Wafer unloading method and device, electronic equipment and storage medium

Abstract

The application belongs to the technical field of wafer arranging, and discloses a wafer arranging method, a wafer arranging device, an electronic device and a storage medium. The method comprises the following steps: acquiring motion state information of a target wafer in a wafer arranging process; determining target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information according to a preset wafer arranging precision index control coefficient and a preset wafer arranging speed index control coefficient; and controlling a wafer arranging manipulator of the target wafer based on the target suction nozzle control negative pressure information and the target control speed data. Through the method, the wafer arranging efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of wafer layout, and more specifically, to a wafer layout method, apparatus, electronic device, and storage medium. Background Technology

[0002] High-speed wafer arrangement technology plays a crucial role in the automated production of precision electronic components such as semiconductors, optoelectronics, and quartz wafers. Its main function is to efficiently and accurately arrange bulk wafers into molds or carriers, thereby significantly improving production efficiency and product yield. Currently, mainstream high-speed wafer arrangement methods typically use a camera to identify the wafer position, then use a vacuum nozzle to pick up the wafer, and a high-speed robotic arm to move the wafer to the target position, finally placing the wafer into a mold or carrier.

[0003] The core indicators for measuring wafer layout performance mainly include layout speed and layout accuracy. However, in existing technologies, there is a significant contradiction between layout speed and layout accuracy, and the two are often mutually exclusive. Specifically, to ensure high layout accuracy, the layout speed usually cannot be set too fast; conversely, when attempting to increase the layout speed, the layout accuracy will drop sharply, resulting in poor loading effect and difficulty in meeting the requirements of actual production environments.

[0004] To resolve the trade-off between screen layout speed and accuracy, existing technologies typically focus on improving hardware to enhance performance, such as increasing camera recognition accuracy, actuator motion accuracy, and the dimensional accuracy of molds or carriers. However, this hardware-upgrade-dependent solution often leads to a significant increase in production costs, adding to the operational burden on companies. Therefore, optimizing screen layout planning algorithms to simultaneously achieve both speed and accuracy in high-speed screen layout without significantly increasing hardware costs is a pressing issue in the current technological field.

[0005] To address the aforementioned issues, existing technologies urgently need improvement. Summary of the Invention

[0006] The purpose of this application is to provide a wafer stacking method, apparatus, electronic device, and storage medium. By using preset stacking accuracy index control coefficients and preset stacking speed index control coefficients, combined with the operating status information of the target wafer during the stacking process, the target nozzle control negative pressure information and target control speed data are determined to control the stacking robot. This solves the problem that existing wafer stacking methods rely on hardware upgrades to combine stacking speed and accuracy, resulting in excessive costs. It can dynamically adjust the nozzle negative pressure and robot speed based on the real-time motion status information of the wafer, thereby effectively improving the stacking speed and increasing the wafer stacking efficiency while ensuring stacking accuracy.

[0007] In a first aspect, this application provides a wafer arrangement method, including: Acquire the motion state information of the target wafer during the wafer stacking process; Based on the preset control coefficients for the precision index of the tablet arrangement and the preset control coefficients for the speed index of the tablet arrangement, the target nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined. Based on the target suction nozzle control negative pressure information and the target control speed data, the wafer stacking robot is controlled.

[0008] The wafer arrangement method provided in this application can arrange wafers. By using preset wafer arrangement accuracy index control coefficients and preset wafer arrangement speed index control coefficients, combined with the target wafer's operating status information during the arrangement process, the target nozzle control negative pressure information and target control speed data are determined to control the wafer arrangement robot. This solves the problem of excessively high costs caused by existing wafer arrangement methods relying on hardware upgrades to combine wafer arrangement speed and accuracy. It can dynamically adjust the nozzle negative pressure and robot speed based on the real-time motion status information of the wafer, thereby effectively improving the wafer arrangement speed and increasing wafer arrangement efficiency while ensuring wafer arrangement accuracy.

[0009] Optionally, the motion state information of the target wafer during the wafer stacking process is obtained, including: Acquire information on the speed change of the target wafer stacking robot during the stacking process; Based on the velocity change information, calculations are performed to determine the motion state information of the target wafer.

[0010] The wafer arrangement method provided in this application can arrange wafers and accurately obtain the motion state of the wafers by real-time monitoring and calculation of the speed changes of the robotic arm, providing accurate input data for subsequent fine control and improving the accuracy of the perception of the wafer motion state.

[0011] Optionally, the motion state information includes uniformly accelerated motion state information, uniformly velocity motion state information, and uniformly decelerated motion state information.

[0012] Optionally, based on preset sheet arrangement accuracy index control coefficients and preset sheet arrangement speed index control coefficients, the target nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: The target uniform acceleration control negative pressure information, the target uniform speed control negative pressure information, and the target uniform deceleration control negative pressure information corresponding to the uniform acceleration motion state information, respectively, are determined. Based on the preset control coefficients for the precision index of the film arrangement and the preset control coefficients for the speed index of the film arrangement, the target uniform acceleration speed data corresponding to the uniform acceleration motion state information, the target uniform speed data corresponding to the uniform speed motion state information, and the target uniform deceleration speed data corresponding to the uniform deceleration motion state information are determined. Based on the target uniform acceleration speed data, the target uniform acceleration control negative pressure information, the target uniform speed data, the target uniform speed control negative pressure information, the target uniform deceleration speed data, and the target uniform deceleration control negative pressure information, the target suction nozzle control negative pressure information and the target control speed data corresponding to the motion state information are determined.

[0013] The wafer arrangement method provided in this application can arrange wafers. By pre-setting corresponding target speed and negative pressure information for different motion states, and combining the arrangement accuracy and speed index control coefficient, the control strategy is more targeted and flexible, and the balance between speed and accuracy in the arrangement process is further optimized.

[0014] Optionally, based on the target uniform acceleration speed data, the target uniform acceleration control negative pressure information, the target uniform speed data, the target uniform speed control negative pressure information, the target uniform deceleration speed data, and the target uniform deceleration control negative pressure information, the target nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: When the motion state information is uniform acceleration motion state information, the target uniform acceleration control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform acceleration speed data is determined as the target control speed data, such that the difference between the target uniform acceleration control negative pressure information and the actual control negative pressure data of the target wafer is less than or equal to a preset control negative pressure difference threshold, and the absolute value of the difference between the actual control acceleration data of the target wafer and the target uniform acceleration speed data is less than or equal to a preset control acceleration difference threshold.

