Laser processing method and apparatus based on dynamic tension

Abstract

The application discloses a laser processing method and device based on dynamic tension, wherein the laser processing method based on dynamic tension is applied to a laser processing system, the laser processing system comprises a laser processing device, a photographing device and a control device, the laser processing device comprises a laser assembly and a stretching assembly, the laser assembly is used for generating laser to cut a workpiece to be processed, and the stretching assembly is used for stretching the workpiece to be processed along a workpiece axis of the workpiece to be processed; the laser processing method based on dynamic tension comprises the following steps: in the case that the laser assembly cuts a notch on the workpiece to be processed, the photographing device is controlled to take a photograph of the notch, and a first notch image is obtained; notch size parameters of the notch are determined based on the first notch image; a breaking tension of the stretching assembly is determined based on the notch size parameters; and the stretching assembly is controlled to apply tension to the workpiece to be processed based on the breaking tension, until the workpiece to be processed is broken. The application can improve the yield and consistency of laser processing workpieces.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, specifically to a laser processing method and apparatus based on dynamic tension. Background Technology

[0002] An optical fiber bundle is formed by sintering multiple optical fibers with a glass tube in a tapered manner. In laser processing, it is necessary to break the optical fiber bundle. However, current technology may result in excessive tensile force when breaking the optical fiber bundle, leading to damage to the fiber bundle and a low yield rate of laser-processed workpieces. Summary of the Invention

[0003] This application provides a laser processing method and apparatus based on dynamic tensile force, which can improve the yield of laser-processed workpieces.

[0004] This application provides a laser processing method based on dynamic tension applied to a laser processing system. The laser processing system includes a laser processing device, an imaging device, and a control device. The laser processing system is used to process a workpiece. The laser processing device includes a laser component and a tensioning component. The laser component is used to generate laser light to cut the workpiece, and the tensioning component is used to stretch the workpiece along its axial direction. The laser processing method based on dynamic tension includes: When the laser assembly cuts a notch in the workpiece to be processed, the imaging device is controlled to take a picture of the notch to obtain a first image of the notch. The cut size parameters of the cut are determined based on the first cut image; The tensile force at which the tension assembly breaks is determined based on the slit size parameters. The tensile component applies a tensile force to the workpiece to be processed based on the tensile force control, until the workpiece is broken.

[0005] Accordingly, this application provides a control device applied to a laser processing system. The laser processing system includes a laser processing device, an imaging device, and a control device. The laser processing system is used to process a workpiece. The laser processing device includes a laser assembly and a stretching assembly. The laser assembly generates a laser to cut the workpiece, and the stretching assembly stretches the workpiece along its axial direction. The control device includes: The imaging module controls the imaging device to take a picture of the cut when the laser component cuts a notch in the workpiece to be processed, thereby obtaining a first image of the cut. The first determining module determines the cut size parameters of the cut based on the first cut image; The second determining module determines the breaking force of the tension component based on the cut size parameters; The tension application module controls the tensioning component to apply tension to the workpiece to be processed based on the breaking tension, until the workpiece is broken.

[0006] Furthermore, the electronic device provided in this application includes a memory and a processor. The memory stores a computer program, and the processor is used to run the computer program in the memory to implement the steps in the laser processing method provided in this application.

[0007] Furthermore, the computer-readable storage medium provided in this application stores a computer program that is adapted to be loaded by a processor to implement the steps in the laser processing method provided in this application.

[0008] Furthermore, the laser processing system provided in this application includes laser processing equipment, a photographing device, and a control device. The laser processing system is used to process the workpiece to be processed, and the control device is used to execute the laser processing method based on dynamic tension.

[0009] In this application, compared to related technologies, a laser processing method based on dynamic tension is applied to a laser processing system. The laser processing system includes laser processing equipment, an imaging device, and a control device. The laser processing system is used to process the workpiece to be processed. The laser processing equipment includes a laser component and a tensioning component. The laser component generates laser light to cut the workpiece, and the tensioning component stretches the workpiece along its axial direction. The laser processing method based on dynamic tension includes: when the laser component cuts a kerf into the workpiece, controlling the imaging device to photograph the kerf to obtain a first kerf image; determining the kerf size parameters based on the first kerf image; determining the tensile force of the tensioning component based on the kerf size parameters; and controlling the tensioning component to apply tension to the workpiece until the workpiece is broken. This application can improve the yield rate of laser-processed workpieces. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of a laser processing system provided in an embodiment of this application; Figure 2 This is a schematic diagram of one embodiment of the laser processing equipment provided in this application; Figure 3This is a schematic diagram of the structure of one embodiment of the laser processing equipment provided in this application when the protective cover is removed; Figure 4 This is a schematic diagram of the structure inside the protective cover of one embodiment of the laser processing equipment provided in this application. Figure 5 This is a structural schematic diagram of the interior of the protective cover from another perspective in one embodiment of the laser processing equipment provided in this application; Figure 6 yes Figure 5 Schematic diagram of the structure within region D; Figure 7 This is a schematic diagram of the structure of the laser component in one embodiment of the laser processing equipment provided in this application; Figure 8 This is a schematic diagram of the structure of the workpiece area on the initial side image of the workpiece when the workpiece to be processed is a cylindrical glass tube, in one embodiment of the laser processing method based on dynamic tension provided in this application. Figure 9 This is a schematic diagram of the structure of the workpiece area on the initial side image of the laser processing method based on dynamic tension provided in this application, when the workpiece to be processed is an optical fiber bundle. Figure 10 This is a schematic diagram of various parameters in the workpiece region on the initial workpiece side image when the workpiece to be processed is an optical fiber bundle, in one embodiment of the laser processing method based on dynamic tension provided in this application. Figure 11 This is a schematic diagram showing that the end face contour is a complete elliptical contour in one embodiment of the laser processing method based on dynamic tension provided in this application. Figure 12 This is a schematic diagram showing that the end face contour is a semi-elliptical contour in one embodiment of the laser processing method based on dynamic tension provided in this application. Figure 13 This is a schematic diagram showing that the end face contour line is a straight line in one embodiment of the laser processing method based on dynamic tension provided in this application. Figure 14 This is a schematic flowchart of an embodiment of the laser processing method based on dynamic tension provided in this application. Figure 15 This is a schematic diagram of an image of the workpiece end face being broken when the workpiece detection result is normal in one embodiment of the laser processing method based on dynamic tensile force provided in this application. Figure 16 This is a schematic diagram of an image of a workpiece end face being broken when the workpiece detection result is a processing abnormality in one embodiment of the laser processing method based on dynamic tensile force provided in this application. Figure 17 This is a schematic diagram of the first incision image in one embodiment of the laser processing method based on dynamic tension provided in this application; Figure 18 This is a schematic diagram of the second incision image in one embodiment of the laser processing method based on dynamic tension provided in this application; Figure 19 This is a schematic diagram of the tensile force growth curve of the tension component in one embodiment of the laser processing method based on dynamic tension provided in this application. Detailed Implementation

[0012] It should be noted that the principles of this application are illustrated by example in a suitable computing environment. The following description is based on the specific embodiments of this application that are illustrated, and should not be regarded as limiting other specific embodiments not detailed herein.

[0013] In the following description of this application, "some embodiments" are referred to, which describe a subset of all possible embodiments. However, it is understood that "some embodiments" may be the same subset or different subset of all possible embodiments, and may be combined with each other without conflict.

[0014] In the following description of this application, the terms "first, second, third" are used merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, third" may be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0015] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0016] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0017] Please see Figure 1 , Figure 1This diagram illustrates an application environment of a laser processing system according to an embodiment of this application. The laser processing system includes laser processing equipment and a control device. The control device is network-connected to the laser processing equipment and is used to control the laser processing equipment. The control device can be installed on the laser processing equipment or independent of it, depending on the specific circumstances.

[0018] The control device can be a server or a terminal device. For example, the server can be a physical server, a cloud server, or a server cluster composed of multiple servers, etc., and the terminal device can be a mobile phone, tablet computer, desktop computer, laptop computer, smartwatch, smart glasses, vehicle terminal, smart home terminal, cloud computer, PLC, touch screen, etc.

[0019] It should be noted that, Figure 1 The schematic diagram of the laser processing system shown is merely an example. The laser processing system and scenario described in this application are intended to more clearly illustrate the technical solutions of this application and do not constitute a limitation on the technical solutions provided in this application. As those skilled in the art will know, with the evolution of laser processing systems and the emergence of new business scenarios, the technical solutions provided in this application are also applicable to similar technical problems.

[0020] The following sections provide detailed descriptions of each example. It should be noted that the sequence numbers of the following embodiments are not intended to limit the preferred order of the embodiments.

