Power generation device

Abstract

The present disclosure aims to suppress heat generation of a single-phase diode bridge itself and a pattern directly below the same in a case where the single-phase diode bridge is used instead of a three-phase inverter mounted on a three-phase four-wire 400V air conditioner. A power generation device (100) includes a first inverter (20A) and a second inverter (20B) mounted on a printed wiring board (10). The first inverter (20A) includes a first diode bridge (21Aa) and a second diode bridge (21Ab) that convert alternating-current power into direct-current power, the first diode bridge (21Aa) being connected between a first wiring (11) connected to an R phase and a second wiring (12) connected to an S phase, and the second diode bridge (21Ab) being connected between the second wiring (12) and a third wiring (13) connected to a T phase. The second inverter (20B) includes a third diode bridge (21B) connected between a fourth wiring (14) connected to an N phase and a fifth wiring (15) branched from the first wiring (11) that converts alternating-current power into direct-current power.

Description

Technical Field

[0001] This invention relates to a power generation device for a three-phase four-wire 400V air conditioner. Background Technology

[0002] In a three-phase four-wire 400V air conditioner, the 400V converter circuit installed in the outdoor unit, as disclosed in Patent Document 1 (Japanese Patent Application Publication No. 2012-165509), is generally composed of a three-phase diode bridge.

[0003] On the other hand, in order to get rid of the high cost of three-phase diode bridges, the use of two single-phase diode bridges is being studied. Summary of the Invention

[0004] The problem that the invention aims to solve

[0005] However, in a three-phase four-wire 400V air conditioner, in order to replace one three-phase diode bridge, two single-phase diode bridges are used, which raises the issue of suppressing the heat generation of the single-phase diode bridges themselves and the pattern directly below them.

[0006] Methods for solving problems

[0007] The power generation device of the first viewpoint is a power generation device installed on a printed circuit board, wherein the power generation device includes input terminals, a first wiring, a second wiring, a third wiring, and a fourth wiring, a first converter, a fifth wiring, and a second converter. The input terminals are configured to receive three-phase AC power supplied in a three-phase four-wire configuration from phases R, S, T, and N. The first wiring, second wiring, third wiring, and fourth wiring are connected to phases R, S, T, and N, respectively, via the input terminals. The first converter includes a first diode bridge and a second diode bridge, converting AC power to DC power. The first diode bridge is connected between two power lines selected as a first combination from the three power lines (first, second, and third wiring), and the second diode bridge is connected between two power lines selected as a second combination different from the first combination. The fifth wiring branches off from any one of the first, second, and third wirings. The second converter includes a third diode bridge connected between the fourth and fifth wirings, converting AC power to DC power.

[0008] In this power generation device, one side of the input of the second converter is connected to any one of the first, second, and third wirings between the input terminal and the first converter, and the other side of the input of the second converter is connected to the fourth line (N phase). Therefore, it is possible to suppress the increase in the current value of the first diode bridge and the second diode bridge flowing through the first converter.

[0009] The second viewpoint describes a power generation device mounted on a printed circuit board. This device includes input terminals, a first wiring, a second wiring, a third wiring, a fourth wiring, a first converter, a fifth wiring, and a second converter. The input terminals are configured to receive three-phase AC power supplied via a three-phase four-wire power supply to phases R, S, T, and N. The first, second, third, and fourth wirings are connected to phases R, S, T, and N, respectively, via the input terminals. The first converter includes a first diode bridge and a second diode bridge, converting AC power to DC power. The first diode bridge is connected to one of the three power lines selected from the first, second, and third wirings, and the second diode bridge is connected between the remaining two power lines. The fifth wiring branches off from any one of the first, second, and third wirings. The second converter includes a third diode bridge connected between the fourth and fifth wirings, converting AC power to DC power.

[0010] In this power generation device, one side of the input of the second converter is connected to any one of the first, second, and third wirings between the input terminal and the first converter, and the other side of the input of the second converter is connected to the fourth line (N phase). Therefore, it is possible to suppress the increase in the current value of the first diode bridge and the second diode bridge flowing through the first converter.

[0011] In the power generation device of the third viewpoint, in the power generation device of the first or second viewpoint, the branch point of the fifth wiring is located between the center of the length of the wiring from which the fifth wiring branches off and the input terminal.

[0012] In this power generation device, the branch point of the fifth wiring is separated from the first converter by maintaining a distance of at least half of the interval from the input terminal to the first converter. In this way, by keeping the branch point of the fifth wiring away from the first converter, the heat generated at the branch point of the fifth wiring is less likely to be conducted to the first converter, thus suppressing heat concentration around the terminals of the first converter.

[0013] The power generation device of the fourth viewpoint, in any of the power generation devices of the first to third viewpoints, further includes a sixth wiring and a seventh wiring, as well as a third converter. The sixth and seventh wirings branch off from any two of the first, second, and third wirings. The third converter includes a fourth diode bridge connected between the sixth and seventh wirings, converting alternating current (AC) power to direct current (DC) power.

[0014] In this power generation device, the two inputs of the third converter are respectively connected to any two of the first wiring, second wiring and third wiring between the input terminal and the first converter. Therefore, it is possible to suppress the increase of the current value of the first diode bridge and the second diode bridge flowing through the first converter.

[0015] In the power generation device of the fifth viewpoint, in any of the power generation devices of the first to fourth viewpoints, the first diode bridge and the second diode bridge are four diode chips bridged together and embedded in a packaged diode module. The two diode modules are mounted on the first side of the printed circuit board.

