Display module and display device

Abstract

The application discloses a display module and a display device. The display module comprises a display panel, a printed circuit board, a driving chip and a flexible circuit board. A stress release groove is arranged between two adjacent flexible circuit boards to cut off the stress transmission between the areas where the adjacent flexible circuit boards are located and release the stress, thereby improving the problem that the substrate is expanded and shrunk due to temperature change when the flexible circuit board is bonded, the expansion and shrink of the substrate between the bonding areas of the adjacent flexible circuit boards pull each other, and the substrate is wrinkled, and improving the yield and reliability of the display module. The recessed part is formed by recessing at least one side of the flexible circuit board, so as to reduce the mutual influence between the stress generated by the bonding of the flexible circuit board on the substrate and the stress generated by the bonding of the flexible circuit board on the printed circuit board, reduce the influence of the expansion and shrink of the flexible circuit board on the bonding accuracy of the flexible circuit board on the printed circuit board when the flexible circuit board is bonded on the substrate, and improve the use performance of the OLED display product.

Description

Technical Field

[0001] This application relates to the field of displays, specifically to a display module and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a display module and a display device, which aim to improve the performance of OLED display products.

[0005] A first aspect of this application provides a display module, comprising: a display panel including a substrate and a functional layer on the substrate; a printed circuit board located on one side of the display panel in a first direction; a driver chip bonded to the substrate, with multiple driver chips spaced apart in a second direction; and a flexible circuit board, one end of which is bonded to the substrate in the first direction and the other end of which is bonded to the printed circuit board, the flexible circuit board being located on the side of the driver chip closer to the printed circuit board in the first direction, with multiple flexible circuit boards spaced apart in the second direction. The display panel has multiple stress relief grooves, and a stress relief groove is provided between at least two adjacent flexible circuit boards. At least one side of the flexible circuit board in the second direction is recessed to form a recessed portion, and the first and second directions intersect.

[0006] According to the first aspect of this application, stress relief grooves are provided between two adjacent flexible circuit boards.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the edge of the display panel near the printed circuit board is recessed in a first direction toward the direction away from the printed circuit board to form a stress relief groove.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the edge of the stress relief groove includes a first curved section, a second curved section, a third curved section and a fourth curved section arranged sequentially, the first curved section being connected between the edge of the display panel and the second curved section, and the fourth curved section being connected between the third curved section and the edge of the display panel.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the protrusion directions of the first curved segment and the second curved segment are opposite.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the protrusion directions of the third curved segment and the fourth curved segment are opposite.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the edge of the stress relief groove further includes a first straight segment, a second straight segment, and a third straight segment. The first straight segment is connected between the first curved segment and the second curved segment, the second straight segment is connected between the second curved segment and the third curved segment, and the third straight segment is connected between the third curved segment and the fourth curved segment.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the radius of curvature of the first curved segment is less than or equal to the radius of curvature of the second curved segment.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the radius of curvature of the fourth bending segment is less than or equal to the radius of curvature of the third bending segment.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the radius of curvature of the first curved segment is 0.4 mm to 0.6 mm.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the radius of curvature of the second bending segment is 0.6 mm to 0.8 mm.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the radius of curvature of the third bending segment is 0.6 mm to 0.8 mm.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the radius of curvature of the fourth bending segment is 0.4 mm to 0.6 mm.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the display panel includes signal lines, which are spaced apart from the stress relief grooves.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes alignment marks located on both sides of the flexible circuit board, the alignment marks being spaced apart from the stress relief grooves.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the minimum distance between the alignment mark and the stress relief groove is 2mm to 3mm.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the functional layer includes: a metal layer, wherein the orthographic projection of the metal layer onto the substrate is located outside the orthographic projection of the stress relief groove onto the substrate.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the functional layer further includes: an encapsulation layer, wherein the orthographic projection of the metal layer on the substrate is located outside the orthographic projection of the stress relief groove on the substrate.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the flexible circuit board has recesses formed on both sides in the second direction.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the flexible circuit board includes a first side, a second side, and a third side located between the first side and the second side in a first direction. The first side, the second side, and the third side enclose a recessed portion. A first arc segment is provided between the first side and the third side, and / or a second arc segment is provided between the second side and the third side.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the radius of curvature of the first arc segment is 0.5 mm to 1 mm.

[0026] According to any of the foregoing embodiments of the first aspect of this application, the radius of curvature of the second arc segment is 0.5 mm to 1 mm.

[0027] According to any of the foregoing embodiments of the first aspect of this application, the display module has a second reference line extending along a first direction, and two recesses on the same flexible circuit board are symmetrical about the second reference line.

