Back-drilling method, apparatus and system for circuit board

Abstract

This invention discloses a method, apparatus, and system for back-drilling a circuit board. Based on a configured detection device and a drilling device, the method includes: acquiring the actual position information of each electroplated hole to be back-drilled on the circuit board using the detection device to determine the hole position deviation value; determining the actual center coordinates of the back-drilling based on the hole position deviation value; and determining the back-drilling depth of the corresponding electroplated hole; and performing back-drilling on the circuit board using the drilling device based on the actual center coordinates and back-drilling depth of each electroplated hole to be back-drilled. This invention achieves drilling position acquisition outside the processing step, resulting in lower data acquisition costs and higher efficiency. It eliminates the need to integrate hole position detection equipment next to the drilling machine spindle or to measure relevant data before drilling, thus improving work efficiency and reducing equipment complexity and cost.

Description

Technical Field

[0001] This invention relates to the field of circuit board drilling, and more particularly to a method, apparatus, and system for back drilling of circuit boards. Background Technology In existing technologies, drilling machines with integrated hole position detection equipment are generally used for back drilling of circuit boards. This hole position detection equipment is typically a CCD vision camera, which has position detection and compensation functions. Before drilling, the CCD vision camera scans to obtain the position data of the holes to be back drilled. The hole position deviation data measured by the CCD vision camera is used to compensate for the hole position deviation during back drilling, thus achieving alignment. However, integrating a CCD vision camera into the spindle of the drilling machine has several drawbacks. It not only increases the complexity and cost of the equipment, but also requires data measurement before drilling. Since the CCD vision camera and the drilling machine body are integrated, the corresponding hole position scanning and data analysis need to be completed before secondary drilling, which takes up a significant amount of time in the drilling process. Furthermore, it is greatly affected by factors such as the worktable, and is also prone to instability, impacting drilling efficiency. Therefore, these problems urgently need to be addressed. Summary of the Invention

[0002] This invention provides a method, apparatus, and system for back-drilling circuit boards to solve the problem that existing drilling machines require integrated hole position detection equipment for hole position scanning and data analysis before back-drilling, which affects drilling efficiency.

[0003] Therefore, in one embodiment, a back-drilling method for a circuit board is provided, based on configured testing equipment and drilling equipment, the back-drilling method comprising: Based on a circuit board with electroplated holes, the actual position information of each electroplated hole to be back-drilled on the circuit board is obtained by the detection device to determine the hole position deviation value, and the actual center coordinates of the back-drilling are determined according to the hole position deviation value; and the back-drilling depth of the corresponding electroplated hole is determined. Based on the actual center coordinates and back-drilling depth of each electroplating hole to be back-drilled, the circuit board is back-drilled using the drilling equipment.

[0004] In one embodiment, the detection device includes a detection device with thickness detection function, and determining the back-drilling depth of the corresponding electroplating hole specifically includes: The actual thickness of the area corresponding to each back-drilled electroplating hole on the circuit board is measured using the aforementioned testing equipment. Based on the actual thickness, and in combination with the ratio of the target layer design depth to the circuit board design thickness, the back-drilling depth of each electroplated hole to be back-drilled is determined. Based on the actual center coordinates and back-drilling depth of each electroplating hole to be back-drilled, the circuit board is back-drilled using the drilling equipment, specifically including: Based on the actual center coordinates of each electroplating hole to be back-drilled, the drilling equipment is used to reach each predetermined position and back-drill the circuit board according to the back-drilling depth of the corresponding electroplating hole. In one embodiment, the testing equipment includes a non-destructive testing device, which includes an X-ray inspection device. Determining the back-drilling depth of the corresponding electroplated hole specifically includes: The back-drilling depth of each electroplated hole to be back-drilled is obtained using the non-destructive testing equipment. After back-drilling the circuit board is completed, the method further includes: The non-destructive testing equipment is used to check whether the back drilling depth of the corresponding electroplated hole is within the target deviation value. If it is not within the target deviation value, the difference value is fed back to the drilling equipment for compensation and adjustment.

[0005] In one embodiment, the circuit board based on electroplated holes is obtained through the following steps: Drill holes at predetermined locations on the circuit board to obtain through holes that penetrate the circuit board; The through holes are electroplated to obtain a circuit board with electroplated holes.

