Solid precursor source bottle

Abstract

The application relates to a solid precursor source bottle, comprising: a bottle body with a bottle bottom, a bottle wall and a bottle cap, the bottle bottom, the bottle wall and the bottle cap constitute a sealed vapor chamber, the bottle cap is provided with a carrier gas inlet and a vapor outlet; a carrier disc comprises a disc wall and a disc bottom, the disc wall extends in a first direction, the disc bottom is provided with a carrier gas sub-channel protruding towards the bottle cap, when a plurality of carrier discs are stacked, carrier gas flows through the plurality of carrier gas sub-channels in sequence; a plurality of vapor through holes are formed in the disc bottom, when solid precursor materials are placed on the disc bottom, the solid precursor materials cover the vapor through holes; after the carrier gas flows through the plurality of carrier gas sub-channels from the carrier gas inlet, the carrier gas carries the vapor between adjacent carrier discs, flows through the vapor through holes and the solid precursor materials and then flows to the vapor outlet. The source bottle enables the mixed gas of the vapor and the carrier gas to not only pass through filtration before being discharged but also be further fully mixed, can reduce the entrainment of solid small particles in the airflow and the re-sublimation phenomenon, and further guarantees the purity of the vapor supplied to the reaction chamber.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a solid-state precursor source bottle. Background Technology

[0002] In semiconductor manufacturing processes, the solid precursor source bottle, as a core component of atomic layer deposition and chemical vapor deposition systems, plays a crucial role in safely storing solid precursor materials. Its working principle involves precise temperature control of the source bottle via an external heat source, causing the solid precursor material to sublimate into vapor. This vapor is then carried by an inert carrier gas into the reaction chamber to participate in the thin film deposition process. The uniformity and stability of the vapor flow directly determine the microstructure, thickness consistency, and final device production yield of the deposited film, thus placing extremely high demands on the design of the source bottle's internal structure.

[0003] In existing technologies, source bottle designs with complex internal channels and stacked structures are often used to improve the uniformity of carrier gas and steam mixing. However, when cleaning and refurbishing these source bottles after use, the complexity of the geometry and the gaps between the multiple stacks make it difficult to completely remove residual precursor materials, which not only increases maintenance difficulty but may also lead to the risk of cross-contamination in subsequent use.

[0004] Furthermore, during the thermal sublimation process of solid precursor materials, the rising vapor flow can easily entrain tiny solid particles. Simultaneously, due to temperature changes or structural obstructions along the flow path, some vapor may re-condense into fine particles. These particles, mixed into the vapor flow, reduce the purity of the vapor supplied to the reaction chamber, thus affecting the quality of thin film deposition and process stability. Summary of the Invention

[0005] In view of this, the present application provides a solid precursor source bottle to solve at least one problem existing in the background art.

[0006] In a first aspect, embodiments of this application provide a solid precursor source bottle, the solid precursor source bottle comprising: The bottle body has a bottom, a wall and a cap. The bottom, the wall and the cap form a sealed vapor chamber. The cap is detachably connected to the wall. The cap has a carrier gas inlet and a vapor outlet. The carrier gas inlet is used to input carrier gas and the vapor outlet is used to discharge a mixture of carrier gas and vapor. Multiple carrier trays, each carrier tray including a tray wall and a tray bottom for placing solid precursor materials, the tray wall being connected to the edge of the tray bottom and extending along a first direction, the first direction being the direction of the central axis of the bottle, the tray bottom being provided with a carrier gas sub-channel protruding towards the bottle cap in the first direction, when multiple carrier trays are stacked in the vapor chamber along the first direction, the carrier gas flows through the multiple carrier gas sub-channels in sequence; The bottom of the disk has multiple steam through holes. When the solid precursor material is placed on the bottom of the disk, it covers the steam through holes. The carrier gas flows from the carrier gas inlet through multiple carrier gas sub-channels, carrying the steam between adjacent disks, and flows through the steam through holes and the solid precursor material to the steam outlet.

