Anti-static light shielding mylar tape

Abstract

The application discloses a kind of anti-static light-shielding mylar adhesive tapes, which include: functional composite substrate layer, functional composite substrate layer has opposite first surface and second surface, and is provided with a plurality of microporous structures, and the microporous structure is filled with conductive material;Anisotropic conductive adhesive layer is arranged on the first surface of the functional composite substrate layer, and the anisotropic conductive adhesive layer contains uniformly dispersed conductive particles, and the conductive particles can form electrical connection with the conductive material in the microporous structure under pressure state;And metal composite shielding layer is arranged on the second surface of the functional composite substrate layer, and the metal composite shielding layer is in electrical contact with the conductive material in the microporous structure.The anti-static light-shielding mylar adhesive tape realizes significant technical progress and multi-dimensional beneficial effects by constructing the three-layer synergistic structure of "microporous filled conductive material + anisotropic conductive adhesive layer + metal composite shielding layer".

Description

Technical Field

[0001] This invention relates to the field of Mylar tape technology, and in particular to an antistatic and light-shielding Mylar tape. Background Technology

[0002] Mylar tape is an electronic-grade tape made of polyester film (PET) coated with acrylic adhesive. Due to its excellent insulation, temperature resistance, and dimensional stability, it is widely used in the internal fixing, light shielding, insulation, and grounding protection of electronic products such as smartphones, tablets, and laptops. As electronic devices become thinner, more integrated, and more multifunctional, the performance requirements for Mylar tape are increasing, especially antistatic and electromagnetic shielding functions, which have become key indicators of its quality. Existing antistatic Mylar tapes typically employ two methods: one is to coat the PET substrate with an antistatic coating to dissipate surface static charge; the other is to incorporate conductive fillers (such as carbon black or metal powder) into the adhesive to make the adhesive layer conductive, thereby conducting static charge to the grounding terminal.

[0003] However, the aforementioned existing technologies still have the following shortcomings in practical applications: low functional integration, making it difficult to meet multiple needs. Existing products often only achieve a single or two-fold combination of functions, such as light shielding + anti-static, or insulation + electromagnetic shielding, making it difficult to simultaneously meet the multiple requirements of light shielding, anti-static, and electromagnetic shielding. In practical applications, the internal space of electronic devices is extremely limited, often requiring the simultaneous mounting of multiple functional materials such as light-shielding tape, conductive foam, and electromagnetic shielding film. This not only occupies valuable internal space and increases assembly processes and costs, but also presents compatibility and reliability issues between multiple material interfaces. Summary of the Invention

[0004] Therefore, it is necessary to provide an antistatic and light-shielding Mylar tape to address the technical problem that existing Mylar tapes have limited functionality and cannot simultaneously meet the requirements of antistatic and light-shielding.

[0005] An antistatic and light-shielding Mylar tape, comprising: A functional composite substrate layer having opposing first and second surfaces, and having a plurality of microporous structures penetrating or partially penetrating its thickness, wherein the microporous structures are filled with conductive material. An anisotropic conductive adhesive layer is disposed on the first surface of the functional composite substrate layer. The anisotropic conductive adhesive layer contains uniformly dispersed conductive particles, which, under pressure, can form electrical connections with the conductive material within the microporous structure. A metal composite shielding layer is disposed on the second surface of the functional composite substrate layer. The metal composite shielding layer is in electrical contact with the conductive material in the microporous structure, forming a three-dimensional vertical conductive path from the anisotropic conductive adhesive layer through the conductive material in the microporous structure to the metal composite shielding layer.

[0006] In one embodiment, the microporous structure is a frustum-shaped blind hole extending from the first surface to the second surface, with the hole diameter gradually decreasing from the first surface to the second surface. The opening diameter on the first surface is 10-30 μm, and the depth of the blind hole is 50%-90% of the thickness of the functional composite substrate layer.

