Electronic component

By controlling the Mn concentration distribution in the electrode layer inside the electronic component, especially with the concentration on the central side being higher than that on the end side, and by setting steep and balanced regions, the problem of interface cracks between the electrode layer and the insulation layer under high temperature and high humidity conditions was solved, thereby achieving improved strength and oxidation suppression of the electrode layer and the insulation layer.

CN122158342APending Publication Date: 2026-06-05TDK CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TDK CORP
Filing Date
2025-12-01
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

In high-temperature and high-humidity environments, cracks are easily generated at the interface between the insulation layer and the electrode layer of electronic components, and existing technologies are unable to effectively suppress this problem.

Method used

By controlling the Mn concentration distribution in the electrode layer inside the main body of the component, the concentration on the central side is higher than that on the end side. Steep and balanced regions are set in the electrode layer to improve the bonding strength between the electrode layer and the insulating layer and suppress the oxidation of the electrode ends.

Benefits of technology

Under high temperature and high humidity conditions, it significantly suppressed the generation of cracks at the interface between the electrode layer and the insulating layer, thereby improving the reliability and durability of electronic components.

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Abstract

Provided is an electronic component capable of suppressing the generation of cracks in a high-temperature, high-humidity environment. The electronic component has an element main body that has an insulating layer and an electrode layer inside. The central-side concentration of Mn in a central region of the electrode layer near the center of the element main body is higher than the end-side concentration of Mn in a terminal region of the electrode layer near the end surface of the element main body.
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