A magnetic field-assisted processing device and processing method for brittle materials

Abstract

This application provides a magnetic field-assisted machining apparatus and method for brittle materials. The machining apparatus includes a machining section and a magnetic field generating device. The machining section is connected to a connecting shaft. The machining section is rotatable about the axial direction of the connecting shaft to machine the workpiece. The magnetic field generating device generates a magnetic field region. The connecting shaft is at least partially located within the magnetic field region so that, in the event of vibration of the connecting shaft, the connecting shaft can cut magnetic field lines within the magnetic field region to impede vibration. The workpiece and the machining section are both at least partially located within the magnetic field region. The machining section is rotatable about the axial direction of the connecting shaft to machine the workpiece within the magnetic field region. Embodiments of this application can reduce damage to the workpiece during machining, thereby improving machining quality.

Description

Technical Field

[0001] This application belongs to the field of materials processing technology, and more specifically, relates to a magnetic field-assisted processing device and processing method for brittle materials. Background Technology

[0002] In ultra-precision grinding, brittle materials are prone to brittle zone removal due to their high brittleness, which can lead to damage such as microcracks and brittle fracture. At the same time, the vibration of the grinding wheel spindle can cause micro-wave marks on the surface, increasing the thickness of the damaged layer and seriously affecting the performance of the components. Summary of the Invention

[0003] To improve or solve the technical problem that the processing of related technologies is prone to damage to the workpiece during processing, resulting in reduced processing quality, this application provides a magnetic field-assisted processing device and processing method for brittle materials.

[0004] In a first aspect, embodiments of this application provide a magnetic field-assisted processing apparatus for brittle materials, comprising: A processing unit is connected to a connecting shaft; the processing unit is capable of rotating about the axial direction of the connecting shaft to process the workpiece to be processed; And a magnetic field generating device for generating a magnetic field region; The connecting shaft is at least partially located within the magnetic field region, so that in the event of vibration of the connecting shaft, the connecting shaft can cut magnetic field lines within the magnetic field region to impede the vibration; The workpiece to be processed is at least partially located within the magnetic field region, and the processing unit is at least partially located within the magnetic field region; the processing unit is rotatable about the axial direction of the connecting shaft to process the workpiece to be processed within the magnetic field region.

[0005] In the above technical solution, the magnetic field generating device generates a magnetic field region, so that the connecting shaft of the processing unit and the workpiece to be processed are at least partially located within this magnetic field region. When the connecting shaft vibrates, it cuts the magnetic field lines within the magnetic field region. According to the principle of electromagnetic induction, when a part of a conductor in a closed circuit moves in a magnetic field and cuts the magnetic field lines, an induced current is generated in the conductor. The induced current is then subjected to a magnetic force, which hinders the vibration of the connecting shaft.

[0006] It effectively reduces machining errors caused by vibration of the connecting shaft during processing, avoids unstable relative positional relationship between the machining tool and the workpiece due to vibration, thereby improving machining accuracy, ensuring machining quality, and reducing problems such as increased workpiece surface roughness and dimensional deviation caused by vibration.

[0007] Since the processing takes place in a magnetic field region, the presence of magnetoplasticity can increase the critical depth of the brittle-plastic transition of the workpiece, suppress brittle fracture, thereby reducing damage to the workpiece during processing and improving processing quality.

[0008] Furthermore, when the connecting shaft vibrates, one end of the connecting shaft is connected to the processing unit; the deviation of one end of the connecting shaft from the axial direction of the connecting shaft is 10nm-50μm.

[0009] In the above technical solution, the vibration amplitude range of 10nm-50μm provides a relatively stable reference range for the processing. Within this range, the magnetic field suppresses the vibration, ensuring that the deviation of the movement trajectory of the processing unit is controlled within a very small range when processing the workpiece. For example, in some high-precision processing scenarios, such as the processing of optical components, even if the connecting shaft has such a small vibration, after being suppressed by the magnetic field, the processing unit can process according to the predetermined precise path, ensuring that the dimensional and shape accuracy of the processed workpiece meets the stringent requirements.

[0010] Furthermore, the material of the workpiece to be processed is a brittle material.

[0011] Brittle materials are very sensitive to vibration and force fluctuations during processing. Even small vibrations or force changes can lead to dimensional deviations and increased surface roughness.

[0012] In the above technical solution, the processing device effectively suppresses the generation and propagation of microcracks in brittle materials during processing, reduces the risk of workpiece breakage, improves the yield of brittle material workpieces, and reduces production costs.

[0013] Furthermore, the magnetic field-assisted processing device for the brittle material also includes: The fastener is used to install and fix the workpiece to be processed. And a rotating device; the rotating device is used to connect the processing part via a connecting shaft, so as to drive the processing part to rotate axially around the connecting shaft, so as to process the workpiece to be processed in the magnetic field area.

