Liquid cooling plate, battery module and case

By optimizing the flow channel structure and slanted fin design of the liquid cooling plate, the problem of uneven heat dissipation of the high-voltage DC power supply module was solved, achieving more efficient heat dissipation and more uniform temperature control.

CN122177993APending Publication Date: 2026-06-09SINOPEC OILFIELD SERVICE CORPORATION +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SINOPEC OILFIELD SERVICE CORPORATION
Filing Date
2024-12-06
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

The existing liquid-cooled chassis of high-voltage DC power modules has unsatisfactory heat dissipation, especially with concentrated heat inside the module, uneven temperature of the guide rails, and inconvenient maintenance.

Method used

The microchannel structure within the flow channel is optimized using liquid cooling plates, including a serpentine coiled liquid cooling channel and an inclined fin structure. Combined with the multi-layer coiled design of the inflow and outflow sections, the flow of the cooling medium is optimized, improving heat dissipation uniformity and efficiency.

Benefits of technology

Under the same liquid supply flow rate and ambient temperature conditions, the solid wall temperature of the power module was reduced, the heat exchange area of ​​the wall was increased, the temperature distribution was made more uniform, the temperature rise of the slot rail was reduced, and the heat dissipation performance was improved.

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Abstract

The application provides a liquid cooling plate, a battery module and a case. The liquid cooling plate comprises a base body, the shape and size of the base body are matched with the shape and size of a battery monomer; a liquid cooling channel is arranged on the base body, the liquid cooling channel is coiled on the base body, one end of the liquid cooling channel is provided with an inlet, and the other end is provided with an outlet, and the inlet and the outlet are arranged at different positions of the edges of the base body respectively; wherein the cooling medium enters the cooling channel through the inlet, and flows out through the outlet after heat exchange with the battery monomer. The case comprises a battery monomer, a case body, and front and rear cover plates arranged on the two sides of the case body, and the front and rear cover plates can be detached and installed on the case body. The application effectively improves the liquid cooling heat exchange effect of the case, the battery module composed of the liquid cooling plate and the battery unit has the effect of reducing the solid wall surface temperature of the power module and improving the wall surface heat exchange area.
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Description

Technical Field

[0001] This invention relates to a liquid cooling plate, a battery module, and a chassis, belonging to the technical field of heat dissipation and high-voltage DC power supply modules. Background Technology

[0002] The high-voltage DC power module is a core component of charging piles, typically with a fixed power output, adjusted according to the charging pile's power requirements. The stability of this component directly impacts the overall product quality and user experience. Research and disassembly of high-voltage constant-power charging modules on the market reveal that they generally employ a single-layer liquid cooling system with heat sinks for auxiliary heat dissipation. However, some heat remains concentrated within the module, resulting in less than ideal cooling performance.

[0003] Air cooling and liquid cooling are the mainstream thermal management methods for electrochemical energy storage. Compared with air cooling, liquid cooling technology has a higher thermal conductivity due to its liquid medium and forced heat convection, resulting in better heat exchange performance than air convection and conventional metal heat conduction. The heat dissipation of liquid cooling systems can be more than 100 times that of traditional air cooling and conductive cooling. Furthermore, liquids have a higher specific heat capacity and thermal conductivity than air, making them more suitable for high-power energy storage systems.

[0004] Microchannels have become a current research hotspot due to their strong and efficient heat transfer characteristics, small size design, and precise temperature control capabilities.

[0005] Existing liquid-cooled chassis technology includes those with embedded titanium tubes and a three-sided liquid-cooling structure that can accommodate standard modules. The chassis employs a plug-in design, with a frame welded from aluminum alloy and internally embedded with 1mm thick, 8mm outer diameter titanium tubes. Titanium alloy offers advantages such as corrosion resistance, lightweight, and high strength. Replacing the internal flow channels with integrally welded titanium tubes effectively avoids coolant leakage and corrosion. To enhance heat dissipation, compressible thermally conductive adhesive plates are installed on the power module heat sources to reduce thermal resistance and accelerate heat dissipation. However, this chassis requires analysis of the heat dissipation of the power module's heat-generating components and calculation of the motherboard module's power consumption distribution, which lacks general applicability. Furthermore, the thermally conductive adhesive plates on the modules are prone to aging during use, leading to inconvenience in disassembly and maintenance.

