A high-precision automatic wire bonding device for semiconductor chips

Abstract

This invention relates to the field of semiconductor chip manufacturing equipment, and discloses a high-precision automated wire bonding device for semiconductor chips. The device includes a frame, and integrated components on the frame: a wire cutting assembly, a transfer assembly, a wire bonding assembly, a fixing assembly, a fume extraction assembly, and a conveyor belt. The frame serves as the supporting carrier for the entire device. The wire cutting assembly is installed on the top front side of the frame and is used for conveying and cutting the metal wire for bonding to a fixed length. The wire bonding assembly is installed on the top rear side of the frame and is used for performing wire bonding operations on the semiconductor chips. The transfer assembly is installed on the top side of the frame and is used to transfer the cut metal wire to the working area of ​​the wire bonding assembly. Through the coordinated operation of these components, a fully automated high-precision wire bonding system is constructed. The overall device significantly reduces manual intervention, substantially improves the automation level, production efficiency, and welding accuracy of wire bonding, reduces the defect rate, and adapts to the needs of large-scale, high-precision semiconductor chip production.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip manufacturing equipment, specifically a high-precision automatic wire bonding device for semiconductor chips. Background Technology

[0002] In the semiconductor chip manufacturing industry, wire bonding is a core process connecting the internal circuitry of a chip to its external pins. The precision of this bonding directly determines the chip's signal transmission efficiency, power supply stability, and product lifespan. Automated wire bonding equipment is a crucial foundational piece of equipment supporting large-scale, high-precision chip production. With the continuous increase in demands for chip integration and performance density from consumer electronics, new energy, and artificial intelligence sectors, the market is placing increasingly stringent requirements on the automation level, positioning accuracy, operational continuity, and environmental friendliness of the wire bonding process.

[0003] In the existing technology, semiconductor chip wire bonding equipment has initially realized the automation of basic functions such as metal wire conveying, chip fixing, and wire bonding execution. Some equipment completes the supply and fixed-length cutting of metal wire by setting up independent traction and cutting mechanisms, and uses a cylinder-driven clamping structure or vacuum adsorption structure to fix the chip. Then, a single-axis or dual-axis linear module drives the welding gun to complete the wire bonding operation at the designated position. However, existing equipment still faces several technical bottlenecks in practical applications: First, the traction and cutting of metal wires often employ a step-by-step drive mode, resulting in poor coordination between traction speed and cutting timing, which easily leads to deviations in metal wire length. Furthermore, the cut metal wires lack precise guiding and positioning structures during transport to the wire bonding station, making them prone to offset and bending. Additionally, the chip fixing mechanisms are mostly single-sided drive or single clamping methods, resulting in insufficient positioning stability. Even slight chip displacement during wire bonding can cause wire bonding deviations, severely affecting welding accuracy. Second, post-weld inspection, sorting, and transport functions rely heavily on independent drive units and control modules, lacking coordinated design between modules. This not only leads to a complex overall equipment structure, large footprint, and high manufacturing costs but also easily causes delays in process connections, affecting the continuity of production rhythm. Third, dust treatment systems typically use independent fans as drive sources, making it difficult to precisely match the airflow adjustment with the wire bonding operation rhythm. This results in unstable dust absorption efficiency, and the independent drive unit increases equipment energy consumption. Moreover, the vibration generated by the fan operation may indirectly affect the wire bonding positioning accuracy, making it impossible to balance dust removal effectiveness with equipment operational stability. The existence of these problems has hindered the development of semiconductor chip wire bonding processes towards higher precision, higher efficiency, and lower energy consumption, making it difficult to meet the actual needs of large-scale production of high-end chips. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a high-precision automatic wire bonding device for semiconductor chips, which solves the problems mentioned in the background section.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-precision automatic wire bonding device for semiconductor chips, comprising:

[0006] Includes a frame, and wire tangent assembly, transfer assembly, wire bonding assembly, fixing assembly, smoke removal assembly and conveyor belt integrated and mounted on the frame;

[0007] The frame serves as the supporting carrier for the entire device;

[0008] The wire cutting assembly is installed on the top front side of the frame and is used to feed and cut the welding wire to a fixed length.

[0009] The wire bonding assembly is mounted on the top rear side of the rack and is used to perform wire bonding operations on semiconductor chips;

[0010] The transfer assembly is installed on one side of the top of the frame and is used to transfer the cut metal wire to the working area of ​​the wire bonding assembly, providing material preparation for the wire bonding process.

[0011] The fixing component is installed on the top rear side of the rack and is used to position and fix the semiconductor chip during the wire bonding process;

[0012] The smoke removal assembly is installed on the top right side of the frame to absorb the smoke and dust generated during wire bonding operations;

[0013] The conveyor belt is installed on the top center side of the frame and is used to transport the wires to be soldered and the semiconductor chips after soldering.

[0014] The above technical solution integrates wire cutting, transfer, wire bonding, fixing, fume extraction, and conveyor belts into a fully integrated operation system. The wire cutting component ensures a stable supply of metal wires, the transfer component enables precise transfer of wire bonding materials, the fixing component ensures stable positioning of chips during wire bonding, the wire bonding component completes high-precision multi-position wire bonding, the fume extraction component promptly removes work fumes, and the conveyor belt connects each process to achieve automatic chip flow. Each component has a clear division of labor and works in concert, significantly improving the automation level and production efficiency of wire bonding, ensuring welding accuracy, optimizing the working environment, and adapting to the needs of large-scale high-precision chip production.