[0007] In conjunction with the first aspect of this application, in an alternative embodiment, the steam passage is circular in shape.

[0008] In conjunction with the first aspect of this application, in an alternative embodiment, the inner diameter of the steam through-hole is 10 μm to 15 μm.

[0009] In conjunction with the first aspect of this application, in an optional embodiment, a plurality of the steam through holes extend from the outer wall of the carrier gas sub-channel to the connection between the disk wall and the disk bottom, and are evenly distributed on the disk bottom.

[0010] In conjunction with the first aspect of this application, in an alternative embodiment, the central axis of the carrier gas subchannel is collinear with the central axis of the disk bottom.

[0011] In conjunction with the first aspect of this application, in an optional embodiment, the carrier disk further includes a guide plate, the guide plate having a through hole extending along the first direction and forming the carrier gas sub-channel; in the first direction, the height of the guide plate is the same as the height of the disk wall.

[0012] In conjunction with the first aspect of this application, in an optional embodiment, the end of the guide plate is provided with an annular mounting groove; the solid precursor source bottle further includes a sealing ring adapted to the annular mounting groove; when adjacent carrier disks are stacked, adjacent carrier gas sub-channels are sealed under the action of the sealing ring.

[0013] In conjunction with the first aspect of this application, in an optional embodiment, a first slot is provided at the end of the disk wall, and a second slot adapted to the first slot is provided at the connection between the disk bottom and the disk wall. When multiple disks are stacked, the first slot and the second slot engage with each other.

[0014] In conjunction with the first aspect of this application, in an optional embodiment, the carrier tray includes a first carrier tray and a second carrier tray stacked adjacent to each other. The first carrier tray is disposed adjacent to the bottom of the bottle. The bottom of the first carrier tray has a solid structure, and the guide plate of the first carrier tray has a plurality of carrier gas holes. When the carrier gas is transported to the first carrier tray through the carrier gas sub-channel, it flows through the plurality of carrier gas holes and carries away the steam generated by the first carrier tray through the steam passage holes of the second carrier tray.

[0015] In conjunction with the first aspect of this application, in an optional embodiment, the bottle body includes an upper bottle body, a lower bottle body, and a sealing connection assembly. The upper bottle body is detachably connected to the lower bottle body in the first direction, and the sealing connection assembly is connected at the connection between the upper bottle body and the lower bottle body, so that the upper bottle body and the lower bottle body are sealed together.

[0016] The solid precursor source bottle provided in this application embodiment, through multiple vapor passages set on the bottom of the disk and covered by solid precursor material, allows the mixture of vapor and carrier gas to not only be filtered before discharge but also to be further fully mixed. This reduces the entrainment and re-sublimation of solid particles in the gas flow and improves the uniformity of vapor and carrier gas mixing, further ensuring the purity of vapor supplied to the reaction chamber, and improving the quality of thin film deposition and device production yield.

[0017] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the solid precursor source bottle provided in an embodiment of this application; Figure 2 A cross-sectional view of a solid precursor source bottle provided in an embodiment of this application; Figure 3 for Figure 2 Enlarged view of point A in the middle; Figure 4 A three-dimensional structural diagram of the carrier disk in the solid precursor source bottle provided in the embodiments of this application; Figure 5 for Figure 4 The cross-sectional view of the carrier disk shown in the figure; Figure 6 This is a top view of the carrier disk in the solid precursor source bottle provided in an embodiment of this application.

[0019] Figure label: 100. Source bottle; 10. Bottle body; 101. Upper bottle body; 102. Lower bottle body; 103. Sealing connection assembly; 11. Bottle bottom; 12. Bottle wall; 13. Bottle cap; 131. Carrier gas inlet; 132. Steam outlet; 14. Steam chamber; 20. Carrier tray; 21. Tray wall; 211. First slot; 22. Tray bottom; 221. Carrier gas sub-channel; 222. Steam through-hole; 223. Second slot; 24. Deflector plate; 241. Annular mounting groove; 242. Carrier air port; 25. First carrier disk; 26. Second carrier disk. Detailed Implementation

[0020] To make the technical solution and beneficial effects of the present invention more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0021] In the description of this invention, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this invention and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. That is, they should not be construed as limiting this invention.

