A flying probe testing apparatus for manufacturing a circuit board and a testing method thereof

Abstract

The present application relates to the technical field of circuit board detection, and particularly relates to a flying probe test equipment for circuit board manufacturing and a test method thereof, comprising a machine table, a test table and an X-axis control console are arranged at the top end of the machine table, a Y-axis control console is in transmission connection with the output end of the X-axis control console, a moving table is in transmission connection with the output end of the Y-axis control console, and a cylinder is installed at the top end of the moving table. Through the structural design of the gas adding mechanism and the fixed-point releasing mechanism, the inert gas with constant pressure in the storage tube is sprayed to the test area after being accelerated by the Laval nozzle at the moment when the probe contacts the circuit board, the airflow can not only maintain the low temperature of the probe tip through convection heat dissipation to prevent high-temperature oxidation, but also form a micro inert atmosphere around the needle tip and the welding point to drive away oxygen, so that oxidation is not caused even if an electric arc is generated, and at the same time, the micro particles can be blown away in time to avoid the attachment of debris, and the contact reliability and the repeat accuracy of the flying probe test are significantly improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board testing technology, and in particular to a flying probe testing device and its testing method for circuit board manufacturing. Background Technology

[0002] Circuit boards are the core components of all electronic products, and their manufacturing quality directly affects the performance of the equipment. As electronic products become increasingly sophisticated and complex, the width and spacing of the conductors on circuit boards are getting smaller and smaller. Any tiny defects such as open circuits or short circuits can lead to product failure. Therefore, circuit boards must undergo 100% electrical performance testing before leaving the factory. Flying probe testers, with their advantages of not requiring special fixtures and flexible programming, have become key testing equipment in this process.

[0003] However, during long-term, high-current aging tests or high-density multi-channel tests, existing flying probe testers experience Joule heating due to contact resistance between the probe and the test point, which can lead to localized and continuous heat accumulation. This may cause the probe tip material to soften and accelerate metal oxidation, thereby affecting test accuracy and probe life. At the same time, tiny metal debris or solder slag generated during frequent contact and energization are prone to splashing and adhering to the probe surface, posing a long-term potential risk to equipment reliability and test stability. Therefore, this application proposes a flying probe test device and its test method for circuit board manufacturing. Summary of the Invention

[0004] The purpose of this invention is to address the problem of heat accumulation in existing flying probe testing machines, and to propose a flying probe testing device and method for circuit board manufacturing.

[0005] In a first aspect, the present invention provides a flying probe testing device for circuit board manufacturing, comprising a machine base, a testing platform and an X-axis control console disposed at the top of the machine base, a Y-axis control console being drivenly connected to the output end of the X-axis control console, a moving stage being drivenly connected to the output end of the Y-axis control console, and a cylinder being mounted at the top of the moving stage, and further comprising: A storage tube for storing inert gas, the output end of the cylinder is connected to the storage tube in a transmission connection, a conveying tube is slidably connected inside the storage tube, a support plate is fixedly connected to the bottom end of the conveying tube, and a probe for detecting the circuit board is connected to the bottom end of the support plate. Multiple air inlets are provided on the outside of the conveying pipe. An air collecting ring is fixed to the outside of the conveying pipe. Multiple air outlets are provided together with the inside of the air collecting ring and the conveying pipe. A flexible tube is fixed to the outside of the air collecting ring. A nozzle connected to a flexible tube is used to pressurize and guide the inert gas probe to the contact area of ​​the circuit board; A gas adding mechanism is used to add inert gas into the interior of the storage tube and maintain a constant internal gas pressure in the storage tube; The fixed-point release mechanism, connected to the delivery tube, is used to release the inert gas inside the storage tube when the probe presses the circuit board.

[0006] Optionally, the gas adding mechanism includes a diaphragm pump, a connecting pipe, a central controller, and a gas detector. The diaphragm pump and the central controller are both connected to the moving stage. The two ends of the connecting pipe are respectively connected to the output end of the diaphragm pump and the storage pipe. The gas detector is installed on the inner wall of the storage pipe. The output end of the central controller is connected to the diaphragm pump and the gas detector.