[0028] According to any of the foregoing embodiments of the first aspect of this application, the maximum dimension of the flexible circuit board in the second direction is 45mm to 55mm.

[0029] According to any of the foregoing embodiments of the first aspect of this application, the maximum dimension of the flexible circuit board in the first direction is 10mm to 20mm.

[0030] According to any of the foregoing embodiments of the first aspect of this application, in the same flexible circuit board, the distance between two recesses in the second direction is 20mm to 30mm.

[0031] According to any of the foregoing embodiments of the first aspect of this application, the flexible circuit board includes a first layer and a second layer, which are stacked in the thickness direction of the display module.

[0032] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the first layer plate on the substrate coincides with the orthographic projection of the second layer plate on the substrate.

[0033] An embodiment of the second aspect of this application provides a display device that includes a display module of any of the above embodiments.

[0034] According to an embodiment of this application, the display module includes a display panel, a printed circuit board, a driver chip, and a flexible circuit board. The flexible circuit board is bonded to a substrate and electrically connects the display panel to the printed circuit board. The printed circuit board and the driver chip drive and control the display panel to achieve light emission. Multiple driver chips and flexible circuit boards are arranged at intervals in a second direction, and stress relief grooves are provided between adjacent flexible circuit boards to isolate stress transmission between adjacent flexible circuit board areas and release stress. This improves the problem of substrate wrinkling caused by expansion and contraction due to temperature changes during flexible circuit board bonding, which leads to mutual pulling between the bonding areas of adjacent flexible circuit boards. This improves the yield and reliability of the display module. A recess is formed on at least one side of the flexible circuit board to reduce the mutual influence between the stress generated by bonding the flexible circuit board to the substrate and the stress generated by bonding the flexible circuit board to the printed circuit board. This reduces the impact of expansion and contraction of the flexible circuit board during bonding to the substrate on the bonding accuracy of the flexible circuit board to the printed circuit board, thereby improving the performance of the OLED display product. Attached Figure Description

[0035] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0036] Figure 1 This is a partial top view of a display module provided in an embodiment of this application;

[0037] Figure 2 This is a partial top view of a display module provided in another embodiment;

[0038] Figure 3 This is a partial top view of a display module provided in yet another embodiment;

[0039] Figure 4 yes Figure 1 A magnified view of a portion of the image;

[0040] Figure 5 This is provided in another embodiment. Figure 1 A magnified view of a portion of the image;

[0041] Figure 6 This is a partial top view of the display module provided in another embodiment;

[0042] Figure 7 yes Figure 6 A magnified view of a portion of the image;

[0043] Figure 8 This is provided in another embodiment. Figure 6A magnified view of a portion of the image;

[0044] Figure 9 This is yet another embodiment provided. Figure 6 A magnified view of a portion of the image;

[0045] Figure 10 This is provided in yet another embodiment. Figure 6 A magnified view of a portion of the image.

[0046] Explanation of reference numerals in the attached figures:

[0047] 10. Display module; 11. First reference line; 12. Second reference line;

[0048] 100. Display panel; 110. Stress relief groove; 111. First bending section; 112. Second bending section; 113. Third bending section; 114. Fourth bending section; 115. First straight section; 116. Second straight section; 117. Third straight section; 120. Alignment mark;

[0049] 200. Printed circuit boards;

[0050] 300. Driver chip;

[0051] 400. Flexible circuit board; 410. Recessed portion; 411. First side; 412. Second side; 413. Third side; 414. First arc segment; 415. Second arc segment;

[0052] X, the first direction; Y, the second direction. Detailed Implementation

[0053] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0054] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0055] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0056] This application provides a display module and a display device. The various embodiments of the display module and display device will be described below with reference to the accompanying drawings. The display module may be an organic light-emitting diode (OLED) display module.

[0057] Please see Figure 1 , Figure 1 This is a partial top view of a display module provided in an embodiment of this application.

[0058] like Figure 1As shown, a first aspect of this application provides a display module 10, including: a display panel 100, including a substrate (not shown) and a functional layer (not shown) on the substrate; a printed circuit board 200 (PCB), located on one side of the display panel 100 in a first direction X; a driver chip 300 (Integrated Circuit, IC), bonded to the substrate, with multiple driver chips 300 arranged at intervals in a second direction Y; and a flexible printed circuit board 400. The flexible circuit board 400 is bonded to a substrate at one end in the first direction X and to a printed circuit board 200 at the other end. The flexible circuit board 400 is located on the side of the driver chip 300 in the first direction X that is close to the printed circuit board 200. Multiple flexible circuit boards 400 are arranged at intervals in the second direction Y. The display panel 100 is provided with multiple stress relief grooves 110. At least two adjacent flexible circuit boards 400 are provided with stress relief grooves 110. At least one side of the flexible circuit board 400 in the second direction Y is recessed to form a recessed portion 410. The first direction X and the second direction Y intersect.

