A chip package device and a chip stack package method thereof

Abstract

The application discloses a chip packaging device and a chip stack packaging method thereof, and is applied to the technical field of chip packaging, and comprises a rack, a feeding mechanism, a packaging mechanism, a transfer mechanism, a cooling mechanism, a discharging mechanism and a control instrument, the feeding mechanism, the packaging mechanism, the transfer mechanism, the cooling mechanism and the discharging mechanism are sequentially arranged on the rack in a counterclockwise manner, and the control instrument is installed on the top of the rack through a universal arm; the packaging mechanism comprises a supporting frame, a clamping seat, a driving assembly, a plurality of injection molding boxes, a plurality of injection molding heads and a heat preservation assembly, the driving assembly is arranged on the top of the supporting frame, the driving assembly comprises a supporting seat two, a cylinder one and a base, the injection molding box comprises a temporary storage box, two groups of discharge ports one, two groups of feeding ports, two groups of circulating material ports one, a plurality of telescopic rods and two groups of push plates, and the application can improve the forming quality and reliability of the stack chip packaging which is sensitive to thermal stress.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, specifically to a chip packaging device and a chip stacking packaging method thereof. Background Technology

[0002] Traditional chip packaging structures typically involve directly mounting the chip on a planar substrate and then providing external protection. This packaging density is limited by the two-dimensional layout, the signal transmission path is relatively long, and the overall structure is susceptible to interference from external environmental factors. Consequently, it is difficult to meet the increasingly demanding requirements of high-performance electronic devices in terms of integration, signal integrity, and long-term reliability.

[0003] To overcome these limitations, chip stacking and packaging technology has emerged as a key path to achieving three-dimensional high-density integration. This technology effectively shortens interconnection distances and improves system performance by integrating multiple chips vertically. In this technological system, the injection molding packaging process is crucial for ensuring the integrity and long-term reliability of the stacked structure.

[0004] However, in traditional stacked packaging injection molding, injection temperature control has become a major bottleneck restricting the yield and performance of stacked packaging. If the injection temperature is too low, the packaging material will not melt sufficiently and will have excessively high viscosity. Its flowability within the complex three-dimensional cavity formed by the stacked chips and the cut-out carrier will decrease significantly, easily leading to incomplete filling and voids forming between chips or layers. This not only weakens the mechanical protection but also introduces the hidden dangers of uneven heat dissipation and local stress concentration. On the other hand, poor temperature uniformity control will directly aggravate thermomechanical stress. During the material curing process, asynchronous shrinkage caused by temperature gradients will generate significant residual stress at the interface of heterogeneous materials, thereby inducing interface delamination, chip warping, and even hidden cracks, seriously damaging the reliability of the packaging structure.

[0005] Therefore, it is necessary to provide a chip packaging device and a chip stacking packaging method thereof to solve the above problems. Summary of the Invention

[0006] The purpose of this invention is to provide a chip packaging device that can improve the molding quality and reliability of thermal stress-sensitive stacked chip packaging, thereby solving the problems mentioned in the background art.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a chip packaging device, including a frame, a loading mechanism, a packaging mechanism, a transfer mechanism, a cooling mechanism, a unloading mechanism, and a controller. The loading mechanism, packaging mechanism, transfer mechanism, cooling mechanism, and unloading mechanism are arranged in a counterclockwise order on the frame. The distance between the transfer mechanism and the cooling mechanism is the same as the distance between the cooling mechanism and the unloading mechanism. The controller is mounted on the top of the frame via a universal arm. The packaging mechanism includes a support frame, a clamp, a drive assembly, an injection box, several injection heads, and a heat preservation assembly. The drive assembly is located on the top of the support frame and includes a second support base, a first cylinder, and a base. The injection box includes a temporary storage box, two sets of discharge ports, two sets of inlet ports, two sets of circulating material ports, several telescopic rods, and two sets of push plates. The temporary storage box is fixedly connected to two sets of guide posts. The two ends of the two sets of push plates are sleeved on the two sets of guide posts. The push plates are set parallel to the long side of the temporary storage box. The width of the push plates is greater than the inner diameter of the feed port and the first circulation port. The push plates are slidably connected to the inside of the temporary storage box, so that the two sets of push plates and the temporary storage box respectively form two injection plastic storage areas. The two sets of discharge ports are located in the temporary storage areas respectively. According to the above technical solution, the feeding mechanism includes a material platform, a dual-axis moving seat one, a dual-axis moving seat two, and a camera. A support seat one is provided above the material platform. The material platform and the support seat one are fixed to the top of the frame. A clamp one is fixed to the top of the support seat one. The top of the support base one, away from the feeding mechanism, is fixedly connected to the support plate one. The dual-axis moving base one and the dual-axis moving base two are both fixed on the support plate one on the side close to the feeding mechanism. The clamp two is set below the dual-axis moving base one, and the clamp three is set below the dual-axis moving base two. A support block is fixedly connected to the side of the support plate near the unloading mechanism. The support block is located above the dual-axis moving seat. The camera is fixed to the bottom of the support block.

[0008] According to the above technical solution, the support frame is fixed on the machine frame, and a single-axis movable seat is fixedly connected to the lower top of the support frame. The single-axis movable seat is set on the top of the support frame, and the clamp is set on the single-axis movable seat. The second support base is fixed to the top of the support frame. The second support base is located above the first single-axis moving base. Limiting seats are fixedly connected to the inner two sides of the second support base. Limiting holes are provided on the side of the two sets of limiting seats that are close to each other. The cylinder is located below the top of the support base. The base is fixed to the output end of the cylinder. Four sets of push rods and two sets of limit posts are fixedly connected to the bottom of the base.