[0022] In this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" can explicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise explicitly specified.

[0023] In this invention, unless otherwise explicitly defined, the terms "installation," "connection," "linking," "fixing," and "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] In this invention, unless otherwise explicitly defined, the terms "above," "on top of," "over," "above," "below," "below," "below," or "below" for "first feature above second feature" can refer to the first and second features being in direct contact, or to the first and second features being in indirect contact through an intermediate medium. Furthermore, "above," "over," and "below" for "first feature above second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature below second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0025] Please refer to Figures 1 to 6 This application provides a solid precursor source bottle 100 (which may be simply referred to as "source bottle 100"), which includes a bottle body 10 and a plurality of carrier disks 20.

[0026] The bottle body 10 comprises a bottom 11, a wall 12, and a cap 13, which together form a sealed vapor chamber 14. The cap 13 is detachably connected to the wall 12, which can be achieved through threaded connection, snap-fit ​​connection, or flange connection. The cap 13 has a carrier gas inlet 131 and a vapor outlet 132. The carrier gas inlet 131 is used to input carrier gas into the vapor chamber 14; for example, the carrier gas inlet 131 can be an interface connected to an external carrier gas supply pipeline. The vapor outlet 132 is used to discharge the mixture of carrier gas and solid precursor material sublimated into gas; for example, the vapor outlet 132 can be an interface connected to a reaction chamber. This structure achieves effective sealing of the vapor chamber 14 while facilitating disassembly, cleaning, and maintenance of the interior of the source bottle 100.

[0027] Each tray 20 includes a tray wall 21 and a tray bottom 22 for placing solid precursor material. The tray wall 21 is connected to the edge of the tray bottom 22 and extends along a first direction. The first direction is the direction of the central axis of the bottle body 10. The tray bottom 22 protrudes in the first direction toward the bottle cap 13 and is provided with a carrier gas sub-channel 221. When multiple trays 20 are stacked in the vapor chamber 14 along the first direction, the carrier gas is guided to flow sequentially through multiple carrier gas sub-channels 221. For example, the carrier gas sub-channel 221 can be a simple protruding structure, so that an annular or central channel is formed between adjacent trays 20. This ensures that the carrier gas can be evenly distributed from the bottom up or from the center outward to each tray 20, making sufficient contact with the solid precursor material, thereby promoting uniform vapor generation and mixing. The stacking of the trays 20 can be achieved by simple placement or by alignment using a guide structure to ensure the continuity of the carrier gas sub-channels 221.

[0028] Furthermore, multiple steam through-holes 222 are formed on the bottom of the tray 22. When the solid precursor material is placed on the bottom of the tray 22, the solid precursor material covers the steam through-holes 222. For example, the steam through-holes 222 can be circular, rectangular, or elliptical, etc. The solid precursor material is placed on the bottom of the tray 22 in powder, granular, or block form, naturally covering these holes. After the carrier gas enters from the carrier gas inlet 131, it first flows through multiple carrier gas sub-channels 221. During this process, the carrier gas carries the steam formed by the sublimation of the solid precursor material between adjacent trays 20. Subsequently, this mixed gas flows through the steam through-holes 222 and the solid precursor material covering the through-holes, and finally flows to the steam outlet 132. This airflow path allows the carrier gas to filter potential solid particles in the steam while carrying the steam, through the covering effect of the solid precursor material, thereby improving the purity of the discharged steam. At the same time, the thorough mixing of the carrier gas and the steam also helps to improve the uniformity of the steam.

[0029] The solid precursor material in the embodiments of this application can be aluminum trichloride, molybdenum pentachloride, molybdenum dichlorodioxychloride, tungsten pentachloride, etc.