[0014] In the above technical solution, the rotating device is connected to the machining unit via a connecting shaft, enabling the machining unit to rotate axially around the connecting shaft. This design provides the machining unit with flexible movement, allowing it to perform comprehensive machining operations on the fixed workpiece within the magnetic field region. The synergistic effect of the fixing component and the rotating device provides a stable platform for machining brittle material workpieces. The stable rotation and precise cutting of the machining unit within the magnetic field region ensures the accuracy of machining dimensions and the consistency of shape.

[0015] Furthermore, the magnetic field-assisted machining device for brittle materials also includes a machine tool; the fixing member is used to install on the spindle of the machine tool; the feed system of the machine tool drives the spindle to move to adjust the machining position of the workpiece to be processed; the rotating device and the magnetic field generating device are located on the machine tool.

[0016] In the above technical solution, the machine tool's high-precision feed system and spindle motion control can ensure the relative positional accuracy between the workpiece and the machining section. When machining brittle materials, even slight positional deviations can lead to dimensional and shape errors, affecting the workpiece's performance. Precise motion control of the machine tool ensures that the machining section cuts the workpiece in the correct position, improving machining accuracy.

[0017] Furthermore, the magnetic field generating device includes a first magnetic element and a second magnetic element; the first magnetic element and the second magnetic element are spaced apart along a first direction; the magnetic field region is formed between the first magnetic element and the second magnetic element; the connecting shaft extends along a second direction and is at least partially located within the magnetic field region; the first direction and the second direction intersect.

[0018] In the above technical solution, the magnetic field generating device in the processing apparatus forms a magnetic field region by first and second magnetic components spaced apart along a first direction, and the connecting shaft extends along a second direction and is at least partially located within the magnetic field region. This design makes the magnetic field distribution controllable and the region stable; the rotating connecting shaft cuts magnetic field lines and interacts with the magnetic field to affect the movement of the processing part, providing more means for processing adjustment; for the processing of brittle materials, it can reduce stress concentration, improve surface quality, and enhance processing stability, which can meet the requirements of high-precision processing and improve production efficiency and product quality.

[0019] Secondly, this application provides a processing method, using a magnetic field-assisted processing device for the brittle material, comprising: Obtain the material of the workpiece to be processed and the target processing quality parameter data corresponding to the material; Based on the target processing quality parameter data, generate the magnetic field parameters and processing parameters for processing the workpiece to be processed; Based on the magnetic field parameters and processing parameters, the processing device is controlled to process the workpiece within the magnetic field region.

[0020] In the above technical solution, this method can generate corresponding magnetic field parameters and processing parameters according to the different materials of the workpieces to be processed, thus it can be applied to the processing of workpieces made of various materials. Whether it is brittle crystals, ceramics, glass, or composite materials, high-quality processing can be achieved by adjusting the parameters, expanding the application range of the processing device. This method can generate personalized parameters according to these different requirements, thereby meeting diverse processing needs.

[0021] Furthermore, the target processing quality parameter data includes a surface roughness threshold and a subsurface damage depth threshold; Based on the target machining quality parameter data, magnetic field parameters and machining parameters for machining the workpiece to be processed are generated; including: The surface roughness of the workpiece to be processed is determined based on a surface roughness threshold. The subsurface damage depth of the workpiece to be processed is determined based on the subsurface damage depth threshold. When the surface roughness is less than or equal to the surface roughness threshold and / or the subsurface damage depth is less than or equal to the subsurface damage depth threshold, the material removal rate is maximized to generate the magnetic field parameters and processing parameters of the workpiece to be processed.

[0022] In the above technical solution, by maximizing the material removal rate while meeting the requirements of surface roughness and subsurface damage depth, the processing time can be significantly shortened and the output per unit time can be increased.

[0023] Furthermore, the processing device includes a machine tool; the magnetic field parameters include magnetic induction intensity; the processing parameters include the grinding depth of the workpiece to be processed, the feed rate of the workpiece to be processed, and the rotational speed of the processing unit.

[0024] In the above technical solution, by determining the actual surface roughness of the machined surface based on the surface roughness threshold and strictly controlling it during the parameter generation process, it is possible to ensure that the surface roughness of the machined workpiece meets the design requirements, thereby improving the appearance quality and performance of the workpiece.

[0025] The actual subsurface damage depth is determined by the subsurface damage depth threshold, and controlled by optimizing magnetic field parameters and processing parameters. This can effectively reduce subsurface damage such as microcracks and residual stress generated during processing, thereby improving the mechanical properties and fatigue life of the workpiece.

[0026] This method is based on clearly defined target processing quality parameter data. Through scientific experiments and analysis, it generates magnetic field parameters and processing parameters, reduces interference from human factors, and makes the processing process more stable and controllable.