[0009] According to the above technical solution, the temporary storage box is fixed at the bottom of the base, and the two sets of discharge ports are respectively arranged on both sides of the bottom width direction of the temporary storage box, and a number of injection heads are arranged in the discharge ports. Two sets of feed inlets are located on one side of the length direction of the temporary storage box, and two sets of circulating material outlets are located on one side of the width direction of the temporary storage box. The feed inlets and circulating material outlets are connected to a mixing tank. A pumping device is installed inside the mixing tank. A circulating feed inlet and a second discharge outlet are provided on the mixing tank. The circulating feed inlet of the mixing tank is connected to the first circulating material outlet via a pipeline, and the second discharge outlet of the mixing tank is connected to the feed inlet via a pipeline. A valve is installed on the pipeline connection between the circulating feed inlet and the first circulating material outlet. Several telescopic rods are fixed inside the center of the temporary storage box, and the output ends of the several telescopic rods are staggered in the direction of the two sets of push plates. Two sets of limiting plates are detachably connected to the bottom of the temporary storage box, and the two sets of limiting plates correspond to the positions of the two sets of discharge ports.

[0010] According to the above technical solution, the heat preservation component is set at the bottom of the support frame. The heat preservation component includes a heat preservation box, a single-axis moving seat II and a temperature equalization box. The heat preservation box is fixed at the bottom of the support frame. The single-axis moving seat II is set on the support frame and located inside the heat preservation box. The temperature equalization box is set on the single-axis moving seat II. The support frame is provided with a heat preservation port, the heat distribution box is located inside the heat preservation port, the heat preservation port is located directly below the injection molding box, the side of the heat distribution box is connected to an air pipe, and the air pipe is connected to an air pump. The insulated box has an opening on its side.

[0011] According to the above technical solution, the transfer mechanism includes a transfer component and a thermal imager. The transfer component is fixed on the top of the frame, and the thermal imager is fixed on the transfer component.

[0012] According to the above technical solution, the cooling mechanism includes a single-axis movable seat three, a movable seat one, two sets of lifting seats one, a support seat five, a cooling box, an air outlet and an air inlet. The single-axis movable seat three and the support seat five are fixed on the frame. The movable seat one is set on the single-axis movable seat three. The two sets of lifting seats one are respectively set at both ends of the movable seat one. The distance between the two sets of lifting seats one is the same as the distance between the transfer mechanism and the cooling mechanism. The support base five is located above the single-axis movable base three. A cooling box is fixedly connected to the top of the support base five. A single-axis movable base four is provided on the top of the support base five. The support base five is located inside the cooling box. A lifting base two is provided on the single-axis movable base four. The air outlet is provided on the lifting base two. The air intake is fixed to the top of the support base five. A fan is connected to the air outlet and air intake pipes. A clamp four is provided at the top center of the support base five.

[0013] According to the above technical solution, the feeding mechanism includes a support seat six, a single-axis movable seat five, a movable seat two, a clamp five, a single-axis movable seat six, and a clamp six. The support seat six and the single-axis movable seat six are fixed on the top of the frame. The single-axis movable seat five is disposed on the top of the support seat six. The movable seat two is disposed on the single-axis movable seat five. The clamp five is disposed on the movable seat two. The clamp six is ​​disposed on the single-axis movable seat six.

[0014] According to the above technical solution, an alarm light is provided on the top of the controller, and an encapsulation module is provided inside the controller. The encapsulation module is connected to the camera and the thermal imager. The encapsulation module is used to acquire the image captured by the camera, to determine the overall quality of the chip before and after encapsulation, and to acquire the temperature after injection molding to determine the injection molding quality. The encapsulation module is also electrically connected to the alarm light and controls the alarm light to light up for alarm prompt.

[0015] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: The present invention, by setting up a packaging mechanism and designing a pusher plate that can move in both directions inside the injection molding box, and by controlling its extension and retraction, combined with the start and stop of the mixing tank pump and the opening and closing of the circulation valve, realizes multiple working modes such as normal injection molding, pressurized injection molding, expansion storage, heat preservation, emptying, and rapid emptying. This allows the device to actively adapt to complex working conditions such as changes in the temperature of the injection molding material, fluctuations in ambient temperature, and switching of process stages. It can also adjust the temporary storage amount to adapt to different production rhythms and realize the rapid emptying or pressure holding of the system. By setting a movable heat exchanger in the packaging mechanism, the injection head can be preheated in a targeted manner during non-injection periods, and the chip mold below can be preheated during injection periods. This greatly reduces the temperature difference between the high-temperature injection plastic and the cold mold and chip, effectively reducing the risk of defects such as interface delamination, chip warping, and hidden cracks caused by thermal shock. This is crucial for high-precision applications such as chip stacking packaging. By setting up a cooling mechanism and utilizing an air outlet that can move in three dimensions, low-temperature airflow can be blown evenly and controllably onto the surface of the package, achieving efficient and uniform forced cooling. Combined with the local circulation formed by the cooling box and the air intake, this not only improves cooling efficiency but also avoids excessive low-temperature interference to the entire packaging environment, which helps control cooling stress and thus helps ensure the effect of chip packaging. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a partial structural schematic diagram of the present invention; Figure 3This is a partial rear view schematic diagram of the structure of the present invention; Figure 4 This is a schematic diagram of the feeding mechanism of the present invention; Figure 5 This is a schematic diagram of the overall structure of the packaging mechanism of the present invention; Figure 6 This is a schematic diagram of the packaging mechanism of the present invention; Figure 7 This is an exploded view of the injection molded box portion of the present invention; Figure 8 This is a schematic diagram of the overall structure of the transfer mechanism of the present invention; Figure 9 This is a schematic diagram of the overall structure of the cooling mechanism of the present invention; In the diagram: 1. Frame; 2. Feeding mechanism; 21. Material platform; 22. Support base one; 23. Support plate one; 24. Fixture one; 25. Dual-axis moving base one; 26. Fixture two; 27. Dual-axis moving base two; 28. Fixture three; 29. ​​Support block one; 210. Camera; 3. Packaging mechanism; 31. Support frame; 32. Single-axis moving seat one; 33. Clamp; 34. Drive assembly; 341. Support seat two; 342. Limit seat; 343. Cylinder one; 344. Base; 345. Push rod; 346. Limit post; 35. Injection box; 351. Temporary storage box; 352. Outlet one; 353. Inlet; 354. Circulation port one; 355. Guide post; 356. Telescopic rod; 357. Push plate; 358. Mixing tank; 359. Limit plate; 36. Injection head; 37. Insulation assembly; 371. Insulation box; 372. Single-axis moving seat two; 373. Temperature equalization box; 374. Air pipe; 375. Movable port; 38. Insulation port; 4. Transfer mechanism; 41. Transfer components; 42. Thermal imager; 5. Cooling mechanism; 51. Single-axis moving seat three; 52. Moving seat one; 53. Lifting seat one; 54. Support seat five; 55. Cooling box; 56. Single-axis moving seat four; 57. Lifting seat two; 58. Air outlet; 59. Air inlet; 510. Fixture four; 6. Feeding mechanism; 61. Support seat six; 62. Single-axis moving seat five; 63. Moving seat two; 64. Fixture five; 65. Single-axis moving seat six; 66. Fixture six; 7. Controller; 8. Alarm light. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Please see Figure 1-9 This invention provides a technical solution: a chip packaging device, comprising a frame 1, a loading mechanism 2, a packaging mechanism 3, a transfer mechanism 4, a cooling mechanism 5, a unloading mechanism 6, and a controller 7. The loading mechanism 2, packaging mechanism 3, transfer mechanism 4, cooling mechanism 5, and unloading mechanism 6 are arranged counterclockwise on the frame 1. The distance between the transfer mechanism 4 and the cooling mechanism 5 is the same as the distance between the cooling mechanism 5 and the unloading mechanism 6. The loading mechanism 2 and the unloading mechanism 6 are collinear, as are the packaging mechanism 3 and the cooling mechanism 5. The controller 7 is mounted on the top of the frame 1 via a universal arm. The frame 1 supports the packaging device and provides the enclosed space required for chip packaging. The loading mechanism 2 is used for loading and assisting in unloading the chips. The packaging mechanism 3 is used for injection molding the chips. The transfer mechanism 4 is used to transfer the injection-molded chips to the cooling mechanism 5 and simultaneously perform thermal imaging detection on the injection-molded chips. The cooling mechanism 5 is used to cool the injection-molded chips. The unloading mechanism 6 is used to unload the chips.

