Method and device for tearing a flexible conductive film

Abstract

The application provides a film tearing method and device for a flexible conductive film, and the method comprises the following steps: providing a flexible conductive film to be processed, a transfer mechanism and a fixing mechanism; placing the flexible conductive film to be processed on the fixing mechanism to obtain a preliminarily positioned flexible conductive film; preliminarily separating a first film layer of a composite tape of the preliminarily positioned flexible conductive film to form an initial separation zone between the first film layer and a second film layer; performing a complete removal treatment on the first film layer of the composite tape of the preliminarily positioned flexible conductive film, and applying a positioning constraint to the second film layer to obtain a flexible conductive film from which the first film layer is removed; performing a second film layer removal treatment on the flexible conductive film from which the first film layer is removed to obtain a flexible conductive film from which the second film layer is removed; and correcting the position of a conductive substrate of the flexible conductive film from which the second film layer is removed in the fixing mechanism to obtain a flexible conductive film after film tearing. The scheme improves the efficiency and quality of flexible conductive film transfer.

Description

Technical Field

[0001] This invention relates to the field of flexible conductive film manufacturing technology, and in particular to a method and apparatus for peeling off a flexible conductive film. Background Technology

[0002] In the fabrication process of flexible conductive films, to protect their surface properties during complex storage and multi-process transfers, it is common practice to bond the pre-formed flexible conductive film with a dedicated protective film strip (such as release film or protective film) for intermediate product storage and transportation. This step is a critical node connecting the preceding molding process with the subsequent testing, packaging, or assembly processes. The existing standard process typically involves: after completing the main fabrication steps, operators manually bond the flexible conductive film to the film strip and place them one by one on a tray serving as a temporary carrier, forming an orderly stack; when the next process is required, the flexible conductive film is removed from the tray, the film strip is manually peeled off, and finally the exposed film is transferred to a dedicated carrier or directly into the subsequent production line. This model is applicable in the early stages of industry development or in small-batch production, but its technological state has long remained at a stage reliant on human experience and repetitive manual operations, with low levels of automation and standardization.

[0003] However, with the rapid miniaturization and high-density development of electronic products, the market has placed extremely stringent demands on the production efficiency, cost control, and quality consistency of flexible conductive films. The existing technological approaches mentioned above have revealed increasingly serious limitations. First, the contradiction between production efficiency and economies of scale is prominent. The slow speed of manual tray placement and film peeling operations has become a significant bottleneck in the entire production process, making it difficult to match the high-speed pace of modern production lines and severely restricting capacity ramp-up and the realization of economies of scale. Second, the risk of product damage is high and quality fluctuates greatly. Manual operation inevitably involves uneven force and improper angles. During the film peeling process, the fragile film substrate is easily wrinkled or micro-cracked due to electrostatic adsorption or mechanical scratching, resulting in poor product yield. In particular, the antistatic properties of traditional film tapes are insufficient; the static charge accumulated during peeling often causes the substrate to be accidentally adsorbed and lifted before falling, causing hidden damage. Third, logistics and storage costs remain high. Pallets, as general temporary carriers, are not structurally optimized for specific-sized flexible conductive films, resulting in low space utilization and limited loading capacity per unit volume. This not only increases storage space usage but also significantly raises transportation costs for products moving within and outside the factory. Finally, process repeatability and traceability are poor. The quality of manual operations highly depends on the skills and condition of the operators. The lack of standardized process parameters and objective monitoring leads to variations in processing status between different batches and even within the same batch, posing a risk to the stability of subsequent processes and hindering accurate traceability, analysis, and optimization of production data. Summary of the Invention

[0004] This invention provides a method and apparatus for peeling flexible conductive films, which solves the problems of low preparation efficiency, high transportation costs, and easy electrostatic adsorption leading to product damage in flexible conductive films.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows: This invention provides a method for peeling off a flexible conductive film, comprising: A flexible conductive film to be processed is provided, the flexible conductive film to be processed includes a conductive substrate and a composite strip bonded to the conductive substrate, the composite strip includes a first film layer and a second film layer; A transfer mechanism and a fixing mechanism are provided, wherein the transfer mechanism is positioned within the fixing mechanism; The flexible conductive film to be processed is placed on the transfer mechanism, and the conductive substrate is positioned at a preset position of the transfer mechanism to obtain a pre-positioned flexible conductive film. The first film layer of the composite strip of the pre-positioned flexible conductive film is subjected to a preliminary separation process to form an initial separation zone between the first film layer and the second film layer; Based on the initial separation zone, the first film layer of the composite strip of the pre-positioned flexible conductive film is completely removed, and the second film layer is subjected to positioning constraints to obtain a flexible conductive film with the first film layer removed. The flexible conductive film with the first film layer removed is subjected to a second film layer removal process to obtain a flexible conductive film with the second film layer removed. The position of the conductive substrate of the flexible conductive film with the second film layer removed is corrected within the transfer mechanism to obtain the flexible conductive film after film removal.

[0006] Optionally, the composite strip includes: The first and second film layers are stacked sequentially, wherein, The first film layer is a silicone layer, and the silicone layer is bonded to the first surface of the second film layer; The second film layer is an antistatic release layer, which is a polymer film, and the second surface of the polymer film is bonded to the conductive substrate.

[0007] Optional, providing transit and fixed facilities, including: A pallet with multiple regularly arranged positioning slots is provided as the transfer mechanism; The fixing mechanism provides a positioning structure that matches the shape of the pallet; The pallet is embedded into the positioning structure of the fixing mechanism to obtain the transfer mechanism with a fixed position.

[0008] Optionally, the flexible conductive film to be processed is placed on the transfer mechanism, and the conductive substrate is positioned at a preset position of the transfer mechanism to obtain a pre-positioned flexible conductive film, including: The positioning edge of the composite strip is positioned to obtain the first coordinate data of the outer edge positioning edge of the composite strip; The border of the transfer mechanism is positioned to obtain the second coordinate data of the border of the transfer mechanism; Based on the first coordinate data and the second coordinate data, the positioning edge is aligned with the frame to obtain a preliminarily positioned flexible conductive film.