[0006] In existing technologies, transverse series flow channels, considering the easily manufactured conventional serpentine series flow channel structure, occupy a small chassis area, with 7 flow channels evenly arranged on the upper and lower walls. Based on the chassis's structural dimensions, an attempt was made to design the flow channel cross-section as a 10mm × 5mm rectangular shape; however, for slot rails, with a uniformly distributed heat source at the contact surface, this type of flow channel results in significant temperature variations on the rails, with lower temperatures on the outer rails and higher temperatures in the middle rails. Taking this into account when calculating the heat-conducting ends of the module, the component temperature rise is relatively high. Summary of the Invention

[0007] To address the aforementioned technical problems in existing technologies, this invention proposes a microchannel heat dissipation structure within an optimized liquid-cooled plate flow channel, effectively improving the liquid-cooled heat exchange effect of the chassis. The battery module, composed of the liquid-cooled plate and battery cells, reduces the solid wall temperature of the power module, increasing the wall heat exchange area. Under the same liquid supply flow rate and ambient temperature conditions, it reduces the temperature rise of the slot rails within the chassis due to the liquid supply temperature. Under the same ambient temperature and liquid supply temperature conditions, it also optimizes the liquid supply flow rate for economical operation.

[0008] According to one aspect of the present invention, a liquid cooling plate is provided, comprising: The substrate, the shape and size of which are matched to the shape and size of the battery cell; A liquid cooling channel is provided on the substrate, the liquid cooling channel is coiled on the substrate, and one end of the liquid cooling channel is provided with an inlet and the other end is provided with an outlet, the inlet and the outlet are respectively located at different positions on the edge of the substrate; The cooling medium enters the cooling channel through the inlet, exchanges heat with the battery cells, and then flows out through the outlet.

[0009] A further improvement of the present invention is that the liquid cooling channel is arranged in a serpentine coil on the substrate.

[0010] A further improvement of the present invention is that the interior of the liquid cooling channel is provided with a plurality of oblique fin structures.

[0011] A further improvement of the present invention is that the oblique fin structure is generally a rectangular strip of metal sheet, one side of the oblique fin structure is disposed in the liquid cooling channel, and the other side is inclined outward and extends to the outside of the cooling channel and contacts the battery cell.

[0012] A further improvement of the present invention is that the liquid cooling channel includes an inflow section and an outflow section, wherein the cooling medium flows from the inlet to the center of the substrate in the inflow section, and the cooling medium flows from the center of the substrate to the outlet in the outflow section; Both the inflow section and the outflow section include several layers, and the inflow section and the outflow section are arranged to intertwine with each other to form a multi-layer structure.

[0013] A further improvement of the present invention is that the substrate is a rectangular structure, and the inflow and outflow sections of the cold channel both include a transverse straight channel portion, a longitudinal straight channel portion, and a curved portion.

[0014] According to another aspect of the invention, a battery module is also provided, comprising the aforementioned liquid cooling plate, and Battery cell; The liquid cooling plate is fixedly connected to the battery cell, and the liquid cooling plate dissipates heat from the battery cell.

[0015] A further improvement of the present invention is that the number of liquid cooling plates is one more than the number of battery cells, and the battery cells and the liquid cooling plates are arranged side by side at intervals.

[0016] According to another aspect of the invention, a chassis is also provided, comprising: The main body of the chassis, wherein the battery module is installed inside the chassis; and The front cover and rear cover are provided on both sides of the main body of the chassis, and both the front cover and the rear cover can be removed and installed on the main body of the chassis; The main body of the chassis is provided with a coolant inlet and a coolant outlet. The coolant inlet is connected to the inlet of all liquid cooling plates in the battery module, and the coolant outlet is connected to the outlet of all liquid cooling plates in the battery module.

[0017] A further improvement of the present invention is that a guide rail backplate is provided on the rear cover plate, and a plurality of slot guide rails are provided inside the chassis and on the guide rail backplate.

