Multilayer board three-dimensional stacking structure, one-time assembling method and assembling system thereof and electronic equipment

Abstract

The invention provides a multi-layer board three-dimensional stacking structure, a one-time assembling method and system thereof and electronic equipment. Relates to the technical field of integrated circuit manufacturing. The one-time assembling method of the multi-layer board three-dimensional stacking structure comprises the steps that a first board body is obtained, wherein the first board body comprises a first bearing part and a first stacking board, and a first conductive connecting layer is printed on one face of the first stacking board; a second plate body is obtained, the second plate body comprises a first adsorption part and a second laminated plate, one surface of the second laminated plate is printed with a second conductive connection layer, and the second conductive connection layer is used for mounting the to-be-mounted piece; the second plate body is attached to the first plate body through the first adsorption part, so that the first laminated plate and the second laminated plate are connected, and the first adsorption part and the first bearing part are oppositely arranged. According to the invention, the first adsorption part is arranged, so that first printing and then surface mounting can be realized, the mass production feasibility of the three-dimensional mounting process in practical application is improved, and the waste of SMT line body resources is reduced.

Description

Technical Field

[0001] This application relates to the field of integrated circuit manufacturing technology, and in particular to a multilayer board three-dimensional stacked structure and its one-time assembly method, assembly system, and electronic equipment. Background Technology

[0002] With the continuous advancement of electronic technology and the trend towards lighter, thinner, shorter, and smaller electronic products, high-density interconnection boards (HDI), as printed circuit boards (PCBs) with high circuit density and utilizing micro-blind / buried via technology, have become an indispensable and important component of modern electronic products. High-density PCBs typically employ multi-layered daughterboards (DBs) stacked on a motherboard (MB). Each daughterboard carries specific circuits and functions, while the motherboard, as the core, coordinates the various daughterboards.

[0003] The traditional manufacturing method for high-density motherboards involves using multiple surface mount technology (SMT) production lines to process individual module boards. Two module boards are then assembled together to form a single unit, which is then attached to other module boards, and so on, until all module boards are assembled. Finally, a new production line is used to assemble the remaining modules onto the motherboard. This method results in significant line resource waste, long manufacturing cycles, and repeated reflow soldering, which negatively impacts first-pass yield and product reliability, especially with high product density and a large number of module boards. To effectively reduce line resource waste, a three-dimensional assembly process has emerged that can assemble multiple boards together on a single production line to form a multi-layer stacked structure. However, existing three-dimensional assembly processes require solder paste transfer (i.e., transferring solder paste to the three-dimensional structure containing the motherboard and module boards) after the module boards are mounted onto the motherboard. Currently, there is no effective method for three-dimensional solder paste transfer, making mass production of the three-dimensional assembly process difficult in practical applications. Summary of the Invention

[0004] This application provides a multilayer board three-dimensional stacking structure and its one-time assembly method, assembly system, and electronic equipment. The aim is to improve the mass production feasibility of three-dimensional assembly technology in practical applications, reduce waste of SMT line resources, shorten manufacturing cycles, and improve processing quality and product reliability.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] On the one hand, this application provides a one-time assembly method for a multilayer board three-dimensional stacked structure, the one-time assembly method for the multilayer board three-dimensional stacked structure includes:

[0007] A first plate is obtained, the first plate includes a first laminate and a first support part, and a first conductive connection layer is printed on one side of the first laminate;

[0008] A second plate is obtained, the second plate includes a second stacked plate and a first adsorption part, one side of the second stacked plate is printed with a second conductive connection layer, the second conductive connection layer is used to mount the part to be mounted;

[0009] The second plate is attached to the first plate by the first adsorption part, so that the first and second laminates are connected, and the first adsorption part and the first support part are arranged opposite to each other.

[0010] That is, this application obtains a first board and a second board, and prints a first conductive connection layer on one side of the first layer of the first board. A first adsorption portion is provided on the second board. Thus, the second board can be adsorbed and moved and mounted onto the first board through the first adsorption portion, so that the second layer of the second board can be connected to the first layer. The first adsorption portion can be disposed opposite to the first support portion of the first board, and the second conductive connection layer of the second board can be used to mount the component to be mounted. With the above arrangement, this application can first print the second conductive connection layer on the second board, and then move the second board to one side of the first board by adsorbing the first adsorption portion, so as to mount the second board onto the first board with the printed first conductive connection layer; without first mounting the second board onto the first board and then using a solder paste transfer process to transfer solder paste onto the second board. In this application, adjacent boards can be stacked and mounted after the conductive interconnect layers are printed during the assembly of a multilayer board stacked structure. The fabrication of different boards can be integrated on the same SMT line. Compared with the solution of processing different boards separately on separate SMT lines and then assembling them together, this application can reduce the number of SMT lines, improve the waste of SMT line resources, and thus shorten the manufacturing cycle of the multilayer board stacked structure. In addition, the first and second conductive interconnect layers of this application do not need to use solder paste transfer technology, but are formed by printing. Since the printing technology is relatively mature compared to the solder paste transfer technology, the first and second conductive interconnect layers are less prone to defects. The assembly method provided by this application can also improve the processing quality and product service reliability of the multilayer board stacked structure. The assembly method of this application can reduce SMT line resources and can be applied to actual mass production, with high mass production feasibility.

[0011] In one possible implementation, the first adsorption portion is located on the outer periphery of the second laminate, and the first adsorption portion is connected to the second laminate.

[0012] This application places the first adsorption part on the outer periphery of the second layer stacked plate. The second conductive connection layer on the second layer stacked plate will not be affected by the first adsorption part during printing. The pattern of the second conductive connection layer can be printed at one time. This simplifies the process operation and reduces the preparation difficulty when assembling the multilayer board three-dimensional stacked structure.

[0013] In one possible implementation, the first adsorption portion comprises a plurality of first adsorption portions, which are spaced apart around the outer periphery of the second laminate.

[0014] By providing multiple first adsorption sections, this application can, on the one hand, increase the surface area of ​​the adsorption area, thereby enhancing the adsorption force of the adsorption device on the second plate, making the adsorption device more firmly adsorb the second plate, and improving the reliability of the adsorption when the second plate is transferred to the first plate; on the other hand, the multiple first adsorption sections can work together to disperse the adsorption force, making the second plate more stable during the transfer process, which helps to prevent the shape or position of the second plate from being affected by equipment vibration or other external forces.

[0015] In one possible implementation, the first adsorption portion is located on the second laminate.

[0016] With the above-mentioned configuration, this application eliminates the need to reserve additional areas outside the second layer of the stacked plate to specifically set up the first adsorption part. The second layer of the stacked plate can be set up on the entire second plate, which can improve the area utilization rate of the second plate. Furthermore, it eliminates the need to remove the first adsorption part later, which can also save steps and reduce the loss of the second plate.

[0017] In one possible implementation, the first adsorption portion comprises a plurality of first adsorption portions, which are distributed at intervals around the center of the second laminate.

[0018] This application incorporates multiple first adsorption sections, providing a larger adsorption surface area and more adsorption sites, thereby enhancing the adsorption capacity of the second plate. This facilitates a more secure adsorption of the second plate by the adsorption device, improving the reliability of the second plate during the transfer process. Simultaneously, the multiple first adsorption sections disperse the adsorption force, making the second plate more stable during transfer and helping to prevent its shape or position from being affected by equipment vibration or other external forces. The multiple first adsorption sections, spaced apart around the center of the second layer, allow the adsorption points on the second plate to be dispersed as much as possible, improving the force balance during adsorption.

[0019] In one possible implementation, the first adsorption portion includes a first pad disposed on the second laminate.

[0020] By setting a first pad on the first adsorption part, a second conductive connection layer can be added on the first pad later, which can improve the reliability of the electrical connection between the second board and the component to be mounted.

[0021] In one feasible manner, after the second board body is attached to the first board body via the first adsorption part, the one-time assembly method of the multilayer board three-dimensional stacked structure further includes: performing tin spraying on the first solder pad.

[0022] This application performs tin plating on the first pad, so that the first pad on the second layer can be replenished with solder, which makes the electrical connection between the second board and the component to be mounted more reliable and the mechanical connection more secure.

[0023] In one feasible embodiment, after the second plate is attached to the first plate via the first adsorption part, the one-time assembly method of the multilayer board three-dimensional stacked structure further includes:

[0024] The mounting status of the first and second plates is inspected.

[0025] Material testing is performed on the second conductive connection layer on the second plate.

[0026] By setting up the above-mentioned patch detection, this application can detect the mounting status of the first board and the second board, and promptly detect whether there are problems such as mounting position deviation or incorrect mounting of the first board and the second board; by setting up material detection, the material of the second conductive connection layer on the second board can be inspected, and printing problems can be detected in time before the second conductive connection layer is cured, so as to solve or improve them as soon as possible, and reduce the risk of later product repair or scrapping.

[0027] In one feasible manner, the one-time assembly method of the multilayer board three-dimensional stacked structure of this application further includes:

[0028] A third plate is obtained, which includes a third laminate and a second adsorption part. One side of the third laminate is printed with a third conductive connection layer, which is used to mount the part to be mounted.

[0029] After attaching the second plate to the first plate via the first adsorption part, the one-time assembly method for the multilayer plate three-dimensional stacked structure provided in this application further includes:

[0030] The third plate is attached to the second plate through the second adsorption part, so that the second and third laminates are connected, and the first adsorption part and the second adsorption part are arranged opposite to each other.

[0031] By setting a third board and mounting the third board onto the second board, this application can obtain a higher density multilayer board stacked structure, which makes the integration of the multilayer board stacked structure higher and can accommodate more electronic components to achieve more functions.

[0032] In one feasible approach, after material testing of the second conductive connection layer on the second plate, the one-time assembly method of the multilayer board three-dimensional stacked structure further includes:

[0033] The structure comprising the first plate and the second plate is subjected to reflow soldering.

[0034] This application achieves solidification of each conductive connection layer by reflow soldering the structure comprising the first plate and the second plate, thereby ensuring a reliable connection between adjacent plates and a reliable fixation of each plate to its electronic components.

[0035] In one feasible approach, after obtaining the first plate, the assembly method of the multi-layer plate stacked structure further includes:

[0036] Material testing was performed on the first conductive connection layer;

[0037] Electronic components are mounted on the first layer of the laminate.

[0038] This application can detect printing defects in the first conductive connection layer early by performing material testing on the first conductive connection layer, so as to solve or improve them as soon as possible, thereby reducing the risk of later product repair or scrapping. By mounting electronic components on the first layer stack, the utilization rate of the first layer stack can be improved, thereby improving the integration of the prepared multilayer board three-dimensional stacked structure.

[0039] In one feasible approach, the peak temperatures of both the materials of the first conductive interconnect layer and the materials of the second conductive interconnect layer are between 230°C and 260°C.

[0040] The assembly method of this application allows for printing before mounting, thus enabling the fabrication of multi-layer board stacked structures on the same SMT line. Therefore, this application eliminates the need for multiple reflow soldering cycles, allowing for the curing of all conductive interconnect layers in a single reflow soldering operation. Consequently, the materials for the first and second conductive interconnect layers can be selected from high-temperature materials (i.e., peak temperatures between 230°C and 260°C). High-temperature materials, compared to low-temperature materials, do not exhibit brittle bismuth (Bi) crystallization, resulting in better reliability.

[0041] In one feasible approach, the first conductive connection layer and the second conductive connection layer are made of the same material.

