System for performing fluid analysis
By using support structures and sealants to isolate the flow path in the fluid analysis system, the inaccuracy and instability problems of the fluid analysis system are solved, and the accuracy of fluid characteristic measurement and system stability are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-22
- Publication Date
- 2026-05-22
AI Technical Summary
Existing fluid analysis systems suffer from inaccuracies, inefficiencies, and inconsistencies. In particular, they are difficult to measure fluid properties stably during fluid flow, and changes in system size can lead to sensor drift and premature failure.
A support structure is used to support the fluid guide and sensing die, and the flow path and entry area are isolated by sealant to ensure that the fluid flows on a continuous horizontal surface. Measurements are performed by combining a printed circuit board and fluid analysis circuitry, and the system is tolerant of size variations.
It enables accurate, efficient and consistent fluid analysis during fluid flow, reduces sensor drift, and improves system stability and lifespan.
Smart Images

Figure CN122072247A_ABST
Abstract
Description
Technical Field
[0001] The embodiments disclosed herein relate to a system for performing fluid analysis. Background Technology
[0002] The applicant has recognized the numerous technical challenges and difficulties associated with performing fluid analysis. Through exerted effort, originality, and innovation, the applicant has solved problems related to fluid analysis by developing solutions embodied in this disclosure, which are described in detail below. Summary of the Invention
[0003] The various implementation schemes described herein relate to a system for performing fluid analysis.
[0004] According to one aspect of this disclosure, a system is provided. In some embodiments, the system includes a support structure. In some embodiments, the system includes a sensing die disposed on the support structure. In some embodiments, the system includes a fluid guide. In some embodiments, the fluid guide is supported by the sensing die at a first position and by the support structure at second and third positions. In some embodiments, the fluid guide defines a flow path configured to receive fluid. In some embodiments, the sensing die includes a sensing portion configured to measure one or more characteristics of the fluid in the flow path.
[0005] In some implementations, the support structure includes a printed circuit board (PCB).
[0006] In some implementations, the flow path includes the bottom surface.
[0007] In some implementations, the bottom surface is flush with the sensing portion of the sensing die.
[0008] In some implementations, at least a portion of the top surface of the sealant is flush with the sensing portion of the sensing die.
[0009] In some implementations, at a first position, the bottom surface of the fluid guide wall is positioned on a support portion of the top surface of the sensing die.
[0010] In some implementations, the fluid guide defines the access area.
[0011] In some implementations, the entry area is separated from the flow path at least by the wall of the fluid guide.
[0012] In some implementations, the entry area is separated from the flow path at least by a sealant.
[0013] In some implementations, the system includes a sealant disposed on the support structure.
[0014] In some implementations, the sealant is disposed on the support structure such that the sealant contacts at least one sidewall of the sensing die and the fluid guide.
[0015] In some embodiments, at the second position, the first support protrusion of the fluid guide is disposed on the top surface of the support structure, and at the third position, the second support protrusion of the fluid guide is disposed on the top surface of the support structure.
[0016] In some implementations, the first support protrusion and the second support protrusion are located on the bottom surface of the fluid guide.
[0017] In some implementations, at least a portion of the bottom surface of the fluid guide is separated from the top surface of the support structure by an air gap.
[0018] In some implementations, the flow path is configured to receive fluid via an inlet portion of the fluid guide and discharge fluid via an outlet portion of the fluid guide.
[0019] In some implementations, the support structure includes one or more electrical connectors and fluid analysis circuitry.
[0020] In some implementations, one or more of the electrical connectors connect the sensing die to the fluid analysis circuitry.
[0021] In some implementations, one or more features include traffic.
[0022] In some implementations, one or more properties include thermal conductivity or viscosity.
[0023] According to another aspect of this disclosure, a system is provided.
[0024] In some embodiments, the system includes a support structure. In some embodiments, the system includes a sensing die disposed on the support structure. In some embodiments, the system includes a fluid guide. In some embodiments, the fluid guide is supported by the sensing die at a first location and by the support structure at second and third locations. In some embodiments, the fluid guide defines a flow path configured to receive fluid. In some embodiments, the sensing die includes a sensing portion configured to measure one or more characteristics of the fluid in the flow path. In some embodiments, the system includes a housing that surrounds a central portion of the support structure, the sensing die, and the fluid guide.
[0025] In some implementations, the fluid guide includes an inlet portion and an outlet portion.
[0026] In some implementations, the inlet and outlet portions protrude outward from the housing.
[0027] According to another aspect of this disclosure, a manufacturing method is provided. In some embodiments, the manufacturing method includes providing a support structure. In some embodiments, the manufacturing method includes disposing a sensing die on the support structure. In some embodiments, the manufacturing method includes disposing a fluid guide on the support structure and the sensing die. In some embodiments, the fluid guide is disposed on the support structure and the sensing die such that the fluid guide is supported by the sensing die at a first position and by the support structure at second and third positions. In some embodiments, the fluid guide defines a flow path configured to receive fluid. In some embodiments, the sensing die includes a sensing portion configured to measure one or more characteristics of the fluid in the flow path.
[0028] In some implementations, the manufacturing method includes applying a sealant to the support structure.
[0029] In some implementations, the sealant is disposed on the support structure such that the sealant contacts at least one sidewall of the sensing die and the fluid guide.
[0030] The above description of the invention is provided merely to outline some exemplary embodiments in order to provide a basic understanding of some aspects of this disclosure. Therefore, it should be understood that the above embodiments are merely illustrative and should not be construed as limiting the scope or substance of this disclosure in any way. It should be understood that, in addition to those outlined herein, the scope of this disclosure covers many possible embodiments, some of which will be further described below. Attached Figure Description
[0031] Reference will now be made to the accompanying drawings. In some embodiments described herein, the components illustrated in the drawings may or may not be present. Some embodiments may include fewer (or more) components than those shown in the drawings of the exemplary embodiments according to this disclosure.
