A multi-surface grinding device for processing gallium nitride polycrystal wafer

Abstract

This invention discloses a multi-faceted grinding device for processing gallium nitride (GaN) polycrystalline wafers, relating to the field of grinding equipment. The multi-faceted grinding device for processing GaN polycrystalline wafers includes a base, columns symmetrically fixedly connected to the upper surface of the base near its edge, a movable plate slidably connected to the middle of multiple columns, a top plate fixedly connected to the end of the multiple columns away from the base, telescopic rods symmetrically fixedly connected between the top plate and the movable plate, and a cylinder slidably connected to the middle of the surface of the movable plate. This invention can stably place and position GaN polycrystalline wafers of different sizes. When changing to another GaN polycrystalline wafer of the same type but different size for grinding, it can adapt and stably place and position them without the need for additional time to change the corresponding workpiece tray. The equipment is compatible, convenient to use, and can improve the processing efficiency of GaN polycrystalline wafers.

Description

Technical Field

[0001] This invention relates to the field of grinding equipment, and in particular to a multi-faceted grinding equipment for processing gallium nitride polycrystalline wafers. Background Technology

[0002] Multi-face grinding equipment for gallium nitride (GaN) multi-wafer processing is a specialized device that simultaneously performs double-sided or multi-sided precision thinning and planarization on multiple GaN wafers. It reduces the original thickness (300–800μm) to 50–150μm (power devices) or 20–50μm (RF or advanced packaging), with a flatness of ≤1μm and a roughness Ra≤0.5nm. It meets the requirements of photolithography, epitaxy, and bonding, eliminates microcracks, dislocations, and surface contamination introduced by cutting or epitaxy, and solves processing problems such as GaN hardness, brittleness, easy edge chipping, warping, and thermal mismatch. It is a key process equipment for GaN wafers from substrate to device. Traditional multi-sided grinding equipment for gallium nitride (GaN) polycrystalline wafer processing typically has multiple placement holes for grinding GaN polycrystalline wafers. The unground GaN polycrystalline wafer is placed on the surface of the placement hole. However, the hole diameter is fixed, and wafers of different diameters cannot be placed in them. For example, existing planetary double-sided grinding machines cannot grind GaN polycrystalline wafers of different sizes. 4-inch, 6-inch, and 8-inch GaN wafers cannot share the same machine. Changing the size requires additional time to replace the corresponding workpiece disk. The low equipment compatibility leads to inconvenience and affects the efficiency of GaN polycrystalline wafer grinding.

[0003] Therefore, it is necessary to propose a multi-faceted grinding equipment for gallium nitride polycrystalline wafer processing to solve the above problems. Summary of the Invention

[0004] The main objective of this invention is to provide a multi-faceted grinding device for processing gallium nitride polycrystalline wafers, which can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A multi-faceted grinding device for processing gallium nitride polycrystalline wafers includes a base, columns symmetrically fixedly connected to the upper surface of the base near the edge, a movable plate slidably connected to the middle of multiple columns, a top plate fixedly connected to the end of multiple columns away from the base, a telescopic rod symmetrically fixedly connected between the top plate and the movable plate, and a cylinder slidably connected to the middle of the surface of the movable plate. A rotating ring and a grinding table are rotatably connected to the top of the base. A grinding table is fixedly connected below the rotating ring and is fixedly connected to the rotating ring. A first annular rack is fixedly connected to the inner side of the rotating ring. Multiple first gears are meshed on the inner side of the first annular rack. Second gears are meshed between the multiple first gears. A circular hole is opened in the middle of the surface of the first gear. The hole wall is provided with a positioning mechanism that can place and position gallium nitride polycrystalline wafers of different sizes. A first annular groove is opened on the surface of the rotating ring away from the top of the base. The groove wall is provided with a grinding mechanism for grinding the surface of the gallium nitride polycrystalline wafer away from the top of the base. The positioning mechanism includes arc-shaped clamping blocks evenly arranged in a ring on the wall of a circular hole. First T-shaped columns are symmetrically fixedly connected to the surface of the arc-shaped clamping blocks. First springs are fixedly connected to the ends of the two first T-shaped columns away from the arc-shaped clamping blocks. Fixed blocks evenly distributed in a ring are fixedly connected to the surface of the first gear away from the top of the base. Column grooves are symmetrically opened on the surface of the fixed blocks. First movable sleeves are fitted on the groove walls. The first movable sleeves are slidably connected to the first T-shaped columns. Fixed columns are fixedly connected to the ends of the first movable sleeves away from the first T-shaped columns. The grinding mechanism includes multiple mounting blocks that are fitted onto the wall of a first annular groove. An L-shaped post is fitted onto the surface of each mounting block. A second spring is sleeved on the outer side of the L-shaped post. A second T-shaped post is fixedly connected to the end of the L-shaped post away from the through hole. A second movable sleeve is slidably connected to the surface of the second T-shaped post. A third spring is fixedly connected to the end of the second T-shaped post away from the L-shaped post. The end of the third spring away from the second T-shaped post is fixedly connected to the second movable sleeve. A circular block is fixedly connected to the end of the second movable sleeve away from the second T-shaped post. A grinding block is fixedly connected to the lower surface of the circular block.

