An automated test equipment for a board module

Abstract

The application discloses a kind of automatic test equipment of board card module, specifically related to board card module test field include: body, support plate being set on body, detection probe for being contacted with the test point of board card, partial pressure connection mechanism being set above support plate, vertical drive assembly for driving partial pressure connection mechanism relative to support plate lifting and limit warping support mechanism being set on support plate.The application is by being set partial pressure connection mechanism and limit warping support mechanism, when testing to board card, it can be by multiple pressure joint assembly to the local pressure connection of board card, simultaneously by support seat to the lower surface of board card around detection probe penetration area side is supported, and utilize adsorption hole to the negative pressure adsorption of board card lower surface, to reduce the problem that board card generates local arch when detection probe top meets test point, improve the contact stability between detection probe and test point.

Description

Technical Field

[0001] This invention relates to the field of circuit board module testing technology, and more specifically, to an automated testing device for circuit board modules. Background Technology

[0002] A circuit board module is a functional circuit component that integrates chips, capacitors, inductors, shielding covers, connectors, and test points. It is used in industrial control equipment, communication equipment, automotive electronics, smart terminals, and various control modules. After mounting, soldering, or assembly, circuit board modules typically require testing equipment to assess their electrical continuity, signal transmission, functional operation, and interface connectivity to determine if they meet the requirements for subsequent assembly or factory use.

[0003] Currently, in automated testing of circuit board modules, the board is typically placed on a testing station and then positioned and pressed by a crimping mechanism to ensure stable contact between the test probes and the test points on the board. However, for thin and light circuit board modules, due to their thinness, weak overall rigidity, and the presence of components such as chips, capacitors, inductors, shielding covers, and connectors of varying heights on the board's surface, testing equipment cannot directly press the board's surface with a single pressure plate. Doing so could easily cause interference, compression, or damage to these components. Therefore, during the testing of such circuit board modules, local crimping is usually only performed on the board's edges, process edges, or blank areas without components.

[0004] However, when testing thin and light circuit board modules using a local crimping method, the area near the test point on the circuit board is often not directly constrained by the upper crimping mechanism. When the test probe pushes against the test point from below the circuit board, the reaction force generated by the test probe can easily cause local arching, warping, or slight deformation of the circuit board area around the test point. This results in inconsistent contact pressure between different test probes and the test point, and some test probes may experience insufficient compression, unstable contact, or momentary poor contact, which in turn affects the accuracy and stability of the automated test results of the circuit board module. Summary of the Invention

[0005] The present invention provides an automated testing device for circuit board modules, which aims to solve the problem that existing thin and light circuit board modules are difficult to be fully pressed by a pressure plate during automated testing due to the presence of components of different heights on the upper surface of the circuit board. Only local pressing can be performed, which causes local arching in the periphery of the test point when the test probe touches the test point, affecting the stability of the contact between the test probe and the test point.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an automated testing device for circuit board modules, comprising: a body, a support plate disposed on the body, a detection probe for contacting the test points of the circuit board, a local pressing mechanism disposed above the support plate, a vertical driving component for driving the local pressing mechanism to rise and fall relative to the support plate, and a warping limiting support mechanism disposed on the support plate. The support plate is used to support the card, and the local crimping mechanism includes multiple crimping joint assemblies for crimping the card; The anti-warping support mechanism includes a support seat disposed around the area through which the detection probe passes, and an adsorption hole is provided on the support seat for communicating with the suction component. The detection probe can pass through the corresponding clearance area of ​​the support and contact the test point of the board. The support is used to support the lower surface of the board around the test point when the detection probe contacts the test point. The adsorption hole is used to adsorb the lower surface of the board around the test point with negative pressure.

[0007] In a preferred embodiment, the local crimping mechanism includes a linear drive component, a crimping seat, and multiple crimping connector assemblies. The linear drive component is used to drive the crimping seat to move vertically in a linear fashion. The multiple crimping connector assemblies are distributed on the crimping seat and correspond to the crimpable areas on the upper surface of the board, respectively.