[0015] Optionally, based on the target uniform acceleration speed data, the target uniform acceleration control negative pressure information, the target uniform speed data, the target uniform speed control negative pressure information, the target uniform deceleration speed data, and the target uniform deceleration control negative pressure information, the target nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: When the motion state information is uniform motion state information, the target uniform speed control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform speed data is determined as the target control speed data, such that the difference between the target uniform speed control negative pressure information and the actual control negative pressure data of the target wafer is less than or equal to a preset control negative pressure difference threshold, and the absolute value of the difference between the actual control speed data of the target wafer and the target uniform speed data is less than or equal to a preset control speed difference threshold.

[0016] Optionally, based on the target uniform acceleration speed data, the target uniform acceleration control negative pressure information, the target uniform speed data, the target uniform speed control negative pressure information, the target uniform deceleration speed data, and the target uniform deceleration control negative pressure information, the target nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: When the motion state information is uniform deceleration motion state information, the target uniform deceleration control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform deceleration speed data is determined as the target control speed data, such that the difference between the target uniform deceleration control negative pressure information and the actual control negative pressure data of the target wafer is less than or equal to a preset control negative pressure difference threshold, and the absolute value of the difference between the actual control deceleration data of the target wafer and the target uniform deceleration speed data is less than or equal to a preset control deceleration difference threshold.

[0017] Secondly, this application provides a wafer stacking apparatus, comprising: The acquisition module is used to acquire motion state information of the target wafer during the wafer stacking process; The determination module is used to determine the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information based on the preset sheet arrangement accuracy index control coefficient and the preset sheet arrangement speed index control coefficient. The control module is used to control the wafer stacking robot based on the target suction nozzle control negative pressure information and the target control speed data.

[0018] This wafer stacking device, through preset stacking accuracy index control coefficients and preset stacking speed index control coefficients, combined with the target wafer's operating status information during the stacking process, determines the target nozzle control negative pressure information and target control speed data to control the stacking robot. This solves the problem of excessively high costs caused by existing wafer stacking methods relying on hardware upgrades to combine stacking speed and accuracy. It can dynamically adjust the nozzle negative pressure and robot speed based on the real-time motion status information of the wafer, thereby effectively improving the stacking speed and increasing the wafer stacking efficiency while ensuring stacking accuracy.

[0019] Thirdly, this application provides an electronic device including a processor and a memory, the memory storing a computer program executable by the processor, wherein when the processor executes the computer program, it performs the steps in the wafer set-out method described above.

[0020] Fourthly, this application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, performs the steps in the wafer set-out method described above.

[0021] Beneficial effects: The wafer stacking method, apparatus, electronic device, and storage medium provided in this application determine the target nozzle control negative pressure information and target control speed data by using preset stacking accuracy index control coefficients and preset stacking speed index control coefficients, combined with the target wafer's operating status information during the stacking process. This allows for the control of the stacking robot, solving the problem of excessively high costs caused by existing wafer stacking methods relying on hardware upgrades to combine stacking speed and accuracy. It can dynamically adjust the nozzle negative pressure and robot speed based on the real-time motion status information of the wafer, thereby effectively improving the stacking speed and increasing wafer stacking efficiency while ensuring stacking accuracy. Attached Figure Description

[0022] Figure 1 A flowchart illustrating the wafer arrangement method provided in this application embodiment.

[0023] Figure 2 This is a schematic diagram of the structure of the wafer stacking device provided in the embodiments of this application.

[0024] Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0025] Labeling Explanation: 1. Acquisition Module; 2. Determination Module; 3. Control Module; 301. Processor; 302. Memory; 303. Communication Bus. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0027] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0028] Please refer to Figure 1 , Figure 1 This application provides a wafer arrangement method in some embodiments, used for wafer arrangement, comprising the following steps: Step S101: Obtain motion state information of the target wafer during the wafer stacking process; Step S102: Based on the preset control coefficients for film arrangement accuracy index and the preset control coefficients for film arrangement speed index, determine the target nozzle control negative pressure information and target control speed data corresponding to the motion state information. Step S103: Based on the target nozzle control negative pressure information and target control speed data, control the target wafer stacking robot.

[0029] This wafer stacking method, by using preset stacking accuracy index control coefficients and preset stacking speed index control coefficients, combined with the target wafer's operating status information during the stacking process, determines the target nozzle control negative pressure information and target control speed data to control the stacking robot. This solves the problem of excessively high costs caused by existing wafer stacking methods relying on hardware upgrades to combine stacking speed and accuracy. It can dynamically adjust the nozzle negative pressure and robot speed based on the real-time motion status information of the wafer, thereby effectively improving the stacking speed and increasing the wafer stacking efficiency while ensuring stacking accuracy.

[0030] Specifically, in step S101, the motion state information of the target wafer during the wafer stacking process is obtained, including: Acquire information on the speed change of the target wafer stacking robot during the stacking process; The motion state information of the target wafer is determined by calculation based on the velocity change information.

[0031] In step S101, sensors configured on the stacking robot, such as encoders, laser rangefinders, or vision systems, monitor the robot's position and time data in real time during the stacking process. By continuously sampling and processing this data, the instantaneous speed of the stacking robot at different time points can be calculated, and its speed change trend can be analyzed, such as speed increase, remaining constant, or decrease. The target wafer refers to precision electronic components such as semiconductor wafers, optoelectronic wafers, or quartz wafers that need to be attracted, moved, and placed in a designated position during the stacking process. Speed ​​change information can include speed values, acceleration values, and curves or sequence data of speed changes over time.

[0032] Based on the acquired velocity change information, corresponding judgment criteria are applied to determine the current motion state of the target chip. This motion state information includes uniformly accelerated motion, uniform velocity motion, and uniformly decelerated motion. For example, when the velocity continuously increases (i.e., the change in velocity is greater than 0), it can be judged as uniformly accelerated motion; when the velocity remains essentially constant (i.e., the change in velocity tends to 0), it can be judged as uniform velocity motion; and when the velocity continuously decreases (i.e., the change in velocity is less than 0), it can be judged as uniformly decelerated motion. These calculations may involve differentiating the velocity data to obtain acceleration, or directly identifying the motion state by analyzing the slope of the velocity-time curve, thus providing accurate kinematic basis for subsequent control decisions.