[0009] Optionally, the first layer of the composite strip of the pre-positioned flexible conductive film is subjected to a preliminary separation process to form an initial separation zone between the first and second film layers, including: Insert the clamping tool into the pre-set tearing position of the composite strip; Control the clamping tool at a preset angle Peel off the first film layer, at the preset angle satisfy: ; The first membrane layer is peeled off until a preset separation length is reached to form the initial separation zone, wherein the preset separation length satisfies the following relationship: ; in, For the preset separation length, This represents the actual contact area between the first and second film layers. The peel energy density coefficient is determined based on the composite strip material and thickness. This is the length scaling factor. This is the area impact index, with values ​​ranging from 0.3 to 0.7. The stripping energy coupling coefficient ranges from 0.05 to 0.3. This is the process allowance constant.

[0010] Optionally, based on the initial separation region, the first film layer of the composite strip of the initially positioned flexible conductive film is completely removed, and a positioning constraint is applied to the second film layer to obtain a flexible conductive film with the first film layer removed, including: The first membrane layer is held at the separated end in the initial separation zone by the first operating part of the clamping tool; A first positioning pressure is applied to the second membrane layer in the region near the initial separation zone by the second operating part of the clamping tool; The first operating unit moves along the first direction to continuously peel off the first film layer, while the second operating unit moves synchronously along the first direction and maintains the application of a second positioning pressure to the second film layer until the first film layer is completely removed. Wherein, the second positioning pressure is not less than the first positioning pressure.

[0011] Optionally, the flexible conductive film with the first film layer removed is subjected to a second film layer removal process to obtain a flexible conductive film with the second film layer removed, including: Insert a clamping tool into the preset force application area on the transfer mechanism, and use the clamping tool to lift the edge of the second film layer; The entire second film layer is removed at a constant or variable speed, and the displacement data of the conductive substrate is corrected to obtain a product with the second film layer removed.

[0012] Optionally, the position of the conductive substrate of the flexible conductive film with the second film layer removed within the transfer mechanism is corrected to obtain the flexible conductive film, including: Obtain an image of the current position of the conductive substrate within the transfer mechanism; The current position image is compared with a preset standard position image to obtain position deviation data; If the magnitude of the position deviation data is greater than a preset tolerance threshold, an adjustment instruction is generated based on the position deviation data. The adjustment command is executed to apply an adjustment force to the conductive substrate, correcting its position to within the preset tolerance threshold range, thereby obtaining a flexible conductive film.

[0013] Optionally, the method for peeling off the flexible conductive film further includes: Based on the film-peeling process parameters, the quality assessment index of the flexible conductive film is determined. The formula for calculating the quality assessment index of the flexible conductive film is: ; in, This refers to the actual film-tearing angle. This is the optimal film-tearing angle reference value; This is the actual separation length. Preset separation length; The magnitude of the positional deviation. The preset tolerance threshold; These are the normalized weighting coefficients, and ; To prevent extremely small positive numbers with a logarithm of zero, It is a non-linear adjustment factor. The deviation softening coefficient; when the quality assessment index When the result exceeds the preset qualified threshold, the quality result of the flexible conductive film is obtained.

[0014] This invention also provides a film-peeling device for a flexible conductive film, which applies the above-described film-peeling method for a flexible conductive film, including: The fixing mechanism is provided with a tray slot; The transfer mechanism is installed in the pallet slot, and the transfer mechanism is provided with multiple positioning slots. The shape of the transfer mechanism matches the pallet slot. An image acquisition unit is installed above the fixing mechanism, and the image acquisition unit acquires image data of the fixing mechanism and the tray in real time. The feeding mechanism and clamping mechanism are arranged above the transfer mechanism, and an operating area is formed between the feeding mechanism, clamping mechanism and transfer mechanism. The feeding mechanism and clamping mechanism reciprocate within the operating area. A controller electrically connected to the feeding mechanism, clamping mechanism, and image acquisition unit controls the feeding mechanism to place the flexible conductive film to be processed onto the transfer mechanism based on image data acquired by the image acquisition unit, positioning the conductive substrate at a preset position on the transfer mechanism to obtain a pre-positioned flexible conductive film. The controller then controls the clamping mechanism to perform preliminary separation processing on the first film layer of the composite strip of the pre-positioned flexible conductive film, forming an initial separation zone between the first and second film layers. Based on the initial separation zone, the first film layer of the composite strip of the pre-positioned flexible conductive film is completely removed, and a positioning constraint is applied to the second film layer to obtain a flexible conductive film with the first film layer removed. The second film layer is then removed from the flexible conductive film with the first film layer removed to obtain a flexible conductive film with the second film layer removed. Finally, the position of the conductive substrate of the flexible conductive film with the second film layer removed within the transfer mechanism is corrected to obtain a flexible conductive film after film removal.

