A magnetic head assembly and related devices

Abstract

The application discloses a magnetic head assembly and a related device. The magnetic head assembly comprises a substrate, a cover plate, N magnetic heads and M first units. The substrate comprises L first spaces, and the N magnetic heads are arranged in the L first spaces. The cover plate is arranged on the substrate and is used for encapsulating the N magnetic heads in the L first spaces. The cover plate comprises K second spaces, and the M first units are arranged in the K second spaces. The M first units are electrically connected with the N magnetic heads, and the first units are used for providing electrostatic discharge protection for the magnetic heads. The first units are arranged on the cover plate of the magnetic head assembly and are used for providing electrostatic discharge protection for the magnetic heads. Since the electrostatic discharge protection units on the flexible circuit board at the periphery of the magnetic head assembly are removed, the overall size of the magnetic head assembly can be reduced.

Description

Technical Field

[0001] This application relates to the field of storage technology, and in particular to a magnetic head assembly and related devices. Background Technology

[0002] In the field of storage technology, magnetic tape storage devices are a commonly used type of storage equipment. A magnetic tape storage device includes a head assembly and a magnetic tape. The head assembly is used for reading and writing operations on the magnetic tape, which is used for data storage. The main structure of the head assembly includes multiple heads. The magnetic tape moves relative to the heads.

[0003] During data reading and writing, the magnetic head is prone to static electricity due to its movement relative to the magnetic tape. To prevent electrostatic damage to the magnetic head, an electrostatic discharge (ESD) protection unit (ESD unit or ESD chip) needs to be added to the magnetic head. This ESD protection unit is used to protect the magnetic head from ESD. Current magnetic head assemblies include: a magnetic head, a magnetic head substrate, a magnetic head cover, a flexible printed circuit (FPC), and the ESD protection unit. The magnetic head substrate includes the magnetic head, and the magnetic head cover is bonded to the magnetic head substrate to protect it. Furthermore, the substrate can also be mounted on a base. The magnetic head substrate has pads that are electrically connected to the magnetic head. The FPC is mounted on the magnetic head substrate, and the ESD protection unit is mounted on the FPC. The ESD protection unit is electrically connected to the pads via wire bonding technology, thus achieving electrical connection between the ESD protection unit and the magnetic head.

[0004] In current head assemblies, the ESD protection unit mounted on the FPC is connected to the head via wire bonding, resulting in a relatively large overall size of the head assembly. Reducing the overall size of the head assembly has become a pressing technical problem to be solved. Summary of the Invention

[0005] This application discloses a magnetic head assembly and related devices. The first unit for electrostatic discharge protection of the magnetic head is disposed on the cover plate of the magnetic head to reduce the overall size of the magnetic head assembly.

[0006] In a first aspect, embodiments of this application propose a magnetic head assembly, which includes: a substrate, a cover plate, N magnetic heads, and M first units; wherein, the substrate includes L first spaces, and the N magnetic heads are disposed in the L first spaces; the cover plate is disposed on the substrate and is used to encapsulate the N magnetic heads in the L first spaces; the cover plate includes K second spaces, and the M first units are disposed in the K second spaces; the M first units are electrically connected to the N magnetic heads, and the first units are used to provide electrostatic discharge protection to the magnetic heads, wherein N is an integer greater than or equal to 1, M is an integer greater than or equal to 1, L is an integer greater than or equal to 1, and K is an integer greater than or equal to 1.

[0007] In one example, L equals N. That is, each first space contains one head.

[0008] In one example, K equals M. That is, each second space includes one first unit.

[0009] The first unit mentioned above can also be replaced by an ESD unit, an ESD protection unit, an ESD chip, or an electrostatic protection circuit. This application embodiment does not limit this.

[0010] For example, the cover plate may be made of semiconductor material.

[0011] For example, the substrate material may include semiconductor material or insulating material.

[0012] For example, the semiconductor material includes aluminum titanium carbon, silicon oxide, or silicon. For instance, the cover plate may be made of aluminum titanium carbon.

[0013] In the above technical solution, a first unit is provided on the cover plate of the magnetic head assembly. This first unit provides electrostatic discharge protection to the magnetic head. Since the electrostatic discharge protection unit on the flexible circuit board surrounding the magnetic head assembly is eliminated, the overall size of the magnetic head assembly can be reduced. Fabricating the first unit on the cover plate eliminates the need to fabricate it separately on an additional wafer, thus reducing the fabrication difficulty and cost of the magnetic head assembly. Furthermore, compared to placing the first unit on the flexible circuit board surrounding the magnetic head assembly, the distance between the first unit and the magnetic head is shortened when the first unit is on the cover plate, thereby enhancing the discharge capability of the first unit.

