Powder-impregnated electrode copper bar and injection molding process thereof

Abstract

The present application relates to the technical field of conductive connecting member, and discloses a powder immersed electrode copper bar, which comprises at least two copper bars, the outer surface of the copper bar is provided with an insulation layer formed by a powder immersion process, one end of a plurality of the copper bars is integrally connected through an injection molding part, and a anti-disengagement fitting structure is arranged between the injection molding part and the copper bar, the anti-disengagement fitting structure is arranged between the injection molding part and the copper bar to multi-directionally constrain the relative displacement of the two, thereby significantly improving the bonding strength, and effectively avoiding peeling and falling under vibration and cold and hot alternating conditions, a sealing groove and a glue sealing groove filled with a sealing element are arranged at both ends of the injection molding part, the sealing groove and the glue sealing groove can completely seal the joint gaps of the injection molding part, the copper bar and the insulation layer, water vapor, salt mist and dust are prevented from invading the copper matrix, the high-voltage insulation safety is improved, and the tail part is provided with a spacing-adjustable positioning element, the distance between the copper bars can be flexibly adjusted, and the device demand of different voltage grades and installation spaces can be adapted.

Description

Technical Field

[0001] This invention relates to the field of conductive connection components, and in particular to a copper busbar dipped in powder and its injection molding process. Background Technology

[0002] In core high-voltage systems such as drive motor controllers, high-voltage power distribution units, and power battery packs in new energy vehicles, irregularly shaped bent copper busbars are key conductive components for achieving high current transmission and power distribution. Due to the limitations of compact installation space and different device layouts in vehicles, copper busbars often adopt non-standard three-dimensional bending shapes. The industry generally uses epoxy powder impregnation process to prepare an insulating layer on the surface of the copper busbar, taking into account both conductor insulation and metal corrosion protection. At the same time, an insulating base is integrally injection molded at the end of the copper busbar, integrating multiple copper busbars into a standardized component. This fixes the safety spacing between phases, improves modular assembly efficiency, and adapts to the needs of mass production in vehicles and platform-based development of the entire vehicle.

[0003] However, existing powder-impregnated copper busbar injection molding assemblies have core technological shortcomings, making it difficult to simultaneously ensure insulation reliability under harsh automotive conditions and adaptability to multiple vehicle platforms. They also fail to meet the ever-increasing safety and cost requirements of high-voltage systems in new energy vehicles. The interface between the powder-impregnated insulation layer and the injection-molded part is often a directly exposed butt joint structure, lacking effective sealing and transition protection. Under complex conditions such as long-term vibration, high and low temperature cycling, and salt spray and humidity in vehicles, moisture and pollutants can easily penetrate the copper substrate along the joint gap, causing copper busbar oxidation, insulation layer peeling and delamination, resulting in safety risks such as shortened creepage distance and insulation breakdown, directly affecting the stability of electrical operation. Summary of the Invention

[0004] This invention addresses the shortcomings of existing technologies by providing a powder-impregnated electrode copper busbar and its injection molding process. It solves the technical problems of insufficient sealing protection at the joints of existing powder-impregnated injection molded copper busbars, which are prone to failure, and the fixed phase spacing which cannot flexibly adapt to multiple scenarios. While improving the insulation reliability and long service life of the copper busbar, it enhances the product's universal adaptability and reduces the development cost of multiple specifications.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A powder-impregnated electrode copper busbar includes at least two copper busbars. The outer surface of each copper busbar is provided with an insulating layer formed by a powder impregnation process. One end of each copper busbar is integrally connected by an injection molded part. An anti-detachment fitting structure is provided between the injection molded part and the copper busbar. A sealing and protective structure is provided at the junction of the injection molded part and the insulating layer. The other end of each copper busbar is provided with a positioning member with adjustable spacing. The positioning member is used to maintain a set spacing between the copper busbars. The device also includes a support column that cooperates with the positioning member. The support column is used to realize the positioning and installation of the copper busbar assembly.

