Anti-disassembly detection structure, method and device, electronic equipment and medium

Abstract

The invention relates to an anti-disassembly detection structure, method and device, electronic equipment and a medium. The anti-disassembly detection structure is applied to the electronic equipment, the electronic equipment comprises a middle frame and a back shell, and the middle frame is connected with the back shell; the anti-disassembly detection structure comprises an anti-disassembly piece which is arranged between the middle frame and the back shell, and the anti-disassembly piece is used for falling off when the back shell is disassembled from the middle frame; the distance sensor is arranged between the middle frame and the anti-disassembly piece, and the distance sensor is used for detecting the distance between the distance sensor and the anti-disassembly piece or the back shell; the processor is arranged between the middle frame and the back shell, the processor is electrically connected with the distance sensor, and the processor is used for determining whether the electronic equipment is disassembled or not according to the distance detected by the distance sensor. Whether the electronic equipment is disassembled or not is detected through the anti-disassembly piece and the distance sensor, and a series of complex circuits are prevented from being arranged, so that the structural complexity of the electronic equipment is reduced.

Description

Technical Field

[0001] This disclosure relates to the field of detection technology, and in particular to an anti-tamper detection structure, method, device, electronic equipment and medium. Background Technology

[0002] Electronic devices may be maliciously disassembled after leaving the factory and eventually reach the user, posing a danger during use. Therefore, tamper-proof testing is necessary for electronic devices. However, this requires incorporating a series of circuits, resulting in complex structures within these devices. Summary of the Invention

[0003] To overcome the problems existing in related technologies, this disclosure provides an anti-tamper detection structure, method, device, electronic equipment, and medium.

[0004] According to a first aspect of this disclosure, a tamper-proof detection structure is provided for use in an electronic device, the electronic device including a mid-frame and a back cover, the mid-frame being connected to the back cover; the tamper-proof detection structure includes:

[0005] An anti-disassembly component is provided between the middle frame and the back shell, and the anti-disassembly component is used to detach the back shell when it is removed from the middle frame;

[0006] A distance sensor is disposed between the middle frame and the tamper protection component, and the distance sensor is used to detect the distance between itself and the tamper protection component or the back cover;

[0007] A processor is disposed between the mid-frame and the back cover, and is electrically connected to the distance sensor. The processor is used to determine whether the electronic device has been disassembled based on the distance detected by the distance sensor.

[0008] In some embodiments of this disclosure, the middle frame and the back shell are connected by an adhesive layer, and the anti-tamper component is connected to the adhesive layer; or,

[0009] The tamper-evident component is located on the side of the back cover facing the middle frame; or,

[0010] The anti-disassembly component is held by the middle frame and the back shell.

[0011] In some embodiments of this disclosure, the electronic device further includes a circuit board disposed on the side of the mid-frame facing the back cover, and both the distance sensor and the processor are disposed on the circuit board.

[0012] In some embodiments of this disclosure, the electronic device further includes a rear camera, and the tamper protection and the distance sensor are located on the side away from the rear camera.

[0013] In some embodiments of this disclosure, the distance sensor includes an infrared distance sensor, an ultrasonic distance sensor, or a laser distance sensor; and / or, the tamper-evident component includes an tamper-evident sticker.

[0014] According to a second aspect of this disclosure, a tamper detection method is provided, applied to the tamper detection structure described above, the tamper detection method comprising:

[0015] Obtain the current distance detected by the distance sensor;

[0016] Based on the current distance, determine whether the electronic device has been disassembled.

[0017] In some embodiments of this disclosure, determining whether the electronic device has been disassembled based on the current distance includes:

[0018] Determine the distance difference between the current distance and the historical distance;

[0019] If the distance difference is greater than or equal to a preset threshold, it is determined that the electronic device has been disassembled;

[0020] If the distance difference is less than the preset threshold, it is determined that the electronic device has not been disassembled; or,

[0021] If the current distance is greater than or equal to a preset distance, it is determined that the electronic device has been disassembled;

[0022] If the current distance is less than the preset distance, it is determined that the electronic device has not been disassembled.

[0023] In some embodiments of this disclosure, before obtaining the current distance detected by the distance sensor, the tamper detection method further includes:

[0024] Turn on the distance sensor;

[0025] After determining whether the electronic device has been disassembled based on the current distance, the tamper detection method further includes:

[0026] The distance sensor is turned off.

[0027] In some embodiments of this disclosure, activating the distance sensor includes:

[0028] When the electronic device changes from a powered-off state to a powered-on state, the distance sensor is activated; or,

[0029] When the electronic device enters maintenance mode, the distance sensor is activated; or,

[0030] In response to the operation of activating the tamper detection function, the distance sensor is activated.

[0031] In some embodiments of this disclosure, after determining whether the electronic device has been disassembled based on the current distance, the tamper detection method further includes:

[0032] If the electronic device is disassembled, a notification message indicating that the electronic device has been disassembled will be issued.

