Conductive paste

Abstract

Provided is a conductive paste containing a conductive powder, a binder resin, and an organic solvent, the binder resin containing one or more polybutene, and the weight-average molecular weight (Mw) of the entire polybutene component being 3700 or more. According to the invention, according to the present invention, it is possible to provide a conductive paste which can be used in various applications, can form an electrode layer having sufficient adhesion to a base layer in the production of a highly laminated laminate member, and can prevent the occurrence of lamination displacement when a laminate structure is produced by laminating a plurality of layers of coating films obtained using the conductive paste and pressing the laminate structure.

Description

Technical Field

[0001] This invention relates to conductive pastes for forming electrodes in electronic components. Background Technology

[0002] In recent years, with the development of electronic technology and the miniaturization of various electronic devices, the requirements for further miniaturization and increased capacitance of electronic components such as capacitors and inductors used in various electronic devices have become increasingly stringent. To meet these requirements, for example, in multilayer ceramic capacitors, efforts are being made to thin the dielectric layer and internal electrode layer. However, thinning the dielectric layer can easily lead to problems such as sheet attack, delamination, and cracking. Therefore, highly stacked electronic components with excellent electrical properties that are less prone to such problems are required.

[0003] Previously, it was known that in conductive pastes for forming the internal electrodes of multilayer ceramic capacitors, by including polyvinyl butyral, which is a main component in the dielectric layer of most multilayer ceramic capacitors, as an adhesive resin in the conductive paste, the adhesion to the dielectric layer can be improved (e.g., Patent Documents 1-2).

[0004] However, in this case, since the organic solvent in the conductive paste is required to dissolve polyvinyl butyral, there is a problem of sheet erosion when the conductive paste coating comes into contact with the dielectric layer. Sheet erosion is the problem of the organic solvent in the conductive paste dissolving the polyvinyl butyral used in the dielectric layer. This problem becomes more pronounced as the dielectric layer becomes thinner.

[0005] Therefore, Patent Document 3 describes an invention that aims to suppress the penetration of organic solvents in the conductive paste to the dielectric layer by setting the amount of resin in the conductive paste to a certain proportion or higher. However, increasing the amount of resin in the conductive paste increases the amount of organic matter in the conductive paste, thus worsening degreasing properties and causing delamination and cracking, making it impossible to manufacture laminated components with stable quality. Moreover, even using this method, considerable sheet erosion still occurs.

[0006] Furthermore, Patent Document 4 describes an invention that aims to suppress sheet erosion by using dihydroterpineol, which has lower solubility for polyvinyl butyral compared to conventionally used terpineol, as an organic solvent for conductive pastes. However, in the case of dihydroterpineol, the effect of suppressing sheet erosion is insufficient, and it is difficult to suppress sheet erosion when the dielectric layer is extremely thin, especially when the dielectric layer is thinner than 5 μm using butyral resin-based adhesives.

[0007] Therefore, in recent years, research has been conducted on using a specific type of polyvinyl butyral, different from that used in dielectrics, in conductive pastes, and on using organic solvents with selective solubility for dissolving this specific polyvinyl butyral but not for the polyvinyl butyral used in dielectrics. However, in this case, the combinations of resins and organic solvents that can be used are limited, thus restricting design freedom.

[0008] Furthermore, as a countermeasure to the delamination problem, Patent Document 5 solves the problem by using a paste that improves sinterability, thereby addressing the delamination issue. This paste uses metal powder with a given amount of element adsorbed onto its surface through surface treatment in the binder resin, and employs a given kinematic viscosity (kinematic viscosity of 500~30000 mmHg at 40°C). 2 Polybutene ( / s).

[0009] Existing technical documents

[0010] Patent documents

[0011] Patent Document 1: Japanese Patent Application Publication No. 2002-216540

[0012] Patent Document 2: Japanese Patent No. 4894260

[0013] Patent Document 3: Japanese Patent No. 6613551

[0014] Patent Document 4: Japanese Patent Application Publication No. 9-17687

[0015] Patent Document 5: Japanese Patent No. 6630208 Summary of the Invention

[0016] The problem that the invention aims to solve

[0017] As mentioned above, in recent years there has been a demand for electronic components consisting of highly stacked thin dielectric layers and internal electrode layers. Therefore, there is a need for a conductive paste that can form an electrode layer with sufficient adhesion to the substrate layer during the manufacture of highly stacked electronic components, and that can form a coating that is not prone to lamination shift when multiple layers of coatings formed using conductive paste are stacked to create a laminated structure and then pressed together.

[0018] On the other hand, in Patent Document 5, the organic solvents that can be included in the conductive paste are only alcohol solvents, glycol ether solvents, acetate solvents and ketone solvents. As a specific example actually confirmed in Patent Document 5 in the form of an embodiment, electrodes were formed on polybutene (HV300 and HV15, both manufactured by JX Energy) using only a completely solvent-free conductive paste.

[0019] Therefore, the inventors actually tested the conductive paste described in Patent Document 5, applied the conductive paste to the dielectric layer, and dried it. The result was that the dried coating did not cure, and thus deformed under load. Therefore, if one were to actually use the conductive paste specifically described in Patent Document 5 to fabricate a highly demanded, multi-layered structure with a large number of layers and then press-fit it, a reduction in coating thickness and layer shift would occur. To solve this problem and prevent layer shift during pressing, various improvements to the pressing conditions and processes, such as those described in Japanese Patent Application Publication No. 2000-269640, are required. That is, although Patent Document 5 indicates its use as internal electrodes in multilayer ceramic capacitors, the process becomes complex when actually fabricating a multilayered structure with alternating internal electrode layers using the example paste.

[0020] In addition, although patent documents 1 to 4 have extensively studied methods to suppress sheet erosion and delamination while improving the adhesion between the conductive paste and the dielectric layer to be printed, none of them have considered the situation of preventing the occurrence of lamination displacement when fabricating a laminate structure by multi-layering the coating film formed by the conductive paste and pressing it.

[0021] Therefore, the object of the present invention is to provide a conductive paste that can be used for various purposes, can form an electrode layer with sufficient adhesion to the substrate layer in the manufacture of highly stacked laminated parts, and can prevent stacking misalignment when a multilayer coating obtained by using conductive paste is stacked to form a laminated structure and then pressed.

[0022] Methods for solving problems

[0023] The above-mentioned problem is solved by the following invention.

[0024] That is, the present invention (1) provides a conductive paste containing conductive powder, binder resin, and organic solvent.