[0042] This application sets the materials of the first conductive connection layer and the second conductive connection layer to be the same. On the one hand, there is no need to change the materials during the preparation process, which saves a lot of effort in both material selection and preparation. On the other hand, the consistency of the same material after reflow soldering and curing is also better, which can improve the overall performance of the device.

[0043] In one possible implementation, the materials of the first conductive connection layer and the second conductive connection layer comprise solder paste.

[0044] Because solder paste has a high melting point, it can fully melt and form a strong connection during soldering. Therefore, this application uses a material containing solder paste as the material for the first conductive connection layer and the second conductive connection layer to improve the connection stability and reliability between adjacent boards or between a board and electronic components. At the same time, tin is a good conductor, so solder paste soldering can improve the connection and signal transmission between adjacent boards or between a board and electronic components, and improve conductivity.

[0045] On the other hand, this application provides a multilayer board three-dimensional stacked structure, which includes:

[0046] The first layer of the laminate has a first conductive connection layer on one side;

[0047] The second layer is disposed on the side of the first layer having the first conductive connection layer, and the side of the second layer away from the first layer has the second conductive connection layer. The second conductive connection layer is used to mount the component to be mounted. The peak temperature of the materials of the first conductive connection layer and the second conductive connection layer is between 230°C and 260°C.

[0048] This application sets the peak temperatures of both the first and second conductive connection layers between 230°C and 260°C. This allows each conductive connection layer in the multilayer PCB stacked structure to be cured in a single reflow soldering operation, enabling simultaneous reflow soldering of conductive connection layers between adjacent boards or between boards and electronic components. Thus, the multilayer PCB stacked structure of this application eliminates the need for multiple reflow soldering processes during assembly, simplifying the assembly process. Furthermore, the materials for the first and second conductive connection layers can be high-temperature materials with peak temperatures between 230°C and 260°C. High-temperature materials do not exhibit brittle bismuth (Bi) crystallization compared to low-temperature materials, resulting in better reliability.

[0049] In one feasible approach, the first conductive connection layer and the second conductive connection layer are made of the same material.

[0050] This application uses the same material for the first and second conductive connection layers, eliminating the need to prepare multiple materials during fabrication and reducing the effort required for material selection. Furthermore, since the first and second conductive connection layers are made of the same material, the consistency of the multilayer board's three-dimensional stacked structure is also better after reflow soldering and curing, which can improve the overall performance of the device.

[0051] In one possible implementation, the materials of both the first conductive connection layer and the second conductive connection layer comprise solder paste.

[0052] Because solder paste has a high melting point, it can fully melt and form a strong connection during soldering. Therefore, this application uses a material containing solder paste as the material for the first conductive connection layer and the second conductive connection layer, which can improve the connection stability and reliability between adjacent boards or between boards and electronic components. At the same time, as tin is a good conductor, solder paste soldering can improve the good electrical connection and signal transmission between adjacent boards or between boards and electronic components, and improve conductivity.

[0053] In one feasible approach, the multilayer board stacked structure also includes a third layer of stacked boards;

[0054] The third layer is disposed on the side of the second layer having the second conductive connection layer, and the third layer has a third conductive connection layer on the side of the third layer away from the second layer. The peak temperature of the material of the third conductive connection layer is between 230°C and 260°C.

[0055] This application improves the integration density of multilayer board stacked structures by incorporating a third layer, facilitating the integration of more electronic components. By setting the peak temperature of the third conductive interconnect layer material between 230°C and 260°C, it maintains the same peak temperature range as the first and second conductive interconnect layers. This allows for simultaneous curing of all conductive interconnect layers in a single reflow soldering process, simplifying the fabrication process of the multilayer board stacked structure. Furthermore, the identical peak temperature of the materials also results in better consistency of the multilayer board stacked structure after reflow soldering.

[0056] In one possible implementation, the third laminate includes at least two laminates stacked on the second laminate, with a third conductive connection layer between adjacent third laminates.

[0057] This application can effectively improve the integration of multi-layer board stacked structure by setting at least two third-layer stacked boards, which makes it easier to lay out more electronic components.

[0058] In another aspect, this application also provides an assembly system for a multilayer board three-dimensional stacked structure, the assembly system comprising:

[0059] A first device for printing a first conductive connection layer on a first laminate;

[0060] A first device, connected to a first equipment, is used to print a second conductive connection layer on a second laminate and to attach the second laminate to the side of the first laminate having the first conductive connection layer via a first adsorption part.

[0061] The first mounting inspection device is connected to the first device and is used to inspect the mounting status of the first and second laminates.

[0062] A first material testing device is connected to a first mounting testing device and is used to test the material of the second conductive connection layer.

[0063] A reflow soldering apparatus, connected to a first material testing device, is used to perform reflow soldering on a structure comprising a first laminate and a second laminate.

[0064] This application, by setting up a first device, can print a first conductive connection layer on a first laminate; by setting up a first apparatus, can print a second conductive connection layer on a second laminate, and attach the second board with the printed second conductive connection layer onto the first conductive connection layer via a first adsorption part; by setting up a first mounting detection device, the mounting status of the first and second laminates can be detected; by setting up a first material detection device, the material of the second conductive connection layer can be detected, so as to promptly detect whether there are mounting defects in the first and second laminates, and whether there are material defects in the second conductive connection layer, thereby allowing for timely correction when defects are found, preventing material from flowing to subsequent processes and causing repair difficulties or scrapping. After performing the corresponding mounting status detection and material detection, reflow soldering is performed by a reflow soldering device to solidify the first and second conductive connection layers, thereby enhancing the mechanical connection strength of the entire structure. This application, through the above design, can realize the assembly of multi-layer board stacked structures on a single production line, reducing the waste of SMT line resources, shortening the manufacturing cycle, improving processing quality and product service reliability, and providing support for the mass production of assembly processes.

[0065] In one feasible manner, the first device comprises multiple components;

[0066] One of the first devices is connected between the first equipment and the first placement detection device;

[0067] The remaining first devices are respectively connected between the first material testing device and the reflow soldering device, and are used to print the third conductive connection layer on the third laminate and attach the third laminate to the side of the second laminate with the second conductive connection layer through the second adsorption part.

[0068] This application can achieve the printing and mounting of multiple boards by setting up multiple first devices, thereby improving the integration of multilayer board three-dimensional stacked structure.

[0069] In one feasible approach, the assembly system for the multilayer board stacked structure also includes:

[0070] The second mounting inspection device is connected to the reflow soldering device and is used to inspect the mounting status of the structure after reflow soldering.

[0071] The segmentation device, connected to the second mounting and inspection device, is used to segment the structure that has passed through the second mounting and inspection device to obtain multiple multilayer board stacked structures.

[0072] This application, by setting a second mounting inspection device, can promptly detect mounting defects after reflow soldering, such as defects in solder joints or mounting positions, thereby improving the product quality of multilayer board stacked structures. By setting a dividing device, the entire structure can be divided into multiple independent multilayer board stacked structures, which facilitates subsequent processing. At the same time, because the dividing device is set, multiple multilayer board stacked structures can be prepared simultaneously in the early stage, which can improve the preparation efficiency.

[0073] In one possible implementation, the first device includes:

[0074] A first printing apparatus is used to print a first conductive connection layer on a first laminate.

[0075] The second material testing device is connected to the first printing device and is used to test the material of the first conductive connection layer.

[0076] The first mounting device is connected to the second material inspection device and is used to mount electronic components on the first laminate.

[0077] This application enables the printing of a first conductive connection layer on a first-layer stack by setting a first printing device; it enables the timely detection of printing defects in the first conductive connection layer printed by the first printing device by setting a second material detection device, so as to make timely corrections and prevent it from flowing to subsequent processes and causing maintenance difficulties or scrapping; it enables the mounting of electronic components on the first-layer stack by setting a first mounting device, thereby effectively utilizing the area of ​​the first-layer stack and improving the integration and area utilization of the multilayer board three-dimensional stacked structure.

[0078] In another aspect, this application also provides an electronic device, which includes a housing and a multi-layer board stacked structure in any of the above-described possible ways, the multi-layer board stacked structure being disposed within the housing.

[0079] Because the electronic device incorporates the aforementioned multi-layer board stacked structure, it can solve the same technical problems and achieve the same technical effects as the multi-layer board stacked structure. Attached Figure Description

[0080] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0081] Figure 2 One of the flowcharts illustrating a one-time assembly method for a multilayer board three-dimensional stacked structure provided in this application embodiment;

[0082] Figure 3 This is one of the structural schematic diagrams of the first plate body provided in the embodiments of this application;

[0083] Figure 4 for Figure 3 A schematic diagram of the structure when the first conductive connection layer is printed on the first plate.

[0084] Figure 5 This is one of the structural schematic diagrams of the second plate provided in the embodiments of this application;

[0085] Figure 6 for Figure 5 A schematic diagram of the structure when the second plate has a second conductive connection layer printed on it;

[0086] Figure 7 A schematic diagram of a structure in which multiple second plates are mounted on a first plate, as provided in an embodiment of this application;

[0087] Figure 8 for Figure 7 A schematic diagram of a structure in which a second plate is attached to a first plate;

[0088] Figure 9 A schematic diagram of the structure of the third plate being mounted on the second plate according to an embodiment of this application;

[0089] Figure 10 This is a second schematic diagram of the structure of the first plate provided in the embodiments of this application;

[0090] Figure 11 for Figure 10 A schematic diagram of the structure when the first conductive connection layer is printed on the first plate.

[0091] Figure 12 This is a second schematic diagram of the structure of the second plate provided in the embodiments of this application;

[0092] Figure 13 for Figure 12 A schematic diagram of the structure when the second plate has a second conductive connection layer printed on it;

[0093] Figure 14 for Figure 13 A schematic diagram of the structure in which the second plate is attached to the first plate;

[0094] Figure 15 for Figure 14 A schematic diagram of the structure of the second plate after tin plating;

[0095] Figure 16 The second schematic flowchart of the one-time assembly method for the multilayer board three-dimensional stacked structure provided in the embodiments of this application;

[0096] Figure 17 The third flowchart illustrates the one-time assembly method for the multilayer board three-dimensional stacked structure provided in the embodiments of this application;

[0097] Figure 18 The fourth flowchart illustrates the one-time assembly method for a multilayer board three-dimensional stacked structure provided in the embodiments of this application.

[0098] Figure 19 Fifth of the flowcharts illustrating the one-time assembly method for the multilayer board three-dimensional stacked structure provided in the embodiments of this application;

[0099] Figure 20 This is one of the structural schematic diagrams of a multilayer board three-dimensional stacked structure provided in the embodiments of this application;

[0100] Figure 21 This is the second schematic diagram of the three-dimensional stacked structure of multilayer boards provided in the embodiments of this application;

[0101] Figure 22 This is one of the structural schematic diagrams of the assembly system for a multilayer board three-dimensional stacking structure provided in the embodiments of this application;

[0102] Figure 23 This is the second structural schematic diagram of the assembly system for the multilayer board three-dimensional stacking structure provided in the embodiments of this application.

[0103] Figure label:

[0104] 100 - Electronic device; 10 - Housing; 11 - Front cover; 12 - Frame;

[0105] 20 - Multilayer board stacked structure; 21 - First board body; 211 - First layer of stacked board; 212 - First support part; 213 - First conductive connection layer;

[0106] 22-Second board body; 221-Second stacked board; 2211-First pad; 2212-Second pad; 222-First adsorption part; 223-Second conductive connection layer; 23-Third board body; 231-Third stacked board; 232-Second adsorption part; 233-Third conductive connection layer; 24-Electronic component; 251-Fourth stacked board; 253-Fourth conductive connection layer;

[0107] 30 - Display screen.