[0008] In a preferred embodiment, the crimping assembly includes a connecting seat, a crimping member, and an elastic element. The connecting seat is disposed on the crimping seat, and the elastic element is disposed between the connecting seat and the crimping member.

[0009] In a preferred embodiment, the vertical drive assembly includes a drive member and a connecting frame. A local pressing mechanism is disposed on the connecting frame. The drive member is used to drive the connecting frame to move vertically, thereby moving the local pressing mechanism closer to or away from the support plate.

[0010] In a preferred embodiment, the support base is provided with a communicating cavity, the adsorption hole is connected to the communicating cavity, and the support plate is provided with a connecting hole for connecting the communicating cavity and the suction component.

[0011] In a preferred embodiment, the suction assembly includes a sliding groove formed on the support plate, the sliding groove communicating with the connecting hole, a piston plate slidably disposed in the sliding groove, and a linear drive assembly 1 disposed on the support plate, a connecting strip installed at the output end of the linear drive assembly 1, and the piston plate fixedly disposed on the connecting strip.

[0012] In a preferred embodiment, the support plate is further provided with a floating support mechanism, which includes a slide groove, an elastic element two, a hose, and a flexible support pad one. The support base includes multiple support columns, which are spaced apart around the penetration area of ​​the detection probe. The slide groove includes multiple columns, and the multiple support columns are respectively floating up and down in the corresponding slide groove. The elastic element two is used to provide a floating pre-pressure towards the board to the corresponding support column. The hose is used to keep the connecting cavity connected to the suction assembly when the support column floats up and down. The flexible support pad one is provided at the end of the support column near the board and is used to fit the lower surface of the board and compensate for slight warping of the board.

[0013] In a preferred embodiment, the support plate is further provided with a floating support mechanism, which includes a linear drive component two, a connecting plate, and multiple floating support components. The linear drive component two is used to drive the connecting plate to rise and fall relative to the support plate, and the multiple floating support components are disposed on the connecting plate.

[0014] In a preferred embodiment, the floating support assembly includes a support base, a support column, an elastic element three, a flexible support pad two, and a vertical hole. The support base is disposed on the connecting plate, the vertical hole is opened on the support plate, the support column is slidably disposed in the vertical hole, the elastic element three is disposed between the support column and the support base, and is used to provide floating support force to the support column. The flexible support pad two is disposed at the end of the support column near the plate.

[0015] In a preferred embodiment, the floating support assembly is located at the corresponding position of the corresponding crimp joint below the plate. After the crimp joint crimps the plate, the linear drive assembly two drives the connecting plate to rise, so that the support column contacts the lower surface of the plate in the area corresponding to the crimp joint through the flexible support pad two.

[0016] The beneficial effects of this invention are as follows: This invention, by setting up a local pressing mechanism and a warping-limiting support mechanism, allows for local pressing of the circuit board during testing through multiple pressing joint components. Simultaneously, a support seat supports the lower surface of the circuit board around the area where the test probe penetrates, and negative pressure adsorption is applied to the lower surface of the circuit board using adsorption holes. This reduces the problem of localized warping of the circuit board when the test probe touches the test point, thereby improving the contact stability between the test probe and the test point.

[0017] This invention, by setting a floating support mechanism, enables the support base to form a multi-point floating support structure from multiple support columns. The multiple support columns can float up and down according to the actual height of the lower surface of the board, and are attached to the lower surface of the board by a flexible support pad. At the same time, the suction hole and the suction component are kept connected by a flexible tube, thereby improving the adaptability of the support base to slight warping of the board and reducing the problem of insufficient local adhesion affecting the negative pressure suction effect.