[0025] The aforementioned adhesive resin contains one or more types of polybutene, and the overall weight-average molecular weight (Mw) of the polybutene component is 3700 or higher.

[0026] In addition, the present invention (2) provides the conductive paste of (1), wherein the weight average molecular weight (Mw) of the above-mentioned polybutene component is 4000 or more.

[0027] In addition, the present invention (3) provides a conductive paste of (2), wherein the weight-average molecular weight (Mw) of the above-mentioned polybutene component is 4300 or more.

[0028] In addition, the present invention (4) provides a conductive paste of (3), wherein the weight-average molecular weight (Mw) of the above-mentioned polybutene component is 4500 or more.

[0029] In addition, the present invention (5) provides a conductive paste containing conductive powder, binder resin, and organic solvent.

[0030] The aforementioned adhesive resin contains one or more types of polybutene, and the overall viscosity of the polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is greater than 50 Pa·s.

[0031] In addition, the present invention (6) provides a conductive paste of (5), wherein the viscosity of the above-mentioned polybutene component as a whole is 55 Pa·s or more at a temperature of 40°C and a shear rate of 0.10 / s.

[0032] In addition, the present invention (7) provides a conductive paste of (6), wherein the viscosity of the above-mentioned polybutene component as a whole is 60 Pa·s or more at a temperature of 40°C and a shear rate of 0.10 / s.

[0033] In addition, the present invention (8) provides a conductive paste of (7), wherein the overall viscosity of the above-mentioned polybutene component is 80 Pa·s or more at a temperature of 40°C and a shear rate of 0.10 / s.

[0034] In addition, the present invention (9) provides conductive pastes of (1) to (8), wherein the organic solvents comprise hydrocarbon solvents.

[0035] In addition, the present invention (10) provides a conductive paste of any one of (1) to (9), wherein the organic solvent comprises one or more selected from terpineol, dihydroterpineol, dihydroterpineol acetate, petroleum hydrocarbons, cycloalkyl acetate, dialkylene glycol dialkyl ether, and trialkylene glycol dialkyl ether.

[0036] In addition, the present invention (11) provides a conductive paste of (10), wherein the organic solvent comprises one or more selected from mineral spirit, turpentine, isoparaffin, n-paraffin, cycloparaffin and cycloalkyl acetate.

[0037] In addition, the present invention (12) provides a conductive paste of any one of (1) to (11), wherein the conductive powder is a metal powder.

[0038] In addition, the present invention (13) provides a conductive paste of any one of (1) to (12) for use in forming internal electrodes of laminated ceramic electronic components.

[0039] In addition, the present invention (14) provides an electronic component having:

[0040] A matrix layer containing polyvinyl butyral, and

[0041] Electrode layers are stacked on the substrate layer using any one of (1) to (13).

[0042] The effects of the invention

[0043] According to the present invention, a conductive paste can be provided that can be used for various applications, forms an electrode layer with sufficient adhesion to the substrate layer in the manufacture of highly stacked laminated components, and prevents lamination shift when fabricating a laminated structure by stacking multiple layers of coatings obtained using a conductive paste and pressing them together. Furthermore, according to the present invention, a multilayer ceramic capacitor can be provided that exhibits excellent reliability even with further thinning and high stacking of the dielectric layer. Attached Figure Description

[0044] Figure 1 These are microscope images from Example 6.

[0045] Figure 2 These are microscopic images of Comparative Example 5.

[0046] Figure 3 These are photographs of the atmospheric debinding characteristics test results from Example 7.

[0047] Figure 4 These are photographs of the debinding characteristics test in a nitrogen atmosphere as described in Example 7.

[0048] Figure 5 These are photographs of the atmospheric debinding characteristics test results from Example 8.

[0049] Figure 6 These are photographs of the debinding characteristics test in a nitrogen atmosphere as described in Example 8.

[0050] Figure 7 These are photographs of the atmospheric debinding characteristics test of Comparative Example 6.

[0051] Figure 8 These are photographs of the debinding characteristics test of Comparative Example 6 in a nitrogen atmosphere.

[0052] Figure 9 These are photographs of the atmospheric debinding characteristics test of Comparative Example 7.

[0053] Figure 10 These are photographs of the debinding characteristics test results of Comparative Example 7 in a nitrogen atmosphere.

[0054] Figure 11 These are photographs of the atmospheric debinding characteristics test of Comparative Example 8.

[0055] Figure 12 These are photographs of the debinding characteristics test in a nitrogen atmosphere for Comparative Example 8. Detailed Implementation

[0056] The conductive paste of the present invention contains:

[0057] Conductive powders, adhesive resins, and organic solvents,

[0058] The aforementioned adhesive resin contains one or more types of polybutene, and the overall weight-average molecular weight (Mw) of the polybutene component is 3700 or higher.

[0059] In addition, the conductive paste of the present invention contains:

[0060] Conductive powders, adhesive resins, and organic solvents,

[0061] The aforementioned adhesive resin contains one or more types of polybutene, and the overall viscosity of the polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is greater than 50 Pa·s.

[0062] The conductive paste of the present invention contains conductive powder, binder resin, and organic solvent. As the binder resin, one or more polybutenes are used. The weight-average molecular weight (Mw) of the polybutene component without organic solvent is within a given range and / or the absolute viscosity of the polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is within a given range.

[0063] The conductive paste of the present invention can be suitably used for forming internal electrodes in multilayer ceramic capacitors, and can also be applied to other ceramic electronic components such as inductors and actuators.

[0064] The method for forming a coating using the conductive paste of the present invention is not particularly limited, and can correspond to various printing methods such as offset printing, screen printing, gravure printing, inkjet printing, dipping, dispensing, brushing, and spin coating.

[0065] The conductive powder used in the conductive paste of the present invention is not particularly limited as long as it is conductive, but metal powder is preferred. Examples of metal powders include precious metals such as silver, gold, platinum, and palladium; and base metals such as nickel, copper, cobalt, iron, aluminum, molybdenum, and tungsten. In addition to single metals, alloy powders, composite powders, and mixed powders are also included. Nickel, copper, silver, gold, platinum, and palladium are preferred. Furthermore, the conductive powder can be a powder with a thin oxide film on its surface, or a powder coated with glass or various oxides to suppress over-sintering and oxidation. Additionally, conductive powders that have undergone surface treatment with organometallic compounds, surfactants, fatty acids, etc., as needed can be used. The conductive powder can be a single type or a combination of two or more types.