[0006] Preferably, each of the plurality of mounting blocks is fixedly connected to an arc-shaped connecting column between each other, and each of the plurality of arc-shaped connecting columns is installed in conjunction with the first annular groove.

[0007] Preferably, a connecting spring is fixedly connected to one end of each of the two first movable sleeves near the arc-shaped clamping block, and the other end of each of the two connecting springs is fixedly connected to the fixing block.

[0008] Preferably, a through hole is formed on the side of the surface of the plurality of mounting blocks away from the first annular groove, the L-shaped column is installed in conjunction with the through hole, the surface of the L-shaped column is formed with a first strip groove, a second strip groove and a spiral groove, the spiral groove is connected to both the first strip groove and the second strip groove, a protrusion is slidably connected to the wall of the first strip groove, and the protrusion is fixedly connected to the wall of the through hole.

[0009] Preferably, each of the L-shaped columns has a vertical groove on its surface below the movable plate. A reset spring is fixedly connected to the wall of the vertical groove, and a first friction block is fixedly connected to the upper end of the reset spring. The first friction block is installed in conjunction with the vertical groove.

[0010] Preferably, a protruding post is fixedly connected to the middle of the upper surface of the circular block.

[0011] Preferably, a rotating column is rotatably connected to the inner wall of the cylinder. The upper end of the rotating column is rotatably connected to the top plate, and the lower end of the rotating column is fixedly connected to the second gear. A third gear is fixedly connected to the side of the rotating column near the top plate. A fourth gear and a fifth gear are meshed on the outer side of the third gear. The third, fourth, and fifth gears are all rotatably connected to the lower surface of the top plate. A first motor is fixedly connected below the fourth gear and is fixedly connected to the top plate. A transmission column is fixedly connected below the fifth gear. A rotating sleeve is slidably connected to the side of the transmission column away from the fifth gear. The rotating sleeve is rotatably connected to the movable plate. A sixth gear is fixedly connected to the end of the rotating sleeve away from the fifth gear. A second annular rack is meshed on the outer side of the sixth gear. An annular plate is rotatably connected to the lower surface of the movable plate and is fixedly connected to the second annular rack. A second annular groove is formed on the lower surface of the annular plate.

[0012] Preferably, the outer side of the cylinder is provided with a ring-shaped, uniformly distributed limiting groove, and all of the limiting grooves are slidably connected to the movable plate.

[0013] Preferably, a second friction block is fixedly connected to both ends of the surface of the first movable sleeve, and both second friction blocks are installed in conjunction with the column groove.

[0014] Compared with the prior art, the present invention provides a multi-faceted grinding device for gallium nitride polycrystalline wafer processing, which has the following beneficial effects: 1. This multi-faceted grinding equipment for gallium nitride polycrystalline wafer processing, through a set positioning mechanism, allows multiple arc-shaped clamping blocks to rotate with the first and second gears. As the fixed column continuously contacts the inner side of the rotating ring and the surface of the cylinder, the arc-shaped clamping blocks are constantly adjusted and moved, ensuring stable placement and positioning of gallium nitride polycrystalline wafers of different sizes. When replacing with another gallium nitride polycrystalline wafer of the same type but a different size for grinding, it can be stably placed and positioned without requiring additional time to change the corresponding workpiece tray. The equipment is compatible, easy to use, and can improve the processing efficiency of gallium nitride polycrystalline wafers.