[0033] Specifically, in step S102, based on the preset tablet arrangement accuracy index control coefficient and the preset tablet arrangement speed index control coefficient, the target nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: The target uniform acceleration control negative pressure information, the target uniform velocity control negative pressure information, and the target uniform deceleration control negative pressure information corresponding to the uniform acceleration motion state information, are determined respectively. Based on the preset control coefficients for the precision index and the preset control coefficients for the speed index, the target uniform acceleration speed data, the target uniform speed data, and the target uniform deceleration speed data corresponding to the uniform acceleration motion state information are determined. Based on the target uniform acceleration speed data, target uniform acceleration control negative pressure information, target uniform speed data, target uniform speed control negative pressure information, target uniform deceleration speed data, and target uniform deceleration control negative pressure information, the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined.

[0034] In step S102, maintaining the maximum negative pressure throughout the entire wafer stacking process allows for higher stacking speed and accuracy. However, this method places high demands on hardware, requiring high specifications for the volumetric flow rate, pressure, and power of the pressure supply equipment, thus increasing costs. The acceleration and deceleration movements of the stacking robot have the greatest impact on stacking accuracy. During the constant speed phase, the wafers experience only air resistance and are subjected to relatively small forces, so the suction nozzle does not require a large negative pressure. Therefore, during the acceleration and deceleration phases, the suction nozzle needs a higher negative pressure and must maintain the maximum negative pressure value as much as possible. During the constant speed phase, the pressure can be reduced to maintain a stable suction state without detachment.

[0035] In summary, considering the different motion stages that wafers may undergo during the wafer stacking process, the maximum and minimum safe control negative pressure information of the stacking robot can be obtained as control negative pressure information for different motion stages. Specifically, the maximum safe control negative pressure information is defined as the target uniformly accelerated control negative pressure information for uniformly accelerated motion and the target uniformly decelerated control negative pressure information for uniformly decelerated motion. The minimum safe control negative pressure information is defined as the target uniformly velocities control negative pressure information for uniform motion. The maximum safe control negative pressure information refers to the maximum negative pressure value that the nozzle can apply without deforming or damaging the wafer, ensuring wafer safety when a large suction force is required. The minimum safe control negative pressure information refers to the minimum negative pressure value that the nozzle can apply while maintaining stable wafer adhesion without detachment, minimizing stress on the wafer while meeting adhesion requirements. The maximum and minimum safe control negative pressure information can be set according to actual needs, such as through experimental results.

[0036] The wafer arrangement accuracy index control coefficient and the wafer arrangement speed index control coefficient are pre-set parameters used to balance and optimize wafer arrangement accuracy and speed under different motion states. For example, in scenarios requiring high-precision wafer arrangement, a higher wafer arrangement accuracy index control coefficient can be set to ensure precise wafer placement; while in scenarios with high speed requirements, a higher wafer arrangement speed index control coefficient can be set to accelerate wafer arrangement efficiency. These coefficients can be empirically set or obtained through experimental optimization based on factors such as actual application needs, wafer type, and wafer arrangement robot performance. Using the wafer arrangement accuracy index control coefficient and the wafer arrangement speed index control coefficient, the target uniform acceleration speed data corresponding to uniform acceleration motion state information, the target uniform speed speed data corresponding to uniform speed motion state information, and the target uniform deceleration speed data corresponding to uniform deceleration motion state information can be calculated.

[0037] For example, to describe the arrangement robot under different motion states, a relational expression can be established based on the relationship between its motion accuracy and parameters such as speed and acceleration, combined with pre-set control coefficients for arrangement accuracy and speed. This expression can then be used to calculate the arrangement accuracy index and speed index, thereby obtaining target speed data (target uniform acceleration data, target uniform speed data, and target uniform deceleration speed data) under different motion states. Specifically, the relational expression for the arrangement accuracy index is as follows: ; ; ; ; ; ; ; in, The overall film arrangement accuracy index of the film arrangement robot; The first sorting accuracy index is the information of the sorting robot when it is in a uniform motion state. This is the first sorting accuracy control coefficient for the sorting robot when it is in a uniform motion state. The speed of the robotic arm during uniform motion; The second sorting accuracy index is the information of the sorting robot in uniform acceleration motion. The second sorting accuracy control coefficient is given when the sorting robot is in a uniformly accelerated motion state. The acceleration of the robotic arm during uniformly accelerated motion; The third sorting accuracy index is the sorting robot's state information when it is in uniformly decelerated motion. This is the third precision control coefficient for the stacking robot during uniformly decelerated motion. This refers to the deceleration of the robotic arm during uniformly decelerated motion (the deceleration is a negative number). For the film arrangement robot to operate under uniform negative pressure The fourth-order plotting accuracy index when maintaining uniform motion state information; The uniform negative pressure is used to maintain the uniform motion state information of the film sorting robot; For the film arrangement robot to operate under uniform negative pressure The fourth-row precision control coefficient when maintaining uniform motion state information; For the film arrangement robot to operate under uniform acceleration and negative pressure The fifth-order precision index when maintaining uniformly accelerated motion state information; The uniform acceleration negative pressure is used by the robotic arm to maintain uniform acceleration motion state information. For the film arrangement robot to operate under uniform acceleration and negative pressure The fifth-order precision control coefficient when maintaining uniformly accelerated motion state information; For the film arrangement robot to operate under uniform deceleration and negative pressure The accuracy index of the sixth row of films when maintaining uniformly decelerated motion state information; The uniform deceleration negative pressure is used by the robotic arm to maintain uniform deceleration motion state information. For the film arrangement robot to operate under uniform acceleration and negative pressure The sixth frame arrangement accuracy control coefficient when maintaining uniformly decelerated motion state information. Among them, each frame arrangement accuracy control coefficient (i.e. , , , , , (This can be obtained through experiments.)