[0018] Compared with the prior art, the advantages of the present invention are as follows: The liquid cooling plate of this invention optimizes the microchannel heat dissipation structure within the flow channel, effectively improving the liquid cooling heat exchange effect of the chassis. Compared to transverse series flow channels, longitudinal series flow channels are beneficial for heat dissipation of modules near the liquid inlet, but the temperature uniformity of the chassis slot rails is poor, and the flow resistance is high. Considering temperature uniformity, flow resistance, and heat dissipation performance, the optimized transverse series microchannel flow channel has stronger performance.

[0019] The battery module composed of the liquid cooling plate and battery cells according to the present invention has the effect of reducing the solid wall temperature of the power module and increasing the heat exchange area of ​​the wall. Under the same liquid supply flow rate and ambient temperature conditions, it reduces the temperature rise of the slot rails inside the chassis due to the liquid supply temperature. Under the same ambient temperature and liquid supply temperature conditions, it optimizes the liquid supply flow rate variation while taking into account economic efficiency.

[0020] In the chassis according to the present invention, if a flow channel is arranged in the non-heat source area at the rear end, the impact on the temperature rise of the inner wall of the chassis is small, and it can be omitted, which can effectively reduce the flow resistance.

[0021] In the chassis according to the present invention, under the same liquid supply temperature and flow rate, the ambient temperature has a relatively small impact on the temperature rise inside the chassis. Under the same ambient temperature and liquid supply temperature, changes in the liquid supply flow rate have a certain impact on the heat dissipation performance of the liquid-cooled chassis. When the liquid supply flow rate increases to a certain extent, its impact on the heat dissipation performance of the chassis will become smaller and smaller, and the temperature rise of the chassis rails will also approach a constant value. Attached Figure Description

[0022] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, in which: Figure 1 The diagram shown is a structural schematic of a liquid cooling plate according to an embodiment of the present invention; Figure 2 The diagram shown is a structural schematic of a battery module according to an embodiment of the present invention; Figure 3 The diagram shown is a structural schematic of a chassis according to an embodiment of the present invention; The accompanying drawings are not drawn to scale.

[0023] The meanings of the reference numerals in the attached figures are as follows: 1. Liquid cooling plate, 2. Battery cell, 3. Chassis body, 4. Front cover, 5. Rear cover, 6. Coolant inlet, 7. Coolant outlet, 8. Guide rail back plate, 9. Slot guide rail, 11. Base, 12. Liquid cooling channel, 13. Inlet, 14. Outlet, 15. Slanted fins, 121. Inflow section, 122. Outflow section. Detailed Implementation

[0025] To make the technical solutions and advantages of the present invention clearer, exemplary embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not an exhaustive list of all embodiments. Furthermore, without conflict, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0026] The high-voltage DC power module is a core component of charging piles, typically with a fixed power output, adjusted according to the charging pile's power requirements. The stability of this component directly impacts the overall product quality and user experience. Research and disassembly of high-voltage constant-power charging modules on the market reveal that they generally employ a single-layer liquid cooling system with heat sinks for auxiliary heat dissipation. However, some heat remains concentrated within the module, resulting in less than ideal cooling performance.

[0027] Air cooling and liquid cooling are the mainstream thermal management methods for electrochemical energy storage. Compared with air cooling, liquid cooling technology has a higher thermal conductivity due to its liquid medium and forced heat convection, resulting in better heat exchange performance than air convection and conventional metal heat conduction. The heat dissipation of liquid cooling systems can be more than 100 times that of traditional air cooling and conductive cooling. Furthermore, liquids have a higher specific heat capacity and thermal conductivity than air, making them more suitable for high-power energy storage systems.

[0028] Microchannels have become a current research hotspot due to their strong and efficient heat transfer characteristics, small size design, and precise temperature control capabilities.