[0032] Figure 1 A perspective view of a system according to one or more embodiments of this disclosure is illustrated;
[0033] Figure 2 A partial perspective view of a system according to one or more embodiments of the present disclosure is illustrated;
[0034] Figure 3 A partial perspective view of a system according to one or more embodiments of the present disclosure is illustrated;
[0035] Figure 4 A partial perspective view of a system according to one or more embodiments of the present disclosure is illustrated;
[0036] Figure 5 A partial perspective view of a system according to one or more embodiments of the present disclosure is illustrated;
[0037] Figure 6 A partial cross-sectional view of a system according to one or more embodiments of the present disclosure is illustrated;
[0038] Figure 7 A perspective view of a sensing die according to one or more embodiments of the present disclosure is illustrated;
[0039] Figure 8 A partial top view of an example system according to one or more embodiments of the present disclosure is illustrated;
[0040] Figure 9 A partial perspective view of a system according to one or more embodiments of the present disclosure is illustrated;
[0041] Figure 10 A partial perspective view of a system according to one or more embodiments of the present disclosure is illustrated;
[0042] Figure 11 A partial perspective view of a system according to one or more embodiments of the present disclosure is illustrated;
[0043] Figure 12 A partial perspective view of a system according to one or more embodiments of the present disclosure is illustrated;
[0044] Figure 13 A partial cross-sectional view of a system according to one or more embodiments of the present disclosure is illustrated;
[0045] Figure 14 Partial perspective views of a system according to one or more embodiments of the present disclosure are illustrated; and
[0046] Figure 15 A flowchart illustrating an example method according to one or more embodiments of this disclosure is provided. Detailed Implementation
[0047] Example embodiments will be described more fully below with reference to the accompanying drawings, which illustrate some, but not all, of the embodiments of this disclosure. In fact, embodiments of this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will meet applicable legal requirements. Similar reference numerals always refer to similar elements.
[0048] Overview
[0049] The example implementations disclosed herein address technical problems associated with systems used to perform fluid analysis. As those skilled in the art to which this disclosure pertains will understand, there are numerous example scenarios where systems are desired for performing fluid analysis.
[0050] In many applications, it may be desirable to perform fluid analysis. For example, it may be desirable to perform fluid analysis of a fluid to measure one or more properties of the fluid, such as its flow rate. In many applications, it may be desirable to perform fluid analysis on a fluid that is currently flowing. For example, it may be desirable to perform fluid analysis on a fluid that is flowing through a pipe. In this way, fluid analysis can be performed without interrupting one or more processes that depend on the flowing fluid. In many applications, it may be desirable to perform fluid analysis using systems constructed using repeatable methods. For example, it may be desirable to perform fluid analysis using systems constructed at least partially using plastic molding. In this way, many similar systems can be quickly constructed and used to perform fluid analysis in many applications.
[0051] Example solutions for systems used to perform fluid analysis involve using sensors to measure one or more properties of a fluid. However, such example solutions are inaccurate, inefficient, and inconsistent. For example, they are inaccurate because they are prone to sensor drift. In this respect, for instance, they are prone to sensor drift because they cannot create a stable flow path near the sensor measuring one or more properties of the fluid. Therefore, they cannot obtain stable measurements of one or more properties of the fluid over time. As another example, they are inefficient because they cannot perform fluid analysis while the fluid is in motion. Therefore, in such example solutions, one or more processes dependent on the fluid flow must be interrupted to perform fluid analysis. As another example, they are inconsistent because they are not designed to tolerate variations in system dimensions introduced by the manufacturing process (e.g., variations in the dimensions of the system's plastic parts introduced by the plastic molding process). Therefore, because such example solutions cannot tolerate variations in system dimensions introduced by the manufacturing process, they often fail prematurely and / or must be reconfigured before use. Therefore, there is a need for systems that can perform fluid analysis in an accurate, efficient and consistent manner.
[0052] Therefore, to address these and / or other problems associated with systems used to perform fluid analysis, example systems and associated methods are provided herein. For example, embodiments of this disclosure, described in more detail below, include a system comprising a support structure. In some embodiments, the system includes a sensing die disposed on the support structure. In some embodiments, the system includes a fluid guide. In some embodiments, the fluid guide is supported by the sensing die at a first location and by the support structure at second and third locations. In some embodiments, the fluid guide defines a flow path configured to receive fluid. In some embodiments, the sensing die includes a sensing portion configured to measure one or more properties of the fluid in the flow path. Therefore, the example systems and associated methods provided herein enable fluid analysis to be performed accurately, efficiently, and consistently.
[0053] Example System
[0054] The embodiments of this disclosure herein include a system 102 for performing fluid analysis. It should be readily understood that embodiments of the system 102 described herein can be configured in various additional and alternative ways, in addition to those expressly described herein.
[0055] refer to Figures 1 to 14 The diagram illustrates a system 102 for performing fluid analysis. In this regard, for example, system 102 may be configured to perform analysis on gases, liquids, etc. In some embodiments, performing fluid analysis includes system 102 being configured to measure one or more properties of the fluid. In some embodiments, one or more properties of the fluid include the fluid's flow rate. In this regard, for example, system 102 may be configured to measure the fluid's flow rate. In some embodiments, one or more properties of the fluid include the fluid's thermal conductivity. In this regard, for example, system 102 may be configured to measure the fluid's thermal conductivity. In some embodiments, one or more properties of the fluid include the fluid's viscosity. In this regard, for example, system 102 may be configured to measure the fluid's viscosity. In some embodiments, by measuring the fluid's flow rate, thermal conductivity, and / or viscosity, system 102 is configured to identify the fluid (e.g., the type of fluid).