[0030] In this embodiment, multiple vapor through-holes 222 are provided on the bottom 22 of the pan, which can be covered by solid precursor material. This allows the mixture of vapor and carrier gas to be filtered before discharge and further fully mixed. This reduces the entrainment and re-sublimation of solid particles in the gas flow and improves the uniformity of vapor and carrier gas mixing. This further ensures the purity of the vapor supplied to the reaction chamber, improves the quality of thin film deposition and device production yield.

[0031] In one alternative embodiment, please refer to Figures 4 to 6 The steam passage 222 is circular in shape.

[0032] In this embodiment, the steam through-hole 222 is made circular, which improves the flowability of steam when it flows through the steam through-hole 222. In addition, the circular steam through-hole 222 has a smooth and continuous aperture edge, which enables the carrier gas and steam to form a more uniform and stable flow field when they flow through it, reducing flow resistance and effectively suppressing the generation of eddies and dead zones.

[0033] Furthermore, a uniform and stable flow field can reduce the risk of solid particles being entrained. Specifically, during the steam rise process, if the flow field is unstable or there are local high-speed regions, tiny particles of the solid precursor material may be mechanically carried away from the bottom of the pan 22 by the airflow. The stable airflow provided by the circular through-holes can reduce the shear force on the solid precursor material, thereby reducing particle shedding and entrainment. At the same time, by avoiding local high-pressure or low-pressure regions, the circular through-holes also help maintain the temperature and pressure uniformity within the steam chamber 14, thereby effectively reducing the possibility that steam will re-sublimate into small droplets or solid particles due to sudden temperature or pressure changes during its flow through the through-holes.

[0034] In this embodiment, the steam through-hole 222 is circular, which not only improves the mixing uniformity of the carrier gas and steam, but also enhances the purity and supply stability of the steam. As the carrier gas flows from the carrier gas inlet 131 through multiple carrier gas sub-channels 221, carrying steam between adjacent carrier disks 20, it flows through the circular steam through-hole 222 and the solid precursor material towards the steam outlet 132. The circular through-hole ensures smooth steam flow, reduces the introduction of impurities and flow interference, thereby providing a high-quality steam source for subsequent thin film deposition processes.

[0035] In an alternative embodiment, the inner diameter of the vapor passage 222 is 10 μm to 15 μm.

[0036] The solid precursor material provided in this embodiment can be aluminum trichloride, molybdenum pentachloride, molybdenum dichlorodioxychloride, or tungsten pentachloride, and the particle size of the above materials is 30 μm to 40 μm. Therefore, when the solid precursor material is placed on the bottom 22 of the pan, it can cover the steam through-hole 222. At the same time, the inner diameter range of the steam through-hole 222 can also allow the mixture of steam and carrier gas to flow smoothly.

[0037] In one alternative embodiment, please continue to refer to Figures 4 to 6 Multiple steam through holes 222 extend from the outer wall of the carrier gas sub-channel 221 to the connection between the disk wall 21 and the disk bottom 22, and are evenly distributed on the disk bottom 22.

[0038] This can be understood as the distribution range of the steam through-holes 222 starting from the outer wall of the carrier gas sub-channel 221 and extending outward until it approaches the connection line between the disk wall 21 and the disk bottom 22. This ensures that steam can diffuse from the side area of ​​the carrier gas sub-channel 221 and cover the edge area of ​​the disk bottom 22, thereby avoiding excessive concentration of steam in the central area of ​​the disk bottom 22 or the formation of dead zones in the edge area, promoting sufficient contact and uniform sublimation of steam with the solid precursor material. For example, the steam through-holes 222 can start from the outer wall of the carrier gas sub-channel 221 and be arranged radially or spirally outward until they approach the connection line between the disk wall 21 and the disk bottom 22; or, the steam through-holes 222 can form one or more rings around the outer wall of the carrier gas sub-channel 221 and extend outward, with the outermost through-hole located within a certain distance inside the connection between the disk wall 21 and the disk bottom 22.