[0066] The average particle size of the conductive powder is not particularly limited, but is preferably 1.0 μm or less. By keeping the average particle size of the conductive powder within the above range, it is easy to form a dense, smooth, and thin internal electrode layer. The conductive powder can be a mixture of two or more conductive powders with different average particle sizes. The shape of the conductive powder is not particularly limited, and conventionally used shapes such as spherical powder, flake powder, and dendritic powder can be used, as well as a mixture of two or more conductive powders with different shapes. It should be noted that in this invention, the average particle size of the conductive powder is the cumulative 50% value (D50) of the volume reference in the particle size distribution measured using a laser particle size distribution measuring device.

[0067] In the conductive paste of the present invention, the content of conductive powder is not particularly limited. Considering the final viscosity, printability, and storage stability of the conductive paste, it is usually appropriately selected in the range of 10.0% by mass or more and 95.0% by mass or less.

[0068] The conductive paste of the present invention contains one or more polybutenes as binder resins.

[0069] In the conductive paste of the present invention, polybutene refers to a homopolymer of 1-butene, a homopolymer of 2-butene, a homopolymer of isobutene, or a copolymer of two or more of 1-butene, 2-butene, and isobutene, or a mixture of two or more of these polymers (homomers or copolymers). Furthermore, the polybutene in the conductive paste of the present invention satisfies the following physical properties. Preferably, the polybutene is a homopolymer of isobutene, a copolymer of isobutene and linear butene, more preferably a homopolymer of isobutene, a copolymer of monomers mainly composed of isobutene and containing a portion of linear butene, and particularly preferably a homopolymer of isobutene.

[0070] In the conductive paste of the present invention, the overall weight-average molecular weight (Mw) of the polybutene component is 3700 or more, preferably 4000 or more, more preferably 4300 or more, more preferably 4500 or more, even more preferably 5000 or more, and particularly preferably 5500 or more. By making the overall weight-average molecular weight (Mw) of the polybutene component within the above range, an electrode layer with sufficient adhesion to the substrate layer can be formed. Furthermore, when the coating obtained using the conductive paste is multi-layered to form a laminate structure and then pressed, the coating layer is not easily deformed, thus preventing lamination shift. On the other hand, if the overall weight-average molecular weight (Mw) of the polybutene component is less than the above range, when the coating obtained using the conductive paste is multi-layered to form a laminate structure and then pressed, the coating does not cure and is easily deformed, resulting in lamination shift. Therefore, it is difficult to produce a high-precision laminate, which adversely affects the characteristics of electronic components and reduces the yield. It should be noted that the overall weight-average molecular weight (Mw) of the polybutene component is the weight-average molecular weight of polystyrene measured by gel permeation chromatography using a Tosoh HLC-8321GPC / HT. Furthermore, in this invention, the overall weight-average molecular weight (Mw) of the polybutene component refers to the weight-average molecular weight (Mw) of that single polybutene when using one type of polybutene as the binder resin; and the weight-average molecular weight (Mw) of the mixture when two or more types of polybutene are mixed in the proportions required for a conductive paste when using two or more types of polybutene as the binder resin.

[0071] When the overall weight-average molecular weight of the polybutene component is high, it can be used simply by changing the ratio of the polybutene component to the organic solvent in the conductive paste according to the coating film formation method (offset printing, screen printing, gravure printing, etc.). Therefore, in the conductive paste of the present invention, the upper limit of the overall weight-average molecular weight (Mw) of the polybutene component is not particularly limited. From the viewpoint of easy handling of the paste, the overall weight-average molecular weight (Mw) of the polybutene component is preferably 100,000 or less, more preferably 90,000 or less, and particularly preferably 80,000 or less.

[0072] It should be noted that at the time of this application, there were no commercially available polybutene products with a weight-average molecular weight (Mw) of 3000 or more and 6000 or less that were readily available in Japan. However, experiments conducted by the inventors have shown a correlation between the overall weight-average molecular weight (Mw) of the polybutene component and the magnitude (degree) of the effect of the present invention. Therefore, it has been confirmed that when the overall weight-average molecular weight (Mw) of the polybutene component used in the conductive paste of the present invention is 3700 or more, satisfactory results can be obtained as an effect of the present invention, and this effect increases as the weight-average molecular weight (Mw) increases to 4000 or more, 4300 or more, 4500 or more, 5000 or more, and further to 5500 or more.

[0073] In the conductive paste of the present invention, the number-average molecular weight (Mn) of the polybutene component is preferably 1000 or more, more preferably 1050 or more, further preferably 1100 or more, and particularly preferably 1200 or more. Furthermore, in the conductive paste of the present invention, the upper limit of the number-average molecular weight (Mn) of the polybutene component is not particularly limited, but from the viewpoint of ease of handling the paste, it is preferably 60,000 or less, more preferably 50,000 or less, and particularly preferably 40,000 or less. It should be noted that in the present invention, the number-average molecular weight (Mn) of the polybutene component is the number-average molecular weight converted from that of polystyrene measured by gel permeation chromatography using an HLC-8321GPC / HT manufactured by Tosoh Corporation. Furthermore, in this invention, the number average molecular weight (Mn) of the polybutene component as a whole refers to the number average molecular weight (Mn) of that single polybutene when using one polybutene as an adhesive resin, and the number average molecular weight (Mn) of the mixture when two or more polybutenes are used as adhesive resins when the two or more polybutenes are mixed in the proportions required in the conductive paste.

[0074] In the conductive paste of the present invention, the viscosity (absolute viscosity) of the polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is 50 Pa·s or more, preferably 55 Pa·s or more, more preferably 60 Pa·s or more, more preferably 80 Pa·s or more, even more preferably 100 Pa·s or more, and particularly preferably 130 Pa·s or more. By ensuring that the viscosity (absolute viscosity) of the polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is within the above range, an electrode layer with sufficient adhesion to the substrate layer can be formed. Furthermore, when the coating obtained using the conductive paste is multi-layered to form a laminate structure and then pressed, the coating layer is less prone to deformation, thus preventing lamination shift. On the other hand, if the viscosity of the polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is less than the above range, lamination shift will occur when the coating obtained using the conductive paste is multi-layered to form a laminate structure and then pressed, thus adversely affecting the characteristics of electronic components and causing a decrease in yield. It should be noted that, in this invention, the overall absolute viscosity of the polybutene component was measured using an ARES-G2 instrument manufactured by TA Instruments. Furthermore, in this invention, the overall viscosity (absolute viscosity) of the polybutene component at 40°C and a shear rate of 0.10 / s refers to the viscosity (absolute viscosity) of that single polybutene at 40°C and a shear rate of 0.10 / s when using only one polybutene as a binder resin. Additionally, when using two or more polybutenes as binder resins, the viscosity (absolute viscosity) refers to the viscosity of the mixture at 40°C and a shear rate of 0.10 / s when the two or more polybutenes are mixed in the proportions required for a conductive paste.