[0006] In one embodiment, the actual position information of each electroplating hole to be back-drilled on the circuit board is obtained through the detection device to determine the hole position deviation value, specifically including: The drilling position of the corresponding electroplating hole on the circuit board to be back-drilled is detected by the detection equipment to obtain the actual position information of the corresponding electroplating hole to be back-drilled. Based on the actual and theoretical position information of the electroplating hole corresponding to the back-drilling surface, the corresponding hole position deviation value is determined.

[0007] In one embodiment, the detection device with thickness detection function is a laser thickness measuring device, which measures the actual thickness of the area corresponding to each back-drilled electroplating hole on the circuit board.

[0008] In one embodiment, the drilling equipment has multiple machining spindles, and the back drilling method further includes: Through drilling and back drilling of the same circuit board are performed on the same machining spindle.

[0009] In one embodiment, a back-drilling processing apparatus for a circuit board is provided, the back-drilling processing apparatus including a testing device and a drilling processing device, wherein; The detection device is used to acquire the actual position information of each electroplated hole to be back-drilled on the circuit board based on the circuit board with electroplated holes, so as to determine the hole position deviation value; determine the actual center coordinates of the back-drilling based on the hole position deviation value, and determine the back-drilling depth of the corresponding electroplated hole. The drilling equipment is used to perform back-drilling on the circuit board based on the actual center coordinates and back-drilling depth of each electroplating hole to be back-drilled.

[0010] In one embodiment, the detection device includes an integrated laser thickness measurement module and / or a hole position detection module.

[0011] In one embodiment, a back-drilling system for a circuit board is provided, the back-drilling system comprising: Drilling equipment; Testing equipment; The drilling equipment and the testing equipment are used to work together to achieve the back drilling method described in any embodiment.

[0012] The aforementioned back-drilling method, apparatus, and system for circuit boards separates the detection equipment from the drilling equipment, allowing the drilling equipment to be dedicated solely to drilling circuit boards. A separate detection device detects the position of electroplated holes on the circuit board and calculates the hole position deviation, the actual center coordinates of the back-drilling, and the corresponding back-drilling depth. This enables the acquisition of drilling positions outside the drilling equipment's processing steps, resulting in lower data acquisition costs and higher efficiency. It eliminates the need to integrate detection equipment next to the drilling equipment's spindle or to perform pre-drilling measurements, thus improving the drilling equipment's efficiency and reducing its complexity and cost. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of a back-drilling process for a circuit board according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a back-drilling processing device for a circuit board according to an embodiment of the present invention; The symbols are explained as follows: 300. Drilling equipment; 400. Testing equipment. Detailed Implementation

[0015] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] It should be understood that the invention can be embodied in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated. The same reference numerals denote the same elements throughout.

[0017] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this invention, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.

[0018] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below,” “under,” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0019] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0020] To fully understand this invention, detailed structures and steps will be presented in the following description to illustrate the technical solution proposed by this invention. Preferred embodiments of the invention are described in detail below; however, in addition to these detailed descriptions, the invention may have other embodiments.

[0021] In one embodiment, a back-drilling method for a circuit board is provided, such as... Figure 1 and Figure 2 As shown, based on the configured inspection equipment and drilling equipment, which are not integrated, the back drilling method includes: S101, based on a circuit board with electroplated holes, the actual position information of each electroplated hole to be back-drilled on the circuit board is obtained by the detection device to determine the hole position deviation value, and the actual center coordinates of the back-drilling are determined according to the hole position deviation value; and the back-drilling depth of the corresponding electroplated hole is determined. Among them, the testing equipment refers to the testing equipment that is separate from the drilling equipment, specifically the hole position testing equipment.

[0022] In this step, the circuit board processing file records the predetermined position for the first drilling. The drilling machine can obtain the processing file in advance and drill through holes at the predetermined positions on the PCB board according to the processing requirements on the processing file. Then, the through holes are electroplated to obtain a circuit board with electroplated holes.

[0023] S102, based on the actual center coordinates and back-drilling depth of each electroplating hole to be back-drilled, the circuit board is back-drilled using the drilling equipment.

[0024] It's understandable that drilling equipment refers to a drilling machine that doesn't have a detection device on its main body for measuring the position of electroplated holes; the drilling machine is only used for drilling operations and not for measuring the position of holes on circuit boards. However, it should also be noted that drilling equipment can be equipped with a detection module for locating target positions at the edges and corners of the circuit board. For example, a CCD camera can be used for target point detection to achieve expansion and contraction detection and corresponding compensation, thereby further improving drilling accuracy.