[0039] Furthermore, multiple vapor through-holes 222 are evenly distributed on the bottom of the disk 22, ensuring that the solid precursor material can uniformly contact the carrier gas and vapor throughout the entire area of ​​the bottom of the disk 22. This achieves uniform sublimation and vapor carry-over, helping to avoid local overheating or undercooling and reducing the risk of sublimation and particle entrainment. For example, the vapor through-holes 222 can be arranged in a concentric circle array or a radial array on the bottom of the disk 22, such that the distance between any adjacent through-holes is approximately equal, or that a similar through-hole density is maintained in different areas; alternatively, the vapor through-holes 222 can be arranged in a grid-like or honeycomb pattern to cover the entire area of ​​the bottom of the disk 22, ensuring uniform vapor flow and comprehensive coverage of the solid precursor material.

[0040] In one alternative embodiment, please continue to refer to Figures 4 to 6 The central axis of the carrier gas sub-channel 221 is collinear with the central axis of the disk bottom 22. This can be understood as the carrier gas sub-channel 221 being located at the center of the disk bottom 22, which ensures uniform sublimation of the precursor material and symmetrical distribution of vapor.

[0041] After flowing out of the carrier gas sub-channel 221, the carrier gas diffuses uniformly in a centrosymmetric manner to the solid precursor material region on the bottom 22 of the disk and flows uniformly through multiple vapor passages 222. This uniform carrier gas distribution avoids biased flow or excessively fast / slow local flow rates, ensuring that the carrier gas efficiently and uniformly carries the vapor generated by the sublimation of the solid precursor material. This not only improves the efficiency of the carrier gas in carrying vapor and reduces dead zones or localized concentration inconsistencies within the chamber, but also helps maintain the purity and stability of the vapor flow, reducing the risk of re-sublimation or entrainment of small solid particles during vapor ascent. Ultimately, this significantly improves the uniformity of the carrier gas-vapor mixing, thereby enhancing the thickness consistency of the deposited film.

[0042] In one alternative embodiment, please refer to Figures 3 to 6The carrier plate 20 also includes a guide plate 24, which has a through hole extending in a first direction and forms a carrier gas sub-channel 221. In the first direction, the height of the guide plate 24 is the same as the height of the plate wall 21.

[0043] The deflector 24 is mainly used to guide the flow direction of the carrier gas. The deflector 24 can be fixed to the bottom of the tray 22 by welding, threaded connection or snap-fit; or, the deflector 24 can be integrally formed with the bottom of the tray 22 by injection molding, casting or 3D printing. The material of the deflector 24 is usually selected to be compatible with the solid precursor material and is resistant to high temperature and corrosion, such as stainless steel, quartz glass or special ceramics.

[0044] The guide plate 24 has a through-hole extending along a first direction, forming a carrier gas sub-channel 221. This through-hole is a continuous channel formed inside the guide plate 24, with its axis aligned with the central axis of the bottle body 10. This through-hole directly serves as the carrier gas sub-channel 221, guiding the carrier gas along a predetermined path when multiple carrier trays 20 are stacked. The cross-sectional shape of the through-hole can be circular, square, or polygonal to adapt to different fluid dynamics requirements and manufacturing processes. For example, it can be designed as a circular channel with a smooth inner wall to reduce airflow resistance; or it can be designed as a channel with a specific inner wall texture to promote uniform airflow distribution.

[0045] The height of the guide vane 24 is the same as the height of the disk wall 21, allowing the guide vane 24 and the disk wall 21 to be tightly aligned when adjacent disks 20 are stacked. This further enhances the fit between components, effectively prevents lateral leakage, and maintains the regularity of the overall structure. This not only simplifies the cleaning and maintenance process of the source bottle 100 and reduces the risk of residue accumulation, but also improves the overall performance of the solid-state precursor source bottle 100 and the quality of the deposited thin film by improving airflow uniformity and sealing.