[0027] Furthermore, based on the magnetic field parameters and processing parameters, the processing device is controlled to process the workpiece within the magnetic field region; including: Acquire acoustic emission signal data of the workpiece to be processed and vibration acceleration signal data of the connecting shaft; If the acoustic emission signal data of the workpiece to be processed is greater than the acoustic emission signal threshold, the magnetic field generating device is controlled to adjust the magnetic induction intensity so that the acoustic emission signal data is less than the acoustic emission signal threshold. If the vibration acceleration signal data of the connecting shaft is greater than the vibration acceleration signal threshold, the magnetic field generating device is controlled to adjust the magnetic induction intensity so that the vibration acceleration signal of the connecting shaft is less than the vibration acceleration signal threshold.

[0028] The above technical solution, by real-time monitoring of acoustic emission signals and timely adjustment of magnetic induction intensity, can take measures to suppress the initiation and propagation of cracks inside the workpiece in the early stages. Monitoring and controlling the vibration acceleration signal of the connecting shaft can effectively reduce the impact of vibration on the machining process. Vibration causes changes in the relative position between the tool and the workpiece, thereby affecting machining accuracy and surface roughness. By adjusting the magnetic induction intensity to suppress the vibration of the connecting shaft, the contact between the tool and the workpiece can be made more stable, improving machining quality.

[0029] This method enables real-time monitoring and timely adjustment of acoustic emission signals and connecting shaft vibration acceleration signals during machining. By continuously feeding back signal information and adjusting the magnetic induction intensity, the machining process can remain stable, reducing machining interruptions and quality fluctuations caused by abnormal conditions.

[0030] Because this method can dynamically adjust based on real-time signal data, it is highly adaptable and can handle different workpiece materials, processing techniques, and equipment conditions. Whether in roughing or finishing, the stability and reliability of the machining process can be ensured by adjusting the magnetic induction intensity.

[0031] This application provides a magnetic field-assisted processing device and method for brittle materials. It employs a processing unit and a magnetic field generator, with the processing unit processing the workpiece within the magnetic field region generated by the magnetic field generator. During processing, a connecting shaft can cut magnetic field lines within the magnetic field region, generating eddy current damping forces that impede vibration, thereby reducing the damage to the workpiece caused by the vibration of the connecting shaft. Since the processing is carried out within the magnetic field region, the presence of magnetoplasticity can increase the critical depth of the brittle-plastic transition of the workpiece, suppressing brittle fracture and thus reducing damage to the workpiece during processing. Therefore, this application embodiment can reduce damage to the workpiece during processing, thereby improving processing quality. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the overall structure of the processing device.

[0034] Figure 2 for Figure 1 A magnified schematic diagram of part A in the diagram.

[0035] Figure 3 This is a schematic diagram of the structure after the machining part, fixing parts, rotating device, magnetic field generating device and mounting parts are assembled.

[0036] Figure 4 for Figure 3 A schematic diagram of the left-side view structure.

[0037] Figure 5 for Figure 4 A magnified schematic diagram of part B.

[0038] Figure 6 This is a schematic diagram of the control system.

[0039] Figure 7 This is a flowchart illustrating a processing method according to one embodiment.

[0040] Figure 8 A schematic diagram of the process for generating magnetic field parameters and processing parameters.

[0041] Figure 9 Images of the machined surface before and after the magnetic field is turned on are shown, where (a) is the machined surface image without magnetic field assistance and (b) is the machined surface image after magnetic field assistance is used.

[0042] The attached figures are labeled as follows: 1-Machining section, 2-Magnetic field generating device, 3-Connecting shaft, 4-Magnetic field area, 5-First magnetic component, 6-Second magnetic component, 7-Magnetic field lines, 8-Mounting component, 9-Machine tool body, 10-Spindle, 11-Rotating device, 12-Fixing component, 13-Workpiece to be processed, 14-Grinding wheel spindle device. Detailed Implementation

[0043] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0044] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0045] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0047] This application provides a magnetic field-assisted processing device for brittle materials, see below. Figures 1-6 As shown, it includes: a processing unit 1 and a magnetic field generating device 2; the processing unit 1 is connected to a connecting shaft 3; the processing unit 1 is rotatable about the axial direction of the connecting shaft 3 to process a workpiece 13; the magnetic field generating device 2 is used to generate a magnetic field region 4; the connecting shaft 3 is at least partially located within the magnetic field region 4, so that in the event of vibration of the connecting shaft 3, the connecting shaft 3 can cut the magnetic field lines within the magnetic field region 4 to impede the vibration; the workpiece 13 is at least partially located within the magnetic field region 4, and the processing unit 1 is at least partially located within the magnetic field region 4; the processing unit 1 is rotatable about the axial direction of the connecting shaft 3 to process the workpiece 13 within the magnetic field region 4.

[0048] It is understood that the machining part 1 can be a disc-shaped structure, such as a grinding wheel; the machining part 1 can also be a slender rod-shaped structure with a circular cross-section. No limitation is made here.