[0016] The power generation device of the sixth viewpoint, in contrast to the power generation device of the fifth viewpoint, includes a diode module having terminal groups and terminal mounting surfaces for arranging the terminal groups. In the terminal groups, two AC input terminals and two DC output terminals are arranged in a row in a first direction. The two diode modules are configured such that their respective terminal groups are spaced apart by a surface distance of more than 3.2 mm, and their respective terminal mounting surfaces are not opposite each other.

[0017] In this power generation device, since the terminal groups of the two diode modules are not opposite each other, heat concentration towards the terminals and conductive patterns is suppressed.

[0018] In the power generation device of the seventh viewpoint, the diode module has a heat sink, as in the power generation device of the fifth viewpoint.

[0019] The power generation device of the eighth viewpoint, in the power generation device of the fifth viewpoint, has a diode module with two AC input terminals and two DC output terminals. At least one of a varistor and a surge absorber is connected between the two AC input terminals.

[0020] In this power generation device, even if a voltage exceeding a specified value is applied between the AC input terminals, the voltage between the AC input terminals can be limited to a specified value.

[0021] The power generation device of the ninth viewpoint, compared to the power generation device of the fifth viewpoint, has a diode module with two AC input terminals and two DC output terminals. At least one of a varistor and a film capacitor is connected between the two DC output terminals.

[0022] In this power generation device, external pulses or power noise are absorbed, thereby preventing the transmission of noise to the AC power source.

[0023] The power generation device of the tenth viewpoint, in any of the power generation devices of the first to ninth viewpoints, further includes a first inverter circuit connected between the output terminals of the first converter. The first inverter circuit is a power module with upper arm-side switching elements and lower arm-side switching elements integrated into a package and mounted on the first side of a printed circuit board.

[0024] In this power generation device, modularity makes it easy to design the peripheral circuitry on the first surface of the printed wiring board, which serves as the mounting surface.

[0025] The power generation device of the eleventh viewpoint, in any of the power generation devices of the first to tenth viewpoints, further includes a second inverter circuit connected between the output terminals of the second converter. The second inverter circuit is a power module with upper arm-side switching elements and lower arm-side switching elements integrated into a package and mounted on the first side of a printed circuit board.

[0026] In this power generation device, modularity makes it easy to design the peripheral circuitry on the first surface of the printed wiring board, which serves as the mounting surface.

[0027] In the power generation device of the twelfth viewpoint, in any of the power generation devices of the first to eleventh viewpoints, the printed wiring board is a multilayer printed wiring board having multiple conductive pattern layers stacked with an insulating layer between them.

[0028] In this power generation device, conductive patterns can be wired not only on the surface of the printed wiring board, but also on the inner layer, thus enabling high-density mounting of components.

[0029] The power generation device of the thirteenth viewpoint, in addition to the power generation device of the fifth viewpoint, also includes a first inverter circuit, a second inverter circuit, and a heat sink. The first inverter circuit is connected between the output terminals of the first converter. The second inverter circuit is connected between the output terminals of the second converter. The first inverter circuit and the second inverter circuit are respectively upper arm-side switching elements and lower arm-side switching elements built into a packaged power module, mounted on the first side of the printed circuit board. The heat sink cools the two diode modules and the two power modules.

[0030] In this power generation device, a heat sink cools two diode modules and two power modules, thus enabling a reduction in the number of components and the amount of space required for installation. Attached Figure Description

[0031] Figure 1 This is a circuit diagram showing the structure of the power generation device according to the first embodiment of the present disclosure.

[0032] Figure 2 This is a structural diagram of the inverter circuit and the drive circuit that drives the inverter circuit.

[0033] Figure 3A This is a top view of the diode modules used as the first and second diode bridges.

[0034] Figure 3B This is a side view of the diode module used as the first diode bridge and the second diode bridge.

[0035] Figure 4This is a top view showing the mounting positions of the first and second diode bridges on the printed wiring board.

[0036] Figure 5 This is a top view showing the mounting positions of the first diode bridge and the second diode bridge on the printed wiring board of the first modified example.

[0037] Figure 6 This is a top view showing the mounting positions of the first diode bridge and the second diode bridge on the printed wiring board of the second variant.

[0038] Figure 7 This is a top view showing the mounting positions of the first diode bridge and the second diode bridge on the printed wiring board of the third variation.

[0039] Figure 8 This is a circuit diagram showing the structure of the power generation device according to the second embodiment of this disclosure.

[0040] Figure 9 This is a top view of the heat sink used to cool the first diode bridge, the second diode bridge, the first inverter circuit, and the second inverter circuit.

[0041] Figure 10 This is a circuit diagram showing the structure of a power generation device that includes a first diode bridge connected to one of the three power lines selected from the first, second, and third power lines, and a second diode bridge connected between the remaining two power lines.

[0042] Figure 11 This is another circuit diagram showing the structure of a power generation device including a first diode bridge connected to one of the three power lines selected from the first, second, and third power lines, and a second diode bridge connected between the remaining two power lines.

[0043] Figure 12 It is Figure 10 The wiring method of the first diode bridge in the middle is applied to Figure 8 The circuit diagram under the following conditions.

[0044] Figure 13 It is Figure 11 The wiring method of the first diode bridge in the middle is applied to Figure 8 The circuit diagram under the following conditions. Detailed Implementation

[0045] <First Implementation>

[0046] (1) Overview of the power generation device 100

[0047] Figure 1This is a circuit diagram showing the structure of the power generation apparatus 100 according to the first embodiment of this disclosure. Figure 1 In the power generation device 100, a first converter 20A and a second converter 20B are mounted on the first surface 10a of the printed wiring board 10.