[0014] In one possible implementation of the first aspect, the cover plate includes K second spaces, including: the second side of the cover plate includes K second spaces; the magnetic head assembly specifically includes: the first side of the substrate includes L first spaces; the second side of the cover plate is disposed on the first side of the substrate, such that L first spaces and K second spaces are formed between the first side of the substrate and the second side of the cover plate.

[0015] Specifically, the cover plate also includes one or more first through holes, one end of which is connected to a first unit, and the other end of which includes a pad; one of the M first units is electrically connected to the pad through one of the one or more first through holes.

[0016] In the above technical solution, a first unit and a magnetic head are arranged between the cover plate and the substrate, and the magnetic head is directly connected to the first unit to further shorten the distance between the first unit and the magnetic head and improve the discharge capability of the electrostatic discharge protection unit.

[0017] In one possible implementation of the first aspect, the M first units are electrically connected to the N magnetic heads, including: one of the M first units is electrically connected to one of the N magnetic heads through hybrid bonding.

[0018] In one possible implementation of the first aspect, the cover plate includes K second spaces, including: the first surface of the cover plate includes K second spaces; the magnetic head assembly specifically includes: the first surface of the substrate includes L first spaces; the second surface of the cover plate is disposed on the first surface of the substrate, such that L first spaces are formed between the first surface of the substrate and the second surface of the cover plate.

[0019] Specifically, the cover plate has one or more pads; one of the M first cells is electrically connected to the pads. The cover plate also includes one or more second through holes; one of the M first cells is electrically connected to one of the N magnetic heads through the second through holes.

[0020] Alternatively, the substrate and the cover plate are bonded together with adhesive.

[0021] In the above technical solution, a first unit is set between the cover plate and the substrate on the other side, which improves the flexibility of the solution.

[0022] In one possible implementation of the first aspect, the head assembly further includes a flexible circuit board, with the first unit and the head electrically connected to the flexible circuit board via pads.

[0023] Optionally, the pad is electrically connected to the flexible circuit board via a lead, which can be made of metal materials such as gold, silver or copper.

[0024] In one possible implementation of the first aspect, the first unit includes: a metal-oxide-semiconductor field-effect transistor (MOS transistor) or a transient voltage suppressor diode (TVS transistor).

[0025] In one possible implementation of the first aspect, the magnetic head specifically includes: a first electrode, a second electrode, a first shielding layer, a second shielding layer, and a magnetoresistive layer, wherein the first shielding layer is disposed between a first surface of the substrate and a second surface of the first electrode corresponding to the first shielding layer, and the first shielding layer and the first electrode are isolated by an insulating material; the magnetoresistive layer is disposed between the first surface of the first electrode and the second surface of the second electrode; the second shielding layer is disposed on the first surface of the second electrode; the first electrode and the second electrode are used to provide voltage to the magnetic head.

[0026] In one possible implementation of the first aspect, the first shielding layer is made of nickel-iron or cobalt-iron material; the second shielding layer is made of nickel-iron or cobalt-iron material.

[0027] In one possible implementation of the first aspect, the magnetoresistive layer includes: two first sub-magnetoresistive layers and one second sub-magnetoresistive layer; the second sub-magnetoresistive layer is disposed between the two first sub-magnetoresistive layers, and the first sub-magnetoresistive layers and the second sub-magnetoresistive layer are isolated by an insulating material; the second sub-magnetoresistive layer includes two third sub-magnetoresistive layers, and the two third sub-magnetoresistive layers are isolated by an insulating material.

[0028] In one possible implementation of the first aspect, the first sub-magnetoresistive layer is made of a hard magnetic material, and the third sub-magnetoresistive layer is made of a soft magnetic material.

[0029] Secondly, embodiments of this application provide a magnetic tape storage device, the magnetic tape storage device including a magnetic head assembly as described in any of the first aspects above.

[0030] In conjunction with the second aspect, in one possible implementation of the second aspect, the magnetic tape storage device further includes: a magnetic tape, wherein the magnetic head assembly is used to perform read and write operations on the magnetic tape.

[0031] In conjunction with the second aspect, in one possible implementation of the second aspect, the magnetic tape storage device further includes: a driving device for driving the magnetic head assembly to move.

[0032] Thirdly, embodiments of this application propose a storage system comprising a processor and a magnetic tape storage device as described in the second aspect above, wherein the processor is used to generate data and the magnetic tape storage device is used to store the data.