[0059] According to an embodiment of this application, the display module 10 includes a display panel 100, a printed circuit board 200, a driver chip 300, and a flexible circuit board 400. The flexible circuit board 400 is bonded to a substrate and electrically connects the display panel 100 to the printed circuit board 200. The printed circuit board 200 and the driver chip 300 drive and control the display panel 100 to achieve light emission and display. Multiple driver chips 300 and flexible circuit boards 400 are arranged at intervals in the second direction Y, and stress relief grooves 110 are provided between two adjacent flexible circuit boards 400 to isolate stress transmission between the areas where adjacent flexible circuit boards 400 are located and to release stress. This improves the problem of wrinkles (e.g., wavy wrinkles) on the display panel 100 caused by the expansion and contraction of the display panel 100 due to temperature changes during bonding with the flexible circuit board 400, which leads to mutual pulling between the bonding areas of adjacent flexible circuit boards 400. This improves the yield and reliability of the display module 10. A recessed portion 410 is formed on at least one side of the flexible circuit board 400 to reduce the interaction between the stress generated when the flexible circuit board 400 is bonded to the display panel 100 and the stress generated when the flexible circuit board 400 is bonded to the printed circuit board 200. This reduces the impact of expansion and contraction of the flexible circuit board 400 during bonding to the display panel 100 on the bonding accuracy of the flexible circuit board 400 on the printed circuit board 200, thereby improving the performance of the OLED display product.

[0060] Optionally, the display module 10 also includes a support film located on the side of the substrate away from the functional layer to support the substrate and improve the structural strength of the substrate.

[0061] Optionally, the ratio of the thickness of the display panel 100 to the thickness of the support film is 0.25 to 0.3. For example, the ratio of the thickness of the display panel 100 to the thickness of the support film is 0.25, 3 / 11, 0.28, or 0.3, to achieve better support for the display panel 100.

[0062] In some optional embodiments, a stress relief groove 110 is provided between each two adjacent flexible circuit boards 400. A stress relief groove 110 is provided between any two adjacent flexible circuit boards 400. For example, four flexible circuit boards 400 are spaced apart in the second direction Y, and a stress relief groove 110 is provided between adjacent flexible circuit boards 400, that is, a total of three stress relief grooves 110 are provided.

[0063] In these optional embodiments, a stress relief groove 110 is provided between two adjacent flexible circuit boards 400 to isolate the stress transmission between the areas where the adjacent flexible circuit boards 400 are located, and to release stress. This improves the problem that the display panel 100 expands and contracts due to temperature changes when it is bonded to the flexible circuit boards 400, and the expansion and contraction of the display panel 100 in the bonding areas of the adjacent flexible circuit boards 400 pulls on each other, causing wrinkles on the display panel 100.

[0064] Please see Figure 2 , Figure 2 This is a partial top view of a display module provided in another embodiment.

[0065] like Figure 2 As shown, optionally, multiple stress relief grooves 110 are provided between two adjacent flexible circuit boards 400 to further isolate the stress transmission between the areas where the adjacent flexible circuit boards 400 are located and to release the stress.

[0066] Please see Figure 3 , Figure 3 This is a partial top view of a display module provided in another embodiment.

[0067] like Figure 3 As shown, optionally, stress relief grooves 110 are provided on both sides of the flexible circuit board 400, so that the display panel 100 forms islands in the area where each flexible circuit board 400 is located, in order to improve the tension between the bonded area and the unbonded area of ​​the display panel 100 when the flexible circuit board 400 is bonded to the display panel 100, which causes wrinkles to form on the display panel 100.

[0068] Optionally, the edge of the display panel 100 near the printed circuit board 200 is recessed in the first direction X toward the direction away from the printed circuit board 200 to form a stress relief groove 110. One end of the stress relief groove 110 in the first direction X penetrates the substrate, thereby improving the stress relief effect and stress barrier capability of the stress relief groove 110.

[0069] Optionally, the stress relief groove 110 is spaced apart from the edge of the display panel 100, that is, the display panel 100 surrounds and forms the stress relief groove 110.

[0070] Optionally, multiple stress relief grooves 110 are spaced apart in the second direction Y, and the edge of the display panel 100 on one side in the first direction X is serrated to improve stress isolation capability.

[0071] Please refer to the following: Figure 1 and Figure 4 , Figure 4 yes Figure 1 A magnified view of a portion of the image.