[0033] According to a third aspect of this disclosure, a tamper detection device is provided, applied to the tamper detection structure described above, the tamper detection device comprising:

[0034] An acquisition module, configured to acquire the current distance detected by the distance sensor;

[0035] A determination module is configured to determine whether the electronic device has been disassembled based on the current distance.

[0036] According to a fourth aspect of this disclosure, an electronic device is provided, the electronic device comprising a mid-frame, a back shell, and an anti-tamper detection structure as described above, wherein the mid-frame is connected to the back shell, and the anti-tamper detection structure is disposed between the mid-frame and the back shell; or,

[0037] processor;

[0038] Memory used to store the processor's executable instructions;

[0039] The processor is configured to perform the tamper detection method described above.

[0040] According to a fifth aspect of this disclosure, a non-transitory computer-readable storage medium is provided, which, when instructions in the storage medium are executed by a processor of a terminal, enables the terminal to perform the tamper detection method as described above.

[0041] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0042] The tamper detection structure includes a tamper-proof component, a distance sensor, and a processor. The tamper-proof component is positioned between the electronic device's mid-frame and back cover. The distance sensor detects the distance between itself and the tamper-proof component or back cover, allowing the processor to determine whether the electronic device has been tampered with. Because the object detected by the distance sensor differs before and after the tamper-proof component detaches, the detected distance reflects the presence of the tamper-proof component, thus determining whether the electronic device has been tampered with. Using only the tamper-proof component and distance sensor to detect tampering avoids the need for a series of complex circuits, thereby reducing the complexity of the electronic device's structure. Furthermore, since only the distance sensor requires additional power, eliminating the need to power a series of circuits, the power consumption of the electronic device is reduced.

[0043] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0044] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0045] Figure 1-1 This is a schematic diagram of an anti-tamper detection structure;

[0046] Figure 1-2 This is a schematic diagram of an anti-tamper detection circuit;

[0047] Figure 2 This is a schematic diagram of an anti-tamper detection structure provided in an exemplary embodiment of the present disclosure;

[0048] Figure 3 This is a schematic diagram of an anti-tamper detection structure provided in another exemplary embodiment of this disclosure;

[0049] Figure 4 This is a schematic diagram of an anti-tamper detection structure provided in another exemplary embodiment of this disclosure;

[0050] Figure 5 This is a flowchart illustrating an exemplary embodiment of the tamper detection method provided in this disclosure;

[0051] Figure 6 This is a flowchart illustrating an anti-tamper detection method provided in another exemplary embodiment of this disclosure;

[0052] Figure 7 This is a block diagram of an tamper detection device provided in an exemplary embodiment of this disclosure;

[0053] Figure 8 This is a block diagram of an electronic device provided in an exemplary embodiment of the present disclosure.

[0054] In the picture:

[0055] 1-Anti-tamper detection circuit; 2-Backup power circuit; 3-Processing unit; 4-Storage circuit; 5-Clock circuit; 6-Communication circuit; 7-Differential inductive switch; 8-First optocoupler; 9-Second optocoupler; 10-Middle frame; 20-Back shell; 30-Anti-tamper component; 31-Release paper; 40-Proximity sensor; 41-Infrared transmitter; 42-Infrared receiver; 43-Control module; 50-Processor; 60-Adhesive layer; 70-Rear camera; 100-Acquisition module; 200-Confirmation module; 400-Electronic device; 402-Processing component; 404-Memory; 406-Power supply component; 408-Multimedia component; 410-Audio component; 412-Input / output interface; 414-Transmission... Sensor assembly; 416 - Communication assembly; 420 - Processor; m - Metal patch; L1 - First inductor; L2 - Second inductor; R1 - First resistor; R2 - Second resistor; Rp - Adjustable resistor; C1 - First capacitor; C2 - Second capacitor; Q - Transistor; K - Controllable switch; D - Diode; Lcom - Inductor common terminal; Lsense - Inductor sensing terminal; Lref - Inductor reference terminal; VCC - Power supply terminal; EN - Enable terminal; OUT - Output terminal; GND - Common terminal; ADJ - Adjustable terminal; IN1 - Anode; IN2 - Cathode; OUT1 - Collector; OUT2 - Emitter; IO - Input terminal; PGND - Ground terminal; Vbat - Power supply voltage; Vtar - Target level. Detailed Implementation

[0056] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with some aspects of the invention as detailed in the appended claims. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0057] Electronic devices may be maliciously disassembled after leaving the factory for modification or research purposes, eventually reaching the user. Alternatively, users may attempt to repair malfunctioning electronic devices by disassembling them. Because electrical components may be replaced or improperly connected, users may face dangers such as explosions or privacy breaches during use, necessitating tamper-proof testing of electronic devices.

