A kind of DIP-like package module circuit's general board design method and device of aging

Abstract

This invention discloses a design method and apparatus for a general-purpose aging board for DIP-like packaged module circuits, belonging to the field of power module circuit aging testing. By fully utilizing the commonalities of DIP-like packaged module circuits, this invention creates more versatile fixtures, improving fixture compatibility and achieving full coverage of DIP-like package pin spans within 50.8mm. This reduces the design time and procurement costs of custom-made fixtures, improving design efficiency. Under different power conditions, crown spring holes are used as resistor connectors, enabling free insertion and replacement between different load resistors, reducing the cost of repeatedly customizing fixtures and manufacturing boards due to different load resistors, and improving efficiency. When only the connection method of the CTRL pin differs—negative logic requires grounding, positive logic requires floating—the design of pin headers and jumpers allows for flexible connection selection, reducing overall hardware manufacturing costs. This invention is suitable for large-scale design and storage, and offers high testing efficiency.

Description

Technical Field

[0001] This invention relates to the field of power module circuit aging test technology, and in particular to a design method and apparatus for a general-purpose aging board for DIP-packaged module circuits. Background Technology

[0002] DIP-like packaged module circuits are a type of power module package characterized by pin spacing in multiples of 2.54mm, a lateral pin span of less than 25.4mm, a vertical pin span of less than 50.8mm, a pin diameter of less than 1mm, and a load current typically less than 2A. The load resistor power rating is between 5W and 30W. As a prototype board for this type of circuit, it includes module fixtures, load resistors, capacitors, power input terminals, and process status monitoring terminals. Unlike prototype boards for integrated circuits, power module prototype boards have higher power requirements, higher costs, and varying load resistors, necessitating design methods that offer higher reliability and lower costs.

[0003] Traditional DIP-like packaged module circuit boards, although they have a high degree of packaging similarity, mainly use one-to-one custom-made circuit packages for their fixtures, resulting in high manufacturing costs, long cycles, and low testing efficiency.

[0004] Traditional DIP-packaged module circuit boards, when faced with load resistors of various values, can only be designed and manufactured one-to-one according to the load resistor, even with the same package. This increases the cost of repeatedly making test boards and lengthens the production cycle.

[0005] Traditional DIP-packaged module circuit boards have different connection methods for the CTRL pins of the same package due to different circuit functions. They must be designed one by one, which greatly affects the overall progress of the test board and is not conducive to large-scale design and storage. Summary of the Invention

[0006] The purpose of this invention is to provide a method and apparatus for designing a general-purpose board for DIP-packaged module circuits, so as to solve the problems in the background art.

[0007] To address the aforementioned technical problems, this invention provides a method for designing a general-purpose board for DIP-packaged module circuits, comprising the following steps: Step S1: Design a DIP-like packaged module circuit aging general board. The PCB board includes a DIP-like packaged fixture, crown spring hole, load resistor, CTRL pin reserved connection, capacitor, power input terminal, and process status monitoring terminal. Step S2: Insert the DIP-like package fixture into a circuit that meets the following characteristics: the pin spacing is an integer multiple of 2.54mm, the lateral span of the pins is less than 25.4mm, the longitudinal span is within 50.8mm, and the pin diameter is less than 1mm; each pin of the fixture can carry a current of less than 2A, and there is no obstruction around the contact point between the fixture and the circuit. Step S3: After step S2 is initiated, the crown spring hole portion is selected and designed; Step S4: After step S3 is passed, design alternative connections for the CTRL pin; Step S5: Place the capacitors in appropriate positions around the circuit pins, and place the power input terminal and process status monitoring terminal in appropriate positions on the PCB. Perform the overall design of the DIP-packaged module circuit aging general board to achieve effective power supply to the module circuit and effective monitoring of temperature and voltage output terminals during the process. Step S6: After receiving the test request, analyze the package of the device under test to confirm whether the circuit size conforms to the characteristics of a DIP-like package; Step S7: After step S6 is passed, select a suitable load resistor based on the power of the module circuit, insert it into the crown spring hole, and test the matching module circuit to ensure a stable and reliable connection. Step S8: After step S7 is passed, select the connection method of CTRL pin through the logic function of the module circuit. When the pin is floating, do not process it. When it is grounded, insert a jumper cap into the pin and perform the aging test of the module circuit.