[0015] 2. This multi-faceted grinding equipment for gallium nitride polycrystalline wafer processing, through the setting of a protruding post and a second annular groove, drives the movable plate to move towards the base as the telescopic rod extends. During this process, the movable plate contacts the surface of the second friction block, causing relative movement between the L-shaped post and the through hole, and relative movement between the protrusion and the first, spiral, and second grooves, allowing the grinding block to be positioned above the circular hole. Then, it is adjusted and moved as the movable plate moves. When the second friction block is completely submerged in the vertical groove, the protrusion can engage with the second annular groove, and the grinding block can contact the surface of the gallium nitride polycrystalline wafer placed in the circular hole away from the grinding table. The annular plate is adjusted and rotated, and relative movement occurs between the protrusion and the second annular groove, thereby adjusting the continuous movement of the circular block and the grinding block. The gallium nitride polycrystalline wafer itself is also adjusted and rotated, thus ensuring the grinding processing effect on gallium nitride polycrystalline wafers of different sizes. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is the invention Figure 1 Enlarged view of point A in the middle; Figure 3 This is a partial structural diagram of the annular plate of the present invention; Figure 4 This is the invention Figure 3 Enlarged view at point B in the middle; Figure 5 This is a partial structural diagram of the cylindrical part of the present invention; Figure 6 This is the invention Figure 5 Enlarged view at point C; Figure 7 This is a partial structural diagram of the rotating ring of the present invention; Figure 8 This is a partial structural diagram of the vertical groove and the return spring of the present invention.

[0017] In the diagram: 1. Base; 11. Column; 12. Movable plate; 13. Top plate; 14. Telescopic rod; 15. Cylinder; 151. Rotating column; 152. Third gear; 153. Fourth gear; 154. Fifth gear; 155. Transmission column; 156. Rotating sleeve; 157. Sixth gear; 158. Second annular rack; 159. Annular plate; 1510. Second annular groove; 1511. Limiting groove; 16. First annular groove; 2. Rotating ring; 3. Grinding table; 4. First annular rack; 5. First gear; 6. Second gear; 7. Circular hole; 8. Positioning mechanism; 81. Arc-shaped clamping block; 82. First T-shaped post; 83. First spring; 84. Fixing block; 85. Post groove; 86. First movable sleeve; 861. Second friction block; 87. Fixing post; 9. Grinding mechanism; 91. Mounting block; 911. Arc-shaped connecting post; 912. Through hole; 913. First strip groove; 914. Second strip groove; 915. Protrusion; 92. L-shaped post; 921. Vertical groove; 922. Return spring; 923. First friction block; 93. Second spring; 94. Second T-shaped post; 95. Second movable sleeve; 96. Third spring; 97. Circular block; 971. Protrusion post; 98. Grinding block. Detailed Implementation