[0049] Optionally, the connecting shaft 3 is made of metal.

[0050] See Figure 3 As shown, the processing unit 1 can be placed in the magnetic field region 4 generated by the magnetic field generator 2. The right end of the connecting shaft 3 is connected to the center of the processing unit 1; the left end of the connecting shaft 3 can be connected to a power device such as a motor to provide power for the rotation of the connecting shaft 3. In the magnetic field region 4, the rotation of the connecting shaft 3 drives the processing unit 1 to rotate around the axial direction of the connecting shaft 3. In this rotating state, the edge of the processing unit 1 grinds the workpiece 13 to be processed in the magnetic field region 4, thereby processing the workpiece 13.

[0051] During the machining process, due to the interaction between the machining part and the workpiece 13, the connecting shaft 3 often vibrates to varying degrees. When the connecting shaft 3 vibrates, it cuts the magnetic field lines in the magnetic field region 4, thereby generating a force that hinders the vibration of the connecting shaft 3 and reduces its vibration. The reduction of the vibration of the connecting shaft 3 avoids machining errors caused by its vibration. Furthermore, in the workpiece 13 in the magnetic field region 4, the magnetoplastic effect can increase the critical depth of the brittle-plastic transition of the workpiece 13, suppressing brittle fracture and thus improving the machining quality.

[0052] In the above technical solution, the magnetic field generating device 2 generates a magnetic field region 4, so that the connecting shaft 3 of the processing unit 1 and the workpiece 13 to be processed are at least partially located within the magnetic field region 4. When the connecting shaft 3 vibrates, it cuts the magnetic field lines within the magnetic field region 4. According to the principle of electromagnetic induction, when a part of a conductor in a closed circuit moves in a magnetic field and cuts the magnetic field lines, an induced current is generated in the conductor. The induced current is then subjected to a magnetic force, which hinders the vibration of the connecting shaft 3.

[0053] This effectively reduces machining errors caused by the vibration of the connecting shaft 3 during processing, and avoids unstable relative positional relationships between the machining tool and the workpiece 13 caused by vibration. This improves machining accuracy, ensures machining quality, and reduces problems such as increased workpiece surface roughness and dimensional deviations caused by vibration. The machining process takes place in the magnetic field region 4. Due to the magnetoplastic effect, the critical depth of the brittle-plastic transition of the workpiece 13 can be increased, suppressing brittle fracture and thus reducing damage to the workpiece 13 during machining, thereby improving machining quality.

[0054] Therefore, in this embodiment, the processing unit 1 and the magnetic field generating device 2 use the connecting shaft 3 to cut magnetic field lines to generate eddy current damping force that hinders vibration, thereby reducing the damage of the connecting shaft 3 to the workpiece 13 to be processed; the magnetoplastic effect increases the critical depth of the brittle-plastic transition of the workpiece 13 to be processed, suppressing brittle fracture, thereby reducing the damage to the workpiece 13 to be processed during the processing, thereby reducing the damage to the workpiece 13 to be processed during the processing and improving the processing quality.

[0055] Furthermore, when the connecting shaft vibrates, one end of the connecting shaft is connected to the processing unit; the deviation of one end of the connecting shaft from the axial direction of the connecting shaft is 10nm-50μm.

[0056] In one embodiment, see Figure 5As shown, machining part 1 is a grinding wheel, and the right side of machining part 1 is a circular rotating plane. The right end of the connecting shaft is connected to the grinding wheel. Optionally, the direction of the magnetic field lines 7 in the magnetic field region 4 is vertically downward. When machining brittle materials, the vibration of the connecting shaft often has amplitudes in various directions. Therefore, the connecting shaft will inevitably vibrate along the direction of cutting the magnetic field lines 7, thereby generating a Lorentz force that opposes the vibration of the connecting shaft, thus reducing the vibration of the connecting shaft along the direction of cutting the magnetic field lines 7. The vibration of the connecting shaft along the direction of cutting the magnetic field lines 7 is often related to parameters such as the machining depth of the brittle material. Therefore, the machining quality can be improved by the above method.

[0057] Optionally, the deviation of the right end of the connecting shaft from the axial direction of the connecting shaft can be 10nm, 50nm, 1000nm, 10μm, 20μm, 30μm, 40μm or 50μm, etc., and is not limited here.

[0058] Within the aforementioned vibration amplitude, the magnetic field suppresses the vibration, ensuring that the deviation of the machining unit's trajectory during workpiece processing is controlled within a minimal range. For example, in high-precision machining scenarios, such as the machining of optical components, even with such minute vibrations in the connecting shaft, the machining unit can still perform machining along a predetermined precise path after being suppressed by the magnetic field, ensuring that the dimensional and shape accuracy of the machined workpiece meets stringent requirements.

[0059] Furthermore, the material of the workpiece 13 to be processed is a brittle material.