[0015] Preferably, the wire cutting assembly includes a mounting frame fixedly installed on the front side of the top of the frame. A wire feeding roller and multiple conveying rollers for guiding and conveying the metal wire are rotatably mounted on the inner side of the mounting frame. A traction roller is also rotatably mounted on the mounting frame. One end of each traction roller is fixedly connected to a drive gear, and two drive gears mesh with each other. A motor is mounted on the outer side of the mounting frame, and the output end of the motor is fixedly connected to one of the drive gears. A hinge rod is rotatably connected to the outer eccentric part of the upper drive gear, and a cutter is rotatably connected to the other end of the hinge rod. Driven by the motor, the drive gear rotates, and in conjunction with the traction action of the hinge rod, the two cutters reciprocate up and down relative to each other, thereby cutting the metal wire.

[0016] Through the above technical solution, the wire cutting assembly integrates a wire feeding roller, a conveying roller, a traction roller, a drive gear, a hinge rod, and a cutter through a mounting frame. With the help of motor drive and gear meshing transmission, it can simultaneously realize the smooth guidance and conveying of metal wire, uniform speed traction, and precise cutting to a fixed length, ensuring the continuity, stability, and dimensional consistency of the supply of wire bonding raw materials, and laying the foundation for the precise implementation of subsequent wire bonding processes.

[0017] Preferably, the transfer assembly includes an electric guide rail mounted on the top of the frame, an electric slider slidably fitted on the electric guide rail, an electric turntable fixedly mounted on the top of the electric slider, a clamping cylinder for clamping metal wires mounted on the top of the electric turntable, a support frame fixedly connected to the top center of the frame, a plurality of guide cylinders for guiding metal wires detachably connected to the top of the support frame, and a placement rack for temporarily placing metal wires fixedly connected to one side of the top of the support frame, the placement rack having grooves adapted to the metal wires.

[0018] Through the above technical solution, the transfer component is driven by the electric guide rail, electric slider and electric turntable, and stably clamped by the clamping cylinder to realize the flexible transfer of the cut metal wire. Then, through the precise guidance of the guide cylinder and the positioning limit of the placement rack groove, the placement posture and position of the metal wire in the wire bonding operation area are ensured to be accurate, effectively connecting the wire cutting and wire bonding processes, and ensuring the smoothness and accuracy of the wire bonding operation.

[0019] Preferably, the wire bonding assembly includes a linear module one fixedly installed on the rear side of the top of the frame, a linear module two fixedly installed on the sliding end of the linear module one, and a welding gun installed on the sliding end of the linear module two. The driving directions of the linear module one and the linear module two are perpendicular to each other, and together drive the welding gun to move in the horizontal plane to realize multi-position wire bonding.

[0020] Through the above technical solution, the wire bonding assembly constructs an XY axis drive platform through two vertically arranged linear modules, namely Linear Module 1 and Linear Module 2, which precisely drives the welding gun to move flexibly in the horizontal plane. This can adapt to the wire bonding requirements of different pad positions of semiconductor chips, realize multi-position, high-precision wire bonding operations, and ensure the stability and reliability of chip wire bonding connections.

[0021] Preferably, the fixing assembly includes an electric telescopic rod installed on the rear side of the frame. The telescopic end of the electric telescopic rod is fixedly connected to a limit rod. A drive rack is fixedly connected to the inner side of the limit rod. A transmission shaft is rotatably connected to the top of the frame via a bearing. Drive gears are fixedly connected to both ends of the transmission shaft. One drive gear meshes with drive rack, and the other drive gear meshes with drive rack. A fixing plate for pressing the semiconductor chip is fixedly connected to the top of drive rack. The telescopic movement of the electric telescopic rod drives the limit rod to move, which in turn drives drive rack, drive gear, transmission shaft, and drive rack in sequence, ultimately driving the fixing plate to move up and down, thereby fixing and releasing the semiconductor chip.

[0022] Through the above technical solution, the fixing component drives the rack and pinion and the transmission shaft through the electric telescopic rod, which drives the fixing plate to rise and fall smoothly, so as to realize the rapid clamping and fixing and precise release of semiconductor chips. The transmission synchronization is strong and the positioning is stable, which effectively avoids the wire bonding deviation caused by chip displacement during the wire bonding process, and ensures the accuracy and stability of the wire bonding operation.

[0023] Preferably, a fixed frame is fixedly connected to the top right side of the frame, a drive motor is mounted on the outer side of the fixed frame, a synchronous pulley is fixedly connected to the output end of the drive motor, a synchronous pulley is rotatably mounted on the inner side of the fixed frame, the synchronous pulley is connected to the synchronous pulley via a synchronous belt, a drive block is fixedly connected to the outer side of the synchronous belt, a telescopic cylinder is mounted on the outer side of the drive block, an electric suction cup for gripping semiconductor chips is fixedly connected to the telescopic end of the telescopic cylinder, and a detection device for detecting chip position is fixedly connected to the outer surface of the telescopic cylinder.