[0021] Please refer to Figures 2 to 7 In this embodiment, the laser processing equipment 10 includes a working platform 113, a laser component 12, two clamping and rotating components 13, a second base 151, a stretching component 171, and a first driving component 14. The laser component 12 is mounted on the working platform 113 and is used to generate laser light to cut the workpiece. The clamping and rotating components 13 include the first base 131, clamping mechanisms 132, and a rotational driving mechanism 133. The two ends of the clamping mechanisms 132 are rotatably connected to the first base 131. The two clamping mechanisms 132 of the two clamping and rotating components 13 clamp the two ends of the workpiece, and the rotational driving mechanism 133 drives the clamping mechanisms 132 to rotate. The two clamping and rotating components 13 are mounted on the second base 151. The first driving component 14 is connected to the second base 151 and is used to drive the second base 151 to move in three-dimensional space. The stretching component 171 drives the two clamping and rotating components 13 to move away from or towards each other. The control device is used to control the laser assembly 12, the clamping rotation assembly 13, and the first drive assembly 14.

[0022] The control device can be a server or a terminal device, and the control device can be connected to the laser component 12, the clamping and rotating component 13 and the first drive component 14 via a wired network or a wireless network.

[0023] The workpiece to be processed can be a cylindrical glass tube or an optical fiber bundle. The cylindrical glass tube is a hollow glass tube with a cross-section consisting of two circular arcs. The optical fiber bundle is composed of multiple interconnected optical fibers. The cross-section of each optical fiber is cylindrical. The cross-section of the optical fiber bundle consists of multiple circular optical fiber cross-sections. The optical fiber bundle includes a thick-end fiber bundle segment, a tapered fiber bundle segment, and a thin-end fiber bundle segment. The cross-sectional area is the same at all locations on the thick-end fiber bundle segment, and the cross-sectional area is also the same at all locations on the thin-end fiber bundle segment. The cross-sectional area of ​​the thick-end fiber bundle segment is larger than that of the thin-end fiber bundle segment. The cross-sectional area of ​​the tapered fiber bundle segment gradually decreases from the thick-end fiber bundle segment to the thin-end fiber bundle segment.

[0024] In this embodiment, the laser assembly 12 includes a laser emitting assembly, a vertical drive mechanism 126, and a laser cutting head 125. The laser emitting assembly and the vertical drive mechanism 126 are disposed on the working platform 113. The laser cutting head 125 processes the laser emitted by the laser emitting assembly into a cutting laser and cuts the workpiece to be processed. The laser cutting head 125 is connected to the output end of the vertical drive mechanism 126. The vertical drive mechanism 126 is used to drive the laser cutting head 125 to move in the vertical direction to adjust the distance between the laser cutting head 125 and the workpiece to be processed.

[0025] In this embodiment, the laser emitting assembly includes a laser 121, a first reflector 1221, a beam expander 124, a second reflector 1222, and a third reflector 1223. The laser 121 is mounted on the working platform 113. The laser emitted by the laser 121 enters the first reflector 1221 along a first horizontal direction. The first reflector 1221 reflects the laser in the first horizontal direction upward along the vertical direction, and then passes through the beam expander 124 before entering the second reflector 1222. The second reflector 1222 reflects the incident laser along a second horizontal direction to the third reflector 1223. The third reflector 1223 reflects the laser downward along the vertical direction to the laser cutting head 125.

[0026] Among them, the laser cutting head 125 can be a Bessel laser cutting head. The Bessel laser cutting head is composed of an axial cone lens and a dual telecentric optical system, which shapes the laser generated by the laser 121 into a non-diffraction Bessel beam. It has the characteristics of long focal depth, small focused spot, vertical cut without taper, and extremely small heat-affected zone. It is suitable for high-precision laser cutting of brittle and transparent materials such as optical fibers, optical fiber bundles and glass tubes.

[0027] In this embodiment, the working platform 113 is provided with a first support 1271 and a second support 1272. A first reflector 1221 and a second reflector 1222 are connected through a first mirror tube 1231. A beam expander 124 is disposed inside the first mirror tube 1231. A second reflector 1222 and a third reflector 1223 are connected through the second mirror tube 1232. One side of the first mirror tube 1231 is fixed to the first support 1271. A vertical drive mechanism 126 and the second mirror tube 1232 are fixed to the second support 1272. By using multiple reflectors in combination, a linear arrangement is avoided, reducing the size of the equipment and making the structure more compact and conducive to miniaturization design.

[0028] In this embodiment of the application, the laser processing equipment 10 includes a tensioning component 171 disposed on a second base 151. A first base 131 of one clamping rotating component 13 is connected to the tensioning component 171, and a first base 131 of the other clamping rotating component 13 is connected to the second base 151. The tensioning component 171 drives the two clamping rotating components 13 to move away from each other to pull off the workpiece to be processed.

[0029] In this embodiment, the second base 151 is provided with a slide rail 172 arranged along the first horizontal direction, and a slider 173 is slidably connected to the slide rail 172. The first base 131 is connected to the slider 173, and the output end of the tensioning assembly 171 is connected to the slider 173. The tensioning assembly 171 drives the slider 173 to slide, thereby driving the two clamping rotating assemblies 13 to move away from or closer to each other. The tensioning assembly 171 can be any type of cylinder, hydraulic cylinder, or other device that provides driving force along a straight line.

[0030] In this embodiment of the application, the clamping mechanism 132 includes a workpiece bearing portion 1320 and a workpiece pressing portion 1324 rotatably connected to the workpiece bearing portion 1320. The side of the workpiece bearing portion 1320 is provided with a workpiece receiving groove 1322 for receiving one end of the workpiece to be processed. When the workpiece pressing portion 1324 rotates closer to the workpiece receiving groove 1322, it squeezes the workpiece to be processed in the workpiece receiving groove 1322 to clamp the workpiece to be processed.

[0031] The cross-section of the workpiece receiving groove 1322 can be triangular or arc-shaped, depending on the specific situation. A flexible buffer pad is provided on the inner surface of the workpiece receiving groove 1322, which can also be configured according to specific circumstances.

[0032] Specifically, the workpiece bearing part 1320 includes a detachably connected bearing body 1321 and a bearing rod 1323. Both ends of the bearing body 1321 are rotatably connected to the first base 131. The two ends of the bearing body 1321 are cylindrical, and the middle of the bearing body 1321 is recessed to form a planar platform. The bearing body 1321 has a slot extending along a first horizontal direction, into which the bearing rod 1323 engages. The bearing rod 1323 extends along the first horizontal direction, and its surface has a workpiece receiving groove 1322 extending along the first horizontal direction. Different workpieces can be adapted by replacing different bearing rods 1323. One side of the workpiece pressing part 1324 is rotatably connected to the planar platform. When one side of the workpiece pressing part 1324 faces the planar platform, it presses the workpiece to be processed to form a clamp. When the workpiece pressing part 1324 contacts the planar platform, it can no longer press the workpiece to be processed, thus protecting the workpiece.

[0033] Specifically, the first base 131 includes a base plate and upright plates disposed on both sides of the base plate. The two ends of the supporting body 1321 are rotatably connected to the two upright plates. One end of the supporting body 1321 passes through the upright plate and is provided with a transmission gear. The rotary drive mechanism 133 is fixed to the upright plate and is connected to the control device. The rotary drive mechanism 133 can be a servo motor. The end of the servo motor is provided with a drive gear. The drive gear and the transmission gear mesh. The control device controls the output end of the rotary drive mechanism 133 to rotate, thereby driving the supporting body 1321 to rotate.

[0034] In this embodiment, a flexible buffer pad and a pressure sensor are provided on the surface of the workpiece pressing part 1324 near the workpiece receiving groove 1322. The pressure sensor is used to detect the pressure of the workpiece pressing part 1324 on the workpiece to be processed. The flexible buffer pad can be made of rubber, which can protect the workpiece to be processed and prevent it from being crushed.

[0035] In this embodiment, the workpiece pressing part 1324 is provided with a screw 1325 and a threaded hole, and the workpiece bearing part 1320 is provided with a threaded hole. The screw 1325 passes through the threaded holes on the workpiece pressing part 1324 and the workpiece bearing part 1320 to connect the workpiece pressing part 1324 and the workpiece bearing part 1320. By adjusting the number of rotations of the screw 1325, the pressure on the workpiece to be processed can be adjusted.

[0036] Furthermore, a servo motor may be provided on the workpiece pressing part 1324. The servo motor is connected to a control device, and the output end of the servo motor is connected to the screw 1325. The control device controls the rotation of the servo motor, which drives the screw 1325 to rotate, thereby automatically adjusting the screw insertion depth of the screw 1325 and dynamically adjusting the pressure on the workpiece to be processed. In other embodiments, the workpiece pressing part 1324 is provided with a rotating shaft, which is rotatably connected to the workpiece bearing part 1320. A servo motor is provided on the workpiece pressing part 1324, and the servo motor is connected to a control device. The output end of the servo motor is rotatably connected to the rotating shaft of the workpiece pressing part 1324. The control device controls the rotation of the servo motor, which drives the workpiece pressing part 1324 to rotate, thereby dynamically adjusting the pressure on the workpiece to be processed.