[0060] Brittle materials are very sensitive to vibration and force fluctuations during processing. Even small vibrations or force changes can lead to dimensional deviations and increased surface roughness.

[0061] In the above technical solution, the processing device effectively suppresses the generation and propagation of microcracks in brittle materials during processing, reduces the risk of workpiece breakage, improves the yield of brittle material workpieces, and reduces production costs.

[0062] Furthermore, the processing device also includes: a fixing member 12 and a rotating device 11; the fixing member 12 is used to install and fix the workpiece 13 to be processed; the rotating device 11 is used to connect the processing part 1 through the connecting shaft 3, so as to drive the processing part 1 to rotate around the axial direction of the connecting shaft 3, so as to process the workpiece 13 to be processed in the magnetic field region 4.

[0063] For example, see Figure 1 As shown, the processing device includes a fixing member 12 and a rotating device 11; the right end of the fixing member 12 is used to install and fix the workpiece 13 to be processed, and the rotating device 11 is used to install the processing part 1 through the connecting shaft 3, so that the processing part 1 rotates around the axis of the connecting shaft 3 to process the workpiece 13.

[0064] In the above technical solution, the rotating device 11 is connected to the machining unit 1 via the connecting shaft 3, enabling the machining unit 1 to rotate around the axial direction of the connecting shaft 3. This design provides the machining unit 1 with a flexible mode of movement, allowing it to perform comprehensive machining operations on the fixed workpiece 13 within the magnetic field region 4. The synergistic effect of the fixing member 12 and the rotating device 11 provides a stable platform for machining brittle material workpieces. The stable rotation and precise cutting of the machining unit 1 within the magnetic field region 4 ensures the accuracy of the machining dimensions and the consistency of the shape.

[0065] Furthermore, the processing device also includes a machine tool; the fixing member 12 is used to install on the spindle 10 of the machine tool; the feed system of the machine tool drives the spindle 10 to move to adjust the processing position of the workpiece 13 to be processed; the rotating device 11 and the magnetic field generating device 2 are provided on the machine tool.

[0066] See Figure 1 As shown, the processing device includes a machine tool; the machine tool includes a worktable; a fixing member 12 is mounted on the spindle 10 of the machine tool; the spindle 10 can be moved by the machine tool's feed system, thereby adjusting the processing position of the workpiece 13 to be processed, and thus adjusting the location, processing depth, etc. of the workpiece 13 to be processed. Optionally, the rotating device 11 and the magnetic field generating device 2 are disposed on the worktable of the machine tool. Optionally, the magnetic field generating device 2 is fixed to the worktable by a mounting member 8. Optionally, the connecting shaft 3 can extend into the magnetic field region 4 of the magnetic field generating device 2 along the direction of cutting magnetic field lines, such that the connecting shaft and the magnetic field lines form a certain angle (e.g., 30°-90°).

[0067] Optionally, the processing part 1 is a grinding wheel, and the rotating device 11 is a grinding wheel spindle device 14; the grinding wheel is mounted on the grinding wheel spindle device 14 via the connecting shaft 3.

[0068] In the above technical solution, the high-precision feed system and spindle 10 motion control of the machine tool can ensure the relative positional accuracy between the workpiece 13 and the machining unit 1. When machining brittle materials, even slight positional deviations can lead to dimensional and shape errors, affecting the workpiece's performance. Precise motion control of the machine tool ensures that the machining unit 1 cuts the workpiece in the correct position, improving machining accuracy.

[0069] Furthermore, the magnetic field generating device 2 includes a first magnetic element 5 and a second magnetic element 6; the first magnetic element 5 and the second magnetic element 6 are spaced apart along a first direction; the magnetic field region 4 is formed between the first magnetic element 5 and the second magnetic element 6; the connecting shaft 3 extends along a second direction and is at least partially located within the magnetic field region 4; the first direction and the second direction intersect.

[0070] See Figure 3 As shown, optionally, the first direction is the Y-axis and the second direction is the X-axis. The magnetic field generating device 2 includes a first magnetic element 5 and a second magnetic element 6. The first magnetic element 5 and the second magnetic element 6 are spaced apart along the Y-axis to form a magnetic field region 4. The connecting shaft 3 and the processing part 1 extend into the magnetic field region 4 along the X-axis. Optionally, the X-axis and the Y-axis are perpendicular. The X-axis can be the length direction of the first magnetic element 5, and the Y-axis can be the vertical direction.

[0071] Optionally, the first magnetic element 5 and the second magnetic element 6 can be electromagnets; the magnetic field generating device 2 also includes a power supply device; the power supply device is connected to the first magnetic element 5 and the second magnetic element 6 respectively; the power supply device provides currents of different magnitudes and directions to the first magnetic element 5 and the second magnetic element 6, thereby causing changes in the magnitude and direction of magnetic field lines in the magnetic field region 4 between the first magnetic element 5 and the second magnetic element 6.