[0018] By setting up a floating support mechanism, the present invention can drive the connecting plate and multiple floating support components to rise through the linear drive component two, so that the support column supports the corresponding area of ​​the crimping joint with low preload, thereby forming a supplementary reverse support below the crimping area. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the front cross-sectional structure of the present invention; Figure 3 This is a schematic diagram of the structure of the crimp connector assembly of the present invention; Figure 4 This is a schematic diagram of the anti-warping support mechanism of the present invention; Figure 5 This is a three-dimensional structural schematic diagram of the vertical drive component of the present invention; Figure 6 This is a schematic diagram of the floating support mechanism of the present invention; Figure 7 This is an enlarged view of the floating support mechanism of the present invention; Figure 8 This is a schematic diagram of the floating support mechanism of the present invention; Figure 9 This is an enlarged view of the floating support mechanism of the present invention.

[0020] The attached reference numerals are as follows: 100, plate; 1, body; 11, support plate; 12, detection probe; 13, vertical drive assembly; 131, drive component; 132, connecting frame; 2, local pressing mechanism; 21, linear drive component; 22, pressing seat; 23, pressing head assembly; 231, connecting seat; 232, pressing head; 233, elastic element one; 3, anti-warping support mechanism; 31, support seat; 32, suction hole; 33, communicating cavity; 34, slide. 35. Moving groove; 36. Connecting hole; 37. Piston plate; 38. Linear drive assembly one; 4. Connecting bar; 59. Floating support mechanism; 40. Slide groove; 41. Elastic element two; 42. Hose; 43. Flexible support pad one; 50. Floating support mechanism; 51. Linear drive assembly two; 52. Connecting plate; 53. Floating support assembly; 531. Support seat; 532. Support column; 533. Elastic element three; 534. Flexible support pad two; 535. Vertical hole. Detailed Implementation

[0021] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0022] Refer to the instruction manual appendix Figure 1 , Figure 2 An automated testing device for circuit board modules includes: a body 1, a support plate 11 disposed on the body 1, a detection probe 12 for contacting the test points of the circuit board 100, a local pressing mechanism 2 disposed above the support plate 11, a vertical driving component 13 for driving the local pressing mechanism 2 to rise and fall relative to the support plate 11, and a warping limiting support mechanism 3 disposed on the support plate 11. The support plate 11 is used to support the board 100, and the local crimping mechanism 2 includes a plurality of crimping joint assemblies 23 for crimping the upper surface edge, process edge or blank area without components of the board 100, so as to avoid the components on the upper surface of the board 100. Refer to the instruction manual appendix Figure 3 , Figure 4 The limiting support mechanism 3 includes a support seat 31 disposed around the area through which the detection probe 12 passes. The support seat 31 is provided with an adsorption hole 32, which is used to communicate with the suction component. The detection probe 12 can pass through the avoidance area corresponding to the support 31 and contact the test point of the board 100. The support 31 is used to support the lower surface of the board 100 around the test point when the detection probe 12 contacts the test point. The adsorption hole 32 is used to perform negative pressure adsorption on the lower surface of the board 100 around the test point to suppress the local upward arching of the board 100 under the action of the detection probe 12.

[0023] It should be noted that the detection probe 12 is used to contact the test points on the board 100 during the test to achieve electrical continuity, signal acquisition or functional testing. The detection probe 12 can be driven to rise and fall by a cylinder to perform board testing. The suction component can be a vacuum pump, vacuum generator, negative pressure fan or external negative pressure pipeline. It generates a negative pressure adsorption effect on the lower surface of the board 100 through the adsorption hole 32, so that the area around the test point of the board 100 is close to the support 31, thereby preventing the board 100 from arching up locally when the detection probe 12 pushes against the test point.