[0018] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0019] Please see Figures 1 to 8 A multi-faceted grinding device for processing gallium nitride polycrystalline wafers includes a base 1, columns 11 symmetrically and fixedly connected to the upper surface of the base 1 near the edge, a movable plate 12 slidably connected to the middle of the columns 11, a top plate 13 fixedly connected to the end of the columns 11 away from the base 1, a telescopic rod 14 symmetrically and fixedly connected between the top plate 13 and the movable plate 12, and a cylinder 15 slidably connected to the middle of the surface of the movable plate 12. A rotating ring 2 and a grinding table 3 are rotatably connected to the top of the base 1, and the grinding table 3 is fixedly connected below the rotating ring 2. The ring 2 is fixedly connected, and a first annular rack 4 is fixedly connected to the inner side of the rotating ring 2. Multiple first gears 5 are meshed and connected to the inner side of the first annular rack 4. A second gear 6 is meshed and connected between the multiple first gears 5. A circular hole 7 is opened in the middle of the surface of the first gear 5. A positioning mechanism 8 is provided on the wall of the circular hole 7, which can place and position gallium nitride polycrystalline wafers of different sizes. A first annular groove 16 is opened on the surface of the rotating ring 2 away from the top of the base 1. A grinding mechanism 9 is provided on the groove wall of the first annular groove 16 to grind the surface of the gallium nitride polycrystalline wafer away from the top of the base 1. The positioning mechanism 8 includes an arc-shaped clamping block 81 evenly arranged in a ring on the wall of the circular hole 7. A first T-shaped column 82 is symmetrically fixedly connected to the surface of the arc-shaped clamping block 81. A first spring 83 is fixedly connected to the end of each of the two first T-shaped columns 82 away from the arc-shaped clamping block 81. A fixed block 84 evenly distributed in a ring is fixedly connected to the surface of the first gear 5 away from the top of the base 1. A column groove 85 is symmetrically opened on the surface of the fixed block 84. A first movable sleeve 86 is fitted on the groove wall of the column groove 85. The first movable sleeve 86 is slidably connected to the first T-shaped column 82. A fixed column 87 is fixedly connected to the end of the first movable sleeve 86 away from the first T-shaped column 82. The grinding mechanism 9 includes multiple mounting blocks 91 that are fitted onto the wall of the first annular groove 16. An L-shaped post 92 is fitted onto the surface of the mounting block 91. A second spring 93 is sleeved on the outside of the L-shaped post 92. A second T-shaped post 94 is fixedly connected to the end of the L-shaped post 92 away from the through hole 912. A second movable sleeve 95 is slidably connected to the surface of the second T-shaped post 94. A third spring 96 is fixedly connected to the end of the second T-shaped post 94 away from the L-shaped post 92. The end of the third spring 96 away from the second T-shaped post 94 is fixedly connected to the second movable sleeve 95. A circular block 97 is fixedly connected to the end of the second movable sleeve 95 away from the second T-shaped post 94. A grinding block 98 is fixedly connected to the lower surface of the circular block 97. It should be noted that when the gallium nitride polycrystalline wafer is placed in the circular hole 7, its lower surface contacts the grinding table 3. The telescopic rod 14 extends, driving the movable plate 12 to move towards the base 1. The movable plate 12 will contact multiple first friction blocks 923. Due to the friction between the first friction blocks 923 and the vertical groove 921, the first friction blocks 923 will not immediately sink into the vertical groove 921. The L-shaped column 92 and the first friction blocks 923 will move with the movable plate 12. The second spring 93 is compressed. The setting of the second spring 93 facilitates the reset of the L-shaped column 92, the second T-shaped column 94, the second movable sleeve 95, the circular block 97 and the grinding block 98, making it easy to remove the gallium nitride polycrystalline wafer after grinding. The L-shaped post 92 moves relative to the through hole 912, and the protrusion 915 moves relative to the first groove 913. Then, the protrusion 915 moves relative to the spiral groove, thereby adjusting the rotation of the L-shaped post 92. The grinding block 98 is positioned above the circular hole 7. Then, the protrusion 915 moves relative to the second groove 914 until the grinding block 98 contacts the surface of the gallium nitride polycrystalline wafer grinding stage 3. The protrusion 971 also engages with the second annular groove 1510 on the surface of the annular plate 159. The first motor starts, driving the fourth gear 153 to rotate. The third gear 152 meshes with the fourth gear 153, and the fifth gear 154 meshes with the third gear 152. The rotating post 151 and the transmission post 155 are both adjusted to rotate, rotating along with the transmission post 155, thereby driving the sixth gear 157 to rotate. Wheel 157 meshes with the second annular rack 158, the annular plate 159 is adjusted to rotate, the rotating column 151 rotates and drives the second gear 6 to rotate, and the four first gears 5 are adjusted to rotate at the same time. The first gears 5 make a circular motion around the second gear 6, that is, the position of the gallium nitride polycrystalline wafer is adjusted while being adjusted to rotate, so as to ensure the grinding effect of the gallium nitride polycrystalline wafer. The second annular groove 1510 can move relative to the protrusion 971, so that the circular block 97 and the grinding block 98 can be adjusted to move back and forth. The second T-shaped column 94 moves relative to the second movable sleeve 95, the third spring 96 deforms, and the grinding block 98 moves with the second movable sleeve 95, the circular block 97 and the protrusion 971, so as to cover the surface of the gallium nitride polycrystalline wafer away from the grinding table 3, ensuring the grinding effect. By utilizing the extension and elasticity of the first spring 83 installed inside the first movable sleeve 86, gallium nitride polycrystalline wafers of different sizes can be stably placed and positioned. When replacing with another gallium nitride polycrystalline wafer of the same type but different size for grinding, it can be stably placed and positioned without the need to spend extra time replacing the corresponding workpiece tray. The equipment is compatible, easy to use, and can improve the processing efficiency of gallium nitride polycrystalline wafers.