[0029] Existing liquid-cooled chassis technology includes those with embedded titanium tubes and a three-sided liquid-cooling structure that can accommodate standard modules. The chassis employs a plug-in design, with a frame welded from aluminum alloy and internally embedded with 1mm thick, 8mm outer diameter titanium tubes. Titanium alloy offers advantages such as corrosion resistance, lightweight, and high strength. Replacing the internal flow channels with integrally welded titanium tubes effectively avoids coolant leakage and corrosion. To enhance heat dissipation, compressible thermally conductive adhesive plates are installed on the power module heat sources to reduce thermal resistance and accelerate heat dissipation. However, this chassis requires analysis of the heat dissipation of the power module's heat-generating components and calculation of the motherboard module's power consumption distribution, which lacks general applicability. Furthermore, the thermally conductive adhesive plates on the modules are prone to aging during use, leading to inconvenience in disassembly and maintenance.

[0030] In existing technologies, transverse series flow channels, considering the easily manufactured conventional serpentine series flow channel structure, occupy a small chassis area, with 7 flow channels evenly arranged on the upper and lower walls. Based on the chassis's structural dimensions, an attempt was made to design the flow channel cross-section as a 10mm × 5mm rectangular shape; however, for slot rails, with a uniformly distributed heat source at the contact surface, this type of flow channel results in significant temperature variations on the rails, with lower temperatures on the outer rails and higher temperatures in the middle rails. Taking this into account when calculating the heat-conducting ends of the module, the component temperature rise is relatively high.

[0031] In such Figure 1 In the illustrated embodiment, a liquid cooling plate 1 includes: The substrate 11 has a shape and size that match the shape and size of the battery cell. For example, if the battery cell has a rectangular structure, the substrate 11 also has the same rectangular structure as the battery cell.

[0032] A liquid cooling channel 12 is provided on the substrate 11. The liquid cooling channel 12 is coiled on the substrate 11, and one end of the liquid cooling channel 12 is provided with an inlet 13 and the other end is provided with an outlet 14. The inlet 13 and the outlet 14 are respectively located at different positions on the edge of the substrate 11.

[0033] In the liquid cooling plate 1 according to this embodiment, the cooling medium enters the cooling channel through the inlet 13, and after heat exchange with the battery cells, flows out through the outlet 14, thereby carrying away heat.

[0034] In one embodiment, the liquid cooling channel 12 is coiled in a serpentine shape. Preferably, the liquid cooling channel 12 is arranged in a coiled serpentine shape rather than a meandering serpentine shape.

[0035] In the liquid cooling plate 1 according to this embodiment, the liquid cooling channel 12 is arranged in a serpentine pattern, which makes the entire heat dissipation field more uniform. Compared with the S-shaped or serpentine structure, the temperature is lower on the side near the inlet 13 and higher on the side near the outlet 14, which will cause uneven heat dissipation on both sides of the battery cell, thereby affecting the overall heat dissipation effect.

[0036] In this embodiment, the serpentine structure ensures the cooling effect of the entire liquid cooling plate 1 and avoids local overcooling or overheating.

[0037] In one embodiment, a plurality of inclined fins 15 are arranged inside the liquid cooling channel 12. One side of each inclined fin 15 is located inside the liquid cooling channel 12, while the other side slopes outward and extends to the outside of the cooling channel. When the liquid cooling plate 1 is assembled with the battery unit 2, the inclined fins 15 can contact the battery unit 2, thus playing a role in heat conduction.

[0038] In a preferred embodiment, the inclined fin 15 is a rectangular strip of metal with good thermal conductivity, which can transfer heat from the battery cell 2 to the cooling medium of the liquid cooling channel 12 and carry away the heat as the cooling medium flows.

[0039] The slanted fin 15 structure can effectively improve the flow of coolant. Experimental results show that the optimized slanted fin 15 type cold plate can control the average surface temperature of the battery below 50℃.

[0040] In one embodiment, the liquid cooling channel 12 includes a coiled multi-layer structure, which can be divided into an inflow section 121 and an outflow section 122 according to the direction of fluid flow. In the liquid cooling channel 12, the inflow section 121 is the part where the cooling medium flows from the inlet 13 to the center of the substrate 11, and the outflow section 122 is the part where the cooling medium flows from the center of the substrate 11 to the outlet 14.

