Mounting structure of SiP module and heat dissipation implementation method thereof

By adopting integrated potting resin encapsulation of laminated board assembly and heat-conducting plate in SiP module and designing heat conduction path, the problems of easy detachment of heat sink, poor module sealing and difficult installation are solved, achieving efficient heat dissipation and stable installation, and adapting to multi-power devices and complex operating conditions.

CN122161464APending Publication Date: 2026-06-05ZHUHAI ORBITA AEROSPACE SCI TECH CO LTD
View PDF 4 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ZHUHAI ORBITA AEROSPACE SCI TECH CO LTD
Filing Date
2026-04-16
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Existing SiP modules suffer from issues such as heat sink detachment under high vibration and multi-power device conditions, poor module sealing, and installation difficulties. They are unsuitable for operating conditions where internal components have varying heights or limited layouts. Furthermore, existing heat dissipation methods cannot simultaneously meet the requirements for installation fixation and heat dissipation.

Method used

The heat sink and heat conduction plate are integrally encapsulated with potting resin to form a potting body. The heat conduction plate and the heat sink are connected by heat conduction bosses and heat conduction through holes to form a vertical heat conduction path. They are fixed to the mounting base plate by mounting studs to achieve mechanical interlocking between the heat sink and the heat sink, ensuring that the heat sink does not fall off and the module is sealed.

Benefits of technology

It effectively avoids the risk of the heat dissipation structure loosening in high vibration environments, improves the module's sealing and electromagnetic interference resistance, ensures efficient heat dissipation and stable installation, adapts to different device layouts and height differences, and meets the signal integrity requirements of high-density integration and extreme environments.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122161464A_ABST
    Figure CN122161464A_ABST
Patent Text Reader

Abstract

The application provides a mounting and fixing structure of a SiP module and a heat dissipation implementation method thereof. The mounting and heat dissipation structure comprises a laminated plate group, a heat conduction plate and a mounting bottom plate. The laminated plate group comprises a power plate. The power plate is provided with power devices and heat conduction vias penetrating through the power plate corresponding to the positions of the heat dissipation pads. The heat conduction vias are filled with heat conduction materials. The side of the heat conduction plate facing the power plate is provided with heat conduction bosses corresponding to the areas of the heat conduction vias. The heat conduction bosses are internally provided with a plurality of blind hole channels. The laminated plate group and the heat conduction plate are integrally filled with pouring sealing resin to form a pouring sealing body. The heat conduction bottom surface of the side of the heat conduction plate away from the power plate is exposed outside the pouring sealing body and is attached and mounted on the mounting bottom plate. The heat dissipation implementation method comprises the following steps: setting heat conduction vias and filling heat conduction materials; attaching the heat conduction bosses to the bottom layer of the power plate through heat conduction pads and fixing mounting studs; and after stacking each circuit layer, integrally filling the heat conduction plate. The application relates to the technical field of packaging.
Need to check novelty before this filing date? Find Prior Art