[0020] Multiple mounting blocks 91 are fixedly connected to each other with arc-shaped connecting columns 911, and the multiple arc-shaped connecting columns 911 are all installed in conjunction with the first annular groove 16; It should be noted that the arc-shaped connecting column 911 allows the four mounting blocks 91 to be adjusted in position simultaneously, which facilitates the adjustment of the position of the grinding mechanism 9, thereby facilitating the grinding mechanism 9 to perform grinding processing on the surface of the gallium nitride polycrystalline wafer away from the grinding table 3.

[0021] Each of the two first movable sleeves 86 has a connecting spring fixedly connected to one end of the surface near the arc-shaped clamp 81, and the other end of each connecting spring is fixedly connected to the fixed block 84. It should be noted that during the process of the fixed block 84 being adjusted and rotated together with the first gear 5, the fixed column 87 will continuously contact the surface of the cylinder 15 and the inner side of the rotating ring 2. During this process, the fixed column 87 and the first movable sleeve 86 are adjusted and moved, and relative movement occurs between the first movable sleeve 86 and the column groove 85. The second friction block 861 moves with the first movable sleeve 86. The first T-shaped column 82 and the arc-shaped clamping block 81 both move with the fixed column 87. Utilizing the extension and elasticity of the first spring 83, after the arc-shaped clamping block 81 contacts the gallium nitride polycrystalline wafer, it can stably clamp and position the gallium nitride polycrystalline wafer, and is compatible with clamping gallium nitride polycrystalline wafers of the same type but different sizes. Since one end of the connecting spring is fixedly connected to the first movable sleeve 86 and the other end is fixedly connected to the fixed block 84, when the first movable sleeve 86 is adjusted and moved, the connecting spring is stretched, and the elastic force of the connecting spring is used to facilitate the first movable sleeve 86 to be reset.

[0022] Multiple mounting blocks 91 have through holes 912 on the side of their surfaces away from the first annular groove 16. L-shaped posts 92 are installed in conjunction with the through holes 912. The surfaces of the L-shaped posts 92 have a first strip groove 913, a second strip groove 914, and a spiral groove. The spiral groove is connected to both the first strip groove 913 and the second strip groove 914. A protrusion 915 is slidably connected to the wall of the first strip groove 913. The protrusion 915 is fixedly connected to the wall of the through hole 912. It should be noted that during the process of the movable plate 12 being adjusted to move closer to the base 1, after the movable plate 12 contacts the first friction block 923, the L-shaped column 92 is also adjusted to move closer to the base 1. During this process, the protrusion 915 and the first strip groove 913 move relative to each other, and the second spring 93 is compressed. Then, the protrusion 915 and the spiral groove move relative to each other, and the L-shaped column 92 is adjusted to rotate. The second T-shaped column 94, the second movable sleeve 95, the circular block 97, and the grinding block 98 are all adjusted to rotate together with the L-shaped column 92, so that the grinding block 98 can be placed above the circular hole 7. As the movable plate 12 continues to be adjusted and moved, the grinding block 98 can contact the surface of the gallium nitride polycrystalline wafer, and then perform grinding processing.