[0019] Specifically, such as Figures 2-4 As shown, the feeding mechanism 2 includes a material platform 21, a dual-axis moving seat 1 25, a dual-axis moving seat 27 and a camera 210. A support seat 1 22 is provided above the material platform 21. The material platform 21 and the support seat 1 22 are fixed to the top of the frame 1. A clamp 1 24 is fixed to the top of the support seat 1 22. Support plate 23 is fixedly connected to the top of the end of support base 1 22 away from the unloading mechanism 6. Dual-axis moving base 1 25 and dual-axis moving base 27 are both fixed on the side of support plate 1 23 near the unloading mechanism 6. Clamp 2 26 is set below dual-axis moving base 1 25 and clamp 3 28 is set below dual-axis moving base 27. Dual-axis moving base 1 25 and dual-axis moving base 27 are used to drive clamp 2 26 and clamp 3 28 to move up, down and left and right respectively. Clamp 1 24 is used to transfer and clamp the chip during the loading and unloading process. Clamp 2 26 is used to clamp and move the chip to be injection molded and the chip after injection molding. Clamp 3 28 is used to clamp and move the chip to be injection molded. A support block 29 is fixedly connected to the side of the support plate 23 near the unloading mechanism 6. The support block 29 is located above the dual-axis moving seat 27. The camera 210 is fixed to the bottom of the support block 29. The camera 210 is used to take visual pictures of the chip before and after packaging at the loading and unloading stations.

[0020] Specifically, such as Figure 2 , Figures 5-7 As shown, the packaging mechanism 3 includes a support frame 31, a clamp 33, a drive assembly 34, an injection box 35, several injection heads 36, and a heat preservation assembly 37. The support frame 31 is fixed on the frame 1. A single-axis moving seat 32 is fixedly connected to the lower top of the support frame 31. The single-axis moving seat 32 is located on the top of the support frame 31. The clamp 33 is located on the single-axis moving seat 32. The single-axis moving seat 32 is used to drive the clamp 33 to move along the setting direction of the feeding mechanism 2 and the packaging mechanism 3.

[0021] Furthermore, such as Figure 5 and Figure 6 As shown, the drive assembly 34 is disposed on the top of the support frame 31. The drive assembly 34 includes a second support seat 341, a first cylinder 343 and a base 344. The second support seat 341 is fixed on the top of the support frame 31 and is located above the first single-axis moving seat 32. Limiting seats 342 are fixedly connected to the two sides inside the second support seat 341 respectively. Limiting holes are provided on the side of the two sets of limiting seats 342 that are close to each other. Cylinder 1 343 is located below the top of support base 2 341. Base 344 is fixed to the output end of cylinder 1 343. Four sets of push rods 345 and two sets of limiting posts 346 are fixedly connected to the bottom of base 344. The positions and dimensions of the two sets of limiting posts 346 and the limiting holes on the two sets of limiting seats 342 are matched. Cylinder 1 343 is used to drive base 344 to move up and down. Push rods 345 are used to limit the position of base 344 to prevent displacement. Push rods 345 are used to fix the chip mold that needs to be injected to prevent the mold from being pushed open by the injection plastic and affecting the molding effect.