[0024] In this embodiment, the implementation scenario is as follows: First, the board 100 is placed on the test position of the support plate 11, so that the test point of the board 100 corresponds to the detection probe 12. At the same time, the edge, process edge or blank area without components on the upper surface of the board 100 corresponds to multiple crimping assembly 23. Then, the vertical drive assembly 13 drives the local crimping mechanism 2 to move towards the support plate 11, so that the multiple crimping assembly 23 respectively crimps the crimpable area on the upper surface of the board 100. After the local crimping is completed, the suction assembly performs negative pressure suction on the lower surface of the board 100 through the suction hole 32, so that the area around the test point of the board 100 is suctioned and close to the support 31. The support 31 simultaneously supports the area around the test point. Then, the detection probe 12 passes through the avoidance area corresponding to the support 31 and contacts the test point of the board 100 to perform electrical performance, signal continuity or functional tests on the board 100.

[0025] It should also be noted that by setting a support 31 around the area through which the detection probe 12 passes, and setting an adsorption hole 32 on the support 31, a combined anti-warping effect of lower support and negative pressure adsorption can be formed around the test point. When the detection probe 12 touches the test point, the lower surface of the board 100 around the test point is supported by the support 31 and restricted by the negative pressure adsorption of the adsorption hole 32. This reduces the occurrence of local arching or warping of the board 100 under the action of the detection probe 12 touching the test point, and improves the contact stability between the detection probe 12 and the test point.

[0026] Further, please refer to the appendix to the instruction manual. Figure 1 , Figure 2 The local crimping mechanism 2 includes a linear drive component 21, a crimping seat 22, and multiple crimping connector assemblies 23. The linear drive component 21 is used to drive the crimping seat 22 to move vertically in a linear manner. The multiple crimping connector assemblies 23 are distributed on the crimping seat 22 and correspond to the crimpable areas on the upper surface of the board 100, respectively.

[0027] It should be noted that the linear drive component 21 can be a drive structure capable of outputting linear motion, such as a cylinder, electric cylinder, hydraulic cylinder, or lead screw linear module. After the board 100 is placed in the test position on the support plate 11, the edge, process edge, or blank area without components of the board 100 are first aligned with the multiple crimping connector assemblies 23 on the crimping seat 22. Then, the linear drive component 21 drives the crimping seat 22 to move toward the support plate 11. The crimping seat 22 drives the multiple crimping connector assemblies 23 to move down synchronously, so that the multiple crimping connector assemblies 23 are in the area close to the top of the board 100. Then, the linear drive component 21 drives the crimping connector assemblies 23 to contact the board 100, so that the board 100 is locally crimped and positioned while avoiding the components on the upper surface.

[0028] Further, please refer to the appendix to the instruction manual. Figure 3, Figure 4 The crimping assembly 23 includes a connecting seat 231, a crimping head 232, and an elastic element 233. The connecting seat 231 is disposed on the crimping seat 22, and the elastic element 233 is disposed between the connecting seat 231 and the crimping head 232.

[0029] It should be noted that the elastic element 233 can be a spring. When the crimping seat 22 drives the multiple crimping connector assemblies 23 to move downward, each crimping connector 232 first contacts the crimpable area on the upper surface of the board 100. Since there may be a slight height difference on the surface of the board 100, or the distance between different crimping areas and the crimping connectors 232 may be different, some crimping connectors 232 may contact the board 100 first. At this time, the crimping connectors 232 that contact the board 100 first can float upward relative to the corresponding connecting seat 231, causing the elastic element 233 to be compressed. The crimping connectors 232 that do not contact the board 100 can continue to move downward with the crimping seat 22 until all the crimping connectors 232 make contact with the corresponding crimpable areas.

[0030] Further, please refer to the appendix to the instruction manual. Figure 5 The vertical drive assembly 13 includes a drive member 131 and a connecting frame 132. The local pressing mechanism 2 is disposed on the connecting frame 132. The drive member 131 is used to drive the connecting frame 132 to move vertically and to drive the local pressing mechanism 2 to move closer to or away from the support plate 11.