[0007] Optionally, the fixed-point release mechanism includes a top plate, two sets of guide rods and a spring. The top plate is fixedly connected to the top end of the conveying pipe, and the two ends of the two sets of guide rods are respectively fixedly connected to the inner wall of the storage pipe. The guide rods slide through the top plate, and the spring is fixedly connected between the top end of the top plate and the inner wall of the storage pipe.

[0008] Optionally, the nozzle is integrally stamped from a side tube and a Laval nozzle.

[0009] Optionally, the support plate has an arc groove inside, a connecting plate is provided at the bottom of the support plate, a bolt is threaded inside the connecting plate and fits against the top of the support plate, a connecting rod is fixed inside the connecting plate, a side plate is rotatably connected to the outside of the connecting rod, a circular locking block is fixed to the outside of the side plate, and the outside of the circular locking block is connected to the nozzle.

[0010] Optionally, two sets of limiting blocks are symmetrically arranged on the outer side of the probe. Two sets of limiting rods are slidably connected inside the limiting blocks. A limiting plate is fixed to one end of each limiting rod away from the limiting block. A side rod is fixed to one end of the limiting plate away from the limiting block. The end of the side rod away from the limiting plate is fixed to the bottom end of the moving stage. A spring is fixed between the limiting block and the limiting plate. A linkage mechanism is provided on the outer side of the limiting block. The linkage mechanism is used to make the limiting block slightly clamp the probe when the probe moves down, thereby reducing the shaking of the probe.

[0011] Optionally, the linkage mechanism includes a fixed rod, a guide block, and a crossbar. The fixed rod is fixed to the outside of the limiting block, the guide block is disposed on the outside of the probe, and the two ends of the crossbar are fixed to the probe and the guide block, respectively.

[0012] Optionally, a friction ball is fixedly connected to one end of the fixing rod away from the limiting block, and the friction ball is in contact with the guide block.

[0013] Optionally, the limiting block has a fitting groove on the side opposite to the second spring.

[0014] Secondly, the present invention provides a flying probe testing method for circuit board manufacturing, applied to the flying probe testing equipment for circuit board manufacturing described in the first aspect, the method comprising the following steps: S1. Place the circuit board and perform dual-axis positioning. Place the circuit board on the test stage and drive the moving stage through the X-axis control console and Y-axis control console to move the probe to the target test point in the horizontal plane. S2. The probe is lowered and the jet is triggered. The cylinder is started to drive the storage tube to move down. After the probe contacts the circuit board, the storage tube continues to move down, triggering the fixed-point release mechanism to expose the air inlet. The inert gas in the storage tube is transported to the nozzle through the delivery tube, the gas collecting ring and the flexible tube. After being accelerated by the Laval nozzle, it is sprayed towards the contact area between the probe and the circuit board to complete the cooling, anti-oxidation and cleaning. S3. The linkage clamps the probe to suppress shaking. When the probe moves down, the linkage mechanism drives the guide block to release the pressure on the fixed rod. Spring 2 pushes the two sets of limit blocks to slightly clamp the probe through the fitting groove, reducing the shaking caused by sudden stop. S4. After the test is completed, the cylinder moves upward, spring one pushes the top plate to reset, the air inlet is closed and the air supply stops, spring two retracts, the limit block releases the probe, and the equipment returns to standby mode.

[0015] Compared with the prior art, this application includes at least one of the following beneficial technical effects: This invention, through the structural design of a gas addition mechanism and a fixed-point release mechanism, automatically sprays constant-pressure inert gas from the storage tube into the test area via a Laval nozzle the instant the probe contacts the circuit board. This airflow can maintain the low temperature of the probe tip through convection heat dissipation, preventing high-temperature oxidation, and can also form a micro inert atmosphere around the tip and solder joint, displacing oxygen. Even if an electric arc is generated, oxidation will not occur. At the same time, it can also blow away small particles in time, preventing debris from adhering, which significantly improves the contact reliability and repeatability of flying probe testing.