[0046] Furthermore, the end of the guide plate 24 is provided with an annular mounting groove 241; the solid precursor source bottle 100 also includes a sealing ring adapted to the annular mounting groove 241; when adjacent carrier plates 20 are stacked, the adjacent carrier gas sub-channels 221 are sealed under the action of the sealing ring.

[0047] The sealing ring is an elastic and compressible ring-shaped component whose geometry and dimensions are precisely matched to the annular mounting groove 241 to ensure a tight fit within the groove. The sealing ring is typically made of a material that is resistant to high temperatures and chemical corrosion and possesses good elasticity, such as fluororubber, perfluoroether rubber, or polytetrafluoroethylene.

[0048] When multiple carrier disks 20 are stacked along a first direction, the bottom of the bottom 22 of the previous carrier disk 20 comes into contact with the end of the guide plate 24 of the next carrier disk 20. At this time, the sealing ring installed in the annular mounting groove 241 is compressed, and its elastic deformation causes the sealing ring to fit tightly between adjacent contact surfaces, thereby forming an airtight barrier between adjacent carrier gas sub-channels 221. This prevents carrier gas from leaking from the connection of the carrier gas sub-channels 221 and ensures that the carrier gas flows along a preset path.

[0049] This embodiment of the application utilizes a sealing ring to ensure the sealing of the carrier gas sub-channel 221, which can ensure that the carrier gas flow path and the steam flow path flow along the preset path, further ensuring the stability of each flow path in the steam chamber 14, and at the same time ensuring the uniformity of the mixing of steam and carrier gas.

[0050] In one alternative embodiment, please refer to Figures 3 to 5 The tray 20 has a first slot 211 at the end of the tray wall 21, and a second slot 223 that matches the first slot 211 is provided at the connection between the tray bottom 22 and the tray wall 21. When multiple trays 20 are stacked, the first slot 211 and the second slot 223 are engaged with each other.

[0051] The first slot 211 can be an annular groove extending circumferentially on the outer or inner side of the disk wall 21, or it can be an annular protrusion protruding outward or inward at the edge of the disk wall 21 to form a snap-fit ​​surface. In addition, the first slot 211 can also be multiple buckles or latches distributed circumferentially along the disk wall 21 to achieve segmented snap-fit.

[0052] The second slot 223 matches the first slot 211 to form a complementary snap-fit. The function of the second slot 223 is to work in conjunction with the first slot 211 to ensure precise alignment and secure fixation of the carrier trays 20 during stacking. For example, if the first slot 211 is a recess, the second slot 223 can be designed as a corresponding protrusion; conversely, if the first slot 211 is a protrusion, the second slot 223 can be designed as a corresponding recess. The second slot 223 can also be a snap or tongue with a shape complementary to the first slot 211 to achieve a reliable connection. When multiple carrier trays 20 are stacked, the first slot 211 and the second slot 223 snap together, meaning that adjacent carrier trays 20 are securely connected together through physical contact and structural interlocking.

[0053] When the carrier disks 20 are stacked along the first direction, the ends of the disk walls 21 of adjacent carrier disks 20 are interlocked with the disk bottoms 22 via a slot structure, thereby preventing the carrier disks 20 from becoming unstable or misaligned during operation. This further ensures the precise alignment and continuity of the carrier gas sub-channels 221 and the steam through-holes 222, allowing the carrier gas to flow uniformly through each carrier disk 20 along a preset path and efficiently carry steam. Therefore, the mixing uniformity of the carrier gas and steam is significantly improved, thereby ensuring the uniform sublimation of the solid precursor material and the purity of the steam.