[0072] In the above technical solution, the magnetic field generating device 2 in the processing apparatus forms a magnetic field region 4 by first magnetic elements 5 and second magnetic elements 6 spaced apart along a first direction, and the connecting shaft 3 extends along a second direction and is at least partially located within the magnetic field region 4. This design makes the magnetic field distribution controllable and the region stable; the rotating connecting shaft 3 cuts magnetic field lines and interacts with the magnetic field to affect the movement of the processing part 1, providing more means for processing adjustment; for the processing of brittle materials, it can reduce stress concentration, improve surface quality, and enhance processing stability, which can meet the requirements of high-precision processing and improve production efficiency and product quality.

[0073] See Figure 7 As shown in the figure, this application embodiment also provides a processing method using the aforementioned processing apparatus, comprising: S1. Obtain the material of the workpiece 13 to be processed and the target processing quality parameter data corresponding to the material; For example, a quantitative relationship can be established between the target machining quality (surface roughness Sa, subsurface damage depth SSD) and magnetic field parameters (magnetic induction intensity B), and key grinding process parameters (grinding depth ap, workpiece feed rate Vw, grinding wheel linear speed Vs) of a workpiece 13 made of a specific brittle material. This relationship can be obtained by designing multi-factor orthogonal experiments or response surface experiments, measuring Sa and SSD under different combinations of (B, ap, Vw), establishing a predictive model through regression analysis, and plotting the "process safety window" that meets the target quality requirements. Optionally, the brittle material can be calcium fluoride or silicon, etc.

[0074] S2. Generate magnetic field parameters and processing parameters for processing the workpiece 13 based on the target processing quality parameter data; For example, the core optimization objective of this grinding process can be set (e.g., maximizing the material removal rate MRR under the constraints of Sa ≤ [target value] and SSD ≤ [target value]), and the optimal or suboptimal combination of magnetic induction intensity B_opt, grinding depth ap_opt, feed rate Vw_opt and grinding wheel linear speed Vs_opt can be solved based on the model established by S1.

[0075] S3. Based on the magnetic field parameters and processing parameters, control the processing device to process the workpiece 13 to be processed within the magnetic field region 4.

[0076] It is understandable that the subject executing the above method can be a processor or a device that includes a processor, such as a PLC control system.

[0077] In the above technical solution, this method can generate corresponding magnetic field parameters and processing parameters according to the different materials of the workpiece 13 to be processed, thus it can be applied to the processing of workpieces of various materials. Whether it is brittle crystals, ceramics, glass or composite materials, high-quality processing can be achieved by adjusting the parameters, expanding the application range of the processing device. This method can generate personalized parameters according to these different requirements, thereby meeting diverse processing needs.

[0078] See Figure 8 As shown, the target processing quality parameter data includes a surface roughness threshold and a subsurface damage depth threshold; Based on the target machining quality parameter data, magnetic field parameters and machining parameters for machining the workpiece 13 to be processed are generated; including: S21. Determine the surface roughness of the workpiece 13 to be processed based on the surface roughness threshold; S22. Determine the subsurface damage depth for machining the workpiece 13 based on the subsurface damage depth threshold; S23. When the surface roughness is less than or equal to the surface roughness threshold and / or the subsurface damage depth is less than or equal to the subsurface damage depth threshold, maximize the material removal rate to generate the magnetic field parameters and processing parameters of the workpiece 13 to be processed.

[0079] In the above technical solution, by maximizing the material removal rate while meeting the requirements of surface roughness and subsurface damage depth, the processing time can be significantly shortened and the output per unit time can be increased.

[0080] Furthermore, the processing device includes a machine tool; the magnetic field parameters include magnetic induction intensity; the processing parameters include the grinding depth of the workpiece 13 to be processed, the feed speed of the workpiece 13 to be processed, and the rotational speed of the processing section.

[0081] In the above technical solution, by determining the actual surface roughness of the machined surface based on the surface roughness threshold and strictly controlling it during the parameter generation process, it is possible to ensure that the surface roughness of the machined workpiece meets the design requirements, thereby improving the appearance quality and performance of the workpiece.

[0082] The actual subsurface damage depth is determined by the subsurface damage depth threshold, and controlled by optimizing magnetic field parameters and processing parameters. This can effectively reduce subsurface damage such as microcracks and residual stress generated during processing, thereby improving the mechanical properties and fatigue life of the workpiece.

[0083] This method is based on clearly defined target processing quality parameter data. Through scientific experiments and analysis, it generates magnetic field parameters and processing parameters, reduces interference from human factors, and makes the processing process more stable and controllable.

[0084] Furthermore, S3. Based on the magnetic field parameters and processing parameters, control the processing device to process the workpiece 13 within the magnetic field region 4; including: S31. Acquire acoustic emission signal data of the workpiece 13 to be processed and vibration acceleration signal data of the connecting shaft 3; During the grinding process, acoustic emission (AE) sensors and high-response acceleration sensors can be used to monitor acoustic emission and spindle 10 vibration acceleration signals in real time to evaluate the effects of magnetoplastic effect and magneto-eddy current damping effect online.