[0016] Furthermore, the linkage mechanism automatically releases the constraint on the limiting block when the probe moves downward, allowing the spring to push the two sets of limiting blocks to move symmetrically along the limiting rod. The probe is slightly clamped by the fitting groove. This clamping force is strictly controlled and will not hinder the normal downward movement of the probe, but can effectively suppress the shaking caused by the sudden stop of the X-axis or Y-axis control console, allowing the probe to quickly return to center. The wear-resistant and smooth coating and the friction ball design reduce wear, and the fitting groove increases the contact area, thereby improving the stability of probe positioning, testing efficiency and service life. Attached Figure Description

[0017] Figure 1 A schematic diagram of the overall structure of a flying probe testing device for circuit board manufacturing; Figure 2 This is a diagram illustrating the explosion of the mobile station. Figure 3 This is a schematic diagram of the storage tube and gas collecting ring. Figure 4 This is a schematic diagram of the diaphragm pump and the central controller; Figure 5 This is a structural diagram of the connecting plate and the circular locking block; Figure 6 A partial plan view of a flying probe testing device for circuit board manufacturing; Figure 7 This is a bottom view of the mobile station; Figure 8 for Figure 7 A magnified structural diagram at point A; Figure 9 This is a cross-sectional schematic diagram of the limiting block.

[0018] Attached reference numerals: 11. Machine base; 12. Test bench; 13. X-axis control console; 14. Y-axis control console; 15. Moving stage; 16. Cylinder; 21. Storage tube; 22. Delivery tube; 23. Support plate; 24. Probe; 25. Air inlet; 26. Air outlet; 27. Gas collecting ring; 28. Flexible tube; 3. Gas addition mechanism; 31. Diaphragm pump; 32. Connecting pipe; 33. Central controller; 34. Gas detector; 4. Fixed-point release mechanism; 41. Top plate; 42. Guide rod; 43. Spring 1; 5. Nozzle; 51. Side pipe; 52. Laval nozzle; 61. Arc groove; 62. Connecting plate; 63. Bolt; 64. Connecting rod; 65. Side plate; 66. Circular locking block; 71. Limiting block; 72. Limiting rod; 73. Limiting plate; 74. Side rod; 75. Spring 2; 8. Linkage mechanism; 81. Fixed rod; 82. Guide block; 83. Crossbar; 91. Friction ball; 92. Fitting groove. Detailed Implementation

[0019] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0020] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0021] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0022] like Figure 1 and Figure 2 As shown, the present invention proposes a flying probe testing device for circuit board manufacturing, including a machine base 11. The machine base 11 provides installation space for its top structure. The top of the machine base 11 is provided with a test platform 12 and an X-axis control console 13. When flying probe testing of a circuit board is required, the circuit board is first placed on the test platform 12. The output end of the X-axis control console 13 is driven to a Y-axis control console 14, which can drive the Y-axis control console 14 to move along the X-axis. The output end of the Y-axis control console 14 is driven to a moving stage 15, which can control the moving stage 15 to move along the Y-axis, thereby realizing the dual-axis movement function of the moving stage 15. It should be noted that the X-axis control console 13 and the Y-axis control console 14 in this embodiment are conventional means in existing movement technology, which will not be elaborated on further. The top of the moving stage 15 is equipped with a cylinder 16, and the output end of the cylinder 16 can control the connected components to move up and down.

[0023] As one implementation method, such as Figure 3 - Figure 6As shown, the flying probe testing device also includes a storage tube 21 for storing inert gas. The output end of the cylinder 16 is connected to the storage tube 21 for transmission. The cylinder 16 can control the storage tube 21 to move up and down. When performing flying probe testing on the circuit board, the cylinder 16 drives the storage tube 21 to move down. The storage tube 21 is slidably connected to a conveying tube 22. During the downward movement of the storage tube 21, the conveying tube 22 moves down synchronously under the action of gravity. The bottom end of the conveying tube 22 is fixed to a support plate 23. The bottom end of the support plate 23 is connected to a probe 24 for detecting the circuit board. At this time, the probe 24 and the support plate 23 also move down. When the probe 24 contacts and squeezes the circuit board, it can be determined whether there is an electrical signal in that area of ​​the circuit board, thereby completing the flying probe test. It should be noted that the probe 24 in this embodiment is a conventional technique in existing flying probe testing technology, and only one set of probes 24 is shown. The actual number of probes 24 depends on the actual situation.