[0015] The technical solution of the present invention has at least the following effects: The above-described solution of the present invention provides a flexible conductive film to be processed, the flexible conductive film to be processed comprising a conductive substrate and a composite strip adhered to the conductive substrate, the composite strip comprising a first film layer and a second film layer; provides a transfer mechanism and a fixing mechanism, the transfer mechanism being positioned within the fixing mechanism; the flexible conductive film to be processed is placed on the transfer mechanism, so that the conductive substrate is positioned at a preset position of the transfer mechanism, thereby obtaining a pre-positioned flexible conductive film; the first film layer of the composite strip of the pre-positioned flexible conductive film is subjected to a preliminary separation process, forming an initial separation zone between the first film layer and the second film layer. Based on the initial separation zone, the first film layer of the composite strip of the pre-positioned flexible conductive film is completely removed, and a positioning constraint is applied to the second film layer to obtain a flexible conductive film with the first film layer removed. The flexible conductive film with the first film layer removed is then subjected to a second film layer removal process to obtain a flexible conductive film with the second film layer removed. The position of the conductive substrate of the flexible conductive film with the second film layer removed is corrected within the transfer mechanism to obtain a flexible conductive film after film removal. This process improves the efficiency of flexible conductive film preparation, reduces transportation costs, avoids electrostatic adsorption, and ensures product positioning accuracy. Attached Figure Description

[0016] Figure 1 This is a flowchart of the film-peeling method for the flexible conductive film provided in the embodiments of the present invention; Figure 2 This is a schematic diagram of the structure of the film-peeling device for the flexible conductive film provided in an embodiment of the present invention; The components include: 1. Fixing mechanism; 2. Pallet slot; 3. Transfer mechanism; 4. Positioning slot; 5. Image acquisition unit; 6. Feeding mechanism; 7. Controller; 8. First operating part; 9. Second operating part; 10. Clamping end; 11. Pressing end; 12. Positioning hole. Detailed Implementation

[0017] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0018] like Figure 1 As shown, an embodiment of the present invention proposes a method for peeling off a flexible conductive film, which may include: Step 11, providing a flexible conductive film to be processed, the flexible conductive film to be processed includes a conductive substrate and a composite strip bonded to the conductive substrate, the composite strip includes a first film layer and a second film layer; Step 12: Provide a transfer mechanism and a fixing mechanism, wherein the transfer mechanism is positioned within the fixing mechanism; Step 13: Place the flexible conductive film to be processed on the transfer mechanism, so that the conductive substrate is positioned at the preset position of the transfer mechanism, and obtain the initially positioned flexible conductive film. Step 14: Perform preliminary separation treatment on the first film layer of the composite strip of the pre-positioned flexible conductive film to form an initial separation zone between the first film layer and the second film layer; Step 15: Based on the initial separation zone, the first film layer of the composite strip of the preliminarily positioned flexible conductive film is completely removed, and a positioning constraint is applied to the second film layer to obtain a flexible conductive film with the first film layer removed. Step 16: Perform a second film removal process on the flexible conductive film with the first film layer removed to obtain a flexible conductive film with the second film layer removed; Step 17: Correct the position of the conductive substrate of the flexible conductive film with the second film layer removed within the transfer mechanism to obtain the flexible conductive film after film removal.

[0019] In step 11 of this embodiment, the conductive substrate is a flexible conductive film with a thickness of 0.1 mm. The composite strip includes a first film layer and a second film layer superimposed on the first film layer. The second film layer is directly attached to the conductive substrate. Both films are of a preset thickness and are tightly attached without bubbles or wrinkles. In step 12, the transfer mechanism is a tray with multiple positioning slots, and the fixing mechanism is a suitable fixture. The positioning and fixing of the transfer mechanism within the fixing mechanism is achieved by aligning the positioning holes of the tray with the positioning protrusions of the fixture and placing it in. In step 13, the feeding mechanism grabs the edge of the composite strip frame, aligns the edge of the frame with the square frame edge of the tray, and lowers it so that the conductive substrate is accurately inserted into the corresponding positioning groove of the tray. The outer frame of the strip is then gently pressed to confirm that the conductive substrate is stably positioned, thus obtaining a preliminarily positioned flexible conductive film. In step 14, the clamping mechanism extends from the pre-set tearing position of the composite material strip to peel off the first film layer at an angle of 20° to 40° with the film surface. The peeling length is 8mm to 12mm, so that an initial separation zone is formed between the first film layer and the second film layer. In step 15, based on the initial separation zone, the end of the separated first film layer is clamped by the clamping mechanism, while the position of the second film layer near the separation zone is pressed. The clamping mechanism moves at a constant speed away from the tearing hand position to remove the first film layer, while maintaining the positioning constraint on the second film layer, until the first film layer is completely removed, and a flexible conductive film with the first film layer removed is obtained. In step 16, the flexible conductive film with the first film layer removed is subjected to a clamping mechanism that extends from a designated corner of the transfer mechanism to lift the second film layer until the second film layer is completely removed, thus obtaining a flexible conductive film with the second film layer removed. In step 17, the position of the conductive substrate of the flexible conductive film after the second film layer is removed is detected in the positioning groove of the transfer mechanism. If displacement occurs, the clamping mechanism will correct it and restore it to the preset position in the positioning groove, so as to finally obtain the flexible conductive film after the film is peeled off with accurate positioning.

[0020] The technical solution described in this embodiment achieves high efficiency, stability, and precision in the flexible conductive film peeling process by using a composite material strip with double-sided antistatic fluoroplastic release film, a positioning system combining a standardized tray and fixing mechanism, and an automated process flow that includes mechanical gripping, visual positioning, automatic film peeling, and online correction. This effectively reduces the product defect rate caused by improper operation and improves overall production quality and consistency.

[0021] In an optional embodiment of the present invention, the composite strip may include: The first and second film layers are stacked sequentially, wherein, The first film layer is a silicone layer, and the silicone layer is bonded to the first surface of the second film layer; The second film layer is an antistatic release layer, which is a polymer film, and the second surface of the polymer film is bonded to the conductive substrate.

