meta-lens structures. The meta-lens structure is formed, for example, by periodically arranging columnar elements with nanoscale dimensions, wherein the multiple columnar elements can polarize the passing light after being arranged. The meta-lens can be formed, for example, using deep ultraviolet lithography, nanoimprinting, or other suitable processes, and the present invention is not limited thereto.

[0085] For detailed descriptions of other components of electronic devices 40b and 40c, please refer to the foregoing embodiments, and they will not be repeated here.

[0086] Please refer to Figure 10 As shown, Figure 10 This is a cross-sectional schematic diagram of the electronic device 40d according to the seventh embodiment of the present invention.

[0087] like Figure 10 The configuration and connection relationships of the components of the electronic device 40d shown are as follows: Figure 9A The components of the electronic device 40b shown are configured and connected in a largely similar manner. The difference lies in that the electronic device 40d further includes a light-absorbing layer 48, disposed on the side of the reflective layer 45 away from the second substrate 44. Figure 10As shown, the light-absorbing layer 48 is disposed adjacent to the side of the reflective layer 45 away from the second substrate 44, and is disposed corresponding to the reflective layer 45. The light-absorbing layer 48 may be, for example, but not limited to, a black photoresist layer, which may include a black matrix layer (BM), and the width of the light-absorbing layer 48 along the second direction Y may be, for example, slightly greater than, slightly less than, or equal to the width of the opposing reflective layer 45 along the second direction Y; this invention is not limiting. Furthermore, in the electronic device 40d of this embodiment, as shown... Figure 9A The microstructures 431a, 432a, and 433a shown are (i.e., wire grid structures); in other embodiments, they may also employ, as shown in the figure. Figure 9B The microstructures 431b, 432b, and 433b shown (i.e., super-lens structures) are not limited in this invention.

[0088] For detailed descriptions of other components of the electronic device 40d, please refer to the foregoing embodiments, and they will not be repeated here.

[0089] It should be understood that features in several different embodiments can be replaced, recombined, or mixed to complete other embodiments without departing from the spirit of the present invention. For example, the optical layers (including circular polarizers, scattering layers, low refractive index material layers, microlens structures, etc.) of the first, second, and third embodiments can be applied to the fourth to seventh embodiments, while the reflection enhancement layers 46 and / or microstructures 431a, 432a, 433a or 431b, 432b, 433b of the fourth to seventh embodiments can be applied to the first, second, and third embodiments, and the present invention is not limited thereto.

[0090] In summary, the electronic device of the present invention includes a first substrate, a circuit layer, an electronic unit, a second substrate, a reflective layer, and a reflective enhancement layer. The circuit layer is disposed on the first substrate; the electronic unit is disposed on the first substrate and electrically connected to the circuit layer; the second substrate is disposed relative to the first substrate and includes at least one light-transmitting area and at least one reflective area, the light-transmitting area being adjacent to the reflective area and corresponding to the electronic unit; the reflective layer is disposed on the side of the second substrate adjacent to the first substrate and corresponding to the reflective area; the reflective enhancement layer is disposed on the side of the second substrate away from the first substrate, for reflecting at least a portion of ambient light. By reflecting a portion of the ambient light (such as the first polarized light portion) through the reflective enhancement layer, only the remaining portion of the ambient light (such as the second polarized light portion) is incident on the electronic unit (or the traces of the circuit layer), thus effectively reducing the intensity of reflected light with color shift, thereby improving the grainy color shift phenomenon of the mirror image.

[0091] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be defined by the claims.

Claims

1. An electronic device comprising: First substrate; A circuit layer is disposed on the first substrate; At least one electronic unit is disposed on the first substrate and electrically connected to the circuit layer; A second substrate is disposed relative to the first substrate and includes at least one light-transmitting area and at least one light-reflecting area, the light-transmitting area being adjacent to the light-reflecting area and the light-transmitting area being disposed corresponding to the electronic unit; A reflective layer is disposed on the side of the second substrate adjacent to the first substrate and corresponding to the reflective area; and An optical layer is disposed between the second substrate and the electronic unit, and is disposed at least corresponding to the light-transmitting area.

2. The electronic device as claimed in claim 1, characterized in that, It also includes: An intermediary layer is disposed between the first substrate and the second substrate.

3. The electronic device as claimed in claim 2, characterized in that, The interlayer contains an air medium, an optically transparent adhesive, or an optically transparent resin.

4. The electronic device as claimed in claim 2, characterized in that, The optical layer is disposed between the intermediary layer and the second substrate.

5. The electronic device as claimed in claim 4, characterized in that, The optical layer contains multiple scattering particles.

6. The electronic device as claimed in claim 4, characterized in that, The optical layer includes a circular polarizer.

7. The electronic device as claimed in claim 4, characterized in that, The reflective layer is disposed between the optical layer and the second substrate.

8. The electronic device as claimed in claim 2, characterized in that, It also includes: A color filter layer is disposed between the light-transmitting area of ​​the second substrate and the optical layer.

9. The electronic device as claimed in claim 2, characterized in that, It also includes: A light-absorbing layer is disposed between the reflective layer and the intermediate layer.

10. The electronic device as claimed in claim 2, characterized in that, The optical layer is disposed between the intermediate layer and the electronic unit.

11. The electronic device as claimed in claim 10, characterized in that, The optical layer comprises transparent organic materials.

12. The electronic device as claimed in claim 11, characterized in that, The refractive index of the optical layer is less than that of the intermediate layer.

13. The electronic device as claimed in claim 11, characterized in that, The optical layer further includes multiple bubbles.

14. The electronic device as claimed in claim 1, characterized in that, The optical layer includes at least one microlens structure.

15. The electronic device as claimed in claim 14, characterized in that, It also includes: A leveling layer is disposed between the microlens structure and the second substrate, and the leveling layer covers the reflective layer.

16. The electronic device as claimed in claim 15, characterized in that, The thickness of the microlens structure is less than or equal to the distance between the electronic unit and the filler layer.

17. The electronic device as claimed in claim 14, characterized in that, It also includes: A filler layer is disposed between the microlens structure and the first substrate, and the filler layer covers the electronic unit.

18. An electronic device comprising: First substrate; A circuit layer is disposed on the first substrate; At least one electronic unit is disposed on the first substrate and electrically connected to the circuit layer; A second substrate is disposed relative to the first substrate and includes at least one light-transmitting area and at least one light-reflecting area, the light-transmitting area being adjacent to the light-reflecting area and the light-transmitting area being disposed corresponding to the electronic unit; A reflective layer is disposed on the side of the second substrate adjacent to the first substrate and corresponding to the reflective area; and A reflection enhancement layer is disposed on the side of the second substrate away from the first substrate to reflect at least a portion of ambient light.

19. The electronic device as claimed in claim 18, characterized in that, The ambient light includes a first polarized light portion and a second polarized light portion, and the reflective enhancement layer reflects the first polarized light portion and allows the second polarized light portion to pass through.

20. The electronic device as claimed in claim 18, characterized in that, The electronic unit includes a polarized electronic unit with a microstructure disposed on the side of the polarized electronic unit adjacent to the second substrate. The light emitted by the polarized electronic unit can penetrate the reflective enhancement layer.

Images