[0024] Furthermore, such as Figure 3 - Figure 6As shown, the flying probe testing device also includes multiple air inlets 25 located on the outside of the delivery pipe 22, a gas adding mechanism 3, a fixed-point release mechanism 4, and a nozzle 5. The gas adding mechanism 3 is used to add inert gas into the storage pipe 21 and maintain a constant internal air pressure in the storage pipe 21. The inert gas is used to fill the storage pipe 21 with inert gas. The fixed-point release mechanism 4 is connected to the delivery pipe 22 and is used to release the inert gas inside the storage pipe 21 when the probe 24 presses the circuit board. Subsequently, after the probe 24 presses the circuit board, the cylinder 16 controls the storage pipe 21 to continue to move downward. This will trigger the operation of the fixed-point release mechanism 4. In the first state: multiple sets of air inlets 25 are closed by the storage pipe 21, and the inert gas inside the storage pipe 21 will not enter the interior of the air inlets 25. In the second state: when the fixed-point release mechanism 4 is running, the multiple sets of air inlets 25 will move upward with the delivery pipe 22. At this time, the obstruction of the air inlets 25 by the storage pipe 21 is released, and the inert gas inside the storage pipe 21 will enter the interior of the delivery pipe 22 through the air inlets 25. A gas collecting ring 27 is fixedly connected to the outside of the delivery pipe 22, and the gas collecting ring 27 and the interior of the delivery pipe 22 are opened together. There are multiple sets of air outlets 26, and the delivery pipe 22 discharges inert gas through these outlets into the interior of the gas collecting ring 27. It should be noted that the gas collecting ring 27 serves two purposes: firstly, it collects the gas discharged through the multiple outlets 26, and secondly, it limits the upward movement distance of the delivery pipe 22. A flexible tube 28 is fixed to the outer side of the gas collecting ring 27. Finally, the gas collecting ring 27 delivers the collected gas into the interior of the flexible tube 28. The flexible tube 28 then pressurizes the inert gas through the nozzle 5 and blows it towards the contact area between the probe 24 and the circuit board, thereby achieving a triple effect of cooling, anti-oxidation, and cleaning. Among them: Cooling: The airflow generated by the gas can generate convective heat dissipation in the contact area between the probe 24 and the circuit board, thereby maintaining the low temperature of the probe tip 24; Anti-oxidation: The blown inert gas can form a micro inert gas environment at the solder joint between the probe tip 24 and the circuit board, completely displacing oxygen. Without oxygen, even if an arc is generated, it will not cause oxidation, fundamentally ensuring the stability and consistency of each test contact; Cleaning: The airflow sprayed from the nozzle 5 can promptly blow away small particles, avoiding the splashing of small metal fragments or solder slag and their adhesion to the surface of the probe 24.

[0025] Furthermore, such as Figure 4 and Figure 5 As shown, the gas adding mechanism 3 includes a diaphragm pump 31, a connecting pipe 32, a central controller 33, and a gas detector 34. The gas adding mechanism 3 is described in detail below: Both the diaphragm pump 31 and the central controller 33 are connected to the moving platform 15. The two ends of the connecting pipe 32 are connected to the output end of the diaphragm pump 31 and the storage pipe 21, respectively. First, the diaphragm pump 31 draws inert gas from the outside and then transmits the inert gas to the inside of the connecting pipe 32. The connecting pipe 32 then transmits the inert gas into the inside of the storage pipe 21, thereby realizing the function of adding inert gas to the inside of the storage pipe 21. The gas detector 34 is installed on the inner wall of the storage pipe 21. The gas detector 34 can detect the content of inert gas inside the storage pipe 21 in real time. The output end of the central controller 33 is connected to the diaphragm pump 31 and the gas detector 34, respectively. When the inert gas content is insufficient, the gas detector 34 will transmit a signal to the central controller 33, and the central controller 33 will control the diaphragm pump 31 to run again to replenish the inert gas inside the storage pipe 21 in time, thereby achieving a constant gas pressure of inert gas inside the storage pipe 21.