[0037] In this embodiment, the laser processing equipment 10 includes a protective cover 111, which is connected to the edge of the work platform 113 and covers the components of the work platform 113. The protective cover 111 is provided with a laser protective glass door 112, and a sensing device is provided on the laser protective glass door 112. The sensing device is connected to the laser component 12, and when the sensing device senses that the laser protective glass door 112 is in an open state, it controls the laser component 12 to stop emitting light.

[0038] Furthermore, a frame 144 is provided below the work platform 113, and rollers 115 are provided at the bottom of the frame. The laser processing equipment 10 can be easily moved to a designated position using the rollers 115.

[0039] Specifically, the frame 144 uses a square steel bracket with a honeycomb core structure and a marble platform to lower the center of gravity and reduce vibration, an air spring vibration isolation system, or an active closed-loop vibration isolation system with sensors and actuators.

[0040] Furthermore, the first drive assembly 14 includes a first horizontal drive mechanism 141 and a second horizontal drive mechanism 142. The second horizontal drive mechanism 142 is disposed on the first horizontal drive mechanism 141 and connected to the second base 151 for driving the second base 151 to move along the second horizontal direction. The first horizontal drive mechanism 141 is connected to the second horizontal drive mechanism 142 for driving the second horizontal drive mechanism 142 and the second base 151 to move along the first horizontal direction.

[0041] The first horizontal direction can be the X-axis, the second horizontal direction can be the Y-axis, and the vertical direction can be the Z-axis.

[0042] Furthermore, the first horizontal drive mechanism 141 can provide linear driving force for devices such as cylinders or hydraulic cylinders. For example, the second horizontal drive mechanism 142 includes a cylinder, a track, and a sliding part, with the sliding part connected to the second base 151, and the cylinder drives the sliding part to slide on the track.

[0043] Furthermore, the laser processing equipment 10 includes a loading plate 163, which is disposed on one side of the rotary drive mechanism 133 and is used to support the workpiece to be processed.

[0044] Furthermore, the laser processing equipment 10 includes an imaging device 161 and a light source assembly 153. The imaging device 161 is located on one side of the clamping and rotating assembly 13, and the light source assembly 153 is located on the other side of the clamping and rotating assembly 13. The imaging device 161 takes a picture from the side of the workpiece to be processed, obtaining a side image of the workpiece. The light source assembly 153 includes a support frame and multiple light sources on the support frame. The support frame is fixed to the second base 151, and the multiple light sources are used to provide illumination to the workpiece to be processed. The multiple light sources are connected to a control device, and the imaging device 161 is connected to the control device. The control device controls the light sources and the imaging device 161.

[0045] Furthermore, the laser processing equipment 10 includes a second drive assembly 162, which drives the imaging device 161 to move in a second horizontal direction to approach or move away from the workpiece to be processed.

[0046] Furthermore, the laser processing equipment 10 includes a reflective assembly 152, with the reflective assembly 152 and the imaging device 161 positioned on either side of the clamping and rotating assembly 13. The reflective assembly 152 includes a mirror rotation mechanism 1521 and two fourth mirrors 1522 arranged at an angle. The mirror rotation mechanism 1521 is connected to the second base 151; specifically, it is connected to a support frame and drives the two fourth mirrors 1522 to rotate vertically. Specifically, the mirror rotation mechanism 1521 can be a servo motor, and the two fourth mirrors 1522 are connected to its output. The control device controls the rotation of the mirror rotation mechanism 1521, causing the two fourth mirrors 1522 to rotate, thereby reflecting the end face of the workpiece to be processed onto the imaging device 161.

[0047] This application also provides a laser processing method based on dynamic tension, which is applied to a laser processing system. The laser processing system includes laser processing equipment, an imaging device, and a control device. The laser processing system is used to process the workpiece to be processed, and the control device is used to execute the laser processing method based on dynamic tension. The laser processing method based on dynamic tension includes: S11. Obtain the initial side image of the workpiece captured by the photographing device.

[0048] In this embodiment of the application, after the workpiece to be processed is loaded, the camera is controlled to take a picture from the side of the workpiece before it is broken, and the side image of the workpiece is obtained. The side image of the workpiece is determined as the initial side image of the workpiece. At this time, the workpiece to be processed has not yet been broken.

[0049] S12. Determine the workpiece category of the workpiece to be processed based on the initial workpiece side image.

[0050] In one specific embodiment, the initial workpiece side image is an image of the side of the workpiece to be processed. Based on the initial workpiece side image, the workpiece category of the workpiece to be processed is determined, including: (1) Perform workpiece region recognition on the initial workpiece side image to obtain the workpiece region.

[0051] Specifically, a workpiece region recognition model is pre-trained. This model can be a YOLO series model. The initial side image of the workpiece is input into the workpiece region recognition model to obtain the workpiece region. When the workpiece to be processed is a cylindrical glass tube, the workpiece region is as follows: Figure 8 As shown, when the workpiece to be processed is an optical fiber bundle, the workpiece area is as follows: Figure 9 As shown, Figure 9 In the middle, the thick-end fiber bundle, the tapered fiber bundle, and the thin-end fiber bundle are arranged in sequence from left to right.

[0052] (2) Generate multiple spaced vertical axes on the initial workpiece side image, and determine the length of the vertical axis in the workpiece area as a workpiece width to obtain multiple workpiece widths.

[0053] Among them, such as Figure 8 As shown, the vertical axis represents the height direction of the initial workpiece side image. The vertical axis needs to cover the camera's field of view, or the spacing between them should be greater than half of the camera's field of view.

[0054] Specifically, multiple vertical axes are generated at equal intervals in the initial workpiece side image.

[0055] (3) Determine the width difference between the maximum and minimum widths among multiple workpiece widths.

[0056] Specifically, record the width difference AD.

[0057] (4) When the width difference is greater than the first preset width threshold, the workpiece category is determined to be an optical fiber bundle; when the width difference is less than the second preset width threshold, the workpiece category is determined to be a cylindrical glass tube.

[0058] The first preset width threshold is greater than the second preset width threshold.

[0059] Specifically, the first preset width threshold can be 300μm or other manually set values; the second preset width threshold can be 50μm or other manually set values. If AD > 300μm, it is determined to be an optical fiber bundle; if AD < 50μm, it is determined to be a cylindrical glass tube.

[0060] Furthermore, such as Figure 9 As shown, when the width difference exceeds a first preset width threshold, multiple spaced rectangular frames are generated along the workpiece axis. The centers of these rectangular frames are all located along the workpiece axis, and the frames are identical in size and spacing. Each rectangular frame has a width of s1 and a height of s2. The overlap area between each rectangular frame and the workpiece area is calculated. When it is detected that the overlap area between the rectangular frame and the workpiece area gradually decreases from left to right along the workpiece axis, the area containing the rectangular frame is determined to be a cone region, and the workpiece type is determined to be an optical fiber bundle.

[0061] S13. Determine the processing operation information of the laser processing equipment based on the workpiece category.

[0062] In this embodiment, when the workpiece type is an optical fiber bundle, the processing operation information includes: controlling the laser assembly to cut a slit on one side surface of the workpiece to be processed, and controlling the stretching assembly to drive the two clamping and rotating assemblies to move away from each other to break the workpiece to be processed. When the workpiece type is a cylindrical glass tube, the processing operation information includes: controlling the laser assembly to cut a slit on one side surface of the workpiece to be processed; and controlling the two clamping and rotating assemblies to drive the workpiece to be processed to rotate so that the laser assembly cuts an annular groove on the surface of the workpiece to be processed.

[0063] S14. Control the laser processing equipment to process the workpiece based on the processing operation information of the laser processing equipment.

[0064] In this embodiment, the laser processing equipment includes a laser component, a stretching component, and two clamping and rotating components. The laser component generates a laser to cut the workpiece, the two clamping and rotating components clamp the two ends of the workpiece and drive it to rotate, and the stretching component drives the two clamping and rotating components to move relative to each other. Based on the processing operation information of the laser processing equipment, the laser processing equipment is controlled to process the workpiece, including: when the workpiece type is an optical fiber bundle, the laser component is controlled to cut a notch on one side surface of the workpiece, and the stretching component is controlled to drive the two clamping and rotating components to move away from each other to break the workpiece.

[0065] In this embodiment, the laser assembly includes a laser emitting assembly, a vertical drive mechanism, and a laser cutting head. The laser cutting head processes the laser emitted by the laser emitting assembly into a cutting laser and cuts the workpiece to be processed. The vertical drive mechanism is used to drive the laser cutting head to move in the vertical direction to adjust the distance between the laser cutting head and the workpiece to be processed. When the workpiece type is an optical fiber bundle, the laser assembly is controlled to cut a slit on one side surface of the workpiece to be processed, including: (1) When the workpiece type is fiber bundle, determine the surface to be cut of the fiber bundle.