[0024] The above technical solution integrates a drive motor, synchronous pulley, synchronous belt, drive block, telescopic cylinder, electric chuck, and testing equipment into a fixed frame. The synchronous belt drive enables coordinated action of testing and transfer. The testing equipment can accurately identify the chip position and the quality of the bonding wires. The electric chuck, driven by the telescopic cylinder, completes the stable gripping and classified transfer of chips. No additional independent equipment is required, which simplifies the operation process, improves the efficiency and accuracy of testing and transfer, and ensures production continuity.

[0025] Preferably, a rotating disk is fixedly connected to the side of the synchronous pulley away from the drive motor, a movable block is fixedly connected to the outer eccentric part of the rotating disk, a movable frame is rotatably installed on the outer side of the frame, a sector gear is fixedly connected to the bottom end of the movable frame, and a movable rack is meshed with the outer side of the sector gear.

[0026] Through the above technical solution, the rotating disk is driven to rotate synchronously by the synchronous wheel, the movable frame is driven to swing by the movable block, and then the rotational power is converted into the horizontal reciprocating movement of the movable rack through the meshing transmission of the sector gear and the moving rack. This realizes the linkage of multiple mechanisms from a single power source, without the need for additional drive units. This simplifies the device structure, reduces energy consumption, and can accurately provide stable transmission power for the subsequent smoke removal components, ensuring the overall coordination and efficiency of the operation.

[0027] Preferably, the smoke removal assembly includes a drive rod fixedly connected to one end of a moving rack, a fixed cylinder fixedly connected to the top of the frame, and a rubber piston fixedly connected to the end of the drive rod away from the moving rack inside the fixed cylinder. The rubber piston slides and seals against the inner wall of the fixed cylinder. The outer surface of the fixed cylinder is connected to a connecting pipe one and a connecting pipe two, respectively. The outer surface of the connecting pipe one is connected to a plurality of smoke removal pipes facing the wire bonding operation area, and one end of the connecting pipe one is connected to a collection box for collecting smoke and dust.

[0028] Through the above technical solution, the smoke removal component uses the power transmitted by the moving rack to drive the drive rod and the rubber piston to slide back and forth in a sealed manner in the fixed cylinder. With the passage design of connecting pipe one, connecting pipe two and smoke removal pipe, it can quickly capture the smoke and dust generated by the wire bonding operation and efficiently transport it to the collection box for collection. This effectively avoids smoke and dust from polluting the working environment, adhering to the chip and affecting product quality, ensuring a clear view of the wire bonding, and improving the environmental friendliness and continuity of the operation.

[0029] Preferably, both the first connecting pipe and the second connecting pipe are equipped with one-way valves, the two one-way valves have opposite conduction directions, and the cross-sectional area of ​​the fixed cylinder is larger than that of the first connecting pipe.

[0030] Through the above technical solution, the one-way valves that conduct in opposite directions within connecting pipe 1 and connecting pipe 2 can ensure unidirectional circulation of gas within the fixed cylinder, preventing backflow of airflow from affecting the adsorption effect. The design of the fixed cylinder having a larger cross-sectional area than connecting pipe 1 can significantly increase the gas flow rate within connecting pipe 1 when the rubber piston moves, quickly forming a stable negative pressure, enhancing the adsorption force of the smoke removal pipe on welding wire fumes, and thus improving the efficiency and stability of fume collection.

[0031] This invention provides a high-precision automated wire bonding device for semiconductor chips. It has the following advantages:

[0032] 1. This invention constructs a fully automated, high-precision wire bonding system through the coordinated operation of various components. The wire cutting component, relying on a drive gear and a hinged rod, simultaneously achieves the traction and precise cutting of the metal wire to a fixed length, ensuring a stable and consistent supply of raw materials. The transfer component, using an electric guide rail, an electric turntable, and a clamping cylinder, combined with the positioning guidance of a guide cylinder and a placement rack, efficiently transfers and precisely places the cut metal wire. The fixing component, by driving a fixing plate, synchronously presses the semiconductor chip, preventing chip displacement during wire bonding and ensuring positioning accuracy. The overall device significantly reduces manual intervention, substantially improves the automation level of wire bonding, production efficiency, and welding accuracy, reduces the defect rate, and is suitable for the needs of large-scale, high-precision semiconductor chip production.

[0033] 2. This invention integrates a telescopic cylinder, an electric chuck, and a detection device on the drive block outside the synchronous belt, realizing an integrated operation for the detection and classification of semiconductor chips after soldering: the detection device can accurately identify whether the chip soldering quality meets the standards. Qualified chips are picked up by the electric chuck driven by the telescopic cylinder and transferred as qualified products. Unqualified chips are moved to the preset unqualified product area by the drive block along with the synchronous belt. This can effectively simplify the operation process and reduce the space occupied by the equipment.