[0056] In some embodiments, system 102 includes a support structure 114. In some embodiments, the support structure 114 is any structure capable of supporting the fluid guide 106, the sensing die 116, the sealant 134, and / or any structure, device, etc., configured to facilitate the measurement of one or more properties of the fluid. For example, the support structure 114 may be a printed circuit board (PCB). In some embodiments, the support structure 114 includes one or more of the following: plastic, metal, composite material, insulating material, conductive material, etc. In some embodiments, the support structure 114 includes one or more surfaces. For example, the support structure 114 may include a top surface 158.
[0057] In some embodiments, the support structure 114 includes a fluid analysis circuit 126. In some embodiments, the fluid analysis circuit 126 includes an application-specific integrated circuit (ASIC). In some embodiments, the fluid analysis circuit 126 is configured to facilitate fluid analysis. For example, the fluid analysis circuit 126 may be configured to facilitate the measurement of fluid flow rate, fluid thermal conductivity, and / or fluid viscosity. As another example, based on the measured flow rate, measured thermal conductivity, and / or measured viscosity of the fluid, the fluid analysis circuit 126 may be configured to identify the fluid. In some embodiments, the support structure 114 includes one or more electrical connectors 124. In some embodiments, the one or more electrical connectors 124 include one or more wires, traces (e.g., conductive traces), etc. In some embodiments, one or more electrical connectors 124 are connected to the fluid analysis circuit 126.
[0058] In some embodiments, system 102 includes a sensing die 116. In some embodiments, the sensing die 116 is any shape suitable for facilitating fluid analysis. For example, the sensing die 116 may be a rectangular prism (e.g., a cube), a cylinder, a sphere, and / or any other suitable shape. In some embodiments, the sensing die 116 includes one or more sidewalls 120. For example, when the sensing die 116 is a rectangular prism, the one or more sidewalls 120 may include four sidewalls.
[0059] In some embodiments, the sensing die 116 includes a bottom surface 122. In some embodiments, the sensing die 116 is disposed on a support structure 114. In this regard, in some embodiments, the bottom surface 122 of the sensing die 116 is fixed to, secured to, or attached to a top surface 158 of the support structure 114, supported by, and / or in contact with the top surface. For example, the bottom surface 122 of the sensing die 116 may be fixed to the top surface 158 of the support structure 114 via adhesives, screws, fasteners, etc.
[0060] In some embodiments, the sensing die 116 includes a top surface 118. In some embodiments, the top surface 118 of the sensing die 116 includes a sensing portion 132. In some embodiments, the sensing portion 132 is configured to measure one or more properties of a fluid. In some embodiments, the sensing portion 132 is configured to measure one or more properties of a fluid as the fluid flows across the sensing portion 132. For example, the sensing portion 132 may be configured to measure the flow rate of the fluid as the fluid flows across the sensing portion 132.
[0061] In some embodiments, the top surface 118 of the sensing die 116 includes a connection portion 128. In some embodiments, the connection portion 128 connects to one or more electrical connectors 124. In this respect, in some embodiments, one or more electrical connectors 124 connect the sensing die 116 to the fluid analysis circuit 126. For example, one or more measurements taken by the sensing portion 132 of the sensing die 116 may be provided to the fluid analysis circuit 126 via the connection portion 128 and / or one or more electrical connectors 124.
[0062] In some embodiments, the top surface 118 of the sensing die 116 includes a support portion 130. In some embodiments, the support portion 130 is configured to at least partially support one or more other components of the system 102. In some embodiments, the support portion 130 is located on the top surface 118 of the sensing die 116 between the connection portion 128 and the sensing portion 132. In this regard, for example, the connection portion 128 may be located at an upper portion of the top surface 118, the support portion 130 may be located at a middle portion of the top surface 118, and the sensing portion 132 may be located at a lower portion of the top surface 118.
[0063] In some embodiments, system 102 includes a fluid guide 106. In some embodiments, the fluid guide 106 includes one or more of plastic, metal, composite material, and / or any other suitable material for facilitating the measurement of one or more properties of the fluid. For example, the fluid guide 106 may be a molded part of plastic. In some embodiments, the fluid guide 106 includes a central portion 162. In some embodiments, the fluid guide 106 includes an inlet portion 110. In some embodiments, the fluid guide 106 is configured to receive fluid via the inlet portion 110. For example, the inlet portion 110 may include an opening through which the fluid guide 106 is configured to receive fluid. In some embodiments, the fluid guide 106 includes an outlet portion 112. In some embodiments, the fluid guide 106 is configured to discharge fluid via the outlet portion 112. For example, the outlet portion 112 may include an opening through which the fluid guide 106 is configured to discharge fluid.
[0064] In some embodiments, inlet portion 110 is configured to connect to one or more pipes that supply fluid to system 102 via inlet portion 110. In some embodiments, outlet portion 112 is configured to connect to one or more pipes that receive fluid discharged from system 102 via outlet portion 112. Although described herein as inlet portion 110 configured to receive fluid and outlet portion 112 configured to discharge fluid, those skilled in the art to which this disclosure pertains will understand that inlet portion 110 may be configured to discharge fluid and outlet portion 112 may be configured to receive fluid.