[0048] The first converter 20A includes: a first diode bridge 21Aa connected between two power lines selected as a first combination from three power lines: a first wiring 11, a second wiring 12, and a third wiring 13; and a second diode bridge 21Ab connected between two power lines selected as a second combination from the three power lines, which is different from the first combination.

[0049] In this embodiment, the first converter 20A includes a first diode bridge 21Aa connected between a first wiring 11 connected to phase R and a second wiring 12 connected to phase S, and a second diode bridge 21Ab connected between the second wiring 12 and a third wiring 13 connected to phase T, to convert AC power into DC power.

[0050] The second converter 20B includes a third diode bridge 21B connected between a fourth wiring 14 connected to the N phase and a fifth wiring 15 branching from the first wiring 11, which converts AC power into DC power.

[0051] The power generation device 100 disclosed herein is, for example, installed in the outdoor unit of a three-phase four-wire 400V air conditioner.

[0052] (2) Detailed structure

[0053] (2-1) Printed wiring board 10

[0054] The printed wiring board 10 is a multilayer printed wiring board having multiple conductive pattern layers stacked with an insulating layer between them.

[0055] The printed wiring board 10 is equipped with input terminals 9, a first converter 20A, a second converter 20B, a first inverter circuit 25A, a second inverter circuit 25B, a switching power supply 31, a four-way commutator circuit 32, and multiple microcontrollers that control these components, which are components of the power generation device 100.

[0056] The input terminal 9 is configured to receive the R-phase, S-phase, T-phase, and N-phase AC power from an AC power supply 91 that provides three-phase AC power in a three-phase four-wire configuration. The first wiring 11, the second wiring 12, the third wiring 13, and the fourth wiring 14, which are conductive patterns, are connected to the R-phase, S-phase, T-phase, and N-phase of the AC power supply 91, respectively, via the input terminal 9.

[0057] (2-2) First converter 20A

[0058] The first converter 20A includes a first diode bridge 21Aa, a second diode bridge 21Ab, and a first smoothing capacitor 22A.

[0059] The first diode bridge 21Aa is a single-phase diode bridge. The first diode bridge 21Aa performs full-wave rectification on the AC power input from the first wiring 11 connected to phase R and the second wiring 12 connected to phase S.

[0060] The second diode bridge 21Ab is a single-phase diode bridge. The second diode bridge 21Ab performs full-wave rectification on the AC power input from the second wiring 12 and the third wiring 13 connected to phase T.

[0061] The first diode bridge 21Aa and the second diode bridge 21Ab are four diode chips bridged together and integrated into a single packaged diode module. The first diode bridge 21Aa and the second diode bridge 21Ab are mounted on the first surface 10a of the printed wiring board 10.

[0062] The first smoothing capacitor 22A smooths the output voltage from the first diode bridge 21Aa and the second diode bridge 21Ab.

[0063] (2-3) Second converter 20B

[0064] The second converter 20B includes a third diode bridge 21B and a second smoothing capacitor 22B. The third diode bridge 21B is a single-phase diode bridge.

[0065] The third diode bridge 21B performs full-wave rectification of the AC power input from the fourth wiring 14 connected to phase N and the fifth wiring 15 branching from the first wiring 11.

[0066] The branching fifth wiring 15 can be any one of the first wiring 11, the second wiring 12, and the third wiring 13.

[0067] The third diode bridge 21B is a diode module with four diode chips integrated into a single package.

[0068] The second smoothing capacitor 22B smooths the output voltage from the third diode bridge 21B.

[0069] (2-4) Voltage detection unit 23A

[0070] The voltage detection unit 23A is connected to the output side of the first smoothing capacitor 22A to detect the voltage across the first smoothing capacitor 22A. The voltage detection unit 23A is configured such that two resistors connected in series are connected in parallel with the smoothing capacitor 22A, thus dividing the voltage across the first smoothing capacitor 22A. The voltage value at the junction of these two resistors is input to the first microcontroller 27A.

[0071] (2-5) Voltage detection unit 23B

[0072] The voltage detection unit 23B is connected to the output side of the second smoothing capacitor 22B to detect the voltage across the second smoothing capacitor 22B. The voltage detection unit 23B is configured such that two resistors connected in series are connected in parallel with the second smoothing capacitor 22B, causing a voltage divider across the second smoothing capacitor 22B. The voltage value at the junction of these two resistors is input to the second microcontroller 27B.

[0073] (2-6) Current detection unit 24A

[0074] The current detection unit 24A is connected between the first smoothing capacitor 22A and the first inverter circuit 25A, and is connected to the negative output terminal side of the first smoothing capacitor 22A. After the first motor 51A is started, the current detection unit 24A detects the motor current flowing through the first motor 51A.

[0075] The current detection unit 24A can also be configured as an amplifier circuit using a shunt resistor and an operational amplifier that amplifies the voltage across the resistor. The motor current detected by the current detection unit 24A is input to the first microcontroller 27A.

[0076] (2-7) Current detection unit 24B

[0077] The current detection unit 24B is connected between the second smoothing capacitor 22B and the second inverter circuit 25B, and is connected to the negative output terminal side of the second smoothing capacitor 22B. After the second motor 51B is started, the current detection unit 24B detects the motor current flowing through the second motor 51B.

[0078] The current detection unit 24B can also be configured as an amplifier circuit using a shunt resistor and an operational amplifier that amplifies the voltage across the resistor. The motor current detected by the current detection unit 24B is input to the second microcontroller 27B.