[0033] Fourthly, embodiments of this application provide a computer device that includes a magnetic tape storage device as described in the second aspect above, the magnetic tape storage device being used to store data. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of a magnetic tape storage device.

[0035] Figure 2 This is a schematic diagram of a magnetic head assembly.

[0036] Figure 3 A schematic diagram of a structure for an ESD protection unit;

[0037] Figure 4a This is a schematic diagram of a structure of the magnetic head assembly 1000 in an embodiment of this application;

[0038] Figures 4b-4c This is a schematic diagram of a structure of substrate 1100 in an embodiment of this application;

[0039] Figures 5a-5b This is a schematic diagram of another structure of the substrate 1100 in an embodiment of this application;

[0040] Figures 6a-6b This is a schematic diagram of one structure of the cover plate 1200 in an embodiment of this application;

[0041] Figures 7a-7b This is a schematic diagram of another structure of the cover plate 1200 in the embodiments of this application;

[0042] Figures 8a-8b This is a partial structural diagram of the magnetic head assembly 1000 in an embodiment of this application;

[0043] Figures 9a-9b This is a schematic diagram of one structure of the cover plate 1200 in an embodiment of this application;

[0044] Figures 10a-10b This is a schematic diagram of another structure of the cover plate 1200 in the embodiments of this application;

[0045] Figures 11a-11b This is a partial structural diagram of the magnetic head assembly 1000 in an embodiment of this application;

[0046] Figures 12a-12b This is a schematic diagram of one structure of the cover plate 1200 in an embodiment of this application;

[0047] Figures 13a-13b This is a partial structural diagram of the magnetic head assembly 1000 in an embodiment of this application;

[0048] Figures 14a to 14g This is a schematic diagram of the processing flow of the magnetic head assembly 1000 in the embodiments of this application;

[0049] Figure 15 This is a schematic diagram of a magnetic tape storage device in an embodiment of this application;

[0050] Figure 16 A schematic diagram of the structure of a computer device 1600 provided in this application. Detailed Implementation

[0051] The embodiments of this application are described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. As those skilled in the art will understand, with the development of technology and the emergence of new scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0052] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0053] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0054] To facilitate understanding of the embodiments of this application, the terminology used in this application will be briefly introduced below.

[0055] 1. Magnetic Tape Storage: A technology that uses magnetic tape for persistent data storage. Magnetic tape is a non-volatile storage medium, typically packaged in rolls. It is a strip of material with a magnetic layer used to record sound, images, numbers, text, or other signals. Typically, magnetic tape is packaged in a roll. Due to its sequential access characteristics, magnetic tape is used in traditional storage and backup, as well as for sequentially reading and writing large amounts of data. Magnetic tape can also be called a tape body. The tracks on the tape where data is recorded are called tracks. Magnetic tape: A strip of material with a magnetic layer used to record sound, images, numbers, or other signals. Magnetic media, such as magnetic powder, are attached to the magnetic tape to store the data. For example, the magnetic field changes in this magnetic medium are usually achieved by coating a plastic film substrate (support) with a layer of granular magnetic material or by evaporating and depositing a layer of magnetic oxide or alloy film. The substrate of magnetic tape can include, but is not limited to: paper, celluloid, or polyester film.

[0056] 2. Magnetic particle: A hard magnetic single-domain particle. Magnetic particle, combined with binders and solvents, forms a magnetic paste, which is then coated onto the surface of a plastic or metal substrate (support) to create magnetic recording materials such as magnetic tapes, disks, and magnetic cards. Magnetic particle is the core component of magnetic coatings and a major factor determining the magnetic properties of magnetic recording media. Magnetic particle affects the properties of magnetic recording materials. Commonly used magnetic particles are broadly classified into two categories: oxide magnetic particles and metallic magnetic particles.

[0057] 3. Magnetic Tape Storage Device: A magnetic tape storage device includes a magnetic tape drive, a head assembly, and a magnetic tape. The magnetic tape drive drives the magnetic tape to move, enabling the head assembly, including the magnetic heads, to read and write magnetic powder on the tape. An example is... Figure 1 As shown, Figure 1 This is a schematic diagram of a magnetic tape storage device. The magnetic tape storage device includes a tape cassette, a reel, a head structure, and a support. The head structure includes a head driver and a head. The tape cassette is a single-reel cassette. When the tape cassette is loaded into the tape drive, the reel and its rotation cause the tape in the cassette to be wound onto the reel. During the movement of the tape, the head driver drives the head to perform read or write operations on a first side of the tape. The first side is coated with magnetic powder. The tape also includes a second side, which is not coated with magnetic powder.