[0034] 3. While performing welding inspection on semiconductor chips, this invention can indirectly drive the rubber piston at one end of the drive rod to reciprocate along the inner wall of the fixed cylinder, creating periodic air pressure changes inside the fixed cylinder. Combined with Bernoulli's principle and the cooperation of the reverse one-way valves in connecting pipe one and connecting pipe two, the smoke removal pipe generates a continuous adsorption force, efficiently sucking the fumes generated during the wire welding process into the collection box for collection. There is no need to configure an additional independent drive mechanism for the smoke removal component, realizing the linkage and coordination between inspection and transportation and smoke removal operations. This not only simplifies the overall structure of the device, reduces equipment manufacturing costs and energy consumption, but also ensures timely and efficient removal of fumes, optimizing the working environment. Attached Figure Description

[0035] Figure 1 This is a perspective view of the present invention;

[0036] Figure 2 This is a schematic diagram of the frame structure of the present invention;

[0037] Figure 3 This is a schematic diagram of the wire feeding roller structure of the present invention;

[0038] Figure 4 This is a schematic diagram of the mounting bracket structure of the present invention;

[0039] Figure 5 This is a schematic diagram of the rotating disk structure of the present invention;

[0040] Figure 6 for Figure 1 Enlarged view of point A in the middle;

[0041] Figure 7 for Figure 2 Enlarged view of point B in the middle;

[0042] Figure 8 This is a schematic diagram of the fixing frame structure of the present invention;

[0043] Figure 9 This is a schematic diagram of the limiting rod structure of the present invention.

[0044] The components include: 1. Frame; 201. Mounting frame; 202. Feeding roller; 203. Conveying roller; 204. Traction roller; 205. Cutter; 206. Drive gear one; 207. Hinge rod; 301. Electric guide rail; 302. Electric slider; 303. Electric turntable; 304. Clamping cylinder; 401. Linear module one; 402. Linear module two; 403. Welding gun; 501. Fixing frame; 502. Drive motor; 503. Testing equipment; 504. Electric suction cup; 505. Drive block; 506. Synchronous pulley one. 507. Synchronous pulley II; 601. Fixed cylinder; 602. Drive rod; 603. Connecting pipe I; 604. Smoke removal pipe; 605. Connecting pipe II; 606. Collection box; 7. Support frame; 8. Guide cylinder; 901. Electric telescopic rod; 902. Drive rack I; 903. Limit rod; 904. Drive gear II; 905. Transmission shaft; 906. Drive rack II; 907. Fixed plate; 10. Placement rack; 11. Rotating disk; 12. Movable block; 13. Movable frame; 14. Sector gear; 15. Moving rack. Detailed Implementation

[0045] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] Please see the appendix Figure 1 - Appendix Figure 9 This invention provides a high-precision automatic wire bonding device for semiconductor chips, comprising:

[0047] Includes a frame 1, and a tangent assembly, a transfer assembly, a wire bonding assembly, a fixing assembly, a smoke removal assembly, and a conveyor belt integrated and mounted on the frame 1;

[0048] Frame 1 serves as the supporting carrier for the entire device;

[0049] The wire cutting assembly is installed on the top front side of the frame 1 for conveying and cutting welding metal wire to a fixed length. The wire cutting assembly includes a mounting frame 201 fixedly installed on the top front side of the frame 1. A wire feeding roller 202 and multiple conveying rollers 203 for guiding and conveying metal wire are rotatably installed on the inner side of the mounting frame 201. A traction roller 204 is also rotatably installed on the mounting frame 201. One end of each traction roller 204 is fixedly connected to a drive gear 206. The two drive gears 206 mesh with each other. A motor is installed on the outer side of the mounting frame 201. The output end of the motor is fixedly connected to one of the drive gears 206. A hinge rod 207 is rotatably connected to the outer eccentric part of the upper drive gear 206. The other end of the hinge rod 207 is rotatably connected to a cutter 205. The motor drives the drive gear 206 to rotate. With the traction of the hinge rod 207, the two cutters 205 move back and forth relative to each other to cut the metal wire.

[0050] Specifically, the motor outputs power to drive one of the drive gears 206 to rotate. Utilizing the meshing transmission characteristics of the two drive gears 206, the two traction rollers 204 rotate synchronously in opposite directions. The friction between the traction rollers 204 and the metal wire pulls the metal wire released by the wire feeding roller 202. Through the guiding and limiting action of multiple conveying rollers 203, the metal wire is smoothly and uniformly conveyed. Simultaneously, the eccentric rotation of the upper drive gear 206 is converted into the reciprocating linear motion of the cutter 205 via the hinge rod 207. The motion frequency of the cutter 205 is preset to match the metal wire conveying speed of the traction rollers 204. When the metal wire is conveyed to the set length, the two cutters 205 close relative to each other to complete the fixed-length cut. By synchronously achieving the metal wire conveying and fixed-length cutting functions through a single power source, the continuity of metal wire supply and the accuracy of the cutting length are ensured.

[0051] The wire bonding assembly is installed on the top rear side of the rack 1 and is used to perform wire bonding operations on semiconductor chips. The wire bonding assembly includes a linear module 401 fixedly installed on the top rear side of the rack 1, a linear module 402 fixedly installed on the sliding end of the linear module 401, and a welding gun 403 installed on the sliding end of the linear module 402. The driving directions of the linear module 401 and the linear module 402 are perpendicular to each other, and together drive the welding gun 403 to move in the horizontal plane to realize multi-position wire bonding.

[0052] Specifically, linear module 1 401 and linear module 2 402 are arranged vertically to form an XY axis linkage drive platform. The two provide linear driving forces in different directions and work together to accurately transmit power to the welding gun 403 installed at its sliding end. This enables the welding gun 403 to move smoothly and accurately in any position in the horizontal plane, thereby accurately aligning with different pad positions on the semiconductor chip to perform wire bonding operations, meeting the high-precision wire bonding requirements of multiple solder points and multiple positions.