[0025] The circuit board back-drilling method of this embodiment separates the detection device from the drilling equipment, allowing for pre-detection of relevant data on the circuit board. This enables the drilling equipment to be dedicated solely to back-drilling of the circuit board. The separate detection device detects the position of the electroplated holes on the circuit board and calculates the hole position deviation, the actual center coordinates of the back-drilling, and the corresponding back-drilling depth. This allows for acquisition of drilling positions outside the drilling equipment's processing steps, resulting in lower data acquisition costs and higher efficiency. Compared to existing technologies, it eliminates the need to integrate detection equipment next to the drilling equipment's spindle or to temporarily measure relevant data before drilling. This not only improves the efficiency of the drilling equipment but also reduces its complexity and cost.

[0026] In one embodiment, the detection device includes a detection device with thickness detection function, and determining the back-drilling depth of the corresponding electroplating hole specifically includes: S201, the actual thickness of the area corresponding to each electroplating hole to be processed on the circuit board is measured by the detection device; based on the actual thickness, combined with the ratio of the target layer design depth to be back drilled to the design thickness of the circuit board, the back drilling depth of each electroplating hole to be back drilled is determined. In this step, the ratio of the target layer design depth to the circuit board design thickness is a fixed value, and the measurement methods for this ratio include: At multiple back-drilling locations along the designed thickness direction of the circuit board, the actual board thickness at the electroplated hole at each drilling location is measured. The ratio between the actual board thickness at the electroplated hole at each drilling location and the designed thickness is calculated to obtain the ratio of the target layer design depth to the designed thickness of the circuit board.

[0027] The method for determining the back-drilling depth includes multiplying the design thickness of the electroplated hole at a certain back-drilling position on the circuit board by the ratio calculated above to obtain the back-drilling depth at that position.

[0028] S202, based on the actual center coordinates and back-drilling depth of each electroplating hole to be back-drilled, the circuit board is back-drilled using the drilling equipment, specifically including: Based on the actual center coordinates of each electroplating hole to be back-drilled, the drilling equipment is used to reach each predetermined position and back-drill the circuit board according to the back-drilling depth of the corresponding electroplating hole.

[0029] Among them, back drilling of the circuit board according to the actual center coordinates and back drilling depth means first finding the position, using the actual center coordinates as the target point, and performing corresponding depth control processing, the processing depth being the back drilling depth.

[0030] The circuit board back-drilling method of this embodiment separates the detection equipment from the drilling equipment, allowing the drilling equipment to be dedicated solely to drilling circuit boards. A separate detection device detects the actual position of each electroplated through-hole to be back-drilled, as well as the overall board thickness deviation at that through-hole. Based on the deviation between the measured actual and theoretical positions, compensation is applied to the back-drilling position coordinates of each hole during back-drilling, improving the concentricity between the back-drilled hole and the original electroplated through-hole. Furthermore, the drilling depth is proportionally adjusted based on the deviation between the actual and designed board thickness of each hole at its position, thereby reducing the deviation between the actual drilling depth and the actual target position. In other words, each hole individually obtains a position deviation compensation value and a depth compensation value. This allows for the acquisition of drilling position and board thickness outside the drilling equipment's processing steps, resulting in lower and more efficient data acquisition and processing costs. It eliminates the need to integrate a position detection device next to the drilling equipment's spindle or to measure relevant data before drilling, thus improving work efficiency and reducing equipment complexity and cost.

[0031] In one embodiment, the testing equipment includes a non-destructive testing (NDT) device, which includes an X-ray inspection device. Determining the back-drilling depth of the corresponding electroplated hole specifically includes: The back-drilling depth of each electroplated hole to be back-drilled is obtained using the non-destructive testing equipment. After back-drilling the circuit board is completed, the method further includes: The non-destructive testing equipment is used to check whether the back drilling depth of the corresponding electroplated hole is within the target deviation value. If it is not within the target deviation value, the difference value is fed back to the drilling equipment for compensation and adjustment.

[0032] The back-drilling depth of the electroplated hole can be obtained using X-ray inspection equipment via CT scanning. After the back-drilling is completed, X-ray inspection equipment is used again via CT scanning to check whether the back-drilling depth of the corresponding electroplated hole is within a preset target deviation value. The specific detection and adjustment method includes: calculating the difference between the actual back-drilling depth and the target back-drilling depth, comparing the difference with the preset target deviation value, and determining that the back-drilling depth of the electroplated hole is within the preset target deviation value if the difference is less than or equal to the preset target deviation value; otherwise, determining that the back-drilling depth of the electroplated hole is not within the preset target deviation value.