[0006] Preferably, the copper busbar is provided with anti-groove holes and anti-detachment holes. During injection molding, the molten material is filled into the anti-groove holes and anti-detachment holes to form the anti-detachment interlocking structure. After the injection material is filled into the hole and solidified, it forms a plastic insert, which can constrain the relative displacement of the injection molded part and the copper busbar in multiple directions, significantly improve the bonding strength between the two, and avoid peeling and falling off under vibration and alternating hot and cold conditions.

[0007] Preferably, the copper busbar is provided with a sealing groove around the end of the injection molded part away from the insulating layer. The injection molding material is filled into the sealing groove to form a closed structure at that end of the injection molded part. The injection molding material filling the groove forms a ring-shaped interlocking closed structure, which can eliminate the assembly gap between the injection molded part port and the copper busbar substrate, prevent moisture and dust from penetrating into the injection molded part, and further enhance the port's anti-peeling ability.

[0008] Preferably, the injection molded part includes an injection base, and a sealing groove is formed around one end of the injection base corresponding to the insulating layer. The end of the insulating layer extends into the sealing groove. The sealing and protective structure includes a sealing element filled in the sealing groove. After the end of the insulating layer extends into the sealing groove, the sealing element can completely seal the connection gap between the injection molded part and the insulating layer, prevent external contaminants from intruding into the copper substrate, and at the same time eliminate insulation steps, extend the surface creepage path, and improve high voltage insulation safety.

[0009] Preferably, the sealing groove is an inner conical groove, and the sealing element is an insulating sealing body formed by secondary injection molding. The inner conical groove can increase the contact area of ​​the sealing element and also play a guiding role during glue injection, making the filling more full and defect-free. The secondary injection molded sealing element is firmly bonded, not easy to fall off after long-term use, and has higher sealing reliability.

[0010] Preferably, the positioning component includes a first plate and a second plate arranged opposite to each other. Both the first plate and the second plate are provided with mating holes for the ends of the copper busbars to pass through. The two plates are respectively fitted onto the ends of the corresponding copper busbars, providing a structural carrier for spacing adjustment. At the same time, the relative positions of the copper busbars can be initially constrained. The assembly and connection are convenient and the positioning foundation is stable.

[0011] Preferably, the first plate is provided with a locking member and an adjusting plate. The locking member is threadedly connected to the first plate and presses and fixes the adjusting plate to the surface of the first plate. The adjusting plate is provided with a strip-shaped adjusting hole. The second plate is provided with a mating end block located in the adjusting hole. Rotating the adjusting plate can drive the second plate closer to or away from the first plate through the mating end block.

[0012] Preferably, the first plate is further provided with a limiting groove, and the second plate is provided with a limiting end block. The limiting end block is movably located in the limiting groove to form a sliding guide fit.

[0013] Preferably, both the first plate and the second plate are provided with mounting holes, the end of the copper busbar is a wiring part, the wiring part is provided with wiring holes, the support column can pass through the mounting hole and the wiring hole in sequence to realize the positioning and fixing of the positioning component and the copper busbar. The support column passes through the mounting hole and the copper busbar wiring hole in sequence to lock the relative position of the positioning component and the copper busbar at the same time, and realize the suspended and insulated installation of the entire copper busbar assembly, ensuring the safe insulation distance between the copper busbar and the equipment housing.

[0014] An injection molding process for preparing copper busbars dipped in powder coating, characterized by comprising the following steps: S1: The area of ​​the copper busbar to be injected is shielded at high temperature, and the remaining area is cured to form an insulating layer through a fluidized bed powder dipping process; S2: Remove the shielding, place the copper busbar to be injected into the injection mold, adjust and lock the spacing between the copper busbars through the positioning parts, and inject the main body of the injection molded part in one injection. S3: A secondary sealant is filled into the sealing groove of the injection molded part to complete the sealing and protection at the junction of the injection molded part and the insulation layer.

