Cleaning device for semiconductor material handling systems

Abstract

This application provides a cleaning device for a semiconductor material handling system, specifically relating to the field of semiconductor technology. The device includes: a cleaning body; a vacuum system for providing vacuum suction to the cleaning section; a first sensing device for collecting device position information of the cleaning device; an identification information collection device for collecting object identification information; a second sensing device disposed on the cleaning body for collecting distance information between the cleaning section and the object to be cleaned; and a control device for receiving the device position information and distance information. If the device position information indicates that the cleaning device has reached a preset area of ​​the object to be cleaned, the identification information collection device is triggered to collect identification information. When the object identification information matches the preset identification information of the object to be cleaned, and the distance information indicates that the cleaning section has reached the surface to be cleaned of the object, the vacuum system is triggered to operate, thereby providing vacuum suction to the cleaning section and achieving fully automatic and efficient cleaning of the system.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a cleaning device for semiconductor material handling systems. Background Technology

[0002] Automatic Material Handling System (AMHS), also known as overhead crane system, is an indispensable part of automated semiconductor manufacturing. It includes overhead hoist transport (OHT), rail systems, and automated storage and retrieval systems (AS / RS), such as… Figure 1 As shown, the automated storage and retrieval system (AS / RS) is responsible for storing and transporting wafer pods (PODs) for interfacing with the overhead material handling unit (OHT) to achieve fully automated material transfer between different AS / RS or machine units. However, after prolonged and high-frequency operation, dirt particles accumulate at the contact points between the stocker and the PODs, causing false triggering of the stocker PGV (Programmable Guide Vehicle) and OHT port (the transfer point between the OHT and the stocker) sensors. This results in system malfunctions, severely impacting material transfer safety and efficiency, and also affecting product yield. Currently, manual periodic cleaning is the primary method to address these issues. However, this requires the machine to be stopped during cleaning, affecting production efficiency. Furthermore, the high location of the OHT port poses a high risk of working at height, and the high-speed operation of the surrounding OHTs also presents a significant safety threat. Summary of the Invention

[0003] This application provides a cleaning device for semiconductor material handling systems, which can realize automatic cleaning of semiconductor material handling systems and equipment.

[0004] On one hand, this application provides a cleaning device for a semiconductor material handling system, the semiconductor material handling system including an overhead conveying device, the cleaning device being capable of positional changes within the semiconductor material handling system via the overhead conveying device, the cleaning device comprising:

[0005] The cleaning body includes a cleaning section for contacting the object to be cleaned;

[0006] A vacuum system, installed on the cleaning body, is used to provide vacuum suction for the cleaning section;

[0007] A first sensing device is disposed on the cleaning body and is used to collect the device position information of the cleaning device;

[0008] An identification information collection device is installed on the cleaning body to collect object identification information;

[0009] The second sensing device is disposed on the cleaning body and is used to collect distance information between the cleaning part and the object to be cleaned;

[0010] The control device is communicatively connected to the vacuum system, the identification information acquisition device, the first sensing device, and the second sensing device. The control device receives the device position information and the distance information. If the device position information indicates that the cleaning device has reached the preset area of ​​the object to be cleaned, the identification information acquisition device is triggered to acquire identification information. If the object identification information matches the preset identification information of the object to be cleaned, and the distance information indicates that the cleaning device has reached the surface of the object to be cleaned, the vacuum system is triggered to operate to provide vacuum suction for the cleaning device.

[0011] In a possible implementation, the cleaning device further includes:

[0012] An image acquisition device is disposed on the cleaning body and is used to acquire environmental images, the environmental images including the surface to be cleaned corresponding to the cleaning body;

[0013] The control device is also used to trigger the image acquisition device to acquire an environmental image if the device location information indicates that the cleaning device has reached a preset area of ​​the object to be cleaned. The environmental image is used to provide indication information for controlling the operating status of the vacuum system.

[0014] In a possible implementation, the control device is communicatively connected to a host computer;

[0015] The control device is also used to receive the environmental image and send it to the host computer, and control the operating status parameters of the vacuum system based on the vacuum operation control information fed back by the host computer, wherein the vacuum operation control information is generated based on the degree of dirt on the surface to be cleaned indicated by the environmental image.

[0016] In a possible implementation, the operating status parameters include suction intensity;

[0017] The control device is further configured to: when the object identification information matches the preset identification information of the object to be cleaned, and the distance information indicates that the cleaning unit has reached the surface to be cleaned of the object to be cleaned, control the vacuum system to start and the suction intensity to be the rated suction intensity of the vacuum system; and, in response to the vacuum operation control information sent by the host computer, control the suction intensity of the vacuum system to switch from the rated suction intensity to the target suction intensity corresponding to the vacuum operation control information.

[0018] In a possible implementation, the control device is further configured to:

[0019] The system receives the environmental image and performs particle detection-based dirt level identification on the environmental image to obtain the target identification result.

