Testing device and temperature control method for vehicle-mounted storage device
By separately monitoring the temperature of the device under test and the temperature control board, and using a method of high-temperature active heating and low-temperature passive cooling, the problem of easy damage to memory chip testing devices is solved, and efficient and reliable temperature control and accurate test results are achieved.
Patent Information
- Application Number
- CN202610546400.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-04-23
- Publication Date
- 2026-05-26
- Estimated Expiration
- 2046-04-23
AI Technical Summary
In existing technologies, the testing equipment for memory chips is easily damaged during high and low temperature testing, and it is difficult to distinguish between SoC and DUT issues, resulting in high testing costs and inaccurate results.
Design a test device for vehicle-mounted storage devices. Use separate temperature sensors to monitor the temperature of the device under test and the temperature control board to achieve active heating at high temperatures and passive cooling at low temperatures. Prevent damage to the temperature control board through PID control and safety protection logic.
It enables precise wide-temperature testing of the device under test, avoids the failure of the temperature control board at ultra-low temperatures, improves the reliability and consistency of the test, and reduces the test cost.