[0026] As one implementation method, such as Figure 4 , Figure 5 and Figure 6 As shown, the fixed-point release mechanism 4 includes a top plate 41, two sets of guide rods 42, and a spring 43. The fixed-point release mechanism 4 is described in detail below: The top plate 41 is fixedly connected to the top end of the conveying pipe 22. The top plate 41, conveying pipe 22, support plate 23, and probe 24 are all connected together. Since the probe 24 cannot move further down after contacting the circuit board, while the storage pipe 21 is still in a downward state under the action of cylinder 16, the storage pipe 21 will move downward outside the top plate 41. When the storage pipe 21 is in contact with the gas collecting ring 27, the air inlet 25 will be fully exposed, and the gas inside the storage pipe 21 will enter the interior of the conveying pipe 22 through the air inlet 25. The two ends of the two sets of guide rods 42 are fixedly connected to the inner wall of the storage pipe 21. The guide rods 42 slide through the top plate 41, and when the storage pipe 21 moves downward, the storage pipe 21 will synchronously drive the two sets of guide rods 42 to move downward. The guide rod 42 slides along the inside of the top plate 41 to ensure that the top plate 41 is stable when the storage tube 21 moves. The spring 43 is fixed between the top of the top plate 41 and the inner wall of the storage tube 21. At the same time, the downward movement of the storage tube 21 will also cooperate with the top plate 41 to squeeze the spring 43, causing the spring 43 to deform and generate elastic potential energy. When the probe 24 is no longer in contact with the circuit board, the spring 43 will stop being squeezed and will release the elastic potential energy, pushing the top plate 41 to move down and reset. The movement of the top plate 41 will drive the delivery tube 22 to move, so that the storage tube 21 will block the air inlet 25 again to prevent the inert gas from leaking. It should be noted that the contact surface between the storage tube 21 and the delivery tube 22 is made of rubber, which has good sealing performance.

[0027] Furthermore, such as Figure 5 and Figure 6 As shown, the nozzle 5 is integrally formed by stamping a side tube 51 and a Laval nozzle 52. The side tube 51 is used to receive the gas delivered from the flexible tube 28. After the gas enters the Laval nozzle 52, the pressure energy of the gas is efficiently converted into kinetic energy by utilizing the special pipe shape of the Laval nozzle 52, which is "contracted first and then expanded". In the contraction section, the airflow space is compressed and the speed is forced to increase. After reaching the narrowest point, the expansion section provides expansion space for the gas. The high-pressure gas will expand rapidly and release its remaining pressure, which is converted into forward speed, thereby forming a high-speed, stable and dense airflow at the outlet.

[0028] Furthermore, such as Figure 5 and Figure 6 As shown, the support plate 23 has an arc groove 61 inside, and a connecting plate 62 is provided at the bottom end of the support plate 23. When adjusting the position of the nozzle 5, the connecting plate 62 can be moved along the outside of the support plate 23. The connecting plate 62 is threaded with a bolt 63 inside, and the bolt 63 fits against the top of the support plate 23. After adjustment, the connecting plate 62 and the support plate 23 are quickly connected together by the bolt 63. A connecting rod 64 is fixed inside the connecting plate 62, and a side plate 65 is rotatably connected to the outside of the connecting rod 64. At the same time, the side plate 65 can also be rotated along the outside of the connecting rod 64 to adjust the height of the nozzle 5. A circular locking block 66 is fixed to the outside of the side plate 65. The outside of the circular locking block 66 is connected to the nozzle 5, and the circular locking block 66 is used to connect the nozzle 5 and the side plate 65 together.

[0029] As one implementation method, such as Figure 7 , Figure 8 and Figure 9As shown, two sets of limiting blocks 71 are symmetrically arranged on the outer side of the probe 24. A linkage mechanism 8 is provided on the outer side of the limiting blocks 71. The linkage mechanism 8 is used to slightly clamp the probe 24 with the limiting blocks 71 when the probe 24 moves downward, reducing the shaking of the probe 24. In the initial state, the two sets of limiting blocks 71 are not in contact with the probe 24, and the linkage mechanism 8 is in a controlling state for the limiting blocks 71. Two sets of limiting rods 72 are slidably connected inside the limiting blocks 71. The device can move along the outside of the limiting rod 72. One end of each limiting rod 72 away from the limiting block 71 is fixed to a limiting plate 73. A side rod 74 is fixed to the end of the limiting plate 73 away from the limiting block 71. The end of the side rod 74 away from the limiting plate 73 is fixed to the bottom end of the moving platform 15. The side rod 74 connects the limiting plate 73 and the limiting rod 72 to the moving platform 15, ensuring that the positions of the limiting plate 73 and the limiting rod 72 do not change. The limiting block 71 and the limiting rod 72... Spring 75 is fixed between the position plates 73. When the linkage mechanism 8 is in a controlled state on the limit block 71, spring 75 is in a compressed state. Then, when the probe 24 is working, that is, when the probe 24 moves down, the probe 24 will drive the linkage mechanism 8 to release the control of the limit block 71. The two sets of springs 75 will release their elastic potential energy at the same time, pushing the two sets of limit blocks 71 to move along the outside of the limit rod 72 and slightly squeezing the probe 24. This reduces the possibility of the probe 24 shaking when it suddenly stops after the X-axis control console 13 or Y-axis control console 14 moves. By slightly and symmetrically squeezing the probe 24, the probe 24 can be quickly placed at the center of the two sets of limit blocks 71 when it shakes slightly, so as to reduce the shaking. It should be noted that the outer sides of the limit block 71 and the probe 24 are coated with a wear-resistant and smooth coating, and the elastic potential energy of spring 75 is low. Therefore, when the two sets of limit blocks 71 squeeze the probe 24, it will not affect the normal downward movement of the probe 24.