[0022] Furthermore, such as Figures 5-7 As shown, the injection box 35 is fixed to the bottom of the base 344. The injection box 35 includes a temporary storage box 351, two sets of discharge ports 352, two sets of inlet ports 353, two sets of circulating material ports 354, several telescopic rods 356, and two sets of push plates 357. The temporary storage box 351 is fixed to the bottom of the base 344. The two sets of discharge ports 352 are respectively located on both sides of the bottom width direction of the temporary storage box 351. Each set of discharge ports 352 has several discharge ports. Several injection heads 36 are located inside the discharge ports 352 and protrude from the bottom of the temporary storage box 351. Two sets of feed inlets 353 are located on one side of the length direction of the temporary storage box 351, and two sets of circulating material inlets 354 are located on one side of the width direction of the temporary storage box 351. The inner diameters of the two sets of feed inlets 353 and the two sets of circulating material inlets 354 are the same and coaxial. The feed inlets 353 and the circulating material inlets 354 are connected to a mixing tank 358. A pumping device is installed inside the mixing tank 358. The mixing tank 358 is equipped with a circulating feed inlet and a second discharge outlet. The circulating feed inlet of the mixing tank 358 is connected to the circulating material inlet 354 via a pipeline, and the second discharge outlet of the mixing tank 358 is connected to the feed inlet 353 via a pipeline. A valve is installed on the pipeline connection between the circulating feed inlet and the circulating material inlet 354. The temporary storage box 351 has two sets of guide posts 355 fixedly connected inside. The two ends of the two sets of push plates 357 are sleeved on the two sets of guide posts 355. The push plates 357 are set parallel to the long side of the temporary storage box 351. The width of the push plates 357 is greater than the inner diameter of the feed port 353 and the circulation port 354. The push plates 357 are slidably connected to the inside of the temporary storage box 351, so that the two sets of push plates 357 and the temporary storage box 351 respectively form two injection plastic storage areas. The two sets of discharge ports 352 are located in the temporary storage areas respectively. Several telescopic rods 356 are fixed inside the center of the temporary storage box 351. The output ends of the telescopic rods 356 are staggered in the direction of the two sets of push plates 357. When the telescopic rods 356 with the same direction at their output ends extend synchronously, they can drive the push plates 357 on the corresponding side to move closer to the discharge port 352, reducing the space of the temporary storage area and discharging the injection plastic in the temporary storage area. When the telescopic rods 356 with the same direction at their output ends retract synchronously, they can drive the push plates 357 on the corresponding side to move away from the discharge port 352, increasing the space in the temporary storage area and increasing the amount of injection plastic that can be temporarily stored. Two sets of limiting plates 359 are detachably connected to the bottom of the temporary storage box 351. The two sets of limiting plates 359 correspond to the positions of the two sets of discharge ports 352 respectively. The two sets of limiting plates 359 are used to restrict the position of several injection heads 36, prevent the injection heads 36 from moving and prevent the injection heads 36 from falling off during injection. The detachable connection method is preferably a bolt and nut fastening connection, but other connection methods that can set the two sets of limiting plates 359 below the temporary storage box 351 are also possible.

[0023] It should be noted that the chips to be injection molded require pre-processing. The pre-processing process involves placing the chip components on a carrier board made of electrically insulating material with multiple pre-reserved cutout areas. The size and position of the cutout areas on the carrier board are designed according to the size and number of chips to be packaged, and a corresponding number of pins are arranged around each cutout area. These pins will later be used to connect to the chip's pins. A support film is laid on the bottom of the carrier board to fix the chips to be placed in the cutout areas. The material and thickness of the film should have sufficient strength and stability to provide reliable support. Then, the entire assembly is placed in the injection mold to form the chip assembly to be injection molded and packaged. One or more components such as capacitors, resistors, MCUs, sensors, and ASICs are placed in each cutout area, with the component pins facing the support film side. The injection head 36 can be independently controlled to open to ensure the normal operation of the injection molding process.

[0024] Supplementary explanation of the above structure: The temporary storage box 351 is provided with an insulation layer. Before injection molding, the single-axis moving seat 32, the dual-axis moving seat 27 and the clamp 38 are in operation. The single-axis moving seat 32 drives the clamp 33 to be located at the end of the single-axis moving seat 32 closest to the dual-axis moving seat 27. The chip is held by the clamp 38. The dual-axis moving seat 27 drives the clamp 38 holding the chip to move until it is above the clamp 33. Then the clamp 38 releases the clamp, and the clamp 33 limits the chip. After that, the single-axis moving seat 32 drives the chip with the clamp 33 to move to the bottom of the injection molding box 35 for injection molding and encapsulation. Taking the operation mode of the single-sided temporary storage area as an example: Case 1: When the pumping device inside the mixing tank 358 is started, it can pump the injection plastic inside the mixing tank 358 into the temporary storage area inside the temporary storage box 351 through the connecting pipe and the inlet 353. ① If the valve connected to the pipeline of the circulating inlet and the circulating material inlet 354 is closed at this time, and the telescopic rod 356 is in a non-operating state and the telescopic length is fixed, then the capacity of the temporary storage area remains unchanged. At this time, the injection plastic entering the temporary storage area can only be discharged from the outlet 352 and then through the injection head 36 to inject the chip placed in the mold. This is the normal injection mode. ② If the valve on the pipeline connecting the circulating feed port and the circulating material port 354 is closed at this time, the telescopic rod 356 with the same direction at the output end extends synchronously, driving the push plate 357 to move closer to the discharge port 352, reducing the space of the temporary storage area. This can increase the discharge pressure and discharge volume of the injection plastic from the discharge port 352 and the injection head 36 without increasing the operating power of the pumping device inside the mixing tank 358. This is suitable for situations where the injection plastic temperature is low and the fluidity is poor. This is the pressurized injection mode. In this mode, the maximum extension of the telescopic rod 356 is when the push plate 357 is about to contact the inner diameter of the feed port 353 and the circulating material port 354. ③ If the valve on the pipeline connecting the circulating feed port and the circulating material port 354 is closed at this time, the telescopic rod 356 with the same direction at the output end will retract synchronously, driving the push plate 357 to move closer to the discharge port 352, increasing the space in the temporary storage area. The negative pressure generated when the temporary storage area expands will promote the injection plastic from the mixing tank 358 and the feed port 353 into the temporary storage area, increasing the amount of injection plastic stored in the temporary storage area. At the same time, it can also suck some of the injection plastic in several injection heads 36 into the temporary storage area, avoiding the injection plastic from solidifying in the injection head 36 due to the low injection environment temperature, which would affect the normal injection effect. This mode is suitable for situations where the injection environment temperature is low. ④ If the valve on the pipeline connecting the circulating feed port and the circulating material port 354 is open at this time, regardless of whether the telescopic rod 356 is in a non-operating state, an extended state, or a retracted state, part of the injection plastic entering the temporary storage area will be discharged from the injection head 36 for injection molding, and the other part will re-enter the mixing tank 358 from the circulating material port 354 for re-mixing. Since the fluidity of the injection plastic will change with temperature, the pressure of the injection plastic discharged from the injection head 36 cannot be guaranteed to be stable. Therefore, this mode should not be selected unless necessary.