[0020] The target suction intensity matching the target identification result is determined based on a preset correspondence, wherein the preset correspondence includes a mapping relationship between multiple dirt levels and multiple suction intensities;

[0021] When the object identification information matches the preset identification information of the object to be cleaned, and the distance information indicates that the cleaning unit has reached the surface of the object to be cleaned, the vacuum system is controlled to start and operate at the target suction intensity.

[0022] In a possible implementation, the control device is further specifically used for:

[0023] The environmental image is subjected to particle detection based on an image segmentation model to obtain particle quantity information of the environmental image;

[0024] The target identification result is determined based on the particle quantity information. The target identification result is used to indicate the degree of dirtiness indicated by the environmental image. The particle quantity information is positively correlated with the degree of dirtiness.

[0025] In a possible implementation, the particle quantity information includes particle area percentage and particle number, wherein the particle area percentage indicates the area proportion of each particle's image region in the environmental image; the determination of the target recognition result based on the particle quantity information includes:

[0026] The correction weight is determined based on the particle area ratio, and the particle area ratio is positively correlated with the correction weight;

[0027] The particle number is corrected using the correction weight as a coefficient to obtain correction amount information;

[0028] The degree of dirtiness corresponding to the correction amount information is determined as the target identification result.

[0029] In a possible implementation, the control device is further configured to: activate a timeout timer when the vacuum system is started; and, in response to the timeout timer reaching a preset duration, control the vacuum system to stop operating.

[0030] In a possible implementation, the semiconductor material handling system includes a handling control device and an automated storage and retrieval system, and the cleaning device further includes:

[0031] A power supply assembly includes a battery and a charge / discharge control module, wherein the charge / discharge control module is communicatively connected to the control device and is used to acquire the battery's power information and send it to the control device.

[0032] The control device is also used to respond to the power information being lower than a preset power level, control the vacuum system to stop operating and feed back low power indication information to the host computer, so that the host computer can send the low power indication information to the handling control device, so that the handling control device can control the aerial handling device to transfer the cleaning device to the charging shelf of the automated warehouse based on the low power indication information.

[0033] In a possible implementation, the cleaning device further includes a temperature detection module for detecting a first temperature of the battery and a second temperature of the vacuum system, and feeding this information back to the control device.

[0034] The control device is also used to control the vacuum system to stop operating when the first temperature is higher than the first preset temperature and / or the second temperature is higher than the second preset temperature; and to send a warning message to the host computer so that the host computer can send the warning message to the transport control device so that the transport control device can control the aerial transport device to transfer the cleaning device to the output port of the automated warehouse based on the warning message.

[0035] The cleaning device for semiconductor material handling systems provided in this application has the following technical advantages:

[0036] The technical solution of this application sets a first sensing device, a second sensing device, an identification information collection device, and a vacuum system on the cleaning body. It detects whether the cleaning device has reached the preset area of ​​the object to be cleaned by combining the device position information collected by the first sensing device. If it has reached the preset area, it triggers identification collection. Then, when the object identification information matches the preset identification information of the object to be cleaned, and the distance information indicates that the cleaning part has reached the surface to be cleaned of the object, it triggers the operation of the vacuum system to provide vacuum suction for the cleaning part during the cleaning process. This realizes remote fully automatic cleaning of semiconductor material handling systems and corresponding machines, avoids the risks of manual climbing operations, and does not require machine shutdown for cleaning, thus improving machine operating efficiency and cleaning effect. Attached Figure Description

[0037] To more clearly illustrate the technical solutions and advantages in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the structure of a semiconductor material handling system provided in an embodiment of this application;

[0039] Figure 2 This is a schematic diagram of the structure of a cleaning device for a semiconductor material handling system provided in an embodiment of this application;

[0040] Figure 3 yes Figure 2 A structural schematic diagram of the cleaning device from another side view;

[0041] Figure 4 This is a communication block diagram between a cleaning device for a semiconductor material handling system and the semiconductor material handling system provided in an embodiment of this application;

[0042] Figure 5 This is a schematic diagram of the human interaction interface of a cleaning device provided in an embodiment of this application;

[0043] Figure 6 This is a block diagram illustrating the operation control principle of a cleaning device provided in an embodiment of this application;

[0044] Figure 7 This is a schematic diagram illustrating the principle of abnormal power handling in a cleaning device provided in an embodiment of this application.

[0045] Figure 8 This is a block diagram illustrating the principle of temperature anomaly handling in a cleaning device provided in an embodiment of this application.

[0046] Reference numerals: 11-Placing / Retrieving position, 12-Robot conveyor, 13-OHT port, 14-Shelf of automated warehouse, 110-Cleaning unit, 120-Vacuum system, 131-First sensor, 132-Identification information acquisition device, 133-Second sensor, 140-Control device, 150-Image acquisition device, 160-Wireless communication module, 170-Handle, 180-Cleaning device identification module, 190-Human-machine interaction device, 200-Power supply unit. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0048] It should be noted that, in the description of this application, the following definitions shall apply unless a different definition is given elsewhere in the claims or this specification. All numerical values, whether or not explicitly indicated, are defined herein as being modified by the term "about". The term "about" generally refers to a range of numerical values ​​that a person skilled in the art would consider equivalent to the stated values ​​to produce substantially the same properties, functions, results, etc. A range of numerical values ​​indicated by a low value and a high value is defined as including all numerical values ​​within that range and all subranges included within that range.