[0030] Furthermore, such as Figure 7 and Figure 8 As shown, the linkage mechanism 8 includes a fixed rod 81, a guide block 82, and a crossbar 83. The linkage mechanism 8 is described in detail below: The fixed rod 81 is fixed to the outside of the limiting block 71, and the guide block 82 is set on the outside of the probe 24. In the initial state, the guide block 82 is in a state of compression on the two sets of fixed rods 81, and the fixed rods 81 are in a state of compression on the spring 75 through the limiting block 71. The two ends of the crossbar 83 are fixed to the probe 24 and the guide block 82 respectively. The crossbar 83 connects the probe 24 and the guide block 82 together. When the probe 24 moves down, the probe 24 will drive the guide block 82 to move down through the crossbar 83. As the guide block 82 moves down, the guide block 82 will gradually release the compression on the fixed rod 81. When the spring 75 is no longer under force, it will push the limiting block 71 to slightly compress the probe 24. A friction ball 91 is fixed to the end of the fixed rod 81 away from the limiting block 71. The friction ball 91 fits in close contact with the guide block 82. The design of the friction ball 91 is more rounded and smooth, which can reduce the friction between the fixed rod 81 and the guide block 82, thereby improving the service life of the device.

[0031] Furthermore, such as Figure 8 and Figure 9 As shown, the limiting block 71 has a fitting groove 92 on the side opposite to the spring 75. The curvature of the fitting groove 92 is similar to the curvature of the outer side of the probe 24. Therefore, the fitting groove 92 can provide a larger contact area when the limiting block 71 squeezes the probe 24, and the probe 24 is better protected against shaking.

[0032] A flying probe testing method for circuit board manufacturing, the method comprising the following steps: S1. Place the circuit board and perform dual-axis positioning. Place the circuit board on the test stage 12. Drive the moving stage 15 through the X-axis control console 13 and the Y-axis control console 14 to move the probe 24 to the target test point in the horizontal plane. S2. The probe 24 is lowered and the jet is triggered. The cylinder 16 is started to drive the storage tube 21 to move down. After the probe 24 contacts the circuit board, the storage tube 21 continues to move down, triggering the fixed-point release mechanism 4, so that the air inlet 25 is exposed. The inert gas in the storage tube 21 is transported to the nozzle 5 through the delivery tube 22, the gas collecting ring 27 and the flexible tube 28. After being accelerated by the Laval nozzle 52, it is sprayed towards the contact area between the probe 24 and the circuit board to complete the cooling, anti-oxidation and cleaning. S3. The linkage clamps the probe 24 to suppress shaking. When the probe 24 moves down, the linkage mechanism 8 drives the guide block 82 to release the pressure on the fixed rod 81. The spring 75 pushes the two sets of limit blocks 71 to slightly clamp the probe 24 through the fitting groove 92 to reduce the shaking caused by sudden stop. S4. After the test is completed, the cylinder 16 moves up, the spring 1 43 pushes the top plate 41 to reset, the air inlet 25 is closed and the air supply stops, the spring 2 75 retracts, the limit block 71 releases the probe 24, and the equipment returns to standby mode.