[0108] 200 - Assembly system for multilayer board stacked structure; 210 - First equipment; 2101 - First printing device; 2102 - Second material inspection device; 2103 - First placement device; 220 - First device; 230 - First placement inspection device; 240 - First material inspection device; 250 - Reflow soldering device; 260 - Second placement inspection device; 270 - Dividing device. Detailed Implementation

[0109] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0110] The terms "first," "second," and similar terms used in this article do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "one" or similar terms do not indicate a quantity limitation, but rather indicate the existence of at least one.

[0111] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0112] This application provides an electronic device, which may include, but is not limited to, mobile phones, tablets, e-readers, laptops, digital cameras, in-vehicle devices, ultra-mobile personal computers (UMPCs), handheld computers, touch-screen TVs, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices, virtual reality devices, smart door locks, servers, switches, speakers, desk lamps, robots, etc. Figure 1 The illustrated embodiment uses a mobile phone as an example of an electronic device.

[0113] The electronic device provided in this application may include a multilayer board stacked structure 20 and a housing, with the multilayer board stacked structure 20 disposed within the housing. The housing is used to house the multilayer board stacked structure 20. The multilayer board stacked structure 20 can be electrically interconnected with various functional devices within the electronic device to achieve corresponding functions. The multilayer board stacked structure 20 may include, but is not limited to, a baseboard module, a middleboard module, a backplane module, a switching network board module, a main control board module, and a service board module.

[0114] The housing 10 may include a front cover 11, a frame 12, and a rear cover. Figure 1 (Not shown). The front cover 11 and the rear cover may be spaced apart, and the frame 12 may surround the front cover 11 and the rear cover. The front cover 11, the rear cover, and the frame 12 may be enclosed to form a housing structure for protecting the functional components and the multilayer board stacked structure 20 inside the electronic device. Of course, in some embodiments, the housing may not include the front cover 11, but only the frame 12 and the rear cover. The housing structure proposed in this application is only an example and is not a limitation of this application.

[0115] The electronic device may also include functional components housed within the housing 10. These functional components are used to perform one or more functions of the electronic device. These functional components include, but are not limited to, a camera module, a display screen 30, a speaker, a receiver, an antenna, a microphone, a universal serial bus (USB) interface, a subscriber identification module (SIM) card interface, buttons, and so on.

[0116] The number of functional components within an electronic device can be one or more. When the number of functional components within an electronic device is one, that functional component can be one of the following: camera module, display screen 30, speaker, receiver, antenna, microphone, USB interface, SIM card interface, or button. When the number of functional components within an electronic device is multiple, those multiple functional components can be multiple of the following: camera module, display screen 30, speaker, receiver, antenna, microphone, USB interface, SIM card interface, or button.

[0117] A multi-layer board stacked structure 20 is disposed within the housing 10, and the multi-layer board stacked structure 20 can be electrically connected to functional devices. The multi-layer board stacked structure 20 is used for signal control, data signal processing, and data signal storage operations on the functional devices. The multi-layer board stacked structure 20 may include the motherboard of an electronic device, or it may include other circuit boards of the electronic device, such as the circuit board in a tablet phone used to carry the speaker and USB interface, without specific limitations.

[0118] For example, the multilayer board stacked structure 20 provided in this application may include multiple stacked boards and electronic components 24 disposed on the corresponding boards. The electronic components 24 may be disposed on each board layer or only on some boards. This application does not limit the layout, location, or quantity of the electronic components 24 on each board.

[0119] The multilayer board stacked structure 20 may include printed circuit boards (PCBs), flexible circuit boards, integrated circuits (or chips), etc. Depending on the number of electronic components 24 to be carried on the multilayer board stacked structure 20, it may include single-sided boards and double-sided boards. A single-sided board can refer to a circuit board that carries electronic components 24 on one side. A double-sided board can refer to a circuit board that carries electronic components 24 on both sides. Depending on the type of electronic components 24 carried on the multilayer board stacked structure 20, the board body of the multilayer board stacked structure 20 may include a motherboard, a module board, a daughterboard printed circuit board (DBPCB), a printed circuit board assembly (PCBA), a frame board (FB), a radio frequency (RF) board, and an application processor (AP) board, etc. The motherboard may be the main circuit board within an electronic device. RF boards can be used to house RF chips (radio frequency integrated circuits, RF ICs), RF power amplifiers (RF PAs), Wi-Fi chips, etc. AP boards, for example, can be used to house system-on-chip (SoC) components, double-data-rate (DDR) memory, main power management units (PMUs), auxiliary PMUs, etc.

[0120] The multilayer board stacked structure 20 may include a sandwich structure board. A conventional sandwich structure typically includes a radio frequency (RF) board, a frame board (FB), an application processor (AP) board, etc.

[0121] The electronic component 24 can be a central processing unit (CPU), graphics processing unit (GPU), or memory chip, or it can be a power module, resistor, capacitor, inductor, potentiometer, electron tube, heat sink, electromechanical component, connector, discrete semiconductor device, electroacoustic device, laser device, optoelectronic device, sensor, switch, micro motor, electronic transformer, relay, integrated circuit device, etc. One or more electronic components 24 can be disposed on the multilayer board stacked structure 20, and one or more different types of electronic components 24 can be disposed on the multilayer board stacked structure 20. Furthermore, this application embodiment does not limit the number or arrangement of electronic components 24 on the multilayer board stacked structure 20.

[0122] In the embodiments of this application, the multilayer board three-dimensional stacked structure 20 may include multilayer boards stacked together, each board may include multilayer core boards stacked together, adjacent core boards may be bonded and fixed by prepreg, each core board may be provided with circuits, the circuits may include power lines, signal lines and ground lines, etc., each core board may be provided with one or more of power lines, signal lines and ground lines.

[0123] It is understandable that power lines on the same core board can be in the same network, and multiple power lines on the same core board can also be disconnected and in multiple different networks; signal lines on the same core board can be in the same network, and multiple signal lines on the same core board can also be disconnected and in multiple different networks; ground lines on the same core board can be in the same network, and multiple ground lines on the same core board can also be disconnected and in multiple different networks.

[0124] In the embodiments of this application, electronic components 24 can be disposed on the multilayer board stacked structure 20 and electrically connected to the multilayer board stacked structure 20. A conductive connection layer capable of electrically connecting the two can be disposed between the multilayer board stacked structure 20 and the electronic components. It is understood that the conductive connection layer can be conductive adhesive or solder paste, etc. In this embodiment, the conductive connection layers mentioned in this application are all layers capable of conducting electricity and providing mechanical connection. For example, if a conductive connection layer is disposed between two boards, the two boards can achieve both mechanical and electrical connection. To avoid redundancy, the same points mentioned below will not be explained again in this application.

[0125] In the embodiments of this application, the multilayer board three-dimensional stacked structure 20 may also be provided with vias. The vias may include power vias for connecting the power lines of different layers, signal vias for connecting the signal lines of different layers, and grounding vias for connecting the ground lines of different layers.

[0126] With the trend towards thinner and lighter electronic devices, high-density motherboards employing multi-layer 3D stacked structures 20 have become an indispensable part of electronic products. However, the traditional fabrication of multi-layer 3D stacked structures 20 typically involves independently fabricating individual boards on multiple production lines using surface mount technology. Then, one production line assembles two boards together to obtain a first 3D structure. Another production line assembles this first 3D structure onto another board to obtain a second 3D structure, and so on. After all the modules are assembled, the final 3D structure is obtained. Finally, a single production line mounts this final 3D structure onto the motherboard to obtain the multi-layer 3D stacked structure 20. It can be seen that this method requires many production lines, resulting in significant waste of line resources, especially when the number of modules is large.

[0127] For the reasons mentioned above, in some embodiments, a three-dimensional assembly process has been proposed, which can assemble multiple boards together on the same production line to form a multi-layer board three-dimensional stacked structure 20. For example, this assembly process can be implemented as follows: a first module board is mounted on the motherboard, then solder paste is transferred on the first module board using a three-dimensional solder paste transfer process, then a second module board is mounted on the first module board with solder paste, and so on, and after all module boards are assembled, a reflow soldering process is performed. However, this three-dimensional assembly process requires a three-dimensional solder paste transfer process, and currently there is no effective three-dimensional solder paste transfer process available, making it difficult to mass-produce in practical applications.

[0128] Based on this, this application proposes a novel assembly method for a multilayer PCB stacked structure 20. In this method, a first adsorption part 222 is provided on the second board 22. This allows for the printing of a second conductive connection layer 223 on the second board 22. Then, by adsorbing the first adsorption part 222, the second board 22 with the printed second conductive connection layer 223 can be moved to the first board 21, and the second board 22 is mounted on the first board 21 with the printed first conductive connection layer 213, thus achieving the mounting of the first board 21 and the second board 22. This method allows for the printing of conductive connection layers before mounting, eliminating the need for a solder paste transfer process. Therefore, this assembly method for the multilayer PCB stacked structure 20 has high feasibility for mass production in practical applications and can reduce the waste of circuit resources.

[0129] The following application will provide a detailed description and explanation of the specific fabrication process of the assembly method for the new multilayer board three-dimensional stacked structure 20.

[0130] Please refer to Figure 2 , Figure 2 This is one of the flowcharts illustrating an assembly method for a multilayer board stacked structure 20 provided in this application. The application provides an assembly method for a multilayer board stacked structure 20, which includes the following steps S100-S300.

[0131] S100. Obtain the first plate 21. The first plate 21 includes a first laminate 211 and a first support portion 212. One side of the first laminate 211 is printed with a first conductive connection layer 213.

[0132] Please refer to Figure 3 and Figure 4 As shown, the first plate 21 may include a first laminate 211 and a first support portion 212. The first laminate 211 and the first support portion 212 are part of the first plate 21 and can be connected to each other. The connection here can be a direct connection or an indirect connection. Figure 3 The diagram illustrates the indirect connection between the first bearing portion 212 and the first laminate 211. Figure 10 The first bearing part 212 and the first laminate 211 are shown to be directly connected.

[0133] Furthermore, this application does not limit the specific arrangement position of the first laminate 211 and the first support portion 212. For example, the first laminate 211 and the first support portion 212 may be arranged side by side in a linear arrangement; or the first support portion 212 may include multiple portions and surround the outer periphery of the first laminate 211. In this embodiment, multiple portions refer to two or more.

[0134] When multiple first support portions 212 surround the outer periphery of the first laminate 211, the distance between two adjacent first support portions 212 can be equal or unequal, and the distance between any two first support portions 212 and the first laminate 211 can be equal or unequal. In other words, when multiple first support portions 212 surround the outer periphery of the first laminate 211, the multiple first support portions 212 can be distributed according to a certain pattern or randomly.

[0135] Furthermore, this application does not limit the specific shape of the first laminate 211 and the first support portion 212. The first laminate 211 can be square, polygonal or other irregular shape, etc. Similarly, the first support portion 212 can also be square, polygonal or other irregular shape, etc. Figure 3 The example of the first laminate 211 and the first support portion 212 being square is merely an illustration and is not a limitation on the specific shape of the first laminate 211 and the first support portion 212 in this application.