[0038] The specific expression for the relationship between the scheduling speed index and the film scheduling speed index is as follows: ; in, This refers to the overall scheduling speed index of the scheduling robot. The first stacking speed control coefficient is the information of the stacking robot when it is in a uniform motion state. The second tray-laying speed control coefficient is given when the tray-laying robot is in a state of uniform acceleration motion. This is the third speed control coefficient for the stacking robot when it is in a uniformly decelerated motion state.

[0039] Furthermore, based on actual application requirements and the stringent requirements of wafer placement processes, acceptable precision boundary condition parameters can be set for the motion accuracy of the placement robot. For example, the maximum acceptable lower limit parameter, maximum permissible deviation, and error range for repeatability can be set during wafer placement. For instance, to ensure high placement accuracy, the maximum acceptable lower limit parameter can be set to 0.9, meaning that the precision index of each placement element is greater than 0.9. , , , , , , These parameters are key constraints to ensure the quality of wafer stacking, ensuring that the stacking robot can still meet high-precision operation requirements while moving at high speeds.

[0040] Therefore, considering the actual working environment of the wafer sorting robot (such as temperature, humidity, wafer size, and sorting cycle time) and performance requirements (such as maximum and minimum safety control negative pressure information), numerical calculation methods are used to repeatedly adjust the parameters in the speed exponential relationship expression until they meet the accuracy requirements set by the accuracy boundary condition parameters. This allows for the search for optimal speed data for the wafer sorting robot under uniform acceleration, uniform speed, and uniform deceleration motion states while meeting high accuracy requirements. The goal of iterative calculation is to find the combination of motion parameters that maximizes sorting efficiency (i.e., the target speed data) while meeting accuracy requirements. For example, by optimizing algorithms, the operating speed of the wafer sorting robot can be gradually increased until the performance limit is reached or the preset operating conditions are met, all while meeting accuracy requirements.

[0041] This method avoids simply relying on experience or preset values. Instead, it uses a scientific modeling and optimization process to ensure that the determined optimal speed data (target speed data) can meet the high precision requirements of wafer layout while maximizing layout efficiency.

[0042] Optionally, in the first optional embodiment, in step S102, based on the target uniform acceleration speed data, target uniform acceleration control negative pressure information, target uniform speed data, target uniform speed control negative pressure information, target uniform deceleration speed data, and target uniform deceleration control negative pressure information, the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: When the motion state information is uniform acceleration motion state information, the target uniform acceleration control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform acceleration speed data is determined as the target control speed data, so that the difference between the target uniform acceleration control negative pressure information and the actual control negative pressure data of the target chip is less than or equal to the preset control negative pressure difference threshold, and the absolute value of the difference between the actual control acceleration data of the target chip and the target uniform acceleration speed data is less than or equal to the preset control acceleration difference threshold.

[0043] In step S102, when the wafer stacking robot is performing uniform acceleration motion (i.e., when the motion state information is identified as uniform acceleration motion state information), the pre-determined target uniform acceleration control negative pressure information is used as the current target suction nozzle control negative pressure information, and the target uniform acceleration speed data is used as the target control speed data. The actual control negative pressure data and the actual control acceleration data must be consistent with these target values ​​(target uniform acceleration control negative pressure information and target uniform acceleration speed data) within a preset allowable range. This limits the deviation between the actual control effect and the theoretical target, ensuring the stability and accuracy of the wafer during the acceleration process. The preset control negative pressure difference threshold and the preset control acceleration difference threshold can be set according to actual needs.

[0044] Optionally, in the second optional embodiment, in step S102, based on the target uniform acceleration speed data, target uniform acceleration control negative pressure information, target uniform speed data, target uniform speed control negative pressure information, target uniform deceleration speed data, and target uniform deceleration control negative pressure information, the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: When the motion state information is uniform motion state information, the target uniform speed control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform speed data is determined as the target control speed data, so that the difference between the target uniform speed control negative pressure information and the actual control negative pressure data of the target chip is less than or equal to the preset control negative pressure difference threshold, and the absolute value of the difference between the actual control speed data of the target chip and the target uniform speed data is less than or equal to the preset control speed difference threshold.

[0045] In step S102, when the wafer stacking robot is moving at a constant speed (i.e., when the motion state information is identified as constant speed motion state information), the pre-determined target constant speed control negative pressure information is used as the current target suction nozzle control negative pressure information, and the target constant speed data is used as the target control speed data. The actual control negative pressure data and the actual control acceleration data must be consistent with these target values ​​(target constant speed control negative pressure information and target constant speed data) within a preset allowable range. This limits the deviation between the actual control effect and the theoretical target, ensuring the stability and accuracy of the wafer during the acceleration process. The preset control speed difference threshold can be set according to actual needs.

[0046] Optionally, in the third optional embodiment, in step S102, based on the target uniform acceleration speed data, target uniform acceleration control negative pressure information, target uniform speed data, target uniform speed control negative pressure information, target uniform deceleration speed data, and target uniform deceleration control negative pressure information, the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: When the motion state information is uniform deceleration motion state information, the target uniform deceleration control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform deceleration speed data is determined as the target control speed data, so that the difference between the target uniform deceleration control negative pressure information and the actual control negative pressure data of the target wafer is less than or equal to the preset control negative pressure difference threshold, and the absolute value of the difference between the actual control deceleration data of the target wafer and the target uniform deceleration speed data is less than or equal to the preset control deceleration difference threshold.

[0047] In step S102, when the wafer stacking robot is performing uniform deceleration motion (i.e., when the motion state information is identified as uniform deceleration motion state information), the pre-determined target uniform deceleration control negative pressure information is used as the current target suction nozzle control negative pressure information, and the target uniform deceleration speed data is used as the target control speed data. The actual control negative pressure data and the actual control acceleration data must be consistent with these target values ​​(target uniform deceleration control negative pressure information and target uniform deceleration speed data) within a preset allowable range. This limits the deviation between the actual control effect and the theoretical target, ensuring the stability and accuracy of the wafer during the acceleration process. The preset control deceleration difference threshold can be set according to actual needs.

[0048] Therefore, the speed, acceleration, and deceleration of the wafer stacking robot can be precisely controlled within the optimal range throughout the entire movement process, thereby significantly improving the stability and accuracy of wafer stacking.