[0033] In this embodiment, when the flying probe testing equipment is working, the circuit board is first placed on the test platform 12. The X-axis control console 13 drives the Y-axis control console 14 to move along the X-axis, and the Y-axis control console 14 then drives the moving platform 15 to move along the Y-axis, realizing the dual-axis positioning of the probe 24. Subsequently, the cylinder 16 drives the storage tube 21 to move downward, and the delivery tube 22, support plate 23 and probe 24 move downward synchronously under the action of gravity. When the probe 24 contacts and squeezes the circuit board, the cylinder 16 continues to drive the storage tube 21 to move downward. At this time, the top plate 41 in the fixed-point release mechanism 4 moves upward relative to the storage tube 21, the guide rod 42 slides and guides, and the spring 43 is compressed, so that multiple sets of air inlets 25 are exposed from the inner wall of the storage tube 21. The storage tube 21 is filled with inert gas at constant pressure by the gas adding mechanism 3. The diaphragm pump 31 injects the gas through the connecting pipe 32. The central controller 33 works with the gas detector 34 to maintain the gas pressure. Then the gas enters the delivery tube 22 through the air inlet 25 and then through multiple sets of air outlets 26. The gas enters the gas collecting ring 27 and is finally delivered to the nozzle 5 via the flexible tube 28. The nozzle 5 consists of a side tube 51 and a Laval nozzle 52, which accelerates the gas and sprays it towards the contact area between the probe 24 and the circuit board to achieve cooling, anti-oxidation, and cleaning. At the same time, the crossbar 83 in the linkage mechanism 8 moves down with the probe 24, causing the guide block 82 to release the pressure on the fixed rod 81. The friction ball 91 reduces friction, and the second spring 75 releases elastic potential energy, pushing the two sets of limit blocks 71 to move along the limit rod 72 towards the probe 24. The probe 24 is slightly clamped by the fitting groove 92 to reduce the shaking of the probe 24. The limit plate 73 and the side rod 74 maintain structural stability. After the test is completed, the cylinder 16 moves up, the first spring 43 resets the delivery tube 22, the air inlet 25 is resealed by the storage tube 21, and the second spring 75 is also recompressed in preparation for the next action. In addition, the position of the nozzle 5 can be adjusted by the arc groove 61, the connecting plate 62, the bolt 63, the connecting rod 64, the side plate 65, and the circular locking block 66.

[0034] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A flying probe testing device for circuit board manufacturing, comprising a machine base (11), wherein a test stage (12) and an X-axis control console (13) are provided at the top of the machine base (11), a Y-axis control console (14) is drivenly connected to the output end of the X-axis control console (13), a moving stage (15) is drivenly connected to the output end of the Y-axis control console (14), and a cylinder (16) is mounted at the top of the moving stage (15), characterized in that, Also includes: A storage tube (21) for storing inert gas is connected to the output end of the cylinder (16) in a transmission connection with the storage tube (21). A conveying tube (22) is slidably connected inside the storage tube (21). A support plate (23) is fixedly connected to the bottom end of the conveying tube (22). A probe (24) for detecting the circuit board is connected to the bottom end of the support plate (23). Multiple sets of air inlets (25) are opened on the outside of the conveying pipe (22). A gas collecting ring (27) is fixedly connected to the outside of the conveying pipe (22). Multiple sets of air outlets (26) are opened together inside the gas collecting ring (27) and the conveying pipe (22). A flexible pipe (28) is fixedly connected to the outside of the gas collecting ring (27). The nozzle (5), connected to the flexible tube (28), is used to pressurize and guide the inert gas probe (24) to the contact area of ​​the circuit board; Gas addition mechanism (3) is used to add inert gas into the interior of storage tube (21) and maintain the internal gas pressure of storage tube (21); The fixed-point release mechanism (4) is connected to the delivery tube (22) and is used to release the inert gas inside the storage tube (21) when the probe (24) presses the circuit board.

2. The flying probe testing device for circuit board manufacturing according to claim 1, characterized in that, The gas adding mechanism (3) includes a diaphragm pump (31), a connecting pipe (32), a central controller (33), and a gas detector (34). The diaphragm pump (31) and the central controller (33) are both connected to the moving platform (15). The two ends of the connecting pipe (32) are respectively connected to the output end of the diaphragm pump (31) and the storage pipe (21). The gas detector (34) is installed on the inner wall of the storage pipe (21). The output end of the central controller (33) is respectively connected to the diaphragm pump (31) and the gas detector (34).