[0015] Compared with the prior art, the present invention has the following beneficial effects: This invention significantly improves the bonding strength by setting an anti-detachment interlocking structure between the injection molded part and the copper busbar, which restricts the relative displacement of the two in multiple directions. It can effectively prevent peeling and detachment under vibration and alternating hot and cold conditions. Sealing grooves and sealing grooves filled with sealant are set at both ends of the injection molded part, which can completely seal the connection gap between the injection molded part, the copper busbar, and the insulation layer, preventing moisture, salt spray, and dust from penetrating the copper substrate. At the same time, it eliminates insulation steps, extends the surface creepage path, and improves the safety of high-voltage insulation. The tail is equipped with an adjustable positioning component, which can flexibly adjust the phase distance between the copper busbars to adapt to the equipment requirements of different voltage levels and installation spaces, and greatly reduce the mold development cost of multi-specification products. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is an exploded view of the overall structure of the present invention; Figure 3 This is a view of the copper busbar structure of the present invention; Figure 4 This is a structural view of the injection molded part of the present invention; Figure 5This is a structural view of the positioning component of the present invention; Figure 6 This is a separate view of plate body one and plate body two of the present invention; Figure 7 This is a bottom view of the positioning element of the present invention.

[0018] Drawing number explanation: 1. Copper busbar; 11. Wiring part; 12. Wiring hole; 13. Anti-groove hole; 14. Sealing groove; 15. Anti-detachment hole; 2. Insulation layer; 3. Injection molded part; 31. Injection molded base; 32. Sealing groove; 33. Sealing element; 4. Positioning element; 41. Plate body one; 42. Plate body two; 43. Mating hole; 44. Locking element; 45. Adjusting plate; 451. Adjusting hole; 46. Mating end block; 47. Limiting groove; 48. Limiting end block; 49. Mounting hole; 5. Support column. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to the accompanying drawings.

[0020] The following description is intended to disclose the invention so that those skilled in the art can implement it. The preferred embodiments described below are merely examples, and other obvious modifications will be apparent to those skilled in the art. The basic principles of the invention defined in the following description can be used in other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the invention.

[0021] Those skilled in the art should understand that, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or position based on the orientation or positional relationship shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing this invention and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on this invention.

[0022] It is understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple, and the term "a" should not be understood as a limitation on the number.

[0023] Example: Please see Figure 1-7 A copper busbar dipped in powder coating includes at least two copper busbars 1. The copper busbars 1 are formed by stamping and bending high-conductivity copper or brass plates. An insulating layer 2 is provided on the outer surface of the busbars. The insulating layer 2 is formed by curing epoxy powder fluidized bed dip coating process. Its thickness ensures that it has good electrical insulation performance and atmospheric corrosion protection after dip coating.

[0024] Multiple copper busbars 1 are integrally connected at one end by injection molded parts 3 to form a standardized copper busbar assembly. An anti-detachment interlocking structure is provided between the injection molded parts 3 and the copper busbars 1 to improve the bonding strength between the two and prevent long-term peeling under stress. A sealing and protective structure is provided at the joint between the injection molded parts 3 and the insulation layer 2 to seal the joint gap and prevent external pollutants from entering.

[0025] The other end of multiple copper busbars 1 is fitted with a positioning element 4 with adjustable spacing to maintain a set safe phase-to-phase distance between two copper busbars 1. An insulating support column 5 is provided. The support column 5 cooperates with the positioning element 4 to fix the relative position of the positioning element 4 and the copper busbar 1, and can also insulate the entire copper busbar assembly on the equipment housing.