[0033] In one embodiment, the inspection equipment includes an inspection device with thickness detection function and a non-destructive testing device. Before back-drilling the circuit board using the drilling equipment, the method further includes: S501, the actual thickness of the area corresponding to each electroplating hole to be processed on the circuit board is measured by the detection device; based on the actual thickness of the circuit board, combined with the ratio of the target layer depth to be back drilled and the thickness of the circuit board, the first back drilling depth of each electroplating hole to be back drilled is determined. The process of determining the first back-drilling depth in this step can be referred to in step S201, and will not be repeated here.

[0034] S502, using the non-destructive testing equipment, determine the second back-drilling depth of each electroplated hole to be back-drilled; determine whether the deviation between the first back-drilling depth and the second back-drilling depth is within a preset deviation range; If the deviation between the first back-drilling depth and the second back-drilling depth is within the preset deviation range, the circuit board is back-drilled using the drilling equipment based on the actual center coordinates and according to the first back-drilling depth.

[0035] The non-destructive testing equipment can be a CT scanning device to scan the circuit board and determine the second back-drilling depth of each electroplated hole to be back-drilled. By comparing whether the deviation between the first back-drilling depth and the second back-drilling depth is within the preset deviation range, it can be determined whether the first back-drilling depth is reliable. For example, if the deviation between the first back-drilling depth and the second back-drilling depth is within the preset deviation range, it is determined that the determination of the first back-drilling depth is reliable, and the circuit board can be back-drilled according to the first back-drilling depth.

[0036] In one embodiment, step S101 above, namely obtaining the circuit board with electroplated holes, includes: Drill holes at predetermined locations on the circuit board to obtain through holes that penetrate the circuit board; Electroplating is performed on the through holes to obtain the corresponding electroplated holes on the circuit board.

[0037] The process involves drilling a through hole in the circuit board, followed by electroplating.

[0038] In one embodiment, step S101 above, which involves obtaining the actual position information of each electroplating hole to be back-drilled on the circuit board using the detection device to determine the hole position deviation value, specifically includes: S301, The detection device is used to detect the drilling position of the electroplating hole corresponding to the back drilling on the circuit board, and the actual position information of the electroplating hole corresponding to the back drilling is obtained. S302, determine the hole position deviation value based on the actual position information and theoretical position information of the electroplating hole corresponding to the back-drilling surface.

[0039] The drilling position on the circuit board is detected using a hole position detection device. The actual position information of the electroplating hole corresponding to the back drill face is (x2', y2'). The theoretical position information of the electroplating hole corresponding to the back drill face is (x1, y1). The difference between the actual position information and the theoretical position information of the electroplating hole corresponding to the back drill face is calculated to obtain the hole position deviation value, with coordinates (Δx, Δy).

[0040] The back-drilling processing method in this embodiment uses a combination of detection equipment and drilling equipment to apply the pre-acquired plate thickness data and the position data of the holes to be processed, so as to achieve efficient alignment (based on coordinate detection and compensation) and depth control processing (proportional mode of back-drilling processing) based on the actual plate thickness deviation correction compensation. This can achieve accurate location of the back-drilling hole in the XY axis and accurate approach to the target layer in the Z axis direction, thereby improving the accuracy and efficiency of back-drilling processing.

[0041] In one embodiment, the detection device with thickness detection function is a laser thickness measuring device. The laser thickness measuring device measures the actual thickness of the area corresponding to each back-drilled electroplating hole on the circuit board to improve the accuracy of the measurement.

[0042] In one embodiment, the drilling equipment has multiple machining spindles. To further improve machining accuracy, the back drilling method includes: The first and back drilling processes of the same circuit board are performed on the same machining spindle.

[0043] Considering that the processing procedures of each machining spindle may differ, the first drilling and back drilling of the same circuit board are configured to be performed on the same machining spindle. This means that process traceability control is implemented for the circuit board. In practice, the circuit boards can be marked or classified for traceability, so that the first drilling and back drilling of the same circuit board can be completed on the same machining spindle. This results in relatively good processing accuracy and consistency for back drilling of each circuit board.