[0136] At least one side of the first laminate 211 is printed with a first conductive connection layer 213, which can be used to mount components to be mounted. These components can be electronic components 24, including chips, capacitors, inductors, power modules, resistors, potentiometers, heat sinks, connectors, discrete semiconductor devices, electroacoustic devices, laser devices, optoelectronic devices, sensors, switches, micromotors, electronic transformers, relays, and integrated circuit devices; of course, the components can also be circuit boards or other board surfaces. This application does not impose specific limitations on the components to be mounted on the first conductive connection layer 213.

[0137] If mounting is required only on one side of the first layer 211, the first conductive connection layer 213 can be printed on only one side of the first layer 211; if mounting is required on both sides of the first layer 211 to improve the utilization rate of the first layer 211 and thus improve the integration of the multilayer board stacked structure 20, the first conductive connection layer 213 can be printed on both sides of the first layer 211 respectively, such as... Figure 4 As shown.

[0138] Furthermore, the first conductive connection layer 213 can be printed according to actual needs. That is to say, the coverage area of ​​the first conductive connection layer 213 on the first board 21 and the specific printed pattern are not subject to special restrictions in this application and can be determined according to the circuit design.

[0139] S200. Obtain the second plate 22. The second plate 22 includes a second laminate 221 and a first adsorption part 222. One side of the second laminate 221 is printed with a second conductive connection layer 223. The second conductive connection layer 223 is used to mount the part to be mounted.

[0140] That is, the second plate 22 may include a second laminate 221 and a first adsorption part 222, please refer to Figure 5 and Figure 6 As shown. The second laminate 221 and the first adsorption part 222 are part of the second plate body 22, and the two can be connected to each other. The connection here can be a direct connection or an indirect connection. Figure 5 The illustration is based on an example where the first adsorption section 222 and the second laminate 221 are indirectly connected. Figure 12 The first adsorption section 222 and the second laminate 221 are directly connected.

[0141] Furthermore, this application does not limit the specific arrangement of the second layer plate 221 and the first adsorption part 222. For example, the second layer plate 221 and the first adsorption part 222 may be arranged side by side in a linear arrangement; or the first adsorption part 222 may include multiple parts and surround the outer periphery of the second layer plate 221. In this embodiment, multiple parts refer to two or more.

[0142] In this embodiment, the first adsorption portion 222 of the second plate 22 and the first support portion 212 of the first plate 21 can be arranged in a positional correspondence, or in other words, the orthographic projection of the first adsorption portion 222 on the first plate 21 can be located at the first support portion 212 of the first plate 21. In this embodiment, the first adsorption portion 222 may have a corresponding first support portion 212 on the first plate 21, but not all first support portions 212 can have a corresponding first adsorption portion 222 on the first plate 21. In other words, the number of first adsorption portions 222 and first support portions 212 may not be the same, and the first adsorption portions 222 and first support portions 212 may not be in a one-to-one correspondence.

[0143] For ease of understanding, this application now illustrates an example: the first plate 21 may be provided with four first support portions 212, and the second plate 22 may be provided with two first adsorption portions 222. The projections of the two first adsorption portions 222 on the first plate 21 may be located at two of the first support portions 212 on the first plate 21. Using this arrangement, two second plates 22 can be attached to the first plate 21; alternatively, in addition to attaching one second plate 22, another plate can be attached to the first plate 21.

[0144] When multiple first adsorption portions 222 are included and surround the outer periphery of the second laminate 221, the distance between two adjacent first adsorption portions 222 can be the same as the distance between two adjacent first support portions 212. That is, when multiple first adsorption portions 222 are included and surround the outer periphery of the second laminate 221, the positional relationship of the multiple first adsorption portions 222 can be consistent with the positional relationship of the multiple first support portions 212.

[0145] In addition, the specific shapes of the second layer plate 221 and the first adsorption part 222 are not limited. The second layer plate 221 can be square, polygonal or other irregular shapes, etc. Similarly, the first adsorption part 222 can also be square, polygonal or other irregular shapes, etc. Figure 5 The example of the second layer plate 221 and the first adsorption part 222 being square is merely an illustration and is not a limitation on the specific shape of the second layer plate 221 and the first adsorption part 222 in this application.

[0146] Furthermore, the shape of the first adsorption part 222 can be the same as the shape of the first support part 212. In this way, when the first adsorption part 222 and the first support part 212 are connected, the contact area is larger and the structural reliability is better.

[0147] Furthermore, the design of the first adsorption part 222 can be chosen in a way that does not affect the effective utilization rate of each layer of the board. In simpler terms, the location and / or shape of the first adsorption part 222 should not affect the normal layout of each layer of the multilayer board stacked structure 20. For example, the first adsorption part 222 can be placed in the non-layout area of ​​the first board 21. By placing the first adsorption part 222 in a position that does not affect the normal layout of each layer of the multilayer board stacked structure 20, this application can reduce the impact of the first adsorption part 222 on the normal layout of the multilayer board stacked structure 20, and without needing to increase the area of ​​the multilayer board stacked structure 20, it can achieve effective utilization of the area of ​​the multilayer board stacked structure 20.

[0148] One side of the second laminate 221 is printed with a second conductive connection layer 223, which can be used to mount a component to be mounted. The component to be mounted can be an electronic component 24, or other board material (such as the third board material 23), and this application does not limit it.

[0149] Furthermore, the aforementioned second conductive connection layer 223 can be printed according to actual needs. That is, the coverage area of ​​the second conductive connection layer 223 on the second board 22 and the specific printed pattern are not subject to special restrictions in this application and can be determined according to the circuit design.

[0150] S300, the second plate 22 is attached to the first plate 21 via the first adsorption part 222, so that the first laminate 211 and the second laminate 221 are connected. The first adsorption part 222 and the first support part 212 are arranged opposite to each other. Figures 7 to 9 As shown.

[0151] Since the second plate 22 of this application has a first adsorption part 222, when it is necessary to attach the second plate 22 to the first plate 21, the second plate 22 can be moved to the first plate 21 through the first adsorption part 222 and then attached to the first plate 21. For example, the first adsorption part 222 can be vacuum-adsorbed to move the second plate 22 above the first plate 21, and then the second plate 22 can be attached to the first plate 21.

[0152] This application provides a first adsorption part 222 on the second plate 22, which can adsorb and move the second plate 22 to the first plate 21, thereby achieving the mounting of the second plate 22 to the first plate 21. In this way, this application can first print the first conductive connection layer 213 on the first board 21 and the second conductive connection layer 223 on the second board 22, and then mount the second board 22 onto the first board 21. In this way, the preparation and mounting of the first board 21 and the second board 22 can be integrated on the same SMT line. Compared with the scheme of processing different boards separately on separate SMT lines and then assembling them together on other SMT lines, this application can reduce the equipment investment of SMT lines and improve the waste of SMT line resources. In addition, since the first conductive connection layer 213 and the second conductive connection layer 223 of the assembly method of this application are formed by printing, and the printing process is relatively mature, the assembly method of this application can reduce SMT line resources and can also be applied to actual mass production, which has high mass production feasibility.

[0153] Furthermore, after the first plate 21 and the second plate 22 of this application are attached together, the first adsorption part 222 and the first support part 212 can be arranged opposite to each other. That is, after the first plate 21 and the second plate 22 are attached, the projection of the first adsorption part 222 on the first plate 21 can be located at the first support part 212 of the first plate 21. Figure 8 As shown.

[0154] Furthermore, the assembly method of the multilayer board three-dimensional stacking structure 20 proposed in this application can be applied to all three-dimensional stacking manufacturing scenarios of PCBA and PCBA, as well as three-dimensional stacking manufacturing scenarios of modules and modules, and also three-dimensional stacking manufacturing scenarios of PCBA and modules.

[0155] The assembly method of this multilayer board stacked structure 20 is suitable for scenarios where PCBAs (or modules to PCBAs, or modules to modules) are connected using soldering materials, and is also suitable for scenarios where other materials that can provide mechanical connection are used, such as adhesive materials. That is, the first conductive connection layer 213 and the second conductive connection layer 223 can be layers formed by soldering materials or layers formed by adhesive materials with conductive functions.

[0156] This application does not limit the specific location of the first adsorption part 222 and the second laminate 221, as long as the first adsorption part 222 can serve as an adsorption point or adsorption area, allowing the adsorption device to adsorb the second plate 22 and move it to the first plate 21, thereby facilitating the attachment of the second plate 22 to one side of the first plate 21. The specific location of the first adsorption part 222 can be set in any feasible area.

[0157] For example, in the first implementation, the first adsorption portion 222 can be located on the outer periphery of the second laminate 221, and the first adsorption portion 222 is connected to the second laminate 221, such as... Figure 5 As shown.

[0158] That is, the first adsorption part 222 and the second laminate 221 can be two independent components. The first adsorption part 222 is disposed on the outer periphery of the second laminate 221, and the first adsorption part 222 can have no overlapping area with the second laminate 221.

[0159] In order to make effective use of the area of ​​the second plate 22, the first adsorption part 222 can be directly connected to the second layer plate 221, so that the area of ​​the second layer plate 221 can be maximized.

[0160] Of course, to facilitate subsequent plate separation and prevent damage to the second layer plate 221 during the later plate separation process, the first adsorption part 222 and the second layer plate 221 can also be indirectly connected, such as... Figure 5 As shown. It should be understood that "separate board" refers to the simultaneous fabrication of multiple products during the initial preparation of the multilayer board stacked structure 20, such as... Figure 7 As shown, multiple products are divided into multiple independent single products through a segmentation process in the later stage. Since the first adsorption part 222 in this implementation is located on the outer periphery of the second laminate 221, it can be removed during the later plate separation process.

[0161] In this application, the first adsorption part 222 is disposed on the outer periphery of the second layer stack 221, so that the second conductive connection layer 223 can be printed on the second layer stack 221 in one step. The first adsorption part 222 will not affect the printing of the second conductive connection layer 223 on the second layer stack 221. This facilitates operation when assembling the multilayer board three-dimensional stacked structure 20, simplifies the process operation, and reduces the difficulty of preparation.

[0162] Furthermore, when the first adsorption portion 222 is located on the outer periphery of the second laminate 221, correspondingly, the first support portion 212 can also be located on the outer periphery of the first laminate 211, such as... Figure 3 and Figure 4 As shown.

[0163] In one possible implementation, a first conductive connection layer 213 can also be printed on the first support portion 212 of the first plate 21. This allows the first adsorption portion 222 to be fixedly attached to the first support portion 212 when the second plate 22 is mounted onto the first plate 21. Figure 7 As shown, this can improve the connection strength between the first plate 21 and the second plate 22, thereby improving the mounting reliability.

[0164] In addition, the area between the first laminate 211 and the first support portion 212 may not have the first conductive connection layer 213 printed on it. In this way, if the first adsorption portion 222 needs to be removed during subsequent board separation, it can be separated from the area between the first laminate 211 and the first support portion 212. Since the first conductive connection layer 213 is not provided in the area between the first laminate 211 and the first support portion 212, it is more convenient to separate them.

[0165] Meanwhile, since the area between the first laminate 211 and the first support portion 212 does not need to be provided with the first conductive connection layer 213, and the first support portion 212 of the first plate 21 can be printed with the first conductive connection layer 213, when dividing from the area between the first laminate 211 and the first support portion 212, both sides of the divided area (the area between the first laminate 211 and the first support portion 212) have high connection strength. Therefore, the positions of the first support portion 212 and the first adsorption portion 222 are not prone to warping during division, which facilitates division.

[0166] In one possible implementation, the first adsorption section 222 may include multiple sections.

[0167] The plurality of first adsorption sections 222 may be two, three, four or more, and this application does not limit the specific number of first adsorption sections 222. Figure 5The example is based on two first adsorption units 222.