[0058] In related technologies, an anti-tamper detection structure is provided, such as Figure 1-1 and Figure 1-2As shown, the tamper detection structure includes a tamper detection circuit 1, a backup power circuit 2, and a processing unit 3. The backup power circuit 2 is electrically connected to both the tamper detection circuit 1 and the processing unit 3, providing power to them. The tamper detection circuit 1 is electrically connected to the processing unit 3, detecting whether the back cover of the electronic device has been removed and outputting a corresponding voltage level to the processing unit 3. The processing unit 3 determines whether the electronic device has been removed based on the voltage level output by the tamper detection circuit 1 and controls the electronic device to continue or stop operating. For example, it can control the operation or shutdown of the electronic device's storage circuit 4, clock circuit 5, and communication circuit 6. The tamper detection circuit 1 includes a metal patch m disposed on the back cover, a differential inductive switch 7, a first optocoupler 8, a second optocoupler 9, a first inductor L1, a second inductor L2, a first resistor R1, a second resistor R2, an adjustable resistor Rp, a first capacitor C1, a second capacitor C2, a transistor Q, a controllable switch K, and a diode D. The first terminal of the first capacitor C1 is electrically connected to the ground terminal PGND, and the second terminal is electrically connected to the first terminals of the first inductor L1, the second inductor L2, and the common inductor terminal Lcom of the differential inductive switch 7. The second terminal of the first inductor L1 is electrically connected to the inductance sensing terminal Lsense of the differential inductive switch 7, and is used to sense the distance between itself and the metal patch m. The second terminal of the second inductor L2 is electrically connected to the inductance reference terminal Lref of the differential inductive switch 7. The first fixed terminal of the adjustable resistor Rp is used to receive the supply voltage Vbat output by the backup power circuit 2, and the second fixed terminal is electrically connected to the adjustable terminal ADJ of the differential inductive switch 7. The first terminal of the second capacitor C2 is electrically connected to the power supply terminal VCC and the enable terminal EN of the differential inductive switch 7, and is used to receive the supply voltage Vbat. The second terminal is electrically connected to the common terminal GND and the ground terminal PGND of the differential inductive switch 7. The collector of transistor Q is electrically connected to the first end of the first resistor R1, the base is electrically connected to the output terminal OUT of the differential inductive switch 7, and the emitter is electrically connected to the anode IN1 of the first optocoupler 8. The second end of the first resistor R1 is used to receive the supply voltage Vbat. The cathode IN2 of the first optocoupler 8 is electrically connected to the anode IN1 of the second optocoupler 9, the collector OUT1 is electrically connected to the anode of diode D and the first end of the coil of the controllable switch K, and the emitter OUT2 is used to be electrically connected to the ground terminal PGND. The cathode of diode D and the second end of the coil of the controllable switch K are both used to receive the supply voltage Vbat. The cathode IN2 of the second optocoupler 9 is used to be electrically connected to the ground terminal PGND, the collector OUT1 is electrically connected to the first end of the second resistor R2, and the emitter OUT2 is used to be electrically connected to the ground terminal PGND. The second end of the second resistor R2 is used to receive the supply voltage Vbat. The first contact of the controllable switch K is electrically connected to the input terminal IO of the processing unit 3, and the second contact is used to receive the target level Vtar output by the backup power circuit 2.When the back cover is not removed, the inductance of the first inductor L1 is the first inductance value, and the output terminal OUT of the differential inductive switch 7 outputs a low level, causing the transistor Q to turn off. Since the transistor Q is off, the coil of the controllable switch K is not energized, and the first and second contacts are disconnected, causing the input terminal IO of the processing unit 3 to be in a floating state. When the back cover is removed, the inductance of the first inductor L1 is the second inductance value, and the output terminal OUT of the differential inductive switch 7 outputs a high level, causing the transistor Q to turn on. Since the transistor Q is on, the coil of the controllable switch K is energized, and the first and second contacts are connected, causing the input terminal IO of the processing unit 3 to reach the target level Vtar. By making the output level to the processing unit 3 different through the tamper detection circuit 1, it is possible to determine whether the back cover has been detached from the electronic device, thus detecting whether the electronic device has been disassembled. However, since an additional tamper detection circuit 1 and a backup power circuit 2 need to be set in the electronic device, and the tamper detection circuit 1 and the backup power circuit 2 contain a large number of electrical components, the structure of the electronic device becomes complex. Meanwhile, since the anti-tamper detection circuit 1 and the backup power circuit 2 need to be powered, the anti-tamper detection circuit 1 and the backup power circuit 2 consume additional power, resulting in increased power consumption of the electronic device.

[0059] Based on this, this disclosure provides an anti-tamper detection structure that determines whether an electronic device has been disassembled by using a distance sensor to detect the distance and whether the anti-tamper component has fallen off. This eliminates the need for additional anti-tamper detection circuits and backup power circuits, thus reducing the complexity of the electronic device's structure. Furthermore, since there is no need to supply power to the anti-tamper detection circuit and backup power circuit, power consumption is reduced, thereby lowering the power consumption of the electronic device.