[0054] In one alternative embodiment, please refer to Figure 3 The carrier tray 20 includes a first carrier tray 25 and a second carrier tray 26 stacked adjacent to each other. The first carrier tray 25 is disposed adjacent to the bottle bottom 11. The bottom 22 of the first carrier tray 25 has a solid structure, and the guide plate 24 of the first carrier tray 25 has a plurality of carrier gas holes 242. When the carrier gas is transported to the first carrier tray 25 through the carrier gas sub-channel 221, it flows through the plurality of carrier gas holes 242 and carries away the steam generated by the first carrier tray 25 through the steam through hole 222 of the second carrier tray 26.

[0055] The fact that the first carrier tray 25 is adjacent to the bottle bottom 11 indicates that the first carrier tray 25 is the bottommost of the stacked carrier trays 20. The bottom 22 of the first carrier tray 25 is a solid structure, which can prevent the carrier gas or steam from leaking directly downwards or short-circuiting from the bottom 22 of the first carrier tray 25, forcing the carrier gas and steam to flow upwards along a preset path; it can also prevent the solid precursor material located in the first carrier tray 25 from leaking into the bottom of the bottle bottom 11 through the steam through hole 222, thus ensuring the utilization rate of the solid precursor material and avoiding increasing the difficulty of cleaning.

[0056] It should be noted that although the particle size of the solid precursor material is larger than the pore size of the vapor passage 222, the particle size of the solid precursor material will decrease during the continuous sublimation process, and some solid precursor material may leak down through the vapor passage 222. Even if solid precursor material in the multiple carriers 20 above the first carrier 25 leaks down, it will fall onto other carriers 20, and will not reduce the material utilization rate.

[0057] In addition, the guide plate 24 of the first carrier plate 25 is provided with multiple air carrier holes 242, which can ensure that the air carrier flows to the space between adjacent carrier plates 20 to carry away the generated steam. The air carrier holes 242 can be various geometric shapes such as circular, elliptical, rectangular or slit-shaped, and can be distributed on the guide plate 24 in an array, ring or spiral pattern according to the requirements of air carrier flow rate and distribution uniformity. For example, the air carrier holes 242 can be evenly distributed around the circumference of the guide plate 24, or concentrated near the center of the bottom 22 of the plate.

[0058] In one alternative embodiment, please refer to Figure 1 The bottle body 10 includes an upper bottle body 101, a lower bottle body 102, and a sealing connection assembly 103. The upper bottle body 101 is detachably connected to the lower bottle body 102 in a first direction. The sealing connection assembly 103 is connected to the connection between the upper bottle body 101 and the lower bottle body 102 so that the upper bottle body 101 and the lower bottle body 102 are sealed together.

[0059] The upper bottle body 101 and the lower bottle body 102 constitute the main body of the steam chamber 14. The upper bottle body 101 and the lower bottle body 102 can be detachably connected by flanges and bolts. That is, both the upper bottle body 101 and the lower bottle body 102 are equipped with flanges at the connection point, and the two flanges are fastened together by bolts. Alternatively, clamps or quick couplings can be used for connection to achieve quick disassembly and installation. The sealing connection assembly 103 can ensure the sealing of the connection point between the upper bottle body 101 and the lower bottle body 102, ensure the integrity of the steam chamber 14, and prevent internal steam leakage and the entry of external air or impurities.

[0060] In this embodiment, the bottle 10 is designed as a split structure, making its internal structure easier to expose and improving the convenience of thoroughly cleaning any residual precursor material inside the bottle 10, thus ensuring the cleanliness of the source bottle 100. Furthermore, the detachable connection simplifies the disassembly and assembly process, shortens maintenance time, and improves the maintenance efficiency of the source bottle 100. Overall, this split bottle 10 design, while maintaining the overall airtightness of the steam chamber 14, improves the maintainability of the source bottle 100 and the purity of the steam.