[0079] (2-8) First inverter circuit 25A, second inverter circuit 25B

[0080] The first inverter circuit 25A is connected to the output side of the first smoothing capacitor 22A. The second inverter circuit 25B is connected to the output side of the second smoothing capacitor 22B. The first inverter circuit 25A and the second inverter circuit 25B have the same structure, therefore, they will be described as inverter circuit 25.

[0081] Figure 2 This is a structural diagram of the inverter circuit 25 and the drive circuit 26 that drives it. Figure 2In the inverter circuit 25, multiple insulated-gate bipolar transistors (hereinafter referred to as transistors) Q3a, Q3b, Q4a, Q4b, Q5a, Q5b and multiple return diodes D3a, D3b, D4a, D4b, D5a, D5b are used as switching elements.

[0082] Transistors Q3a and Q3b, Q4a and Q4b, and Q5a and Q5b are connected in series with each other. Diodes D3a to D5b are connected in parallel with each transistor Q3a to Q5b in such a way that the collector terminal of the transistor is connected to the cathode terminal of the diode, and the emitter terminal of the transistor is connected to the anode terminal of the diode.

[0083] The inverter circuit 25 is supplied with a DC voltage from the converter and, at a timing indicated by the drive circuit 26, turns each transistor Q3a to Q5b on / off, thereby generating drive voltages SU, SV, and SW to drive the motor. These drive voltages SU, SV, and SW are output to the motor from the connection points NU, NV, and NW of each transistor Q3a and Q3b, Q4a and Q4b, and Q5a and Q5b.

[0084] The first inverter circuit 25A and the second inverter circuit 25B are power modules in which the upper arm-side switching elements (Q3a, Q4a, Q5a, D3a, D4a, D5a) and the lower arm-side switching elements (Q3b, Q4b, Q5b, D3b, D4b, D5b) are integrated into a single package.

[0085] The first inverter circuit 25A and the second inverter circuit 25B are mounted on the first surface 10a of the printed wiring board 10.

[0086] (2-9) First driving circuit 26A, second driving circuit 26B

[0087] The first drive circuit 26A, based on drive commands from the first microcontroller 27A, changes the on / off state of each transistor Q3a~Q5b in the first inverter circuit 25A. The second drive circuit 26B, based on drive commands from the second microcontroller 27B, changes the on / off state of each transistor Q3a~Q5b in the second inverter circuit 25B.

[0088] The first driving circuit 26A and the second driving circuit 26B have the same structure, therefore, they will be described as driving circuit 26.

[0089] like Figure 2As shown, the drive circuit 26 generates gate control voltages Gu, Gx, Gv, Gy, Gw, and Gz applied to the gates of each transistor Q3a to Q5b, so that drive voltages SU, SV, and SW with duty cycles determined by the microcontroller are output from the inverter circuit 25 to the motor. The generated gate control voltages Gu, Gx, Gv, Gy, Gw, and Gz are applied to the gate terminals of each transistor Q3a to Q5b.

[0090] (2-10) First microcontroller 27A, second microcontroller 27B, third microcontroller 40

[0091] The first microcontroller 27A is connected to the voltage detection unit 23A, the current detection unit 24A, and the first drive circuit 26A. The first microcontroller 27A controls the first drive circuit 26A to drive the first motor 51A. As an example, in this embodiment, the first motor 51A is used as the drive motor of the compressor.

[0092] The second microcontroller 27B is connected to the voltage detection unit 23B, the current detection unit 24B, and the second drive circuit 26B. The second microcontroller 27B controls the second drive circuit 26B to drive the second motor 51B. As an example, in this embodiment, the second motor 51B is used as the drive motor of a blower.

[0093] The third microcontroller 40 is a refrigerant control microcontroller. For example, the third microcontroller 40 controls the opening of the electric expansion valve of the air conditioner and adjusts the evaporation temperature, superheat, and subcooling of the refrigerant.

[0094] (2-11) First varistor 28, second varistor 29

[0095] A surge absorber or varistor is connected between the AC input terminals of the first diode bridge 21Aa and the second diode bridge 21Ab to serve as an overvoltage suppression element. In this embodiment, a first varistor 28 is connected. When a voltage exceeding a predetermined value is applied between the AC input terminals, the first varistor 28 limits the voltage between the AC input terminals to a predetermined value.

[0096] Furthermore, at least one of an overvoltage suppression element and a noise removal element is connected between the DC output terminals of the first diode bridge 21Aa and the second diode bridge 21Ab. As the overvoltage suppression element, a surge absorber or a varistor is used. As the noise removal element, a film capacitor is used. In this embodiment, a second varistor 29 with an overvoltage suppression element is connected. The second varistor 29 is connected between the first smoothing capacitor 22A and the first inverter circuit 25A to absorb surges generated during the operation of the switching elements.

[0097] (2-12) Switching power supply 31

[0098] The switching power supply 31 is connected to the output side of the second converter 20B and supplies power to the first microcontroller 27A, the second microcontroller 27B and the third microcontroller 40.

[0099] (2-13) Four-way reversing valve circuit 32

[0100] The four-way reversing valve circuit 32 is connected to the output side of the second converter 20B. The four-way reversing valve circuit 32 uses the power output from the second converter 20B to switch the flow path of the four-way reversing valve 61. The four-way reversing valve 61 is a valve that switches the circulation direction of the refrigerant in the refrigerant circuit.

[0101] (3) Relationship between the first converter 20A and the second converter 20B

[0102] The first converter 20A in this embodiment is a circuit structure that uses two diode bridges, the first diode bridge 21Aa and the second diode bridge 21Ab, to perform full-wave rectification of the AC power from a three-phase four-wire AC power supply. Compared with a circuit structure that performs full-wave rectification using a single three-phase diode bridge, this structure has a cost advantage.

