Method for improving effect of ACF bonding process

Abstract

The present application relates to display module manufacturing technical field, disclose a kind of ACF binding process effect promotion method, ACF preparation: in material mixing process, utilize high-speed mixer to mix resin and metal particle to prepare ACF coating liquid, the coating liquid is coated by slit extrusion coater, hot air circulation oven drying, hot air circulation oven cutting, after precision cutting machine winding, obtain the ACF finished product roll material of the ACF particle concentration from low to high distribution from roll head to roll tail;Step 2, circuit board classification: using the circuit board processing equipment with PAD size detection classification function, PAD size detection is carried out to circuit board, and classification is completed in the order from wide to narrow according to PAD size;Step 3, matching binding: the high concentration ACF of the tail of ACF finished product roll material is bound with the circuit board of narrow PAD size.The present application, using the preparation characteristics of ACF and advanced size measurement classification equipment, the ACF density and circuit board PAD size are precisely matched, so as to improve the binding process effect.

Description

Technical Field

[0001] This invention relates to the field of display module manufacturing technology, specifically to a method for improving the effect of ACF bonding process. Background Technology

[0002] In the COG and FOG bonding processes of display modules such as LCD and OLED, ACF (Acoustic Coating Fluoride) is the core material for achieving electrical connections between chips and circuit boards. Currently, during ACF preparation, resin metal particles deposit due to variations in gravity and stirring speed, resulting in a gradual distribution of particle concentration from low to medium to high from the beginning to the end of the finished roll. Simultaneously, the PADs on the circuit boards to be bonded exhibit natural differences in size. Direct random bonding can lead to mismatches such as "large PAD + low-concentration ACF" or "small PAD + high-concentration ACF," causing large fluctuations in the number of burst particles at each bonding point, poor impedance stability, and ultimately, decreased product yield and reliability. Existing technologies primarily focus on optimizing the ACF material itself or bonding equipment parameters, lacking a solution for actively matching the natural gradient of ACF concentration with the differences in circuit board PAD size. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a method for improving the performance of the ACF bonding process. This method solves the problem that in existing ACF bonding processes, when electrically linking core components to circuit boards, the ACF particle density and the bonding pads of both the circuit board and the core components exhibit process fluctuations, affecting the electrical properties and reliability of the bonding process.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A method for improving the bonding effect of ACF (Acrylic Fluorescent Foam) bonding process includes the following steps:

[0006] Step 1, ACF preparation: In the material mixing process, resin and metal particles are mixed using a high-speed mixer to prepare ACF coating liquid. The coating liquid is coated by a slot extrusion coating machine, dried in a hot air circulating oven, cut in a hot air circulating oven, and rolled up by a precision slitting machine to obtain ACF finished roll material with ACF particle concentration distributed from low to high from the beginning to the end of the roll.

[0007] Step 2, Circuit Board Classification: Using circuit board processing equipment with PAD size detection and classification function, the circuit boards are classified and sorted according to PAD size from widest to narrowest.

[0008] Step 3, Matching and Binding: Bind the low-concentration ACF at the beginning of the ACF finished roll in Step 1 to the circuit board with the wide PAD size in Step 2; bind the high-concentration ACF at the end of the ACF finished roll to the circuit board with the narrow PAD size.

[0009] Preferably, in the ACF preparation process, due to the deposition of resin metal particles in the solution, the particle concentration of the finished ACF roll exhibits a gradual distribution with a low concentration at the beginning and a high concentration at the end.

[0010] Preferably, in the circuit board sorting step, the circuit boards are automatically detected and sorted by size through a gate-type robotic arm, a sorting and sorting device, and a PAD size detection module.

[0011] Preferably, in the matching and binding, high-concentration ACF is paired with small-sized PADs, and low-concentration ACF is paired with large-sized PADs.

[0012] Preferably, during the binding process, the ACF particles are fractured by the PAD through pre-pressure and actual pressure to form electrical conductivity, so as to keep the impedance of different binding combinations and the actual number of explosive particles relatively stable.

[0013] The present invention has the following beneficial effects:

[0014] This method for improving ACF bonding process efficiency utilizes a measurement and sorting device to obtain sorted circuit boards. Based on the characteristics of ACF preparation, the concentration of the finished ACF increases from the beginning to the end of the roll. During the bonding process, bonding is performed according to the width of the circuit board pads, from widest to narrowest, to achieve a relatively stable output in terms of impedance and actual explosive particle count, thereby improving the bonding effect. By actively utilizing the concentration gradient during ACF preparation and precisely matching it with the size gradient of the circuit board pads, bonding yield and product reliability can be significantly improved without additional equipment or material costs, demonstrating high industrial application value. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the ACF preparation process of the present invention;

[0016] Figure 2 This is a schematic diagram of the circuit board bonding of the present invention. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] A method for improving the bonding effect of ACF (Acrylic Fluorescent Foam) bonding process includes the following steps:

[0019] Step 1, ACF preparation: In the material mixing process, resin and metal particles are mixed using a high-speed mixer to prepare ACF coating liquid. The coating liquid is coated by a slot extrusion coating machine, dried in a hot air circulating oven, cut in a hot air circulating oven, and rolled up by a precision slitting machine to obtain ACF finished roll material with ACF particle concentration distributed from low to high from the beginning to the end of the roll.