[0044] In one embodiment, such as Figure 2 As shown, a back-drilling apparatus for a circuit board is provided. The back-drilling apparatus includes: Drilling equipment 300 and testing equipment 400 The testing equipment is used to obtain the actual position information of each electroplated hole on a circuit board to be back-drilled, in order to determine the hole position deviation value; based on the hole position deviation value, the actual center coordinates of the back-drilling are determined, and the back-drilling depth of the corresponding electroplated hole is determined. Drilling equipment is used to determine the actual center coordinates of back drilling based on the hole position deviation value, and to perform back drilling on circuit boards.

[0045] It should be noted that, in the above process, based on the actual position information obtained by the detection equipment, the corresponding hole position deviation value and back drilling depth can be obtained by the drilling equipment, as shown in the following embodiment, which is not specifically limited here: Alternatively, the testing equipment can be used to obtain the actual location information of each electroplated hole to be back-drilled on a circuit board with electroplated holes. The drilling equipment is used to determine the hole position deviation value; based on the hole position deviation value, the actual center coordinates of the back drilling are determined, and the back drilling depth of the corresponding electroplating hole is determined; and based on the hole position deviation value, the actual center coordinates of the back drilling are determined, and the circuit board is back drilled.

[0046] Specifically, the drilling equipment determines the hole position deviation value based on the actual and theoretical position information of the electroplated hole corresponding to the back-drilling surface. Refer to the description of step S302 above; to avoid redundancy, it will not be elaborated further here.

[0047] The drilling equipment 300 and the testing equipment 400 are used together to implement the back drilling method mentioned in any of the preceding embodiments. For example, the communication port of the drilling equipment 300 and the communication port of the testing equipment 400 can communicate with each other. The communication ports of the drilling equipment 300 and the testing equipment 400 can be connected wirelessly or wiredly.

[0048] Alternatively, the communication port of the drilling equipment 300 and the communication port of the testing equipment 400 may not communicate. After the testing equipment 400 completes the actual measurement, the measurement data can be obtained through data storage and imported into the drilling equipment 300 to achieve the above-mentioned back drilling process.

[0049] The drilling equipment in this embodiment utilizes a separately set detection device 400 to obtain the thickness data of the board to be processed and the drilling position data of the holes to be processed in advance. Using the detection data from the same device, the position deviation and thickness deviation of each hole requiring back drilling are calculated. This is equivalent to directly associating the hole position deviation and thickness deviation, reducing errors caused by additional external process measurement of the board thickness, thereby improving the accuracy of the data (actual center coordinates of the secondary drilling and the back drilling depth). Compared to existing technologies, the processing equipment in this embodiment does not require obtaining board thickness data through external process measurement of the board thickness, reducing operational steps and avoiding errors caused by external factors.

[0050] In one embodiment, the detection device includes a laser thickness measurement module and / or a hole position detection module, or a detection device with image sensor function and plate thickness measurement function.

[0051] The hole position detection equipment is equipped with a planar array camera module or an AOI (Auto Optical Inspection) integrated module. The drilling equipment can be equipped with a CCD camera to accurately locate the target position, detecting only a few corners of the target position to achieve expansion and contraction detection for compensation. Outside the processing of the circuit board drilling equipment 300, a separate detection device 400 is set up to measure the actual hole position deviation and obtain the actual board thickness data of the accessories requiring back-drilling. This avoids the instability caused by setting up the detection device 400 and the drilling equipment 300 together, improving efficiency.

[0052] In one embodiment, such as Figure 2 As shown, a back-drilling system for circuit boards is provided. The back-drilling system includes: 300 drilling equipment; 400 testing devices; The drilling equipment 300 and the inspection equipment 400 are used together to implement the back drilling method mentioned in any of the preceding embodiments. The communication ports of the drilling equipment 300 and the inspection equipment 400 can be connected wirelessly, wiredly, or not at all.

[0053] In this process, the circuit board is first drilled using a drilling machine 300; then, a detection machine 400 performs data detection and calculation for steps S101 and S201 to obtain the actual center coordinates and back-drilling depth of the second drilling; finally, the circuit board is fixed on the drilling table, and a second drilling (back-drilling) is performed on the circuit board according to the actual center coordinates and back-drilling depth of the second drilling. In other embodiments, the back-drilling system may also include a drilling table for placing the circuit board to be processed.

[0054] The back-drilling system of this embodiment acquires the drilling position and thickness data on the circuit board outside the drilling process of the drilling equipment 300. This data acquisition is cost-effective and efficient, eliminating the need for an integrated detection device 400 next to the spindle or for controlling the drilling equipment 300 to measure relevant data before drilling. Instead, a separately installed hole position detection device 400 detects and processes the drilling position and thickness data, improving work efficiency and reducing equipment complexity and cost. Compared to existing technologies, it offers higher efficiency, higher precision, lower error, and lower cost, demonstrating significant advantages.