[0031] It should be noted that the driving component 131 can be a cylinder. After the board 100 is placed on the support plate 11 and initially positioned, the driving component 131 drives the connecting frame 132 to move downward. The connecting frame 132 drives the local pressing mechanism 2 to move towards the support plate 11, so that the pressing head assembly 23 in the local pressing mechanism 2 gradually approaches the pressable area on the upper surface of the board 100. When the local pressing mechanism 2 moves to the preset pressing height, the pressing head assembly 23 performs local pressing on the edge, process edge, or blank area without components of the board 100. After the test is completed, the driving component 131 drives the connecting frame 132 to move upward, so that the local pressing mechanism 2 moves away from the support plate 11, thereby releasing the pressing on the board 100 and making it easy to remove the board 100 from the test position.

[0032] Further, please refer to the appendix to the instruction manual. Figure 4 The support 31 has a communicating cavity 33, and the suction hole 32 communicates with the communicating cavity 33. The support plate 11 has a connecting hole 35, which is used to connect the communicating cavity 33 and the suction assembly. The suction assembly includes a sliding groove 34 on the support plate 11, which communicates with the connecting hole 35. A piston plate 36 is slidably disposed in the sliding groove 34. A linear drive assembly 37 is disposed on the support plate 11. A connecting strip 38 is installed at the output end of the linear drive assembly 37. The piston plate 36 is fixedly disposed on the connecting strip 38.

[0033] It should be noted that after the board 100 is pressed and positioned by the local pressing mechanism 2, the linear drive assembly 37 drives the connecting bar 38 to move along the extension direction of the sliding groove 34. The connecting bar 38 drives the piston plate 36 to slide in the sliding groove 34, which increases the space on the side of the sliding groove 34 that is connected to the connecting hole 35, thereby forming a negative pressure in the sliding groove 34. This negative pressure is transmitted through the connecting hole 35 to the connecting cavity 33 in the support seat 31, and then from the connecting cavity 33 to the adsorption hole 32, so that the adsorption hole 32 has a suction effect on the lower surface of the test point of the board 100. At this time, the area around the test point of the board 100 is adsorbed by the adsorption hole 32 and close to the support seat 31, thereby cooperating with the support function of the support seat 31 to limit the board 100 from local upward arching when the detection probe 12 is pressed against it.

[0034] In the above technical solution, by setting a support 31 around the detection probe 12 and using the adsorption hole 32 to perform negative pressure adsorption on the periphery of the test point of the board 100, it is possible to suppress the local arching of the board 100 when the detection probe 12 touches the test point. However, in actual batch testing, the board 100 often has slight warping or local height differences that are not obvious to the naked eye before entering the testing equipment due to factors such as welding thermal stress, substrate internal stress, differences in weight distribution after component mounting, handling and clamping, or batch processing errors. Since the support seat 31 in the first layer of the technical solution mainly supports and adsorbs the lower surface of the board 100 at a fixed height, when the lower surface of the area around the test point of the board 100 is not on the same plane, there is a tendency for insufficient local fit, local gaps, or excessive local stress between the support seat 31 and the board 100. This leads to a decrease in the negative pressure adsorption effect at the adsorption hole 32, and even problems such as air leakage in some areas and insufficient support in some areas. At this time, even if the detection probe 12 can contact the test point, the compression amount of different detection probes 12 may be inconsistent due to the local height of the board 100 not being fully corrected, thus affecting the stability of the test contact and the accuracy of the test results. To this end, the present invention also proposes a floating support mechanism 4.

[0035] For details, please refer to the instruction manual appendix. Figure 6 , Figure 7The support plate 11 is also provided with a floating support mechanism 4. The floating support mechanism 4 includes a slide groove 41, an elastic element 42, a hose 43, and a flexible support pad 44. The support seat 31 includes multiple support columns, which are spaced apart around the penetration area of ​​the detection probe 12. The slide groove 41 includes multiple columns, and the multiple support columns are respectively floating up and down in the corresponding slide groove 41. The elastic element 42 is used to provide a floating pre-pressure towards the board 100 to the corresponding support column. The hose 43 is used to keep the connecting cavity 33 connected to the suction component when the support column floats up and down. The flexible support pad 44 is provided at the end of the support column near the board 100 and is used to fit the lower surface of the board 100 and compensate for the slight warping of the board 100.