[0049] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0050] Please see Figure 1 , Figure 1This is a schematic diagram of a semiconductor material handling system provided in an embodiment of this application. The semiconductor material handling system includes an overhead transport device (OHT), a track, and an automated storage and retrieval system (Stocker). The automated storage and retrieval system is equipped with a loading / unloading port (PGV port) 11, a robotic conveyor (Crane) 12, an OHT port (transfer position between the OHT and the Stocker) 13, a shelf 14, and a handling control device 140. The loading / unloading port 11 serves as an entrance for manual loading or unloading. The robotic conveyor 12 is used to transport materials, etc. The OHT port provides an area for the transfer of materials and cleaning equipment between the OHT and the Stocker. After loading, the materials can be transferred to the automated storage and retrieval system by the robotic conveyor 12, or the materials from the automated storage and retrieval system can be picked up by the OHT after reaching the OHT port exit for the next transfer. The racks 14 in the automated storage and retrieval system (AS / RS) serve as platforms for storing materials within the AS / RS. The handling control device 140 may include an MCS (Material Control System) and a MES (Manufacturing Execution System). The former is used for information exchange with the cleaning device, while the latter is used for executing handling operations. The cleaning device of this application can be moved within the semiconductor material handling system via the aforementioned overhead handling device. For example, it can enter the AS / RS through the loading / unloading position 11 and be transported to different locations within the AS / RS. It can also be transported to the OHT (Outdoor Handling Station) via the OHT port and then transferred to the machine by the OHT.

[0051] In some embodiments, reference is made to Figure 4 , Figure 4 This diagram illustrates the flow of a cleaning device within a semiconductor material handling system. First, after the cleaning device enters Stocker A, its location information is reported to the MCS and MES. The MES automatically issues destination instructions to the MCS according to predefined rules. The MCS then sends these instructions to the OHVC (Overhead Vehicle Controller). The OHVC automatically controls the OHT (Overhead Trolley) to transport the cleaning device to its destination, such as the machine requiring cleaning, or between other Stockers, such as Stocker BN.

[0052] The following describes a cleaning device for a semiconductor material handling system according to this application, with reference to... Figure 2 and Figure 3 The cleaning device includes: a cleaning body 110, specifically including a cleaning part for contacting the object to be cleaned; and a vacuum system 120, disposed on the cleaning body 110, for providing vacuum suction to the cleaning part.

[0053] Specifically, the cleaning unit 110, which is used to approach or contact the object to be cleaned, may be equipped with a suction port for sucking up dirt particles and other impurities. The vacuum system 120, which has a vacuum supply function, is integrated into the cleaning unit 110 and communicates with the cleaning unit. It can generate vacuum suction to provide suction for the cleaning unit and filter and process the adsorbed impurities.

[0054] The cleaning device also includes: a first sensing device 131, disposed on the cleaning body 110, for collecting device position information of the cleaning device; an identification information collection device 132, disposed on the cleaning body 110, for collecting object identification information; and a second sensing device 133, disposed on the cleaning body 110, for collecting distance information between the cleaning part and the object to be cleaned.

[0055] Specifically, the device location information is used to indicate the position of the cleaning device in the semiconductor material handling system or machine. The first sensing device 131 is used to collect position sensing signals around the cleaning device to generate device location information, which is then transmitted to the control device 140. For example, the first sensing device 131 can be a positioning sensor, capable of receiving positioning signals sent by the object to be cleaned or other devices to detect the current position of the cleaning device, such as detecting that the cleaning device has arrived near the machine to be cleaned.

[0056] Specifically, different shelves, overhead conveyor devices, or different OHT ports and machines in the semiconductor material handling system each have their own identification modules carrying unique identification information. The identification information acquisition device 132 can obtain the identification carried by the identification module through identification sensing to generate object identification information, which is then fed back to the control device 140. For example, the object identification information can be a barcode or the like, and the current position of the shelf or machine can be recorded based on the object identification information.

[0057] Specifically, the second sensing device 133 is used to detect the distance between the cleaning unit and the object to be cleaned. The object to be cleaned may include, but is not limited to, objects that the cleaning device can reach and that perform automatic cleaning operations, such as machines, shelves, and OHT ports. The second sensing device 133 may include a distance sensor to realize distance sensing and generate distance information, which is then fed back to the control device 140.

[0058] In some embodiments, the cleaning device also includes a cleaning device identification module 180 (Smart tag) carrying identification information for uniquely identifying the cleaning device, such as a unique barcode, which can be used to provide the current location of the cleaning device to the handling control device 140 of the semiconductor material handling system, so as to realize independent control between different cleaning devices.