[0103] On the other hand, the heat resistance of individual diodes in the first diode bridge 21Aa and the second diode bridge 21Ab is lower than that of the diode module in a three-phase diode bridge, so heat dissipation measures are required during operation.

[0104] Therefore, in this embodiment, in order to suppress the current flowing through the first diode bridge 21Aa and the second diode bridge 21Ab to a low level, the power supply for the switching power supply 31 and the four-way commutation valve circuit 32 is not obtained from the downstream of the first converter 20A.

[0105] Specifically, such as Figure 1 As shown, the AC power input to the second converter 20B is the AC power input from the fourth wiring 14 connected to the N phase and the fifth wiring 15 branching from the first wiring 11 connected to the R phase.

[0106] Based on this, the power supply for the switching power supply 31 and the four-way commutation valve circuit 32 is obtained from downstream of the second converter 20B. This suppresses the increase in current flowing through the first diode bridge 21Aa and the second diode bridge 21Ab, respectively.

[0107] Furthermore, the branch point of the fifth wiring 15 is located between the center of the length of the first wiring 11 from which the fifth wiring 15 branches and the input terminal 9. Specifically, the branch point of the fifth wiring 15 is separated from the first converter 20A by maintaining a distance of at least half of the distance from the input terminal 9 to the first converter 20A. In this way, by keeping the branch point of the fifth wiring 15 away from the first converter 20A, the heat generated at the branch point of the fifth wiring 15 is less likely to be conducted to the first converter 20A, suppressing heat concentration around the terminals of the first diode bridge 21Aa and the second diode bridge 21Ab.

[0108] (4) Configuration of the first diode bridge 21Aa and the second diode bridge 21Ab

[0109] Figure 3A and Figure 3B These are top and side views of the diode module 21 used as the first diode bridge 21Aa and the second diode bridge 21Ab. Figure 3A and Figure 3B In the diode module 21, there is a cuboid package P containing four built-in bridged diode chips and a terminal group TG protruding from one side of the package P.

[0110] The terminal group TG includes a first terminal T1, a second terminal T2, a third terminal T3, and a fourth terminal T4. The terminal group TG protrudes at a right angle from one of two faces that are parallel to the thickness direction of the package body P and include both long sides. The protruding face of the terminal group TG is designated as the terminal mounting face TS.

[0111] An inclined surface C is formed at one corner of the side of the face that is parallel to the terminal arrangement surface TS. The terminal group TG is arranged in sequence with the first terminal T1 closest to the inclined surface C as a reference, and the second terminal T2, the third terminal T3, and the fourth terminal T4 are arranged in the direction away from the inclined surface C (hereinafter referred to as the first direction D1).

[0112] Terminals T2 and T3 are AC input terminals. Terminal T1 is the positive DC output terminal. Terminal T4 is the negative DC output terminal.

[0113] Figure 4 This is a top view showing the mounting positions of the first diode bridge 21Aa and the second diode bridge 21Ab on the printed wiring board 10. Figure 4 In the printed wiring board 10, the first diode bridge 21Aa and the second diode bridge 21Ab are mounted in a horizontal row with their respective terminal configuration surfaces TS.

[0114] The first terminal T1 of the first diode bridge 21Aa and the fourth terminal T4 of the second diode bridge 21Ab are adjacent to each other, but the surface distance X is ensured to be more than 3.2mm. Therefore, sufficient surface distance is ensured.

[0115] In addition, since the terminal groups TG of the first diode bridge 21Aa and the second diode bridge 21Ab are not opposite, heat is not easily concentrated on each terminal and the conductive pattern for soldering each terminal.

[0116] (5) Characteristics

[0117] (5-1)

[0118] In the power generation device 100, one input of the second converter 20B is connected to any one of the first wiring 11 (R phase), the second wiring 12 (S phase), and the third wiring 13 (T phase) between the input terminal 9 and the first converter 20A, while the other input of the second converter 20B is connected to the fourth wiring 14 (N phase). As a result, the increase in the current value flowing through the first diode bridge 21Aa and the second diode bridge 21Ab of the first converter 20A is suppressed.

[0119] (5-2)

[0120] The branch point of the fifth wiring 15 is located between the center of the length of the first wiring 11 from which the fifth wiring 15 branches and the input terminal 9. As a result, the branch point of the fifth wiring 15 is far away from the first converter 20A, suppressing heat concentration around the terminals of the first converter 20A.

[0121] (5-3)

[0122] The first diode bridge 21Aa and the second diode bridge 21Ab are four diode chips bridged together and integrated into a single packaged diode module. The two diode modules are mounted on the first surface 10a of the printed circuit board 10.

[0123] Two diode modules are configured such that their respective terminal groups TG are spaced apart by a surface distance of more than 3.2 mm, and their respective terminal mounting surfaces TS are not aligned with each other. Therefore, the non-opposing terminal groups of the two diode modules suppress heat concentration towards the terminals and conductive patterns. Furthermore, the diode modules may also have a heat sink.

[0124] (5-4)

[0125] A first varistor 28, acting as a surge absorber, is connected between the AC input terminals of the first diode bridge 21Aa and the second diode bridge 21Ab. Therefore, even if a voltage exceeding a specified value is applied between the AC input terminals, the voltage between the AC input terminals can be limited to the specified value.