[0075] When the overall viscosity of the polybutene component is high, it can be used simply by changing the ratio of the polybutene component to the organic solvent in the conductive paste according to the coating film formation method (offset printing, screen printing, gravure printing, etc.). Therefore, in this invention, there is no particular limitation on the upper limit of the overall viscosity of the polybutene component at a temperature of 40°C and a shear rate of 0.10 / s. From the viewpoint of easy paste handling, the overall viscosity (absolute viscosity) of the polybutene component at a temperature of 40°C and a shear rate of 0.10 / s is preferably 100,000 Pa·s or less, more preferably 80,000 Pa·s or less, and particularly preferably 50,000 Pa·s or less.

[0076] It should be noted that at the time of this application, as polybutene readily available in Japan, there were no commercially available products with a viscosity (absolute viscosity) of 50 or higher and 150 or lower at a temperature of 40°C and a shear rate of 0.10 / s. However, experiments conducted by the inventors have shown a correlation between the overall absolute viscosity of the polybutene component and the magnitude (degree) of the effect of the present invention. Therefore, it has been confirmed that when the overall absolute viscosity of the polybutene component used in the conductive paste of the present invention is 50 Pa·s or higher, satisfactory results can be obtained as an effect of the present invention, and this effect increases with the absolute viscosity increasing to 55 Pa·s or higher, 60 Pa·s or higher, 80 Pa·s or higher, 100 Pa·s or higher, and further increasing to 130 Pa·s or higher.

[0077] In the conductive paste of the present invention, the overall kinematic viscosity of the polybutene component at a temperature of 40°C is preferably 45000 mm⁻¹. 2 / s or higher, more preferably 55000mm 2 / s or higher, further preferably 100000mm 2 / s or higher, with 130000mm being particularly preferred. 2 / s or higher. In the conductive paste of the present invention, the upper limit of the overall kinematic viscosity of the polybutene component at a temperature of 40°C is not particularly limited, but from the viewpoint of ease of handling as a paste, 100,000,000 mm is preferred. 2 / s or less, more preferably 80,000,000 mm 2 / s or less, with 50,000,000 mm being particularly preferred. 2 / s or less. By keeping the overall kinematic viscosity of the polybutene component within the above range at a temperature of 40°C, the coating is less prone to deformation when multiple layers of a coating obtained using a conductive paste are stacked together to create a laminate structure and then pressed, thus increasing the effectiveness in preventing lamination shift.

[0078] Regarding the conductive paste of the present invention, as an adhesive resin, by using a polybutene component having the given weight-average molecular weight (Mw) and / or the given viscosity at a temperature of 40°C and a shear rate of 0.10 / s, an electrode layer with sufficient adhesion to the substrate layer can be formed. Furthermore, when a multilayer composite structure is formed by stacking the coating obtained using the conductive paste and then pressed, the coating layer is less prone to deformation, thus preventing lamination misalignment. Additionally, regarding the conductive paste of the present invention, by setting the overall number-average molecular weight (Mn) and / or kinematic viscosity at 40°C of the polybutene component used as an adhesive resin to the given range, the effect of preventing coating layer deformation is enhanced when a multilayer composite structure is formed by stacking the coating obtained using the conductive paste and then pressed.

[0079] The polybutene used in the conductive paste of the present invention, and a polybutene (hereinafter also referred to as polybutene (1)) that satisfies the overall physical properties of the polybutene components described above, can be, for example, a copolymer of monomers mainly composed of isobutylene and containing a portion of linear butene, or a homopolymer of isobutylene that satisfies the overall physical properties of the polybutene components described above. Examples of such polybutene (1) include: HV-1900 manufactured by ENEOS Corporation, TETRAX6T manufactured by ENEOS Corporation, TETRAX5T manufactured by ENEOS Corporation, TETRAX4T manufactured by ENEOS Corporation, and TETRAX3T manufactured by ENEOS Corporation. In the conductive paste of the present invention, one of these polybutenes (1) can be used alone as an adhesive resin. In addition, in the conductive paste of the present invention, two or more polybutenes (1) can be used in combination. In addition, in the conductive paste of the present invention, one or more polybutenes (1) and the polybutenes (2) described below may be used as a polybutene component in combination to satisfy the overall physical property values ​​of the polybutene component.

[0080] In the conductive paste of the present invention, even if a single polybutene (hereinafter also referred to as polybutene (2)) does not meet the overall physical property values ​​of the polybutene component described above, as long as it meets the overall physical property values ​​of the polybutene component when used in combination with polybutene (1), one or more polybutenes (2) can be used as one of the components of the adhesive resin. That is, in the conductive paste of the present invention, as long as the physical property values ​​of the mixture when one or more polybutenes (1) and one or more polybutenes (2) are mixed in the proportions in the conductive paste meet the overall physical property values ​​of the polybutene component described above, one or more polybutenes (1) and one or more polybutenes (2) can be used in combination.

[0081] In the conductive paste of the present invention, from the viewpoint of easy industrial use, it is preferable that the polybutene used in the adhesive resin is only polybutene (1).

[0082] Furthermore, compared to ethyl cellulose and other resins, the polybutene in the conductive paste of the present invention exhibits excellent thermal decomposition properties. Therefore, after calcining the conductive paste of the present invention, virtually no carbon or carbonaceous organic residues remain. Consequently, the sintering hindrance of conductive powder caused by these residues can be suppressed, and the occurrence of bubbles, delamination, cracking, etc., can be prevented. As a result, electronic components with excellent electrical properties can be obtained.

[0083] In the conductive paste of the present invention, the binder resin may include, in addition to polybutene, cellulose resins such as acrylic resin, methacrylic resin, ethyl cellulose, and hydroxyethyl cellulose, as well as binder resins such as butyral resin, epoxy resin, phenolic resin, and rosin, as long as it does not impair the effect of the present invention. As is known in the art, various properties of the conductive paste can sometimes be improved by appropriately mixing multiple binder resins. However, in order to further obtain the effect of the present invention, the higher the proportion of polybutene in the binder resin, the better, preferably 90.0% by mass or more, and particularly preferably 100.0% by mass.