[0036] It should be noted that multiple support columns can be arranged at intervals along the circumference of the area through which the detection probe 12 passes, or they can be distributed according to the shape of the support area around the test point of the board 100. Each support column can serve as an independent support unit of the support seat 31, and each of them can be provided with a connecting cavity 33 that communicates with the adsorption hole 32. The adsorption hole 32 is opened at the end of the corresponding support column that is close to the board 100.

[0037] It should also be noted that when the board 100 is placed on the support plate 11, multiple support columns float and extend toward the lower surface of the board 100 under the action of the elastic element 42. When the local pressing mechanism 2 performs local pressing on the board 100, the lower surface of the board 100 contacts the flexible support pads 44 at the upper ends of the multiple support columns. If the board 100 has slight warping or local height difference, the support columns at different positions can float up and down to different degrees in the corresponding sliding grooves 41, so that the multiple support columns fit the lower surface of the board 100 in a multi-point conformal manner. Then, the suction assembly draws air into the connecting cavity 33 in the multiple support columns through the hose 43, so that the adsorption hole 32 generates a negative pressure adsorption effect on the periphery of the test point of the board 100.

[0038] With the above settings, multiple support columns can adapt to the actual height of different positions around the test points of the board 100, so that the support seat 31 changes from fixed height support to multi-point floating support, thereby reducing the problem that some areas cannot fit the support seat 31 due to slight warping of the board 100. At the same time, the hose 43 can maintain negative pressure connection when the support columns float up and down, so that the adsorption hole 32 can still adsorb the lower surface of the board 100 in the multi-point floating fit state, thereby improving the fit adaptability of the support seat 31 to slight warping of the board 100 and the stability of negative pressure warping limitation.

[0039] In the above technical solution, by setting the support seat 31 as multiple support columns that can float up and down independently, and cooperating with the elastic element 42, the hose 43 and the flexible support pad 44, the multiple support columns can conform to the slight warping shape of the lower surface of the board 100 at multiple points, thereby improving the support and negative pressure adsorption stability of the test point periphery area. However, since the multiple crimping joints 232 in the local crimping mechanism 2 are mainly arranged according to the edge, process edge or blank area without components on the upper surface of the board 100, and the multiple support columns are mainly arranged around the penetration area of ​​the detection probe 12 or the periphery of the test point of the board 100, it is easy for the downward pressing position of the crimping joint 232 and the upward supporting position of the support column to not correspond in the planar direction of the board 100. At this time, the local crimping force applied by the crimping joint 232 to the board 100 may need to be transmitted through the thin board 100 itself to the support area far away from the crimping point, causing the board 100 to bend, twist or stress concentration between the local crimping point and the support area around the test point. Especially when the board 100 is thin, has weak rigidity and uneven distribution of components on the upper surface, it is easy to affect the contact stability between the detection probe 12 and the test point, and may also cause local deformation, indentation or even damage to the board 100. For this reason, the present invention also proposes a floating support mechanism 5.

[0040] For details, please refer to the instruction manual appendix. Figure 8 The support plate 11 is also provided with a floating support mechanism 5. The floating support mechanism 5 includes a linear drive component 2 51, a connecting plate 52 and multiple floating support components 53. The linear drive component 2 51 is used to drive the connecting plate 52 to rise and fall relative to the support plate 11, and the multiple floating support components 53 are arranged on the connecting plate 52.