[0168] Multiple first adsorption portions 222 may be distributed at intervals around the outer periphery of the second laminate 221. The distance between any two first adsorption portions 222, or the distance from each first adsorption portion 222 to the second laminate 221, is not limited in this application and can be determined as needed.

[0169] For example, multiple first adsorption portions 222 can be evenly arranged around the outer periphery of the second layer plate 221, and the distance from each first adsorption portion 222 to the second layer plate 221 can be equal, and the distance between any two adjacent first adsorption portions 222 can be equal.

[0170] For example, when there are two first adsorption portions 222, the two first adsorption portions 222 may be distributed on opposite sides of the second laminate 221, or the two first adsorption portions 222 may be distributed at two opposite corners of the second laminate 221.

[0171] The two first adsorption portions 222 can be symmetrically or asymmetrically distributed relative to the second laminate 221. Of course, to improve the force balance of the first plate 21 during adsorption, the multiple first adsorption portions 222 can be symmetrically or uniformly distributed. In this way, when the first adsorption portions 222 are adsorbed to move the second plate 22 to the location of the first plate 21, the force on the second plate 22 is more balanced, making the adsorption transfer more reliable.

[0172] This application, by providing multiple first adsorption sections 222, can offer a larger adsorption surface area and more adsorption sites, thereby enhancing the adsorption capacity of the second plate 22. This allows the adsorption device to more firmly adsorb the second plate 22, improving the reliability of the second plate 22 during the transfer process. Simultaneously, the multiple first adsorption sections 222 can disperse the adsorption force, making the second plate 22 more stable during transfer. This helps prevent the shape or position of the second plate 22 from being affected by equipment vibration or other external forces.

[0173] For example, in the second implementation, the first adsorption part 222 can be located on the second laminate 221, such as... Figure 12 As shown.

[0174] That is, the first adsorption part 222 can be disposed not only on the outer periphery of the second laminate 221, but also on the second laminate 221. It can be considered that the first adsorption part 222 can be a part of the second laminate 221, such as... Figure 12As shown. With the above-described configuration, this application eliminates the need to reserve additional areas outside the second-layer stacked plate 221 for the dedicated first adsorption part 222. The second-layer stacked plate 221 can be installed on the entire second plate 22, which improves the area utilization rate of the second plate 22. Furthermore, it eliminates the need to remove the first adsorption part 222 later, saving steps and reducing the wear and tear on the second plate 22.

[0175] The first adsorption portion 222 may include a first pad 2211 disposed on the second laminate 221. By providing the first pad 2211 on the first adsorption portion 222, in order to improve the reliability of the electrical connection between the second board 22 and the component to be mounted, a second conductive connection layer 223 can be added to the first pad 2211 later.

[0176] Furthermore, the first adsorption portion 222 including the first pad 2211 disposed on the second laminate 221 is merely an example and not a limitation on the first adsorption portion 222 of this application. In some embodiments, the first adsorption portion 222 may also be a blank area reserved on the second laminate 221. That is to say, the first adsorption portion 222 may be an unused area on the second laminate 221.

[0177] Furthermore, when the first adsorption part 222 is disposed on the second laminate 221, the corresponding first support part 212 can also be located on the first laminate 211, such as... Figure 10 and Figure 11 As shown.

[0178] The area of ​​the first adsorption section 222 can be determined as needed, and this application does not impose any restrictions. Of course, while ensuring the adsorption strength and reliability, the area of ​​the first adsorption section 222 should be made as small as possible to avoid occupying too much space in the second layer of the stacked plate 221.

[0179] In one possible implementation, the first adsorption section 222 may include multiple sections.

[0180] The aforementioned plurality of first adsorption portions 222 may be two, three, four, or more first adsorption portions 222. This application does not limit the distribution pattern of the plurality of first adsorption portions 222. For example, the plurality of first adsorption portions 222 may be symmetrically or uniformly distributed relative to the centerline perpendicular to the thickness direction of the second laminate 221.

[0181] When multiple first adsorption portions 222 are symmetrically distributed, taking two as an example, the two first adsorption portions 222 can be distributed on both sides of the second laminate 221, or the two first adsorption portions 222 can be distributed at two opposite corners of the second laminate 221.

[0182] Of course, the two first adsorption portions 222 can be symmetrically distributed relative to the center of the second layer plate 221, or they can be asymmetrically distributed. The symmetrical or uniform distribution of multiple first adsorption portions 222 can make the force on the second plate 22 more balanced when the second plate 22 is moved to the first plate 21 by adsorbing the first adsorption portions 222, making the adsorption and transfer more reliable.

[0183] By providing multiple first adsorption sections 222, this application offers a larger adsorption surface area and more adsorption sites, thereby enhancing the adsorption capacity of the second plate 22. This allows the adsorption device to more firmly adhere to the second plate 22, improving the reliability of the second plate 22 during the transfer process. Simultaneously, the multiple first adsorption sections 222 disperse the adsorption force, making the second plate 22 more stable during transfer. This helps prevent the shape or position of the second plate 22 from being affected by equipment vibration or other external forces.

[0184] Multiple first adsorption portions 222 can be distributed at intervals around the center of the second layer plate 221. The distribution of multiple first adsorption portions 222 around the center of the second layer plate 221 can make the adsorption points of the second plate 22 as dispersed as possible, which can improve the force balance of the second plate 22 when it is adsorbed to a certain extent.

[0185] When the first adsorption part 222 is located on the second laminate 221, in order to improve the reliability of the electrical connection between the second plate 22 and the part to be mounted, in one possible manner, please refer to [reference needed]. Figure 16 After step S300, where the second plate 22 is attached to the first plate 21 via the first adsorption part 222, the assembly method of the multilayer board three-dimensional stacked structure 20 may further include the following step S400:

[0186] S400, perform solder plating on the first pad 2211. Please refer to... Figures 12 to 15 .

[0187] That is, after step S300, the assembly method of the multilayer board three-dimensional stacked structure 20 of this application may also include the step of performing tin spraying on the first pad 2211.

[0188] When the first adsorption part 222 is disposed on the second laminate 221, such as Figure 12 As shown, when printing the second conductive connection layer 223 onto the second plate 22, it is necessary to avoid the first adsorption portion 222. Therefore, when mounting the second plate 22 with the printed second conductive connection layer 223 onto the first plate 21, as shown... Figure 13 and Figure 14As shown, the second laminate 221 does not have a second conductive connection layer 223 in the area corresponding to the first adsorption portion 222. To improve the reliability of the electrical connection between the second laminate 221 and the component to be mounted, the first pad 2211 can be tin-plated to obtain... Figure 15 .

[0189] The second laminate 221 may also have multiple second pads 2212, and the second conductive connection layer 223 may be printed on the multiple second pads 2212, such as... Figure 12 and Figure 13 As shown. In this way, the second laminate 221 can be mounted to the component to be mounted through the second pad 2212 printed with the second conductive connection layer 223.

[0190] When the first adsorption part 222 is disposed on the second laminate 221, in addition to multiple second pads 2212, the second laminate 221 can also have a first pad 2211 disposed on the first adsorption part 222. When the second board body 22 is mounted on the first board body 21, the first pads 2211 on the second board body 22 can be tin-plated, thus making the electrical connection between the second board body 22 and the component to be mounted more reliable.

[0191] Of course, in other embodiments, it may be unnecessary to perform tin plating on the first pad 2211. This reduces the number of fabrication steps in the multilayer board stacked structure 20, improving fabrication efficiency. Those skilled in the art can select a suitable assembly method according to actual needs.

[0192] In one possible approach, please refer to Figure 16 or Figure 17 After step S300, where the second plate 22 is attached to the first plate 21 via the first adsorption part 222, the assembly method of the multilayer board three-dimensional stacked structure 20 may further include steps S500-S600:

[0193] S500, Perform patch detection on the mounting status of the first board 21 and the second board 22;

[0194] S600, Perform material testing on the second conductive connection layer 223 on the second plate 22.

[0195] In this application, steps S500 and S600 can be interchanged. That is, step S500 can be executed first and then step S600 can be executed, or step S600 can be executed first and then step S500. This application does not restrict this.

[0196] The mounting status detection of the first board 21 and the second board 22 can correct errors in a timely manner when there are positional deviations or incorrect mounting of the first board 21 and the second board 22, thereby preventing the product from flowing into the next process, causing product repair difficulties or product scrapping.

[0197] The quality of the printing of the second conductive connection layer 223 directly affects the quality of subsequent component soldering. Therefore, in order to ensure stable quality, an additional optical instrument is set up after the second conductive connection layer 223 is printed to check the printing quality of the second conductive connection layer 223. If a second board 22 with poor printing is found after inspection, it can be picked out, the second conductive connection layer 223 on it can be washed off and reprinted, or the excess second conductive connection layer 223 can be removed by repair.

[0198] If problems are found in the second conductive bonding layer 223 after subsequent curing, it may require soldering iron repair or scrapping. If printing problems can be detected and improved or resolved before early curing, the production defect rate and repair costs can be significantly reduced.

[0199] Furthermore, when the assembly method of the multilayer board three-dimensional stacked structure 20 of this application includes the solder spraying process in step S400, steps S500 and S600 can be before step S400, after step S500 and S600, or between step S500 and S600 (i.e., interspersed between step S500 and S600), this application does not impose any restrictions on this.

[0200] In one possible approach, please refer to Figure 18 As shown, the assembly method of the multilayer board three-dimensional stacked structure 20 of this application may further include step S700.

[0201] S700. Obtain the third plate 23. The third plate 23 includes a third laminate 231 and a second adsorption part 232. One side of the third laminate 231 is printed with a third conductive connection layer 233. The third conductive connection layer 233 is used to mount the part to be mounted.

[0202] After step S300, when the second plate 22 is attached to the first plate 21 by the first adsorption part 222, the assembly method of the multilayer board three-dimensional stacked structure 20 provided in this application may further include step S800.

[0203] S800, the third plate 23 is attached to the second plate 22 through the second adsorption part 232, so that the second laminate 221 and the third laminate 231 are connected, and the first adsorption part 222 and the second adsorption part 232 are arranged opposite to each other.

[0204] In other words, after the second plate 22 is attached to the first plate 21, the multilayer board three-dimensional stacked structure 20 of this application may further include steps S700 and S800. That is, after the second plate 22 is attached to the first plate 21, a third plate 23 may be prepared and attached to the second plate 22.

[0205] The third conductive connection layer 233 on the third plate 23 can be used to mount the component to be mounted. The component to be mounted can be other plates, electronic components 24, or both. This application does not limit this.

[0206] The second adsorption section 232, like the first adsorption section 222, serves as the adsorption point for the third plate 23. The structure, shape, number, and position of the second adsorption section 232 can be referenced to the first adsorption section 222 described above. The positional, arrangement, and quantity relationships between the second adsorption section 232 and the third laminated plate 231 can be referenced to the first adsorption section 222 and the second laminated plate 221 described above. Any features applicable to the first adsorption section 222 that can be applied to the second adsorption section 232 can also be applied to the second adsorption section 232, and will not be repeated here.

[0207] In addition, after completing step S800, if it is necessary to continue stacking other boards, you can refer to steps S700 and S800 to continue preparing boards with printed conductive connection layers and attaching them to the third board 23. Since this can be easily deduced from the aforementioned steps, this application will not describe it here.