[0058] 4. Magnetic Head: This refers to the component that reads and writes data onto a magnetic tape based on magnetic principles. Magnetic heads are divided into write heads and read heads. The write head records data by magnetizing the magnetic medium to change its magnetic field. The read head reads data from the magnetic medium by sensing its magnetic field.

[0059] During data reading and writing, the magnetic head's movement relative to the magnetic tape can easily generate static electricity. To prevent electrostatic damage to the magnetic head, an electrostatic discharge (ESD) protection unit (ESD unit or ESD chip) needs to be added to the magnetic head. This ESD protection unit is used to protect the magnetic head from ESD. For easier understanding, please refer to [link to relevant documentation]. Figure 2 , Figure 2This is a schematic diagram of a magnetic head assembly. The assembly includes: a magnetic head, a magnetic head substrate (hereinafter referred to as the substrate), a magnetic head cover plate (hereinafter referred to as the cover plate), a flexible printed circuit (FPC), and an ESD protection unit. The substrate includes the magnetic head, and the cover plate is bonded to the substrate to protect the magnetic head. Further, the substrate can also be mounted on a base. Pads are provided on the substrate and are electrically connected to the magnetic head. The FPC is mounted on the substrate, and the ESD protection unit is mounted on the FPC. The ESD protection unit is electrically connected to the pads via wire bonding technology, thereby achieving electrical connection between the ESD protection unit and the magnetic head.

[0060] For one example, please refer to Figure 3 , Figure 3 This is a schematic diagram of an ESD protection unit. The ESD protection unit is electrically connected to the magnetic head. The ESD protection unit includes a transient voltage suppressor (TVS), a resistor, and a capacitor. The transient voltage suppressor is an overvoltage protection device that can clamp transient high voltages (such as lightning, static electricity, surges, etc.) in the circuit to a safe voltage range within nanoseconds, protecting sensitive electronic components from damage caused by transient high voltages.

[0061] The following section introduces one possible manufacturing method for current magnetic head assemblies. Figure 2 The illustration uses a sample head assembly as an example. Please refer to [link / reference]. Figure 3 , Figure 3 This is a schematic diagram of a manufacturing process for a magnetic head assembly. One possible manufacturing method is as follows:

[0062] 1. The substrate wafer is diced to obtain a block substrate, on which a magnetic head is fabricated. A cover plate is then bonded to the substrate to protect the magnetic head. The substrate can be made of aluminum titanium carbon (AlTiC) material (or aluminum titanium carbide). The cover plate can also be made of aluminum titanium carbon (AlTiC) material (or aluminum titanium carbide). AlTiC material possesses the properties of both metals and ceramics, exhibiting electrical and thermal conductivity similar to metals, high elastic modulus and excellent high-temperature mechanical properties similar to ceramics, while also possessing good thermal shock resistance, damage resistance, and excellent chemical corrosion resistance. Both the substrate and the cover plate are wafers.

[0063] 2. The substrate and cover plate are block-shaped wafers, so they need to be processed into bars. In the process of processing into bars, the substrate and cover plate need to be cut and ground.

[0064] 3. The substrate and cover plate are bonded to the base.

[0065] 4. The magnetic head stepped structure is obtained by processing on the substrate.

[0066] 5. A flexible printed circuit board (FPC) is mounted on the substrate, and an ESD protection unit is mounted on the FPC. Then, the pads on the substrate are electrically connected to the ESD protection unit by wire bonding. The pads are also electrically connected to the magnetic head mounted on the substrate, thus achieving an electrical connection between the magnetic head and the ESD protection unit.

[0067] In the aforementioned magnetic head assembly, both the magnetic head and the ESD protection unit are fabricated from wafers. For ease of distinction, the wafer used to fabricate the magnetic head is called the magnetic head wafer, and the wafer used to fabricate the ESD protection unit is called the ESD wafer. Since magnetic heads typically use magnetic thin film materials, the fabrication process of magnetic head wafers does not require ion implantation. Common semiconductors suffer from poor conductivity; to improve conductivity, impurities are added to increase the number of mobile electrons or holes. A commonly used method for impurity doping is ion implantation. Because the fabrication process of magnetic head wafers does not require ion implantation, while the fabrication process of ESD wafers does, magnetic head wafers are incompatible with ESD circuit designs for Complementary Metal Oxide Semiconductor (CMOS) chips. Current magnetic head assemblies require an additional ESD wafer to process the ESD protection unit, which is then placed on the FPC around the magnetic head. The ESD protection unit is connected to the magnetic head via wire bonding, resulting in a large overall size of the magnetic head assembly and increasing the processing difficulty and cost of the magnetic head assembly.