[0084] The content of the binder resin in the conductive paste of the present invention can be appropriately selected according to the application of the conductive paste and the printing method.

[0085] The ratio of conductive powder to binder resin in the conductive paste of the present invention can be appropriately selected according to the application of the conductive paste and the printing method.

[0086] The organic solvent of the conductive paste of the present invention is not particularly limited as long as it can dissolve polybutene. It can be an organic solvent that is soluble in polybutene but has low solubility in polyvinyl butyral used in the dielectric layer (hereinafter referred to as a suitable solvent), or an organic solvent that is soluble in polybutene but has high solubility in polyvinyl butyral used in the dielectric layer (hereinafter referred to as a usable solvent).

[0087] In the conductive paste of the present invention, when a suitable solvent is included as an organic solvent, the low solubility of polyvinyl butyral used in the dielectric layer can suppress sheet erosion, making it suitable for conductive pastes requiring protection against sheet erosion. Suitable solvents include hydrocarbon solvents. Examples of suitable hydrocarbon solvents include paraffinic hydrocarbons, olefinic hydrocarbons, cycloalkanes, aromatic hydrocarbons, petroleum hydrocarbons, and mixtures of two or more of these. Examples of suitable cycloalkanes include cycloalkanes, and examples of suitable petroleum hydrocarbon solvents include mineral oil, turpentine, isoalkanes, and n-alkanes. Other suitable solvents include oxygen-containing organic solvents such as cyclohexyl acetate, cyclodecyl acetate, dialkylene glycol dialkyl ethers (the alkyl groups may be the same or different), and trialkylene glycol dialkyl ethers (the alkyl groups may be the same or different).

[0088] In conventional conductive pastes for forming internal electrodes, the binder resin typically contains ethyl cellulose suitable for screen printing, and polyvinyl butyral to ensure adhesion to the dielectric layer. Therefore, conventional conductive pastes require an organic solvent that dissolves the ethyl cellulose and polyvinyl butyral contained in the paste. This organic solvent also dissolves the polyvinyl butyral used in the dielectric layer, which causes sheet erosion of the dielectric layer.

[0089] The inventors conducted repeated and in-depth research on this matter and found that using one or more polybutenes as adhesive resins, with polybutene components having a specific range of overall weight-average molecular weight (Mw) and / or viscosity at 40°C and a shear rate of 0.10 / s, provides high adhesion to the dielectric layer. Compared to ethyl cellulose, it exhibits superior combustion decomposition properties and also helps improve the dispersibility of conductive powders. Therefore, it can replace ethyl cellulose and polyvinyl butyral as adhesive resins. Even when polybutene accounts for 100% of the adhesive resin, it can still ensure the printability of the conductive paste and its adhesion to the dielectric layer. Furthermore, the inventors have discovered that since polybutene is a low-polarity hydrocarbon compound, a suitable organic solvent can be used as the organic solvent in the conductive paste. Therefore, the conductive paste of the present invention, which uses one or more polybutenes as the adhesive resin with a specific range of weight-average molecular weight (Mw) as the polybutene component and / or viscosity at a temperature of 40°C and a shear rate of 0.10 / s, and uses a suitable organic solvent, can ensure adhesion to the dielectric layer while suppressing sheet erosion, even when used in a dielectric layer using polyvinyl butyral.

[0090] The conductive paste of the present invention uses polybutene as the binder resin instead of the combination of ethyl cellulose and polyvinyl butyral widely used in conventional conductive pastes. Furthermore, polybutene is soluble in organic solvents with low solubility for polyvinyl butyral used in the dielectric layer, such as hydrocarbon solvents, cycloalkyl acetates, dialkylene glycol dialkyl ethers, and trialkylene glycol dialkyl ethers. Therefore, in the conductive paste of the present invention, organic solvents with low solubility for polyvinyl butyral used in the dielectric layer, such as hydrocarbon solvents, cycloalkyl acetates, dialkylene glycol dialkyl ethers, and trialkylene glycol dialkyl ethers, can be used as the organic solvent for dissolving the binder resin. Therefore, when the conductive paste of the present invention contains a suitable solvent as the organic solvent, the conductive paste of the present invention can suppress sheet erosion.

[0091] Furthermore, compared to conventional conductive pastes that use ethyl cellulose as a binder resin, the conductive powder of the conductive paste of the present invention, which uses polybutene, exhibits higher dispersibility. Moreover, the dispersibility of the conductive powder is even more excellent when using hydrocarbon solvents as organic solvents.

[0092] It should be noted that the conductive paste of the present invention does not exclude the use of organic solvents with high solubility for polyvinyl butyral used in the dielectric layer. If the conductive paste does not require protection against the aforementioned sheet corrosion (e.g., for inductor applications), it may contain organic solvents with high solubility for polyvinyl butyral used in the dielectric layer, as long as it does not impair the effectiveness of the present invention. Examples of usable solvents include terpineol, dihydroterpineol, and dihydroterpineol acetate.

[0093] When the conductive paste of the present invention contains a suitable solvent and a usable solvent as an organic solvent, from the viewpoint of suppressing sheet corrosion, the higher the proportion of suitable solvents such as cycloalkanes, petroleum hydrocarbons, cyclohexyl acetate, cyclodecyl acetate, dialkylene glycol dialkyl ethers such as dipropylene glycol methyl n-propyl ether and dipropylene glycol methyl n-butyl ether (alkyl groups may be the same or different), and trialkylene glycol dialkyl ethers such as tripropylene glycol methyl n-propyl ether (alkyl groups may be the same or different), the better, preferably 90.0% by mass or more. Furthermore, when the conductive paste of the present invention is used in a dielectric layer using polyvinyl butyral, from the viewpoint of increasing the effect of suppressing sheet corrosion, it is particularly preferable to use an organic solvent with a suitable solvent proportion of 100.0% by mass as the organic solvent.

[0094] Furthermore, as long as it does not impair the effects of the present invention, the conductive paste of the present invention may contain an organic solvent that does not show solubility in polybutene as an organic solvent. However, in order to further obtain the effects of the present invention, the higher the proportion of the organic solvent that is soluble in polybutene, the better, preferably 90.0% by mass or more, and particularly preferably 100.0% by mass. Especially when the conductive paste of the present invention is used in a dielectric layer using polyvinyl butyral, from the viewpoint of increasing the effect of suppressing sheet corrosion, it is preferable to use an organic solvent with a suitable solvent proportion of 100.0% by mass as the organic solvent.