[0208] Furthermore, the above steps S700 and S800 can be performed after the mounting state of the first board 21 and the second board 22 is inspected and the material of the second conductive connection layer 223 on the second board 22 is inspected. Alternatively, they can be performed after the second board 22 is mounted onto the first board 21 by the first adsorption part 222. Or they can be performed after the first solder pad 2211 is tin-plated (if tin-plating is required). This application does not limit these steps, as long as the second board 22 is mounted onto the first board 21.

[0209] By continuing to mount the third board 23, this application can obtain a higher density multilayer board three-dimensional stacked structure 20, which makes the multilayer board three-dimensional stacked structure 20 more integrated and can accommodate more electronic components 24.

[0210] To make the connection between the first plate 21 and the second plate 22 more reliable, such as Figure 18In one possible implementation, after step S600, where the material of the second conductive connection layer 223 on the second plate 22 is tested, the assembly method of the multilayer board three-dimensional stacked structure 20 may further include step S900:

[0211] S900, the structure including the first plate 21 and the second plate 22 is reflow soldered.

[0212] After reflow soldering, the conductive connection layer can be melted, thereby fixing the electronic component 24 onto the corresponding board, and also fixing the first board 21 and the second board 22.

[0213] In the assembly method of the multilayer board stacked structure 20, the steps of obtaining the third board 23 and attaching the third board 23 to the second board 22 are further included. This step S900 can be performed after the third board 23 is attached. In this way, the conductive connection layers of the multilayer board stacked structure 20 can be cured by one reflow soldering, which can improve efficiency and reduce damage to electronic components 24.

[0214] In one possible implementation, after step S900 is completed, a detection step and a board separation step may also be included.

[0215] The testing steps may include checking whether each solder joint of the device after reflow soldering is complete or has defects, checking whether there are defects in the mounting between two adjacent boards, and checking whether there are defects in the mounting of the corresponding board and the electronic components 24 on it.

[0216] The separation step refers to the process where, if multiple devices are fabricated simultaneously during the initial fabrication phase, they can be separated into multiple individual products through a later process.

[0217] If the first adsorption portion 222 is located on the outer periphery of the second laminate 221, the first adsorption portion 222 can be removed simultaneously during the delamination step. Of course, if the device obtained includes a third plate 23, and the second adsorption portion 232 of the third plate 23 is also located on the outer periphery of the third laminate 231, then the first adsorption portion 222 and the second adsorption portion 232 can be removed simultaneously during the delamination step.

[0218] Please refer to Figure 19 In one feasible manner, after obtaining the first plate 21, the assembly method of the multi-layer plate three-dimensional stacked structure 20 may further include steps S01-S02.

[0219] S01. Perform material testing on the first conductive connection layer 213;

[0220] S02, Electronic components 24 are mounted on the first laminate 211.

[0221] The quality of the printing of the first conductive connection layer 213 will affect the quality of subsequent component soldering. After the first conductive connection layer 213 is printed, the printing quality of the first conductive connection layer 213 should be checked. If a first board 21 with poor printing is found after inspection, it can be picked out, the first conductive connection layer 213 on it can be washed off and reprinted, or the excess first conductive connection layer 213 can be removed by repair.

[0222] If problems are found in the first conductive bonding layer 213 after subsequent curing, it may require soldering iron repair or scrapping. If printing problems can be detected and improved or resolved before early curing, the production defect rate and repair costs can be significantly reduced.

[0223] The electronic components 24 are mounted on the first laminate 211. They can be mounted on one side of the first laminate 211 or on two opposite sides of the first laminate 211. This application does not limit this and can set it as needed. Mounting the electronic components 24 on the first laminate 211 can improve the utilization rate of the first laminate 211, thereby improving the integration of the multilayer board three-dimensional stacked structure 20.

[0224] In addition, in this embodiment, the feeding of the second plate 22, the printing of the second conductive connection layer 223 of the second plate 22, and the mounting of the first plate 21 and the second plate 22 can be performed within the first device 220.

[0225] The first device 220 may include a feeding unit, a printing unit, and a mounting unit. The mounting unit is located between the feeding unit and the printing unit. The second board 22 can be fed into the feeding unit first; then it can be conveyed to the printing unit by means of a conveyor belt or the like for printing the second conductive connection layer 223; and then it can be conveyed to the mounting unit by means of a conveyor belt or the like for mounting onto the first board 21.

[0226] In addition to the preparation and mounting of the third board 23, the assembly method of this application may also include a first device 220 for feeding, printing and mounting the third board 23. For example, the third board 23 may be fed into the feeding unit first; then conveyed to the printing unit by means of a conveyor belt or the like for printing the third conductive connection layer 233; and then conveyed to the mounting unit by means of a conveyor belt or the like for mounting onto the second board 22.

[0227] When the assembly method of this application requires the stacking of other plates on the third plate 23, the first device 220 can be added. Its principle is the same as the arrangement of the second plate 22 and the third plate 23 mentioned above. Those skilled in the art can easily deduce it based on the above description. To avoid repetition, it will not be described again here.

[0228] In one possible implementation, the peak temperatures of the materials of the first conductive connection layer 213 and the second conductive connection layer 223 are both between 230°C and 260°C.

[0229] The peak temperature mentioned above refers to the highest temperature that the material can reach during the reflow soldering process.

[0230] For example, the peak temperature of the material of the first conductive connection layer 213 can be 230°C, 240°C, 250°C or 260°C, etc., and the peak temperature of the material of the second conductive connection layer 223 can be 230°C, 240°C, 250°C or 260°C, etc.

[0231] The assembly method of this application allows for printing before mounting, thus enabling the fabrication of a multilayer board three-dimensional stacked structure 20 on the same SMT line. Therefore, this application does not require multiple reflow soldering steps; instead, all conductive connection layers can be simultaneously cured in a single reflow soldering. As a result, the materials for the first conductive connection layer 213 and the second conductive connection layer 223 can be high-temperature materials (i.e., peak temperatures between 230°C and 260°C). Compared to low-temperature materials, high-temperature materials do not exhibit brittle bismuth (Bi) crystallization, thus resulting in better reliability.

[0232] In addition, when the assembly method of this application also includes a third plate 23, the peak temperature of the material of the third conductive connection layer 233 on the third plate 23 can also be between 230°C and 260°C.

[0233] In one feasible approach, the materials of the first conductive connection layer 213 and the second conductive connection layer 223 can be the same. This eliminates the need to change materials during fabrication, saving considerable effort in both material selection and preparation. Furthermore, the consistency of the same material after reflow soldering and curing is better, improving the overall performance of the device.

[0234] In addition, when the assembly method of this application further includes a third plate 23, the materials of the first conductive connection layer 213, the second conductive connection layer 223, and the third conductive connection layer 233 can all be the same.

[0235] Of course, the fact that the materials of the first conductive connection layer 213, the second conductive connection layer 223, and the third conductive connection layer 233 are all the same is only an example and is not a limitation of this application. In other embodiments, two of the first conductive connection layer 213, the second conductive connection layer 223, and the third conductive connection layer 233 may be the same, and the remaining one may be different from the other two; or all three may be different.

[0236] In one possible implementation, the materials of the first conductive connection layer 213 and the second conductive connection layer 223 comprise solder paste.

[0237] For example, the materials of the first conductive connection layer 213 and the second conductive connection layer 223 can both be lead-free solder paste. For instance, the material composition of both the first conductive connection layer 213 and the second conductive connection layer 223 can include tin, silver, and copper. Of course, the above material compositions are merely examples and are not intended to limit this application.

[0238] Of course, when a third conductive connection layer 233 is present, the material of the third conductive connection layer 233 may also include solder paste, for example, lead-free solder paste whose material composition includes tin, silver and copper may be used.

[0239] Solder paste has a high melting point, which allows it to melt fully during soldering and form a strong connection, thereby improving the stability and reliability of the connection between adjacent boards or between the board and electronic components 24. At the same time, as tin is a good conductor, solder paste soldering can improve the connection and signal transmission between adjacent boards or between the board and electronic components 24, and improve conductivity.

[0240] On the other hand, this application provides a multilayer board three-dimensional stacked structure 20, please refer to... Figure 20 The multi-layer board three-dimensional stacked structure 20 includes a first stacked board 211 and a second stacked board 221.

[0241] One side of the first laminate 211 has a first conductive connection layer 213.

[0242] The first conductive connection layer 213 can be used to mount the second laminate 221, and can also be used to mount electronic components 24, such as chips, capacitors, inductors, power modules, resistors, potentiometers, heat sinks, connectors, discrete semiconductor devices, electroacoustic devices, laser devices, optoelectronic devices, sensors, switches, micro motors, electronic transformers, relays, and integrated circuit devices.

[0243] The number and type of electronic components 24 mounted on the first layer 211 are not limited in this application and can be determined according to the circuit design.

[0244] In addition, if mounting is required on only one side of the first laminate 211, the first conductive connection layer 213 can be disposed on only one side of the first laminate 211; if mounting is required on both sides of the first laminate 211, the first conductive connection layer 213 can also be disposed on the two opposite surfaces of the first laminate 211. Figure 20 The example is that the first layer 211 is mounted on both sides. Using double-sided mounting can effectively improve the area utilization of the first layer 211, thereby improving the integration of the multilayer board stacked structure 20.

[0245] Furthermore, the pattern shape of the first conductive connection layer 213 and the coverage area of ​​the first conductive connection layer 213 on the first laminate 211 are not subject to special restrictions in this application and can be determined according to the circuit design.

[0246] The second laminate 221 is disposed on the side of the first laminate 211 having the first conductive connection layer 213.

[0247] That is, the second layer 221 is stacked on the side of the first layer 211 that has the first conductive connection layer 213. Thus, the first conductive connection layer 213 electrically connects and fixes the first layer 211 and the second layer 221 together. It should be understood that the conductive connection layer can be conductive adhesive or solder paste, etc. In this embodiment, the conductive connection layers mentioned in this application are all layers that can provide both electrical conductivity and mechanical connection. For example, if a conductive connection layer is provided between two boards, both mechanical and electrical connections can be achieved between the two boards. Other conductive connection layers discussed below are similar and will not be explained further to avoid redundancy.

[0248] The second laminate 221 has a second conductive connection layer 223 on the side opposite to the first laminate 211. The second conductive connection layer 223 is used to mount the component to be mounted.

[0249] The second conductive connection layer 223 on the second laminate 221 can be used to mount the component to be mounted. The component to be mounted can be an electronic component 24 or other board (such as a third board), and this application does not limit it.

[0250] Furthermore, the second conductive connection layer 223 is similar to the first conductive connection layer 213. The coverage area of ​​the second conductive connection layer 223 on the second plate and the specific pattern of the second conductive connection layer 223 are not specially limited in this application and can be determined according to the circuit design.

[0251] The peak temperatures of the materials of the first conductive connection layer 213 and the second conductive connection layer 223 are both between 230°C and 260°C.

[0252] For example, the peak temperature of the material of the first conductive connection layer 213 can be 230°C, 240°C, 250°C, or 260°C, etc., and the peak temperature of the material of the second conductive connection layer 223 can be 230°C, 240°C, 250°C, or 260°C, etc. Of course, the above specific temperature values ​​are only examples and are not specific limitations on the peak temperatures of the materials of the first conductive connection layer 213 and the second conductive connection layer 223 in this application.

[0253] This application sets the peak temperature of the material of the first conductive connection layer 213 and the peak temperature of the material of the second conductive connection layer 223 both between 230°C and 260°C. This allows each conductive connection layer of the multilayer board stacked structure 20 to be cured in a single reflow soldering operation, enabling simultaneous reflow soldering of the conductive connection layers between adjacent boards or between boards and electronic components 24. Therefore, the multilayer board stacked structure 20 of this application does not require multiple reflow soldering processes during assembly; instead, all conductive connection layers can be cured simultaneously in a single reflow soldering operation.