[0008] In one embodiment, the fixture ensures good contact between the module circuit and the PCB, and the load resistor and capacitor are effectively distributed on the PCB around the fixture. The PCB is powered through the power port. After the tested module receives the power, the output level and operating temperature of the module circuit are monitored at the process status monitoring terminal.

[0009] In one embodiment, the crown spring hole is designed to accommodate the pluggable pin size of a load resistor between 5W and 30W, and the allowable current is sufficiently large and the number of pluggable / pluggable cycles is sufficiently high. By selecting and determining, a crown spring hole with high stability that meets the requirements is customized for pluggable / pluggable connection of the load resistor.

[0010] In one implementation, the CTRL pin has two options: either floating or grounded, depending on the circuit function. The CTRL pin is grounded when it is in negative logic and floating when it is in positive logic. The reserved connection of the CTRL pin adopts the connection method of reserved 2 pin header and jumper cap. Pin 1 of the header is connected to the CTRL pin, and pin 2 of the header is grounded. When the CTRL pin needs to be floating, the header is not processed. When grounded, the jumper cap is inserted into the header to make the CTRL pin stably grounded.

[0011] In one implementation, if the circuit size does not conform to the characteristics of a DIP-like package, a custom fixture needs to be made on a one-to-one basis according to the circuit package size and power factor, and a special aging test board containing components such as load resistors and capacitors needs to be designed; if it conforms to the characteristics of a DIP-like package, a general-purpose aging board for DIP-like package module circuits can be used directly.

[0012] This invention also provides a general-purpose aging device for DIP-like packaged module circuits. The aforementioned general-purpose aging board design method for DIP-like packaged module circuits includes: a DIP-like package fixture, a crown spring hole, a load resistor, a reserved connection for the CTRL pin, a capacitor, a power input terminal, and a process status monitoring terminal. The DIP-like package fixture is suitable for module circuits with pin spacing that is an integer multiple of 2.54mm, a horizontal pin span of less than 25.4mm, a vertical pin span of less than 50.8mm, and a pin diameter of less than 1mm. Placing the module circuit into the DIP-like package fixture achieves a stable connection between the circuit and the PCB.

[0013] In one embodiment, the crown spring hole serves as the carrier for connecting the load resistor to the PCB. Depending on the power of the module circuit, the corresponding load resistor can be replaced to achieve flexible insertion and removal between resistors of different resistance values, ensuring efficient replacement and effective connection of the load resistor to the PCB.

[0014] In one embodiment, the power supply terminal is used to transmit the electrical stress provided by the power supply to the clamping plate.

[0015] In one embodiment, the capacitor is used to remove high-frequency noise and spikes in the power supply, reduce output voltage ripple, and also has the functions of energy storage and decoupling, ensuring a more stable DC power supply to the module circuit.

[0016] In one embodiment, the process status monitoring terminal is used to monitor the circuit temperature and output voltage in real time during the module circuit test to ensure the stability of the circuit status during the aging test.

[0017] The present invention provides a method and apparatus for designing a general-purpose board for DIP-like packaged module circuits, which has the following advantages: (1) The present invention produces a universal fixture with a pin span of less than 50.8mm, achieving full coverage of DIP-like packages and effectively improving fixture compatibility and design efficiency; (2) The present invention can realize the plugging and unplugging of different load resistors under different power states, reducing the cost of repeatedly customizing fixtures and making boards, and improving efficiency; (3) The present invention adopts a reliable connector design to realize flexible selection between positive and negative logic, reduce the overall hardware cost, and facilitate large-scale design and batch storage. Attached Figure Description

[0018] Figure 1 The flowchart shows the design method of a general-purpose board for aging DIP-like packaged module circuits provided by the present invention.