[0072] like Figure 1 and Figure 4 As shown, in some optional embodiments, the edge of the stress relief groove 110 includes a first curved section 111, a second curved section 112, a third curved section 113 and a fourth curved section 114 arranged sequentially. The first curved section 111 is connected between the edge of the display panel 100 and the second curved section 112, and the fourth curved section 114 is connected between the third curved section 113 and the edge of the display panel 100.

[0073] In these alternative embodiments, the arrangement of the first bending segment 111, the second bending segment 112, the third bending segment 113, and the fourth bending segment 114 reduces stress concentration at the location of the stress relief groove 110, thereby improving the stress relief capacity and structural stability of the stress relief groove 110.

[0074] Optionally, the first curved segment 111 and the second curved segment 112 have opposite protrusion directions to achieve a smooth transition at the edge of the substrate and reduce stress concentration.

[0075] Optionally, the third bending segment 113 and the fourth bending segment 114 have opposite protrusion directions to achieve a smooth transition at the edge of the substrate and reduce stress concentration.

[0076] In some alternative embodiments, the edge of the stress relief groove 110 further includes a first straight segment 115, a second straight segment 116, and a third straight segment 117, wherein the first straight segment 115 connects between the first curved segment 111 and the second curved segment 112, the second straight segment 116 connects between the second curved segment 112 and the third curved segment 113, and the third straight segment 117 connects the third curved segment 113 and the fourth curved segment 114.

[0077] In these alternative embodiments, the arrangement of the first straight segment 115, the second straight segment 116, and the third straight segment 117 makes the edge transition of the stress relief groove 110 smooth, reduces stress concentration, and improves the structural stability of the stress relief groove 110.

[0078] Optionally, the radius of curvature of the first bending segment 111 is less than or equal to the radius of curvature of the second bending segment 112, so that when the substrate is stretched or contracted, the stress at the position of the second bending segment 112 is smaller, thereby improving the structural strength and structural stability of the stress relief groove 110, and thus improving the stress relief capacity and stress isolation capacity of the stress relief groove 110.

[0079] In some optional embodiments, the radius of curvature of the fourth bending segment 114 is less than or equal to the radius of curvature of the third bending segment 113, so that when the substrate is stretched or contracted, the stress at the position of the third bending segment 113 is smaller, thereby improving the structural strength and structural stability of the stress relief groove 110, and thus improving the stress relief capacity and stress isolation capacity of the stress relief groove 110.

[0080] In some alternative embodiments, the radius of curvature of the first curved segment 111 is 0.4 mm to 0.6 mm. For example, the radius of curvature of the first curved segment 111 is 0.4 mm, 0.45 mm, 0.5 mm, or 0.6 mm.

[0081] In these optional embodiments, the radius of curvature of the first bending segment 111 is greater than or equal to 0.4 mm, which can improve the problem that stress concentration easily occurs at the location of the first bending segment 111 when the substrate is stretched or contracted due to the small radius of curvature of the first bending segment 111. The radius of curvature of the first bending segment 111 is less than or equal to 0.6 mm, which can improve the problem that the edge of the stress relief groove 110 is too gentle due to the large radius of curvature of the first bending segment 111, resulting in reduced stress relief and stress isolation capabilities.

[0082] In some alternative embodiments, the radius of curvature of the second curved segment 112 is 0.6 mm to 0.8 mm. For example, the radius of curvature of the second curved segment 112 is 0.6 mm, 0.65 mm, 0.7 mm, or 0.8 mm.

[0083] In these optional embodiments, the radius of curvature of the second bending segment 112 is greater than or equal to 0.6 mm, which can improve the problem that stress concentration easily occurs at the location of the second bending segment 112 when the substrate is stretched or contracted due to an excessively small radius of curvature of the second bending segment 112. The radius of curvature of the second bending segment 112 is less than or equal to 0.8 mm, which can improve the problem that the edge of the stress relief groove 110 is too gentle due to an excessively large radius of curvature of the second bending segment 112, resulting in reduced stress relief and stress isolation capabilities.

[0084] In some alternative embodiments, the radius of curvature of the third bending segment 113 is 0.6 mm to 0.8 mm. For example, the radius of curvature of the third bending segment 113 is 0.6 mm, 0.65 mm, 0.7 mm, or 0.8 mm.

[0085] In these optional embodiments, the radius of curvature of the third bending segment 113 is greater than or equal to 0.6 mm, which can improve the problem that stress concentration easily occurs at the location of the third bending segment 113 when the substrate is stretched or contracted due to an excessively small radius of curvature of the third bending segment 113. The radius of curvature of the third bending segment 113 is less than or equal to 0.8 mm, which can improve the problem that the edge of the stress relief groove 110 is too gentle due to an excessively large radius of curvature of the third bending segment 113, resulting in reduced stress relief and stress isolation capabilities.