[0053] The transfer assembly is installed on the top side of the frame 1 to transfer the cut metal wire to the working area of ​​the wire bonding assembly, providing material preparation for the wire bonding process. The transfer assembly includes an electric guide rail 301 installed on the top of the frame 1, an electric slider 302 slidably fitted on the electric guide rail 301, an electric turntable 303 fixedly installed on the top of the electric slider 302, a clamping cylinder 304 for clamping the metal wire installed on the top of the electric turntable 303, a support frame 7 fixedly connected to the top middle side of the frame 1, a plurality of guide cylinders 8 for guiding the metal wire detachably connected to the top of the support frame 7, and a placement rack 10 for temporarily placing the metal wire fixedly connected to one side of the top of the support frame 7, with a groove adapted to the metal wire on the placement rack 10.

[0054] Specifically, the clamping cylinder 304 first precisely clamps the metal wire cut by the wire cutting assembly. The electric guide rail 301 drives the electric slider 302 to move the clamped metal wire smoothly along a preset path. The electric turntable 303 can flexibly adjust the placement angle of the metal wire to adapt to the guiding requirements. The metal wire is kept in a stable posture by the limiting and guiding action of the guide cylinder 8 on the support frame 7. Finally, it is precisely placed in the groove of the placement frame 10 to complete the temporary positioning, providing the welding gun 403 of the wire welding assembly with a precise position and stable state of the welding material, ensuring the precise connection and smooth progress of the subsequent wire welding process.

[0055] A fixing assembly is installed on the top rear side of the frame 1 for positioning and fixing the semiconductor chip during wire bonding. The fixing assembly includes an electric telescopic rod 901 installed on the rear side of the frame 1. The telescopic end of the electric telescopic rod 901 is fixedly connected to a limit rod 903. A drive rack 902 is fixedly connected to the inner side of the limit rod 903. A transmission shaft 905 is rotatably connected to the top of the frame 1 via a bearing. Both ends of the transmission shaft 905 are fixedly connected to drive gears 904. One drive gear 904 meshes with the drive rack 902, and the other drive gear 904 meshes with a drive rack 906. A fixing plate 907 for pressing the semiconductor chip is fixedly connected to the top of the drive rack 906. The telescopic movement of the electric telescopic rod 901 drives the limit rod 903 to move, which in turn drives the drive rack 902, drive gear 904, transmission shaft 905, and drive rack 906 in sequence, ultimately driving the fixing plate 907 to move up and down, thereby fixing and releasing the semiconductor chip.

[0056] Specifically, the electric telescopic rod 901 outputs linear telescopic power, driving the drive rack 902 to move linearly. Through the meshing transmission between the drive rack 902 and the corresponding drive gear 904, the transmission shaft 905 rotates synchronously and drives the drive gear 904 at the other end to move in conjunction, thereby driving the meshing drive rack 906 to move vertically. Finally, the fixing plate 907 is raised and lowered smoothly, realizing precise clamping and fast release of the semiconductor chip. Moreover, the transmission process has strong synchronization and high positioning accuracy, effectively avoiding wire bonding deviation caused by chip displacement during wire bonding.

[0057] The fume extraction unit is installed on the top right side of the frame 1 to absorb the fumes generated during wire bonding operations;

[0058] The conveyor belt is installed on the top middle side of the frame 1 to transport the wire to be soldered and the semiconductor chip after the wire soldering is completed.

[0059] Specifically, the smoke removal component 6 and the conveyor belt work together to adapt to the overall operation process. The conveyor belt can smoothly transport the wire to be soldered and the semiconductor chip after the soldering is completed, realizing continuous flow between processes and providing basic transportation guarantee for precise operation. The smoke removal component generates an air pressure difference through power transmission to drive the internal structure, so that the smoke removal pipe 604 forms a directional adsorption force, accurately capturing the smoke and dust generated in the soldering operation area. It is then efficiently transported to the collection box 606 through the connecting pipe 603 for collection and purification. This not only avoids smoke and dust pollution from affecting chip quality and the working environment, but also precisely matches the conveying rhythm of the conveyor belt and the working rhythm of the soldering component, ensuring the smoothness and environmental friendliness of the overall operation.

[0060] A fixed frame 501 is fixedly connected to the top right side of the frame 1. A drive motor 502 is mounted on the outside of the fixed frame 501. A synchronous pulley 506 is fixedly connected to the output end of the drive motor 502. A synchronous pulley 507 is rotatably mounted on the inside of the fixed frame 501. The synchronous pulley 506 and the synchronous pulley 507 are connected by a synchronous belt. A drive block 505 is fixedly connected to the outside of the synchronous belt. A telescopic cylinder is mounted on the outside of the drive block 505. An electric suction cup 504 for gripping semiconductor chips is fixedly connected to the telescopic end of the telescopic cylinder. A detection device 503 for detecting chip position is fixedly connected to the outer surface of the telescopic cylinder. A rotating disk 11 is fixedly connected to the side of the synchronous pulley 506 away from the drive motor 502. A movable block 12 is fixedly connected to the eccentric part of the outside of the rotating disk 11. A movable frame 13 is rotatably mounted on the outside of the frame 1. A sector gear 14 is fixedly connected to the bottom end of the movable frame 13. A movable rack 15 is meshed with the outside of the sector gear 14.