[0059] The cleaning device also includes a control device 140, which is communicatively connected to the vacuum system 120, the identification information acquisition device 132, the first sensor device 131, and the second sensor device 133, respectively, to realize the transmission of data signals and control commands between the vacuum system 120, the identification information acquisition device 132, the first sensor device 131, and the second sensor device 133.

[0060] The control device 140 is used to receive device position information and distance information. If the device position information indicates that the cleaning device has reached the preset area of ​​the object to be cleaned, the identification information acquisition device 132 is triggered to acquire the identification information. If the object identification information matches the preset identification information of the object to be cleaned, and the distance information indicates that the cleaning device has reached the surface of the object to be cleaned, the vacuum system 120 is triggered to operate to provide vacuum suction for the cleaning device.

[0061] Specifically, the first sensing device 131 transmits the device position information to the control device 140. The control device 140 determines the position of the cleaning device based on this information. If it determines that the cleaning device has reached the preset area of ​​the object to be cleaned, it triggers the identification information acquisition device 132 to collect the object identification information corresponding to the object to be cleaned. The control device 140 compares the collected object identification information with the preset identification information of the object to be cleaned. If they match, the identification is confirmed as a match. The preset area is the surrounding area of ​​the object to be cleaned, and its size can be set based on actual needs. The preset identification information is the unique identification code of the object to be cleaned. Simultaneously, the control device 140 also determines whether the cleaning part has reached the surface to be cleaned based on the distance information indicating the distance between the cleaning part and the object to be cleaned. If so, it sends a start command to the vacuum system 120 to trigger the vacuum system 120 to operate, thereby providing vacuum suction to remove particles and other dirt and impurities from the surface to be cleaned.

[0062] In summary, this application sets up a first sensor 131, a second sensor 133, an identification information acquisition device 132, and a vacuum system 120 on the cleaning body 110. It detects whether the cleaning device has reached the preset area of ​​the object to be cleaned by combining the device position information collected by the first sensor 131. If it has reached the preset area, it triggers identification acquisition. Then, when the object identification information matches the preset identification information of the object to be cleaned, and the distance information indicates that the cleaning part has reached the surface to be cleaned of the object, it triggers the operation of the vacuum system 120 to provide vacuum suction for the cleaning part during the cleaning process. This enables remote fully automatic cleaning of the semiconductor material handling system and corresponding machine, avoids the risks of manual climbing operations, and does not require machine shutdown for cleaning, thus improving machine operating efficiency and cleaning effect.

[0063] Based on some or all of the above embodiments, in some embodiments, the cleaning device further includes an image acquisition device 150, which is disposed on the cleaning body 110 and is used to acquire environmental images, the environmental images including the surface to be cleaned corresponding to the cleaning body 110; the control device 140 is also used to trigger the image acquisition device 150 to acquire images and obtain environmental images if the device position information indicates that the cleaning device has reached the preset area of ​​the object to be cleaned.

[0064] Specifically, the image acquisition device 150 is used to acquire images of the surface of the object to be cleaned, visualizing particles and other dirt and impurities on the surface, thereby providing information on the degree of dirt on the surface. Based on this visualized information, the operating state of the vacuum system 120 is controlled. Therefore, the environmental image provides indication information for controlling the operating state of the vacuum system 120. When the current position indicated by the device position information is detected to be within a preset area of ​​the object to be cleaned, the control device 140 sends an image acquisition command to the image acquisition device 150 to control the image acquisition device 150 to capture an environmental image. Thus, by setting up the image acquisition device 150 and the triggering mechanism, visual information of the surface to be cleaned is acquired at the triggering node of the cleaning process, thereby providing reference information for the operating state control of the vacuum system 120. This allows for the location of dirt and identification of the degree of dirt while automating cleaning, which is beneficial for the state and energy consumption control of the vacuum system 120 and improves the cleaning effect.

[0065] In some embodiments, the control device 140 is communicatively connected to a host computer, which operates in a semiconductor material handling system, machine, or human-machine interface device. The host computer is also communicatively connected to the wireless communication module 160 of the cleaning device. The wireless communication module 160 is also communicatively connected to the control device 140, used to transmit information processed by the control device 140 to the host computer and to receive control commands from the host computer. Accordingly, the control device 140 is also used to: receive environmental images and send them to the host computer, and control the operating status parameters of the vacuum system 120 based on the vacuum operation control information fed back by the host computer.

[0066] Specifically, the vacuum operation control information is generated based on the degree of dirt on the surface to be cleaned, as indicated by an environmental image. After receiving the environmental image, the host computer performs image recognition to determine the current degree of dirt on the surface and, based on this, determines the required cleaning intensity. It then sends the vacuum operation control information corresponding to this cleaning intensity to the control device 140. This control device then directs the vacuum system 120 to perform the cleaning operation based on the operating status parameters carried in the vacuum operation control information. These operating status parameters may include, but are not limited to, suction strength, such as the vacuum suction level. In this way, by having the host computer determine the cleaning status and send signal commands, the data processing burden on the cleaning device is reduced, and the cleaning effect is improved.