[0066] Since the fiber bundle has three segments, the thinner segment needs to be cut. Therefore, it is necessary to identify the thinner segment. In a specific embodiment, the upper boundary of the workpiece area is determined, and the portion of the upper boundary of the workpiece within a preset horizontal coordinate range is identified as the surface to be cut. The preset horizontal coordinate range can be manually preset. Specifically, the line segment formed by the pixel with the largest vertical coordinate in each column of pixels in the workpiece area is identified as the upper boundary of the workpiece.

[0067] In another specific embodiment, since the thin-end fiber bundle segment may not be within the preset horizontal coordinate range, to determine the thin-end fiber bundle segment, the workpiece area is divided into multiple workpiece sub-regions based on multiple vertical axes. The standard deviation of the ordinate of each pixel on the upper boundary of the workpiece sub-region is determined. If the standard deviation of the ordinate of each pixel on the upper boundary of the workpiece sub-region is greater than a first preset value, the workpiece sub-region is determined to be a conical sub-region; if the standard deviation of the ordinate of each pixel on the upper boundary of the workpiece sub-region is less than a second preset value, the workpiece sub-region is determined to be a cylindrical sub-region. Multiple cylindrical regions and corresponding workpiece widths are obtained. Multiple cylindrical regions with workpiece widths less than a preset width are determined as thin-end fiber bundle segment regions, and the upper boundary of the thin-end fiber bundle segment regions is determined as the surface to be cut. Multiple cylindrical regions with workpiece widths greater than a preset width are determined as thick-end fiber bundle segment regions. The region between the thick-end fiber bundle segment regions and the thin-end fiber bundle segment regions is determined as a conical fiber bundle segment region. The first preset value is greater than the second preset value. The preset width can be the average of the workpiece widths of the multiple workpiece sub-regions.

[0068] (2) Determine the actual distance between the surface to be cut and the laser cutting head of the laser assembly.

[0069] In one specific embodiment, it is identified whether the initial workpiece side image contains a laser cutting head. When the initial workpiece side image contains a laser cutting head, the image distance between the surface to be cut and the laser cutting head on the initial workpiece side image is determined, and the actual distance is determined based on the image distance and a preset conversion relationship.

[0070] Furthermore, a straight line is fitted to the upper surface of the surface to be cut, resulting in a fitted straight line. The vertical distance between the laser cutting head and the fitted straight line is then determined as the image distance. The preset conversion relationship can be determined based on the ratio of the camera's pixel distance to the instance distance. For example, if the image distance is 2600 pixels and the actual distance is 10mm, then the single pixel accuracy is 0.00385mm / pixel. This can be set according to specific circumstances.

[0071] In this embodiment of the application, when the initial workpiece side image does not contain the laser cutting head, a preset reference line on the initial workpiece side image is first obtained, wherein the distance between the preset reference line and the laser cutting head at the target position is the laser focal length.

[0072] Specifically, record the target position as Z0. Prepare the workpiece for testing. Adjust the height of the laser cutting head to a suitable position and turn on the laser at a lower power so that the workpiece is exactly at the focal point of the laser spot on the laser cutting head. At this time, the surface of the workpiece to be cut will have a bright light interacting with the laser / or a bright spot on the photosensitive film. Record the target position Z0 of the laser cutting head in the vertical direction at this time. At the same time, record the position of the surface of the workpiece to be cut in the vertical direction as h10, that is, record the position of the preset reference line in the vertical direction as h10.

[0073] Secondly, determine the height difference between the preset reference line and the surface to be cut of the fiber bundle, and determine the relative displacement of the laser cutting head relative to the target position. For example, the vertical position of the surface to be cut of the fiber bundle is recorded as h1, and the height difference is (h1-h10).

[0074] Finally, the actual distance is determined based on the relative displacement, height difference, and laser focal length.

[0075] Wherein, the actual distance = laser focal length - height difference + relative displacement.

[0076] Specifically, the distance between the target position Z0 and the preset reference line h10 is the laser focal length F; target position Z0 - preset reference line h10 = laser focal length F. The distance between the current position Z1 and the target position Z0 is the relative displacement (Z1 - Z0). The distance between the target position Z0 and the surface to be cut h10 is the laser focal length F - (h1 - h10). The actual distance L4 between the current position Z1 and the surface to be cut h10 = laser focal length F - height difference (h1 - h10) + relative displacement (Z1 - Z0).

[0077] (3) When the actual distance does not fall within the preset distance range threshold, the vertical drive mechanism is controlled to drive the laser cutting head to move in the vertical direction until the actual distance falls within the preset distance range threshold.

[0078] The preset distance range threshold is determined based on the laser focal length of the laser cutting head and the preset error. Specifically, the preset distance range threshold is the laser focal length ± the preset error. For example, if the preset error is 0.01mm and the laser focal length of the laser cutting head is 10mm, then the preset distance range threshold is [9.99mm, 10.01mm].

[0079] When the actual distance does not fall within the preset distance range threshold, the vertical drive mechanism is controlled to drive the laser cutting head to move vertically until the actual distance falls within the preset distance range threshold.

[0080] Specifically, the required position Z of the laser cutting head is Z = target position Z0 - height difference (h1-h10) = Z0 - (h1-h10), or the required position Z of the laser cutting head is Z = target position Z0 + height difference (h1-h10) = Z0 + (h1-h10).

[0081] (4) When the actual distance is within the preset distance range threshold, control the laser component to cut a notch on one side of the workpiece.

[0082] Specifically, when the actual distance falls within a preset distance range threshold, the laser component is controlled to cut an incision on the surface of the workpiece to be processed. The first drive component is controlled to move the workpiece parallel until the surface to be cut is positioned below the laser cutting head.

[0083] When the actual distance is within the preset distance range threshold, it indicates that the workpiece to be processed is close to the focal length of the laser emitted by the laser component, and has the maximum processing power. Controlling the laser component to cut a slit on one side of the workpiece can improve processing efficiency.

[0084] In this embodiment of the application, controlling the laser component to cut a notch on one side surface of the workpiece to be processed further includes: determining the diameter to be cut of the fiber bundle at the surface to be cut based on an initial side image of the workpiece; determining the laser parameters generated by the laser component based on the diameter to be cut, wherein the laser parameters include at least one of laser power, laser pulse number and laser frequency; and controlling the laser component to cut a notch on one side surface of the workpiece to be processed based on the laser parameters.

[0085] In one specific embodiment, determining the diameter to be cut of the fiber bundle at the cut surface based on an initial workpiece side image includes: determining the workpiece width at the cut surface as the diameter to be cut. Further, the average value of multiple workpiece widths corresponding to multiple vertical axes passing through the cut surface is determined as the diameter to be cut.

[0086] In one specific embodiment, determining the laser parameters generated by the laser component based on the diameter to be cut includes: (1) Determine the target cutting parameters of the cut based on the diameter of the fiber bundle to be cut.

[0087] The target incision parameters include at least one of incision depth and incision width.

[0088] Specifically, the diameter-cutting mapping relationship of the fiber bundle is obtained. This diameter-cutting mapping relationship is the mapping relationship between the diameter to be cut and the target cutting parameters. For example, the target cutting parameters include the cutting depth and the cutting width. The diameter-cutting mapping relationship is the mapping relationship between the diameter to be cut, the cutting depth, and the cutting width. For example, when the diameter to be cut is d1, the cutting depth is s1, and the cutting width is k1.

[0089] (2) Determine the laser parameters generated by the laser component based on the target cut parameters.

[0090] Specifically, the relationship between the target incision parameters and the laser parameters can be preset, for example, the incision depth is s1 and the incision width is k1.

[0091] In one specific embodiment, the fiber bundle consists of a main fiber and multiple secondary fibers, which surround the main fiber to form the fiber bundle. The test fiber bundle, with a test diameter to be cut, is cut using test laser parameters, and the test fiber bundle is then broken. Multiple images of the broken workpiece end faces are acquired. End face region recognition is performed on the broken workpiece end face images to obtain the workpiece segmentation region on the broken workpiece end face image. Laser scar detection is performed on the images within the workpiece segmentation region to obtain the overall laser scar region. The minimum bounding rectangle of the overall laser scar region is determined, where one side of the minimum bounding rectangle is parallel to the laser incident direction. The length of the side of the minimum bounding rectangle parallel to the laser incident direction is determined as the end face cut depth, and the length of the side of the minimum bounding rectangle perpendicular to the laser incident direction is determined as the end face cut width. The test laser parameters, end face cut depth, and end face cut width of a test fiber bundle are obtained. Using the end face cut depth and end face cut width as training samples, and the corresponding test laser parameters as sample labels, the sample labels corresponding to multiple training samples are determined as the training set. The laser parameter prediction model is trained until convergence. The target cut parameters are input into the laser parameter prediction model to obtain the laser parameters generated by the laser component.