[0026] Both ends of the copper busbar 1 are flat terminal parts 11, and the terminal parts 11 are provided with elongated terminal holes 12 for conductive connection with external electrical terminals via bolts. The elongated hole design can compensate for assembly tolerances. At least one set of anti-grooving holes 13 and anti-detachment holes 15 are provided on the copper busbar 1 corresponding to the area covered by the injection molded part 3. Both are through holes that penetrate the thickness direction of the copper busbar 1. During injection molding, the molten insulating plastic will completely fill the internal space of the anti-grooving holes 13 and anti-detachment holes 15. After cooling and solidification, a plastic insert penetrating through the top and bottom is formed, which constitutes an anti-detachment interlocking structure. This structure can constrain the relative displacement of the injection molded part 3 and the copper busbar 1 in multiple axial and radial directions. Compared with simple planar bonding, the bonding strength is improved, which can effectively prevent the injection molded part 3 and the copper busbar 1 from peeling off under vibration or alternating hot and cold temperatures.

[0027] The copper busbar 1 corresponds to the end of the injection molded part 3 away from the insulating layer 2, that is, the root position of the outer wiring part 11. A concave sealing groove 14 is provided around the base of the copper busbar 1. During the molding process of the injection molded part 3, the molten plastic will fill the interior of the sealing groove 14. After solidification, it forms a ring-shaped fitted closed structure, eliminating the assembly gap between the port of the injection molded part 3 and the base of the copper busbar 1, preventing moisture and dust from seeping into the interior of the injection molded part 3 along the port, and further enhancing the peel resistance of the port of the injection molded part 3.

[0028] The insulating layer 2 covers the outer surface of the middle wiring section and the tail wiring part 11 of the copper busbar 1. The area on the copper busbar 1 used for molding the injection molded part 3 and the electrical connection contact surface of the wiring part 11 are bare copper and no insulating layer 2 is set. During the powder dipping process, high-temperature resistant silicone tape or other methods can be used to fully cover and shield the non-powder-dipping area to ensure that the boundary of the bare copper area is neat and there is no powder residue after powder dipping, thus ensuring the subsequent injection molding bonding force and electrical contact performance.

[0029] The main body of the injection molded part 3 is the injection molded base 31. The injection molded base 31 is made of engineering plastic in one injection molding and has the characteristics of high strength, high temperature resistance, high insulation and aging resistance. It can simultaneously realize the mechanical fixation, phase insulation isolation and installation reference positioning of multiple copper busbars 1. At one end of the injection molded base 31 corresponding to the end of the insulation layer 2, a sealing groove 32 is opened around the insertion position of each copper busbar 1. The sealing groove 32 is an inwardly narrowing inner conical groove. The large opening of the groove faces the side of the insulation layer 2 and the small end faces the inside of the injection molded base 31. After one injection molding is completed, the corresponding end of the insulation layer 2 extends into the inside of the sealing groove 32. A uniform filling gap is reserved between the end face of the insulation layer 2 and the bottom of the sealing groove 32.

[0030] The sealing and protective structure includes a sealing element 33 filled in the sealing groove 32. The sealing element 33 can be made of the same grade of engineering plastic as the injection molded seat 31, or it can be made of high temperature resistant modified elastic material. It is injected into the gap of the sealing groove 32 under low pressure through a secondary injection molding process. After cooling and curing, it completely fills the annular gap between the end of the insulation layer 2 and the injection molded seat 31, forming a continuous annular sealing structure.

[0031] The inner conical sealing groove 32 can increase the contact area between the sealant 33 and the injection seat 31, improve the bonding strength of the sealant 33 and prevent it from falling off. On the other hand, it plays a guiding role in the secondary injection process, so that the molten material can be evenly filled into all corners of the groove, avoiding sealing defects such as air bubbles and material shortage.

[0032] By filling the sealant 33, the gap at the junction of the injection molded part 3 and the insulation layer 2 can be completely sealed, preventing water vapor, salt spray, and dust from entering the copper busbar 1 substrate along the gap and causing oxidation and corrosion. At the same time, the exposed end face of the insulation layer is completely covered, eliminating right-angle insulation steps, extending the surface creepage path, and improving insulation safety under high-voltage conditions.