[0126] (5-5)

[0127] A second varistor 29 is connected between the DC output terminals of the first diode bridge 21Aa and the second diode bridge 21Ab. Therefore, external pulses or power supply noise are absorbed, thereby preventing the transmission of noise to the AC power supply.

[0128] (5-6)

[0129] The first inverter circuit 25A and the second inverter circuit 25B are power modules with upper arm-side switching elements and lower arm-side switching elements built into a package and mounted on the first surface 10a of the printed wiring board 10.

[0130] Modular design makes it easier to design peripheral circuits on the first surface 10a of the printed wiring board 10, which serves as the mounting surface.

[0131] (5-7)

[0132] The printed wiring board 10 is a multilayer printed wiring board with multiple conductive pattern layers stacked with an insulating layer between them. Therefore, conductive patterns can be wired not only on the surface of the printed wiring board 10, but also on the inner layers, enabling high-density mounting of components.

[0133] (6) Variations

[0134] The configuration of the first diode bridge 21Aa and the second diode bridge 21Ab is not limited to Figure 4 Therefore, the following is explained as a variation of the configuration.

[0135] (6-1) First variation

[0136] Figure 5 This is a top view showing the mounting positions of the first diode bridge 21Aa and the second diode bridge 21Ab on the printed wiring board 10 in the first modified example.

[0137] exist Figure 5 In the circuit, the first diode bridge 21Aa and the second diode bridge 21Ab are mounted on the printed wiring board 10 with their respective terminal configuration surfaces TS facing opposite directions.

[0138] Since the terminal group TG of the first diode bridge 21Aa is not opposite to the terminal group TG of the second diode bridge 21Ab, heat is not easily concentrated on each terminal and the conductive pattern for soldering each terminal.

[0139] (6-2) Second variation

[0140] Figure 6This is a top view showing the mounting positions of the first diode bridge 21Aa and the second diode bridge 21Ab on the printed wiring board 10 in the second variation.

[0141] exist Figure 6 In the circuit, the first diode bridge 21Aa and the second diode bridge 21Ab are mounted on the printed wiring board 10 with their respective terminal configuration surfaces TS facing opposite directions and arranged in a direction orthogonal to the arrangement direction of the terminal group TG.

[0142] Since the terminal group TG of the first diode bridge 21Aa is not opposite to the terminal group TG of the second diode bridge 21Ab, heat is not easily concentrated on each terminal and the conductive pattern for soldering each terminal.

[0143] (6-3) Third variation

[0144] Figure 7 This is a top view showing the mounting positions of the first diode bridge 21Aa and the second diode bridge 21Ab on the printed wiring board 10 in the third variation.

[0145] exist Figure 7 In the circuit, the first diode bridge 21Aa and the second diode bridge 21Ab are mounted on the printed wiring board 10 such that their respective terminal configuration surfaces TS face each other in the same direction and are arranged in a direction orthogonal to the arrangement direction of the terminal group TG.

[0146] Since the terminal group TG of the first diode bridge 21Aa is not opposite to the terminal group TG of the second diode bridge 21Ab, heat is not easily concentrated on each terminal and the conductive pattern for soldering each terminal.

[0147] <Second Implementation>

[0148] Figure 8 This is a circuit diagram showing the structure of the power generation apparatus 200 according to the second embodiment of this disclosure. Figure 8 In, with Figure 1 The power generation device 100 differs from the previous one in that it also includes a third converter 20C. Other structural features are similar. Figure 1 The power generation device 100 is the same as that used in the power generation device, so only the differences will be described here.

[0149] The third converter 20C includes a fourth diode bridge 21C and a third smoothing capacitor 22C. The fourth diode bridge 21C is connected between the sixth wiring 16 and the seventh wiring 17. The sixth wiring 16 and the seventh wiring 17 branch from any two of the first wiring 11, the second wiring 12, and the third wiring 13. In this embodiment, the sixth wiring 16 branches from the second wiring 12, and the seventh wiring 17 branches from the third wiring 13.

[0150] The third converter 20C converts AC power to DC power and supplies this DC power to a specified load (excluding the first inverter circuit 25A, the second inverter circuit 25B, the switching power supply 31, and the four-way commutator circuit 32). As an example, in this embodiment, such as Figure 8 As shown, DC power is supplied to the electric valve drive circuit 33. The electric valve drive circuit 33 controls the operation of the electric valve 63.

[0151] In the power generation device 200, the two inputs of the third converter 20C are respectively connected to any two of the first wiring 11, the second wiring 12 and the third wiring 13 between the input terminal 9 and the first converter 20A, thereby suppressing the increase in the current value of the first diode bridge 21Aa and the second diode bridge 21Ab flowing through the first converter 20A.

[0152] Furthermore, the branch point of the sixth wiring 16 is located between the midpoint of the length of the second wiring 12 from which the sixth wiring 16 branches off and the input terminal 9. Similarly, the branch point of the seventh wiring 17 is located between the midpoint of the length of the third wiring 13 from which the seventh wiring 17 branches off and the input terminal 9. As a result, the branch points of the sixth wiring 16 and the seventh wiring 17 are located away from the first converter 20A, suppressing heat concentration around the terminals of the first converter 20A.

[0153] <Common Variations in the First and Second Embodiments>

[0154] In the first and second embodiments, the first diode bridge 21Aa is connected between the first wiring 11 and the second wiring 12, and the second diode bridge 21Ab is connected between the second wiring 12 and the third wiring 13.

[0155] However, it is not limited to this. Alternatively, the first diode bridge 21Aa can be connected between the second wiring 12 and the third wiring 13, and the second diode bridge 21Ab can be connected between the first wiring 11 and the third wiring 13.