[0049] Specifically, in step S103, the wafer stacking robot is controlled based on the determined target nozzle control negative pressure information and target control speed data. The target nozzle control negative pressure information is sent to the vacuum generator or negative pressure controller of the stacking robot, causing it to adjust the negative pressure value of the nozzle to ensure that the wafer can be stably adsorbed under the current motion state information. At the same time, the target control speed data is sent to the robot's motion controller, causing it to adjust the robot arm's movement speed, acceleration, or deceleration, so that the robot arm can transport the wafer from the starting position to the target position with the optimal motion trajectory and speed.

[0050] As can be seen from the above, this wafer placement method acquires the motion state information of the target wafer during the placement process. Based on preset placement accuracy index control coefficients and preset placement speed index control coefficients, it determines the target nozzle control negative pressure information and target control speed data corresponding to the motion state information. Based on the target nozzle control negative pressure information and target control speed data, it controls the wafer placement robot. Thus, by using preset placement accuracy index control coefficients and preset placement speed index control coefficients, combined with the target wafer's running state information during the placement process, it determines the target nozzle control negative pressure information and target control speed data to control the placement robot. This solves the problem of excessively high costs caused by existing wafer placement methods relying on hardware upgrades to combine placement speed and placement accuracy. It can dynamically adjust the nozzle negative pressure and robot speed based on the real-time motion state information of the wafer, thereby effectively improving placement speed and increasing wafer placement efficiency while ensuring placement accuracy.

[0051] refer to Figure 2 This application provides a wafer stacking apparatus for stacking wafers, comprising: Acquisition module 1 is used to acquire motion state information of the target wafer during the wafer stacking process; Module 2 is used to determine the target nozzle control negative pressure information and target control speed data corresponding to the motion state information based on the preset sheet arrangement accuracy index control coefficient and the preset sheet arrangement speed index control coefficient. Control module 3 is used to control the wafer stacking robot based on the target suction nozzle control negative pressure information and target control speed data.

[0052] This wafer stacking device, through preset stacking accuracy index control coefficients and preset stacking speed index control coefficients, combined with the target wafer's operating status information during the stacking process, determines the target nozzle control negative pressure information and target control speed data to control the stacking robot. This solves the problem of excessively high costs caused by existing wafer stacking methods relying on hardware upgrades to combine stacking speed and accuracy. It can dynamically adjust the nozzle negative pressure and robot speed based on the real-time motion status information of the wafer, thereby effectively improving the stacking speed and increasing the wafer stacking efficiency while ensuring stacking accuracy.

[0053] Specifically, when acquiring the motion state information of the target wafer during the wafer stacking process, module 1 executes the following: Acquire information on the speed change of the target wafer stacking robot during the stacking process; The motion state information of the target wafer is determined by calculation based on the velocity change information.

[0054] During execution, module 1 monitors the position and time data of the robot arm in real time during the stacking process using sensors configured on the robot arm, such as encoders, laser rangefinders, or vision systems. By continuously sampling and processing this data, the instantaneous speed of the robot arm at different time points can be calculated, and its speed change trend can be analyzed, such as whether the speed increases, remains constant, or decreases. The target wafer refers to precision electronic components such as semiconductor wafers, optoelectronic wafers, or quartz wafers that need to be attracted, moved, and placed in a designated position during the stacking process. Speed ​​change information can include speed values, acceleration values, and curves or sequence data of speed changes over time.

[0055] Based on the acquired velocity change information, corresponding judgment criteria are applied to determine the current motion state of the target chip. This motion state information includes uniformly accelerated motion, uniform velocity motion, and uniformly decelerated motion. For example, when the velocity continuously increases (i.e., the change in velocity is greater than 0), it can be judged as uniformly accelerated motion; when the velocity remains essentially constant (i.e., the change in velocity tends to 0), it can be judged as uniform velocity motion; and when the velocity continuously decreases (i.e., the change in velocity is less than 0), it can be judged as uniformly decelerated motion. These calculations may involve differentiating the velocity data to obtain acceleration, or directly identifying the motion state by analyzing the slope of the velocity-time curve, thus providing accurate kinematic basis for subsequent control decisions.

[0056] Specifically, when determining the target nozzle control negative pressure information and target control speed data corresponding to the motion state information based on the preset film arrangement accuracy index control coefficient and the preset film arrangement speed index control coefficient, module 2 executes: The target uniform acceleration control negative pressure information, the target uniform velocity control negative pressure information, and the target uniform deceleration control negative pressure information corresponding to the uniform acceleration motion state information, are determined respectively. Based on the preset control coefficients for the precision index and the preset control coefficients for the speed index, the target uniform acceleration speed data, the target uniform speed data, and the target uniform deceleration speed data corresponding to the uniform acceleration motion state information are determined. Based on the target uniform acceleration speed data, target uniform acceleration control negative pressure information, target uniform speed data, target uniform speed control negative pressure information, target uniform deceleration speed data, and target uniform deceleration control negative pressure information, the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined.

[0057] When module 2 is executed, maintaining the maximum negative pressure throughout the entire wafer stacking process allows for higher stacking speed and accuracy. However, this method places high demands on hardware, requiring high specifications for the pressure supply equipment's volumetric flow rate, pressure, and power, thus increasing costs. The acceleration and deceleration movements of the stacking robot have the greatest impact on stacking accuracy. During the constant-speed phase, the wafers experience only air resistance and minimal force, so the suction nozzle does not require a large negative pressure. Therefore, during acceleration and deceleration, the suction nozzle needs a higher negative pressure, requiring it to maintain the maximum negative pressure value as much as possible. During the constant-speed phase, the pressure can be reduced to maintain a stable suction state without detachment.

[0058] In summary, considering the different motion stages that wafers may undergo during the wafer stacking process, the maximum and minimum safe control negative pressure information of the stacking robot can be obtained as control negative pressure information for different motion stages. Specifically, the maximum safe control negative pressure information is defined as the target uniformly accelerated control negative pressure information for uniformly accelerated motion and the target uniformly decelerated control negative pressure information for uniformly decelerated motion. The minimum safe control negative pressure information is defined as the target uniformly velocities control negative pressure information for uniform motion. The maximum safe control negative pressure information refers to the maximum negative pressure value that the nozzle can apply without deforming or damaging the wafer, ensuring wafer safety when a large suction force is required. The minimum safe control negative pressure information refers to the minimum negative pressure value that the nozzle can apply while maintaining stable wafer adhesion without detachment, minimizing stress on the wafer while meeting adhesion requirements. The maximum and minimum safe control negative pressure information can be set according to actual needs, such as through experimental results.