[0007] In one embodiment, the conductive particles are core-shell structured microspheres, comprising a polymer core, an inner conductive metal layer, and an outer antioxidant metal layer; the conductive particles have a particle size of 5-15 μm, the inner conductive metal layer is a nickel layer or a copper layer with a thickness of 0.2-0.5 μm, and the outer antioxidant metal layer is a gold layer or a palladium layer with a thickness of 0.02-0.05 μm.

[0008] In one embodiment, the metal composite shielding layer is a multilayer metal film structure, comprising an adhesion layer in contact with the second surface of the functional composite substrate layer, a conductive shielding layer disposed on the adhesion layer, and an anti-oxidation protective layer disposed on the conductive shielding layer; the adhesion layer is a nickel-chromium alloy layer with a thickness of 50-100 Å; the conductive shielding layer is a copper layer with a thickness of 0.2-0.5 μm; and the anti-oxidation protective layer is a nickel layer or a graphene layer with a thickness of 100-200 Å.

[0009] In one embodiment, the antistatic and light-shielding Mylar tape further includes an interface bonding layer disposed between the functional composite substrate layer and the metal composite shielding layer, wherein the interface bonding layer is a silane coupling agent modified polyurethane coating with a thickness of 0.5-1.5 μm.

[0010] In one embodiment, the conductive material filling the microporous structure is a composite conductive paste, which comprises flake silver powder, carbon nanotubes and an epoxy resin matrix; the mass percentage of the flake silver powder is 60%-70%, the mass percentage of the carbon nanotubes is 1%-3%, and the mass percentage of the epoxy resin matrix is ​​20%-30%.

[0011] In one embodiment, the functional composite substrate layer is a graphene-modified black polyethylene terephthalate film, wherein the content of graphene nanosheets is 0.5wt%-3wt%, and the surface resistivity of the functional composite substrate layer is 10 Ω·cm. 3 -10 6 Ω / sq, optical density greater than 4.0.

[0012] In one embodiment, the distribution density of conductive particles in the anisotropic conductive adhesive layer is 50-200 particles / mm². 2 The distribution positions of the conductive particles correspond to the distribution positions of the microporous structure.

[0013] In one embodiment, the microporous structure is distributed in an array on the functional composite substrate layer, comprising standard conductive regions and densely conductive regions; the pore density of the standard conductive regions is 1000-5000 pores / cm². 2 The pore density of the densely conductive region is 5000-10000 pores / cm². 2 .

[0014] In one embodiment, the antistatic and light-shielding Mylar tape further includes a release protective layer disposed on the outer surface of the anisotropic conductive adhesive layer, wherein the release protective layer is a fluorinated release film or a PET release film, and the release force is 5-15 g / in.

[0015] The aforementioned antistatic and light-shielding Mylar tape achieves significant technological advancements and multi-dimensional benefits through a three-layer synergistic structure: "micropore-filled conductive material + anisotropic conductive adhesive layer + metal composite shielding layer." First, the functional composite substrate layer ensures high optical density for effective light shielding; the micropores penetrating the substrate are filled with highly conductive paste, creating a low-impedance vertical conductive path; and the metal composite shielding layer provides excellent electromagnetic shielding performance. Second, the precise matching of the anisotropic conductive adhesive layer with the micropore positions achieves conductivity in the thickness direction and insulation in the planar direction. Furthermore, the frustum-shaped micropore design creates an "anchor effect," which, combined with the multi-layer metal film structure and optimized interface bonding layer, significantly improves interlayer bonding strength and bending reliability, meeting the stringent requirements of dynamic applications such as flexible screens. Attached Figure Description

[0016] Figure 1 This is a partial structural diagram of the antistatic and light-shielding Mylar tape in one embodiment. Detailed Implementation