[0060] An exemplary embodiment of this disclosure provides an anti-tamper detection structure applied to electronic devices, such as... Figure 2 As shown, the electronic device includes a mid-frame 10 and a back cover 20, with the mid-frame 10 connected to the back cover 20. The tamper detection structure includes a tamper-proof component 30, a distance sensor 40, and a processor 50. The tamper-proof component 30 is disposed between the mid-frame 10 and the back cover 20, and is used to detach the back cover 20 when it is removed from the mid-frame 10. The distance sensor 40 is disposed between the mid-frame 10 and the tamper-proof component 30, opposite to the tamper-proof component 30, and is used to detect the distance between itself and either the tamper-proof component 30 or the back cover 20. The processor 50 is disposed between the mid-frame 10 and the back cover 20, and is electrically connected to the distance sensor 40, and is used to determine whether the electronic device has been tampered with based on the distance detected by the distance sensor 40.

[0061] In this embodiment, the tamper detection structure includes a tamper-proof component, a distance sensor, and a processor. The tamper-proof component is disposed between the mid-frame and back cover of the electronic device. The distance sensor detects the distance between itself and the tamper-proof component or the back cover, allowing the processor to determine whether the electronic device has been disassembled. Since the object detected by the distance sensor differs before and after the tamper-proof component detaches, the detected distance reflects the presence of the tamper-proof component, thus determining whether the electronic device has been disassembled. Detecting disassembly using only the tamper-proof component and the distance sensor avoids the need for a series of complex circuits, thereby reducing the complexity of the electronic device's structure. Furthermore, since only the distance sensor requires additional power, eliminating the need to power a series of circuits, the power consumption of the electronic device is reduced.

[0062] For example, when the back cover 20 is not removed from the mid-frame 10, the tamper-evident piece 30 is not detached, and the distance detected by the distance sensor 40 is the distance between it and the tamper-evident piece 30. When the back cover 20 is removed from the mid-frame 10, the tamper-evident piece 30 is detached, and the distance detected by the distance sensor 40 is the distance between it and the back cover 20.

[0063] For example, processor 50 can be a processor of an electronic device or a separate processor.

[0064] In one embodiment, such as Figure 3 As shown, the middle frame 10 and the back shell 20 are connected by an adhesive layer 60, and the anti-tampering component 30 is connected to the adhesive layer 60.

[0065] In this embodiment, the tamper-proof component only needs to detach when the back cover is removed from the mid-frame, and the adhesive layer needs to be removed when the back cover is removed from the mid-frame to connect the tamper-proof component to the adhesive layer. By connecting the tamper-proof component to the adhesive layer, the tamper-proof component can detach as the adhesive layer is removed to identify the disassembly of the electronic device, thereby improving the reliability of the tamper-proof detection structure.

[0066] For example, the adhesive layer 60 may include an adhesive material such as foam adhesive for bonding.

[0067] In one embodiment, the tamper-evident component 30 is disposed on the side of the back cover 20 facing the middle frame 10.

[0068] In this embodiment, by setting the anti-tampering component on the back shell, the anti-tampering component can be produced integrally with the back shell, thereby reducing the complexity of setting up the anti-tampering detection structure.

[0069] In one embodiment, the tamper-evident component 30 is held between the middle frame 10 and the back shell 20.

[0070] In this embodiment, by clamping the anti-tamper component with the middle frame and the back shell, the anti-tamper component will inevitably fall off when the back shell is removed from the middle frame, thus avoiding the inability to detect that the electronic device has been disassembled, thereby improving the reliability of the anti-tamper detection structure.

[0071] In one embodiment, the electronic device further includes a circuit board. The circuit board is disposed on the side of the mid-frame 10 facing the back cover 20, and both the distance sensor 40 and the processor 50 are disposed on the circuit board.

[0072] In this embodiment, if the distance sensor and processor are directly mounted on the mid-frame, they are prone to detachment and difficult to connect. By mounting the distance sensor and processor on the circuit board of the mid-frame, detachment can be prevented, thereby improving the reliability of the tamper-proof detection structure.

[0073] For example, the circuit board can be the motherboard of an electronic device. The middle frame 10 includes a support and a frame. The circuit board is disposed on the support.

[0074] In one embodiment, such as Figure 3 and Figure 4 As shown, the electronic device also includes a rear camera 70. The tamper protection device 30 and the proximity sensor 40 are located on the side away from the rear camera 70.

[0075] In this embodiment, by placing the tamper-proof component and the distance sensor on the side away from the rear camera, the rear camera is prevented from interfering with the distance sensor's distance detection, thereby improving the reliability of the tamper-proof detection structure.

[0076] In one embodiment, the tamper-evident component 30 includes an tamper-evident sticker.

[0077] In this embodiment, by using tamper-evident stickers as tamper-evident components, the back cover can be easily removed from the middle frame, and the cost of tamper-evident stickers is low, thereby improving the reliability of the tamper-evident detection structure and reducing its cost.

[0078] For example, tamper-evident stickers may include release paper, easy-tear stickers, etc.

[0079] In one embodiment, the distance sensor 40 includes an infrared distance sensor.