[0065] In various embodiments, the fluid guide 106 defines a flow path 136. In some embodiments, the flow path 136 is a portion of the fluid guide 106 through which fluid can flow. For example, the flow path 136 may be a chamber through which fluid flows. In some embodiments, fluid may flow from an inlet portion 110 through the flow path 136 to an outlet portion 112. In some embodiments, the flow path 136 includes a bottom surface 138.
[0066] In some embodiments, the fluid guide 106 defines an access region 140. In some embodiments, the access region 140 is a portion of the fluid guide 106 through which at least a portion of the sensing die 116 can be accessed. For example, the access region 140 may be a portion of the fluid guide 106 through which access to the connection portion 128 of the sensing die 116 can be accessed. In some embodiments, the fluid guide 106 includes a cap 108. In some embodiments, the cap 108 is capable of accessing the flow path 136 and / or the access region 140 during the construction of the system 102. For example, the cap 108 may be capable of accessing the flow path 136 and / or the access region 140 during the construction of the system 102 to apply sealant 134 to the support structure 114. Additionally or alternatively, the cap 108 may seal the flow path 136 and / or the access region 140. For example, the cap 108 may be used to seal the flow path 136 and / or the access region 140 after the sealant 134 has been applied to the support structure 114.
[0067] In some embodiments, the fluid guide 106 includes a wall 142. In some embodiments, the inlet region 140 is separated from the flow path 136 at least by the wall 142 of the fluid guide 106. For example, the wall 142 may at least partially separate the flow path 136 and the inlet region 140. In some embodiments, the wall 142 includes a bottom surface 152.
[0068] In some embodiments, the fluid guide 106 is supported by the sensing die 116. In some embodiments, the fluid guide 106 is supported by the sensing die 116 at a first position 144. In some embodiments, at the first position 144, the bottom surface 152 of the wall 142 is disposed on the support portion 130 of the top surface 118 of the sensing die 116. In this respect, in some embodiments, the bottom surface 152 of the wall 142 of the fluid guide 106 is fixed to, secured to, or attached to the support portion 130 of the top surface 118 of the sensing die 116, supported by and / or in contact with the support portion. For example, the bottom surface 152 of the wall 142 of the fluid guide 106 may be fixed to the support portion 130 of the top surface 118 of the sensing die 116 via adhesives, screws, fasteners, etc.
[0069] In some embodiments, the fluid guide 106 includes a first support protrusion 154. In some embodiments, the fluid guide 106 includes a second support protrusion 156. In some embodiments, the first support protrusion 154 and / or the second support protrusion 156 are located on and extend outward from the bottom surface 160 of the fluid guide 106. In this regard, for example, the fluid guide 106 may be created (e.g., molded) such that the bottom surface 160 of the fluid guide 106 includes the first support protrusion 154 and / or the second support protrusion 156 extending outward from the bottom surface 160 of the fluid guide 106.
[0070] In some embodiments, the fluid guide 106 is supported by a support structure 114. In some embodiments, the fluid guide 106 is supported by the support structure 114 at a second position 146. In some embodiments, at the second position 146, a first support protrusion 154 is disposed on the top surface 158 of the support structure 114. In this respect, in some embodiments, the first support protrusion 154 is fixed to, secured to, attached to, and supported by and / or in contact with the top surface 158 of the support structure 114. For example, the first support protrusion 154 may be fixed to the top surface 158 of the support structure 114 by means of adhesives, screws, fasteners, etc.
[0071] Additionally or alternatively, the fluid guide 106 is supported by the support structure 114 at the third position 148. In some embodiments, at the third position 148, a second support protrusion 156 is provided on the top surface 158 of the support structure 114. In this respect, in some embodiments, the second support protrusion 156 is secured to, fastened to, attached to, supported by, and / or in contact with the top surface 158 of the support structure 114. For example, the second support protrusion 156 may be secured to the top surface 158 of the support structure 114 via adhesives, screws, fasteners, etc. In other words, for example, the fluid guide 106 may be supported at the first position 144, the second position 146, and / or the third position 148.
[0072] In some embodiments, at least a portion of the bottom surface 160 of the fluid guide 106 is separated from the top surface 158 of the support structure 114 by an air gap 150. In this respect, in some embodiments, one or more structural variations in the fluid guide 106 can be described by the air gap 150. In other words, for example, the fluid guide 106 can be constructed using a process (e.g., plastic molding) that introduces minute variations in the dimensions of the fluid guide 106 compared to its design dimensions. Therefore, in some embodiments, by supporting the fluid guide 106 at a first position 144, a second position 146, and / or a third position 148 to ensure the existence of an air gap 150 between at least a portion of the bottom surface 160 of the fluid guide 106 and the top surface 158 of the support structure 114, the system 102 is able to tolerate minute variations in the dimensions of the fluid guide 106 compared to its design dimensions (e.g., and still for performing fluid analysis).
[0073] In some embodiments, system 102 includes a sealant 134. In some embodiments, the sealant 134 is disposed on the support structure 114. For example, the sealant 134 may be disposed on the top surface 158 of the support structure 114. In some embodiments, the sealant 134 occupies the space between one or more sidewalls 120 of the sensing die 116 and the fluid guide 106. In this respect, in some embodiments, the sealant 134 contacts one or more of the sidewalls 120 of the sensing die 116 and the fluid guide 106.