[0092] In this embodiment, when the workpiece is a cylindrical glass tube, the laser assembly is controlled to cut a notch on one side of the workpiece; the two clamping and rotating assemblies are controlled to drive the workpiece to rotate so that the laser assembly cuts an annular groove on the surface of the workpiece.

[0093] Specifically, when the workpiece is a cylindrical glass tube, the laser component is controlled to cut a notch on one side of the workpiece surface; the two clamping and rotating components are controlled to drive the workpiece to rotate by a preset angle, and the laser component is controlled to cut a notch on one side of the workpiece surface. The workpiece is driven to rotate by a preset angle θ multiple times until the workpiece rotates one full turn, so that the laser component cuts an annular groove on the surface of the workpiece.

[0094] Furthermore, such as Figure 10 As shown, the central axis of the thin end of the fiber optic bundle region and the central axis of the thick end of the fiber optic bundle region are determined, and the distance between the central axes of the thin end and the thick end is defined as the axial offset d. The length of the thick end fiber optic bundle region in the image height direction is defined as the thick end diameter d1, and the length of the thin end fiber optic bundle region in the image height direction is defined as the thin end diameter d2. The tapered fiber optic bundle region is the area between A and B, and the length of the tapered fiber optic bundle region in the image width direction is defined as the tapered length L. The coaxiality deviation rate is determined based on the thick end diameter d1, the thin end diameter d2, and the axial offset d; the coaxiality deviation angle is determined based on the tapered length L and the axial offset d.

[0095] Specifically, the coaxiality deviation rate η = 2d / (d1+d2)*100%; the coaxiality deviation angle α = arctan(d / L); and the cone diameter-to-length ratio k = d / L. A larger coaxiality deviation rate η, a larger coaxiality deviation angle α, and a larger cone diameter-to-length ratio k indicate poorer coaxiality in the cone region, making subsequent fiber optic bundling more difficult and increasing the cutting end-face angle. Since the camera observes a projection from a specific orientation, the calculated results of these indicators will differ as the fiber bundle rotates. Therefore, it is necessary to measure at least a 0-180° rotation range and take the maximum value.

[0096] This application provides a laser processing method based on dynamic tension, which includes: S21. When the workpiece to be processed is broken by the stretching component, acquire an image of the broken workpiece side taken by the photographing device from the side of the workpiece to be processed.

[0097] S22. Perform contour detection on the side image of the broken workpiece to obtain the side contour of the workpiece.

[0098] S23. Determine the initial end face cutting angle of the cutting end face of the workpiece to be processed based on the side profile of the workpiece, and obtain the initial end face cutting angle of the side profile of the workpiece.

[0099] The initial end face cutting angle is the angle between the cutting end face and the workpiece axis.

[0100] In this embodiment of the application, determining the initial end-face cutting angle of the workpiece based on the side profile of the workpiece includes: (1) Identify the upper surface contour line, lower surface contour line and end face contour line connecting the upper surface contour line and the lower surface contour line in the side contour of the workpiece, and determine the surface distance between the upper surface contour line and the lower surface contour line.

[0101] Since the end face of the fiber bundle is circular, there are three possible scenarios when viewing the end face profile from the side: a semi-elliptical profile, a complete elliptical profile, or a straight line.

[0102] like Figure 11 As shown, the end face contour is an ellipse, and the surface distance between the upper and lower surface contours is T2.

[0103] (2) When the end face contour is a complete elliptical contour, the initial end face cutting angle is determined based on the complete elliptical contour and the surface spacing.

[0104] like Figure 11 As shown, the end face contour is a complete elliptical contour, and the initial end face cutting angle is determined based on the complete elliptical contour and the surface spacing.

[0105] Specifically, determining the initial end face cutting angle based on the complete elliptical profile and surface spacing includes: projecting the complete elliptical profile onto the workpiece axis to obtain the projected line segment; and converting the ratio of the length of the projected line segment to the surface spacing into an angle based on the arctangent function to obtain the initial end face cutting angle.

[0106] like Figure 11 As shown, the complete elliptical contour is projected onto the workpiece axis to obtain a projection line segment with a length of T1.

[0107] The initial end face cutting angle α satisfies the following condition: a = arctan(T1 / T2).

[0108] Based on the arctangent function, the ratio of the length of the projected line segment to the surface spacing is converted into an angle to obtain the initial end face cutting angle α.

[0109] In this embodiment of the application, when the end face contour is a semi-elliptical contour, the semi-elliptical contour is completed into a complete elliptical contour.

[0110] Specifically, such as Figure 12 As shown, two intersection points are determined where the end face contour line intersects the upper and lower surface contour lines respectively. The midpoint of the line segment at each intersection point is then determined. Using the midpoint as the center of symmetry, a symmetrical contour of the end face contour line is generated on the other side of the intersection line segment, resulting in a symmetrical contour line. This symmetrical contour line is symmetrical to the end face contour line about the midpoint of the line segment. The end face contour line and the symmetrical contour line are then defined as a complete elliptical contour. The initial end face cutting angle α is determined based on the complete elliptical contour and the surface spacing.

[0111] In this embodiment of the application, when the end face contour line is a straight line, the angle between the end face contour line and the vertical axis perpendicular to the workpiece axis is determined as the initial end face cutting angle.

[0112] In this embodiment, when the end face contour line is a semi-elliptical arc, the two contour endpoints on the end face contour line and the far endpoint on the end face contour line with the largest sum of horizontal distances from the two contour endpoints are determined. The horizontal distance is the distance between the contour endpoints and the far endpoint along the workpiece axial direction. Based on the positions of the two contour endpoints and the far endpoint, the initial end face cutting angle α is determined, where the initial end face cutting angle α satisfies the following formula. a=arctan((2*X2-(X1+X3)) / (Y3-Y1)) Where (X2, Y2) are the coordinates of the far end point, and (X1, Y1) and (X3, Y3) are the coordinates of the two contour endpoints, respectively.

[0113] Specifically, such as Figure 12 As shown, the two intersection points where the end face contour line intersects with the upper surface contour line and the lower surface contour line are determined as the two contour endpoints, namely C1 and C3, and the far endpoint is C2. With the workpiece axis as the X-axis and the direction perpendicular to the workpiece axis as the Y-axis, the coordinates of the two contour endpoints C1 and C3 are (X1, Y1) and (X3, Y3) respectively, and the coordinates of the far endpoint C2 are (X2, Y2).

[0114] Specifically, such as Figure 13 As shown, a vertical axis perpendicular to the workpiece axis is generated, and the angle between the end face contour line and the vertical axis is calculated to obtain the initial end face cutting angle α.

[0115] S24. Determine the target end face cutting angle of the workpiece based on the initial end face cutting angle.

[0116] In one specific embodiment, the number of images of the broken workpiece side is 1, and the initial end face cutting angle is determined as the target end face cutting angle.

[0117] In another specific embodiment, the number of broken workpiece side images is multiple. These multiple broken workpiece side images are obtained by rotating the photographing device relative to the workpiece axis to different sides. Specifically, the clamping rotation assembly is controlled to rotate multiple times. Each time it rotates by a preset angle, the photographing device takes a picture of the side of the workpiece to be processed, resulting in one broken workpiece side image and multiple broken workpiece side images from different sides.

[0118] In this embodiment of the application, determining the target end face cutting angle of the workpiece based on the initial end face cutting angle includes: (1) Determine the contour weight coefficient of the workpiece side profile based on the end face contour lines on multiple workpiece side profile images on multiple broken workpiece side profile images.

[0119] (2) The initial end face cutting angle of the workpiece side face is weighted and averaged based on the contour weight coefficients of multiple workpiece side face contours to obtain the target end face cutting angle.

[0120] In this embodiment, the contour weight coefficient of the workpiece side profile with a straight end face contour line is greater than the contour weight coefficient of the workpiece side profile with a complete elliptical end face contour line. The contour weight coefficient of the workpiece side profile with a complete elliptical end face contour line is greater than the contour weight coefficient of the workpiece side profile with a semi-elliptical end face contour line.

