Method of manufacturing a heat treated substrate with a structured functional coating
By applying a dielectric coating layer to the structured areas of the carrier panel, the problems of optical distortion and corrosion during heat treatment and bending are solved, enabling efficient and economical carrier panel manufacturing and improving optical quality and appearance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SAINT-GOBAIN SAFETY GLASS CO FRANCE
- Filing Date
- 2024-12-16
- Publication Date
- 2026-07-17
AI Technical Summary
In the manufacturing process of curved carrier panels, existing technologies have found that structured functional coatings are susceptible to damage from heat treatment and bending processes, leading to optical distortion and corrosion, and also incurring high costs.
A dielectric capping layer is applied to a structured region on the surface of a substrate. A transparent dielectric capping layer is formed by chemical vapor deposition methods such as FA-CVD or APCVD to protect the functional coating and reduce optical interference and distortion during heat treatment and bending.
It significantly improves the optical quality and appearance of the structured coating, prevents flow processes and corrosion, reduces costs, and improves the overall quality of the carrier panel.
Smart Images
Figure CN122422271A_ABST