[0059] The wafer arrangement accuracy index control coefficient and the wafer arrangement speed index control coefficient are pre-set parameters used to balance and optimize wafer arrangement accuracy and speed under different motion states. For example, in scenarios requiring high-precision wafer arrangement, a higher wafer arrangement accuracy index control coefficient can be set to ensure precise wafer placement; while in scenarios with high speed requirements, a higher wafer arrangement speed index control coefficient can be set to accelerate wafer arrangement efficiency. These coefficients can be empirically set or obtained through experimental optimization based on factors such as actual application needs, wafer type, and wafer arrangement robot performance. Using the wafer arrangement accuracy index control coefficient and the wafer arrangement speed index control coefficient, the target uniform acceleration speed data corresponding to uniform acceleration motion state information, the target uniform speed speed data corresponding to uniform speed motion state information, and the target uniform deceleration speed data corresponding to uniform deceleration motion state information can be calculated.

[0060] For example, to describe the arrangement robot under different motion states, a relational expression can be established based on the relationship between its motion accuracy and parameters such as speed and acceleration, combined with pre-set control coefficients for arrangement accuracy and speed. This expression can then be used to calculate the arrangement accuracy index and speed index, thereby obtaining target speed data (target uniform acceleration data, target uniform speed data, and target uniform deceleration speed data) under different motion states. Specifically, the relational expression for the arrangement accuracy index is as follows: ; ; ; ; ; ; ; in, The overall film arrangement accuracy index of the film arrangement robot; The first sorting accuracy index is the information of the sorting robot when it is in a uniform motion state. This is the first sorting accuracy control coefficient for the sorting robot when it is in a uniform motion state. The speed of the robotic arm during uniform motion; The second sorting accuracy index is the information of the sorting robot in uniform acceleration motion. The second sorting accuracy control coefficient is given when the sorting robot is in a uniformly accelerated motion state. The acceleration of the robotic arm during uniformly accelerated motion; The third sorting accuracy index is the sorting robot's state information when it is in uniformly decelerated motion. This is the third precision control coefficient for the stacking robot during uniformly decelerated motion. This refers to the deceleration of the robotic arm during uniformly decelerated motion (the deceleration is a negative number). For the film arrangement robot to operate under uniform negative pressure The fourth-order plotting accuracy index when maintaining uniform motion state information; The uniform negative pressure is used to maintain the uniform motion state information of the film sorting robot; For the film arrangement robot to operate under uniform negative pressure The fourth-row precision control coefficient when maintaining uniform motion state information; For the film arrangement robot to operate under uniform acceleration and negative pressure The fifth-order precision index when maintaining uniformly accelerated motion state information; The uniform acceleration negative pressure is used by the robotic arm to maintain uniform acceleration motion state information. For the film arrangement robot to operate under uniform acceleration and negative pressure The fifth-order precision control coefficient when maintaining uniformly accelerated motion state information; For the film arrangement robot to operate under uniform deceleration and negative pressure The accuracy index of the sixth row of films when maintaining uniformly decelerated motion state information; The uniform deceleration negative pressure is used by the robotic arm to maintain uniform deceleration motion state information. For the film arrangement robot to operate under uniform acceleration and negative pressure The sixth frame arrangement accuracy control coefficient when maintaining uniformly decelerated motion state information. Among them, each frame arrangement accuracy control coefficient (i.e. , , , , , (This can be obtained through experiments.)

[0061] The specific expression for the relationship between the scheduling speed index and the film scheduling speed index is as follows: ; in, This refers to the overall scheduling speed index of the scheduling robot. The first stacking speed control coefficient is the information of the stacking robot when it is in a uniform motion state. The second tray-laying speed control coefficient is given when the tray-laying robot is in a state of uniform acceleration motion. This is the third speed control coefficient for the stacking robot when it is in a uniformly decelerated motion state.

[0062] Furthermore, based on actual application requirements and the stringent requirements of wafer placement processes, acceptable precision boundary condition parameters can be set for the motion accuracy of the placement robot. For example, the maximum acceptable lower limit parameter, maximum permissible deviation, and error range for repeatability can be set during wafer placement. For instance, to ensure high placement accuracy, the maximum acceptable lower limit parameter can be set to 0.9, meaning that the precision index of each placement element is greater than 0.9. , , , , , , These parameters are key constraints to ensure the quality of wafer stacking, ensuring that the stacking robot can still meet high-precision operation requirements while moving at high speeds.

[0063] Therefore, considering the actual working environment of the wafer sorting robot (such as temperature, humidity, wafer size, and sorting cycle time) and performance requirements (such as maximum and minimum safety control negative pressure information), numerical calculation methods are used to repeatedly adjust the parameters in the speed exponential relationship expression until they meet the accuracy requirements set by the accuracy boundary condition parameters. This allows for the search for optimal speed data for the wafer sorting robot under uniform acceleration, uniform speed, and uniform deceleration motion states while meeting high accuracy requirements. The goal of iterative calculation is to find the combination of motion parameters that maximizes sorting efficiency (i.e., the target speed data) while meeting accuracy requirements. For example, by optimizing algorithms, the operating speed of the wafer sorting robot can be gradually increased until the performance limit is reached or the preset operating conditions are met, all while meeting accuracy requirements.

[0064] This method avoids simply relying on experience or preset values. Instead, it uses a scientific modeling and optimization process to ensure that the determined optimal speed data (target speed data) can meet the high precision requirements of wafer layout while maximizing layout efficiency.