[0017] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0018] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0020] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0021] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0022] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0023] Please see Figure 1 This invention discloses an antistatic and light-shielding Mylar tape, which includes: The functional composite substrate layer 1 has a first surface 11 and a second surface 12 opposite to each other, and is provided with a plurality of microporous structures 13 that penetrate or partially penetrate its thickness, the microporous structures 13 being filled with conductive material. An anisotropic conductive adhesive layer 2 is disposed on the first surface 11 of the functional composite substrate layer 1. The anisotropic conductive adhesive layer 2 contains uniformly dispersed conductive particles, which, under pressure, can form an electrical connection with the conductive material within the microporous structure 13. A metal composite shielding layer 3 is disposed on the second surface 12 of the functional composite substrate layer 1. The metal composite shielding layer 3 is in electrical contact with the conductive material in the microporous structure 13, forming a three-dimensional vertical conductive path from the anisotropic conductive adhesive layer 2 through the conductive material in the microporous structure 13 to the metal composite shielding layer 3.

[0024] This solution connects the upper and lower layers through micropores penetrating the substrate, creating a complete Z-axis conductive path. This structure solves the problem of traditional Mylar tape's lack of conductivity in the thickness direction, achieving vertical electrostatic dissipation from the adhesive surface to the shielding layer. Simultaneously, the metal shielding layer provides excellent electromagnetic shielding, and the light-shielding substrate ensures optical performance. The three-layer structure works synergistically, integrating light-shielding, anti-static, and electromagnetic shielding functions into a single, mutually reinforcing system, rather than simply adding them together.

[0025] Furthermore, the microporous structure 13 is a frustum-shaped blind hole extending from the first surface 11 to the second surface 12, with its diameter gradually decreasing from the first surface 11 to the second surface 12. The opening diameter of the first surface 11 is 10-30 μm, and the depth of the blind hole is 50%-90% of the thickness of the functional composite substrate layer 1. Using frustum-shaped blind holes instead of through holes increases the contact area between the conductive material and the hole wall, improving adhesion and conductivity reliability. It also prevents the metal shielding layer from being penetrated and damaged, maintaining the integrity of the shielding layer. The optimized design of the hole diameter and depth ensures the formation of conductive pathways while maximizing the mechanical strength of the substrate, preventing the tape from tearing at the micropores when bent.

[0026] Furthermore, the conductive particles are core-shell structured microspheres, comprising a polymer core, an inner conductive metal layer, and an outer antioxidant metal layer. The particle size of the conductive particles is 5-15 μm. The inner conductive metal layer is a nickel or copper layer with a thickness of 0.2-0.5 μm, and the outer antioxidant metal layer is a gold or palladium layer with a thickness of 0.02-0.05 μm. This multi-layered core-shell structure gives the conductive particles both excellent conductivity and oxidation resistance. The polymer core ensures that the particles can deform appropriately under pressure, forming reliable contact with the conductive material within the micropores. The nickel / copper inner layer provides the main conductive path, while the gold / palladium outer layer significantly reduces contact resistance and prevents oxidation failure during long-term use, significantly improving the reliability and lifespan of the product.

[0027] Furthermore, the metal composite shielding layer 3 is a multilayer metal film structure, including an adhesion layer 31 in contact with the second surface 12 of the functional composite substrate layer 1, a conductive shielding layer 32 disposed on the adhesion layer 31, and an anti-oxidation protective layer 33 disposed on the conductive shielding layer 32. The adhesion layer 31 is a nickel-chromium alloy layer with a thickness of 50-100 Å; the conductive shielding layer 32 is a copper layer with a thickness of 0.2-0.5 μm; and the anti-oxidation protective layer 33 is a nickel layer or a graphene layer with a thickness of 100-200 Å. The multilayer metal film structure, rather than a single metal layer, solves the problem of interfacial bonding between different metal materials. The nickel-chromium alloy layer has excellent adhesion to the polymer substrate; the copper layer provides excellent conductivity and shielding effectiveness (surface resistance <0.1 Ω / sq); and the nickel layer or graphene protective layer effectively prevents oxidation of the copper layer, ensuring that the shielding performance does not degrade during long-term use. This composite design balances process feasibility, performance, and durability.