[0061] It should be understood that the above embodiments are exemplary and not intended to encompass all possible implementations. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A solid precursor source bottle, characterized in that, The solid precursor source bottle (100) includes: The bottle body (10) has a bottle bottom (11), a bottle wall (12) and a bottle cap (13). The bottle bottom (11), the bottle wall (12) and the bottle cap (13) constitute a sealed steam chamber (14). The bottle cap (13) is detachably connected to the bottle wall (12). The bottle cap (13) has a carrier gas inlet (131) and a steam outlet (132). The carrier gas inlet (131) is used to input carrier gas, and the steam outlet (132) is used to discharge a mixture of carrier gas and steam. Multiple carrier trays (20) are provided, each carrier tray (20) including a tray wall (21) and a tray bottom (22) for placing solid precursor materials. The tray wall (21) is connected to the edge of the tray bottom (22) and extends along a first direction, which is the direction of the central axis of the bottle body (10). The tray bottom (22) is provided with a carrier gas sub-channel (221) protruding towards the bottle cap (13) in the first direction. When multiple carrier trays (20) are stacked in the vapor chamber (14) along the first direction, the carrier gas flows through the multiple carrier gas sub-channels (221) in sequence. The bottom of the disk (22) is provided with multiple steam through holes (222). When the solid precursor material is placed on the bottom of the disk (22), it covers the steam through holes (222). The carrier gas flows from the carrier gas inlet (131) through multiple carrier gas sub-channels (221), carrying the steam between adjacent carrier disks (20), and flows through the steam through holes (222) and the solid precursor material to the steam outlet (132).

2. The solid precursor source bottle according to claim 1, characterized in that, The steam passage (222) is circular in shape.

3. The solid precursor source bottle according to claim 2, characterized in that, The inner diameter of the steam through-hole (222) is 10 μm to 15 μm.

4. The solid precursor source bottle according to claim 1, characterized in that, Multiple steam through holes (222) extend from the outer wall of the carrier gas sub-channel (221) to the connection between the disk wall (21) and the disk bottom (22), and are evenly distributed on the disk bottom (22).

5. The solid precursor source bottle according to claim 1, characterized in that, The central axis of the carrier gas sub-channel (221) is collinear with the central axis of the bottom plate (22).

6. The solid precursor source bottle according to any one of claims 1 to 5, characterized in that, The carrier disk (20) also includes a guide plate (24), which has a through hole extending along the first direction and forms the carrier gas sub-channel (221); in the first direction, the height of the guide plate (24) is the same as the height of the disk wall (21).

7. The solid precursor source bottle according to claim 6, characterized in that, The guide plate (24) has an annular mounting groove (241) at its end; the solid precursor source bottle (100) also includes a sealing ring adapted to the annular mounting groove (241); when adjacent carrier plates (20) are stacked, the adjacent carrier gas sub-channels (221) are sealed under the action of the sealing ring.

8. The solid precursor source bottle according to any one of claims 1 to 5, characterized in that, The end of the disk wall (21) is provided with a first slot (211), and the connection between the disk bottom (22) and the disk wall (21) is provided with a second slot (223) that is adapted to the first slot (211). When multiple disks (20) are stacked, the first slot (211) and the second slot (223) are engaged with each other.

9. The solid precursor source bottle according to claim 6, characterized in that, The carrier tray (20) includes a first carrier tray (25) and a second carrier tray (26) stacked adjacent to each other. The first carrier tray (25) is disposed adjacent to the bottle bottom (11). The bottom (22) of the first carrier tray (25) is a solid structure. The guide plate (24) of the first carrier tray (25) is provided with a plurality of air carrier holes (242). When the air carrier is transported to the first carrier tray (25) through the air carrier sub-channel (221), it flows through the plurality of air carrier holes (242) and carries away the steam generated by the first carrier tray (25) through the steam passage (222) of the second carrier tray (26).

10. The solid precursor source bottle according to any one of claims 1 to 5, characterized in that, The bottle body (10) includes an upper bottle body (101), a lower bottle body (102), and a sealing connection assembly (103). The upper bottle body (101) is detachably connected to the lower bottle body (102) in the first direction. The sealing connection assembly (103) is connected at the connection between the upper bottle body (101) and the lower bottle body (102) so that the upper bottle body (101) and the lower bottle body (102) are sealed together.

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