Method for transferring a two-dimensional material film
By coating and curing photoresist on the surface of a two-dimensional material thin film as a transfer medium, and utilizing its low melting point to soften at low temperatures, conformal contact between the two-dimensional material thin film and the target substrate is achieved. This solves the problem of damage to the two-dimensional material thin film during the transfer process on a rough substrate, and improves conductivity and transfer efficiency.
CN122144786APending Publication Date: 2026-06-05BEIJING GRAPHENE INST +2
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING GRAPHENE INST
- Filing Date
- 2024-12-05
- Publication Date
- 2026-06-05
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Figure CN122144786A_ABST
Abstract
The application discloses a transfer method of a two-dimensional material film, which comprises the following steps: coating photoresist on the surface of a two-dimensional material film directly grown on a growth substrate and solidifying the photoresist to form a transfer medium layer; separating the growth substrate from the transfer medium layer / two-dimensional material film; after the transfer medium layer / two-dimensional material film is attached to a target substrate, heating is performed to melt the transfer medium layer; and the transfer medium layer is removed. The transfer method of the application utilizes the characteristic that the photoresist can be softened at a low melting point after being solidified, and firstly solidifies the photoresist on the surface of the two-dimensional material film to be transferred to serve as a support medium for the transfer of the film, so that the transfer of the film is realized. After being transferred to the target substrate, the solidified photoresist can be softened, so that the transferred two-dimensional material film can be fully contacted with the target substrate, and the complete and intact transfer of the two-dimensional material film can be realized. The transfer method of the application is especially suitable for the transfer to a rough target substrate.
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