[0022] In this embodiment, the composite tape comprises a first film layer and a second film layer stacked sequentially. The first film layer is a silicone protective film, specifically a green silicone layer with a thickness of 0.05 mm. This silicone layer has an adhesive surface and is directly bonded to the first surface of the second film layer. The second film layer is an antistatic release layer, employing a double-sided antistatic fluoroplastic release film, specifically a blue release film with a thickness of 0.03 mm. This antistatic release layer is composed of a polymer film and possesses excellent antistatic properties, effectively preventing static electricity accumulation and adsorption. The second surface of the antistatic release layer is bonded to the conductive substrate via an adhesive, thereby achieving stable adhesion between the composite tape and the conductive substrate. In this stacked structure, the silicone protective film acts as a buffer layer for the conductive substrate, providing protection; the antistatic release layer, through its antistatic properties, ensures that the flexible conductive film is not lifted by static electricity during the film peeling process, guaranteeing the stability of the separation operation. Furthermore, the composite tape is provided with appropriate open-pore adhesion areas and limiting structures corresponding to the conductive substrate positions to further enhance bonding accuracy and positioning reliability.

[0023] In an optional embodiment of the present invention, step 12, providing a transfer mechanism and a fixing mechanism, may include: Step 121: Provide a pallet with multiple regularly arranged positioning slots as the transfer mechanism; Step 122, providing the fixing mechanism having a positioning structure that matches the shape of the pallet; Step 123: Embed the pallet into the positioning structure of the fixing mechanism to obtain the transfer mechanism with a fixed position.

[0024] In step 121 of this embodiment, the tray is a standardized plastic tray made of ABS material. Its surface has positioning grooves that match the shape and size of the flexible conductive film. Each positioning groove is 50mm long, 30mm wide, and slightly deeper than the film thickness to achieve support and positioning. The positioning grooves are spaced evenly, which enables the tray to achieve dense and stable storage of products. In step 122, the fixing mechanism is an acrylic or metal fixture that is compatible with the tray. Its surface is provided with multiple positioning protrusions. The positions of the positioning protrusions correspond one-to-one with the positioning holes provided on the bottom of the tray. The height of the protrusions matches the depth of the positioning holes, so that the tray can achieve precise horizontal positioning through the hole-protrusion fit. In step 123, the pallet is smoothly lowered after the positioning hole of the pallet is aligned with the positioning protrusion of the fixture by the feeding mechanism until the bottom surface of the pallet is completely in contact with the bearing surface of the fixture. At this time, the pallet is not loose in the fixture, and a fixed transfer mechanism is obtained, so as to keep the pallet from shifting during the subsequent film tearing operation.

[0025] In an optional embodiment of the present invention, step 13, placing the flexible conductive film to be processed on the transfer mechanism, and positioning the conductive substrate at a preset position of the transfer mechanism to obtain a pre-positioned flexible conductive film, may include: Step 131: Position the positioning edge of the composite strip to obtain the first coordinate data of the outer edge positioning edge of the composite strip; Step 132: Position the frame of the transfer mechanism to obtain the second coordinate data of the frame of the transfer mechanism; Step 133: Based on the first coordinate data and the second coordinate data, align the positioning edge with the frame to obtain a preliminarily positioned flexible conductive film.

[0026] In step 131 of this embodiment, the image acquisition unit acquires a top view image of the entire composite strip, the image processing unit identifies and extracts the pixel coordinates of the four corner points of the outer frame of the composite strip, and then converts the pixel coordinates into first coordinate data relative to the mechanical coordinate system through a transformation matrix according to the preset camera calibration parameters. This data represents the precise position and outline of the outer frame of the strip on the horizontal plane. In step 132, the tray fixed in the fixture is scanned by the image acquisition unit to detect the physical position of at least two adjacent sides or four corner points of its square frame, and the detected position information is sent to the controller, which calculates and generates second coordinate data that characterizes the precise position of the tray frame in the mechanical coordinate system. In step 133, the controller calculates the positional deviation between the first coordinate data and the second coordinate data, generates a displacement compensation command, and sends it to the clamping mechanism. The clamping mechanism adjusts the position of the flexible conductive film to be processed held on its end effector according to the command, so that the outer frame edge of the composite strip and the square frame of the tray completely coincide in the horizontal plane. After alignment, the clamping mechanism lowers the product in the vertical direction, so that the conductive substrate accurately falls into the corresponding positioning groove of the tray under gravity and slight pressure, thereby completing the initial positioning.

[0027] In an optional embodiment of the present invention, step 14, which involves performing a preliminary separation process on the first film layer of the composite strip of the preliminarily positioned flexible conductive film to form an initial separation region between the first film layer and the second film layer, may include: Step 141: Insert a clamping tool into the pre-set tearing position of the composite strip; Step 142: Control the clamping tool at a preset angle. Peel off the first film layer, at the preset angle satisfy: ; Step 143: Peel off the first membrane layer until a preset separation length is reached to form the initial separation zone. The preset separation length satisfies the following relationship: ; in, For the preset separation length, This represents the actual contact area between the first and second film layers. The peel energy density coefficient is determined based on the composite strip material and thickness. This is the length scaling factor. This is the area impact index, with values ​​ranging from 0.3 to 0.7. The stripping energy coupling coefficient ranges from 0.05 to 0.3. This is the process allowance constant.

[0028] In step 141 of this embodiment, the clamping mechanism is inserted into the clamping end from the pre-designed tearing position of the composite strip; the tearing position is a pre-designed protrusion structure at one corner of the outer frame of the strip that is not completely bonded to the underlying film layer, and its width is 5mm; when the clamping mechanism moves above the tearing position, it controls its clamping end to approach vertically until it is inserted below the tearing position, at the interface between the first film layer silicone protective film and the second film layer blue antistatic release film. In step 142, the clamping end is controlled at a preset angle. Peel off the first film layer; the preset angle Satisfying the relation That is, the angle between the lifting direction and the normal direction of the plane containing the conductive substrate below is controlled within... to The angle range is achieved by controlling the joint posture of the clamping mechanism. The selection principle is to achieve a balance between avoiding damage to the membrane due to excessive vertical component of separation force caused by too small an angle and avoiding membrane slippage caused by excessive horizontal component of separation force caused by too large an angle, thereby ensuring a smooth start of the initial separation. In step 143, the first membrane layer is peeled off until a preset separation length is reached, forming the initial separation zone; the preset separation length is determined by the following formula: ; in, Preset separation length; This represents the actual contact area between the conductive substrate and the first film adhesion layer. The peel energy density coefficient is determined experimentally based on the material properties and layer thickness of the composite strip, and it reflects the energy required to separate a unit area of ​​film layer. It is a length scaling factor used to map dimensionless exponential terms to actual length scales; The area influence index ranges from 0.3 to 0.7, indicating a power-law relationship between separation length and contact area. The stripping energy coupling coefficient, ranging from 0.05 to 0.3, is used to adjust the stripping energy density. For separation length The intensity of the impact; This is a process margin constant used to compensate for mechanical positioning errors and environmental fluctuations, ensuring that the initial separation zone length is sufficient for reliable gripping by the subsequent clamping mechanism. This formula is based on the principles of adhesion mechanics and energy balance. By controlling the separation length, the peak adhesion force can be overcome with minimal energy input during the initial separation stage, creating a stable starting point for subsequent continuous film peeling.