[0156] Alternatively, the first diode bridge 21Aa can be connected between the first wiring 11 and the third wiring 13, and the second diode bridge 21Ab can be connected between the first wiring 11 and the second wiring 12.

[0157] <Other Structures>

[0158] (A)

[0159] Figure 9 This is a top view of the heat sink 60 that cools the first diode bridge 21Aa, the second diode bridge 21Ab, the first inverter circuit 25A, and the second inverter circuit 25B.

[0160] In the first and second embodiments, the first diode bridge 21Aa, the second diode bridge 21Ab, the first inverter circuit 25A, and the second inverter circuit 25B are high-heat-generating components.

[0161] exist Figure 9 In this circuit, the first diode bridge 21Aa, the second diode bridge 21Ab, the first inverter circuit 25A, and the second inverter circuit 25B are mounted on the first surface 10a of the printed wiring board 10, and therefore can be cooled by a common heat sink 60. This allows for a reduction in the number of components and the required installation space.

[0162] (B)

[0163] Figure 10 This is a circuit diagram showing the structure of a power generation device 300 comprising a first diode bridge 21Aa connected to one of the three power lines selected from the first wiring 11, the second wiring 12, and the third wiring 13, and a second diode bridge 21Ab connected between the remaining two power lines.

[0164] exist Figure 10 In the first converter 20A, the three-phase AC power supply R (R phase), S (S phase), and T (T phase) is converted into DC power supply consisting of DC+ (positive) and DC- (negative) and supplied to the inverter 25A.

[0165] The first converter 20A includes a first diode bridge 21Aa, a second diode bridge 21Ab, and a first smoothing capacitor 22A.

[0166] exist Figure 10 In this circuit, the first diode bridge 21Aa is a single-phase diode bridge. The first diode bridge 21Aa performs full-wave rectification on the AC power input from the first wiring 11 connected to phase R and the branch wiring 11a branching from the first wiring 11.

[0167] The second diode bridge 21Ab is a single-phase diode bridge. The second diode bridge 21Ab performs full-wave rectification on the AC power input from the second wiring 12 and the third wiring 13 connected to phase T.

[0168] Figure 10 and Figure 1 The only difference is the wiring method between the power supply line and the first diode bridge 21Aa; the rest of the structure is the same, so the description is omitted.

[0169] Figure 10As one example, another example could be that the first diode bridge 21Aa performs full-wave rectification of the AC power input from the second wiring 12 connected to phase S and the branch wiring from the branch of the second wiring 12, and the second diode bridge 21Ab performs full-wave rectification of the AC power input from the first wiring 11 connected to phase R and the third wiring 13 connected to phase T.

[0170] Alternatively, the first diode bridge 21Aa can perform full-wave rectification of the AC power input from the third wiring 13 connected to phase T and the branch wiring from the branch of the third wiring 13, and the second diode bridge 21Ab can perform full-wave rectification of the AC power input from the first wiring 11 connected to phase R and the second wiring 12 connected to phase S.

[0171] (C)

[0172] However, it can also be abolished. Figure 10 Such a branch wiring 11a branching from the first wiring 11, as Figure 11 As shown in the circuit diagram of the power generation device 300, the first diode bridge 21Aa is only connected to the first wiring 11.

[0173] (D)

[0174] It can also be used to Figure 10 The wiring method shown for the power supply line and the first diode bridge 21Aa is applied to Figure 8 ,like Figure 12 The power generation device 400 is configured as shown in the circuit diagram.

[0175] (E)

[0176] You can also Figure 11 The wiring method shown for the power supply line and the first diode bridge 21Aa is applied to Figure 8 ,like Figure 13 The power generation device 400 is configured as shown in the circuit diagram.

[0177] The embodiments of this disclosure have been described above, but it should be understood that various changes in manner and details can be made without departing from the spirit and scope of this disclosure as set forth in the claims.

[0178] Label Explanation

[0179] 9 input terminals

[0180] 10 Printed Wiring Board

[0181] 10a First Page

[0182] 11 First wiring

[0183] 12 Second wiring

[0184] 13 Third wiring

[0185] 14 Fourth Wiring

[0186] 15 Fifth Wiring

[0187] 16 Sixth Wiring

[0188] 17 Seventh Wiring

[0189] 20A First Converter

[0190] 20B Second Converter

[0191] 20C Third Converter

[0192] 21Aa First Diode Bridge

[0193] 21Ab Second Diode Bridge

[0194] 21B Third Diode Bridge

[0195] 21C Fourth Diode Bridge

[0196] 25A First Inverter Circuit

[0197] 25B Second Inverter Circuit

[0198] 28 First varistor

[0199] 29 Second Varistor

[0200] 60 radiator

[0201] 100, 200 power generation devices

[0202] 300 and 400 power generation devices

[0203] D3a, D4a, D5a Upper Arm Side Switching Components

[0204] D3b, D4b, D5b Lower Arm Side Switching Components

[0205] Q3a, Q4a, Q5a upper arm side switching elements

[0206] Q3b, Q4b, Q5b Lower Arm Side Switching Components

[0207] T1, T4 DC output terminals

[0208] T2 and T3 AC input terminals

[0209] TG terminal block

[0210] TS terminal configuration surface

[0211] Existing technical documents

[0212] [Patent Literature]

[0213] Patent Document 1: Japanese Patent Application Publication No. 2012-165509