[0019] Figure 2 The diagram shows the structure of the general-purpose device for aging DIP-like packaged module circuits provided by the present invention. Detailed Implementation

[0020] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a method and apparatus for designing a general-purpose board for DIP-like packaged module circuits according to the present invention. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0021] This invention provides a method for designing a DIP-packaged module circuit board, such as... Figure 1 Its flowchart illustrates the process, and the design method includes: Step S1: Design a DIP-packaged module circuit board to refine general-purpose boards, such as... Figure 2 As shown, the PCB board includes a DIP-like package fixture, a crown spring hole, a load resistor, a CTRL pin reserved connection, a capacitor, a power supply terminal, and a process status monitoring terminal. The fixture ensures good contact between the module circuit and the PCB. The load resistor and capacitor are effectively distributed on the PCB around the fixture. Power is supplied to the PCB board through the power input terminal. After the tested module circuit receives the power, the output level of the module circuit can be monitored at the output monitoring terminal, and the operating temperature of the module circuit can be monitored at the temperature monitoring terminal.

[0022] Step S2: The DIP-like package fixture can be inserted into circuits that meet the following characteristics: the pin spacing is an integer multiple of 2.54 mm, the lateral pin span is less than 25.4 mm, the longitudinal pin span is within 50.8 mm, and the pin diameter is less than 1 mm. Each pin of the fixture can carry a current of up to 2 A, and there are no obstructions around the contact point between the fixture and the circuit. The package, power, and size of this fixture can cover more than 95% of module test circuits.

[0023] Step S3: After step S2 is initiated, the crown spring hole is selected and designed. The crown spring hole should be able to accommodate the pluggable pins of load resistors between 5W and 30W, and the allowable current should be large enough, with a sufficient number of pluggable / pluggable cycles. Through selection and judgment, a crown spring hole with high stability that meets the requirements is customized for the pluggable connection of the load resistor.

[0024] Step S4: After step S3 is passed, alternative designs need to be made for the reserved connection of the CTRL pin. Due to different circuit functions, the CTRL pin may have two options: floating or grounded. That is, the CTRL pin needs to be grounded for negative logic and floating for positive logic. The reserved connection of the CTRL pin adopts the connection method of a reserved 2-pin header and jumper. Pin 1 of the header is connected to the CTRL pin, and pin 2 is grounded. When the CTRL pin needs to be floating, no treatment is required on the header; when grounded, simply insert the jumper into the header to stably ground the CTRL pin.

[0025] Step S5: Place the capacitors in appropriate positions around the circuit pins, and place the power input terminal and process status monitoring terminal in appropriate positions on the PCB. Perform the overall design of the DIP-packaged module circuit aging general board to achieve effective power supply to the module circuit and effective monitoring of temperature and voltage output terminals during the process status.

[0026] Step S6: Upon receiving the test request, analyze the package of the device under test to confirm whether the circuit size conforms to the characteristics of a DIP-like package. If not, a custom fixture needs to be made based on factors such as the circuit package size and power, and a dedicated aging test board including load resistors, capacitors, and other components needs to be designed. If it conforms to the characteristics of a DIP-like package, a general-purpose aging board for DIP-like package module circuits can be used directly.

[0027] Step S7: After step S6 is passed, select a suitable load resistor based on the power of the module circuit, insert it into the crown spring hole, and test the matching module circuit to ensure a stable and reliable connection.

[0028] Step S8: After step S7 is passed, select the connection method of the CTRL pin through the logic function of the module circuit. That is, when the pin is floating, no action is taken on the pin header; when grounded, insert a jumper cap into the pin header to perform the curing test of the module circuit. The DIP-like packaged module circuit curing universal board can be reused multiple times, effectively reducing the cost of customized fixtures and duplicated boards, and ensuring the efficiency and reliability of the module circuit testing process.