[0065] Optionally, in the first optional embodiment, when determining the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information based on the target uniform acceleration speed data, target uniform acceleration control negative pressure information, target uniform speed data, target uniform speed control negative pressure information, target uniform deceleration speed data, and target uniform deceleration control negative pressure information, the determining module 2 performs the following: When the motion state information is uniform acceleration motion state information, the target uniform acceleration control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform acceleration speed data is determined as the target control speed data, so that the difference between the target uniform acceleration control negative pressure information and the actual control negative pressure data of the target chip is less than or equal to the preset control negative pressure difference threshold, and the absolute value of the difference between the actual control acceleration data of the target chip and the target uniform acceleration speed data is less than or equal to the preset control acceleration difference threshold.

[0066] When module 2 is executed, if the wafer-laying robot is undergoing uniform acceleration (i.e., the motion state information is identified as uniform acceleration motion state information), it will use the pre-determined target uniform acceleration control negative pressure information as the current target suction nozzle control negative pressure information, and the target uniform acceleration speed data as the target control speed data. It requires that the actual control negative pressure data and the actual control acceleration data must be consistent with these target values ​​(target uniform acceleration control negative pressure information and target uniform acceleration speed data) within a preset allowable range. This limits the deviation between the actual control effect and the theoretical target, ensuring the stability and accuracy of the wafers during the acceleration process. The preset control negative pressure difference threshold and the preset control acceleration difference threshold can be set according to actual needs.

[0067] Optionally, in the second optional embodiment, when the determining module 2 determines the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information based on the target uniform acceleration speed data, target uniform acceleration control negative pressure information, target uniform speed data, target uniform speed control negative pressure information, target uniform deceleration speed data, and target uniform deceleration control negative pressure information, it performs the following: When the motion state information is uniform motion state information, the target uniform speed control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform speed data is determined as the target control speed data, so that the difference between the target uniform speed control negative pressure information and the actual control negative pressure data of the target chip is less than or equal to the preset control negative pressure difference threshold, and the absolute value of the difference between the actual control speed data of the target chip and the target uniform speed data is less than or equal to the preset control speed difference threshold.

[0068] When module 2 is executed, if the wafer-laying robot is moving at a constant speed (i.e., the motion state information is identified as constant speed motion state information), it will use the pre-determined target constant speed control negative pressure information as the current target suction nozzle control negative pressure information, and the target constant speed data as the target control speed data. It requires that the actual control negative pressure data and the actual control acceleration data must be consistent with these target values ​​(target constant speed control negative pressure information and target constant speed data) within a preset allowable range. This limits the deviation between the actual control effect and the theoretical target, ensuring the stability and accuracy of the wafer during the acceleration process. The preset control speed difference threshold can be set according to actual needs.

[0069] Optionally, in the third optional embodiment, when the determining module 2 determines the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information based on the target uniform acceleration speed data, target uniform acceleration control negative pressure information, target uniform speed data, target uniform speed control negative pressure information, target uniform deceleration speed data, and target uniform deceleration control negative pressure information, it performs the following: When the motion state information is uniform deceleration motion state information, the target uniform deceleration control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform deceleration speed data is determined as the target control speed data, so that the difference between the target uniform deceleration control negative pressure information and the actual control negative pressure data of the target wafer is less than or equal to the preset control negative pressure difference threshold, and the absolute value of the difference between the actual control deceleration data of the target wafer and the target uniform deceleration speed data is less than or equal to the preset control deceleration difference threshold.

[0070] When module 2 is executed, if the wafer-laying robot is undergoing uniform deceleration (i.e., the motion state information is identified as uniform deceleration motion state information), it will use the pre-determined target uniform deceleration control negative pressure information as the current target suction nozzle control negative pressure information, and the target uniform deceleration speed data as the target control speed data. It requires that the actual control negative pressure data and the actual control acceleration data must be consistent with these target values ​​(target uniform deceleration control negative pressure information and target uniform deceleration speed data) within a preset allowable range. This limits the deviation between the actual control effect and the theoretical target, ensuring the stability and accuracy of the wafer during acceleration. The preset control deceleration difference threshold can be set according to actual needs.

[0071] Therefore, the speed, acceleration, and deceleration of the wafer stacking robot can be precisely controlled within the optimal range throughout the entire movement process, thereby significantly improving the stability and accuracy of wafer stacking.

[0072] Specifically, during execution, control module 3 controls the wafer stacking robot based on the determined target nozzle control negative pressure information and target control speed data. It sends the target nozzle control negative pressure information to the robot's vacuum generator or negative pressure controller, causing it to adjust the nozzle's negative pressure value to ensure stable wafer adsorption under the current motion conditions. Simultaneously, it sends the target control speed data to the robot's motion controller, adjusting the robot arm's movement speed, acceleration, or deceleration, thereby enabling the robot to transport the wafer from the starting position to the target position with optimal trajectory and speed.

[0073] As can be seen from the above, this wafer stacking device acquires the motion state information of the target wafer during the stacking process. Based on preset stacking accuracy index control coefficients and preset stacking speed index control coefficients, it determines the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information. Based on the target suction nozzle control negative pressure information and target control speed data, it controls the stacking robot of the target wafer. Thus, by using preset stacking accuracy index control coefficients and preset stacking speed index control coefficients, combined with the running state information of the target wafer during the stacking process, it determines the target suction nozzle control negative pressure information and target control speed data to control the stacking robot. This solves the problem of excessively high costs caused by existing wafer stacking methods relying on hardware upgrades to combine stacking speed and stacking accuracy. It can dynamically adjust the suction nozzle negative pressure and robot speed according to the real-time motion state information of the wafer, thereby effectively improving the stacking speed and increasing the wafer stacking efficiency while ensuring stacking accuracy.

[0074] Please refer to Figure 3 , Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device includes a processor 301 and a memory 302. The processor 301 and the memory 302 are interconnected and communicate with each other through a communication bus 303 and / or other forms of connection mechanism (not shown). The memory 302 stores a computer program executable by the processor 301. When the electronic device is running, the processor 301 executes the computer program to execute the wafer stacking method in any optional implementation of the above embodiments, so as to achieve the following functions: acquiring the motion state information of the target wafer during the stacking process; determining the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information according to the preset stacking accuracy index control coefficient and the preset stacking speed index control coefficient; and controlling the stacking robot of the target wafer based on the target suction nozzle control negative pressure information and the target control speed data.