[0095] In the conductive paste of the present invention, the boiling point of the organic solvent can be appropriately selected according to the application of the conductive paste and the printing method, preferably 80~240°C, more preferably 90~230°C. Furthermore, in the conductive paste of the present invention, the kinematic viscosity of the organic solvent at 40°C can be appropriately selected according to the application of the conductive paste and the printing method, preferably 0.3~90.0 mm. 2 / s, more preferably 1.0~85.0mm 2 / s.

[0096] The content of organic solvent in the conductive paste of the present invention is not particularly limited as long as it is sufficient to dissolve the adhesive resin, and can be appropriately selected according to the application of the conductive paste and the printing method. From the viewpoint of easy handling of the paste, the content of organic solvent in the conductive paste of the present invention is preferably 10.0 parts by weight or more and 800.0 parts by weight or less relative to 100.0 parts by weight of conductive powder, more preferably 30.0 parts by weight or more and 550.0 parts by weight or less relative to 100.0 parts by weight of conductive powder. By keeping the content of organic solvent in the conductive paste within the above range, in order to suppress the above-mentioned layer shift, even when using the specific polybutene of the present invention, good printability in known printing methods such as screen printing and gravure printing can be expected.

[0097] In addition to the components mentioned above, the conductive paste of the present invention can also be formulated with various additives that are commonly used in conductive pastes. For example, in order to improve the dispersibility of inorganic powders such as conductive powders, ensure the long-term stability of the viscosity of the conductive paste, and provide suitable flow characteristics during printing, the conductive paste of the present invention may contain additives such as plasticizers, dispersants, and surfactants as needed.

[0098] In addition, the conductive paste of the present invention may appropriately contain, depending on the purpose, metal oxides such as glass, alumina, silicon dioxide, copper oxide, manganese oxide, and titanium oxide, inorganic powders such as ceramics and montmorillonite, organometallic compounds, plasticizers, etc., as commonly used components in conductive pastes, wherein ceramic powder is preferred.

[0099] In the case where the conductive paste of the present invention is a conductive paste for forming the internal electrode layer of a laminated ceramic electronic component, the conductive paste of the present invention may contain a powder called "co-material" that is the same as or similar to the composition of the ceramic layer in order to make its shrinkage behavior during firing similar to that of the surrounding unfired ceramic layer.

[0100] The type of common material powder is not particularly limited, but it is preferably selected in a way that minimizes the change in capacitor characteristics caused by the reaction with the ceramic dielectric. Preferred common material powders include ceramic powders represented by the general formula ABO3 (where A is at least one of Ba, Ca, and Sr, and B is at least one of Ti, Zr, and Hf), such as perovskite oxide powders like barium titanate, strontium zirconate, and calcium zirconate, as well as products obtained by adding various additives to these. Furthermore, the common material powder is preferably of the same or similar composition as the dielectric ceramic raw material powder used as the main component of the dielectric layer. It should be noted that the common material powder can be adhered to the surface of the conductive powder before being mixed with other components in the conductive paste.

[0101] In the case where the conductive paste of the present invention contains common material powder, the content of common material powder in the conductive paste of the present invention, relative to 100.0 parts by weight of conductive powder, is greater than 0.0 parts by weight and less than 50.0 parts by weight, preferably greater than 1.0 parts by weight and less than 40.0 parts by weight, and particularly preferably greater than 5.0 parts by weight and less than 30.0 parts by weight.

[0102] The average particle size of the common material powder is not particularly limited, but it exhibits better sintering inhibition and densification improvement effects when it is less than 30% of the average particle size of the conductive powder, and is therefore preferred.

[0103] The viscosity of the conductive paste of the present invention is only required to be in paste form, and there are no particular limitations. It can be appropriately selected according to the application of the conductive paste and the printing method.

[0104] There are no particular limitations on the method for preparing or manufacturing the conductive paste of the present invention. The conductive paste can be manufactured by dispersing and mixing conductive powder, organic solvent, and binder resin using known methods.

[0105] The electronic component of the present invention comprises: a substrate layer containing polyvinyl butyral, and an electrode layer laminated on the substrate layer using the conductive paste of the present invention described above.

[0106] The substrate layer of the electronic component of the present invention is not particularly limited, and examples include: dielectric layer, glass layer, ceramic layer, magnetic layer, etc.

[0107] The electronic components of the present invention can be manufactured using the conductive paste of the present invention in the formation of internal electrodes by known methods. For example, a multilayer ceramic capacitor, as an example of an electronic component of the present invention, can be manufactured using the conductive paste of the present invention by the method described below.

[0108] First, barium titanate and other dielectric ceramic raw material powders are dispersed in polyvinyl butyral to form a ceramic green sheet with a thickness of 3.0 μm. The conductive paste of the present invention is then coated onto the ceramic green sheet using known methods such as screen printing. After drying, the organic solvent is removed, forming an internal electrode paste coating film with a given pattern. Next, 1000 layers of the ceramic green sheet with the internal electrode paste coating film are stacked and pressed together at 30°C and 15 MPa for 1 second, followed by vacuum pressing together at 90°C and 130 MPa for 240 seconds to produce an unfired laminate. The resulting laminate is then cut into a given shape and fired at a high temperature to simultaneously sinter the dielectric and electrode layers, obtaining a multilayer ceramic capacitor element. Terminal electrodes are then fired onto both ends of the element to form the multilayer ceramic capacitor of the present invention. It should be noted that the terminal electrodes can also be installed before the firing of the laminate and fired simultaneously with the laminate.

[0109] If the conductive paste of the present invention is used, even unfired laminates produced under the above conditions can be made without the use of jigs or the like without laminate shifting, and the occurrence of sheet erosion can be suppressed.

[0110] The present invention will now be described based on specific experimental examples, but the present invention is not limited to these embodiments.

[0111] Example

[0112] Experimental Example 1

[0113] <Manufacturing of Conductive Paste>

[0114] (Examples 1-2 and Comparative Examples 1-3)

[0115] A conductive paste was prepared by mixing 100.0 g of spherical nickel powder (Ni-683L, manufactured by Showei Chemical Industry Co., Ltd.) with the polybutene and organic solvent shown in Table 1 according to the proportions (parts by mass) shown in Table 1. It should be noted that no organic solvent was used in Comparative Example 3.

[0116] The performance of the obtained conductive paste was evaluated. The results are shown in Table 1.

[0117] It should be noted that the details of the polybutene and organic solvents shown in Table 1 are as follows.