[0029] As another embodiment of the present invention, such as Figure 2 As shown, a general-purpose aging device for DIP-like packaged module circuits is provided, including a DIP-like package fixture, a spring-loaded hole, a load resistor, a reserved connection for the CTRL pin, a capacitor, a power input terminal, and a process status monitoring terminal. The DIP-like package fixture is suitable for module circuits with pin pitches that are multiples of 2.54mm, a lateral pin span of less than 25.4mm, a vertical pin span of less than 50.8mm, and a pin diameter of less than 1mm. Placing the module circuit into the DIP-like package fixture enables a stable connection between the circuit and the PCB.

[0030] The crown spring hole serves as the carrier for connecting the load resistor to the PCB. Depending on the power of the module circuit, the corresponding load resistor can be replaced, enabling flexible insertion and removal of resistors with different resistance values, and ensuring efficient replacement and effective connection of the load resistor to the PCB.

[0031] The CTRL pin has a reserved connection, using a reserved 2-pin header and jumper. Pin 1 of the header is connected to the CTRL pin, and pin 2 is grounded. For positive logic circuitry, the CTRL pin needs to be left floating, and the header is left untreated. For negative logic circuitry, it is grounded, so the jumper is inserted into the header to ensure a stable ground connection for the CTRL pin.

[0032] The power input terminal is used to transmit the electrical stress provided by the power supply to the fixture plate.

[0033] Capacitors are used to remove high-frequency noise and spikes in the power supply, reduce output voltage ripple, and also serve as energy storage and decoupling agents, ensuring a more stable DC power supply to the module circuit.

[0034] The process status monitoring terminal is used to monitor the circuit temperature and output voltage in real time during the module circuit test to ensure the stability of the circuit status during the aging test.

[0035] In this embodiment, the core component of the fixture is the power rating of the compatible circuits, which needs to cover the maximum current of 2A for the circuit pins. This is to ensure compatibility with different power circuit operation modes during the test and to guarantee the normal progress of the aging test.

[0036] The core of crown spring hole design is the size of the crown spring hole, the package size that can be compatible with load resistors, the current that can be passed, and the number of safe and reliable insertion and removal cycles. While ensuring reliable connection, its service life is also a factor that needs to be considered. Real-time statistical testing is required to ensure the stability and reliability of the entire test process.

[0037] The process status monitoring section needs to monitor the module circuit temperature and output voltage values ​​in real time and record the monitoring results to ensure the test process is controllable and traceable. When selecting a load resistor, the power rating should be sufficiently high. For the same resistance value, the power rating can be increased to 30W, allowing the load resistor to be used for aging tests with any load ≤30W, thus improving the compatibility of the load resistor. The data should be recorded in a table to create a searchable file.

[0038] When designing, capacitors should be placed close to the module fixture pins to effectively reduce input and output voltage ripple, ensure a more stable DC power supply to the module circuit, and improve the stability and anti-interference capability of the module circuit.

[0039] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A method for designing a burn-in general board for DIP-like package module circuits, characterized by, Includes the following steps: Step S1: Design a DIP-like packaged module circuit aging general board. The PCB board includes a DIP-like packaged fixture, crown spring hole, load resistor, CTRL pin reserved connection, capacitor, power input terminal, and process status monitoring terminal. Step S2: Insert the DIP-like package fixture into a circuit that meets the following characteristics: the pin spacing is an integer multiple of 2.54mm, the lateral span of the pins is less than 25.4mm, the longitudinal span is within 50.8mm, and the pin diameter is less than 1mm; each pin of the fixture can carry a current of less than 2A, and there is no obstruction around the contact point between the fixture and the circuit. Step S3: After step S2 is initiated, the crown spring hole portion is selected and designed; Step S4: After step S3 is passed, design alternative connections for the CTRL pin; Step S5: Place the capacitors in appropriate positions around the circuit pins, and place the power input terminal and process status monitoring terminal in appropriate positions on the PCB. Perform the overall design of the DIP-packaged module circuit aging general board to achieve effective power supply to the module circuit and effective monitoring of temperature and voltage output terminals during the process. Step S6: After receiving the test request, analyze the package of the device under test to confirm whether the circuit size conforms to the characteristics of a DIP-like package; Step S7: After step S6 is passed, select a suitable load resistor based on the power of the module circuit, insert it into the crown spring hole, and test the matching module circuit to ensure a stable and reliable connection. Step S8: After step S7 is passed, select the connection method of CTRL pin through the logic function of the module circuit. When the pin is floating, do not process it. When it is grounded, insert a jumper cap into the pin and perform the aging test of the module circuit.