3. The flying probe testing device for circuit board manufacturing according to claim 1, characterized in that, The fixed-point release mechanism (4) includes a top plate (41), two sets of guide rods (42) and a spring (43). The top plate (41) is fixedly connected to the top end of the conveying pipe (22). The two ends of the two sets of guide rods (42) are respectively fixedly connected to the inner wall of the storage pipe (21). The guide rods (42) slide through the top plate (41). The spring (43) is fixed between the top end of the top plate (41) and the inner wall of the storage pipe (21).

4. The flying probe testing device for circuit board manufacturing according to claim 1, characterized in that, The nozzle (5) is integrally formed by stamping a side tube (51) and a Laval nozzle (52).

5. The flying probe testing device for circuit board manufacturing according to claim 1, characterized in that, The support plate (23) has an arc groove (61) inside. The bottom end of the support plate (23) is provided with a connecting plate (62). The connecting plate (62) is threaded with a bolt (63). The bolt (63) is attached to the top end of the support plate (23). The connecting plate (62) is fixedly connected with a connecting rod (64). The connecting rod (64) is rotated with a side plate (65) on the outside. The side plate (65) is fixedly connected with a circular locking block (66) on the outside. The outside of the circular locking block (66) is connected to the nozzle (5).

6. The flying probe testing device for circuit board manufacturing according to claim 1, characterized in that, Two sets of limiting blocks (71) are symmetrically arranged on the outer side of the probe (24). Two sets of limiting rods (72) are slidably connected inside the limiting blocks (71). The ends of the two sets of limiting rods (72) away from the limiting blocks (71) are fixed to a limiting plate (73). The end of the limiting plate (73) away from the limiting blocks (71) is fixed to a side rod (74). The end of the side rod (74) away from the limiting plate (73) is fixed to the bottom end of the moving platform (15). A second spring (75) is fixed between the limiting blocks (71) and the limiting plate (73). A linkage mechanism (8) is arranged on the outer side of the limiting blocks (71). The linkage mechanism (8) is used to make the limiting blocks (71) slightly clamp the probe (24) when the probe (24) moves down, so as to reduce the shaking of the probe (24).

7. The flying probe testing device for circuit board manufacturing according to claim 6, characterized in that, The linkage mechanism (8) includes a fixed rod (81), a guide block (82) and a crossbar (83). The fixed rod (81) is fixed to the outside of the limiting block (71), the guide block (82) is located on the outside of the probe (24), and the two ends of the crossbar (83) are fixed to the probe (24) and the guide block (82) respectively.

8. The flying probe testing device for circuit board manufacturing according to claim 7, characterized in that, A friction ball (91) is fixed to one end of the fixed rod (81) away from the limiting block (71), and the friction ball (91) is in contact with the guide block (82).

9. The flying probe testing device for circuit board manufacturing according to claim 6, characterized in that, The limiting block (71) has a fitting groove (92) on the side away from the second spring (75).

10. A method for testing flying probes in circuit board manufacturing, applied to the flying probe testing equipment for circuit board manufacturing as described in any one of claims 1-9, characterized in that, The method includes the following steps: S1. Place the circuit board and perform dual-axis positioning. Place the circuit board on the test stage (12) and drive the moving stage (15) through the X-axis control console (13) and Y-axis control console (14) to move the probe (24) to the target test point in the horizontal plane. S2. Move the probe (24) down and trigger the jet. Start the cylinder (16) to drive the storage tube (21) down. After the probe (24) contacts the circuit board, the storage tube (21) continues to move down, triggering the fixed-point release mechanism (4) to expose the air inlet (25). The inert gas in the storage tube (21) is transported to the nozzle (5) through the delivery tube (22), the gas collecting ring (27) and the flexible tube (28). After being accelerated by the Laval nozzle (52), it is sprayed towards the contact area between the probe (24) and the circuit board to complete the cooling, anti-oxidation and cleaning. S3. The linkage clamps the probe (24) to suppress shaking. When the probe (24) moves down, the linkage mechanism (8) drives the guide block (82) to release the pressure on the fixed rod (81). The second spring (75) pushes the two sets of limit blocks (71) to slightly clamp the probe (24) through the fitting groove (92) to reduce the shaking caused by the sudden stop. S4. After the test is completed, the cylinder (16) moves up, the spring (43) pushes the top plate (41) to reset, the air inlet (25) is closed and the air supply stops, the spring (75) retracts, the limit block (71) releases the probe (24), and the equipment returns to standby mode.

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