[0023] Multiple L-shaped columns 92 have vertical grooves 921 on their surfaces below the movable plate 12. A return spring 922 is fixedly connected to the groove wall of the vertical groove 921. A first friction block 923 is fixedly connected to the upper end of the return spring 922. The first friction block 923 is installed in conjunction with the vertical groove 921. It should be noted that during the process of the movable plate 12 being adjusted to move closer to the base 1, the movable plate 12 will contact the surfaces of multiple first friction blocks 923. Due to the friction between the first friction blocks 923 and the vertical groove 921, the first friction blocks 923 will not immediately sink into the vertical groove 921. Instead, as the movable plate 12 moves, the L-shaped column 92, the first friction blocks 923, the second movable sleeve 95, the circular block 97, and the grinding block 98 all move together with the movable plate 12. After the movable plate 12 stops being adjusted and moved, the protruding column 971 can be placed below the second annular groove 1510. As the first friction blocks 923 gradually sink into the vertical groove 921, the protruding column 971 can also smoothly cooperate with the second annular groove 1510, so that the grinding block 98 can continuously adjust its position. During the grinding process, it can cover the surface of the gallium nitride polycrystalline wafer away from the grinding table 3, thereby ensuring the grinding effect and adapting to the grinding of gallium nitride polycrystalline wafers of the same type but different sizes. It should be noted that ball bearings can be installed on the surface of the first friction block 923 away from the return spring 922 and the surface of the L-shaped block near the movable plate 12, which can avoid direct contact between the first friction block 923 and the movable plate 12 and the L-shaped column 92, thus avoiding contact wear. A protruding post 971 is fixedly connected to the center of the upper surface of the circular block 97; a rotating column 151 is rotatably connected to the inner wall of the cylinder 15, the upper end of the rotating column 151 is rotatably connected to the top plate 13, and the lower end of the rotating column 151 is fixedly connected to the second gear 6. A third gear 152 is fixedly connected to the side of the rotating column 151 near the top plate 13. A fourth gear 153 and a fifth gear 154 are meshed on the outer side of the third gear 152. The third gear 152, the fourth gear 153, and the fifth gear 154 are all rotatably connected to the lower surface of the top plate 13. A first motor is fixedly connected below the fourth gear 153. The first motor is connected to the top plate 13. Plate 13 is fixedly connected. A transmission column 155 is fixedly connected below the fifth gear 154. A rotating sleeve 156 is slidably connected to the side of the transmission column 155 away from the fifth gear 154. The rotating sleeve 156 is rotatably connected to the movable plate 12. A sixth gear 157 is fixedly connected to the end of the rotating sleeve 156 away from the fifth gear 154. A second annular rack 158 is meshed with the outer side of the sixth gear 157. An annular plate 159 is rotatably connected to the lower surface of the movable plate 12. The annular plate 159 is fixedly connected to the second annular rack 158. A second annular groove 1510 is opened on the lower surface of the annular plate 159. It should be noted that when the unpolished gallium nitride polycrystalline wafer is placed in the circular hole 7, the telescopic rod 14 extends, causing the movable plate 12 to move closer to the base 1. The first motor then drives the fourth gear 153 to rotate. Since the fourth gear 153 meshes with the third gear 152, and the third gear 152 meshes with the fifth gear 154, both gears 152 and 154 rotate. The rotating column 151 rotates along with the third gear 152, and the second gear 6 rotates along with the rotating column 151. Multiple first gears 5 mesh with the second gear 6, and these multiple first gears 5 rotate along with the second gear 6, thus driving the gallium nitride polycrystalline wafer... As the wafer moves, the gallium nitride polycrystalline wafer rotates relative to the polishing table 3, performing polishing. The polishing block 98 contacts the surface of the gallium nitride polycrystalline wafer away from the polishing table 3. The fifth gear 154 rotates, driving the transmission column 155 to rotate. The rotating sleeve 156 rotates with the transmission column 155. The sixth gear 157 rotates with the rotating sleeve 156. The second annular rack 158 and the annular plate 159 rotate with the sixth gear 157. The protrusion 971 rotates relative to the second annular groove 1510, which can adjust the polishing block 98, the circular block 97, and the second movable sleeve 95 to move back and forth continuously, thereby ensuring the polishing effect of the gallium nitride polycrystalline wafer.