[0061] Specifically, the drive motor 502 outputs power to drive the synchronous pulley 506 to rotate. On the one hand, through the synchronous belt transmission between the synchronous pulley 506 and the synchronous pulley 507, the drive block 505 on the fixed frame 501 moves along a preset trajectory. The detection device 503 on the drive block 505 first performs precise detection on the chip position and the quality of the bonding wire, and then the electric suction cup 504 is driven by the telescopic cylinder to complete the chip gripping and sorting transfer. On the other hand, the synchronous pulley 506 drives the rotating disk 11 to rotate synchronously. The movable block 12 at its eccentric position drives the movable frame 13 to rotate around the outside of the frame 1. Then, through the meshing transmission between the sector gear 14 and the moving rack 15, the horizontal reciprocating movement of the moving rack 15 is realized. The coordinated action of chip detection, transfer and linkage transmission is realized through a single power source, which greatly improves the continuity of operation and the efficiency of power utilization.

[0062] The smoke removal assembly includes a drive rod 602 fixedly connected to one end of a moving rack 15. A fixed cylinder 601 is fixedly connected to the top of the frame 1. The end of the drive rod 602 away from the moving rack 15 extends into the interior of the fixed cylinder 601 and is fixedly connected to a rubber piston. The rubber piston slides and seals against the inner wall of the fixed cylinder 601. The outer surface of the fixed cylinder 601 is connected to a first connecting pipe 603 and a second connecting pipe 605. The outer surface of the first connecting pipe 603 is connected to multiple smoke removal pipes 604 facing the welding operation area. One end of the first connecting pipe 603 is connected to a collection box 606 for collecting smoke and dust. Both the first connecting pipe 603 and the second connecting pipe 605 are equipped with one-way valves. The two one-way valves have opposite conduction directions. The cross-sectional area of ​​the fixed cylinder 601 is larger than that of the first connecting pipe 603.

[0063] Specifically, the horizontal reciprocating movement of the moving rack 15 drives the drive rod 602 to move synchronously, which in turn drives the rubber piston to slide back and forth in a sealed manner on the inner wall of the fixed cylinder 601. In conjunction with the one-way valves that conduct in opposite directions in the connecting pipe 1 603 and the connecting pipe 2 605, the gas inside the fixed cylinder 601 is circulated in one direction. Because the cross-sectional area of ​​the fixed cylinder 601 is larger than that of the connecting pipe 1 603, the gas flow rate in the connecting pipe 1 603 increases sharply when the piston moves, and a negative pressure is formed. This causes the multiple smoke removal pipes 604 facing the welding operation area to generate a continuous adsorption force, which quickly captures the welding smoke and dust and transports it to the collection box 606 through the connecting pipe 1 603 for collection, thus achieving efficient and directional removal of smoke and dust.

[0064] Working Principle: First, the conveyor belt on the top center side of the frame 1 is started. The semiconductor chip to be wire bonded is smoothly transported to the preset wire bonding station by the conveyor belt, and then the conveyor belt stops running. At this time, the electric telescopic rod 901 on the rear side of the frame 1 is started. Its telescopic end drives the limiting rod 903 to move along the chip conveying direction, and initially limits the chip laterally. Simultaneously, the drive rack 902 on the inner side of the limiting rod 903 meshes with the drive gear 904 at one end of the drive shaft 905, driving the drive shaft 905 to rotate around the bearing at the top of the frame 1, and then driving the drive gear 904 at the other end of the drive shaft 905 to rotate synchronously. The drive gear 904 meshes with the drive rack 906, causing the drive rack 906 to move vertically downward, and finally driving the fixing plate 907 at the top to descend smoothly. The rubber pad at the bottom of the fixing plate 907 flexibly adheres to the upper surface of the chip, realizing the precise positioning and stable fixation of the chip, and avoiding displacement deviation during the wire bonding process.

[0065] After the chip is fixed, the wire cutting assembly is activated: the wire release roller 202 inside the mounting frame 201 releases the welding wire, which is then smoothly conveyed between the traction rollers 204 by the guidance of multiple conveying rollers 203; simultaneously, the motor on the outside of the mounting frame 201 is activated, and the motor output drives one of the drive gears 206 to rotate. Since the two drive gears 206 mesh with each other, they drive the two traction rollers 204 to rotate synchronously in opposite directions, achieving uniform traction and conveying of the metal wire. During the rotation of the upper drive gear 206, the hinge rod 207 connected to its external eccentric part swings eccentrically, driving the cutter 205 to move up and down along the guide structure of the mounting frame 201 through the hinge transmission. When the metal wire is conveyed to the preset length, the cutter 205 closes precisely, completing the fixed-length cutting of the metal wire. After cutting, the transfer assembly is activated: the clamping cylinder 304 on the top of the electric turntable 303 precisely clamps both ends of the cut metal wire, the electric slider 302 slides along the electric guide rail 301, and moves the metal wire to the top of the support frame 7; the electric turntable 303 adjusts the placement angle of the metal wire so that the metal wire passes through the inner wall of the guide cylinder 8 and is finally placed stably in the groove of the placement frame 10, completing the precise transfer and positioning of the wire bonding material and preparing for the wire bonding process;

[0066] Then the wire bonding assembly is started: Linear module 1 401 and linear module 2 402 are started according to the preset program. The driving directions of the two are perpendicular to each other, and together they drive the welding gun 403 to make precise bidirectional movement of the X and Y axes in the horizontal plane, so that the welding nozzle of the welding gun 403 is precisely aligned with the pad on the chip and the end of the metal wire on the placement frame 10 to weld the metal wire, realizing multi-position, high-precision wire bonding operation.