[0254] In addition, the materials of the first conductive connection layer 213 and the second conductive connection layer 223 of this application can be high-temperature materials with peak temperatures between 230°C and 260°C. Compared with low-temperature materials, high-temperature materials do not have brittle bismuth (Bi) element crystallization, so they have better reliability.

[0255] In one possible implementation, the first conductive connection layer 213 and the second conductive connection layer 223 can be made of the same material.

[0256] Using the same material for the first conductive connection layer 213 and the second conductive connection layer 223 eliminates the need to prepare multiple materials during fabrication, reducing the pressure of material selection. Furthermore, since the first conductive connection layer 213 and the second conductive connection layer 223 are made of the same material, the consistency of the multilayer board three-dimensional stacked structure 20 is also better after reflow soldering and curing, which can improve the overall performance of the device.

[0257] Of course, the first conductive connection layer 213 and the second conductive connection layer 223 made of the same material are merely examples and are not intended to limit this application. In other embodiments, the first conductive connection layer 213 and the second conductive connection layer 223 may also be made of different materials, as long as the peak temperature of the material of the first conductive connection layer 213 and the peak temperature of the material of the second conductive connection layer 223 are both between 230°C and 260°C.

[0258] In one possible implementation, the materials of the first conductive connection layer 213 and the second conductive connection layer 223 may both contain solder paste.

[0259] For example, the first conductive connection layer 213 and the second conductive connection layer 223 can be made of lead-free solder paste with material components including tin, silver and copper.

[0260] Because solder paste has a high melting point, it can fully melt and form a strong connection during soldering. Therefore, this application uses solder paste as the material for the first conductive connection layer 213 and the second conductive connection layer 223, which can improve the connection stability and reliability between adjacent boards or between the board and the electronic component 24. At the same time, as tin is a good conductor, solder paste soldering can improve the good electrical connection and signal transmission between adjacent boards or between the board and the electronic component 24, and improve conductivity.

[0261] Of course, solder paste as the material of the first conductive connection layer 213 and the second conductive connection layer 223 is only one example of this application and is not a limitation of this application. In other embodiments, the materials of the first conductive connection layer 213 and the second conductive connection layer 223 can also be other materials with electrical and mechanical connection functions, such as conductive adhesive and other adhesive materials.

[0262] In one possible implementation, the multilayer board stacked structure 20 may further include a third layer 231, such as... Figure 20 As shown.

[0263] The third layer 231 is disposed on the side of the second layer 221 where the second conductive connection layer 223 is located. That is, the third layer 231 can be disposed on the side of the second layer 221 where the second conductive connection layer 223 is located, so that the second conductive connection layer 223 can fix the third layer 231 onto the second layer 221.

[0264] The third laminate 231 has a third conductive connection layer 233 on the side opposite to the second laminate 221. By providing the third conductive connection layer 233, other components to be mounted can be fixed on the third conductive connection layer 233. These components can be electronic components 24 or other boards.

[0265] Alternatively, if mounting is required on only one side of the third laminate 231, the third conductive connection layer 233 can be disposed on only one side of the third laminate 231; if mounting is required on both sides of the third laminate 231, the third conductive connection layer 233 can also be disposed on the two opposite surfaces of the third laminate 231. Figure 20 This example uses the first layer of laminate 211, which is mounted on one side.

[0266] The peak temperature of the material of the third conductive connection layer 233 can be between 230°C and 260°C. Thus, the peak temperatures of the materials of the third conductive connection layer 233, the first conductive connection layer 213, and the second conductive connection layer 223 are all set between 230°C and 260°C. Each conductive connection layer of the multilayer board stacked structure 20 can be cured in a single reflow soldering process. The multilayer board stacked structure 20 of this application does not require multiple reflow soldering processes during assembly; instead, all conductive connection layers can be cured simultaneously in a single reflow soldering process.

[0267] For example, the peak temperature of the material of the third conductive connection layer 233 can be 230°C, 240°C, 250°C or 260°C, etc.

[0268] In one possible implementation, the third laminate 231 may further include at least two laminates disposed on the second laminate 221, with a third conductive connection layer 233 between adjacent third laminates 231, such as... Figure 21 As shown. By setting at least two third-layer stacked boards 231, this application can effectively improve the integration of the multi-layer board three-dimensional stacked structure 20.

[0269] In other words, the third layer 231 can be stacked multiple times on the second layer 221, which can further improve the integration of the multilayer board three-dimensional stacked structure 20 of this application. For example, the number of third layer 231 can be two, three, four or five, etc.

[0270] In order to facilitate the fixing and electrical connection of two adjacent third-layer stacked plates 231, a third conductive connection layer 233 is also provided between two adjacent third-layer stacked plates 231.

[0271] In addition, in this embodiment, the multi-layer board stacked structure 20 can have one board or multiple boards on the same plane. In this embodiment, "multiple" refers to two or more boards.

[0272] For example, in addition to the second layer 221, a fourth layer 251 can also be provided on the first layer 211, such as... Figure 21 As shown, a first conductive connection layer 213 is provided between the fourth laminate 251 and the first laminate 211.

[0273] The fourth layer 251 may have a fourth conductive connection layer 253 on the side opposite to the first layer 211. The fourth conductive connection layer 253 can be used to mount the component to be mounted. The component to be mounted may be an electronic component 24 or other board material, and this application does not limit it.

[0274] This application also provides an assembly system 200 for a multi-layer board three-dimensional stacked structure. Please refer to [link / reference]. Figure 22 As shown, the assembly system 200 of the multilayer board three-dimensional stacked structure may include a first device 210, which is used to print a first conductive connection layer 213 on the first layer stack 211.

[0275] That is, the first device 210 includes at least means for printing the first conductive connection layer 213, and the first device 210 provided in this application is capable of printing the first conductive connection layer 213 on the first laminate 211.

[0276] The first conductive connection layer 213 serves both to conduct electricity and to mechanically connect the two plates. For example, the first conductive connection layer 213 can be a soldering material layer, such as solder paste; or, it can be an adhesive material layer, such as conductive adhesive. Of course, the above-mentioned first conductive connection layer 213 comprising a soldering material layer or an adhesive material layer is merely an example and not a limitation on the specific material of the first conductive connection layer 213 in this application.

[0277] The assembly system 200 for the multi-layer board stacking structure may further include a first device 220, which is connected to the first device 210. For example, the first device 220 may be located at the discharge end of the first device 210, so that the material coming out of the first device 210 can enter the first device 210.

[0278] The first device 220 is used to print a second conductive connection layer 223 on the second laminate 221 and attach the second laminate 221 to the side of the first laminate 211 having the first conductive connection layer 213 via the first adsorption part 222.

[0279] In other words, the first device 220 of this application can print a second conductive connection layer 223, wherein the second conductive connection layer 223 can also be a soldering material layer, such as solder paste; or, the second conductive connection layer 223 can also be an adhesive material layer, such as conductive adhesive. Of course, the above-mentioned second conductive connection layer 223 may include a soldering material layer or an adhesive material layer, which is only an example and is not a limitation on the specific material of the second conductive connection layer 223 of this application.

[0280] Furthermore, this application does not limit the specific method by which the first device 220 prints the second conductive connection layer 223; for example, it can use stencil printing. Similarly, this application does not limit the specific method by which the first device 210 prints the first conductive connection layer 213; for example, it can use stencil printing.

[0281] Furthermore, the printing patterns and positions of the first conductive connection layer 213 and the second conductive connection layer 223 can be determined according to the circuit design, and this application does not impose any special restrictions.

[0282] The first adsorption part 222 can be directly connected to the second layer plate 221 or indirectly connected to the second layer plate 221; this application does not impose any restrictions. As long as the first device 220 can move the second layer plate 221 by adsorbing the first adsorption part 222, it is acceptable. That is, when the first device 220 adsorbs the first adsorption part 222 to move it, it can simultaneously move the second layer plate 221. In this way, the first device 220 can move the second layer plate 221 to one side of the first layer plate 211 via the first adsorption part 222, and attach it to the side of the first layer plate 211 that has the first conductive connection layer 213.

[0283] The assembly system 200 of the multilayer board stacked structure may also include a first mounting detection device 230, which is connected to the first device 220 and is used to detect the mounting status of the first layer stack 211 and the second layer stack 221.

[0284] The inspection of the mounting status of the first laminate 211 and the second laminate 221 may include checking for defects such as incorrect or misaligned mounting. By inspecting the mounting status of the first laminate 211 and the second laminate 221, mounting defects can be detected and corrected in a timely manner, preventing problems such as difficult repairs or scrapping of materials in subsequent processes.

[0285] The specific testing methods of the first mounting testing device 230 are not limited in this application. For example, a camera unit can be used for photographic testing.

[0286] In addition, to facilitate timely detection by users, an alarm device can be installed to promptly alert the user when the first placement detection device 230 detects defects in the placement status of the first laminate 211 and the second laminate 221. Alarm methods include, but are not limited to, voice announcements, audible and visual warnings, or text announcements.

[0287] The assembly system 200 of the multilayer board three-dimensional stacked structure may also include a first material detection device 240, which is connected to a first mounting detection device 230 and is used to perform material detection on the second conductive connection layer 223.

[0288] The quality of the printing of the second conductive connection layer 223 will affect the soldering quality of the components to be mounted on it. After the second conductive connection layer 223 is printed, its printing quality should be checked. If a second layer stack 221 with poor printing is found, it can be picked out, the second conductive connection layer 223 on it can be washed off and reprinted, or the excess second conductive connection layer 223 can be removed by repair.

[0289] If problems are found in the second conductive bonding layer 223 after subsequent curing, it may require soldering iron repair or scrapping. If printing problems can be detected and improved or resolved before early curing, the production defect rate and repair costs can be significantly reduced.

[0290] Of course, the first material testing device 240 can also be set in the first device 220. In this way, after the second conductive connection layer 223 is printed on the second laminate 221, the material of the second conductive connection layer 223 can be tested by the first material testing device 240, and then the second laminate 221 can be attached to the side of the first laminate 211 with the first conductive connection layer 213 by the first adsorption part 222.

[0291] In this way, timely inspection before the first layer 211 and the second layer 221 are mounted, and timely handling after defects occur, makes maintenance easier and reduces the risk of material scrap compared to repairing the second conductive connection layer 223 after the first layer 211 and the second layer 221 are mounted.

[0292] The assembly system 200 of the multi-layer board stacked structure may also include a reflow soldering device 250, which is connected to a first material detection device 240 and is used to perform reflow soldering on the structure containing the first layer stack 211 and the second layer stack 221.

[0293] This application uses a reflow soldering device 250 to perform reflow soldering, which can solidify the first conductive connection layer 213 and the second conductive connection layer 223, thereby allowing the first laminate 211 to be securely fixed to the second laminate 221, and allowing the component to be mounted to be securely fixed to the second laminate 221.