[0118] Polybutene

[0119] ·Polybutene HV-15

[0120] A copolymer of isobutylene-based monomers containing some linear butene monomers, with a weight-average molecular weight (Mw): 717, a number-average molecular weight (Mn): 388, an absolute viscosity at 40°C and a shear rate of 0.10 / s: 2.1 Pa·s, and a kinematic viscosity at 40°C: 655 mm³ / s. 2 kinematic viscosity at 100℃: 31 mm / s 2 / s

[0121] ·Polybutene HV-300

[0122] A copolymer of isobutylene-based monomers containing some linear butene monomers, with a weight-average molecular weight (Mw) of 2470, a number-average molecular weight (Mn) of 977, an absolute viscosity of 26.3 Pa·s at a shear rate of 0.10 / s at 40°C, and a kinematic viscosity of 26000 mm³ / s at 40°C. 2 kinematic viscosity at 100℃: 590 mm³ / s 2 / s

[0123] ·Polybutene HV-1900

[0124] A copolymer of isobutylene-based monomers containing some linear butene monomers, with a weight-average molecular weight (Mw): 6940, a number-average molecular weight (Mn): 1230, an absolute viscosity at 40°C and a shear rate of 0.10 / s: 171.1 Pa·s, and a kinematic viscosity at 40°C: 160000 mm³ / s. 2 kinematic viscosity at 100℃: 3710 mm³ / s 2 / s

[0125] ·TETRAX 6T

[0126] The homopolymer of isobutylene has the following properties: weight-average molecular weight (Mw): 72400; number-average molecular weight (Mn): 36700; absolute viscosity at 40°C and a shear rate of 0.10 / s: 43395.8 Pa·s; kinematic viscosity at 200°C: 50500 mm³ / s. 2 / s

[0127] <Organic solvents>

[0128] Hydrocarbon solvents

[0129] Naphtezol 200 (manufactured by ENEOS), boiling point: 190~220℃

[0130] <Paste Performance Evaluation>

[0131] Various tests were conducted on the conductive paste prepared as described above using the methods described below.

[0132] (1) Deformation test

[0133] Fifteen samples were taken from each specimen to form a 15 mm square coating with a thickness of 10 μm. After drying at 140 °C for 10 minutes, the coating was pressurized at 50 °C and 20 MPa for 10 seconds. The average rate of change of area was calculated to evaluate the deformability. Here, samples with an average rate of change of area ((area after test - area before test) / area before test) × 100) less than 10% were classified as "A: Pass, Excellent", samples with a rate of change of area greater than 10% but less than 20% were classified as "B: Pass, Good", and samples with a rate of change of area greater than 20% were classified as "C: Fail". These results are recorded in Table 1.

[0134] (2) Fitting test

[0135] Fifteen samples were taken from each of the samples, and a 4.0 cm square, 10 μm thick coating was formed on a PET film. The coating was then dried at 140°C for 10 minutes to obtain a dried film of the conductive paste on the PET film. Separately, a dielectric paste, prepared by mixing barium titanate powder, polyvinyl butyral, and dihydroterpineol, was used to form a 4.0 cm square, 10 μm thick coating on another PET film. This was also dried at 140°C for 10 minutes to obtain a dried film of the dielectric paste on the PET film. The dried films of the conductive paste and dielectric paste were then brought into contact, and pressure was applied at 40°C and 20 tons for 10 seconds. The PET film was then peeled off from the dried film of the dielectric paste. Adhesive tape (adhesive strength: approximately 5 N per 10 mm width) was then applied to the dried film of the dielectric paste, and the peeling process was observed to evaluate the adhesion. Here, for a 4.0 cm square adhesive coating area, samples where the dry film of the dielectric paste and the dry film of the conductive paste are jointly attached to the tape in an area of ​​80% to 100% are classified as "A: Qualified, Excellent", samples where the dry film of the dielectric paste and the dry film of the conductive paste are jointly attached to the tape are classified as "B: Qualified" and samples where the dry film of the conductive paste and the dry film of the conductive paste are jointly attached to the tape are classified as "C: Unqualified". These are all recorded in Table 1.

[0136]

[0137] In Table 1, the absolute viscosity of the polybutene component is the absolute viscosity at a temperature of 40°C and a shear rate of 0.10 / s, and the kinematic viscosity is the kinematic viscosity at 40°C. Furthermore, for the weight-average molecular weight, number-average molecular weight, absolute viscosity, and kinematic viscosity of the polybutene component, when only one type of polybutene is used, the values ​​are those measured individually for that single polybutene. When two or more types of polybutene are used, the values ​​are those obtained by mixing the two or more types of polybutene in the proportions shown in Table 1 to obtain a mixture and then measuring that mixture.

[0138] Experimental Example 2

[0139] <Manufacturing of Conductive Paste>

[0140] (Example 6 and Comparative Example 5)

[0141] A conductive paste was prepared by mixing 100.0 g of spherical nickel powder (manufactured by Zhaorong Chemical Industry Co., Ltd., Ni-688BT) with the binder resin and organic solvent shown in Table 2 according to the proportions (parts by mass) shown in Table 2.

[0142] The performance of the obtained conductive paste was evaluated. The results are shown in Table 2.

[0143] It should be noted that the details of the adhesive resins and organic solvents shown in Table 2 are as follows.

[0144] <Adhesive Resins>

[0145] • Polybutene (HV-1900)

[0146] • Ethyl cellulose (manufactured by Dow Chemical Company, STD100)

[0147] <Organic solvents>

[0148] • Naphtezol 200 (NAPH200)

[0149] · sec-Butanol (SBA)

[0150] <Paste Performance Evaluation>

[0151] Various tests were conducted on the conductive paste prepared as described above using the methods described below.

[0152] (1) Dispersion test

[0153] Ten samples were taken from each specimen, and a 1.0 μm thick coating was prepared using a bar coater. The coatings were then dried at 140°C for 10 minutes to obtain dried films. The surface roughness of the dried films was measured using a stylus-type surface roughness meter based on JIS B 0601-2001, and the dispersibility was evaluated. Here, samples with a surface roughness below 50 nm were designated as "A: Acceptable, Excellent", samples with a surface roughness between 50 nm and 70 nm were designated as "B: Acceptable, Good", and samples with a surface roughness above 70 nm were designated as "C: Unacceptable", as shown in Table 2.

[0154] In addition, the dispersion state of each sample was confirmed using a microscope. The results are shown below. Figure 1 , 2 .