[0025] Scenario 2: The pumping device inside the mixing tank 358 stops operating, stopping the pumping of the injection plastic inside the mixing tank 358 into the temporary storage area inside the temporary storage box 351 through the connecting pipe and the inlet 353. ① If the valve on the pipe connecting the circulation inlet and the circulation outlet 354 is closed at this time, the telescopic rod 356 with the same direction at the output end extends synchronously, driving the push plate 357 to move closer to the outlet 352, reducing the space of the temporary storage area, then only the injection plastic in the temporary storage area is used for injection molding. This is suitable for situations where the mixing tank 358 needs to be replaced without interrupting the injection molding process or where all the injection plastic needs to be discharged when the injection molding needs to be stopped. This is the emptying mode. ② If the valve on the pipeline connecting the circulating feed port and the circulating material port 354 is closed at this time, the telescopic rod 356 with the same direction at the output end will retract synchronously, driving the push plate 357 to move closer to the discharge port 352, increasing the space of the temporary storage area. The negative pressure generated when the temporary storage area expands will suck the injection plastic in several injection heads 36 into the temporary storage area, avoiding the injection plastic from solidifying in the injection head 36 due to the low injection environment temperature, which would affect the normal injection effect. This is suitable for situations where the injection process is about to end and the injection temperature is low. This is the heat preservation mode. ③ If the valve on the pipeline connecting the circulating feed port and the circulating material port 354 is opened at this time, the telescopic rod 356 with the same direction at the output end extends synchronously, driving the push plate 357 to move closer to the discharge port 352, reducing the space of the temporary storage area. Then only the injection plastic in the temporary storage area is used for injection molding and discharged into the mixing tank 358 through the circulating material port 354, quickly reducing the amount of injection plastic in the temporary storage area until the push plate 357 completely blocks the circulating material port 354 and the feed port 353. The injection plastic can only be discharged from the injection head 36. This is suitable for situations where the injection is about to end and the injection plastic temperature is low. This is the rapid emptying mode. ④ If the valve on the pipeline connecting the circulating feed port and the circulating material port 354 is opened at this time, the telescopic rod 356 with the same direction at the output end will retract synchronously, driving the push plate 357 to move closer to the discharge port 352, increasing the space of the temporary storage area. This allows the plastic injection in the pipeline connecting the circulating feed port and the circulating material port 354 and the plastic injection in the injection head 36 to be sucked into the temporary storage area using negative pressure, increasing the amount of plastic injection in the temporary storage area. This is suitable for situations where the injection is about to end and the plastic injection temperature is too high. This is the supplementary mode.

[0026] Furthermore, such as Figure 5 and Figure 6 As shown, the heat preservation component 37 is set at the bottom of the support frame 31. The heat preservation component 37 includes a heat preservation box 371, a single-axis moving seat 372, and a temperature equalization box 373. The heat preservation box 371 is fixed at the bottom of the support frame 31. The single-axis moving seat 372 is set on the support frame 31 and located inside the heat preservation box 371. The temperature equalization box 373 is set on the single-axis moving seat 372. The single-axis moving seat 372 is used to drive the temperature equalization box 373 to move in a direction perpendicular to the transmission direction of the single-axis moving seat 32. The support frame 31 is provided with a heat preservation port 38, and the heat distribution box 373 is located inside the heat preservation port 38. The heat preservation port 38 is located directly below the injection molding box 35. The side of the heat distribution box 373 is connected to an air pipe 374, and the air pipe 374 is connected to an air pump. A heating device is provided on the pipe connecting the air pipe 374 and the air pump. The heating device is used to heat the gas that the air pump introduces into the heat distribution box 373 through the pipe and the air pipe 374, thereby increasing the temperature inside the heat distribution box 373 and the movable port 375. The insulated box 371 has a movable opening 375 on its side, which is used to restrict the position of the trachea 374.

[0027] Supplementary explanation based on the above structure: In the non-injection molding state, cylinder 343 drives base 344 to descend, allowing injection head 36 to be positioned within insulation port 38. Then, single-axis moving seat 372 is activated, driving the heat spreader 373 to move within insulation box 371. This allows the hot air heated by the heating device to preheat injection head 36, preventing the injection plastic discharged from the temporary storage area of ​​temporary box 351 from solidifying upon encountering the low-temperature injection head 36, thus reducing the injection molding effect. The movable heat spreader 373 improves the targeted heating of injection head 36. Simultaneously, the movement of the heat spreader 373 promotes the mixing of high-temperature gas discharged from inside the heat spreader 373 with ambient gas, increasing both ambient temperature and temperature uniformity. During injection molding, the temperature distribution box 373 can increase the ambient temperature and is located inside the insulation box 371. During injection molding, the air contraction of cylinder 343 causes the base 344 to rise. Under the drive of the single-axis moving seat 32, the clamp 33 moves to the bottom of the injection box 35, that is, directly above the insulation port 38. Through the heat transfer of the gas discharged from the temperature distribution box 373, the temperature of the chip to be injected on the clamp 33 is increased, preheating the chip. This prevents the injection plastic from solidifying due to a large temperature difference when it enters the mold containing the chip, thereby improving the fluidity of the injection plastic, improving temperature uniformity, reducing mechanical stress, avoiding asynchronous shrinkage at the interface of heterogeneous materials, and thus reducing residual stress. This also prevents interface delamination, chip warping, and hidden cracks, which is beneficial to the injection molding effect.