[0024] The outer side of the cylinder 15 is provided with a ring-shaped and evenly distributed limiting groove 1511, and the multiple limiting grooves 1511 are slidably connected to the movable plate 12. It should be noted that the setting of the limiting groove 1511 can ensure that the cylinder 15 will not rotate with the rotating column 151, that is, to ensure that the cylinder 15 can maintain a stable state during the operation of the entire equipment. During the process of the fixed column 87 contacting the surface of the cylinder 15 with the first gear 5 and then separating, it will not affect the distance that the fixed column 87 can be adjusted and moved.

[0025] The first movable sleeve 86 has two fixedly connected second friction blocks 861 at both ends of its surface, and both second friction blocks 861 are installed in conjunction with the column groove 85. It should be noted that the second friction block 861 is designed so that when the fixed post 87 is in contact with the inner side of the rotating ring 2 or the surface of the cylinder 15 as the first gear 5 rotates, after the first movable sleeve 86 is moved, the fixed post 87 will not immediately reset under the action of the connecting spring force after it separates from the surface of the cylinder 15 or the inner side of the rotating ring 2. In other words, it can maintain the clamping and positioning state of the gallium nitride polycrystalline wafer. Then, as the first gear 5 continues to rotate, the adjacent fixed post 87 will contact the surface of the cylinder 15 or the inner side of the rotating ring 2 again. This cycle is repeated to ensure that the gallium nitride polycrystalline wafer can remain clamped during the grinding process, thereby ensuring the grinding effect.

[0026] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A multi-faceted grinding device for processing gallium nitride polycrystalline wafers, comprising a base (1), columns (11) symmetrically fixedly connected to the upper surface of the base (1) near the edge, a movable plate (12) slidably connected to the middle of the columns (11), a top plate (13) fixedly connected to one end of the columns (11) away from the base (1), a telescopic rod (14) symmetrically fixedly connected between the top plate (13) and the movable plate (12), and a cylinder (15) slidably connected to the middle of the surface of the movable plate (12), characterized in that: The base (1) is rotatably connected to a rotating ring (2) and a grinding table (3) at the top. The grinding table (3) is fixedly connected to the bottom of the rotating ring (2). The grinding table (3) is fixedly connected to the rotating ring (2). A first annular rack (4) is fixedly connected to the inner side of the rotating ring (2). Multiple first gears (5) are meshed on the inner side of the first annular rack (4). A second gear (6) is meshed between the multiple first gears (5). A circular hole (7) is opened in the middle of the surface of the first gear (5). A positioning mechanism (8) is provided on the wall of the circular hole (7) to place and position gallium nitride polycrystalline wafers of different sizes. A first annular groove (16) is opened on the surface of the rotating ring (2) away from the top of the base (1). A grinding mechanism (9) is provided on the groove wall of the first annular groove (16) to grind the surface of the gallium nitride polycrystalline wafer away from the top of the base (1). The positioning mechanism (8) includes an arc-shaped clamping block (81) evenly arranged in a ring on the wall of the circular hole (7). The surface of the arc-shaped clamping block (81) is symmetrically fixedly connected with a first T-shaped column (82). The ends of the two first T-shaped columns (82) away from the arc-shaped clamping block (81) are fixedly connected with a first spring (83). The surface of the first gear (5) away from the top of the base (1) is fixedly connected with a fixed block (84) evenly distributed in a ring. The surface of the fixed block (84) is symmetrically provided with column grooves (85). The groove wall of the column groove (85) is fitted with a first movable sleeve (86). The first movable sleeve (86) is slidably connected to the first T-shaped column (82). The end of the first movable sleeve (86) away from the first T-shaped column (82) is fixedly connected with a fixed column (87). The grinding mechanism (9) includes a plurality of mounting blocks (91) that are fitted and installed on the wall of the first annular groove (16). An L-shaped column (92) is fitted on the surface of the mounting block (91). A second spring (93) is sleeved on the outside of the L-shaped column (92). A second T-shaped column (94) is fixedly connected to the end of the L-shaped column (92) away from the through hole (912). A second movable sleeve (95) is slidably connected to the surface of the second T-shaped column (94). A third spring (96) is fixedly connected to the end of the second T-shaped column (94) away from the L-shaped column (92). The end of the third spring (96) away from the second T-shaped column (94) is fixedly connected to the second movable sleeve (95). A circular block (97) is fixedly connected to the end of the second movable sleeve (95) away from the second T-shaped column (94). A grinding block (98) is fixedly connected to the lower surface of the circular block (97).