[0029] In an optional embodiment of the present invention, step 15, based on the initial separation region, involves completely removing the first film layer of the composite strip of the initially positioned flexible conductive film and applying positioning constraints to the second film layer to obtain a flexible conductive film with the first film layer removed. This step may include: Step 151: Hold the separated end of the first film layer at the initial separation zone using the first operating part of the clamping tool; Step 152: Apply a first positioning pressure to the second membrane layer in the region near the initial separation zone through the second operating part of the clamping tool; Step 153: The first operating unit moves along the first direction to continuously peel off the first film layer, while the second operating unit moves synchronously along the first direction and maintains the application of the second positioning pressure to the second film layer until the first film layer is completely removed. Wherein, the second positioning pressure is not less than the first positioning pressure.

[0030] In step 151 of this embodiment, the clamping mechanism includes a first operating part and a second operating part with identical structures and symmetrically arranged. The first operating part has a clamping end at its end, and the second operating part has a pressing end at its end. The first operating part holds the separated end of the first film layer at the initial separation zone. The first operating part moves above the initial separation zone under the drive of the controller and applies a precise clamping force through its clamping end. This force is sufficient to stably clamp the peeled-off end of the green silicone protective film while ensuring that the film material is not damaged. In step 152, the pressing end of the second operating part moves vertically downward under the action of the driving mechanism until it contacts the surface of the second film layer, i.e., the blue antistatic release film, and maintains the first positioning pressure. This pressure value is sufficient to constrain the position of the second film layer in the initial separation stage and prevent it from moving with the first film layer. In step 153, the first operating unit moves along a first direction to continuously peel off the first film layer, while the second operating unit moves synchronously along the first direction and maintains a second positioning pressure applied to the second film layer until the first film layer is completely removed; wherein, the first direction is parallel to the length direction of the composite strip and away from the tearing hand position. During the movement, the clamping end translates along the first direction at a constant speed, pulling the first film layer to peel off continuously; the second operating unit maintains synchronous displacement with the clamping end through an independent servo axis, and its pressing end always covers the area on the second film layer adjacent to the current peeling front edge, and continuously applies a second positioning pressure not less than the first positioning pressure. The second positioning pressure satisfies the following relationship: ; in, As the first positioning pressure, For the second positioning pressure, This represents the real-time adhesion force between the first and second film layers. This represents the effective contact area between the pressure head and the second film layer. This pressure setting ensures that during the peeling process, the second film layer and the underlying conductive substrate are always stably constrained within the positioning groove of the transfer mechanism, without any displacement, thereby achieving the complete and smooth removal of the first film layer.

[0031] In an optional embodiment of the present invention, step 16, which involves removing a second film layer from the flexible conductive film after removing the first film layer to obtain a flexible conductive film with the second film layer removed, may include: Step 161: Insert a clamping tool into the preset force application area on the transfer mechanism, and use the clamping tool to lift the edge of the second film layer; Step 163: Remove the entire second film layer at a uniform or variable speed, and correct the displacement data of the conductive substrate to obtain a product with the second film layer removed.

[0032] In step 161 of this embodiment, a force application area is pre-marked at the corner of the tray. This area is located away from the positioning groove of the conductive substrate. This position design makes the lever arm longer and the torque direction more conducive to reducing the linkage effect on the conductive substrate when applying the lifting force. The clamping mechanism first inserts its clamping end into the second film layer, i.e., the blue antistatic release film, below the edge in a direction perpendicular to the plane of the tray. The insertion depth is controlled between 0.5 mm and 1 mm. Then the tool moves along the horizontal plane. to The trajectory of the included angle moves in the opposite direction, thereby peeling off the edge of the second film layer to form an initial peel section with a height of 2 mm to 5 mm; In step 162, after the initial peeling section is formed, the clamping mechanism moves according to a preset peeling speed curve. This speed curve can be set to a constant value, i.e., uniform peeling, or a variable speed strategy of low speed first and then high speed can be adopted to adapt to the changes in adhesion force in different sections. During the peeling process, the image acquisition unit installed above the fixture acquires images of the conductive substrate in the positioning groove in real time, and calculates the offset of its center coordinates relative to the reference position through image processing algorithms to generate displacement data. When the displacement data exceeds a preset threshold (e.g., 10 micrometers), the control system immediately sends a pause command to the removal tool, and at the same time drives the micro correction push rod located on the side of the tray to fine-tune the conductive substrate, so that it is reset to the center of the positioning groove. The entire peeling and correction process continues until the second film layer is completely peeled off. Finally, the system performs position verification again, and after confirming that the conductive substrate has no offset or damage, it determines that a qualified product with the second film layer removed has been obtained.