[0121] For example, five images of the broken workpiece's side profile are collected from different perspectives, corresponding to five workpiece side profile contours. Two of these contours are straight lines, each assigned a weight of 0.8, with initial cutting angles of 2.1 degrees and 2.3 degrees respectively. Two more contours are complete elliptical contours, each assigned a weight of 0.5, with initial cutting angles of 2.6 degrees and 2.7 degrees respectively. The remaining contour is a semi-elliptical contour, assigned the lowest weight of 0.3, with an initial cutting angle of 3.2 degrees. The weighted sum is obtained by multiplying each angle by its corresponding weight. The target cutting angle is (2.1*0.8 + 2.3*0.8 + 2.6*0.5 + 2.7*0.5 + 3.2*0.3) / (0.8 + 0.8 + 0.5 + 0.5 + 0.3) = 2.46 degrees. By combining all weights to complete the weighted average calculation, the influence of angle deviation caused by edge occlusion and incomplete imaging of the semi-elliptical contour is weakened, the proportion of high-reliability detection data of the straight contour is strengthened, and the target end face cutting angle that fits the actual state of the workpiece is finally calculated.

[0122] In another specific embodiment, there are multiple images of the broken workpiece side profile. These multiple images are obtained by rotating the photographic device relative to the workpiece axially to different sides. The maximum value of the multiple initial end-face cutting angles is determined as the target end-face cutting angle.

[0123] S25. Determine the workpiece inspection result based on the target end face cutting angle, wherein the workpiece inspection result is either processing abnormal or processing normal.

[0124] In one specific embodiment, when the cutting angle of the target end face is greater than the preset angle threshold, it indicates that the end face deflection angle of the fiber bundle is large, which affects the subsequent fiber bundle splicing, and the workpiece detection result is determined to be a processing abnormality.

[0125] Furthermore, determining the workpiece inspection result based on the target end face cutting angle also includes: (1) When the cutting angle of the target end face is not greater than the preset angle threshold, control the camera to take a picture of the broken end face of the workpiece from the end face of the workpiece to be processed.

[0126] Since the fourth reflecting mirror 1522 reflects the end face of the workpiece to be processed to the imaging device 161, the imaging device 161 acquires an image of the broken end face of the workpiece.

[0127] (2) Perform end face region recognition on the image of the broken workpiece end face to obtain the workpiece segmentation region on the image of the broken workpiece end face.

[0128] (3) Recognize the image within the workpiece segmentation area to obtain multiple fiber end face areas on the workpiece segmentation area.

[0129] Furthermore, a circle is fitted to the outer contour of the workpiece segmentation area to obtain a fitted circular contour. The minimum circumcircle of the workpiece segmentation area is determined, and it is judged whether the diameter difference between the fitted circular contour and the minimum circumcircle is less than a preset diameter value. For example, the preset diameter value is 2% of the diameter of the minimum circumcircle, which can be set according to specific circumstances. If the diameter difference is less than the preset diameter value, the image within the workpiece segmentation area is identified to obtain multiple fiber end face areas on the workpiece segmentation area. If the diameter difference is not less than the preset diameter value, it indicates that the workpiece segmentation area is not close to a circle. Then, the control device controls the reflector rotation mechanism 1521 to rotate, driving the two fourth reflectors 1522 to rotate, so as to reflect the end face of the workpiece to be processed to the imaging device 161. The imaging device 161 re-acquires a new image of the broken workpiece end face and re-identifies the fiber bundle end face of the initial end face image to obtain the fiber bundle end face area until the diameter difference is less than the preset diameter value.

[0130] Since an optical fiber bundle is composed of multiple optical fibers with circular cross-sections, the end face region of the optical fibers can be identified.

[0131] (4) Perform circular fitting on multiple fiber end face regions to obtain multiple fitted end face regions.

[0132] Since the fiber end face region may not be accurately identified, it is necessary to perform fitting to obtain multiple fitted end face regions.

[0133] (5) When the spacing between the fitted end face regions meets the preset spacing conditions, the workpiece detection result is determined to be normal.

[0134] In one specific embodiment, the fiber bundle consists of a main fiber and multiple secondary fibers, with the secondary fibers surrounding the main fiber to form the fiber bundle. The diameter of the main fiber is larger than that of the secondary fibers; for example, the diameter of the main fiber is 410.7 μm, and the overall outer diameter of the fiber bundle is 746.8 μm. Figure 15As shown, the multiple fitting end-face regions include one main fiber fitting end-face region and multiple secondary fiber fitting end-face regions. When the spacing between any two adjacent secondary fiber fitting end-face regions falls within a first spacing range, and the spacing between each secondary fiber fitting end-face region and the main fiber fitting end-face region falls within a second spacing range, the spacing between the fitting end-face regions is determined to satisfy the preset spacing condition.

[0135] Specifically, the distance between the centers of two adjacent fitted end face regions is defined as the distance between the two fitted end face regions. The first distance range and the second distance range can be set according to specific circumstances.

[0136] like Figure 15 As shown, the spacing between any two adjacent fitting end-face regions of the secondary optical fibers falls within the first spacing range, and the spacing between the fitting end-face regions of the secondary optical fibers and the fitting end-face regions of the primary optical fibers falls within the second spacing range. This determines that the spacing between the fitting end-face regions satisfies the preset spacing condition. For example... Figure 16 If the spacing between two adjacent secondary fiber fitting end face regions does not fall within the first spacing range, it is determined that the spacing between the fitting end face regions does not meet the preset spacing condition.

[0137] Furthermore, when the spacing between the fitted end-face regions meets the preset spacing condition, laser scar detection is performed on the image of each secondary fiber fitted end-face region to obtain the laser scar region. The scar area ratio between the laser scar region and the secondary fiber fitted end-face region is determined. When there is no secondary fiber fitted end-face region with a scar area ratio greater than the preset percentage, the workpiece inspection result is determined to be normal processing; when there is a secondary fiber fitted end-face region with a scar area ratio greater than the preset percentage, it indicates that the workpiece is damaged, and the workpiece inspection result is determined to be abnormal processing. The preset percentage can be 30% or other values, which can be set according to specific circumstances.

[0138] See Figure 14 The laser assembly is used to generate a laser to cut the workpiece, and the tension assembly is used to stretch the workpiece along its axial direction. Laser processing methods based on dynamic tension include: 201. When the laser component cuts a notch into the workpiece to be processed, the camera is controlled to take a picture of the notch to obtain the first notch image.

[0139] like Figure 17 As shown, the first incision image is as follows Figure 17 As shown.

[0140] 202. Determine the cut size parameters based on the first cut image.

[0141] In this embodiment of the application, the cut size is identified to obtain the cut size parameters.

[0142] In one specific embodiment, the incision size parameters include the incision depth. Determining the incision size parameters based on the first incision image includes: (1) The first incision region is identified by performing incision region recognition on the first incision image to obtain the first incision region.

[0143] Specifically, the first incision area is as follows: Figure 17 As shown.

[0144] (2) The incision depth is determined based on the length of the first incision region in the height direction of the first incision image.

[0145] Specifically, the length of the first incision region in the height direction of the first incision image is defined as the incision depth.

[0146] Furthermore, the cut size parameters include the cut width. The cut size parameters are determined based on the first cut image, including: (1) Obtain the second incision image.

[0147] The second cut image is obtained by taking a picture after the laser component cuts a cut into the workpiece and the imaging device rotates the workpiece at a preset angle.

[0148] Specifically, after the clamping and rotating assembly rotates the workpiece to be processed by a preset angle, the imaging device is controlled to take a picture of the workpiece to obtain a second cut image. The second cut image is shown below. Figure 18 As shown. Since the laser cuts from top to bottom, the cut is fully visible in the second cut image. The preset angle is 90 degrees.

[0149] (2) The second incision region is identified by performing incision region recognition on the second incision image.

[0150] Specifically, the second incision area is as follows: Figure 18 As shown.

[0151] (3) Determine the cut width based on the length of the second cut region in the height direction of the second cut image.

[0152] Specifically, the length of the second incision region in the height direction of the second incision image is defined as the incision width.

[0153] 203. Determine the breaking force of the tension component based on the slit size parameters.

[0154] In this embodiment of the application, determining the breaking force of the tensile component based on the notch size parameter includes: acquiring a pre-trained tensile force prediction model; inputting the notch parameter into the tensile force prediction model; and determining the predicted tensile force value output by the tensile force prediction model as the breaking force. For example, the breaking force is 10.2N.

[0155] 204. The tension control assembly based on the breaking force applies a tension force to the workpiece to be processed until the workpiece is broken.

[0156] In this embodiment of the application, the tensile component based on the tensile force control applies a tensile force to the workpiece to be processed until the workpiece is broken, including: (1) Control the tensioning assembly to apply tension to the workpiece to be processed according to the first tension growth curve until the tension of the tensioning assembly reaches the breaking tension.

[0157] In this embodiment, the first tensile force growth curve can be a straight line or a curve, depending on the specific situation. For example, the first tensile force growth curve is a straight line, increasing by 0.1 N per second. Another example is... Figure 19 The curve from the 10th second to the 20th second shows the first tension growth curve, where the tension increases from 1N to 10.2N from the 10th second to the 20th second.

[0158] (2) Control the tensioning component to apply tension to the workpiece to be processed according to the second tension growth curve until the workpiece to be processed is broken.