[0067] After the wire bonding operation is completed, the telescopic end of the electric telescopic rod 901 retracts, causing the limit rod 903, drive rack 902, drive gear 904, and other transmission structures to reset. The fixing plate 907 rises to release the chip, and the conveyor belt restarts, transporting the bonded chip to the inspection and sorting station. At this time, the drive motor 502 on the outside of the fixing frame 501 is started, and its output end drives the synchronous pulley 506 to rotate. Through the synchronous belt transmission, the synchronous pulley 507 rotates synchronously, and the drive block 505 on the outside of the synchronous belt moves reciprocating linearly with the synchronous belt. The detection device 503 on the outside of the drive block 505 first performs a comprehensive scan and inspection of the chip bonding quality, accurately identifying defects such as solder joint position deviation, cold solder joint, and desoldering. According to the inspection results, if the chip bonding is qualified, the telescopic cylinder is activated, and its telescopic end drives the electric chuck 504 to descend and pick up the chip. Then, the drive block 505 moves to the qualified product area with the synchronous belt, and the electric chuck 504 releases the chip to complete the transfer. If the chip is found to be unqualified, the drive block 505 drives the electric chuck 504 to transfer the chip to the preset unqualified product area, realizing the automated inspection and classification of the chip after soldering.

[0068] While the drive motor 502 drives the synchronous pulley 506 to rotate, the rotating disk 11 on the side of the synchronous pulley 506 away from the drive motor 502 rotates synchronously. The movable block 12 at the eccentric part of the rotating disk 11 is embedded in the movable slot of the movable frame 13 and moves in a circular motion with the rotating disk 11, thereby driving the movable frame 13 to swing back and forth around the rotating shaft on the outside of the frame 1. The sector gear 14 at the bottom of the movable frame 13 meshes with the moving rack 15 to drive the moving rack 15 to move horizontally back and forth. The drive rod 602 connected to one end of the rack then drives the rubber piston to slide and seal inside the fixed cylinder 601. When the rubber piston moves away from the first connecting pipe 603, the internal volume of the fixed cylinder 601 increases and the air pressure decreases, and the one-way valve in the second connecting pipe 605 opens, allowing outside air to enter the fixed cylinder 601; when the rubber piston moves towards the first connecting pipe 603, the internal volume of the fixed cylinder 601 decreases and the air pressure increases, the one-way valve in the second connecting pipe 605 closes, and the one-way valve in the first connecting pipe 603 opens. Because the cross-sectional area of ​​the fixed cylinder 601 is larger than that of the connecting pipe 603, the air velocity in the connecting pipe 603 increases sharply. Due to the acceleration of the air in the connecting pipe 603, it has a large flow velocity. According to Bernoulli's principle, the faster the gas flow velocity, the lower its pressure. This results in a lower pressure in the connecting pipe 603, which in turn generates suction in the smoke removal pipe 604. Multiple smoke removal pipes 604 are aligned with the welding station to generate continuous suction, quickly sucking in the smoke and dust generated during the welding process. The smoke and dust are transported through the connecting pipe 603 to the collection box 606 for purification, realizing the synchronous linkage between welding and smoke removal operations.

[0069] After completing one wire bonding, inspection, and fume removal process, each component is reset, and the conveyor belt continues to transport the next batch of chips to be soldered, entering the next work cycle, thus achieving large-scale continuous production.

[0070] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-precision automatic wire bonding device for semiconductor chips, characterized in that, include: Includes a frame (1), and a tangent assembly, a transfer assembly, a wire bonding assembly, a fixing assembly, a smoke removal assembly and a conveyor belt integrated on the frame (1); The frame (1) serves as the supporting carrier for the entire device; The tangent assembly is installed on the top front side of the frame (1) for conveying and cutting the welding wire to a fixed length; The wire bonding assembly is mounted on the top rear side of the rack (1) for performing wire bonding operations on semiconductor chips; The transfer assembly is installed on the top side of the frame (1) and is used to transfer the cut metal wire to the working area of ​​the wire bonding assembly to provide material preparation for the wire bonding process. The fixing component is installed on the top rear side of the frame (1) for positioning and fixing the semiconductor chip during the wire bonding process; The smoke removal assembly is installed on the top right side of the frame (1) to absorb the smoke and dust generated during wire bonding operations; The conveyor belt is installed on the top middle side of the frame (1) for conveying the wire to be soldered and the semiconductor chip after the wire soldering is completed.