[0041] It should be noted that the linear drive assembly 51 can be a cylinder. After the board 100 is placed on the support plate 11 and partially pressed by the local pressing mechanism 2, the linear drive assembly 51 drives the connecting plate 52 to rise towards the support plate 11. The connecting plate 52 drives multiple floating support assemblies 53 to move upward synchronously, so that the multiple floating support assemblies 53 gradually approach the lower surface of the board 100. When the floating support assemblies 53 rise to the preset support position, the floating support assemblies 53 form supplementary support for the corresponding area of ​​the lower surface of the board 100, thereby providing auxiliary support for the lower part of the board 100 when the pressing joint 232 performs local pressing on the board 100. After the test is completed, the linear drive assembly 51 drives the connecting plate 52 to descend, and the multiple floating support assemblies 53 move away from the lower surface of the board 100 along with the connecting plate 52 to release the supplementary support for the board 100, making it easier to unload the board 100.

[0042] Further, please refer to the appendix to the instruction manual. Figure 9The floating support assembly 53 includes a support base 531, a support column 532, an elastic element 533, a flexible support pad 534, and a vertical hole 535. The support base 531 is disposed on the connecting plate 52, and the vertical hole 535 is opened on the support plate 11. The support column 532 is slidably disposed in the vertical hole 535. The elastic element 533 is disposed between the support column 532 and the support base 531 to provide floating support force to the support column 532. The flexible support pad 534 is disposed at the end of the support column 532 near the plate 100.

[0043] It should be noted that the elastic element 533 can be a spring. When the crimping joint 232 in the local crimping mechanism 2 crimps the crimpable area on the upper surface of the plate 100, the connecting plate 52 rises under the drive of the linear drive component 51. The connecting plate 52 drives the support base 531 to rise synchronously. The support base 531 pushes the support column 532 to move upward along the vertical hole 535 through the elastic element 533. When the flexible support pad 534 at the upper end of the support column 532 contacts the lower surface of the plate 100, the connecting plate 52 continues to rise a certain distance. At this time, the support column 532 is subjected to the reaction force of the plate 100 and floats and retracts relative to the support base 531, causing the elastic element 533 to be deformed under pressure. Thus, the elastic restoring force of the elastic element 533 provides upward low pre-pressure support to the support column 532.

[0044] Further, please refer to the appendix to the instruction manual. Figure 9 The floating support component 53 is located at the projection position of the corresponding crimp connector 232 below the board 100 or near the safety support area. After the crimp connector 232 crimps the board 100, the linear drive component 51 drives the connecting plate 52 to rise, so that the support column 532 contacts the lower surface of the board 100 in the area corresponding to the crimp connector 232 with low pre-pressure through the flexible support pad 534, thereby forming a supplementary reverse support in the area corresponding to the crimp connector 232 to reduce the local crimping force of the crimp connector 232 from being transmitted to the test area corresponding to the test probe 12.

[0045] The embodiments described above are merely examples of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention.

Claims

1. An automated test equipment for a board card module, characterized by, include: The machine body (1), the support plate (11) set on the machine body (1), the detection probe (12) for contacting the test point of the board (100), the local pressing mechanism (2) set above the support plate (11), the vertical drive assembly (13) for driving the local pressing mechanism (2) to rise and fall relative to the support plate (11), and the anti-tilting support mechanism (3) set on the support plate (11); The support plate (11) is used to support the plate (100), and the local crimping mechanism (2) includes a plurality of crimping head assemblies (23) for crimping the plate (100). The limiting support mechanism (3) includes a support seat (31) disposed on the periphery of the area through which the detection probe (12) passes. The support seat (31) is provided with an adsorption hole (32), which is used to communicate with the suction assembly. The detection probe (12) can pass through the avoidance area corresponding to the support (31) and contact the test point of the board (100). The support (31) is used to support the lower surface of the board (100) around the test point when the detection probe (12) contacts the test point. The adsorption hole (32) is used to perform negative pressure adsorption on the lower surface of the board (100) around the test point.