[0080] In this embodiment, since infrared distance sensors are low in cost and have a certain detection accuracy at close range, the cost of the anti-tamper detection structure is reduced by using infrared distance sensors for anti-tamper detection.

[0081] Exemplarily, the infrared distance sensor includes an infrared transmitter, an infrared receiver, and a control module. The infrared transmitter and receiver are electrically connected to the control module. The control module is electrically connected to the processor 50. When the infrared distance sensor needs to detect distance, the processor 50 controls the infrared transmitter to emit an infrared signal via the control module. The infrared receiver receives the reflected infrared signal. The control module determines the distance to the back cover 20 or the tamper-evident component 30 based on the timing of the infrared signal transmission and reception, and sends the distance information to the processor 50.

[0082] In one embodiment, the distance sensor 40 includes an ultrasonic distance sensor.

[0083] In this embodiment, since ultrasonic distance sensors are moderately priced and have high detection accuracy, using ultrasonic distance sensors for tamper detection improves the reliability of the tamper detection structure and reduces its cost.

[0084] In one embodiment, the distance sensor 40 includes a laser distance sensor.

[0085] In this embodiment, since the laser distance sensor has the highest detection accuracy, the reliability of the anti-tamper detection structure is improved by using the laser distance sensor for anti-tamper detection.

[0086] An exemplary embodiment of this disclosure provides an anti-tamper detection structure applied to an electronic device. The anti-tamper detection structure includes a release liner 31, an infrared transmitter 41, an infrared receiver 42, a control module 43, a processor 50, and adhesive foam. The mid-frame 10 and back cover 20 of the electronic device are connected by adhesive foam. The release liner 31 is connected to the adhesive foam and is located between the mid-frame 10 and the back cover 20 on the side away from the rear camera 70. The infrared transmitter 41 and infrared receiver 42 are disposed opposite to the release liner 31 and are electrically connected to the control module 43. The control module 43 is electrically connected to the processor 50. When anti-tamper detection is required, the processor 50 controls the infrared transmitter 41 to emit infrared signals through the control module 43. The infrared receiver 42 receives the reflected infrared signals. The control module 43 determines the distance to the release liner 31 or the back cover 20 based on the transmission and reception time of the infrared signals and transmits the detected distance to the processor 50. The processor 50 determines whether the electronic device has been disassembled based on the distance transmitted by the control module 43. The disassembly of the electronic device is detected by using an infrared transmitter 41, an infrared receiver 42, a control module 43, and a release paper 31, avoiding the need for a series of complex circuits and thus reducing the complexity of the electronic device's structure. Furthermore, since only the infrared transmitter 41, infrared receiver 42, and control module 43 require additional power, eliminating the need to power a series of circuits, the power consumption of the electronic device is reduced.

[0087] In one exemplary embodiment, an electronic device is provided, the electronic device including a mid-frame, a back shell, and an anti-tamper detection structure as described above, the mid-frame being connected to the back shell, and the anti-tamper detection structure being disposed between the mid-frame and the back shell.

[0088] An exemplary embodiment of this disclosure provides an anti-tamper detection method, applied to the anti-tamper detection structure described above, such as... Figure 5 As shown, the tamper detection methods include:

[0089] S100: Obtain the current distance detected by the distance sensor.

[0090] S200. Determine whether the electronic device has been disassembled based on the current distance.

[0091] In this embodiment, the current distance detected by the distance sensor is obtained to reflect whether the tamper-proof component has been detached. Since the current distance differs when the tamper-proof component is detached and not detached, the current distance is used to determine whether the electronic device has been disassembled. Determining whether the electronic device has been disassembled by using the current distance detected by the distance sensor avoids using a series of circuits for tamper detection, thereby reducing the complexity of tamper detection.

[0092] In one embodiment, determining whether the electronic device has been disassembled based on the current distance in step S200 can be done in the following way:

[0093] Determine the distance difference between the current distance and the historical distance.

[0094] If the distance difference is greater than or equal to a preset threshold, it is determined that the electronic device has been disassembled.

[0095] If the distance difference is less than a preset threshold, it is determined that the electronic device has not been disassembled.

[0096] In this embodiment, since the distance sensor has a certain error in detecting the current distance, determining whether the electronic device has been disassembled solely by comparing the current distance with historical distances may lead to false detections. Therefore, the difference between the current and historical distances is determined to identify whether the electronic device has been disassembled. If the distance difference is greater than or equal to a preset threshold, a larger difference between the current and historical distances indicates that the back cover has been removed, thus confirming that the electronic device has been disassembled. If the distance difference is less than the preset threshold, a smaller difference indicates that the back cover has not been removed, thus confirming that the electronic device has not been disassembled. Determining whether the electronic device has been disassembled by using the distance difference between the current and historical distances avoids false detections due to distance sensor errors, thereby improving the reliability of tamper detection.

[0097] For example, the preset threshold value is related to the position of the tamper-evident component. The preset threshold value can range from 0.5mm to 2mm. The preset threshold value can be 0.8mm, 1mm, 1.2mm, etc.