[0075] This application provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it executes the wafer stacking method in any optional implementation of the above embodiments to achieve the following functions: acquiring motion state information of the target wafer during the stacking process; determining target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information based on preset stacking accuracy index control coefficients and preset stacking speed index control coefficients; and controlling the target wafer stacking robot based on the target suction nozzle control negative pressure information and target control speed data. The storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read Only Memory (EPROM), Programmable Red-Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0076] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the displayed or discussed mutual couplings, direct couplings, or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0077] Furthermore, the units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0078] Furthermore, the functional modules in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0079] In this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying any such actual relationship or order between these entities or operations.

[0080] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A wafer arrangement method, characterized in that, include: Acquire the motion state information of the target wafer during the wafer stacking process; Based on the preset control coefficients for the precision index of the tablet arrangement and the preset control coefficients for the speed index of the tablet arrangement, the target nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined. Based on the target suction nozzle control negative pressure information and the target control speed data, the wafer stacking robot is controlled; The motion state information includes uniformly accelerated motion state information, uniform motion state information, and uniformly decelerated motion state information; Based on preset control coefficients for tablet arrangement accuracy and speed, the target nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: The target uniform acceleration control negative pressure information, the target uniform speed control negative pressure information, and the target uniform deceleration control negative pressure information corresponding to the uniform acceleration motion state information, respectively, are determined. Based on the preset control coefficients for the precision index of the film arrangement and the preset control coefficients for the speed index of the film arrangement, the target uniform acceleration speed data corresponding to the uniform acceleration motion state information, the target uniform speed data corresponding to the uniform speed motion state information, and the target uniform deceleration speed data corresponding to the uniform deceleration motion state information are determined. Based on the target uniform acceleration speed data, the target uniform acceleration control negative pressure information, the target uniform speed data, the target uniform speed control negative pressure information, the target uniform deceleration speed data, and the target uniform deceleration control negative pressure information, the target suction nozzle control negative pressure information and the target control speed data corresponding to the motion state information are determined.

2. The wafer arrangement method according to claim 1, characterized in that, Acquire the motion state information of the target wafer during the wafer stacking process, including: Acquire information on the speed change of the target wafer stacking robot during the stacking process; Based on the velocity change information, calculations are performed to determine the motion state information of the target wafer.

3. The wafer arrangement method according to claim 1, characterized in that, Based on the target uniform acceleration speed data, the target uniform acceleration control negative pressure information, the target uniform speed data, the target uniform speed control negative pressure information, the target uniform deceleration speed data, and the target uniform deceleration control negative pressure information, the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: When the motion state information is uniform acceleration motion state information, the target uniform acceleration control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform acceleration speed data is determined as the target control speed data, such that the difference between the target uniform acceleration control negative pressure information and the actual control negative pressure data of the target wafer is less than or equal to a preset control negative pressure difference threshold, and the absolute value of the difference between the actual control acceleration data of the target wafer and the target uniform acceleration speed data is less than or equal to a preset control acceleration difference threshold.

4. The wafer arrangement method according to claim 1, characterized in that, Based on the target uniform acceleration speed data, the target uniform acceleration control negative pressure information, the target uniform speed data, the target uniform speed control negative pressure information, the target uniform deceleration speed data, and the target uniform deceleration control negative pressure information, the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: When the motion state information is uniform motion state information, the target uniform speed control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform speed data is determined as the target control speed data, such that the difference between the target uniform speed control negative pressure information and the actual control negative pressure data of the target wafer is less than or equal to a preset control negative pressure difference threshold, and the absolute value of the difference between the actual control speed data of the target wafer and the target uniform speed data is less than or equal to a preset control speed difference threshold.

5. The wafer arrangement method according to claim 1, characterized in that, Based on the target uniform acceleration speed data, the target uniform acceleration control negative pressure information, the target uniform speed data, the target uniform speed control negative pressure information, the target uniform deceleration speed data, and the target uniform deceleration control negative pressure information, the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information are determined, including: When the motion state information is uniform deceleration motion state information, the target uniform deceleration control negative pressure information is determined as the target suction nozzle control negative pressure information, and the target uniform deceleration speed data is determined as the target control speed data, such that the difference between the target uniform deceleration control negative pressure information and the actual control negative pressure data of the target wafer is less than or equal to a preset control negative pressure difference threshold, and the absolute value of the difference between the actual control deceleration data of the target wafer and the target uniform deceleration speed data is less than or equal to a preset control deceleration difference threshold.

6. A wafer stacking device, characterized in that, include: The acquisition module is used to acquire motion state information of the target wafer during the wafer stacking process; The determination module is used to determine the target suction nozzle control negative pressure information and target control speed data corresponding to the motion state information based on the preset sheet arrangement accuracy index control coefficient and the preset sheet arrangement speed index control coefficient. The control module is used to control the wafer stacking robot based on the target suction nozzle control negative pressure information and the target control speed data; The motion state information includes uniformly accelerated motion state information, uniform motion state information, and uniformly decelerated motion state information; The determining module is used to determine the target nozzle control negative pressure information and target control speed data corresponding to the motion state information based on preset sheet arrangement accuracy index control coefficients and preset sheet arrangement speed index control coefficients, including: The target uniform acceleration control negative pressure information, the target uniform speed control negative pressure information, and the target uniform deceleration control negative pressure information corresponding to the uniform acceleration motion state information, respectively, are determined. Based on the preset control coefficients for the precision index of the film arrangement and the preset control coefficients for the speed index of the film arrangement, the target uniform acceleration speed data corresponding to the uniform acceleration motion state information, the target uniform speed data corresponding to the uniform speed motion state information, and the target uniform deceleration speed data corresponding to the uniform deceleration motion state information are determined. Based on the target uniform acceleration speed data, the target uniform acceleration control negative pressure information, the target uniform speed data, the target uniform speed control negative pressure information, the target uniform deceleration speed data, and the target uniform deceleration control negative pressure information, the target suction nozzle control negative pressure information and the target control speed data corresponding to the motion state information are determined.

7. An electronic device, characterized in that, It includes a processor and a memory, the memory storing a computer program executable by the processor, which, when executing the computer program, performs the steps of the wafer set-out method as described in any one of claims 1-5.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it performs the steps of the wafer set-out method as described in any one of claims 1-5.

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