Claims

1. A power generation device (100, 200) mounted on a printed wiring board (10), wherein, The power generation device includes: The input terminal (9) is configured to receive R phase, S phase, T phase and N phase from a power source that supplies three-phase AC power in a three-phase four-wire configuration; The first wiring (11), the second wiring (12), the third wiring (13) and the fourth wiring (14) are connected to the R phase, the S phase, the T phase and the N phase respectively via the input terminal (9); A first converter (20A) comprising a first diode bridge (21Aa) and a second diode bridge (21Ab) converts AC power to DC power. The first diode bridge (21Aa) is connected between two power lines selected as a first combination from the three power lines of the first wiring (11), the second wiring (12), and the third wiring (13). The second diode bridge (21Ab) is connected between two power lines selected as a second combination from the three power lines that is different from the first combination. The fifth wiring (15) branches off from any one of the first wiring (11), the second wiring (12), and the third wiring (13); as well as The second converter (20B) includes a third diode bridge (21B) connected between the fourth wiring (14) and the fifth wiring (15) to convert AC power into DC power.

2. A power generation device (300, 400) mounted on a printed wiring board (10), wherein, The power generation device includes: The input terminal (9) is configured to receive R phase, S phase, T phase and N phase from a power source that supplies three-phase AC power in a three-phase four-wire configuration; The first wiring (11), the second wiring (12), the third wiring (13) and the fourth wiring (14) are connected to the R phase, the S phase, the T phase and the N phase respectively via the input terminal (9); The first converter (20A) includes a first diode bridge (21Aa) and a second diode bridge (21Ab) to convert AC power to DC power. The first diode bridge (21Aa) is connected to one of the three power lines selected from the first wiring (11), the second wiring (12) and the third wiring (13). The second diode bridge (21Ab) is connected between the remaining two power lines. The fifth wiring (15) branches off from any one of the first wiring (11), the second wiring (12), and the third wiring (13); as well as The second converter (20B) includes a third diode bridge (21B) connected between the fourth wiring (14) and the fifth wiring (15) to convert AC power into DC power.

3. The power generation device (100, 200, 300, 400) according to claim 1 or 2, wherein, The branch point of the fifth wiring (15) is located between the center of the length of the wiring from which the fifth wiring (15) branches off and the input terminal (9).

4. The power generation device (200, 400) according to any one of claims 1 to 3, wherein, The power generation device also includes: The sixth wiring (16) and the seventh wiring (17) are any two wiring branches from the first wiring (11), the second wiring (12) and the third wiring (13). as well as The third converter (20C) includes a fourth diode bridge (21C) connected between the sixth wiring (16) and the seventh wiring (17) to convert AC power into DC power.

5. The power generation device (100, 200, 300, 400) according to any one of claims 1 to 4, wherein, The first diode bridge (21Aa) and the second diode bridge (21Ab) are four diode chips bridged together and built into a packaged diode module. The two diode modules are mounted on the first side (10a) of the printed wiring board (10).

6. The power generation device (100, 200, 300, 400) according to claim 5, wherein, The diode module has: A terminal group (TG) consisting of two AC input terminals (T2, T3) and two DC output terminals (T1, T4) arranged in a row in the first direction; and Configure the terminal configuration surface (TS) of the terminal group (TG). The two diode modules are configured such that their respective terminal groups (TG) are spaced apart by a surface distance of more than 3.2 mm, and their respective terminal mounting surfaces (TS) are not opposite to each other.

7. The power generation device (100, 200, 300, 400) according to claim 5, wherein, The diode module has a heat sink.

8. The power generation device (100, 200, 300, 400) according to claim 5, wherein, The diode module has two AC input terminals and two DC output terminals. An overvoltage suppression element is connected between the two AC input terminals (T2, T3).

9. The power generation device (100, 200, 300, 400) according to claim 5, wherein, The diode module has two AC input terminals (T2, T3) and two DC output terminals (T1, T4). At least one of an overvoltage suppression element and a noise removal element is connected between the two DC output terminals (T1, T4).

10. The power generation device (100, 200, 300, 400) according to any one of claims 1 to 9, wherein, The power generation device also includes a first inverter circuit (25A) connected between the output terminals of the first converter (20A). The first inverter circuit (25A) is a power module consisting of upper arm-side switching elements (Q3a, Q4a, Q5a, D3a, D4a, D5a) and lower arm-side switching elements (Q3b, Q4b, Q5b, D3b, D4b, D5b) integrated into a package and mounted on the first side (10a) of the printed wiring board (10).

11. The power generation device (100, 200, 300, 400) according to any one of claims 1 to 10, wherein, The power generation device also includes a second inverter circuit (25B) connected between the output terminals of the second converter (20B). The second inverter circuit (25B) is a power module with upper arm-side switching elements (Q3a, Q4a, Q5a, D3a, D4a, D5a) and lower arm-side switching elements (Q3b, Q4b, Q5b, D3b, D4b, D5b) integrated into a package, and is mounted on the first side (10a) of the printed wiring board (10).

12. The power generation device (100, 200, 300, 400) according to any one of claims 1 to 11, wherein, The printed wiring board (10) is a multilayer printed wiring board having multiple conductive pattern layers stacked with an insulating layer between them.

13. The power generation device (100, 200, 300, 400) according to claim 5, wherein, The power generation device also includes: The first inverter circuit (25A) is connected between the output terminals of the first converter (20A); The second inverter circuit (25B) is connected between the output terminals of the second converter (20B); as well as A radiator (60); The first inverter circuit (25A) and the second inverter circuit (25B) are power modules with upper arm-side switching elements and lower arm-side switching elements built into a package, respectively, and are installed on the first side (10a) of the printed wiring board (10). The heat sink (60) cools the two diode modules and the two power modules.

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