[0086] In some alternative embodiments, the radius of curvature of the fourth bending segment 114 is 0.4 mm to 0.6 mm. For example, the radius of curvature of the fourth bending segment 114 is 0.4 mm, 0.45 mm, 0.5 mm, or 0.6 mm.

[0087] In these optional embodiments, the radius of curvature of the fourth bending segment 114 is greater than or equal to 0.4 mm, which can improve the problem that stress concentration easily occurs at the location of the fourth bending segment 114 when the substrate is stretched or contracted due to an excessively small radius of curvature of the fourth bending segment 114. The radius of curvature of the fourth bending segment 114 is less than or equal to 0.6 mm, which can improve the problem that the edge of the stress relief groove 110 is too gentle due to an excessively large radius of curvature of the fourth bending segment 114, resulting in reduced stress relief and stress isolation capabilities.

[0088] Optionally, the display module 10 has a first reference line 11 extending along the first direction X, and the edge of the stress relief groove 110 is symmetrically arranged about the first reference line 11, so that the structure of the stress relief groove 110 is symmetrical, improving the stress distribution of the stress relief groove 110 and improving the structural strength and structural stability of the stress relief groove 110.

[0089] In some optional embodiments, the display panel 100 includes signal lines, which are spaced apart from the stress relief groove 110. For example, the signal lines include power supply voltage signal lines, data signal lines, etc.

[0090] In these alternative embodiments, when the stress relief groove 110 is opened, signal line avoidance design is carried out to avoid interference with the signal line caused by the opening of the stress relief groove 110, so as to ensure the normal function of the signal line.

[0091] Please refer to the following: Figure 1 and Figure 5 , Figure 5This is provided in another embodiment. Figure 1 A magnified view of a portion of the image.

[0092] like Figure 1 and Figure 5 As shown, in some optional embodiments, the display panel 100 further includes alignment marks 120 located on both sides of the flexible circuit board, the alignment marks 120 being spaced apart from the stress relief grooves 110.

[0093] In these alternative embodiments, the alignment mark 120 is provided to facilitate the alignment of the mask or the film layer of the display panel 100. When the stress relief groove 110 is opened, the alignment mark 120 is designed to avoid interference with the alignment mark 120, thus ensuring the normal function of the alignment mark 120.

[0094] In some optional embodiments, the minimum distance D1 between the alignment mark 120 and the stress relief groove 110 is 2 mm to 3 mm. For example, the minimum distance between the alignment mark 120 and the stress relief groove 110 is 2 mm, 2.2 mm, 2.6 mm, or 3 mm.

[0095] In these optional embodiments, the minimum distance between the alignment mark 120 and the stress relief groove 110 is greater than or equal to 2 mm. This can mitigate the impact on the adhesion of the anisotropic conductive film (ACF) caused by an excessively small minimum distance between the alignment mark 120 and the stress relief groove 110, thus ensuring the adhesion effect of the ACF adhesive. The minimum distance between the alignment mark 120 and the stress relief groove 110 is less than or equal to 3 mm. This can mitigate the problem that an excessively large minimum distance between the alignment mark 120 and the stress relief groove 110 results in an excessively small size of the stress relief groove 110, leading to reduced stress relief and stress barrier effects.

[0096] In some alternative embodiments, the functional layer includes a metal layer (not shown) whose orthographic projection onto the substrate is outside the orthographic projection of the stress relief groove 110 onto the substrate.

[0097] In these alternative embodiments, when the stress relief groove 110 is opened, the metal layer is designed to avoid interference with the metal layer and ensure the normal function of the metal layer.

[0098] Optionally, the metal layer may include multiple sublayers, with the signal line located in one of the multiple sublayers.

[0099] Optionally, the alignment mark 120 may be located in one of a plurality of sublayers.

[0100] In some optional embodiments, the functional layer further includes an encapsulation layer (not shown), wherein the metal layer is projected onto the substrate outside the projection of the stress relief groove 110 onto the substrate.

[0101] In these alternative embodiments, when the stress relief groove 110 is opened, the encapsulation layer is designed to avoid interference with the encapsulation layer, thereby ensuring the encapsulation effect of the encapsulation layer.

[0102] Please see Figure 6 , Figure 6 This is a partial top view of a display module provided in another embodiment.

[0103] like Figure 6 As shown, in some optional embodiments, the flexible circuit board 400 has recesses 410 formed on both sides in the second direction Y.