[0098] For example, the historical distance can be the current distance from the previous detection. The step of determining whether the electronic device has been disassembled by means of distance difference described above can be used only when it is determined in the historical time that the electronic device has not been disassembled, and not used when it is determined in the historical time that the electronic device has been disassembled.

[0099] In one embodiment, determining whether the electronic device has been disassembled based on the current distance in step S200 can also be done in the following way:

[0100] If the current distance is greater than or equal to the preset distance, it is determined that the electronic device has been disassembled.

[0101] If the current distance is less than the preset distance, it is determined that the electronic device has not been disassembled.

[0102] In this embodiment, when the current distance is greater than or equal to a preset distance, a greater current distance indicates that the tamper-proof component has detached, confirming that the electronic device has been disassembled. When the current distance is less than the preset distance, a smaller current distance indicates that the tamper-proof component has not detached, confirming that the electronic device has not been disassembled. By comparing the current distance with the preset distance to determine whether the electronic device has been disassembled, false detections due to the influence of historical time and distance are avoided, thereby improving the reliability of tamper detection.

[0103] For example, the value of the preset distance is related to the position of the tamper-evident component and can be set according to the position of the tamper-evident component.

[0104] For example, the step of determining whether an electronic device has been disassembled by using the current distance and a preset distance can be used when it is determined in historical time that the electronic device has not been disassembled, or when it is determined in historical time that the electronic device has been disassembled.

[0105] In one embodiment, before acquiring the current distance detected by the distance sensor in step S100, the tamper detection method further includes:

[0106] Turn on the distance sensor.

[0107] After determining whether the electronic device has been disassembled based on the current distance in step S200, the tamper detection method further includes:

[0108] Turn off the distance sensor.

[0109] In this embodiment, the distance sensor is activated to detect distance before acquiring the current distance detected by the distance sensor. Once it is determined whether the electronic device has been disassembled, the distance sensor is deactivated to avoid redundant detection. By deactivating the distance sensor after tamper detection, additional power consumption from the distance sensor is avoided, thereby reducing the power consumption of the electronic device.

[0110] In one embodiment, the activation of the distance sensor in the above steps can be determined in the following way:

[0111] The distance sensor is activated when the electronic device changes from being powered off to being powered on.

[0112] In this embodiment, the electronic device needs to be powered off when it is disassembled. When the electronic device is switched from powered off to powered on, it may be disassembled, activating the distance sensor. By activating the distance sensor after switching from powered off to powered on, the continuous operation of the distance sensor and the resulting additional power consumption are avoided, thereby reducing the power consumption of the electronic device.

[0113] In one embodiment, the activation of the distance sensor in the above steps can also be determined in the following way:

[0114] When the electronic device enters maintenance mode, activate the distance sensor.

[0115] In this embodiment, since maintenance personnel need to determine whether the electronic device has been disassembled during repair to determine the appropriate repair strategy, a distance sensor is activated when the electronic device enters maintenance mode to detect whether the device has been disassembled. By activating the distance sensor in maintenance mode, the additional power consumption generated by the distance sensor during user operation of the electronic device is avoided, thereby reducing the power consumption of the electronic device.

[0116] In one embodiment, the activation of the distance sensor in the above steps can also be determined in the following way:

[0117] In response to the operation of enabling the tamper detection function, the distance sensor is activated.

[0118] In this embodiment, since users or maintenance personnel may need to inspect the electronic device to determine whether it has been disassembled, the distance sensor is activated in response to the user's or maintenance personnel's activation of the tamper detection function to detect whether the electronic device has been disassembled. By activating the distance sensor in response to the activation of the tamper detection function, the reliability of the tamper detection can be improved by detecting whether the electronic device has been disassembled at any time.

[0119] After determining whether the electronic device has been disassembled based on the current distance in step S200, the tamper detection method further includes:

[0120] If the electronic device has been disassembled, a notification message will be issued indicating that the electronic device has been disassembled.

[0121] In this embodiment, by issuing a prompt message when the electronic device is disassembled, it is convenient to remind the electronic device whether it has been disassembled, thereby improving the reliability of anti-tamper detection.

[0122] An exemplary embodiment of this disclosure provides an anti-tamper detection method, applied to the anti-tamper detection structure described above, such as... Figure 6 As shown, the tamper detection methods include:

[0123] S300: When the electronic device changes from a powered-off state to a powered-on state, the distance sensor is activated.

[0124] S310, Obtain the current distance detected by the distance sensor.

[0125] S320. Determine the distance difference between the current distance and the historical distance.

[0126] S330. If the distance difference is greater than or equal to a preset threshold, determine that the electronic device has been disassembled.

[0127] S340: Issue a notification message that the electronic device has been disassembled, and proceed to step S360.

[0128] S350. If the distance difference is less than a preset threshold, determine that the electronic device has not been disassembled.

[0129] S360, Distance sensor off.