[0068] Based on this, this application proposes a magnetic head assembly with an electrostatic discharge (ESD) protection unit disposed on the cover plate of the magnetic head assembly. Since the ESD protection unit is removed from the flexible circuit board surrounding the magnetic head assembly, the overall size of the magnetic head assembly can be reduced. Fabricating the ESD protection unit on the cover plate eliminates the need to fabricate it separately on an additional wafer, thus reducing the manufacturing difficulty and cost of the magnetic head assembly. Furthermore, compared to placing the ESD protection unit on the flexible circuit board surrounding the magnetic head assembly, the distance between the ESD protection unit and the magnetic head is shortened by placing it on the cover plate, thereby enhancing the discharge capability of the ESD protection unit.

[0069] The magnetic head assembly proposed in this application will now be described in conjunction with the accompanying drawings. Please refer to the attached figures. Figure 4a , Figure 4aThis is a schematic diagram of a magnetic head assembly 1000 according to an embodiment of this application. The magnetic head assembly 1000 proposed in this embodiment includes: a substrate 1100, a cover plate 1200, a flexible circuit board 1300, a lead wire 1400, and a base 1500. N magnetic heads 1110 are disposed on the substrate 1100, and M first units 1210 are disposed on the cover plate 1200. The N magnetic heads 1110 are electrically connected to the M first units 1210, and the M first units 1210 provide electrostatic discharge protection to the N magnetic heads 1110.

[0070] Specifically, the substrate 1100 includes L first spaces 1120, and N magnetic heads 1110 are disposed within the L first spaces 1120; a cover plate 1200 is disposed on the substrate 1100, and the cover plate 1200 is used to encapsulate the N magnetic heads 1110 within the L first spaces 1120; the cover plate 1200 includes K second spaces 1220, and M first units 1210 are disposed within the K second spaces 1220; the M first units 1210 are electrically connected to the N magnetic heads 1110, and the first units 1210 are used to provide electrostatic discharge protection to the magnetic heads 1110, wherein N is an integer greater than or equal to 1, M is an integer greater than or equal to 1, L is an integer greater than or equal to 1, and K is an integer greater than or equal to 1.

[0071] In one example, L equals N, meaning the number of first spaces 1120 on substrate 1100 is the same as the number of magnetic heads 1110 on substrate 1100.

[0072] In another example, L is less than N, meaning that a first space 1120 on substrate 1100 accommodates multiple magnetic heads 1110.

[0073] In one example, K equals M, meaning the number of second spaces 1220 on cover 1200 is the same as the number of first units 1210 on cover 1200.

[0074] In another example, K is less than M, meaning that a second space 1220 on the cover plate 1200 accommodates a plurality of first units 1210.

[0075] In one example, L equals N equals K equals M. For instance, the substrate 1100 of the head assembly 1000 includes eight first spaces 1120, each containing one magnetic head 1110. The cover plate 1200 of the head assembly 1000 includes eight second spaces 1220, each containing one first unit 1210. Each first unit 1210 is connected to one magnetic head 1110 and provides electrostatic discharge protection to that magnetic head 1110.

[0076] Optionally, the N magnetic heads 1110 on the substrate 1100 are electrically connected to the flexible circuit board 1300 through the pads provided on the cover plate 1200 via wire bonding technology, that is, the N magnetic heads 1110 and the M first units 1210 are electrically connected to the flexible circuit board 1300 via leads 1400.

[0077] Optionally, the substrate 1100 is disposed on the base 1500. The substrate 1100 can be adhered to the base 1500. The flexible circuit board 1300 can be adhered to the cover plate 1200.

[0078] Next, we will first introduce the cover plate 1200. In this embodiment, the cover plate 1200 can be made of semiconductor materials, other materials suitable for chip processing, or other materials used as wafers. For example, the semiconductor material can be a semiconductor element or a semiconductor compound. For instance, the cover plate 1200 is made of aluminum titanium carbon, silicon oxide, or silicon. The first unit 1210 and its related links are then processed on the cover plate 1200.

[0079] In one possible implementation, the cover plate 1200 is processed as follows: K second spaces 1220 are processed on the cover plate 1200 by machining or etching, and the second spaces 1220 are grooves on the cover plate 1200.

[0080] In another possible implementation, another processing method for the cover plate 1200 is as follows: K second spaces 1220 are planned on the cover plate 1200, and M first units 1210 are processed on the K second spaces 1220.

[0081] One possible processing method for obtaining the first unit 1210 on the cover plate 1200 is as follows: the cover plate 1200 is processed using CMOS technology to obtain the first unit 1210.