[0033] In an optional embodiment of the present invention, step 17, correcting the position of the conductive substrate of the flexible conductive film with the second film layer removed within the transfer mechanism to obtain the flexible conductive film, may include: Step 171: Obtain an image of the current position of the conductive substrate within the transfer mechanism; Step 172: Compare the current position image with a preset standard position image to obtain position deviation data; Step 173: If the magnitude of the position deviation data is greater than a preset tolerance threshold, then an adjustment instruction is generated based on the position deviation data. Step 174: Execute the adjustment command to apply an adjustment force to the conductive substrate, correcting its position to within the preset tolerance threshold range, thereby obtaining a flexible conductive film.

[0034] In step 171 of this embodiment, a top-view image of the conductive substrate located in the positioning groove of the transfer mechanism tray is acquired by an image acquisition unit installed above the fixing mechanism; the image acquisition unit is equipped with a ring light source to eliminate reflections and ensure image clarity; the acquired current position image is transmitted to the controller. In step 172, the controller compares the current position image with a preset standard position image to obtain position deviation data; the standard position image is a reference image when the conductive substrate is completely located in the center of the positioning groove; the controller extracts the contour center coordinates of the conductive substrate in the current position image and compares them with the reference center coordinates stored in the standard position image, and calculates the displacement deviation vector between the two in the plane coordinate system, which is the position deviation data. In step 173, the preset tolerance threshold is set based on the dimensional tolerance of the positioning groove and the conductive substrate. A typical value is 5% of the positioning groove width. That is, when the magnitude of the displacement deviation vector exceeds 1.5 mm, it is determined that correction is required. The adjustment command includes adjusting the direction vector and adjusting the displacement amount, and their relationship is as follows: ; in, This is the position deviation vector. The command displacement vector for the correction mechanism. k It is a proportionality constant and 0 < k ≤1; In step 174, according to the adjustment command, the clamping mechanism gently pushes the edge of the conductive substrate with a contact force of 0.1N to 0.5N, so that it moves along the commanded displacement direction; during the adjustment process, the position image is fed back in real time until the magnitude of the displacement deviation vector is less than the preset tolerance threshold, and the position correction is completed, and a precisely positioned flexible conductive film is obtained.

[0035] In an optional embodiment of the present invention, the method for peeling off the flexible conductive film may further include: Step 181: Based on the film-peeling process parameters, determine the quality assessment index of the flexible conductive film. The formula for calculating the quality assessment index of the flexible conductive film is: ; in, This refers to the actual film-tearing angle. This is the optimal film-tearing angle reference value; This is the actual separation length. Preset separation length; The magnitude of the positional deviation. The preset tolerance threshold; These are the normalized weighting coefficients, and ; To prevent extremely small positive numbers with a logarithm of zero, It is a non-linear adjustment factor. The deviation softening coefficient; when the quality assessment index When the result exceeds the preset qualified threshold, the quality result of the flexible conductive film is obtained.

[0036] In step 181 of this embodiment, after the film-peeling process is completed, the system executes a quality assessment process, the specific implementation of which is as follows: First, process parameters are collected; among them, the actual film-tearing angle is... The clamping mechanism records data in real time and sends it back to the controller. The preset value is determined through material peeling experiments and stored in the system's process parameter database. The actual length of the initial separation zone formed. The measurements are recorded by a high-precision laser displacement sensor mounted on the clamping mechanism.

[0037] Preset separation length It is derived in real time by the system based on its built-in calculation model; Modulus of positional deviation |Calculated by the controller in step 172.

[0038] The preset tolerance threshold δ is set during system initialization based on the mechanical tolerance of the positioning groove of the transfer mechanism and the product accuracy requirements.

[0039] Subsequently, the controller uses the real-time data obtained from the above acquisition and calculation, according to the formula: ; Calculate the quality assessment index Q. In practical implementation, the weighting coefficients... , , The values ​​were set to 0.5, 0.3, and 0.2 respectively to emphasize the primary impact of compliance with film-tearing angle regulations. A very small positive number was added to prevent taking the logarithm of zero. ε The value is 1×10 -7 Nonlinear adjustment factor Based on process validation data, a value of 1.5 is used to adjust the nonlinearity of the effect when the separation length deviates from the theoretical value. Deviation softening coefficient. The value is 0.2, and its function is to adjust the positional deviation. When the value is increased, it smooths out the sharp drop it causes to the evaluation value, making the evaluation results more stable.

[0040] The system will calculate the index Q Compared with the preset qualified threshold Q th Compare. The threshold. Q th It is achieved by statistically analyzing a large number of historical qualified samples. Q The value is an empirical value obtained by subtracting three times the standard deviation from the mean. If Q ≥ Q th If the system determines that the peeling process of the flexible conductive film is qualified, it marks the product as good and allows it to proceed to the next process; if... Q < Q th If the condition is abnormal, an alarm will be triggered and the product will be isolated. At the same time, relevant process parameters will be recorded for subsequent process analysis.

[0041] like Figure 2 As shown, an embodiment of the present invention provides a film-peeling device for a flexible conductive film, which applies the above-described film-peeling method for a flexible conductive film, including: Fixing mechanism 1, wherein a tray slot 2 is provided on the fixing mechanism; The transfer mechanism 3 is installed in the pallet slot 2, and the transfer mechanism 3 is provided with a plurality of positioning slots 4. The shape of the transfer mechanism 3 matches the pallet slot 2. The image acquisition unit 5 is installed above the fixing mechanism, and the image acquisition unit 5 acquires image data of the fixing mechanism 1 and the transfer mechanism 3 in real time. The feeding mechanism 6 and the clamping mechanism are arranged above the transfer mechanism 3. An operating area is formed between the feeding mechanism 6, the clamping mechanism and the transfer mechanism 3. The feeding mechanism 6 and the clamping mechanism reciprocate within the operating area. A controller 7, electrically connected to the feeding mechanism 6, the clamping mechanism, and the image acquisition unit 5, controls the feeding mechanism 6 to place the flexible conductive film to be processed onto the transfer mechanism 3 based on the image data acquired by the image acquisition unit 5, so that the conductive substrate is positioned at a preset position on the transfer mechanism 3, resulting in a pre-positioned flexible conductive film. The controller then controls the clamping mechanism to perform a preliminary separation process on the first film layer of the composite strip of the pre-positioned flexible conductive film, forming an initial separation zone between the first and second film layers. Based on the initial separation zone, the first film layer of the composite strip of the pre-positioned flexible conductive film is completely removed, and a positioning constraint is applied to the second film layer, resulting in a flexible conductive film with the first film layer removed. The second film layer is then removed from the flexible conductive film with the first film layer removed, resulting in a flexible conductive film with the second film layer removed. Finally, the position of the conductive substrate of the flexible conductive film with the second film layer removed is corrected within the transfer mechanism 3, resulting in a flexible conductive film after film removal.