[0067] In some cases, environmental images can also be used to indicate structural information such as the surface to be cleaned. The control device 140 can send the environmental images to a host computer for storage, and when performing a cleaning task, it can send device location information or object identification information to the host computer so that the host computer can retrieve the corresponding historical environmental images. Based on the structural information and / or the indicated degree of dirt carried in the historical environmental images, the host computer can determine the difficulty of cleaning the surface to be cleaned, and then feed back the vacuum operation control information corresponding to the appropriate cleaning intensity to the control device 140. Understandably, the more complex the structure indicated by the structural information or the more grooves, the higher the cleaning difficulty; the flatter the surface indicated by the structural information, the lower the cleaning difficulty.

[0068] In some embodiments, the operating state parameters include suction strength; the control device 140 is further configured to: control the vacuum system 120 to start and set the suction strength to the rated suction strength of the vacuum system 120 when the object identification information matches the preset identification information of the object to be cleaned, and the distance information indicates that the cleaning unit has reached the surface to be cleaned of the object; and, in response to the vacuum operation control information sent by the host computer, control the suction strength of the vacuum system 120 to switch from the rated suction strength to the target suction strength corresponding to the vacuum operation control information. That is, in the initial state of triggering the cleaning operation, the strongest suction is used for cleaning, and after receiving the vacuum operation control information fed back by the host computer, the suction strength is switched to avoid the cleaning operation delay caused by the image processing and information transmission of the host computer, thereby improving the cleaning effect.

[0069] In one embodiment, during the initial operation of the cleaning device, when the OHT (Outputless Handling Unit) transports the cleaning device to its destination, the control identification information acquisition device 132 records the current position of the machine to be cleaned, and controls the image acquisition device 150 to capture the current environmental image. After processing, the image is fed back to the host computer system via the wireless communication module 160 for recording and analysis. When the vacuum system 120 first cleans the object to be cleaned, the vacuum suction level in the operating status parameters uses the default rated suction level, such as level 3. During the second and subsequent cleaning of the object, after the cleaning device feeds back the position of the machine to be cleaned, the host computer system analyzes the data based on historical environmental images to determine the difficulty of cleaning. It then sends back the applicable operating status parameters for the current position, such as the optimal suction level command, to the control device 140 of the cleaning device to ensure the best cleaning effect while also considering the rational use of energy.

[0070] In other embodiments, the environmental image is processed and analyzed by the control device 140. Accordingly, the control device 140 is also used to: receive the environmental image and perform dirt level identification based on particle detection to obtain target identification results; determine the target suction intensity matching the target identification results based on a preset correspondence; and control the vacuum system 120 to start and operate at the target suction intensity when the object identification information matches the preset identification information of the object to be cleaned and the distance information indicates that the cleaning unit has reached the surface to be cleaned of the object to be cleaned.

[0071] Specifically, the target recognition result is used to indicate the degree of dirtiness of the surface to be cleaned as indicated by the environmental image. Preset correspondences include mappings between multiple dirtiness levels and multiple suction intensities, which can be stored in the control device 140. When the identified object matches the preset identifier and the cleaning unit reaches the surface to be cleaned, the control device 140 sends a start command to the vacuum system 120 and controls the vacuum system 120 to start and clean at the target suction intensity. Thus, through image analysis and vacuum operation control information generation by the control device 140, the cleaning device can achieve a closed-loop processing of information acquisition, analysis, and control command generation, improving cleaning efficiency and avoiding cleaning task interruptions caused by external communication barriers.

[0072] In some embodiments, the control device 140 is further specifically used for: performing particle detection on an environmental image based on an image segmentation model to obtain particle quantity information of the environmental image; and determining the target recognition result based on the particle quantity information.

[0073] Specifically, the image segmentation model is trained under constraints using sample images, sample segmentation labels, and category labels. During training, the sample images are used as input, and the sample segmentation labels and category labels are the desired outputs. The sample segmentation labels represent the region contours of each foreground object in the sample image, and the category labels represent the category of each segmented foreground object or indicate whether the image region is background. The image segmentation model can be used to detect whether each pixel in an environmental image belongs to the foreground or background, thereby detecting objects in the image. The sample images in the training data include images containing multiple particles to ensure that the trained image segmentation model can accurately detect particles and other impurities in the image.

[0074] Specifically, image detection based on image segmentation can identify the contours of dirt particles in an environmental image, thereby obtaining particle quantity information. This particle quantity information indicates the amount of dirt particles in the environmental image. Correspondingly, a target recognition result is obtained, which indicates the degree of dirtiness indicated by the environmental image. The particle quantity information is positively correlated with the degree of dirtiness; that is, the higher the dirt particle content, the higher the degree of dirtiness, and vice versa. In this way, particle detection through image segmentation can accurately determine the degree of dirtiness of the surface to be cleaned, improving the adaptability of the vacuum system 120 control to the environment to be cleaned, and enhancing the cleaning effect.