[0082] The first unit 1210 in this embodiment provides electrostatic discharge protection to the magnetic head 1110. In one example, the first unit 1210 includes a metal-oxide-semiconductor field-effect transistor (MOSFET), an inductor, and / or a capacitor. In another example, the first unit 1210 includes a transient voltage suppressor (TVS), a resistor, and a capacitor. Yet another example shows that the first unit 1210 includes a diode, an inductor, and / or a capacitor. It should be noted that the first unit 1210 in this embodiment includes not only the aforementioned MOSFET, TVS, inductor, and / or capacitor, but also circuitry connecting the various components. The specific structure of the first unit 1210 is not limited in this embodiment.

[0083] Next, the substrate 1100 is introduced. In this embodiment, the substrate 1100 is made of insulating dielectric material and / or conductive material. For example, the insulating dielectric material can be quartz or sapphire. The conductive material can be aluminum titanium carbon, silicon oxide, or silicon, etc. The substrate can also use other semiconductor elements or semiconductor oxides; this embodiment does not limit this. N magnetic heads 1110 are fabricated on the substrate 1100. One of the N magnetic heads 1110 utilizes the giant magnetoresistance effect to read and write data. For example, the magnetic head 1110 includes a layered magnetic thin film structure, which is formed by alternating layers of ferromagnetic and non-ferromagnetic materials. N magnetic heads 1110 are fabricated on the substrate 1100. The substrate 1100 can also serve as a substrate for the magnetic heads 1110 or a substrate.

[0084] In one possible implementation, the substrate 1100 may be processed as follows: L first spaces 1120 are processed on the substrate 1100 by mechanical processing or etching, and the first spaces 1120 are grooves on the substrate 1100.

[0085] The magnetic head 1110 is described below. The specific structure of the magnetic head 1110 is not limited in this application embodiment. The magnetic head 1110 is used to perform read and / or write operations on the storage medium.

[0086] In one example, one of the N magnetic heads 1110 includes: a first electrode, a second electrode, a first shielding layer, a second shielding layer, and a magnetoresistive layer. The first shielding layer is disposed between a first surface of the substrate 1100 and a second surface of the first electrode corresponding to the first shielding layer, and the first shielding layer and the first electrode are isolated by an insulating material. The magnetoresistive layer is disposed between the first surface of the first electrode and the second surface of the second electrode. The second shielding layer is disposed on the first surface of the second electrode. The first electrode and the second electrode are used to provide voltage to the magnetic head 1110, the magnetoresistive layer is used to convert magnetic signals and electrical signals, and the first shielding layer and the second shielding layer are used to isolate interference magnetic fields.

[0087] In other words, the first shielding layer and the second shielding layer of the magnetic head 1110 include a first electrode and a second electrode, and a magnetoresistive layer is included between the first electrode and the second electrode.

[0088] For example, the first and second shielding layers are made of low coercivity materials, such as nickel-iron (NiFe) alloy or cobalt-iron (CoFe) alloy.

[0089] In one example, the magnetoresistive layer includes: two first sub-magnetoresistive layers and one second sub-magnetoresistive layer; the second sub-magnetoresistive layer is disposed between the two first sub-magnetoresistive layers, and the first sub-magnetoresistive layers and the second sub-magnetoresistive layer are isolated by an insulating material; the second sub-magnetoresistive layer includes two third sub-magnetoresistive layers, and the two third sub-magnetoresistive layers are isolated by an insulating material.

[0090] Optionally, the first sub-magnetoresistive layer uses a hard magnetic material, and the third sub-magnetoresistive layer uses a soft magnetic material. Soft magnetic materials can also be called low-coercivity materials, which refer to materials where the coercivity (Hc) during magnetization is no greater than 1000 A / m. Examples of low-coercivity materials include nickel-iron (NiFe) alloys, cobalt-iron (CoFe) alloys, iron-silicon alloys, or iron-aluminum alloys. Insulating materials include polyimide film, magnesium oxide (MgO), or aluminum oxide (Al2O3). Hard magnetic materials refer to materials that retain their magnetism for a long time after magnetization and are not easily demagnetized. Hard magnetic materials have high coercivity, such as neodymium iron boron (NdFeB) materials or cobalt-based permanent magnet alloys (SmCo).

[0091] Optionally, the specific structure of one of the N magnetic heads 1110 is as follows: a first shielding layer, a first electrode, a magnetoresistive layer, a second electrode, and a second shielding layer, with the above structures alternately stacked.