[0020] Step 2, Circuit Board Classification: Using circuit board processing equipment with PAD size detection and classification function, the circuit boards are inspected for PAD size and classified and sorted in descending order of PAD size. The circuit board processing equipment with PAD size detection and classification function can be the TRI TR7700 SII online AOI inspection and classification integrated machine, the KEYENCE CV-X series offline high-precision vision inspection equipment, or the FANUC LR Mate 200iD robot workstation, etc.

[0021] Step 3, Matching and Binding: Bind the low-concentration ACF at the beginning of the ACF finished roll in Step 1 to the circuit board with the wide PAD size in Step 2; bind the high-concentration ACF at the end of the ACF finished roll to the circuit board with the narrow PAD size.

[0022] like Figure 1-2 As shown, in this technical solution, sorted circuit boards are obtained through measurement and classification equipment. Based on the characteristics of ACF preparation, the concentration of the finished ACF product increases from low to high as the roll progresses from the beginning to the end. During the bonding process, bonding is performed according to the width of the circuit board PADs, from wide to narrow, to achieve a relatively stable output in terms of impedance and actual explosive particle count, thereby improving the bonding effect in actual operations. By actively utilizing the concentration gradient during the ACF preparation process and precisely matching it with the size gradient of the circuit board PADs, bonding yield and product reliability can be significantly improved without additional equipment or material costs, demonstrating extremely high industrial application value.

[0023] In this embodiment, during the ACF preparation process, due to the deposition of resin metal particles in the solution, the particle concentration of the finished ACF roll exhibits a gradual distribution with a low concentration at the beginning and a high concentration at the end.

[0024] In this embodiment, the circuit board sorting step is achieved by using a gate-type robotic arm, a sorting and sorting device, and a PAD size detection module to automatically detect and sort the circuit boards by size.

[0025] In this embodiment, during the matching and binding process, high-concentration ACF is paired with small-sized PADs, and low-concentration ACF is paired with large-sized PADs.

[0026] In this embodiment, during the bonding process, the ACF particles are fractured by the PAD to form electrical conductivity through the pre-bonding pre-pressure and the main bonding pressure, so that the impedance of different bonding combinations and the actual number of explosive particles remain relatively stable.

[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0028] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for improving the effect of ACF bonding process, characterized in that, Includes the following steps: Step 1, ACF preparation: In the material mixing process, resin and metal particles are mixed using a high-speed mixer to prepare ACF coating liquid. The coating liquid is coated by a slot extrusion coating machine, dried in a hot air circulating oven, cut in a hot air circulating oven, and rolled up by a precision slitting machine to obtain ACF finished roll material with ACF particle concentration distributed from low to high from the beginning to the end of the roll. Step 2, Circuit Board Classification: Using circuit board processing equipment with PAD size detection and classification function, the circuit boards are classified and sorted according to PAD size from widest to narrowest. Step 3, Matching and Binding: Bind the low-concentration ACF at the beginning of the ACF finished roll in Step 1 to the circuit board with the wide PAD size in Step 2; bind the high-concentration ACF at the end of the ACF finished roll to the circuit board with the narrow PAD size.

2. The method for improving the ACF bonding process effect according to claim 1, characterized in that: In the ACF preparation process, due to the deposition of resin metal particles in the solution, the particle concentration of the finished ACF roll exhibits a gradual distribution with a low concentration at the beginning and a high concentration at the end.

3. The method for improving the ACF bonding process effect according to claim 1, characterized in that: In the circuit board sorting step, the circuit boards are automatically detected and sorted by size through a gate-type robotic arm, a sorting and sorting device, and a PAD size detection module.

4. The method for improving the ACF bonding process effect according to claim 1, characterized in that: In the matching and binding process, high-concentration ACF is paired with small-sized PADs, and low-concentration ACF is paired with large-sized PADs.

5. The method for improving the ACF bonding process effect according to claim 1, characterized in that: During the binding process, the ACF particles are fractured by the PAD through pre-pressure and main pressure to form electrical conduction, so as to keep the impedance of different binding combinations and the actual number of explosive particles relatively stable.

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