[0055] In one embodiment, the detection device 400 is a hole position detection device that integrates a laser thickness measurement module, or a detection device with image sensor function and plate thickness measurement function.

[0056] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for back-drilling a circuit board, characterized in that, Based on the configured testing equipment and drilling equipment, the back drilling method includes: Based on a circuit board with electroplated holes, the actual position information of each electroplated hole to be back-drilled on the circuit board is obtained by the detection device to determine the hole position deviation value, and the actual center coordinates of the back-drilling are determined according to the hole position deviation value. And determine the back-drilling depth of the corresponding electroplating hole; Based on the actual center coordinates and back-drilling depth of each electroplating hole to be back-drilled, the circuit board is back-drilled using the drilling equipment.

2. The back-drilling machining method according to claim 1, characterized in that, The detection equipment includes a detection device with thickness detection function, and determining the back drilling depth of the corresponding electroplating hole specifically includes: The actual thickness of the area corresponding to each back-drilled electroplating hole on the circuit board is measured using the aforementioned testing equipment. Based on the actual thickness, and in combination with the ratio of the target layer design depth to the circuit board design thickness, the back-drilling depth of each electroplated hole to be back-drilled is determined. Based on the actual center coordinates and back-drilling depth of each electroplating hole to be back-drilled, the circuit board is back-drilled using the drilling equipment, specifically including: Based on the actual center coordinates of each electroplating hole to be back-drilled, the drilling equipment is used to reach each predetermined position and back-drill the circuit board according to the back-drilling depth of the corresponding electroplating hole.

3. The back-drilling machining method according to claim 2, characterized in that, The testing equipment includes non-destructive testing equipment, which includes X-ray testing equipment. Determining the back-drilling depth of the corresponding electroplated hole specifically includes: The back-drilling depth of each electroplated hole to be back-drilled is obtained using the non-destructive testing equipment. After back-drilling the circuit board is completed, the method further includes: The non-destructive testing equipment is used to check whether the back drilling depth of the corresponding electroplated hole is within the target deviation value. If it is not within the target deviation value, the difference value is fed back to the drilling equipment for compensation and adjustment.

4. The back drilling method according to claim 1, characterized in that, The circuit board with electroplated holes is obtained through the following steps: Drill holes at predetermined locations on the circuit board to obtain through holes that penetrate the circuit board; The through holes are electroplated to obtain a circuit board with electroplated holes.

5. The back drilling method according to claim 1, characterized in that, The actual position information of each electroplating hole to be back-drilled on the circuit board is obtained through the detection device to determine the hole position deviation value, specifically including: The drilling position of the corresponding electroplating hole on the circuit board to be back-drilled is detected by the detection equipment to obtain the actual position information of the corresponding electroplating hole to be back-drilled. Based on the actual and theoretical position information of the electroplating hole corresponding to the back-drilling surface, the corresponding hole position deviation value is determined.

6. The back drilling method according to claim 2, characterized in that, The detection device with thickness detection function is a laser thickness measuring device, which measures the actual thickness of the area corresponding to each back-drilled electroplating hole on the circuit board.

7. The back-drilling method according to any one of claims 4-6, characterized in that, The drilling equipment has multiple machining spindles, and the back drilling method further includes: Through drilling and back drilling of the same circuit board are performed on the same machining spindle.

8. A back-drilling processing device for circuit boards, characterized in that, The back drilling processing device includes a testing device and a drilling processing device, wherein; The detection device is used to obtain the actual position information of each electroplated hole to be back-drilled on the circuit board based on the circuit board with electroplated holes, so as to determine the hole position deviation value; determine the actual center coordinates of the back-drilling based on the hole position deviation value, and determine the back-drilling depth of the corresponding electroplated hole. The drilling equipment is used to perform back-drilling on the circuit board based on the actual center coordinates and back-drilling depth of each electroplating hole to be back-drilled.

9. The back drilling processing apparatus according to claim 8, characterized in that, The detection equipment includes a laser thickness measurement module and / or a hole position detection module.

10. A back-drilling system for circuit boards, characterized in that, The back drilling system includes: Drilling equipment; Testing equipment; The drilling equipment and the testing equipment are used in cooperation to achieve the back drilling method as described in any one of claims 1 to 7.

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