[0074] In some embodiments, the sealant 134 has a thickness (t) equal to the distance between at least one of the sidewalls 120 and the fluid guide 106. For example, the sealant 134 may have a thickness (t) between 0.15 mm and 0.30 mm. In this respect, in some embodiments, the distance between at least one of the sidewalls 120 and the fluid guide 106 may be between 0.15 mm and 0.30 mm. For example, the fluid guide 106 may be configured (e.g., molded) such that when the fluid guide 106 is disposed on the support structure 114 and the sensing die 116, the distance between at least one of the sidewalls 120 and the fluid guide 106 is between 0.15 mm and 0.30 mm. In some embodiments, the sealant 134 has a height (h2). In some embodiments, the height (h2) of the sealant 134 is approximately equal to the height (h1) of the sensing die 116.
[0075] In some embodiments, at least a portion of the top surface 164 of the sealant 134 is flush with the top surface 118 of the sensing die 116. For example, a portion of the top surface 164 of the sealant 134 near the sensing portion 132 may be flush with the top surface 118 of the sensing die 116. Additionally or alternatively, the bottom surface 138 of the flow path 136 is flush with the top surface 118 of the sensing die 116. Additionally or alternatively, at least a portion of the top surface 164 of the sealant 134 is flush with the bottom surface 138 of the flow path 136. In other words, for example, the fluid guide 106, the sensing die 116, and the sealant 134 may be configured such that at least a portion of the top surface 164 of the sealant 134, the top surface 118 of the sensing die 116, and the bottom surface 138 of the flow path 136 are flush with each other. In this regard, in some embodiments, the fluid can flow over a continuous horizontal surface as it flows over the bottom surface 138 of the flow path 136, then over the top surface 164 of the sealant 134, and then over the top surface 118 of the sensing die 116. In some embodiments, by ensuring that the fluid can flow over a continuous horizontal surface as it approaches the sensing portion 132 of the sensing die 116, the system 102 is able to obtain more accurate measurements of one or more characteristics of the fluid (e.g., flow rate) over time and / or avoid sensor drift (e.g., measurement drift).
[0076] In some embodiments, the entry area 140 is separated from the flow path 136 at least by a sealant 134. In this respect, in some embodiments, the entry area 140 and the flow path 136 may be isolated from each other by the sealant 134 and / or the wall 142 of the fluid guide 106. In some embodiments, by isolating the entry area 140 and the flow path 136 from each other, fluid flowing through the flow path 136 can be prevented from entering the entry area 140.
[0077] In some embodiments, sealant 134 is disposed in liquid form on the top surface 158 of support structure 114 via inlet region 140. In this regard, for example, sealant 134 may penetrate into flow path 136 and surround sensing die 116 from all sides. In some embodiments, sealant 134 may be cured after it surrounds sensing die 116. In some embodiments, sealant 134 is any material suitable for isolating inlet region 140 and flow path 136 from each other and / or suitable for ensuring that bottom surface 138 of flow path 136, at least a portion of top surface 164 of sealant 134, and top surface 118 of sensing die 116 are flush with each other. For example, sealant 134 may be a low-viscosity sealant such as silicone, epoxy, or polyurethane. In some embodiments, sealant 134 may be cured by heat (e.g., heat above room temperature), room temperature air, visible light, ultraviolet (UV) light, and / or moisture.
[0078] In some embodiments, sealant 134 covers the connection portion 128 of the sensing die 116. In this respect, for example, sealant 134 protects the connection portion 128 of the sensing die 116 from corrosion and / or other damage. In some embodiments, system 102 does not include sealant 134. In this respect, for example, when system 102 does not include sealant 134, gaps (e.g., air gaps) may exist in the space between one or more sidewalls 120 of the sensing die 116 and the fluid guide 106.
[0079] In some embodiments, system 102 includes a housing 104. In some embodiments, housing 104 surrounds support structure 114. Additionally or alternatively, housing 104 surrounds sensing die 116. Additionally or alternatively, housing 104 surrounds a central portion 162 of fluid guide 106. In other words, for example, support structure 114, sensing die 116, and / or the central portion 162 of fluid guide 106 may be enclosed in housing 104. In some embodiments, fluid guide 106 comprises one or more of plastic, metal, and composite materials, and / or surrounds support structure 114, sensing die 116, and the central portion 162 of fluid guide 106. In some embodiments, inlet portion 110 and / or outlet portion 112 project outward from housing 104. For example, inlet portion 110 may project outward from a first side of housing 104, and outlet portion 112 may project outward from a second side of housing 104.
[0080] Example Method
[0081] Now for reference Figure 15A flowchart of example method 1500 is provided. In some embodiments, method 1500 is a manufacturing method. For example, method 1500 may be a method of manufacturing system 102 and / or one or more components of system 102.
[0082] As shown in box 1510, method 1500 may include providing a support structure. As described above, in some embodiments, the support structure 114 is any structure capable of supporting the fluid guide 106, the sensing die 116, the sealant 134, and / or any structure, device, etc., configured to facilitate the measurement of one or more properties of the fluid. For example, the support structure 114 may be a printed circuit board (PCB). In some embodiments, the support structure 114 includes one or more of plastics, metals, composite materials, insulating materials, conductive materials, etc. In some embodiments, the support structure 114 includes one or more surfaces. For example, the support structure 114 may include a top surface 158.
[0083] In some embodiments, the support structure 114 includes a fluid analysis circuit 126. In some embodiments, the fluid analysis circuit 126 includes an application-specific integrated circuit (ASIC). In some embodiments, the fluid analysis circuit 126 is configured to facilitate fluid analysis. For example, the fluid analysis circuit 126 may be configured to facilitate the measurement of fluid flow rate, fluid thermal conductivity, and / or fluid viscosity. As another example, based on the measured flow rate, measured thermal conductivity, and / or measured viscosity of the fluid, the fluid analysis circuit 126 may be configured to identify the fluid. In some embodiments, the support structure 114 includes one or more electrical connectors 124. In some embodiments, the one or more electrical connectors 124 include one or more wires, traces (e.g., conductive traces), etc. In some embodiments, one or more electrical connectors 124 are connected to the fluid analysis circuit 126.