[0028] Furthermore, the antistatic and light-shielding Mylar tape also includes an interface bonding layer 4 disposed between the functional composite substrate layer 1 and the metal composite shielding layer 3. The interface bonding layer 4 is a silane coupling agent modified polyurethane coating with a thickness of 0.5-1.5 μm. The introduction of the interface bonding layer 4 solves the problem of large differences in thermal expansion coefficients and insufficient bonding strength between the polymer substrate and the metal layer. One end of the silane coupling agent molecule reacts with the organic groups of the substrate, and the other end forms a chemical bond with the metal layer, forming a "molecular bridge" structure, which significantly enhances the interlayer bonding strength and prevents interlayer delamination under high temperature, high humidity, or bending conditions.

[0029] Furthermore, the conductive material filling the microporous structure 13 is a composite conductive paste, which comprises flake silver powder, carbon nanotubes, and an epoxy resin matrix; the mass percentage of the flake silver powder is 60%-70%, the mass percentage of the carbon nanotubes is 1%-3%, and the mass percentage of the epoxy resin matrix is ​​20%-30%. The flake silver powder forms a surface-contact conductive network within the micropores, resulting in high conductivity; the carbon nanotubes interweave and connect the silver powder flakes, forming a three-dimensional conductive network and significantly improving the fatigue resistance and flexibility of the filler. Even if microcracks develop during tape bending, the carbon nanotubes can still maintain the continuity of the conductive pathway, ensuring conductive reliability under dynamic usage conditions.

[0030] Furthermore, the functional composite substrate layer 1 is a graphene-modified black polyethylene terephthalate film, wherein the content of graphene nanosheets is 0.5wt%-3wt%, and the surface resistivity of the functional composite substrate layer 1 is 10 Ω·cm. 3 -10 6 With an Ω / sq and an optical density greater than 4.0, graphene is directly dispersed in a PET substrate, imparting inherent conductivity to the substrate and creating planar electrostatic dissipation capabilities that complement the vertical conductive pathways. Simultaneously, the addition of graphene enhances the substrate's mechanical strength and thermal conductivity, aiding in device heat dissipation. Integrating multiple functions such as light shielding, planar conductivity, mechanical enhancement, and thermal conductivity into the substrate simplifies the structure and reduces costs.

[0031] Furthermore, the distribution density of conductive particles in the anisotropic conductive adhesive layer 2 is 50-200 particles / mm². 2 The distribution of the conductive particles corresponds to the distribution of the microporous structure 13. Matching the distribution of conductive particles to the positions of the micropores achieves precise rather than random conductivity, ensuring that each micropore has sufficient conductive particles in contact with it. This avoids the problems of wasted conductive particles and uncertain conductivity probability in traditional anisotropic conductive adhesives. While ensuring conductivity reliability, it can reduce the amount of conductive particles used, saving costs.

[0032] Furthermore, the microporous structure 13 is distributed in an array on the functional composite substrate layer 1, including standard conductive regions 131 and densely conductive regions 132; the pore density of the standard conductive regions 131 is 1000-5000 pores / cm². 2 The pore density of the densely conductive region 132 is 5000-10000 pores / cm². 2 In one embodiment, the placement locations of the standard conductive region 131 and the densely conductive region 132 are arbitrarily set according to actual needs. By designing different hole densities in a partitioned manner, on-demand conductivity is achieved. Densely conductive regions are set in areas requiring critical grounding protection (such as the location of sensitive chips) to provide multiple parallel vertical conductive paths, ensuring grounding reliability even if individual paths fail. Standard conductive regions are used in non-critical areas, satisfying basic electrostatic dissipation requirements while avoiding excessive hole openings that could affect substrate strength. This differentiated design achieves an optimal balance between performance and reliability.