[0028] Specifically, such as Figure 8 As shown, the transfer mechanism 4 includes a transfer component 41 and a thermal imager 42. The transfer component 41 is fixed on the top of the frame 1, and the thermal imager 42 is fixed on the transfer component 41. The thermal imager 42 is used to acquire thermal images of the injection-molded chip during the transfer process.

[0029] Specifically, such as Figure 9 As shown, the cooling mechanism 5 includes a single-axis movable seat 3 51, a movable seat 1 52, two sets of lifting seats 1 53, a support seat 54, a cooling box 55, an air outlet 58, and an air intake 59. The single-axis movable seat 3 51 and the support seat 54 are fixed on the frame 1. The movable seat 1 52 is set on the single-axis movable seat 3 51. The single-axis movable seat 3 51 is used to drive the movable seat 1 52 to move along the setting direction of the cooling mechanism 5. The two sets of lifting seats 1 53 are respectively set at both ends of the movable seat 1 52. The distance between the two sets of lifting seats 1 53 is the same as the distance between the transfer mechanism 4 and the cooling mechanism 5. Support base 54 is located above single-axis movable base 3 51. A cooling box 55 is fixedly connected to the top of support base 54. A single-axis movable base 4 56 is installed on the top of support base 54, and support base 54 is located inside the cooling box 55. A lifting base 2 57 is installed on single-axis movable base 4 56. An air outlet 58 is located on lifting base 2 57. An air intake 59 is fixed to the top of support base 54. Pipes connecting the air outlet 58 and air intake 59 are connected to a fan. The fan has an air inlet and an air outlet. The air outlet 58 is connected to the fan... The air outlet pipe is connected, the air inlet 59 is connected to the air inlet pipe of the fan, and a cooling device is installed on the connection pipe between the air outlet 58 and the fan. The cooling device is used to reduce the temperature of the gas entering the air outlet 58 through the fan. The cooling box 55 and the air inlet 59 are used to reduce the emission of low-temperature gas and reduce the ambient temperature of the injection molding packaging. The single-axis moving seat 4 56 is used to drive the lifting seat 2 57 to move along the length of the chip. The lifting seat 2 57 is used to drive the air outlet 58 to move up and down to adjust the range of temperature reduction. A clamp 510 is provided at the top center of the support base 54. The clamp 510 is used to hold the chip to be cooled.

[0030] Supplementary explanation based on the above structure: The left lifting seat 53 is used to receive the chip transferred by the transfer mechanism 4 and move it below the clamp 4 510. Then the lifting seat 53 extends and the clamp 4 510 holds the chip. After cooling, the single-axis moving seat 3 51 drives the moving seat 52 to move so that the right lifting seat 53 receives the cooled chip. At the same time, the left lifting seat 53 receives the chip transferred by the transfer mechanism 4 again.

[0031] Specifically, such as Figure 2 and Figure 3 As shown, the unloading mechanism 6 includes a support base 61, a single-axis movable base 62, a movable base 63, a clamp 64, a single-axis movable base 65, and a clamp 66. The support base 61 and the single-axis movable base 65 are fixed to the top of the frame 1. The single-axis movable base 62 is set on the top of the support base 61. The movable base 63 is set on the single-axis movable base 62. The clamp 64 is set on the movable base 63. The clamp 66 is set on the single-axis movable base 65. The single-axis movable base 62 is used to drive the movable base 63 to move along the setting direction of the unloading mechanism 6. The single-axis movable base 65 is used to drive the clamp 66 to move up and down. Both the clamp 64 and the clamp 66 are used to clamp the chip.

[0032] Supplementary explanation based on the above structure: When loading the chip, the worker or robotic arm places the chip to be injection molded onto the material table 21. The dual-axis moving seat 25 drives the clamp 26 to be above the chip. The clamp 26 then holds the chip and moves it above the clamp 24, where the clamp 24 holds it. Then, the dual-axis moving seat 27 drives the clamp 38 to move above the chip. The clamp 38 holds the chip and, driven by the dual-axis moving seat 27, moves it above the clamp 33. The clamp 33 then limits the chip for subsequent injection molding. During the unloading process, after the right-side lifting seat 53 receives the cooled chip, the single-axis moving seat 3 51 drives the moving seat 52 to move to the right, so that the right-side lifting seat 53 is below the support seat 61. At the same time, the single-axis moving seat 5 62 drives the moving seat 2 63 to move away from the support plate 1 23. When the clamp 5 64 is above the right-side lifting seat 53, the lifting seat 53 rises, and the clamp 5 64 clamps the chip. Then, the single-axis moving seat 5 62 drives the moving seat 2 63 to move closer to the support plate 1 23. The single-axis moving seat 6 65 drives the clamp 6 66 to move upward, so that the clamp 6 66 clamps the chip. Then, the dual-axis moving seat 1 25 drives the clamp 2 26 to be above the clamp 6 66. The clamp 2 26 clamps the chip and places it on the material table 21, completing the unloading process.

[0033] Specifically, such as Figure 1 As shown, an alarm light 8 is installed on the top of the controller 7. An encapsulation module is installed inside the controller 7. The encapsulation module is connected to the camera 210 and the thermal imager 42. The encapsulation module is used to acquire the image captured by the camera 210, to determine the overall quality of the chip before and after encapsulation, and to acquire the temperature after injection molding to determine the injection molding quality. The encapsulation module is also electrically connected to the alarm light 8 and controls the alarm light 8 to light up for alarm prompt.

[0034] It should be noted that the single-axis moving seat, dual-axis moving seat, lifting seat, clamp and clamp, etc., can all adopt the required driving method according to actual needs, including but not limited to motor screw drive and cylinder drive; 4 is the basic structure and can be set according to actual needs.

[0035] Chip stacking packaging method for chip packaging devices: Step 1: Loading and initial inspection: The robotic arm or a person places the pre-processed chip onto the material table 21. Fixtures 26, 66, and 328 work together to first place the chip onto fixture 24. The packaging module obtains the image captured by the camera 210 and analyzes whether the chip to be packaged is qualified. Then, the chip is transferred and positioned onto the clamp 33 of the packaging mechanism 3.