[0084] As shown in box 1520, method 1500 may include positioning a sensing die on a support structure. As described above, in some embodiments, the sensing die 116 is any shape suitable for facilitating fluid analysis. For example, the sensing die 116 may be a rectangular prism (e.g., a cube), a cylinder, a sphere, and / or any other suitable shape. In some embodiments, the sensing die 116 includes one or more sidewalls 120. For example, when the sensing die 116 is a rectangular prism, the one or more sidewalls 120 may include four sidewalls.
[0085] In some embodiments, the sensing die 116 includes a bottom surface 122. In some embodiments, the sensing die 116 is disposed on a support structure 114. In this regard, in some embodiments, the bottom surface 122 of the sensing die 116 is fixed to, secured to, or attached to a top surface 158 of the support structure 114, supported by, and / or in contact with the top surface. For example, the bottom surface 122 of the sensing die 116 may be fixed to the top surface 158 of the support structure 114 via adhesives, screws, fasteners, etc.
[0086] In some embodiments, the sensing die 116 includes a top surface 118. In some embodiments, the top surface 118 of the sensing die 116 includes a sensing portion 132. In some embodiments, the sensing portion 132 is configured to measure one or more properties of a fluid. In some embodiments, the sensing portion 132 is configured to measure one or more properties of a fluid as the fluid flows across the sensing portion 132. For example, the sensing portion 132 may be configured to measure the flow rate of the fluid as the fluid flows across the sensing portion 132.
[0087] In some embodiments, the top surface 118 of the sensing die 116 includes a connection portion 128. In some embodiments, the connection portion 128 connects to one or more electrical connectors 124. In this respect, in some embodiments, one or more electrical connectors 124 connect the sensing die 116 to the fluid analysis circuit 126. For example, one or more measurements taken by the sensing portion 132 of the sensing die 116 may be provided to the fluid analysis circuit 126 via the connection portion 128 and / or one or more electrical connectors 124.
[0088] In some embodiments, the top surface 118 of the sensing die 116 includes a support portion 130. In some embodiments, the support portion 130 is configured to at least partially support one or more other components of the system 102. In some embodiments, the support portion 130 is located on the top surface 118 of the sensing die 116 between the connection portion 128 and the sensing portion 132. In this regard, for example, the connection portion 128 may be located at an upper portion of the top surface 118, the support portion 130 may be located at a middle portion of the top surface 118, and the sensing portion 132 may be located at a lower portion of the top surface 118.
[0089] As shown in block 1530, method 1500 may include disposing a fluid guide on a support structure and a sensing die. As described above, in some embodiments, the fluid guide 106 includes one or more of plastic, metal, composite material, and / or any other suitable material for facilitating the measurement of one or more properties of the fluid. For example, the fluid guide 106 may be a molded part of plastic. In some embodiments, the fluid guide 106 includes a central portion 162. In some embodiments, the fluid guide 106 includes an inlet portion 110. In some embodiments, the fluid guide 106 is configured to receive fluid via the inlet portion 110. For example, the inlet portion 110 may include an opening through which the fluid guide 106 is configured to receive fluid. In some embodiments, the fluid guide 106 includes an outlet portion 112. In some embodiments, the fluid guide 106 is configured to discharge fluid via the outlet portion 112. For example, the outlet portion 112 may include an opening through which the fluid guide 106 is configured to discharge fluid.
[0090] In some embodiments, inlet portion 110 is configured to connect to one or more pipes that supply fluid to system 102 via inlet portion 110. In some embodiments, outlet portion 112 is configured to connect to one or more pipes that receive fluid discharged from system 102 via outlet portion 112. Although described herein as inlet portion 110 configured to receive fluid and outlet portion 112 configured to discharge fluid, those skilled in the art to which this disclosure pertains will understand that inlet portion 110 may be configured to discharge fluid and outlet portion 112 may be configured to receive fluid.
[0091] In various embodiments, the fluid guide 106 defines a flow path 136. In some embodiments, the flow path 136 is a portion of the fluid guide 106 through which fluid can flow. For example, the flow path 136 may be a chamber through which fluid flows. In some embodiments, fluid may flow from an inlet portion 110 through the flow path 136 to an outlet portion 112. In some embodiments, the flow path 136 includes a bottom surface 138.
[0092] In some embodiments, the fluid guide 106 defines an access region 140. In some embodiments, the access region 140 is a portion of the fluid guide 106 through which access is available to at least a portion of the sensing die 116. For example, the access region 140 may be a portion of the fluid guide 106 through which access is available to the connection portion 128 of the sensing die 116. In some embodiments, the fluid guide 106 includes a cap 108. In some embodiments, the cap 108 is capable of accessing the flow path 136 and / or the access region 140 during the construction of the system 102. For example, the cap 108 may be capable of accessing the flow path 136 and / or the access region 140 during the construction of the system 102 to provide sealant 134 onto the support structure 114. Additionally or alternatively, the cap 108 may seal the flow path 136 and / or the access region 140. For example, the cap may be used to seal the flow path 136 and / or the access region 140 after the sealant 134 has been applied to the support structure 114.
[0093] In some embodiments, the fluid guide 106 includes a wall 142. In some embodiments, the inlet region 140 is separated from the flow path 136 at least by the wall 142 of the fluid guide 106. For example, the wall 142 may at least partially separate the flow path 136 and the inlet region 140. In some embodiments, the wall 142 includes a bottom surface 152.