[0041] The inflow section 121 comprises several layers, and the outflow section 122 also comprises several layers. The inflow section 121 and the outflow section 122 are arranged to intertwine with each other to form a multi-layer structure.

[0042] Specifically, the outermost inflow section 121 includes a first-layer inflow section connected to the inlet 13, and the outermost outflow section includes a first-layer outflow section connected to the outlet 14. The first-layer inflow section and the first-layer outflow section form a non-connected annulus on the substrate 11. The first inflow section connects to the second inflow section, and the second inflow section is arranged inside the first outflow section; the first outflow section connects to the second outflow section, and the second outflow section is arranged inside the first inflow section; and the second inflow section and the second outflow section; All other inner layers are connected in the same manner as described above.

[0043] The innermost inflow section and the innermost outflow section are connected at the center of the matrix 11.

[0044] In such Figure 1 In the embodiment shown, the inflow section and the outflow section are three layers, including a first inflow section and a first outflow section set in the outermost layer, a second inflow section and a second outflow section set in the middle layer, and a third inflow section and a third outflow section set in the inner layer.

[0045] The third-layer inflow section and the third-layer outflow section are connected by the innermost pipe of the innermost layer.

[0046] Figure 1 The above is just one implementation method. The number of layers in the inflow section 121 and the outflow section 122 can also be increased or decreased according to the actual situation.

[0047] In one embodiment, the shape of each inflow section 121 and outflow section 122 matches the shape of the substrate 11. For example, if the substrate 11 is rectangular, then each inflow section 121 and outflow section 122 is also a shape that matches the rectangle; if the substrate 11 is circular or elliptical, then the inflow section 121 or outflow section 122 is also an arc shape that matches it.

[0048] In a preferred embodiment, the substrate 11 is a rectangular structure, and the first layer inflow section 121 includes three parts: a transverse straight channel part, a longitudinal straight channel part, and a curved part. like Figure 1 As shown, the horizontal straight channel section is at the bottom, and the vertical straight channel section is on the left. The two are set perpendicularly, and the curved section connects the horizontal straight channel section and the vertical straight channel section; the three parts form a right-angled broken line structure. The curved portion is preferably arc-shaped or rounded to facilitate the smooth flow of the cooling medium; Similarly, the first-layer outflow section 122 also includes three parts: a transverse straight channel section, a longitudinal straight channel section, and a curved section. like Figure 1 As shown, the horizontal straight channel section is at the top, and the vertical straight channel section is on the right side. The two are set perpendicularly, and the curved section connects the horizontal straight channel section and the vertical straight channel section; the three parts form a right-angled broken line structure.

[0049] With the connection method of the liquid cooling plate 1 described in this embodiment, the cooling medium absorbs heat during the flow of the liquid cooling channel 12. The temperature of the cooling medium in the inflow section 121 is lower, and the temperature of the cooling medium in the outflow section 122 is higher.

[0050] By using the alternating arrangement of the lower-temperature inflow section 121 and the higher-temperature outflow section 122 in this embodiment, the overall temperature of the liquid cooling plate 1 can be made more uniform, avoiding the problem of one side being hot and the other side being cold. This improves the cooling effect on the battery.

[0051] In this embodiment, two variables are defined: channel width D and channel bending radius r. According to simulation results, a larger value for D / r results in lower thermal resistance and pressure loss, thus achieving the best cooling effect.

[0052] In one embodiment, the equivalent diameter of the flow channel is calculated: (h is the cross-sectional width, b is the cross-sectional height) Calculation of the spacing between two adjacent flow channels: Among them, Q m For mass flow rate, Q v For mass flow rate.

[0053] Based on the equivalent diameter of the microchannel flow channel and the corresponding flow velocity, the heat source of the contact surface between each slot and the power battery module is used for simulation in the simulation model. The liquid-cooled chassis has one fixed guide rail and one liquid cooling plate. For charging modules with different power ratings, corresponding to two different battery cell groups, the optimal microchannel equivalent diameter D is determined.

[0054] According to the law of conservation of energy, the heat transfer between the coolant and the upper and lower wall plates falls under the category of convective heat transfer. According to the cooling equation: Under the condition of equal heat exchange, if we want to reduce the solid wall temperature tw, we need to increase the heat exchange area A of the solid wall.