[0033] The positioning component 4 includes a first plate 41 and a second plate 42 arranged opposite to each other. Both plates are injection molded from insulating engineering plastics and have sufficient structural strength and insulation performance. Both the first plate 41 and the second plate 42 are provided with mating holes 43 that match the cross-sectional contour of the copper busbar 1. The tail terminal of the copper busbar 1 can be inserted into the mating hole 43 to realize the sleeve assembly of the positioning component 4 and the copper busbar 1.

[0034] The first plate 41 is provided with a locking member 44 and an adjusting plate 45. The locking member 44 is threaded to the first plate 41 and presses the adjusting plate 45 to the surface of the first plate 41. The adjusting plate 45 has a strip-shaped adjusting hole 451. The second plate 42 is provided with a mating end block 46, which is located in the adjusting hole 451. Rotating the adjusting plate 45 can move the second plate 42 closer to or further away from the first plate 41 through the mating end block 46, thereby adjusting the relative distance between the two plates.

[0035] The locking component 44 is specifically an external hexagonal bolt or a knurled locking screw, with external threads machined on its shank. The corresponding position on the plate 41 has an internal threaded hole. The adjusting plate 45 is a long strip plate with a circular through hole in its middle. After the shank of the locking component 44 passes through the through hole, it is threadedly connected to the threaded hole of the plate 41. When the locking component 44 is tightened, its head end face presses and fixes the adjusting plate 45 on the upper surface of the plate 41, thereby locking the position. When the locking component 44 is loosened, the adjusting plate 45 can rotate freely around the axis of the locking component 44.

[0036] The mating end block 46 is a cylindrical protrusion, integrally formed and fixed on the upper surface of the plate 42, and the mating end block 46 is embedded in the adjustment hole 451, which can slide relative to the inner wall of the adjustment hole 451.

[0037] The specific working process of spacing adjustment is as follows: After loosening the locking part 44, rotate the adjusting plate 45 away from the plate body 42. The inner side wall of the adjusting hole 451 applies a pulling force to the mating end block 46, causing the plate body 42 to move towards the plate body 41, reducing the spacing between the two plates, and thus reducing the interphase distance between the two copper busbars 1. Rotate the adjusting plate 45 toward the direction of the second plate 42. The outer sidewall of the adjusting hole 451 applies a pushing force to the mating end block 46, causing the second plate 42 to move away from the first plate 41, increasing the distance between the two plates, and thus increasing the distance between the two copper busbars 1. After adjusting to the target spacing, tighten the locking part 44 to press and fix the adjusting plate 45, thus locking the spacing between copper busbars 1. The structure is simple, the adjustment is convenient, and the positioning is reliable.

[0038] A limiting groove 47 is provided on plate 1 41, and a limiting end block 48 is provided on plate 2 42. The limiting end block 48 is movably located in the limiting groove 47 to form a sliding guide fit. The limiting groove 47 is a strip-shaped through groove extending along the spacing adjustment direction. The limiting end block 48 is a protruding post that matches the cross section of the limiting groove 47 and is embedded in the limiting groove 47. It can slide freely along the length direction of the limiting groove 47. Through the fit between the limiting end block 48 and the limiting groove 47, the movement freedom of plate 2 42 can be constrained, so that it can only move relative to plate 1 41 in the straight line direction of spacing adjustment, avoiding the vertical and horizontal offset during the adjustment process, and ensuring that the two copper busbars 1 always remain parallel.

[0039] Both plate 1 (41) and plate 2 (42) have through mounting holes 49. The positions of the mounting holes 49 correspond one-to-one with the wiring holes 12 on the wiring part 11 of the copper busbar 1. During assembly, the upper end of the support column 5 can pass through the mounting holes 49 and wiring holes 12 in sequence to completely fix the relative position of the positioning part 4 and the copper busbar 1. The lower end of the support column 5 can be installed on any base to achieve the suspended and insulated installation of the entire copper busbar assembly and ensure the safe insulation distance between the copper busbar 1 and the equipment housing.