[0085] Acoustic emission (AE) sensors can be mounted near the workpiece 13 or the grinding wheel to monitor stress waves generated by material fracture (brittle removal) and plastic deformation during grinding, in order to assess whether the magnetoplastic effect has adequately enhanced plasticity. The effective value (RMS) or count rate of the AE signal is closely related to the material removal mechanism and damage generation.

[0086] An accelerometer can be installed on a non-rotating part of the spindle 10 (such as the spindle housing) to monitor the vibration acceleration of the spindle 10 system in real time, in order to assess whether the magnetostrictive damping effect provides sufficient damping. Its frequency response range needs to cover the main operating frequencies of the grinding wheel spindle 10 and possible chatter frequencies. Optionally, the accelerometer is a high-response accelerometer.

[0087] For example, the effective value AE_rms is extracted from the original acoustic emission signal data to obtain the acoustic emission signal data of the workpiece 13 to be processed.

[0088] The effective values ​​are extracted from the original vibration acceleration signal data to obtain the vibration acceleration signal data.

[0089] The specific steps are as follows: A Fast Fourier Transform (FFT) was performed on the original vibration acceleration signal data to extract key features, including vibration intensity and vibration characteristic frequency amplitude. Vibration intensity includes the root mean square (RMS) value of vibration acceleration (a_rms) within the main grinding frequency band (e.g., the spindle speed of 10 rpm and its harmonics). Vibration characteristic frequency amplitude includes the amplitude (A_chatter) at a specific frequency (e.g., a frequency that may indicate chatter).

[0090] S32. When the acoustic emission signal data of the workpiece 13 to be processed is greater than the acoustic emission signal threshold, the magnetic field generating device 2 is controlled to adjust the magnetic induction intensity so that the acoustic emission signal data is less than the acoustic emission signal threshold; S33. When the vibration acceleration signal data of the connecting shaft 3 is greater than the vibration acceleration signal threshold, the magnetic field generating device 2 is controlled to adjust the magnetic induction intensity so that the vibration acceleration signal of the connecting shaft 3 is less than the vibration acceleration signal threshold.

[0091] Understandably, the threshold values ​​for acoustic emission signals and vibration acceleration signals can be determined based on the magnetic field parameters and processing parameters. Furthermore, the threshold values ​​for the root mean square (RMS) value of vibration acceleration (a_rms_warn) and the effective value (AE_rms_warn) can be determined based on the magnetic field parameters and processing parameters.

[0092] For example, following the previous example, during the grinding process, (1) if a_rms ≥ a_rms_warn or A_chatter appears and increases, given that the vibration signal in the grinding process inevitably contains high-frequency noise, and the differential term is extremely sensitive to such noise, which can easily lead to unstable control output, this solution abandons the differential term and can adopt a more robust proportional-integral controller. Start the proportional-integral controller and adjust the magnetic induction intensity slightly and continuously to stabilize the vibration level of the system in the optimal range, thereby achieving "on-demand allocation" of the magnetostrictive damping effect and avoiding long-term excessively high magnetic field operation. (2) If AE_rms is significantly and continuously higher than AE_rms_warn, it indicates that the proportion of brittle fracture may increase and the risk of subsurface damage increases. At this time, it is necessary to slightly increase the magnetic induction intensity to enhance the magnetostrictive effect, suppress brittle fracture, and form subsurface damage. This is to ensure that the ultra-precision grinding process proceeds smoothly under optimal conditions.

[0093] See the surface images of workpiece 13 before and after machining. Figure 9 As shown.

[0094] For example, it can be done by Figure 6The control system shown executes the above method. The control system includes a processor, a processing device, an acoustic emission sensor, and an acceleration sensor; the processor is connected to the processing device, the acoustic emission sensor, and the acceleration sensor respectively; the acoustic emission sensor is installed on the processing device and is used to acquire acoustic emission signal data of the workpiece 13 to be processed; the acceleration sensor is installed on the connecting shaft 3 and is used to acquire vibration acceleration signal data of the connecting shaft.

[0095] The above technical solution, by real-time monitoring of acoustic emission signals and timely adjustment of magnetic induction intensity, can take measures to suppress the initiation and propagation of cracks inside the workpiece in the early stages. Monitoring and controlling the vibration acceleration signal of connecting shaft 3 can effectively reduce the impact of vibration on the machining process. Vibration causes changes in the relative position between the tool and the workpiece, thereby affecting machining accuracy and surface roughness. By adjusting the magnetic induction intensity to suppress the vibration of connecting shaft 3, the contact between the tool and the workpiece can be made more stable, improving machining quality.