[0055] Therefore, fins with a thickness of 2mm are added to the cross-section of the serpentine channel, with a fin spacing of 3mm.

[0056] Regarding the required flow rate at coolant inlet 13, according to the law of conservation of energy: (Q represents power dissipation in W;) The specific heat capacity of coolant at constant pressure is J / (kg×℃); (ρ is the temperature difference between the inlet and outlet of the coolant; ρ is the density of the coolant - kg / m3) Based on the equivalent diameter of the flow channel and the corresponding flow velocity, a fixed, uniformly distributed heat source is set on the contact side between each slot guide rail 9 and the module in the simulation model to simulate the module's heat source. A fixed number of guide rails are placed on the top and bottom of the chassis to simulate heat dissipation. The chassis is simulated using ANSYS Icepak software.

[0057] According to another aspect of the present invention, a battery module is also provided, comprising the liquid cooling plate 1 described in the above embodiments, and Battery cell; The liquid cooling plate 1 is fixedly connected to the battery cell, and the liquid cooling plate 1 dissipates heat from the battery cell.

[0058] In one embodiment, the number of liquid cooling plates 1 is one more than the number of battery cells, and the battery cells are arranged side by side with the liquid cooling plates 1 at intervals.

[0059] Liquid cooling plates 1 are arranged on both sides of the battery cell module, and another liquid cooling plate 1 is arranged between the battery cells.

[0060] In such Figure 2 In the illustrated embodiment, there are two battery cells and three liquid cooling plates 1. The two battery cells are arranged side by side, with two liquid cooling plates 1 positioned on either side of the two battery cells, and a third liquid cooling plate 1 positioned between the two battery cells.

[0061] According to another aspect of the invention, a chassis is also provided, comprising: Chassis body 3, the battery module is installed inside the chassis; and The front cover plate 4 and the rear cover plate 5 are provided on both sides of the chassis body 3. Both the front cover plate 4 and the rear cover plate 5 can be removed and installed on the chassis body 3. The chassis body 3 is provided with a coolant inlet 6 and a coolant outlet 7. The coolant inlet 6 is connected to the inlet 13 of all liquid cooling plates 1 in the battery module, and the coolant outlet 7 is connected to the outlet 14 of all liquid cooling plates 1 in the battery module.

[0062] In a preferred embodiment, a guide rail backplate 8 is provided on the rear cover plate 5, and a plurality of slot guide rails 9 are provided inside the chassis and on the guide rail backplate 8.

[0063] The liquid cooling plate 1 of the present invention optimizes the microchannel heat dissipation structure within the flow channel, effectively improving the liquid cooling heat exchange effect of the chassis. Compared with the transverse series flow channel, the longitudinal series flow channel is beneficial for heat dissipation of modules near the liquid inlet, but the chassis slot guide rail 9 has poor temperature uniformity and high flow resistance. Considering temperature uniformity, flow resistance, and heat dissipation performance, the optimized transverse series microchannel flow channel has stronger performance.

[0064] The battery module composed of the liquid cooling plate 1 and the battery unit 2 according to the present invention has the effect of reducing the solid wall temperature of the power module and increasing the heat exchange area of ​​the wall. Under the same liquid supply flow rate and ambient temperature conditions, it reduces the temperature rise of the slot guide rail 9 inside the chassis due to the liquid supply temperature. Under the same ambient temperature and liquid supply temperature conditions, it optimizes the change of liquid supply flow rate for economic purposes.

[0065] In the chassis according to the present invention, if a flow channel is arranged in the non-heat source area at the rear end, the impact on the temperature rise of the inner wall of the chassis is small, and it can be omitted, which can effectively reduce the flow resistance.

[0066] In the chassis according to the present invention, under the same liquid supply temperature and flow rate, the ambient temperature has a relatively small impact on the temperature rise inside the chassis. Under the same ambient temperature and liquid supply temperature, changes in the liquid supply flow rate have a certain impact on the heat dissipation performance of the liquid-cooled chassis. When the liquid supply flow rate increases to a certain extent, its impact on the heat dissipation performance of the chassis will become smaller and smaller, and the temperature rise of the chassis rails will also approach a constant value.