2. The multi-faceted grinding equipment for processing gallium nitride polycrystalline wafers according to claim 1, characterized in that: Each of the mounting blocks (91) is fixedly connected to an arc-shaped connecting column (911) in pairs, and the arc-shaped connecting column (911) is installed in conjunction with the first annular groove (16).

3. The multi-faceted grinding equipment for processing gallium nitride polycrystalline wafers according to claim 1, characterized in that: Each of the two first movable sleeves (86) has a connecting spring fixedly connected to one end of its surface near the arc-shaped clamp (81), and the other end of each of the two connecting springs is fixedly connected to the fixing block (84).

4. The multi-faceted grinding equipment for processing gallium nitride polycrystalline wafers according to claim 1, characterized in that: A through hole (912) is provided on the side of the surface of the plurality of mounting blocks (91) away from the first annular groove (16). The L-shaped column (92) is installed in conjunction with the through hole (912). The surface of the L-shaped column (92) is provided with a first strip groove (913), a second strip groove (914) and a spiral groove. The spiral groove is connected to both the first strip groove (913) and the second strip groove (914). A protrusion (915) is slidably connected to the wall of the first strip groove (913). The protrusion (915) is fixedly connected to the wall of the through hole (912).

5. The multi-faceted grinding equipment for processing gallium nitride polycrystalline wafers according to claim 1, characterized in that: Each of the L-shaped columns (92) has a vertical groove (921) on its surface below the movable plate (12). A reset spring (922) is fixedly connected to the wall of the vertical groove (921). A first friction block (923) is fixedly connected to the upper end of the reset spring (922). The first friction block (923) is installed in conjunction with the vertical groove (921).

6. The multi-faceted grinding equipment for processing gallium nitride polycrystalline wafers according to claim 1, characterized in that: A protruding post (971) is fixedly connected to the middle of the upper surface of the circular block (97).

7. The multi-faceted grinding equipment for processing gallium nitride polycrystalline wafers according to claim 1, characterized in that: A rotating column (151) is rotatably connected to the inner wall of the cylinder (15). The upper end of the rotating column (151) is rotatably connected to the top plate (13), and the lower end of the rotating column (151) is fixedly connected to the second gear (6). A third gear (152) is fixedly connected to the side of the rotating column (151) near the top plate (13). A fourth gear (153) and a fifth gear (154) are meshed on the outer side of the third gear (152). The third gear (152), the fourth gear (153), and the fifth gear (154) are all rotatably connected to the lower surface of the top plate (13). A first motor is fixedly connected below the fourth gear (153). The first motor is fixedly connected to the top plate (13). A transmission column (155) is fixedly connected to the lower part of the fifth gear (154). A rotating sleeve (156) is slidably connected to the side of the transmission column (155) away from the fifth gear (154). The rotating sleeve (156) is rotatably connected to the movable plate (12). A sixth gear (157) is fixedly connected to the end of the rotating sleeve (156) away from the fifth gear (154). A second annular rack (158) is meshed with the outer side of the sixth gear (157). An annular plate (159) is rotatably connected to the lower surface of the movable plate (12). The annular plate (159) is fixedly connected to the second annular rack (158). A second annular groove (1510) is opened on the lower surface of the annular plate (159).

8. The multi-faceted grinding equipment for processing gallium nitride polycrystalline wafers according to claim 1, characterized in that: The outer side of the cylinder (15) is provided with a ring-shaped and uniformly distributed limiting groove (1511), and the multiple limiting grooves (1511) are slidably connected to the movable plate (12).

9. The multi-faceted grinding equipment for processing gallium nitride polycrystalline wafers according to claim 1, characterized in that: The first movable sleeve (86) has two fixed connections to the two ends of its surface, and the two second friction blocks (861) are installed in conjunction with the column groove (85).

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