[0096] This method enables real-time monitoring and timely adjustment of acoustic emission signals and vibration acceleration signals of connecting shaft 3 during the machining process. By continuously feeding back signal information and adjusting the magnetic induction intensity, the machining process can remain stable, reducing machining interruptions and quality fluctuations caused by abnormal conditions.

[0097] Because this method can dynamically adjust based on real-time signal data, it is highly adaptable and can handle different workpiece materials, processing techniques, and equipment conditions. Whether in roughing or finishing, the stability and reliability of the machining process can be ensured by adjusting the magnetic induction intensity.

[0098] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A magnetic field-assisted processing device for brittle materials, characterized in that, include: A processing unit is connected to a connecting shaft; the processing unit is capable of rotating about the axial direction of the connecting shaft to process the workpiece to be processed; And a magnetic field generating device for generating a magnetic field region; The connecting shaft is at least partially located within the magnetic field region, so that in the event of vibration of the connecting shaft, the connecting shaft can cut magnetic field lines within the magnetic field region to impede the vibration; The workpiece to be processed is at least partially located within the magnetic field region, and the processing unit is at least partially located within the magnetic field region; the processing unit is rotatable about the axial direction of the connecting shaft to process the workpiece to be processed within the magnetic field region.

2. The magnetic field-assisted processing device for brittle materials according to claim 1, characterized in that, When the connecting shaft vibrates, one end of the connecting shaft is connected to the processing unit; the deviation of one end of the connecting shaft from the axial direction of the connecting shaft is 10nm-50μm.

3. The magnetic field-assisted processing device for brittle materials according to claim 2, characterized in that, The material of the workpiece to be processed is a brittle material.

4. The magnetic field-assisted processing device for brittle materials according to claim 3, characterized in that, Also includes: The fastener is used to install and fix the workpiece to be processed. And a rotating device; The rotating device is used to connect the processing unit via a connecting shaft, so as to drive the processing unit to rotate axially around the connecting shaft, so as to process the workpiece to be processed within the magnetic field region.

5. The magnetic field-assisted processing apparatus for brittle materials according to any one of claims 1-4, characterized in that, It also includes a machine tool; the fixing member is used to install on the spindle of the machine tool; the feed system of the machine tool drives the spindle to move to adjust the processing position of the workpiece to be processed; the rotating device and the magnetic field generating device are provided on the machine tool.

6. The magnetic field-assisted processing apparatus for brittle materials according to claim 5, characterized in that, The magnetic field generating device includes a first magnetic element and a second magnetic element; the first magnetic element and the second magnetic element are spaced apart along a first direction; the magnetic field region is formed between the first magnetic element and the second magnetic element; the connecting shaft extends along a second direction and is at least partially located within the magnetic field region; the first direction and the second direction intersect.

7. A processing method, employing the magnetic field-assisted processing apparatus for brittle materials as described in any one of claims 1-6, characterized in that, include: Obtain the material of the workpiece to be processed and the target processing quality parameter data corresponding to the material; Based on the target processing quality parameter data, generate the magnetic field parameters and processing parameters for processing the workpiece to be processed; Based on the magnetic field parameters and processing parameters, the processing device is controlled to process the workpiece within the magnetic field region.

8. The processing method according to claim 7, characterized in that, The target processing quality parameter data includes surface roughness threshold and subsurface damage depth threshold; Based on the target machining quality parameter data, magnetic field parameters and machining parameters for machining the workpiece to be processed are generated; including: The surface roughness of the workpiece to be processed is determined based on a surface roughness threshold. The subsurface damage depth of the workpiece to be processed is determined based on the subsurface damage depth threshold. When the surface roughness is less than or equal to the surface roughness threshold and / or the subsurface damage depth is less than or equal to the subsurface damage depth threshold, the material removal rate is maximized to generate the magnetic field parameters and processing parameters of the workpiece to be processed.

9. The processing method according to claim 8, characterized in that, The processing device includes a machine tool; the magnetic field parameters include magnetic induction intensity; the processing parameters include the grinding depth of the workpiece to be processed, the feed speed of the workpiece to be processed, and the rotational speed of the processing unit.

10. The processing method according to claim 9, characterized in that, Based on the magnetic field parameters and processing parameters, the processing device is controlled to process the workpiece within the magnetic field region; including: Acquire acoustic emission signal data of the workpiece to be processed and vibration acceleration signal data of the connecting shaft; If the acoustic emission signal data of the workpiece to be processed is greater than the acoustic emission signal threshold, the magnetic field generating device is controlled to adjust the magnetic induction intensity so that the acoustic emission signal data is less than the acoustic emission signal threshold. If the vibration acceleration signal data of the connecting shaft is greater than the vibration acceleration signal threshold, the magnetic field generating device is controlled to adjust the magnetic induction intensity so that the vibration acceleration signal of the connecting shaft is less than the vibration acceleration signal threshold.

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