[0040] The injection molding process for the copper busbar dipped in powder coating in this embodiment specifically includes the following steps: S1: Pretreatment and Powder Dipping Molding of Copper Busbar 1 According to the design, the copper busbar 1 is formed by stamping and bending. The wiring hole 12, anti-groove hole 13, anti-detachment hole 15, sealing groove 14 and other structures are machined by drilling and milling. The burrs on the edges are removed. Then, the copper busbar 1 is degreased, pickled and rusted, and phosphated and passivated in sequence to improve the adhesion of epoxy powder on the copper surface. Then, use high-temperature resistant silicone masking tape or custom metal masking fixtures to fully cover and tightly mask the area to be injected on the copper busbar 1 and the electrical connection surface of the wiring part 11 to ensure that no impregnation material adheres to the area. Then, the shielded copper busbar 1 is preheated and fed into a fluidized bed for epoxy powder impregnation, so that the powder is uniformly melted and adhered to the exposed surface of the copper busbar 1; after being taken out, it is placed in an oven to cure and form the required insulation layer 2; after cooling to room temperature, the shielding material is removed to obtain the semi-finished product of the powder-impregnated copper busbar 1 with local bare copper areas.

[0041] S2: Positioning component 4 assembly and one-time injection molding Place two powder-impregnated copper busbars 1 in parallel, insert the tail terminals into the mating holes 43 of the positioning piece 4, loosen the locking piece 44, rotate the adjusting plate 45 to adjust the distance between plate 1 41 and plate 2 42, so that the distance between the two copper busbars 1 reaches the target specification. After confirming that the distance is correct, tighten the locking piece 44 to lock the position of the positioning piece 4, so that the two copper busbars 1 maintain a fixed parallel distance. The front end of the copper busbar 1, the bare copper area to be injected, is placed into the cavity of the injection mold. The positioning part 4 can help fix the tail position of the copper busbar 1 to prevent the copper busbar 1 from shifting due to the pressure of the melt during the injection process. After the mold is closed, the injection process is carried out. The molten plastic fills the cavity and flows fully into the anti-groove hole 13, anti-detachment hole 15 and sealing groove 14 of the copper busbar 1. After holding pressure and cooling and shaping, the mold is opened to form the main body of the injection seat 31 in one step. At this time, the injection seat 31 has an inner conical sealing groove 32 reserved at one end near the insulating layer 2. The end of the insulating layer 2 extends into the sealing groove 32, and a uniform filling gap is left between the two.

[0042] S3: Secondary filling and sealing protection The copper busbar assembly, which has been injection molded in one step, is placed into a secondary injection molding fixture. The injection port and vent are set at the position of the sealing groove 32. Engineering plastic of the same material as the injection base 31, or other materials resistant to high temperature, can be used. Molten material is injected under low-pressure injection conditions to completely fill the gap at the end of the insulation layer 2 in the sealing groove 32. After the material overflows from the vent, the injection is stopped. After cooling and solidification, a seal 33 is formed, which completes the full-enclosed sealing protection at the junction of the injection molded part 3 and the insulation layer 2. Finally, after the flash is cleaned, the appearance is inspected, and the insulation withstand voltage is tested, the finished powder-impregnated electrode copper busbar assembly is obtained.

[0043] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been shown and explained in the embodiments, and any modifications or variations of the embodiments of the present invention may be made without departing from the stated principles.