[0104] In these alternative embodiments, two recessed portions 410 are formed on both sides of the flexible circuit board 400 to further reduce the interaction between the stress generated when the flexible circuit board 400 is bonded to the display panel 100 and the stress generated when the flexible circuit board 400 is bonded to the printed circuit board 200. This reduces the impact of the expansion and contraction of the flexible circuit board 400 during bonding to the display panel 100 on the bonding accuracy of the flexible circuit board 400 on the printed circuit board 200, thereby improving the performance of the OLED display product.

[0105] Please refer to the following: Figure 6 and Figure 7 , Figure 7 yes Figure 6 A magnified view of a portion of the image.

[0106] like Figure 6 and Figure 7 As shown, in some optional embodiments, the flexible circuit board 400 includes a first side 411, a second side 412 opposite to each other in a first direction X, and a third side 413 located between the first side 411 and the second side 412. The first side 411, the second side 412 and the third side 413 enclose a recess 410. A first arc segment 414 is provided between the first side 411 and the third side 413, and / or a second arc segment 415 is provided between the second side 412 and the third side 413.

[0107] In these optional embodiments, a first arc segment 414 is provided between the first side 411 and the third side 413, so that the first side 411 and the third side 413 have a smooth transition and reduce stress concentration. A second arc segment 415 is provided between the second side 412 and the third side 413, so that the second side 412 and the third side 413 have a smooth transition and reduce stress concentration, thereby reducing the risk of breakage due to substrate expansion and contraction.

[0108] In some alternative embodiments, the radius of curvature of the first arc segment 414 is 0.5 mm to 1 mm. For example, the radius of curvature of the first arc segment 414 is 0.5 mm, 0.6 mm, 0.8 mm, or 1 mm.

[0109] In these optional embodiments, the radius of curvature of the first arc segment 414 is greater than or equal to 0.5 mm, which can improve the problem that stress concentration and breakage are prone to occur at the position of the first arc segment 414 when the display panel 100 is stretched or contracted due to the excessively small radius of curvature of the first arc segment 414. The radius of curvature of the first arc segment 414 is less than or equal to 1 mm, which can improve the problem that the edge of the recess 410 is too gentle due to the excessively large radius of curvature of the first arc segment 414, resulting in reduced stress release and stress isolation capabilities.

[0110] In some alternative embodiments, the radius of curvature of the second arc segment 415 is 0.5 mm to 1 mm. For example, the radius of curvature of the second arc segment 415 is 0.5 mm, 0.6 mm, 0.8 mm, or 1 mm.

[0111] In these optional embodiments, the radius of curvature of the second arc segment 415 is greater than or equal to 0.5 mm, which can improve the problem that stress concentration and breakage are prone to occur at the position of the second arc segment 415 when the display panel 100 is stretched or contracted due to an excessively small radius of curvature of the second arc segment 415. The radius of curvature of the second arc segment 415 is less than or equal to 1 mm, which can improve the problem that the edge of the recess 410 is too gentle due to an excessively large radius of curvature of the second arc segment 415, resulting in reduced stress release and stress barrier capabilities.

[0112] Please see Figure 6 and Figure 8 , Figure 8 This is provided in another embodiment. Figure 6 A magnified view of a portion of the image.

[0113] like Figure 6 and Figure 8 As shown, optionally, the display module 10 has a second reference line 12 extending along the first direction X, and the two recesses 410 of the same flexible circuit board 400 are symmetrical about the second reference line 12, so that the structure of the two recesses 410 of the flexible circuit board 400 is symmetrical, which improves the stress distribution of the recesses 410 and enhances the structural strength and structural stability of the recesses 410.

[0114] Optionally, the flexible circuit board 400 is symmetrical about the second reference line 12, which improves the stress distribution of the flexible circuit board 400 and enhances its structural strength and stability.

[0115] Please refer to the following: Figure 6 and Figure 9 , Figure 9 This is yet another embodiment provided. Figure 6 A magnified view of a portion of the image.

[0116] like Figure 6 and Figure 9 As shown, in some optional embodiments, the maximum dimension D2 of the flexible circuit board 400 in the second direction Y is 45mm to 55mm. For example, the maximum dimension of the flexible circuit board 400 in the second direction Y is 45mm, 48mm, 50mm, or 55mm.

[0117] In these optional embodiments, the maximum dimension of the flexible circuit board 400 in the second direction Y is greater than or equal to 45 mm, which can improve the problem of insufficient wiring space and difficult wiring caused by an excessively small maximum dimension of the flexible circuit board 400 in the second direction Y. The maximum dimension of the flexible circuit board 400 in the second direction Y is less than or equal to 55 mm, which can improve the problem of a widened stress transmission path between the bonding position of the flexible circuit board 400 at the display panel 100 and the bonding position of the printed circuit board 200, and increased mutual influence between the stresses at both ends of the flexible circuit board 400, caused by an excessively large maximum dimension of the flexible circuit board 400 in the second direction Y.