2. The burn-in board design method for DIP-like package module circuits of claim 1, wherein, The fixture ensures good contact between the module circuit and the PCB. The load resistor and capacitor are effectively distributed on the PCB around the fixture. The power supply provides the corresponding power to the PCB through the power port. After the tested module receives the power, the output level and operating temperature of the module circuit are monitored at the process status monitoring terminal.

3. The burn-in board design method for DIP-like package module circuits of claim 1, wherein, The crown spring hole is designed to accommodate the pluggable pin sizes of load resistors between 5W and 30W, and the allowable current must be large enough, with a sufficient number of pluggable / pluggable cycles. Through selection and evaluation, a crown spring hole with high stability that meets the requirements is customized for pluggable / pluggable connection of the load resistor.

4. The burn-in board design method for DIP-like package module circuits of claim 1, wherein, The CTRL pin has two options: either floating or grounded, depending on its circuit function; the CTRL pin is grounded when it is in negative logic and floating when it is in positive logic. The CTRL pin is reserved for connection using a reserved 2-pin header and jumper cap. Pin 1 of the header is connected to the CTRL pin, and pin 2 is grounded. When the CTRL pin needs to be left floating, the header is not processed. When grounding, the jumper cap is inserted into the header to make the CTRL pin stably grounded.

5. The burn-in board design method for DIP-like package module circuits of claim 1, wherein, If the circuit dimensions do not conform to the characteristics of a DIP-like package, a custom fixture must be made on a one-to-one basis according to the circuit package dimensions and power factor, and a special aging test board containing components such as load resistors and capacitors must be designed; if they conform to the characteristics of a DIP-like package, a general-purpose aging board for DIP-like packaged module circuits can be used directly.

6. A burn-in general device for DIP-like package module circuits, based on the burn-in general board design method for DIP-like package module circuits according to any one of claims 1 to 5, characterized in that, The general-purpose aging device includes: a DIP-like package fixture, a crown spring hole, a load resistor, a reserved connection for the CTRL pin, a capacitor, a power input terminal, and a process status monitoring terminal. The DIP-like package fixture is suitable for module circuits with pin pitches that are multiples of 2.54mm, a horizontal pin span of less than 25.4mm, a vertical pin span of less than 50.8mm, and a pin diameter of less than 1mm. Placing the module circuit into the DIP-like package fixture achieves a stable connection between the circuit and the PCB.

7. The method for designing a mature general-purpose board for a DIP-like packaged module circuit as described in claim 6, characterized in that, The crown spring hole serves as the carrier for connecting the load resistor to the PCB. Depending on the power of the module circuit, the corresponding load resistor can be replaced to achieve flexible insertion and removal between resistors of different resistance values, ensuring efficient replacement and effective connection of the load resistor to the PCB.

8. The method for designing a mature general-purpose board for a DIP-like packaged module circuit as described in claim 6, characterized in that, The power supply terminal is used to transmit the electrical stress provided by the power supply to the fixture plate.

9. The method for designing a mature general-purpose board for a DIP-like packaged module circuit as described in claim 6, characterized in that, The capacitor is used to remove high-frequency noise and spikes in the power supply, reduce output voltage ripple, and also has the functions of energy storage and decoupling, ensuring a more stable DC power supply to the module circuit.

10. The method for designing a mature general-purpose board for a DIP-like packaged module circuit as described in claim 6, characterized in that, The process status monitoring terminal is used to monitor the circuit temperature and output voltage in real time during the module circuit test to ensure the stability of the circuit status during the aging test.

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