[0294] This application, by setting up a first device 210, can print a first conductive connection layer 213 on a first laminate 211; by setting up a first device 220, can print a second conductive connection layer 223 on a second laminate 221, and attach a second plate with the second conductive connection layer 223 printed on it to the first conductive connection layer 213 via a first adsorption part 222; by setting up a first mounting detection device 230, the mounting status of the first laminate 211 and the second laminate 221 can be detected; by setting up a first material detection device 240, the material of the second conductive connection layer 223 can be detected, so as to promptly detect whether there are mounting defects in the first laminate 211 and the second laminate 221, and whether there are material defects in the second conductive connection layer 223, so as to correct the defects in time and prevent the material from flowing to subsequent processes, causing maintenance difficulties or scrapping. After performing corresponding mounting status and material inspections, reflow soldering via the reflow soldering device 250 can solidify the first conductive connection layer 213 and the second conductive connection layer 223, thereby enhancing the mechanical connection strength of the entire structure. This application, through the above design, enables the assembly of a multi-layer board stacked structure 20 on a single production line, reducing SMT line resource waste, shortening the manufacturing cycle, improving processing quality and product reliability, and providing support for mass production of the assembly process.

[0295] In one possible approach, please refer to Figure 23 As shown, the first device 220 may include multiple devices. These multiple first devices 220 may be two or more, and the specific number can be determined based on the number of layers in the multilayer board stacking structure 20; this application does not impose specific limitations.

[0296] One of the first devices 220 is connected between the first equipment 210 and the first mounting detection device 230.

[0297] The remaining first devices 220 are respectively connected between the first material testing device 240 and the reflow soldering device 250, and are used to print the third conductive connection layer 233 on the third laminate 231, and attach the third laminate 231 to the side of the second laminate 221 with the second conductive connection layer 223 through the second adsorption part 232.

[0298] In other words, one of the multiple first devices 220 is located between the first equipment 210 and the first mounting inspection device 230, while the rest are located between the first material inspection device 240 and the reflow soldering device 250.

[0299] The first device 220, located between the first material testing device 240 and the reflow soldering device 250, can be used to print the third conductive connection layer 233 on the third laminate 231, and to attach the third laminate 231 to one side of the second laminate 221 in sequence through the second adsorption part 232.

[0300] For example, the first device 220 located between the first material testing device 240 and the reflow soldering device 250 includes two devices, namely first device A and first device B. It can be that first device A and first device B are respectively used to print a third conductive connection layer 233 on their respective third laminate 231. Then, first device A attaches the third laminate 231 with the third conductive connection layer 233 printed on it to the second conductive connection layer 223 through the second adsorption part 232, and first device B attaches the third laminate 231 with the third conductive connection layer 233 printed on it to the third conductive connection layer 233 printed by first device A through the second adsorption part 232.

[0301] This application can realize the printing and mounting of multiple boards by setting up multiple first devices 220, thereby improving the integration of the multilayer board three-dimensional stacked structure 20.

[0302] In one possible implementation, the assembly system 200 for the multilayer board stacked structure may further include a second mounting detection device 260 and / or a dividing device 270.

[0303] The second mounting inspection device 260 is connected to the reflow soldering device 250 and is used to inspect the mounting status of the structure after reflow soldering. The function of the second mounting inspection device 260 is the same as that of the first mounting inspection device 230. Please refer to the relevant description of the first mounting inspection device 230. The same parts will not be repeated in this application.

[0304] The dividing device 270 is connected to the second mounting detection device 260 and is used to divide the structure that has passed through the second mounting detection device 260 to obtain multiple multilayer board three-dimensional stacked structures 20.

[0305] By using the segmentation device 270, multiple multilayer board stacked structures 20 can be prepared simultaneously in the aforementioned device. Then, the segmentation device 270 can be used to divide the entire structure into multiple independent multilayer board stacked structures 20, thereby improving the preparation efficiency.

[0306] In one possible implementation, the first device 210 may include a first printing apparatus 2101 for printing a first conductive connection layer 213 on the first laminate 211. The specific printing method of the first printing apparatus 2101 is not limited in this application; for example, stencil printing may be used.

[0307] The first device 210 may also include a second material testing device 2102, which may be connected to the first printing device 2101 for material testing of the first conductive connection layer 213.

[0308] By setting up a second material detection device 2102, it is possible to detect in a timely manner whether there are printing defects in the first conductive connection layer 213 printed by the first printing device 2101, so as to make timely corrections and prevent it from flowing to subsequent processes, causing maintenance difficulties or scrapping.

[0309] The first device 210 may further include a first mounting device 2103, which is connected to the second material inspection device 2102 and is used to mount electronic components 24 on the first laminate 211. By setting the first mounting device 2103, electronic components 24 can be mounted on the first laminate 211, thereby effectively utilizing the area of ​​the first laminate 211 and improving the integration and area utilization of the multilayer board stacked structure 20.

[0310] The specific mounting position or quantity of electronic components 24 on the first laminate 211 is not specifically limited in this application.

[0311] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples. The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A one-time assembly method for a multi-layer board three-dimensional stacked structure, characterized in that, include: A first plate is obtained, the first plate comprising a first laminate and a first support portion, wherein a first conductive connection layer is printed on one side of the first laminate. Obtain a second plate, the second plate including a second laminate and a first adsorption part, one side of the second laminate is printed with a second conductive connection layer, the second conductive connection layer is used to mount the part to be mounted; The second plate is attached to the first plate through the first adsorption part, so that the first laminate and the second laminate are connected, and the first adsorption part and the first support part are arranged opposite to each other.

2. The one-time assembly method for the multi-layer plate three-dimensional stacked structure according to claim 1, characterized in that, The first adsorption portion is located on the outer periphery of the second laminate, and the first adsorption portion is connected to the second laminate.

3. The one-time assembly method for the multi-layer plate three-dimensional stacked structure according to claim 2, characterized in that, The first adsorption portion includes a plurality of first adsorption portions, which are distributed at intervals around the outer periphery of the second laminate.

4. The one-time assembly method for the multi-layer plate three-dimensional stacked structure according to claim 1, characterized in that, The first adsorption section is located on the second laminate.

5. The one-time assembly method for the multi-layer plate three-dimensional stacked structure according to claim 4, characterized in that, The first adsorption portion includes a plurality of first adsorption portions, which are distributed at intervals around the center of the second laminate.

6. The one-time assembly method for a multi-layer plate three-dimensional stacked structure according to claim 4 or 5, characterized in that, The first adsorption portion includes a first pad disposed on the second laminate.

7. The one-time assembly method for the multi-layer board three-dimensional stacked structure according to claim 6, characterized in that, After attaching the second plate to the first plate via the first adsorption part, the method further includes: The first pad is then subjected to solder spraying.

8. The method for assembling a multi-layer plate three-dimensional stacked structure according to any one of claims 1-7, characterized in that, After attaching the second plate to the first plate via the first adsorption part, the method further includes: The mounting status of the first board and the second board is inspected for patch mounting. Material testing is performed on the second conductive connection layer on the second plate.

9. The method for assembling a multi-layer plate three-dimensional stacked structure according to any one of claims 1-8, characterized in that, The method further includes: A third plate is obtained, the third plate comprising a third laminate and a second adsorption part, one side of the third laminate is printed with a third conductive connection layer, the third conductive connection layer being used to mount the part to be mounted. After attaching the second plate to the first plate via the first adsorption part, the method further includes: The third plate is attached to the second plate through the second adsorption part, so that the second laminate and the third laminate are connected, and the first adsorption part and the second adsorption part are arranged opposite to each other.

10. The method for assembling a multi-layer board three-dimensional stacked structure according to claim 8 or 9 in one step, characterized in that, After performing material testing on the second conductive connection layer on the second plate, the method further includes: The structure comprising the first plate and the second plate is subjected to reflow soldering.

11. The method for assembling a multi-layer plate three-dimensional stacked structure according to any one of claims 1-10, characterized in that, After obtaining the first plate, the method further includes: Material testing is performed on the first conductive connection layer; Electronic components are mounted on the first laminate.

12. The method for assembling a multi-layer plate three-dimensional stacked structure according to any one of claims 1-11, characterized in that, The peak temperatures of the materials of the first conductive connection layer and the second conductive connection layer are both between 230°C and 260°C.

13. The one-time assembly method for the multi-layer plate three-dimensional stacked structure according to claim 12, characterized in that, The first conductive connection layer and the second conductive connection layer are made of the same material.

14. The method for assembling a multi-layer plate three-dimensional stacked structure according to claim 12 or 13 in a single step, characterized in that, The materials of the first conductive connection layer and the second conductive connection layer comprise solder paste.

15. A multi-layer board three-dimensional stacked structure, characterized in that, include: A first laminate, one side of which has a first conductive connection layer; The second layer is disposed on the side of the first layer having the first conductive connection layer, and the side of the second layer away from the first layer has a second conductive connection layer. The second conductive connection layer is used to mount the component to be mounted. The peak temperature of the materials of the first conductive connection layer and the second conductive connection layer is between 230°C and 260°C.

16. The multi-layer board three-dimensional stacked structure according to claim 15, characterized in that, The first conductive connection layer and the second conductive connection layer are made of the same material.

17. The multi-layer board three-dimensional stacked structure according to claim 15 or 16, characterized in that, Both the first conductive connection layer and the second conductive connection layer are made of solder paste.

18. The multi-layer board three-dimensional stacked structure according to any one of claims 15-17, characterized in that, The multi-layer board three-dimensional stacked structure also includes a third layer of stacked boards; The third layer is disposed on the side of the second layer having the second conductive connection layer, and the third layer has a third conductive connection layer on the side opposite to the second layer. The peak temperature of the material of the third conductive connection layer is between 230°C and 260°C.

19. The multi-layer board three-dimensional stacked structure according to claim 18, characterized in that, The third layer comprises at least two layers stacked on the second layer, and a third conductive connection layer is provided between two adjacent third layers.

20. An assembly system for a multi-layer board three-dimensional stacked structure, characterized in that, include: A first device for printing a first conductive connection layer on a first laminate; A first device, connected to the first equipment, is used to print a second conductive connection layer on a second laminate and to attach the second laminate to the side of the first laminate having the first conductive connection layer via a first adsorption part. A first mounting inspection device, connected to the first device, is used to inspect the mounting status of the first laminate and the second laminate; A first material testing device is connected to the first mounting testing device and is used to perform material testing on the second conductive connection layer. A reflow soldering apparatus, connected to the first material testing device, is used to perform reflow soldering on a structure comprising the first laminate and the second laminate.

21. The assembly system for a multi-layer board three-dimensional stacked structure according to claim 20, characterized in that, The first device includes multiple devices; One of the first devices is connected between the first equipment and the first mounting detection device; The remaining first devices are respectively connected between the first material detection device and the reflow soldering device, and are used to print the third conductive connection layer on the third laminate, and attach the third laminate to the side of the second laminate with the second conductive connection layer through the second adsorption part.

22. The assembly system for a multi-layer board three-dimensional stacked structure according to claim 20 or 21, characterized in that, The assembly system for the multi-layer board stacked structure also includes: The second mounting inspection device is connected to the reflow soldering device and is used to inspect the mounting status of the structure after reflow soldering. A segmentation device, connected to the second mounting detection device, is used to segment the structure that has passed through the second mounting detection device to obtain multiple multilayer board three-dimensional stacked structures.

23. The assembly system for a multi-layer plate three-dimensional stacked structure according to any one of claims 20-22, characterized in that, The first device includes: A first printing apparatus is used to print the first conductive connection layer on the first laminate; The second material testing device is connected to the first printing device and is used to perform material testing on the first conductive connection layer. The first mounting device is connected to the second material detection device and is used to mount electronic components on the first laminate.

24. An electronic device, characterized in that, include: case; The multi-layer board three-dimensional stacked structure as described in any one of claims 15-19, wherein the multi-layer board three-dimensional stacked structure is disposed within the housing.

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