[0036] Specifically, the packaging module stores standard mold images of the chip. During analysis, the packaging module compares the mold image in the actual screen with the standard mold image. If they are the same, subsequent packaging is performed; if they are different, the packaging system will issue an alarm and control the alarm light 8 to light up.

[0037] Step 2: Preheating: Before the chip enters the injection molding station, the heat preservation component 37 is activated, and the single-axis moving seat 372 drives the temperature distribution box 373 to move. The hot air discharged from it preheats the injection head 36 below and the chip mold that is about to be placed through the heat preservation port 38, reducing the temperature difference with the injection plastic.

[0038] Step 3: Injection Molding: The single-axis moving seat 32 moves the chip directly below the injection molding box 35. The cylinder 343 drives the base to descend, the limiting post 346 inserts into the limiting seat 342, and the push rod 345 presses the mold to perform injection molding.

[0039] Step 4: Transfer and Online Inspection: After injection molding is completed, the transfer mechanism 4 moves the chip to the cooling mechanism 5. The packaging module obtains thermal imaging data of the injection molded body scanned by the thermal imager 42 to analyze the injection molding uniformity and potential defects.

[0040] Specifically, when the packaging module acquires thermal imaging data from the thermal imager 42 scanning the injection molded body, and extracts the highest temperature, lowest temperature, average temperature, maximum temperature difference, highest temperature location, lowest temperature location, etc., if the same problem occurs multiple times in a row, the injection box 35 is controlled to perform injection operations in modes such as normal injection, pressurized injection, expansion storage, heat preservation, evacuation, and rapid evacuation according to the actual situation. It actively adapts to complex working conditions such as changes in injection plastic temperature, fluctuations in ambient temperature, and switching of process stages, thereby improving the effect of chip injection molding and packaging.

[0041] Step 5: Forced Cooling: The cooling mechanism 5 is activated. The single-axis moving seat 4 56 and the lifting seat 2 57 drive the air outlet 58 to move along the length and height of the chip. The fan blows the low-temperature gas treated by the cooling device evenly onto the chip to achieve controllable and efficient cooling. The cooling box 55 and the air intake 59 form a cycle to maintain a low-temperature environment.

[0042] Step Six: Unloading and Final Inspection: After cooling, the chip is transferred via the right-side lifting seat 53. With the cooperation of fixture 5 64 and fixture 2 26, it is first moved to fixture 6 66, and then transferred to fixture 1 24. The packaging module obtains the image captured by camera 210, analyzes whether the packaged chip is qualified, and finally sends it back to the material station 21 to complete one packaging cycle.

[0043] Specifically, the packaging module sets a standard image of the packaged chip. At this point, the injection molding material is evenly covered and there are no defects such as leakage. During analysis, the packaging module compares the image in the actual screen with the standard image. If they are the same, subsequent packaging is performed. If they are different, the packaging system will issue an alarm and control the alarm light 8 to light up.

[0044] The above methods enable highly efficient continuous production, reduce thermal shock through preheating, adapt to process fluctuations through multi-mode injection molding, control stress through uniform cooling, and monitor quality through online thermal imaging. This comprehensively improves chip packaging, especially the molding quality, reliability, and batch consistency of thermally stress-sensitive stacked chip packaging.

[0045] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0046] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip packaging apparatus, comprising a frame (1), a loading mechanism (2), a packaging mechanism (3), a transfer mechanism (4), a cooling mechanism (5), a unloading mechanism (6), and a controller (7), characterized in that, The feeding mechanism (2), packaging mechanism (3), transfer mechanism (4), cooling mechanism (5), and unloading mechanism (6) are arranged in a counterclockwise order on the frame (1), and the controller (7) is mounted on the top of the frame (1) via a universal arm; The packaging mechanism (3) includes a support frame (31), a clamp (33), a drive assembly (34), an injection box (35), several injection heads (36), and a heat preservation assembly (37). The drive assembly (34) is located on the top of the support frame (31). The drive assembly (34) includes a second support base (341), a first cylinder (343), and a base (344). The injection box (35) includes a temporary storage box (351), two sets of discharge ports (352), two sets of inlets (353), two sets of circulating material ports (354), several telescopic rods (356), and two sets of push plates (357). The temporary storage box (351) is fixedly connected to two sets of guide posts (355). The two ends of the two sets of push plates (357) are sleeved on the two sets of guide posts (355). The push plates (357) are set parallel to the long side of the temporary storage box (351). The width of the push plates (357) is greater than the inner diameter of the feed port (353) and the first circulation port (354). The push plates (357) are slidably connected to the inside of the temporary storage box (351), so that the two sets of push plates (357) and the temporary storage box (351) respectively form two injection plastic temporary storage areas. The two sets of discharge ports (352) are located in the temporary storage areas respectively.

2. The chip packaging device according to claim 1, characterized in that, The feeding mechanism (2) includes a material platform (21), a dual-axis moving seat one (25), a dual-axis moving seat two (27) and a camera (210). A support seat one (22) is provided above the material platform (21). The material platform (21) and the support seat one (22) are fixed on the top of the frame (1). A clamp one (24) is fixed on the top of the support seat one (22). The support base one (22) is fixedly connected to the top of the end away from the feeding mechanism (6) by a support plate one (23). The dual-axis moving base one (25) and the dual-axis moving base two (27) are both fixed on the support plate one (23) on the side close to the feeding mechanism (6). The clamp two (26) is set below the dual-axis moving base one (25), and the clamp three (28) is set below the dual-axis moving base two (27). A support block (29) is fixedly connected to the side of the support plate (23) near the unloading mechanism (6). The support block (29) is located above the dual-axis moving seat (27). The camera (210) is fixed to the bottom of the support block (29).