[0042] In this embodiment, the fixing mechanism 1 is a fixture made of acrylic or metal, and its upper surface is provided with a tray slot 2 that precisely matches the shape of the transfer mechanism 3. Positioning protrusions are distributed in the tray slot 2. The transfer mechanism 3 is a standard tray made of ABS material, and its bottom is provided with positioning holes 12 that mate with the positioning protrusions. It is positioned and fixed by fitting into the tray slot 2 through the hole-protrusion fit. The surface of the tray is provided with a plurality of regularly arranged positioning grooves 4. The size of each positioning groove 4 matches the outer dimensions of the flexible conductive film, preferably 50mm in length and 30mm in width.

[0043] The image acquisition unit 5 includes an industrial camera and a ring light source mounted above the fixing mechanism 1, used to acquire top-view image data of the fixing mechanism 1 and the tray in real time. The loading mechanism 6 is a multi-axis robot with a vacuum suction cup or flexible gripper at its end. The clamping mechanism is located above the transfer mechanism 3 and includes a first operating part 8 and a second operating part 9 with identical structures and symmetrical arrangement. The first operating part 8 has a clamping end 10 at its end, and the second operating part 9 has a pressing end 11 at its end. An operating area is formed between the loading mechanism 6, the clamping mechanism, and the transfer mechanism 3. The loading mechanism 6 and the clamping mechanism can reciprocate within the operating area under the drive of the controller 7.

[0044] The first operating unit 8 is a mechanical gripper with force feedback, used for clamping and pulling the film layer. The second operating unit 9 is a pressing mechanism with a flattening pressure head, used for applying positioning pressure. The controller 7 is electrically connected to the image acquisition unit 5, the feeding mechanism 6, and the clamping mechanism.

[0045] The controller 7 executes the following control flow: First, based on the image data acquired by the image acquisition unit 5, it identifies the position of the outer frame of the composite strip and the edge of the tray, controls the feeding mechanism 6 to place the flexible conductive film to be processed on the tray, and makes the conductive substrate snap into the positioning groove 4, completing the initial positioning. Then, it controls the first operating unit 8 to peel off the first film layer from the strip tearing position at an angle of 20 to 40 degrees, forming an initial separation zone with a length equal to the theoretical separation length. Based on the initial separation zone, the controller 7 coordinates the first operating unit 8 to continuously peel off the first film layer, while controlling the second operating unit 9 to move synchronously and apply positioning pressure to the second film layer until the first film layer is completely removed. Next, it controls the first operating unit 8 to peel off and remove the second film layer from the preset force application area on the tray. Finally, the controller 7 judges the position deviation of the conductive substrate based on the image data. If the deviation exceeds the tolerance threshold, it drives the clamping mechanism to adjust the position, ultimately obtaining a precisely positioned flexible conductive film after peeling.

[0046] The technical solution proposed in this invention achieves full automation and precise control of the film-tearing process, significantly improving work efficiency and product yield, effectively eliminating electrostatic adsorption and product displacement problems, and greatly improving space utilization and transportation economy through standardized transfer mechanisms, making it suitable for large-scale production needs.

[0047] The above are preferred embodiments of the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for peeling off a flexible conductive film, characterized in that, include: A flexible conductive film to be processed is provided, the flexible conductive film to be processed includes a conductive substrate and a composite strip bonded to the conductive substrate, the composite strip includes a first film layer and a second film layer; A transfer mechanism and a fixing mechanism are provided, wherein the transfer mechanism is positioned within the fixing mechanism; The flexible conductive film to be processed is placed on the transfer mechanism, and the conductive substrate is positioned at a preset position of the transfer mechanism to obtain a pre-positioned flexible conductive film. The first film layer of the composite strip of the pre-positioned flexible conductive film is subjected to a preliminary separation process to form an initial separation zone between the first film layer and the second film layer; Based on the initial separation zone, the first film layer of the composite strip of the pre-positioned flexible conductive film is completely removed, and the second film layer is subjected to positioning constraints to obtain a flexible conductive film with the first film layer removed. The flexible conductive film with the first film layer removed is subjected to a second film layer removal process to obtain a flexible conductive film with the second film layer removed. The position of the conductive substrate of the flexible conductive film with the second film layer removed is corrected within the transfer mechanism to obtain the flexible conductive film after film removal.

2. The method for peeling off the flexible conductive film according to claim 1, characterized in that, The composite strip includes: The first and second film layers are stacked sequentially, wherein, The first film layer is a silicone layer, and the silicone layer is bonded to the first surface of the second film layer; The second film layer is an antistatic release layer, which is a polymer film, and the second surface of the polymer film is bonded to the conductive substrate.

3. The method for peeling off the flexible conductive film according to claim 1, characterized in that, Provide transit and fixed facilities, including: A pallet with multiple regularly arranged positioning slots is provided as the transfer mechanism; The fixing mechanism provides a positioning structure that matches the shape of the pallet; The pallet is embedded into the positioning structure of the fixing mechanism to obtain the transfer mechanism with a fixed position.