[0130] In this embodiment, when the electronic device changes from a powered-off state to a powered-on state, the electronic device may have been disassembled, activating the distance sensor. The current distance detected by the distance sensor is acquired, and the distance difference between the current distance and the historical distance is determined for comparison. If the distance difference is greater than or equal to a preset threshold, the change in current distance compared to historical distance is large, reflecting the tamper-proof component detachment, indicating that the electronic device has been disassembled, and a prompt message is issued indicating that the electronic device has been disassembled. If the distance difference is less than the preset threshold, the change in current distance compared to historical distance is small, reflecting that the tamper-proof component has not detached, indicating that the electronic device has not been disassembled. After determining whether the electronic device has been disassembled, the distance sensor is turned off to avoid additional power consumption from the distance sensor. Determining whether the electronic device has been disassembled by using the current distance detected by the distance sensor avoids the need for a series of circuits for tamper detection of the electronic device, thereby reducing the complexity of tamper detection.

[0131] In one exemplary embodiment, a tamper detection device is provided for implementing the method described above. (Reference) Figure 7 As shown, the tamper detection device may include an acquisition module 100 and a determination module 200, wherein, during the implementation of the above method,

[0132] The acquisition module 100 is configured to acquire the current distance detected by the distance sensor.

[0133] The determination module 200 is configured to determine whether an electronic device has been disassembled based on the current distance.

[0134] In one exemplary embodiment, an tamper detection device is provided, wherein a determining module 200 is configured to:

[0135] Determine the distance difference between the current distance and the historical distance.

[0136] If the distance difference is greater than or equal to a preset threshold, it is determined that the electronic device has been disassembled.

[0137] If the distance difference is less than a preset threshold, it is determined that the electronic device has not been disassembled.

[0138] In one exemplary embodiment, an tamper detection device is provided, wherein a determining module 200 is configured to:

[0139] If the current distance is greater than or equal to the preset distance, it is determined that the electronic device has been disassembled.

[0140] If the current distance is less than the preset distance, it is determined that the electronic device has not been disassembled.

[0141] In one exemplary embodiment, an anti-tamper detection device is provided, the device further comprising:

[0142] The activation module is configured to activate the distance sensor.

[0143] The shutdown module is configured to turn off the distance sensor.

[0144] In one exemplary embodiment, an anti-tamper detection device is provided, wherein the opening module is configured to:

[0145] The distance sensor is activated when the electronic device changes from being powered off to being powered on.

[0146] In one exemplary embodiment, an anti-tamper detection device is provided, wherein the opening module is configured to:

[0147] When the electronic device enters maintenance mode, activate the distance sensor.

[0148] In one exemplary embodiment, an anti-tamper detection device is provided, wherein the opening module is configured to:

[0149] In response to the operation of enabling the tamper detection function, the distance sensor is activated.

[0150] In one exemplary embodiment, an anti-tamper detection device is provided, the device further comprising:

[0151] The notification module is configured to issue a notification message indicating that the electronic device has been disassembled.

[0152] In one exemplary embodiment, an electronic device is provided, such as a mobile phone, a laptop computer, a tablet computer, and a wearable device.

[0153] refer to Figure 8 As shown, the electronic device 400 may include one or more of the following components: processing component 402, memory 404, power supply component 406, multimedia component 408, audio component 410, input / output (I / O) interface 412, sensor component 414, and communication component 416.

[0154] Processing component 402 typically controls the overall operation of electronic device 400, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 402 may include one or more processors 420 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 402 may include one or more modules to facilitate interaction between processing component 402 and other components. For example, processing component 402 may include a multimedia module to facilitate interaction between multimedia component 408 and processing component 402.

[0155] Memory 404 is configured to store various types of data to support the operation of electronic device 400. Examples of this data include instructions for any application or method operating on electronic device 400, contact data, phonebook data, messages, pictures, videos, etc. Memory 404 can be implemented by any type of volatile or non-volatile storage terminal or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0156] Power supply component 406 provides power to various components of electronic device 400. Power supply component 406 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 400.

[0157] Multimedia component 408 includes a screen that provides an output interface between electronic device 400 and user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 408 includes a front-facing camera module and / or a rear-facing camera module. When electronic device 400 is in an operating mode, such as shooting mode or video mode, the front-facing camera module and / or rear-facing camera module may receive external multimedia data. Each front-facing camera module and rear-facing camera module may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0158] Audio component 410 is configured to output and / or input audio signals. For example, audio component 410 includes a microphone (MIC) configured to receive external audio signals when electronic device 400 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 404 or transmitted via communication component 416. In some embodiments, audio component 410 also includes a speaker for outputting audio signals.

[0159] I / O interface 412 provides an interface between processing component 402 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0160] Sensor assembly 414 includes one or more sensors for providing state assessments of various aspects of electronic device 400. For example, sensor assembly 414 may detect the on / off state of electronic device 400, the relative positioning of components such as the display and keypad of electronic device 400, changes in position of electronic device 400 or a component of electronic device 400, the presence or absence of user contact with electronic device 400, orientation or acceleration / deceleration of electronic device 400, and temperature changes of electronic device 400. Sensor assembly 414 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 414 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 414 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor.