[0118] In some alternative embodiments, the maximum dimension D3 of the flexible circuit board 400 in the first direction X is 10mm to 20mm. For example, the maximum dimension of the flexible circuit board 400 in the first direction X is 10mm, 13mm, 15mm, or 20mm.

[0119] In these optional embodiments, the maximum dimension of the flexible circuit board 400 in the first direction X is greater than or equal to 10 mm. This can mitigate the problem that if the maximum dimension of the flexible circuit board 400 in the first direction X is too small, the stress transmission path between the bonding position of the flexible circuit board 400 at the display panel 100 and the bonding position of the printed circuit board 200 will be too short, resulting in increased mutual influence between the stresses at both ends of the flexible circuit board 400. If the maximum dimension of the flexible circuit board 400 in the first direction X is less than or equal to 20 mm, this can mitigate the problem that if the maximum dimension of the flexible circuit board 400 in the first direction X is too large, the structural strength and stability of the flexible circuit board 400 will be poor.

[0120] In some alternative embodiments, in the same flexible circuit board 400, the distance D4 between two recesses 410 in the second direction Y is 20mm to 30mm. For example, the distance between two recesses 410 in the second direction Y is 20mm, 25mm, 28mm, or 30mm.

[0121] In these optional embodiments, the distance between the two recesses 410 in the second direction Y is greater than or equal to 20 mm, which can improve the problem that the wiring space of the flexible circuit board 400 is too small and the wiring difficulty is too high when the distance between the two recesses 410 in the second direction Y is too small. The distance between the two recesses 410 in the second direction Y is less than or equal to 30 mm, which can improve the problem that the transmission path between the stress at the bonding position of the flexible circuit board 400 at the display panel 100 and the stress at the bonding position of the printed circuit board 200 is widened when the distance between the two recesses 410 in the second direction Y is too large, and the mutual influence between the stresses at both ends of the flexible circuit board 400 is increased.

[0122] In some alternative embodiments, the flexible circuit board 400 includes a first layer (not shown) and a second layer (not shown), which are stacked in the thickness direction of the display module 10. For example, the second layer is located on the side of the first layer away from the substrate.

[0123] In these alternative embodiments, a first layer board and a second layer board are provided. The two flexible circuit boards 400 can increase the wiring space and facilitate wiring. Some of the traces are routed through the first layer board, and the other part of the traces are routed through vias to the second layer board.

[0124] Optionally, both the first and second layers are provided with recesses 410.

[0125] Optionally, the orthographic projection of the first layer on the substrate coincides with the orthographic projection of the second layer on the substrate, so that the first layer and the second layer can be fabricated using the same mask, simplifying the fabrication process.

[0126] Please refer to the following: Figure 6 and Figure 10 , Figure 10 This is provided in yet another embodiment. Figure 6 A magnified view of a portion of the image.

[0127] like Figure 6 and Figure 10 As shown, optionally, the dimension D5 of the stress relief groove 110 in the first direction X is 1.5mm to 1.8mm. For example, the dimension of the stress relief groove 110 in the first direction X is 1.5mm, 1.6mm, 1.7mm, or 1.8mm.

[0128] In these optional embodiments, the stress relief groove 110 has a dimension greater than or equal to 1.5 mm in the first direction X, which can improve the reduced stress relief and stress isolation capabilities of the stress relief groove 110 caused by its small dimension in the first direction X. The stress relief groove 110 has a dimension less than or equal to 1.8 mm in the first direction X, which can improve the problem that if the stress relief groove 110 is too large in the first direction X, its opening can easily interfere with signal lines or encapsulation layers, causing poor functionality or reliability of the display panel 100 and affecting its normal display.

[0129] Optionally, before the stress relief groove 110 is cut and formed, the functional layer in the area where the stress relief groove 110 is located includes a first support layer, a substrate, a second support layer, a buffer layer, a first insulating layer, a second insulating layer, a third insulating layer, a first touch insulating layer, and a second touch insulating layer, which are stacked sequentially along the thickness direction of the display module 10.

[0130] Optionally, near the stress relief groove 110 in the first direction X, the functional layer includes a first support layer, a substrate, a second support layer, a buffer layer, a first insulating layer, a second insulating layer, a third insulating layer, a first planarization layer, a second planarization layer, a first touch insulating layer, a second touch insulating layer, and a touch encapsulation layer, which are stacked sequentially along the thickness direction of the display module 10.