Claims

1. A copper busbar for a powder-impregnated electrode, characterized in that, It includes at least two copper busbars (1), the outer surface of the copper busbars (1) is provided with an insulating layer (2) formed by a powder impregnation process, one end of the plurality of copper busbars (1) is integrally connected by an injection molded part (3), an anti-detachment interlocking structure is provided between the injection molded part (3) and the copper busbars (1), and a sealing protection structure is provided at the junction of the injection molded part (3) and the insulating layer (2); The other end of the plurality of copper busbars (1) is provided with a positioning member (4) with adjustable spacing, the positioning member (4) being used to maintain a set spacing between the copper busbars (1); It also includes a support column (5) that cooperates with the positioning element (4), the support column (5) being used to achieve the positioning and installation of the copper busbar assembly.

2. The copper busbar for a powder-impregnated electrode according to claim 1, characterized in that, The copper busbar (1) is provided with anti-groove holes (13) and anti-detachment holes (15). During injection molding, the molten material is filled into the anti-groove holes (13) and anti-detachment holes (15) to form the anti-detachment interlocking structure.

3. The copper busbar for a powder-impregnated electrode according to claim 1, characterized in that, The copper busbar (1) is provided with a sealing groove (14) around the end of the injection molded part (3) away from the insulating layer (2). The injection molding material is filled into the sealing groove (14) to form a closed structure at that end of the injection molded part (3).

4. The copper busbar for a powder-impregnated electrode according to claim 1, characterized in that, The injection molded part (3) includes an injection base (31), and a sealing groove (32) is provided around one end of the insulation layer (2). The end of the insulation layer (2) extends into the sealing groove (32). The sealing and protective structure includes a sealant (33) filled in the sealing groove (32).

5. The copper busbar for a powder-impregnated electrode according to claim 4, characterized in that, The sealing groove (32) is an inner conical groove, and the sealing element (33) is an insulating sealing body formed by secondary injection molding.

6. The copper busbar for a powder-impregnated electrode according to claim 1, characterized in that, The positioning component (4) includes a plate body one (41) and a plate body two (42) arranged opposite to each other. Both the plate body one (41) and the plate body two (42) are provided with mating holes (43) for the end of the copper busbar (1) to pass through.

7. The copper busbar for a powder-impregnated electrode according to claim 6, characterized in that, The first plate (41) is provided with a locking member (44) and an adjusting plate (45). The locking member (44) is threaded to the first plate (41) and presses the adjusting plate (45) to the surface of the first plate (41). The adjusting plate (45) is provided with a strip-shaped adjusting hole (451). The second plate (42) is provided with a mating end block (46) located in the adjusting hole (451). Rotating the adjusting plate (45) can drive the second plate (42) to move closer to or away from the first plate (41) through the mating end block (46).

8. The copper busbar for a powder-impregnated electrode according to claim 6, characterized in that, The first plate (41) is also provided with a limiting groove (47), and the second plate (42) is provided with a limiting end block (48). The limiting end block (48) is movably located in the limiting groove (47) to form a sliding guide fit.

9. A copper busbar for a powder-impregnated electrode according to claim 6, characterized in that, Mounting holes (49) are provided on both plate one (41) and plate two (42). The end of the copper busbar (1) is a wiring part (11). A wiring hole (12) is provided on the wiring part (11). The support column (5) can pass through the mounting hole (49) and the wiring hole (12) in sequence to realize the positioning and fixing of the positioning part (4) and the copper busbar (1).

10. An injection molding process for preparing the copper electrode busbar with powder impregnation according to any one of claims 1-9, characterized in that, Includes the following steps: S1: High temperature shielding is applied to the area of ​​the copper busbar (1) to be injected, and the remaining area is cured by fluidized bed powder dipping process to form an insulating layer (2). S2: Remove the shielding, put the end of the copper busbar (1) to be injected into the injection mold, adjust and lock the spacing between the copper busbar (1) by positioning part (4), and inject the body of the injection molded part (3) in one injection molding process; S3: Fill the sealing groove (32) of the injection molded part (3) with a sealant (33) for the second time to complete the sealing protection at the junction of the injection molded part (3) and the insulating layer (2).

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