[0075] In some embodiments, the particle quantity information includes particle area percentage and particle count. The particle area percentage indicates the area proportion of each particle's image region within the environmental image. Based on the image segmentation results, the pixel region occupied by each particle can be determined, and then the total number of pixels occupied by all particles in the environmental image can be counted. The ratio of this ratio to the total number of pixels in the environmental image is used as the particle area percentage. Furthermore, the particle count is determined based on the contours of each particle in the image segmentation results.

[0076] Accordingly, determining the target identification result based on particle quantity information includes: determining the correction weight based on the particle area ratio; correcting the particle quantity using the correction weight as a coefficient to obtain the correction amount information; and determining the degree of dirtiness information corresponding to the correction amount information as the target identification result.

[0077] Specifically, a higher number of particles indicates a greater amount of dirt, and thus a higher level of dirtiness, and vice versa. Similarly, a larger particle area ratio indicates a larger dirt area, and thus a higher level of dirtiness, and vice versa. The particle area ratio is positively correlated with the correction weight; a larger particle area ratio results in a larger correction weight, and vice versa. Using the particle area ratio as a coefficient to correct for particle count allows for a combination of consideration of particle area and particle quantity, improving the accuracy of dirtiness assessment.

[0078] In some cases, the correction weight can be the proportion of particle area, or it can be the product of the proportion of particle area and the structural complexity of the surface to be cleaned. The structural complexity is positively correlated with the correction weight and can be obtained through structural analysis of the environmental image segmentation results. Specifically, correcting the particle number with the correction weight as a coefficient means multiplying the correction weight by the particle number to obtain the correction amount information. Based on the pre-stored mapping relationship between multiple levels of dirtiness and multiple particle quantity ranges, the degree of dirtiness corresponding to the correction amount information is determined to obtain the target recognition result; the correction amount information is positively correlated with the degree of dirtiness.

[0079] Based on all or part of the above embodiments, in some embodiments, the vacuum system 120 controls its operating time through a time delay. A single start command can control the vacuum system 120 to run for a preset time and then stop. Accordingly, the control device 140 is further configured to: activate the time delay when the vacuum system 120 is started; and, in response to the time delay reaching the preset duration, control the vacuum system 120 to stop operating. This ensures cleaning effectiveness while reducing energy consumption.

[0080] In some embodiments, after the timing of the delay timer reaches a preset duration and the vacuum system 120 stops operating, the control device 140 is further configured to: control the image acquisition device 150 to acquire updated environmental images again; if the environmental image indicates that the surface to be cleaned meets the cleaning conditions, and the detected particle quantity information is lower than a preset amount, determine that the cleaning task of the object to be cleaned has ended; if the environmental image indicates that the surface to be cleaned does not meet the cleaning conditions, and the detected particle quantity information is still higher than a preset amount, then control the vacuum system 120 to run again, and execute the above-mentioned cleaning and judgment process until the environmental image acquired again indicates that the surface to be cleaned meets the cleaning conditions.

[0081] In some embodiments, reference is made to Figure 2 The cleaning device also includes a power supply component 200, integrated on the cleaning body 110, for providing electrical power for the cleaning device. The power supply component 200 includes a battery and a charge / discharge control module. The charge / discharge control module is communicatively connected to the control device 140 for acquiring battery power information and sending it to the control device 140, as well as controlling the battery to charge and discharge. The power supply component 200 can be charged via wireless charging.

[0082] In some embodiments, reference is made to Figure 2 The cleaning device also includes a human-machine interface 190, which displays the cleaning device's operating mode, temperature information, battery level, suction strength, Wi-Fi signal strength, sensor status information, etc. (see reference). Figure 5 ).

[0083] In one embodiment, reference Figure 6 When the device position information of the first sensor 131 reaches the destination, the control device 140 triggers the identification information acquisition device 132 to read the identification and the image acquisition device 150 to capture the image. Then, the information is fed back to the host computer system through the wireless communication module 160 for recording and analysis to obtain the vacuum control information corresponding to the optimal suction strength. When the distance information of the second sensor 133 indicates that the device has reached the surface to be cleaned and the identification matches, the control device 140 triggers the vacuum system 120 to start and the delay circuit to start timing, so that the vacuum system 120 operates at the optimal suction strength. When the delay reaches the preset time, the control device 140 controls the vacuum pump to shut down.

[0084] Based on some or all of the above embodiments, in some embodiments, the semiconductor material handling system includes a handling control device 140 and an automated storage and retrieval system. The control device 140 is also used to control the vacuum system 120 to stop operating and feed back low power indication information to the host computer in response to the power information being lower than a preset power level. The host computer sends the low power indication information to the handling control device 140, so that the handling control device 140 controls the aerial handling device to transfer the cleaning device to the charging shelf of the automated storage and retrieval system based on the low power indication information, so as to replenish the power of the cleaning device. After charging is completed, the control device 140 sends the charging completion information to the host computer, and the host computer notifies the MES system to continue the cleaning work.