[0161] Communication component 416 is configured to facilitate wired or wireless communication between electronic device 400 and other terminals. Electronic device 400 can access wireless networks based on communication standards, such as WiFi, 2G, 3G, 4G, 5G, or combinations thereof. In one exemplary embodiment, communication component 416 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 416 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0162] In an exemplary embodiment, the electronic device 400 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing terminals (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0163] In one exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 404 including instructions, which can be executed by a processor 420 of an electronic device 400 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage terminal, etc. When the instructions in the storage medium are executed by the processor of the terminal, the terminal is able to perform the method shown in the above embodiments.

[0164] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0165] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0166] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0167] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A tamper-proof detection structure, applied to electronic devices, characterized in that, The electronic device includes a mid-frame and a back cover, the mid-frame being connected to the back cover; the tamper-proof detection structure includes: An anti-disassembly component is provided between the middle frame and the back shell, and the anti-disassembly component is used to detach the back shell when it is removed from the middle frame; A distance sensor is disposed between the middle frame and the tamper protection component, and the distance sensor is used to detect the distance between itself and the tamper protection component or the back cover; A processor is disposed between the mid-frame and the back cover, and is electrically connected to the distance sensor. The processor is used to determine whether the electronic device has been disassembled based on the distance detected by the distance sensor.

2. The tamper-proof detection structure according to claim 1, characterized in that, The middle frame and the back shell are connected by an adhesive layer, and the anti-tamper component is connected to the adhesive layer; or, The tamper-evident component is located on the side of the back cover facing the middle frame; or, The anti-disassembly component is held by the middle frame and the back shell.

3. The tamper-proof detection structure according to claim 1, characterized in that, The electronic device also includes a circuit board disposed on the side of the middle frame facing the back shell, and the distance sensor and the processor are both disposed on the circuit board.

4. The tamper-proof detection structure according to claim 1, characterized in that, The electronic device also includes a rear camera, and the tamper protection and the distance sensor are located on the side away from the rear camera.

5. The tamper-proof detection structure according to any one of claims 1 to 4, characterized in that, The distance sensor includes an infrared distance sensor, an ultrasonic distance sensor, or a laser distance sensor; and / or, the tamper-evident component includes an tamper-evident sticker.

6. A tamper-proof detection method, applied to the tamper-proof detection structure as described in any one of claims 1 to 5, characterized in that, The tamper detection method includes: Obtain the current distance detected by the distance sensor; Based on the current distance, determine whether the electronic device has been disassembled.

7. The tamper detection method according to claim 6, characterized in that, The step of determining whether the electronic device has been disassembled based on the current distance includes: Determine the distance difference between the current distance and the historical distance; If the distance difference is greater than or equal to a preset threshold, it is determined that the electronic device has been disassembled; If the distance difference is less than the preset threshold, it is determined that the electronic device has not been disassembled; or, If the current distance is greater than or equal to a preset distance, it is determined that the electronic device has been disassembled; If the current distance is less than the preset distance, it is determined that the electronic device has not been disassembled.

8. The tamper detection method according to claim 6, characterized in that, Before acquiring the current distance detected by the distance sensor, the tamper detection method further includes: Turn on the distance sensor; After determining whether the electronic device has been disassembled based on the current distance, the tamper detection method further includes: The distance sensor is turned off.

9. The tamper-proof detection method according to claim 8, characterized in that, Activating the distance sensor includes: When the electronic device changes from a powered-off state to a powered-on state, the distance sensor is activated; or, When the electronic device enters maintenance mode, the distance sensor is activated; or, In response to the operation of activating the tamper detection function, the distance sensor is activated.

10. The tamper detection method according to any one of claims 6 to 9, characterized in that, After determining whether the electronic device has been disassembled based on the current distance, the tamper detection method further includes: If the electronic device is disassembled, a notification message indicating that the electronic device has been disassembled will be issued.

11. A tamper detection device, applied to the tamper detection structure as described in any one of claims 1 to 5, characterized in that, The tamper detection device includes: An acquisition module, configured to acquire the current distance detected by the distance sensor; A determination module is configured to determine whether the electronic device has been disassembled based on the current distance.

12. An electronic device, characterized in that, The electronic device includes a mid-frame, a back shell, and an anti-tamper detection structure as described in any one of claims 1 to 5, wherein the mid-frame is connected to the back shell, and the anti-tamper detection structure is disposed between the mid-frame and the back shell; or, processor; Memory used to store the processor's executable instructions; The processor is configured to perform the tamper detection method as described in any one of claims 6 to 10.

13. A non-transitory computer-readable storage medium, characterized in that, When the instructions in the storage medium are executed by the processor of the terminal, the terminal is able to perform the tamper detection method as described in any one of claims 6 to 10.

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