[0092] For ease of description, the embodiments of this application will use a spatial rectangular coordinate system to introduce the scheme, wherein the side of the component facing the +Z axis is defined as the first side, and the side of the component facing the -Z axis is defined as the second side. The magnetic head assembly 1000 proposed in this application embodiment specifically includes two possible implementations:

[0093] In one implementation method, the second surface of the cover plate 1200 includes K second spaces 1220; the magnetic head assembly 1000 specifically includes: the first surface of the substrate 1100 includes L first spaces 1120; the second surface of the cover plate 1200 is disposed on the first surface of the substrate 1100, so that L first spaces 1120 and K second spaces 1220 are formed between the first surface of the substrate 1100 and the second surface of the cover plate 1200.

[0094] Implementation Method 2: The cover plate 1200 includes K second spaces 1220, including: the first surface of the cover plate 1200 includes K second spaces 1220; the magnetic head assembly 1000 specifically includes: the first surface of the substrate 1100 includes L first spaces 1120; the second surface of the cover plate 1200 is disposed on the first surface of the substrate 1100, so that L first spaces 1120 are formed between the first surface of the substrate 1100 and the second surface of the cover plate 1200.

[0095] First, let's introduce implementation method one.

[0096] Taking a substrate 1100 comprising two first spaces 1120, each of which is equipped with a magnetic head 1110, as an example, the structure of the substrate 1100 is as follows: Figures 4b-4c as well as Figures 5a-5b As shown. Figures 4b-4c This is a schematic diagram of a structure of substrate 1100 in an embodiment of this application, wherein, Figure 4c The diagram illustrates a side view of substrate 1100. Substrate 1100 includes two first spaces 1120 disposed on a first surface of substrate 1100. (See diagram below.) Figures 5a-5b As shown, Figures 5a-5b This is another structural schematic diagram of the substrate 1100 in an embodiment of this application, wherein, Figure 5b The diagram shows a side view of the substrate 1100. A magnetic head 1110 is disposed within each first space 1120.

[0097] Taking a cover plate 1200 comprising two second spaces 1220, each of which contains a first unit 1210 as an example, the structure of the cover plate 1200 is as follows: Figures 6a-6b As shown. Figures 6a-6b This is a schematic diagram of a structure of the cover plate 1200 in an embodiment of this application, wherein, Figure 6b The diagram illustrates a side view of the cover plate 1200. The cover plate 1200 includes two second spaces 1220, which are disposed on the second surface of the cover plate 1200. A first through hole 1230 is also provided at the bottom of each second space 1220, allowing the second space 1220 to communicate with the first surface of the cover plate 1200. Figures 7a-7b As shown, Figures 7a-7b This is another structural schematic diagram of the cover plate 1200 in an embodiment of this application, wherein, Figure 7b The diagram shows a side view of the cover plate 1200. A first unit 1210 is provided within each second space 1220.

[0098] In one possible implementation, the first through-hole 1230 can be fabricated using through-silicon via (TSV) technology.

[0099] The magnetic head assembly 1000, composed of the aforementioned substrate 1100 and cover plate 1200, is as follows: Figures 8a-8b As shown, Figures 8a-8b This is a partial structural diagram of the magnetic head assembly 1000 in an embodiment of this application, wherein, Figure 8bThe diagram illustrates a side view of the cover plate 1200 and the substrate 1100. The second surface of the cover plate 1200 is disposed on the first surface of the substrate 1100, forming a first space 1120 and a second space 1220 between the substrate 1100 and the cover plate 1200. The magnetic head 1110 is electrically connected to the first unit 1210, and the first unit 1210 is electrically connected to a first pad 1250 disposed on the first surface of the cover plate 1200 through a first through-hole 1230. The first pad 1250 disposed on the cover plate 1200 is electrically connected to a second pad 1310 disposed on the flexible circuit board 1300 through a lead 1400, thus electrically connecting the magnetic head 1110 and the first unit 1210 to the flexible circuit board 1300 through the first pad 1250, the lead 1400, and the second pad 1310. The substrate 1100 and the cover plate 1200 are connected together by direct bonding.

[0100] In one possible implementation, the M first units 1210 are electrically connected to the N magnetic heads 1110, including: one of the M first units 1210 is electrically connected to one of the N magnetic heads 1110 through hybrid bonding.

[0101] In one possible implementation, on the first surface of the cover plate 1200, the first pad 1250 is obtained by a ball-mounting process at the corresponding position of the first through hole 1230.

[0102] In one possible implementation, the first space 1120 and the second space 1220 in implementation method one can be obtained by machining or by etching.

[0103] Next, we will introduce the second implementation method.