3. The chip packaging apparatus according to claim 2, characterized in that, The support frame (31) is fixed on the frame (1). A single-axis moving seat (32) is fixedly connected to the bottom of the top of the support frame (31). The single-axis moving seat (32) is set on the top of the support frame (31). The clamp (33) is set on the single-axis moving seat (32). The second support seat (341) is fixed on the top of the support frame (31). The second support seat (341) is located above the first single-axis moving seat (32). The two sides inside the second support seat (341) are respectively fixedly connected to the limit seats (342). Limit holes are provided on the side of the two sets of limit seats (342) that are close to each other. The cylinder one (343) is located below the top of the support base two (341), and the base (344) is fixed to the output end of the cylinder one (343). The bottom of the base (344) is fixedly connected with four sets of push rods (345) and two sets of limit posts (346).

4. A chip packaging device according to claim 3, characterized in that, The temporary storage box (351) is fixed to the bottom of the base (344), and the two sets of discharge ports (352) are respectively set on both sides of the bottom width direction of the temporary storage box (351), and a number of injection heads (36) are set in the discharge ports (352). Two sets of feed inlets (353) are located on one side of the length direction of the temporary storage box (351), and two sets of circulating material inlets (354) are located on one side of the width direction of the temporary storage box (351). The feed inlets (353) and circulating material inlets (354) are connected to a mixing tank (358). A pumping device is installed inside the mixing tank (358). A circulating feed inlet and a discharge outlet are provided on the mixing tank (358). The circulating feed inlet of the mixing tank (358) is connected to the circulating material inlet (354) via a pipeline. The discharge outlet of the mixing tank (358) is connected to the feed inlet (353) via a pipeline. A valve is installed on the pipeline connection between the circulating feed inlet and the circulating material inlet (354). Several telescopic rods (356) are fixed inside the center of the temporary storage box (351), and the output ends of several telescopic rods (356) are staggered in the direction toward the two sets of push plates (357); Two sets of limiting plates (359) are detachably connected to the bottom of the temporary storage box (351), and the two sets of limiting plates (359) correspond to the positions of the two sets of discharge ports (352).

5. A chip packaging apparatus according to claim 4, characterized in that, The heat insulation component (37) is set at the bottom of the support frame (31). The heat insulation component (37) includes a heat insulation box (371), a single-axis moving seat (372) and a temperature equalization box (373). The heat insulation box (371) is fixed at the bottom of the support frame (31). The single-axis moving seat (372) is set on the support frame (31) and located inside the heat insulation box (371). The temperature equalization box (373) is set on the single-axis moving seat (372). The support frame (31) is provided with a heat preservation port (38), the heat equalization box (373) is located inside the heat preservation port (38), the heat preservation port (38) is located directly below the injection molding box (35), the side of the heat equalization box (373) is connected to an air pipe (374), and the air pipe (374) is connected to an air pump. The insulated box (371) has an opening (375) on its side.

6. A chip packaging apparatus according to claim 5, characterized in that, The transfer mechanism (4) includes a transfer component (41) and a thermal imager (42). The transfer component (41) is fixed on the top of the frame (1), and the thermal imager (42) is fixed on the transfer component (41).

7. A chip packaging apparatus according to claim 6, characterized in that, The cooling mechanism (5) includes a single-axis movable seat three (51), a movable seat one (52), two sets of lifting seats one (53), a support seat five (54), a cooling box (55), an air outlet (58) and an air intake (59). The single-axis movable seat three (51) and the support seat five (54) are fixed on the frame (1). The movable seat one (52) is set on the single-axis movable seat three (51). The two sets of lifting seats one (53) are respectively set at both ends of the movable seat one (52). The distance between the two sets of lifting seats one (53) is the same as the distance between the transfer mechanism (4) and the cooling mechanism (5). The fifth support seat (54) is located above the third single-axis moving seat (51). A cooling box (55) is fixedly connected to the top of the fifth support seat (54). A fourth single-axis moving seat (56) is provided on the top of the fifth support seat (54). The fifth support seat (54) is located inside the cooling box (55). A second lifting seat (57) is provided on the fourth single-axis moving seat (56). The air outlet (58) is provided on the second lifting seat (57). The air intake (59) is fixed on the top of the fifth support seat (54). A fan is connected to the air outlet (58) and the air intake (59) through pipes. The top center of the support base five (54) is provided with clamp four (510).

8. A chip packaging apparatus according to claim 7, characterized in that, The feeding mechanism (6) includes a support seat six (61), a single-axis moving seat five (62), a moving seat two (63), a clamp five (64), a single-axis moving seat six (65), and a clamp six (66). The support seat six (61) and the single-axis moving seat six (65) are fixed on the top of the frame (1). The single-axis moving seat five (62) is set on the top of the support seat six (61). The moving seat two (63) is set on the single-axis moving seat five (62). The clamp five (64) is set on the moving seat two (63). The clamp six (66) is set on the single-axis moving seat six (65).

9. A chip packaging apparatus according to claim 8, characterized in that, The controller (7) is equipped with an alarm light (8) on its top. The controller (7) is equipped with an encapsulation module. The encapsulation module is connected to the camera (210) and the thermal imager (42) via signal connection. The encapsulation module is used to acquire the image captured by the camera (210), determine the overall quality of the chip before and after encapsulation, and acquire the temperature after injection molding to determine the quality of injection molding. The encapsulation module is also electrically connected to the alarm light (8) and controls the alarm light (8) to light up for alarm prompt.

10. A chip stacking packaging method for a chip packaging apparatus, implemented based on the chip packaging apparatus of claim 9, characterized in that, The chip stacking and packaging method of the chip packaging device is as follows: Step 1: Material loading and initial inspection; Step 2: Preheating; Step 3: Injection molding and encapsulation; Step 4: Transfer and online inspection: After injection molding is completed, the transfer mechanism (4) moves the chip to the cooling mechanism (5), and the packaging module obtains the thermal imaging data of the injection molded body scanned by the thermal imager (42) to analyze the injection molding uniformity and potential defects; Step 5: Forced cooling; Step Six: Material preparation and final inspection.

Images