[0094] In some embodiments, the fluid guide 106 is supported by the sensing die 116. In some embodiments, the fluid guide 106 is supported by the sensing die 116 at a first position 144. In some embodiments, at the first position 144, the bottom surface 152 of the wall 142 is disposed on the support portion 130 of the top surface 118 of the sensing die 116. In this respect, in some embodiments, the bottom surface 152 of the wall 142 of the fluid guide 106 is fixed to, secured to, or attached to the support portion 130 of the top surface 118 of the sensing die 116, supported by and / or in contact with the support portion. For example, the bottom surface 152 of the wall 142 of the fluid guide 106 may be fixed to the support portion 130 of the top surface 118 of the sensing die 116 via adhesives, screws, fasteners, etc.
[0095] In some embodiments, the fluid guide 106 includes a first support protrusion 154. In some embodiments, the fluid guide 106 includes a second support protrusion 156. In some embodiments, the first support protrusion 154 and / or the second support protrusion 156 are located on and extend outward from the bottom surface 160 of the fluid guide 106. In this regard, for example, the fluid guide 106 may be created (e.g., molded) such that the bottom surface 160 of the fluid guide 106 includes the first support protrusion 154 and / or the second support protrusion 156 extending outward from the bottom surface 160 of the fluid guide 106.
[0096] In some embodiments, the fluid guide 106 is supported by a support structure 114. In some embodiments, the fluid guide 106 is supported by the support structure 114 at a second position 146. In some embodiments, at the second position 146, a first support protrusion 154 is disposed on the top surface 158 of the support structure 114. In this respect, in some embodiments, the first support protrusion 154 is fixed to, secured to, attached to, and supported by and / or in contact with the top surface 158 of the support structure 114. For example, the first support protrusion 154 may be fixed to the top surface 158 of the support structure 114 by means of adhesives, screws, fasteners, etc.
[0097] Additionally or alternatively, the fluid guide 106 is supported by the support structure 114 at the third position 148. In some embodiments, at the third position 148, a second support protrusion 156 is provided on the top surface 158 of the support structure 114. In this respect, in some embodiments, the second support protrusion 156 is secured to, fastened to, attached to, supported by, and / or in contact with the top surface 158 of the support structure 114. For example, the second support protrusion 156 may be secured to the top surface 158 of the support structure 114 via adhesives, screws, fasteners, etc. In other words, for example, the fluid guide 106 may be supported at the first position 144, the second position 146, and / or the third position 148.
[0098] In some embodiments, at least a portion of the bottom surface 160 of the fluid guide 106 is separated from the top surface 158 of the support structure 114 by an air gap 150. In this respect, in some embodiments, one or more structural variations in the fluid guide 106 can be described by the air gap 150. In other words, for example, the fluid guide 106 can be constructed using a process (e.g., plastic molding) that introduces minute variations in the dimensions of the fluid guide 106 compared to its design dimensions. Therefore, in some embodiments, by supporting the fluid guide 106 at a first position 144, a second position 146, and / or a third position 148 to ensure the existence of an air gap 150 between at least a portion of the bottom surface 160 of the fluid guide 106 and the top surface 158 of the support structure 114, the system 102 is able to tolerate minute variations in the dimensions of the fluid guide 106 compared to its design dimensions (e.g., and still for performing fluid analysis).
[0099] As shown in block 1540, method 1500 may include applying a sealant to a support structure. As described above, in some embodiments, sealant 134 is applied to support structure 114. For example, sealant 134 may be applied to the top surface 158 of support structure 114. In some embodiments, sealant 134 occupies the space between one or more sidewalls 120 of sensing die 116 and fluid guide 106. In this respect, in some embodiments, sealant 134 contacts one or more of the sidewalls 120 of sensing die 116 and fluid guide 106.
[0100] In some embodiments, the sealant 134 has a thickness (t) equal to the distance between at least one of the sidewalls 120 and the fluid guide 106. For example, the sealant 134 may have a thickness (t) between 0.15 mm and 0.30 mm. In this respect, in some embodiments, the distance between at least one of the sidewalls 120 and the fluid guide 106 may be between 0.15 mm and 0.30 mm. For example, the fluid guide 106 may be configured (e.g., molded) such that when the fluid guide 106 is disposed on the support structure 114 and the sensing die 116, the distance between at least one of the sidewalls 120 and the fluid guide 106 is between 0.15 mm and 0.30 mm. In some embodiments, the sealant 134 has a height (h2). In some embodiments, the height (h2) of the sealant 134 is approximately equal to the height (h1) of the sensing die 116.
[0101] In some embodiments, at least a portion of the top surface 164 of the sealant 134 is flush with the top surface 118 of the sensing die 116. For example, a portion of the top surface 164 of the sealant 134 near the sensing portion 132 may be flush with the top surface 118 of the sensing die 116. Additionally or alternatively, the bottom surface 138 of the flow path 136 is flush with the top surface 118 of the sensing die 116. Additionally or alternatively, at least a portion of the top surface 164 of the sealant 134 is flush with the bottom surface 138 of the flow path 136. In other words, for example, the fluid guide 106, the sensing die 116, and the sealant 134 may be configured such that at least a portion of the top surface 164 of the sealant 134, the top surface 118 of the sensing die 116, and the bottom surface 138 of the flow path 136 are flush with each other. In this regard, in some embodiments, the fluid can flow over a continuous horizontal surface as it flows over the bottom surface 138 of the flow path 136, then over the top surface 164 of the sealant 134, and then over the top surface 118 of the sensing die 116. In some embodiments, by ensuring that the fluid can flow over a continuous horizontal surface as it approaches the sensing portion 132 of the sensing die 116, the system 102 can obtain more accurate measurements of one or more characteristics of the fluid (e.g., flow rate) over time and / or avoid sensor drift (e.g., measurement drift).