4. The method for peeling off the flexible conductive film according to claim 1, characterized in that, The flexible conductive film to be processed is placed on the transfer mechanism, and the conductive substrate is positioned at a preset position of the transfer mechanism to obtain a pre-positioned flexible conductive film, including: The positioning edge of the composite strip is positioned to obtain the first coordinate data of the outer edge positioning edge of the composite strip; The border of the transfer mechanism is positioned to obtain the second coordinate data of the border of the transfer mechanism; Based on the first coordinate data and the second coordinate data, the positioning edge is aligned with the frame to obtain a preliminarily positioned flexible conductive film.

5. The method for peeling off the flexible conductive film according to claim 1, characterized in that, The first layer of the composite strip of the pre-positioned flexible conductive film is subjected to a preliminary separation process to form an initial separation zone between the first and second film layers, including: Insert the clamping tool into the pre-set tearing position of the composite strip; Control the clamping tool at a preset angle Peel off the first film layer, at the preset angle satisfy: ; The first membrane layer is peeled off until a preset separation length is reached to form the initial separation zone, wherein the preset separation length satisfies the following relationship: ； in, For the preset separation length, This represents the actual contact area between the first and second film layers. The peel energy density coefficient is determined based on the composite strip material and thickness. This is the length scaling factor. This is the area impact index, with values ​​ranging from 0.3 to 0.

7. The stripping energy coupling coefficient ranges from 0.05 to 0.

3. This is the process allowance constant.

6. The method for peeling off the flexible conductive film according to claim 5, characterized in that, Based on the initial separation region, the first film layer of the composite strip of the initially positioned flexible conductive film is completely removed, and a positioning constraint is applied to the second film layer to obtain a flexible conductive film with the first film layer removed, including: The first membrane layer is held at the separated end in the initial separation zone by the first operating part of the clamping tool; A first positioning pressure is applied to the second membrane layer in the region near the initial separation zone by the second operating part of the clamping tool; The first operating unit moves along the first direction to continuously peel off the first film layer, while the second operating unit moves synchronously along the first direction and maintains the application of a second positioning pressure to the second film layer until the first film layer is completely removed. Wherein, the second positioning pressure is not less than the first positioning pressure.

7. The method for peeling off the flexible conductive film according to claim 6, characterized in that, The process of removing a second film layer from the flexible conductive film after removing the first film layer is performed to obtain a flexible conductive film with the second film layer removed, including: Insert a clamping tool into the preset force application area on the transfer mechanism, and use the clamping tool to lift the edge of the second film layer; The entire second film layer is removed at a constant or variable speed, and the displacement data of the conductive substrate is corrected to obtain a product with the second film layer removed.

8. The method for peeling off the flexible conductive film according to claim 1, characterized in that, The position of the conductive substrate of the flexible conductive film with the second film layer removed is corrected within the transfer mechanism to obtain a flexible conductive film, comprising: Obtain an image of the current position of the conductive substrate within the transfer mechanism; The current position image is compared with a preset standard position image to obtain position deviation data; If the magnitude of the position deviation data is greater than a preset tolerance threshold, an adjustment instruction is generated based on the position deviation data. The adjustment command is executed to apply an adjustment force to the conductive substrate, correcting its position to within the preset tolerance threshold range, thereby obtaining a flexible conductive film.

9. The method for peeling off the flexible conductive film according to any one of claims 1 to 8, characterized in that, Also includes: Based on the film-peeling process parameters, the quality assessment index of the flexible conductive film is determined. The formula for calculating the quality assessment index of the flexible conductive film is: ； in, This refers to the actual film-tearing angle. This is the optimal film-tearing angle reference value; This is the actual separation length. Preset separation length; The magnitude of the positional deviation. The preset tolerance threshold; These are the normalized weighting coefficients, and ; To prevent extremely small positive numbers with a logarithm of zero, It is a non-linear adjustment factor. The deviation softening coefficient; when the quality assessment index When the result exceeds the preset qualified threshold, the quality result of the flexible conductive film is obtained.

10. A film-peeling device for a flexible conductive film, characterized in that, The method for peeling off the flexible conductive film according to any one of claims 1 to 9 includes: A fixing mechanism (1) is provided with a tray slot (2); The transfer mechanism (3) is provided in the pallet slot (2), and the transfer mechanism (3) is provided with multiple positioning slots (4). The shape of the transfer mechanism (3) matches the pallet slot (2). An image acquisition unit (5) is installed above the fixed mechanism (1), and the image acquisition unit (5) acquires image data of the fixed mechanism (1) and the transfer mechanism (3) in real time; The feeding mechanism (6) and the clamping mechanism are arranged above the transfer mechanism (3). An operating area is formed between the feeding mechanism (6), the clamping mechanism and the transfer mechanism (3). The feeding mechanism (6) and the clamping mechanism reciprocate within the operating area. A controller (7) electrically connected to the feeding mechanism (6), the clamping mechanism, and the image acquisition unit (5) controls the feeding mechanism (6) to place the flexible conductive film to be processed onto the transfer mechanism (3) based on the image data acquired by the image acquisition unit (5), so that the conductive substrate is positioned at a preset position of the transfer mechanism (3) to obtain a pre-positioned flexible conductive film; then, the clamping mechanism is controlled to perform a preliminary separation process on the first film layer of the composite strip of the pre-positioned flexible conductive film to form an initial separation zone between the first film layer and the second film layer; based on the initial separation zone, the first film layer of the composite strip of the pre-positioned flexible conductive film is completely removed, and a positioning constraint is applied to the second film layer to obtain a flexible conductive film with the first film layer removed; the second film layer is removed from the flexible conductive film with the first film layer removed to obtain a flexible conductive film with the second film layer removed; the position state of the conductive substrate of the flexible conductive film with the second film layer removed is corrected in the transfer mechanism to obtain a flexible conductive film after film removal.

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