[0131] The second aspect of this application also provides a display device, including the display module 10 of any of the first aspect embodiments described above. Since the display device provided by the second aspect of this invention includes the display module 10 of any of the first aspect embodiments described above, the display device provided by the second aspect of this invention has the beneficial effects of the display module 10 of any of the first aspect embodiments described above, which will not be elaborated further here.

[0132] The display devices in the embodiments of the present invention include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0133] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display module, characterized in that, include: The display panel includes a substrate and a functional layer located on the substrate; A printed circuit board is located on one side of the display panel in the first direction; A driving chip is bonded to the substrate, and multiple driving chips are arranged at intervals in the second direction; A flexible circuit board, wherein one end of the flexible circuit board is bonded to a substrate in the first direction and the other end is bonded to a printed circuit board, the flexible circuit board is located on the side of the driver chip closer to the printed circuit board in the first direction, and a plurality of flexible circuit boards are arranged at intervals in the second direction. The display panel has multiple stress relief grooves, and at least two adjacent flexible circuit boards are provided with stress relief grooves. The flexible circuit board is recessed on at least one side in the second direction to form a recessed portion, and the first direction and the second direction intersect.

2. The display module according to claim 1, characterized in that, The stress relief groove is provided between each two adjacent flexible circuit boards; Preferably, the stress relief groove is formed by recessing the edge of the display panel near the printed circuit board in the first direction toward the direction away from the printed circuit board.

3. The display module according to claim 1, characterized in that, The edge of the stress relief groove includes a first curved section, a second curved section, a third curved section and a fourth curved section arranged sequentially. The first curved section is connected between the edge of the display panel and the second curved section, and the fourth curved section is connected between the third curved section and the edge of the display panel. Preferably, the first curved segment and the second curved segment protrude in opposite directions; Preferably, the third curved segment and the fourth curved segment protrude in opposite directions; Preferably, the edge of the stress relief groove further includes a first straight segment, a second straight segment, and a third straight segment. The first straight segment connects the first curved segment and the second curved segment, the second straight segment connects the second curved segment and the third curved segment, and the third straight segment connects the third curved segment and the fourth curved segment.

4. The display module according to claim 3, characterized in that, The radius of curvature of the first curved segment is less than or equal to the radius of curvature of the second curved segment; Preferably, the radius of curvature of the fourth curved segment is less than or equal to the radius of curvature of the third curved segment; Preferably, the radius of curvature of the first curved segment is 0.4 mm to 0.6 mm; Preferably, the radius of curvature of the second curved segment is 0.6 mm to 0.8 mm; Preferably, the radius of curvature of the third curved segment is 0.6 mm to 0.8 mm; Preferably, the radius of curvature of the fourth curved segment is 0.4 mm to 0.6 mm.

5. The display module according to claim 1, characterized in that, The display panel includes signal lines, which are spaced apart from the stress relief groove. Preferably, the display panel further includes alignment marks located on both sides of the flexible circuit board, the alignment marks being spaced apart from the stress relief groove; Preferably, the minimum distance between the alignment mark and the stress relief groove is 2mm to 3mm.

6. The display module according to claim 1, characterized in that, The functional layer includes: A metal layer, wherein the orthographic projection of the metal layer onto the substrate is located outside the orthographic projection of the stress relief groove onto the substrate; Preferably, the functional layer further includes: The encapsulation layer, wherein the orthographic projection of the metal layer on the substrate is located outside the orthographic projection of the stress relief groove on the substrate.

7. The display module according to claim 1, characterized in that, The flexible circuit board has recesses on both sides in the second direction to form recessed portions; Preferably, the flexible circuit board includes a first side, a second side, and a third side located between the first side and the second side in a first direction, the first side, the second side, and the third side enclosing to form the recess, a first arc segment between the first side and the third side, and / or a second arc segment between the second side and the third side; Preferably, the radius of curvature of the first arc segment is 0.5 mm to 1 mm; Preferably, the radius of curvature of the second arc segment is 0.5 mm to 1 mm; Preferably, the display module has a second reference line extending along the first direction, and the two recesses of the same flexible circuit board are symmetrical about the second reference line.

8. The display module according to claim 7, characterized in that, The maximum dimension of the flexible circuit board in the second direction is 45mm to 55mm; Preferably, the maximum dimension of the flexible circuit board in the first direction is 10mm to 20mm; Preferably, in the same flexible circuit board, the distance between the two recesses in the second direction is 20mm to 30mm.

9. The display module according to claim 1, characterized in that, The flexible circuit board includes a first layer and a second layer, which are stacked in the thickness direction of the display module. Preferably, the orthographic projection of the first layer on the substrate coincides with the orthographic projection of the second layer on the substrate.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1-9.

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