[0102] In some embodiments, the entry area 140 is separated from the flow path 136 at least by a sealant 134. In this respect, in some embodiments, the entry area 140 and the flow path 136 may be isolated from each other by the sealant 134 and / or the wall 142 of the fluid guide 106. In some embodiments, by isolating the entry area 140 and the flow path 136 from each other, fluid flowing through the flow path 136 can be prevented from entering the entry area 140.
[0103] In some embodiments, sealant 134 is disposed in liquid form on the top surface 158 of support structure 114 via inlet region 140. In this regard, for example, sealant 134 may penetrate into flow path 136 and surround sensing die 116 from all sides. In some embodiments, sealant 134 may be cured after it surrounds sensing die 116. In some embodiments, sealant 134 is any material suitable for isolating inlet region 140 and flow path 136 from each other and / or suitable for ensuring that bottom surface 138 of flow path 136, at least a portion of top surface 164 of sealant 134, and top surface 118 of sensing die 116 are flush with each other. For example, sealant 134 may be a low-viscosity sealant such as silicone, epoxy, or polyurethane. In some embodiments, sealant 134 may be cured by heat (e.g., heat above room temperature), room temperature air, visible light, ultraviolet (UV) light, and / or moisture.
[0104] In some embodiments, sealant 134 covers the connection portion 128 of the sensing die 116. In this respect, for example, sealant 134 protects the connection portion 128 of the sensing die 116 from corrosion and / or other damage. In some embodiments, system 102 does not include sealant 134. In this respect, for example, when system 102 does not include sealant 134, gaps (e.g., air gaps) may exist in the space between one or more sidewalls 120 of the sensing die 116 and the fluid guide 106.
[0105] Those skilled in the art will appreciate many modifications and other embodiments of the invention set forth herein, which benefit from the teachings presented in the foregoing description and associated drawings. Although the drawings show only certain components of the fluid guides and systems described herein, it should be understood that various other components may be used in conjunction with the system. Therefore, it should be understood that the invention is not limited to the specific embodiments disclosed, and modifications and other embodiments are intended to be included within the scope of the appended claims. Furthermore, the steps in the described methods may not necessarily occur in the order depicted in the drawings, and in some cases, one or more of the depicted steps may occur substantially simultaneously, or additional steps may be involved. Although specific terms are used herein, they are used only in a general and descriptive sense and not for limiting purposes.
[0106] Although various embodiments based on the principles disclosed herein have been shown and described above, modifications can be made by those skilled in the art without departing from the spirit and teachings of this disclosure. The embodiments described herein are representative only and are not intended to be limiting. Many variations, combinations, and modifications are possible and are within the scope of this disclosure. Alternative embodiments obtained by merging, integrating, and / or omitting features of the embodiments are also within the scope of this disclosure. Therefore, the scope of protection is not limited by the foregoing statements.
[0107] Additionally, the section headings used herein are intended to be consistent with the recommendations of 37 CFR 1.77 or otherwise provide organizational clues. These headings should not limit or characterize any invention that may be set forth in any of the claims disclosed in this disclosure.
[0108] The use of broad terms such as “comprising,” “including,” and “having” should be understood to provide support for narrower terms such as “consisting of,” “substantially composed of,” and “substantially constituted by.” The use of terms such as “optionally,” “may,” “possibly,” and “capable,” relating to any element of the implementation, implies that the element is not essential, or alternatively, that the element is essential, both of which are within the scope of the implementation. Furthermore, references to examples are for illustrative purposes only and are not intended to be exclusive.
Claims
1. A system comprising: Support structure; A sensing chip, wherein the sensing chip is disposed on the support structure; and A fluid guide, wherein the fluid guide is supported by the sensing die at a first position and by the support structure at a second and a third position, wherein the fluid guide defines a flow path configured to receive fluid, wherein the sensing die includes a sensing portion configured to measure one or more characteristics of the fluid in the flow path.
2. The system of claim 1, wherein the support structure comprises a printed circuit board (PCB).
3. The system of claim 1, wherein the flow path includes a bottom surface, wherein the bottom surface is flush with the sensing portion of the sensing die.
4. The system of claim 3, wherein at least a portion of the top surface of the sealant is flush with the sensing portion of the sensing die.
5. The system of claim 1, wherein at the first position, the bottom surface of the wall of the fluid guide is disposed on a support portion of the top surface of the sensing die.
6. The system of claim 1, wherein the fluid guide defines an entry region, wherein the entry region is separated from the flow path at least by a wall of the fluid guide.
7. The system of claim 6, wherein the entry area is separated from the flow path at least by a sealant.
8. The system according to claim 6, further comprising: A sealant is disposed on the support structure such that the sealant contacts at least one sidewall of the sensing die and the fluid guide.
9. The system of claim 1, wherein at the second position, a first support protrusion of the fluid guide is disposed on the top surface of the support structure, and at the third position, a second support protrusion of the fluid guide is disposed on the top surface of the support structure.
10. A system comprising: Support structure; A sensing chip, wherein the sensing chip is disposed on the support structure; A fluid guide, wherein the fluid guide is supported by the sensing die at a first position and by the support structure at a second and a third position, wherein the fluid guide defines a flow path configured to receive fluid, wherein the sensing die includes a sensing portion configured to measure one or more characteristics of the fluid in the flow path; and The housing surrounds the central portion of the support structure, the sensing die, and the fluid guide.