[0033] Furthermore, the antistatic and light-shielding Mylar tape also includes a release protective layer 5 disposed on the outer surface of the anisotropic conductive adhesive layer 2. The release protective layer 5 is a fluoropolymer release film or a PET release film, with a release force of 5-15 g / in. The release force of the release protective layer 5 is precisely controlled within the range of 5-15 g / in, ensuring that it will not accidentally detach during storage and transportation, and that it can be easily peeled off during application without generating static electricity or residual adhesive residue. Fluoropolymer release films are suitable for silicone systems, while PET release films are suitable for acrylic systems. The appropriate release film can be flexibly selected based on the adhesive layer formulation to ensure compatibility between the release layer and the adhesive layer.

[0034] In summary, the antistatic and light-shielding Mylar tape disclosed in this invention achieves significant technological advancements and multi-dimensional beneficial effects by constructing a three-layer synergistic structure of "micropore-filled conductive material + anisotropic conductive adhesive layer + metal composite shielding layer." First, the functional composite substrate layer ensures high optical density for sufficient light shielding; the micropores penetrating the substrate are filled with highly conductive paste, constructing a low-impedance vertical conductive path; and the metal composite shielding layer provides excellent electromagnetic shielding performance. Second, through precise matching of the anisotropic conductive adhesive layer with the micropore positions, the characteristics of conductivity in the thickness direction and insulation in the planar direction are achieved. Furthermore, the frustum-shaped micropore design forms an "anchor effect," which, combined with the multi-layer metal film structure and optimized interface bonding layer, significantly improves interlayer bonding strength and bending reliability, meeting the stringent requirements of dynamic application scenarios such as flexible screens.

[0035] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0036] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. An antistatic, light-shielding Mylar tape, characterized in that, include: A functional composite substrate layer having opposing first and second surfaces and having a plurality of microporous structures filled with conductive material. An anisotropic conductive adhesive layer is disposed on the first surface of the functional composite substrate layer. The anisotropic conductive adhesive layer contains uniformly dispersed conductive particles, which, under pressure, can form electrical connections with the conductive material within the microporous structure. A metal composite shielding layer is disposed on the second surface of the functional composite substrate layer, and the metal composite shielding layer is in electrical contact with the conductive material in the microporous structure.

2. The antistatic and light-shielding Mylar tape according to claim 1, characterized in that, The microporous structure is a frustum-shaped blind hole extending from the first surface to the second surface, and its diameter gradually decreases from the first surface to the second surface.

3. The antistatic and light-shielding Mylar tape according to claim 2, characterized in that, The conductive particles are core-shell structured microspheres, comprising a polymer core, an inner conductive metal layer, and an outer antioxidant metal layer.

4. The antistatic and light-shielding Mylar tape according to claim 3, characterized in that, The metal composite shielding layer is a multilayer metal film structure, which includes an adhesion layer in contact with the second surface of the functional composite substrate layer, a conductive shielding layer disposed on the adhesion layer, and an anti-oxidation protective layer disposed on the conductive shielding layer.

5. The antistatic and light-shielding Mylar tape according to claim 4, characterized in that, The antistatic and light-shielding Mylar tape also includes an interface bonding layer disposed between the functional composite substrate layer and the metal composite shielding layer.

6. The antistatic and light-shielding Mylar tape according to claim 5, characterized in that, The conductive material filling the microporous structure is a composite conductive paste, which includes flake silver powder, carbon nanotubes and an epoxy resin matrix.

7. The antistatic and light-shielding Mylar tape according to claim 6, characterized in that, The functional composite substrate layer is a graphene-modified black polyethylene terephthalate film.

8. The antistatic and light-shielding Mylar tape according to claim 7, characterized in that, The distribution density of conductive particles in the anisotropic conductive adhesive layer is 50-200 particles / mm². 2 .

9. The antistatic and light-shielding Mylar tape according to claim 8, characterized in that, The microporous structure is distributed in an array on the functional composite substrate layer, including standard conductive regions and densely conductive regions.

10. The antistatic and light-shielding Mylar tape according to claim 9, characterized in that, The antistatic and light-shielding Mylar tape also includes a release protective layer disposed on the outer surface of the anisotropic conductive adhesive layer.

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