[0155] (2) Sheet erosion test

[0156] A dielectric paste was prepared by mixing barium titanate powder, polyvinyl butyral, and dihydroterpineol. Various samples were printed onto a 4 μm thick dielectric coating using this paste, with given internal electrode shapes, resulting in a 2 μm thick dried film. The dried film was then dried at 90°C for 5 minutes to form a dry film of the conductive paste. The portion of the dielectric coating covered by the dry film of the conductive paste was observed visually from the back side. The degree of sheet erosion was evaluated based on the degree of distortion, cracking, and color change. Here, samples with essentially no change were designated "A: Acceptable, Excellent," samples with observable swelling were designated "B: Acceptable," and samples exhibiting distortion and cracking were designated "C: Unacceptable," as shown in Table 2.

[0157]

[0158] Experimental Example 3

[0159] (Examples 7-8 and Comparative Examples 6-8)

[0160] The adhesive resins shown in Table 3 were prepared, and their performance was evaluated using the methods described below.

[0161] It should be noted that the details of the adhesive resins and organic solvents shown in Tables 3 and 4 are as follows.

[0162] <Adhesive Resins>

[0163] • Polybutene (HV-1900)

[0164] • Polyisobutylene (TETRAX6T)

[0165] Ethyl cellulose (STD300)

[0166] Cellulose acetate butyrate (ECB-5000)

[0167] Cellulose acetate butyrate (CAB-553)

[0168] • Polyvinyl butyral (BL-S)

[0169] <Organic solvents>

[0170] • Terpineol (TPO)

[0171] Dihydroterpineol (DHT)

[0172] Dihydroterpineol acetate (DHTA)

[0173] • Mineral oil (MS)

[0174] ·turpentine

[0175] • n-chain alkanes

[0176] Isoalkanes

[0177] ·Cycloalkanes

[0178] Cyclohexyl acetate (CHXA)

[0179] ·Cyclodecyl acetate (CDA)

[0180] Dipropylene glycol methyl n-butyl ether (DPMNB)

[0181] • Dipropylene glycol methyl propyl ether (DPMNP)

[0182] Tripropylene glycol methyl n-propyl ether (TPMNP)

[0183] <Resin Performance Evaluation>

[0184] (1) Debonding property test

[0185] 10 mg of each of the adhesive resins shown in Table 3 was placed in an aluminum dish and heated to 500°C at a rate of 10°C per minute in either atmospheric or nitrogen atmosphere. The residue was measured to evaluate the debinding characteristics. Samples with less than 1.5% residue were designated as "A: Acceptable, Excellent," samples with 1.5% to less than 3% residue were designated as "B: Acceptable, Good," and samples with more than 3% residue were designated as "C: Unacceptable," as recorded in Table 3. Furthermore, the residue in the recycled aluminum dish was visually confirmed. The results are shown below. Figures 3-12 .

[0186]

[0187] (2) Solubility test

[0188] Solubility tests were conducted using the methods described below.

[0189] Two g each of TETRAX6T and the polyvinyl butyral used in the dielectric were added to 8 g of the organic solvent shown in Table 4, and the dissolution results were evaluated. Here, the sample that dissolved uniformly and transparently is designated as "A", the sample that was uniform but slightly turbid is designated as "B", the sample that was uniform but thick and turbid or had a residual gel feel is designated as "C", the sample that was non-uniform and significantly turbid is designated as "D", and the sample that was substantially undissolved or showed swelling is designated as "E", as recorded in Table 4.

[0190]

[0191] It should be noted that for polybutene (polybutene HV-100 and polybutene HV-50, both manufactured by ENEOS) with a weight-average molecular weight (Mw) as low as 2470 (outside the scope of this invention) and an absolute viscosity of less than 26.3 Pa·s at a temperature of 40°C and a shear rate of 0.10 / s, the same tests as in Experimental Example 1 were conducted, and the same results as in Comparative Examples 1 and 2 were confirmed. Furthermore, for polybutene (TETRAX 3T, TETRAX 4T, TETRAX 5T) with a weight-average molecular weight (Mw) in the range of 6940 to 72400 and an absolute viscosity in the range of 171.1 Pa·s to 433395.8 Pa·s at a temperature of 40°C and a shear rate of 0.10 / s, the same tests as in Experimental Examples 1 to 3 were conducted, and the same results as in Examples 2 to 5 were confirmed.

Claims

1. A conductive paste comprising conductive powder, a binder resin, and an organic solvent. The adhesive resin contains one or more types of polybutene, and the total weight-average molecular weight (Mw) of the polybutene component is 3700 or more.

2. The conductive paste according to claim 1, wherein, The overall weight-average molecular weight (Mw) of the polybutene component is above 4000.

3. The conductive paste according to claim 2, wherein, The overall weight-average molecular weight (Mw) of the polybutene component is above 4300.

4. The conductive paste according to claim 3, wherein, The overall weight-average molecular weight (Mw) of the polybutene component is above 4500.

5. A conductive paste comprising conductive powder, a binder resin, and an organic solvent. The adhesive resin contains one or more types of polybutene, and the overall viscosity of the polybutene component is above 50 Pa·s at a temperature of 40°C and a shear rate of 0.10 / s.

6. The conductive paste according to claim 5, wherein, The overall viscosity of the polybutene component is above 55 Pa·s at a temperature of 40°C and a shear rate of 0.10 / s.

7. The conductive paste according to claim 6, wherein, The overall viscosity of the polybutene component is above 60 Pa·s at a temperature of 40°C and a shear rate of 0.10 / s.

8. The conductive paste according to claim 7, wherein, The overall viscosity of the polybutene component is above 80 Pa·s at a temperature of 40°C and a shear rate of 0.10 / s.

9. The conductive paste according to claim 1 or 5, wherein, The organic solvent includes hydrocarbon solvents.

10. The conductive paste according to claim 1 or 5, wherein, The organic solvent comprises one or more selected from terpineol, dihydroterpineol, dihydroterpineol acetate, petroleum hydrocarbons, cycloalkyl acetate, dialkylene glycol dialkyl ether, and trialkylene glycol dialkyl ether.

11. The conductive paste according to claim 10, wherein, The organic solvent comprises one or more selected from mineral oil, turpentine, isoparaffins, n-paraffins, cycloalkanes, and cycloalkyl acetates.

12. The conductive paste according to claim 1 or 5, wherein, The conductive powder is a metal powder.

13. The conductive paste according to claim 1 or 5, used for forming internal electrodes in laminated ceramic electronic components.

14. An electronic component having: A matrix layer containing polyvinyl butyral, and The electrode layer is laminated on the substrate layer using the conductive paste as described in claim 1 or 5.

Images