[0085] In one embodiment, reference Figure 7 When the control device 140 detects that the current power level indicated by the power information is lower than the preset power level, it will control the vacuum pump to stop working and feed back the low power indication information of the cleaning device to the host computer. The host computer will then inform the MES of the transport control device 140. The MES will send a command to the MCS, and the MCS will send the command to the OHVC. Finally, the cleaning device will be transported to a charging rack that can be charged through the OHT to replenish the power, so as to handle the abnormal power situation.

[0086] Based on some or all of the above embodiments, in some embodiments, the cleaning device further includes a temperature detection module for detecting the first temperature of the battery and the second temperature of the vacuum system 120, and feeding it back to the control device 140; the control device 140 is also used to control the vacuum system 120 to stop operating when the first temperature is higher than the first preset temperature and / or the second temperature is higher than the second preset temperature; and to send a warning message to the host computer, so that the host computer can send the warning message to the transport control device 140, so that the transport control device 140 can control the aerial transport device to transfer the cleaning device to the output port of the automated storage and retrieval system based on the warning message, so as to facilitate subsequent device inspection and maintenance and avoid the risk of device operation and explosion caused by abnormal temperature.

[0087] Specifically, the temperature detection module may include a battery temperature detection submodule and a vacuum system 120 temperature detection submodule. The former can be integrated into the charge and discharge control module, and the latter can be integrated into the vacuum system 120.

[0088] In one embodiment, reference Figure 8When the control device 140 detects that the current temperature of the battery and / or vacuum system 120 is higher than the corresponding preset temperature, it controls the vacuum system 120 to stop working and feeds the temperature information back to the host computer. The host computer then notifies the MES, which in turn issues a command to the MCS. The MCS sends the command to the OHVC, and finally, the cleaning device is delivered to the nearest automated storage and retrieval system's output port via the OHT. The MCS notifies the terminal equipment of relevant personnel to provide an early warning and complete the handling process for abnormal temperature conditions.

[0089] In some embodiments, reference is made to Figure 3 The cleaning unit is also equipped with a handle 170 for easy handling of the cleaning device.

[0090] This application provides a control device 140 for a cleaning apparatus. The control device 140 includes a processor and a memory. The memory stores at least one instruction or at least one program. The at least one instruction or at least one program is loaded and executed by the processor to achieve the function of the control device 140 provided in the above-described cleaning apparatus embodiment.

[0091] Memory can be used to store software programs and modules. The processor executes these stored software programs and modules to perform various functional applications and wafer scratch detection. Memory can primarily include a program storage area and a data storage area. The program storage area stores the operating system, application programs required for the functions, etc.; the data storage area stores data created based on device usage, etc. Furthermore, memory can include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, memory may also include a memory controller to provide the processor with access to the memory.

[0092] Embodiments of this application also provide a computer-readable storage medium, which may be disposed in a control device 140 to store at least one instruction or at least one program related to implementing a cleaning device for a semiconductor material handling system in the method embodiment. The at least one instruction or the at least one program is loaded and executed by the processor to implement the function of the control device 140 of the cleaning device provided in the above-described cleaning device embodiment.

[0093] Optionally, in this embodiment, the storage medium may be located at at least one of the multiple network servers in a computer network. Optionally, in this embodiment, the storage medium may include, but is not limited to, various media capable of storing program code, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.

[0094] In summary, the technical solution of this application designs a cleaning device that highly integrates various sensors and a vacuum system 120 on the cleaning body 110, facilitating efficient and fully automated transfer via OHT (Optical Handling Tolerance) to achieve automatic cleaning of different machines, OHT ports, and automated storage and retrieval systems. Furthermore, the image acquisition device 150 can identify the machine location and the degree of dirt on the corresponding surface to be cleaned, and the collected data is fed back to the host computer system or analyzed locally. If the amount of particles at a certain location is high, the suction power is automatically increased during cleaning to ensure cleaning effectiveness. In manual cleaning scenarios, multiple people are required to work at height using a lift vehicle, and each operation requires a 30-40 minute downtime, increasing the risk of working at height and affecting machine transfer efficiency, resulting in poor cleaning results. Using the above-mentioned cleaning device, remote fully automated cleaning can be achieved without downtime or human intervention, reducing manpower waste and improving machine operating efficiency and cleaning effectiveness.

[0095] It should be noted that the order of the embodiments described above is merely for descriptive purposes and does not represent the superiority or inferiority of the embodiments. Furthermore, the above description focuses on specific embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps described in the claims can be performed in a different order than that shown in the embodiments and still achieve the desired results. Additionally, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired results. In some implementations, multitasking and parallel processing are also possible or may be advantageous.