[0159] Among them, the growth rate of the second tension growth curve is smaller than that of the first tension growth curve.

[0160] The growth rate of the first tension growth curve is the increase in tension per unit time in the first tension growth curve.

[0161] In this embodiment, the second tensile force growth curve can be a straight line or a curve, depending on the specific situation. For example, the second tensile force growth curve is a straight line, increasing by 0.06 N per second. Another example is... Figure 19 The curve after the 20th second shows the second tensile force growth curve, from 20 seconds to 40 seconds, where the tensile force increases from 10.2N to 12N and continues to increase.

[0162] In this embodiment of the application, controlling the tensioning component to apply tension to the workpiece to be processed according to the second tension growth curve until the workpiece is broken includes: (1) Control the stretching component to apply tension to the workpiece to be processed according to the second tension growth curve, and collect the stretching distance and tension change ratio of the stretching component according to the preset cycle.

[0163] In this embodiment, the stretching distance of the stretching component can be obtained by measuring the extension / retraction length of the stretching component. A tension sensor is provided on the stretching component to measure the tension force. The rate of change of the tension force is the rate of change of two tension values ​​collected in two adjacent preset periods. For example, the rate of change of two tension values ​​collected in two adjacent preset periods decreases by 10%.

[0164] (2) When the tension change ratio is the tension reduction rate, and the tension reduction rate is greater than or equal to the preset reduction ratio, and the stretching distance is less than the preset breakage distance, it is determined that the workpiece to be processed is broken.

[0165] When the rate of change of the two tension values ​​collected in two adjacent preset periods increases, the tension change ratio within the preset period is the tension increase rate; when the rate of change of the two tension values ​​collected in two adjacent preset periods decreases, the tension change ratio within the preset period is the tension decrease rate.

[0166] The preset reduction ratio and preset breakage distance can be set according to specific circumstances and can be obtained by manual measurement. For example, the preset reduction ratio is 80% and the breakage distance is 2mm. For example, when the tensile force change rate suddenly decreases, that is, the tensile force change rate is the tensile force reduction rate, and the tensile force reduction rate is ≥80%, and the tensile distance is less than 2mm, it is determined that the workpiece to be processed has been broken.

[0167] Furthermore, when the rate of change of tensile force gradually decreases over multiple preset cycles, and the stretching distance is not less than the preset breaking distance, it is determined that the workpiece to be processed has slipped and has not been broken. That is, when the rate of change of tensile force is the rate of decrease over multiple preset cycles, and the stretching distance is not less than the preset breaking distance, it is determined that the workpiece to be processed has slipped and has not been broken.

[0168] Furthermore, the laser processing equipment includes a stretching assembly and two clamping mechanisms. The two clamping mechanisms are used to clamp both ends of the workpiece to be processed. The stretching assembly is used to drive the two clamping assemblies to move relative to each other. The laser processing method based on dynamic tension also includes: (1) When the tension change rate gradually decreases within multiple preset cycles and the stretching distance is not less than the preset breakage distance, it is determined to be slippage, and the clamping force of the clamping mechanism is increased by a preset pressure value.

[0169] The preset pressure value can be a preset increase percentage of the current pressure value. The preset increase percentage can be 10% or other values, which can be set according to the specific situation.

[0170] (2) The tension component based on the breaking force control applies a tension force to the workpiece to be processed until the workpiece is broken.

[0171] Specifically, after the clamping force of the clamping mechanism increases to a preset pressure value, the tensioning component continues to apply tension to the workpiece to be processed based on the breaking tension control until the workpiece is broken.

[0172] Furthermore, the fiber bundle is clamped at both ends by a clamping mechanism, a certain tension is applied by a tensioning component, and then the light source is turned on to take pictures and identify the workpiece to be processed, its highest point, and its outer diameter. When the workpiece to be processed is an optical fiber or a fiber bundle, the vision guides the laser cutting head to be adjusted to a suitable height. At the same time, the laser is automatically controlled to set appropriate cutting power, pulse number, frequency, and other parameters according to the outer diameter of the fiber (bundle) to be cut. The ultrafast laser and the Y-axis work together to quickly and vertically cut the fiber (bundle). After completion, the laser cutting head returns to the standby position, the clamping mechanism adjusts the downward pressure appropriately (generally by increasing it), and then applies tension along the axial direction of the fiber (bundle) until it is completely broken to achieve automatic processing of the thick fiber bundle. After the cutting is completed, it is pulled apart to a certain distance, and the outer diameter and end face angle are automatically measured by taking pictures. The non-product end is rotated to a certain angle (0-360°) and the end face angle is measured again. The end face image is obtained through a reflector, and the minimum outer circle diameter of the fiber bundle and the diameter of its internal fiber are dynamically identified and calculated. The outer diameter, end face angle, and diameter data are recorded and automatically uploaded to the MES.

[0173] During glass tube cutting, one or both ends are clamped, and the light source is turned on to take pictures and identify the product type, highest point, and outer diameter. When the workpiece to be processed is a glass tube, the vision guides the laser cutting head to adjust to the appropriate height. At the same time, the laser is automatically controlled according to the outer diameter of the glass tube to be cut, setting appropriate cutting power, pulse number, frequency, and other parameters. The ultrafast laser and Y-axis work together to vertically cut the glass tube once. Then, it rotates a certain angle (θ*n=360°), takes pictures to identify the highest point, and the vision guides the laser cutting head to adjust to the appropriate height to cut again until a full circle is cut. After cutting, the laser cutting head returns to the standby position (initial height) without affecting loading and unloading. During glass tube cutting, the laser power, focal length, and other parameters are controlled to ensure that the glass tube is not completely cut through, so that it has a certain strength and does not affect the insertion of fiber optic bundles. The fiber optic bundles can be broken by a certain axial tensile force in subsequent processes.

[0174] In this embodiment, the laser is generally an ultrafast laser, such as a 30W infrared picosecond laser. The focusing lens can be a Bessel beam laser cutting head, which is particularly suitable for brittle and transparent materials. It has a long focal depth, a cut perpendicular to the sidewall, almost no taper, and a very small heat-affected zone, resulting in high precision and clean edge quality. The clamping and rotating assembly consists of a rotary motor, gear set, shaft, bearing housing, fiber optic cover, reflector, camera lens, and light source. The protective cover uses laser protective glass. When the door is closed, the sensor (e.g., a limit switch) is triggered, allowing normal laser cutting. If the door is open or not closed properly, the sensor (e.g., the limit switch) is in the normally open state, and the host computer controls the laser to prevent it from emitting light to ensure safety. The lower frame marble platform consists of casters, floor mats, a square steel base, marble platform, controller, host computer, and electrical cabinet. A water chiller is used to cool the laser, and the cooling water flow is monitored in real time. If the flow is low or zero, an automatic alarm is triggered, and the laser is shut down to prevent it from emitting light.

[0175] Through visual recognition, guide the laser cutting head to adaptively adjust the height to ensure automatic and efficient cutting of different products. Adjust whether the clamping and rotating component rotates or applies tensile force, which can be compatible with laser cutting of thick optical fibers (bundles) and circumferential cutting of glass tubes at the same time. Visual recognition of the workpiece to be processed and its outer diameter can also control the laser to automatically set process parameters such as the optimal laser power, pulse number, frequency, etc., and automatically achieve high-quality and high-consistency cutting. The cutting end face has a small angle, small burrs and damage, no tool head damage problem and high-cost consumables.

[0176] When laser cutting a thick optical fiber bundle, the breaking tensile force can be flexibly adjusted by the cutting depth and length. By adjusting the height of the laser cutting head, laser power, pulse number, frequency, pulse width, step size and the position of the aperture opening size, the initial cutting depth and length of the optical fiber bundle can be changed, so as to reduce or increase the cutting breaking tensile force of the thick optical fiber bundle. Moreover, for thick optical fibers (bundles) with the same outer diameter, the laser cutting has a lower tensile force than mechanical cutting, so that the brittle point fracture of the coupler product can be effectively avoided.

[0177] In this application, the automatic clamping of optical fibers, optical fiber bundles and glass tubes can be realized by replacing the workpiece receiving groove. By adjusting the downward pressure of the workpiece pressing part, the maximum friction force when it is pulled out can be adjusted, so as to control the maximum allowable tensile force. The downward pressure can be adjusted by the locking screw on the workpiece pressing part. A micro motor is installed on the upper cover plate, and its output rotating shaft is connected to the locking screw. A pressure sensor is installed on the fitting surface of the optical fiber clamp base and the upper pressing cover to monitor the pressure of the workpiece pressing part clamping the optical fiber (bundle) in real time, F = F N ·f, where F is the minimum tensile force for pulling the optical fiber (bundle), F N is the pressure of the workpiece pressing part clamping the optical fiber (bundle). Different products have a maximum allowable pressure Fm that will not be damaged. f is the friction coefficient between the optical fiber clamp with a silicone pad and the optical fiber (bundle). The friction coefficients of different products can be obtained through experiments. Given the cutting tensile force F and f of a certain product, only need to adjust the rotation angle of the locking screw of the workpiece pressing part to make the pressure F N of the workpiece pressing part clamping the optical fiber (bundle) reach its minimum value, so as to minimize the damage to the cutting object (F N <Fm). One end of the clamping and rotating component is provided with a tensile force sensor and a stretching component. After clamping both ends, the required tensile force can be set, and the required tensile force can be gradually obtained through the stretching component.