2. The automated test equipment for board card modules of claim 1, wherein: The local crimping mechanism (2) includes a linear drive component (21), a crimping seat (22), and multiple crimping connector assemblies (23). The linear drive component (21) is used to drive the crimping seat (22) to move vertically in a linear motion. The multiple crimping connector assemblies (23) are distributed on the crimping seat (22) and correspond to the crimpable areas on the upper surface of the board (100).

3. The automated test equipment for board card modules of claim 2, wherein: The crimping assembly (23) includes a connecting seat (231), a crimping head (232), and an elastic element (233). The connecting seat (231) is disposed on the crimping seat (22), and the elastic element (233) is disposed between the connecting seat (231) and the crimping head (232).

4. The automated test equipment for board card modules of claim 3, wherein: The vertical drive assembly (13) includes a drive member (131) and a connecting frame (132). The local pressing mechanism (2) is disposed on the connecting frame (132). The drive member (131) is used to drive the connecting frame (132) to move vertically and to drive the local pressing mechanism (2) to move closer to or away from the support plate (11).

5. The automated test equipment for board card modules of claim 4, wherein: The support (31) is provided with a connecting cavity (33), the adsorption hole (32) is connected to the connecting cavity (33), and the support plate (11) is provided with a connecting hole (35), which is used to connect the connecting cavity (33) and the suction assembly.

6. The automated test equipment for board card modules of claim 5, wherein: The suction assembly includes a sliding groove (34) formed on the support plate (11), the sliding groove (34) is connected to the connecting hole (35), a piston plate (36) is slidably arranged in the sliding groove (34), and a linear drive assembly (37) is provided on the support plate (11). A connecting strip (38) is installed at the output end of the linear drive assembly (37), and the piston plate (36) is fixedly arranged on the connecting strip (38).

7. The automated test equipment for board card modules of claim 6, wherein: The support plate (11) is also provided with a floating support mechanism (4). The floating support mechanism (4) includes a slide groove (41), an elastic element two (42), a hose (43), and a flexible support pad one (44). The support seat (31) includes multiple support columns, which are spaced apart around the penetration area of ​​the detection probe (12). The slide groove (41) includes multiple columns, and the multiple support columns are respectively floating up and down in the corresponding slide groove (41). The elastic element two (42) is used to provide floating pre-pressure towards the plate (100) to the corresponding support column. The hose (43) is used to keep the connecting cavity (33) connected to the suction component when the support column floats up and down. The flexible support pad one (44) is provided at the end of the support column near the plate (100) and is used to fit the lower surface of the plate (100) and compensate for the slight warping of the plate (100).

8. The automated test equipment for board card modules of claim 7, wherein: The support plate (11) is also provided with a floating support mechanism (5), which includes a linear drive component two (51), a connecting plate (52) and multiple floating support components (53). The linear drive component two (51) is used to drive the connecting plate (52) to rise and fall relative to the support plate (11), and the multiple floating support components (53) are provided on the connecting plate (52).

9. The automated test equipment for board card modules of claim 8, wherein: The floating support assembly (53) includes a support base (531), a support column (532), an elastic element three (533), a flexible support pad two (534), and a vertical hole (535). The support base (531) is disposed on the connecting plate (52), the vertical hole (535) is opened on the support plate (11), the support column (532) is slidably disposed in the vertical hole (535), the elastic element three (533) is disposed between the support column (532) and the support base (531) for providing floating support force to the support column (532), and the flexible support pad two (534) is disposed at one end of the support column (532) near the plate (100).

10. The automated test equipment for board card modules of claim 9, wherein: The floating support assembly (53) is located at the corresponding position of the corresponding crimp connector (232) below the plate (100). After the crimp connector (232) crimps the plate (100), the linear drive assembly two (51) drives the connecting plate (52) to rise, so that the support column (532) contacts the lower surface of the plate (100) in the corresponding area of ​​the crimp connector (232) through the flexible support pad two (534).

Images