2. The high-precision semiconductor chip automatic wire bonding device according to claim 1, characterized in that, The wire cutting assembly includes a mounting frame (201) fixedly installed on the front side of the top of the frame (1). The inner side of the mounting frame (201) is rotatably mounted with a wire feeding roller (202) and a plurality of conveying rollers (203) for guiding and conveying metal wire. The mounting frame (201) is also rotatably mounted with a traction roller (204). One end of each traction roller (204) is fixedly connected to a drive gear (206). The two drive gears (206) mesh with each other. A motor is installed on the outer side of the mounting frame (201). The output end of the motor is fixedly connected to one of the drive gears (206). A hinge rod (207) is rotatably connected to the outer eccentric part of the upper drive gear (206). The other end of the hinge rod (207) is rotatably connected to a cutter (205). The drive gear (206) is driven to rotate by the motor. With the traction of the hinge rod (207), the two cutters (205) move back and forth relative to each other to achieve the cutting of the metal wire.

3. The high-precision semiconductor chip automatic wire bonding device according to claim 1, characterized in that, The transfer assembly includes an electric guide rail (301) mounted on the top of the frame (1), an electric slider (302) slidably fitted on the electric guide rail (301), an electric turntable (303) fixedly mounted on the top of the electric slider (302), a clamping cylinder (304) for clamping metal wires mounted on the top of the electric turntable (303), a support frame (7) fixedly connected to the top middle side of the frame (1), a plurality of guide cylinders (8) for guiding metal wires detachably connected to the top of the support frame (7), and a placement rack (10) for temporarily placing metal wires fixedly connected to one side of the top of the support frame (7), and a groove adapted to the metal wires is provided on the placement rack (10).

4. The high-precision automatic wire bonding device for semiconductor chips according to claim 1, characterized in that, The wire bonding assembly includes a linear module one (401) fixedly installed on the rear side of the top of the frame (1). A linear module two (402) is fixedly installed on the sliding end of the linear module one (401). A welding gun (403) is installed on the sliding end of the linear module two (402). The driving directions of the linear module one (401) and the linear module two (402) are perpendicular to each other, and together drive the welding gun (403) to move in the horizontal plane to realize multi-position wire bonding.

5. The high-precision automatic wire bonding device for semiconductor chips according to claim 1, characterized in that, The fixing assembly includes an electric telescopic rod (901) installed on the rear side of the frame (1). The telescopic end of the electric telescopic rod (901) is fixedly connected to a limit rod (903). The inner side of the limit rod (903) is fixedly connected to a drive rack (902). The top of the frame (1) is rotatably connected to a transmission shaft (905) via a bearing. Both ends of the transmission shaft (905) are fixedly connected to drive gears (904), one of which meshes with the drive rack (902). Next, another drive gear (904) is meshed with a drive rack (906), and a fixing plate (907) for pressing the semiconductor chip is fixedly connected to the top of the drive rack (906); by moving the extension and retraction drive limit rod (903) of the electric telescopic rod (901), the drive rack (902), drive gear (904), transmission shaft (905) and drive rack (906) are driven in sequence, and finally the fixing plate (907) is driven to move up and down, so as to realize the fixing and release of the semiconductor chip.

6. The high-precision automatic wire bonding device for semiconductor chips according to claim 1, characterized in that, A fixed frame (501) is fixedly connected to the top right side of the frame (1). A drive motor (502) is installed on the outside of the fixed frame (501). A synchronous pulley (506) is fixedly connected to the output end of the drive motor (502). A synchronous pulley (507) is rotatably installed on the inside of the fixed frame (501). The synchronous pulley (506) and the synchronous pulley (507) are connected by a synchronous belt. A drive block (505) is fixedly connected to the outside of the synchronous belt. A telescopic cylinder is installed on the outside of the drive block (505). An electric suction cup (504) for gripping semiconductor chips is fixedly connected to the telescopic end of the telescopic cylinder. A detection device (503) for detecting the chip position is fixedly connected to the outer surface of the telescopic cylinder.

7. The high-precision automatic wire bonding device for semiconductor chips according to claim 6, characterized in that, A rotating disk (11) is fixedly connected to the side of the synchronous pulley (506) away from the drive motor (502). A movable block (12) is fixedly connected to the outer eccentric part of the rotating disk (11). A movable frame (13) is rotatably installed on the outer side of the frame (1). A sector gear (14) is fixedly connected to the bottom end of the movable frame (13). A movable rack (15) is meshed with the outer side of the sector gear (14).

8. The high-precision automatic wire bonding device for semiconductor chips according to claim 7, characterized in that, The smoke removal assembly includes a drive rod (602) fixedly connected to one end of a moving rack (15). A fixed cylinder (601) is fixedly connected to the top of the frame (1). The end of the drive rod (602) away from the moving rack (15) extends into the interior of the fixed cylinder (601) and is fixedly connected to a rubber piston. The rubber piston slides and seals against the inner wall of the fixed cylinder (601). The outer surface of the fixed cylinder (601) is connected to a connecting pipe one (603) and a connecting pipe two (605). The outer surface of the connecting pipe one (603) is connected to a plurality of smoke removal pipes (604) facing the wire bonding operation area. One end of the connecting pipe one (603) is connected to a collection box (606) for collecting smoke and dust.

9. A high-precision automatic wire bonding device for semiconductor chips according to claim 8, characterized in that, Both the first connecting pipe (603) and the second connecting pipe (605) are equipped with one-way valves. The two one-way valves have opposite conduction directions. The cross-sectional area of ​​the fixed cylinder (601) is larger than that of the first connecting pipe (603).

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