[0178] This application enables end-face inspection by adding a central reflector. When measuring the outer diameter and end-face angle, the reflector retracts, and the camera detects the number of pixels on the upper and lower edges of the workpiece. Multiplying this number by the single-pixel accuracy (μm / pixel, pre-calibrated) yields the outer diameter. The end-face angle is obtained by fitting the angle between the cut fiber (bundle) end face and the perpendicular to the fiber (bundle) central axis. In actual measurement, the camera can only see one projection of the fiber (bundle) end face at a time, so it can rotate to different positions (0-360°) to measure multiple end-face angles and take the maximum value. When observing the end face, the reflector extends, and the camera can see the image of the workpiece end face through the reflector. Through multi-point fitting, the minimum outer circle diameter of the fiber bundle and the cladding or core diameter of each fiber can be measured. The two motors on both sides of the clamping rotating assembly can rotate synchronously or independently on one side. The vision guidance system can also achieve automatic back-top position adjustment for traditional mechanical cutter head cutting, compatible with high-speed mechanical cutter head cutting.

[0179] This application utilizes infrared picosecond ultrafast lasers to cut thick optical fibers or fiber bundles. By adjusting the laser power, Bessel laser cutting head height, and pulse number, it can cut optical fibers or fiber bundles with diameters ranging from 30μm to 3000μm. The tensile force used is 10-60% lower than that of traditional mechanical cutting, the end face angle is <1.5°, and the cutting depth is controllable from 10-500μm. Femtosecond or ultraviolet ultrafast lasers can also achieve good processing results.

[0180] This application has the following advantages: Advantage 1: Ultrafast laser cutting of thick fiber bundles has a small end face angle, less burrs and damage, no problem of cutting head damage and high consumables. The lifespan of ultrafast lasers is generally 5-10 years, and daily maintenance is simple. Advantage 2: The tension of ultrafast laser cutting of thick fiber bundles can be flexibly adjusted by cutting depth and length, and the tension is lower than that of mechanical cutting, which can effectively avoid the brittle fracture of coupler products; Advantage 3: The thick fiber bundle in vision-guided laser processing can adaptively adjust the Z-axis cutting height, ensuring automatic and efficient cutting of different products; Advantage 4: A vision-guided laser processing equipment for brittle non-metallic materials can automatically measure the outer diameter, end face angle and conical coaxiality of the workpiece to be processed, and can also achieve automatic back-top position adjustment through vision, and is compatible with high-speed mechanical cutting head cutting; Advantage 5: A vision-guided laser processing equipment for brittle non-metallic materials can realize automatic circumferential pre-cutting of glass tubes. The number of cuts and the depth are controllable. Since the glass tube is cut before the optical fiber is inserted, the risk of damaging the optical fiber during subsequent glass tube cutting is fundamentally avoided. The glass tube can be pulled apart with a certain pulling force afterward. Advantage 6: A vision-guided laser processing device for brittle non-metallic materials is simultaneously compatible with coarse fiber bundle cutting and glass tube circumferential cutting.

[0181] The foregoing has provided a detailed description of a laser processing method and apparatus based on dynamic tension provided in this application. This related equipment may include an index data processing device, electronic equipment, a computer-readable storage medium, and a computer program product. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are merely for the purpose of helping to understand the method and its core ideas. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

[0182] It should be noted that when the above embodiments of this application are applied to specific products or technologies, and user-related data is involved, user permission or consent is required, and the collection, use and processing of related data must comply with the relevant laws, regulations and standards of the relevant countries and regions.

Claims

1. A laser processing method based on dynamic tensile force, characterized in that, The laser processing method based on dynamic tension is applied to a laser processing system, which includes a laser processing device, an imaging device, and a control device. The laser processing system is used to process a workpiece. The laser processing device includes a laser component and a stretching component. The laser component generates a laser to cut the workpiece, and the stretching component stretches the workpiece along its axial direction. The laser processing method based on dynamic tension includes: When the laser assembly cuts a notch in the workpiece to be processed, the imaging device is controlled to take a picture of the notch to obtain a first image of the notch. The cut size parameters of the cut are determined based on the first cut image; The tensile force at which the tension assembly breaks is determined based on the slit size parameters. The tensile component applies a tensile force to the workpiece to be processed based on the tensile force control, until the workpiece is broken.

2. The laser processing method based on dynamic tension according to claim 1, characterized in that, The step of controlling the tensioning assembly to apply a tension force to the workpiece to be processed based on the breaking tensile force, until the workpiece is broken, includes: The stretching assembly is controlled to apply a tensile force to the workpiece to be processed according to a first tensile force growth curve until the tensile force of the stretching assembly reaches the breaking tensile force; The stretching component is controlled to apply a tensile force to the workpiece to be processed according to a second tensile force growth curve until the workpiece is broken, wherein the growth rate of the second tensile force growth curve is less than the growth rate of the first tensile force growth curve.

3. The laser processing method based on dynamic tension according to claim 2, characterized in that, The control of the stretching assembly to apply a tensile force to the workpiece according to a second tensile force growth curve until the workpiece breaks includes: The stretching component is controlled to apply tension to the workpiece to be processed according to the second tension growth curve, and the stretching distance and tension change rate of the stretching component are collected at a preset period. When the tensile force change rate is the tensile force reduction rate, and the tensile force reduction rate is greater than or equal to the preset reduction ratio, and the stretching distance is less than the preset breaking distance, it is determined that the workpiece to be processed is broken.

4. The laser processing method based on dynamic tension according to claim 3, characterized in that, The control of the stretching assembly to apply a tensile force to the workpiece according to a second tensile force growth curve until the workpiece breaks includes: When the tensile force change rate gradually decreases over multiple preset cycles, and the stretching distance is not less than the preset breaking distance, it is determined that the workpiece to be processed has not been broken.

5. The laser processing method based on dynamic tension according to claim 4, characterized in that, The laser processing equipment includes two clamping mechanisms for clamping both ends of the workpiece to be processed, and a tensioning assembly for driving the two rotating assemblies to move relative to each other. The laser processing method based on dynamic tension further includes: When the tension change rate gradually decreases over multiple preset cycles, and the stretching distance is not less than the preset breaking distance, the clamping force of the clamping mechanism is increased by a preset pressure value. The tensile component applies a tensile force to the workpiece to be processed based on the tensile force control, until the workpiece is broken.

6. The laser processing method based on dynamic tension according to claim 5, characterized in that, The incision size parameters include the incision depth, and determining the incision size parameters based on the first incision image includes: The first incision region is obtained by identifying the incision region in the first incision image. The cut depth is determined based on the length of the first cut region in the height direction of the first cut image.

7. The laser processing method based on dynamic tension according to claim 6, characterized in that, The incision size parameter includes the incision width, and determining the incision size parameter based on the first incision image includes: Acquire a second cut image, wherein the second cut image is captured by the imaging device after rotating the imaging device relative to the workpiece by a preset angle when the laser component cuts a cut into the workpiece to be processed; The second incision image is subjected to incision region identification to obtain the second incision region; The cut width is determined based on the length of the second cut region in the height direction of the second cut image.

8. A control device, characterized in that, The control device is applied to a laser processing system, which includes laser processing equipment, an imaging device, and a control device. The laser processing system is used to process a workpiece. The laser processing equipment includes a laser component and a stretching component. The laser component generates laser light to cut the workpiece, and the stretching component stretches the workpiece along its axial direction. The control device includes: The imaging module controls the imaging device to take a picture of the cut when the laser component cuts a notch in the workpiece to be processed, thereby obtaining a first image of the cut. The first determining module determines the cut size parameters of the cut based on the first cut image; The second determining module determines the breaking force of the tension component based on the cut size parameters; The tension application module controls the tensioning component to apply tension to the workpiece to be processed based on the breaking tension, until the workpiece is broken.

9. An electronic device, characterized in that, It includes a memory and a processor, the memory storing a computer program, and the processor running the computer program in the memory to perform the steps of the laser processing method based on dynamic tension as described in any one of claims 1 to 7.

10. A laser processing system, characterized in that, The laser processing system includes laser processing equipment, a photographing device, and a control device. The laser processing system is used to process the workpiece to be processed, and the control device is used to execute the laser processing method based on dynamic tension.

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