[0067] It should be understood that the embodiments disclosed herein are not limited to the specific structures, processing steps, or materials disclosed herein, but should be extended to equivalent substitutions of these features as understood by those skilled in the art. It should also be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting.

[0068] In the description of this invention, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0069] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0070] Certain terms are used throughout this application to refer to specific system components. As those skilled in the art will recognize, the same components may often be referred to by different names, and therefore this application is not intended to distinguish components that differ only in name and not in function. The terms "an embodiment" or "embodiment" used in the specification mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. Therefore, the phrase "an embodiment" or "embodiment" appearing throughout the specification does not necessarily refer to the same embodiment.

[0071] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and to design various embodiments with various modifications suitable for a particular purpose.

[0072] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and / or modifications falling within the scope of the invention, and all changes and / or modifications made according to embodiments of the invention should be covered within the protection scope of the invention.

Claims

1. A liquid-cooled plate (1), characterized in that, include: The substrate (11) has a shape and size that match the shape and size of the battery cell; A liquid cooling channel (12) is provided on the substrate (11), the liquid cooling channel (12) is coiled on the substrate (11), and one end of the liquid cooling channel (12) is provided with an inlet (13) and the other end is provided with an outlet (14). The inlet (13) and the outlet (14) are respectively located at different positions on the edge of the substrate (11). The cooling medium enters the cooling channel through the inlet (13), and after heat exchange with the battery cells, it flows out through the outlet (14).

2. The liquid cooling plate according to claim 1, characterized in that, The liquid cooling channel (12) is arranged in a serpentine pattern on the substrate (11).

3. The liquid cooling plate according to claim 2, characterized in that, The liquid cooling channel (12) is provided with a structure of several oblique fins (15).

4. The liquid cooling plate according to claim 3, characterized in that, The inclined fin (15) structure is a rectangular strip of metal. One side of the inclined fin (15) structure is located in the liquid cooling channel (12), and the other side is inclined outward and extends to the outside of the cooling channel and contacts the battery cell (2).

5. The liquid cooling plate according to claim 4, characterized in that, The liquid cooling channel (12) includes an inflow section (121) and an outflow section (122). In the inflow section (121), the cooling medium flows from the inlet (13) to the center of the substrate (11), and in the outflow section (122), the cooling medium flows from the center of the substrate (11) to the outlet (14). Both the inflow section (121) and the outflow section (122) include several layers, and the inflow section (121) and the outflow section (122) are arranged to coil around each other to form a multi-layer structure.

6. The liquid cooling plate according to claim 5, characterized in that, The substrate (11) has a rectangular structure, and the inflow section (121) and outflow section (122) of the cold night channel both include a transverse straight channel section, a longitudinal straight channel section and a curved section.

7. A battery module, characterized in that, Including the liquid cooling plate (1) according to any one of claims 1 to 6, and Battery cell; The liquid cooling plate (1) is fixedly connected to the battery cell, and the liquid cooling plate (1) dissipates heat from the battery cell.

8. The battery module according to claim 7, characterized in that, The number of liquid cooling plates (1) is one more than the number of battery cells, and the battery cells are arranged side by side with the liquid cooling plates (1) at intervals.

9. A chassis, characterized in that, include: The main body of the chassis (3) is equipped with the battery module according to claim 7 or 8; as well as The front cover (4) and the rear cover (5) are provided on both sides of the chassis body (3), and both the front cover (4) and the rear cover (5) can be removed and installed on the chassis body (3); The chassis body (3) is provided with a coolant inlet (6) and a coolant outlet (7). The coolant inlet (6) is connected to the inlet (13) of all liquid cooling plates (1) in the battery module, and the coolant outlet (7) is connected to the outlet (14) of all liquid cooling plates (1) in the battery module.

10. The chassis according to claim 9, characterized in that, The rear cover plate (5) is provided with a guide rail back plate (8), and the inside of the chassis and the guide rail back plate (8) are provided with a number of slot guide rails (9).