[0096] The various embodiments in this application are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the device, equipment, and storage medium embodiments are basically similar to the method embodiments, so the descriptions are relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0097] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware, or by a program instructing the relevant hardware to implement them. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0098] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A cleaning device for a semiconductor material handling system, the semiconductor material handling system comprising an airborne handling device, characterized in that, The cleaning device is capable of repositioning within the semiconductor material handling system via the aerial transport device. The cleaning device includes: The cleaning body includes a cleaning section for contacting the object to be cleaned; A vacuum system, installed on the cleaning body, is used to provide vacuum suction for the cleaning section; A first sensing device is disposed on the cleaning body and is used to collect the device position information of the cleaning device; An identification information collection device is installed on the cleaning body to collect object identification information; The second sensing device is disposed on the cleaning body and is used to collect distance information between the cleaning part and the object to be cleaned; The control device is communicatively connected to the vacuum system, the identification information acquisition device, the first sensing device, and the second sensing device. The control device receives the device position information and the distance information. If the device position information indicates that the cleaning device has reached the preset area of ​​the object to be cleaned, the identification information acquisition device is triggered to acquire identification information. If the object identification information matches the preset identification information of the object to be cleaned, and the distance information indicates that the cleaning device has reached the surface of the object to be cleaned, the vacuum system is triggered to operate to provide vacuum suction for the cleaning device.

2. The cleaning device of claim 1, wherein, The cleaning device also includes: An image acquisition device is disposed on the cleaning body and is used to acquire environmental images, the environmental images including the surface to be cleaned corresponding to the cleaning body; The control device is also used to trigger the image acquisition device to acquire an environmental image if the device location information indicates that the cleaning device has reached a preset area of ​​the object to be cleaned. The environmental image is used to provide indication information for controlling the operating status of the vacuum system.

3. The cleaning device of claim 2, wherein, The control device is communicatively connected to the host computer. The control device is also used to receive the environmental image and send it to the host computer, and control the operating status parameters of the vacuum system based on the vacuum operation control information fed back by the host computer, wherein the vacuum operation control information is generated based on the degree of dirt on the surface to be cleaned indicated by the environmental image.

4. The cleaning device of claim 3, wherein, The operating status parameters include suction strength; The control device is further configured to: when the object identification information matches the preset identification information of the object to be cleaned, and the distance information indicates that the cleaning unit has reached the surface to be cleaned of the object to be cleaned, control the vacuum system to start and the suction intensity to be the rated suction intensity of the vacuum system; and, in response to the vacuum operation control information sent by the host computer, control the suction intensity of the vacuum system to switch from the rated suction intensity to the target suction intensity corresponding to the vacuum operation control information.

5. The cleaning device according to claim 2, characterized in that, The control device is also used for: The system receives the environmental image and performs particle detection-based dirt level identification on the environmental image to obtain the target identification result. The target suction intensity matching the target identification result is determined based on a preset correspondence, wherein the preset correspondence includes a mapping relationship between multiple dirt levels and multiple suction intensities; When the object identification information matches the preset identification information of the object to be cleaned, and the distance information indicates that the cleaning unit has reached the surface of the object to be cleaned, the vacuum system is controlled to start and operate at the target suction intensity.

6. The cleaning device according to claim 5, characterized in that, The control device is also specifically used for: The environmental image is subjected to particle detection based on an image segmentation model to obtain particle quantity information of the environmental image; The target identification result is determined based on the particle quantity information. The target identification result is used to indicate the degree of dirtiness indicated by the environmental image. The particle quantity information is positively correlated with the degree of dirtiness.

7. The cleaning device according to claim 6, characterized in that, The particle quantity information includes particle area percentage and particle number, wherein the particle area percentage indicates the area percentage of each particle's image region in the environmental image; the determination of the target recognition result based on the particle quantity information includes: The correction weight is determined based on the particle area ratio, and the particle area ratio is positively correlated with the correction weight; The particle number is corrected using the correction weight as a coefficient to obtain correction amount information; The degree of dirtiness corresponding to the correction amount information is determined as the target identification result.

8. The cleaning apparatus according to any one of claims 1-7, characterized in that, The control device is further configured to: activate a time delay timer when the vacuum system is started; and control the vacuum system to stop operating in response to the time delay timer reaching a preset duration.

9. The cleaning apparatus according to any one of claims 1-7, characterized in that, The semiconductor material handling system includes a handling control device and an automated storage and retrieval system; the cleaning device further includes: A power supply assembly includes a battery and a charge / discharge control module, wherein the charge / discharge control module is communicatively connected to the control device and is used to acquire the battery's power information and send it to the control device. The control device is also used to respond to the power information being lower than a preset power level, control the vacuum system to stop operating and feed back low power indication information to the host computer, so that the host computer can send the low power indication information to the handling control device, so that the handling control device can control the aerial handling device to transfer the cleaning device to the charging shelf of the automated warehouse based on the low power indication information.

10. The cleaning apparatus according to any one of claims 1-7, characterized in that, The cleaning device also includes a temperature detection module for detecting the first temperature of the battery and the second temperature of the vacuum system, and feeding it back to the control device; The control device is also used to control the vacuum system to stop operating when the first temperature is higher than the first preset temperature and / or the second temperature is higher than the second preset temperature; and to send a warning message to the host computer so that the host computer can send the warning message to the transport control device so that the transport control device can control the aerial transport device to transfer the cleaning device to the output port of the automated warehouse based on the warning message.

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