[0104] In the second implementation method, taking the substrate 1100 as an example, which includes two first spaces 1120, and each of the two first spaces 1120 is equipped with a magnetic head 1110. The structure of the substrate 1100 is similar to... Figures 4b-4c as well as Figures 5a-5b The schematic structure is the same, so it will not be repeated here.

[0105] Taking the cover plate 1200 as an example, which includes two second spaces 1220, and each of the two second spaces 1220 is provided with a first unit 1210.

[0106] In one possible implementation, the cover plate 1200 has the following structure: Figures 9a-9b As shown. Figures 9a-9b This is a schematic diagram of a structure of the cover plate 1200 in an embodiment of this application, wherein, Figure 9bThe diagram illustrates a side view of the cover plate 1200. The cover plate 1200 includes two second spaces 1220, which are disposed on the first surface of the cover plate 1200. A second through hole 1240 is also provided at the bottom of each second space 1220, allowing the second space 1220 to communicate with the second surface of the cover plate 1200. Figures 10a-10b As shown, Figures 10a-10b This is another structural schematic diagram of the cover plate 1200 in an embodiment of this application, wherein, Figure 10b The diagram shows a side view of the cover plate 1200. A first unit 1210 is provided within each second space 1220. The second space 1220 can be obtained by machining or etching.

[0107] The magnetic head assembly 1000, composed of the aforementioned substrate 1100 and cover plate 1200, is as follows: Figures 11a-11b As shown, Figures 11a-11b This is a partial structural diagram of the magnetic head assembly 1000 in an embodiment of this application, wherein, Figure 11b The diagram illustrates a side view of the cover plate 1200 and the substrate 1100. The second surface of the cover plate 1200 is disposed on the first surface of the substrate 1100, forming a first space 1120 between the substrate 1100 and the cover plate 1200. A second space 1220 is disposed on the first surface of the cover plate 1200. The magnetic head 1110 and the first unit 1210 are electrically connected through a second through-hole 1240. The first unit 1210 is electrically connected to a second pad 1310 disposed on the flexible circuit board 1300 through a lead 1400, thus enabling the magnetic head 1110 and the first unit 1210 to be electrically connected to the flexible circuit board 1300 via the lead 1400 and the second pad 1310.

[0108] In another possible implementation, the structure of the cover plate 1200 is as follows: Figures 12a-12b As shown. Figures 12a-12b This is a schematic diagram of a structure of the cover plate 1200 in an embodiment of this application, wherein, Figure 12b The diagram illustrates a side view of the cover plate 1200. Two first units 1210 are provided on the first surface of the cover plate 1200. In other words, instead of drilling or etching a groove on the first surface of the cover plate 1200 to create a second space 1220, two areas are selected on the surface of the first surface of the cover plate 1200 as the second space 1220, and the two first units 1210 are machined within the corresponding areas of the second space 1220 on the first surface of the cover plate 1200. A second through hole 1240 is also provided at the bottom of the second space 1220, allowing the second space 1220 to communicate with the second surface of the cover plate 1200.

[0109] The magnetic head assembly 1000, composed of the aforementioned substrate 1100 and cover plate 1200, is as follows: Figures 13a to 11b As shown, Figures 13a-13bThis is a partial structural diagram of the magnetic head assembly 1000 in an embodiment of this application, wherein, Figure 13b The diagram illustrates a side view of the cover plate 1200 and the substrate 1100. The second surface of the cover plate 1200 is disposed on the first surface of the substrate 1100, forming a first space 1120 between the substrate 1100 and the cover plate 1200. A second space 1220 is disposed on the first surface of the cover plate 1200. The magnetic head 1110 and the first unit 1210 are electrically connected through a second through-hole 1240. The first unit 1210 is electrically connected to a second pad 1310 disposed on the flexible circuit board 1300 through a lead 1400, thus enabling the magnetic head 1110 and the first unit 1210 to be electrically connected to the flexible circuit board 1300 via the lead 1400 and the second pad 1310.

[0110] The first unit 1210 can be glued to the substrate 1100.

[0111] In one possible implementation, the second through-hole 1240 can be fabricated using through-silicon via (TSV) technology.

[0112] In the second implementation, the substrate 1100 and the cover plate 1200 can be bonded together with adhesive. This application embodiment does not limit the connection method between the substrate 1100 and the cover plate 1200.

[0113] By providing an electrostatic discharge (ESD) protection unit on the cover plate 1200 of the head assembly 1000 in the above manner, the overall size of the head assembly 1000 can be reduced by eliminating the need for an ESD protection unit on the flexible circuit board 1300 surrounding the head assembly 1000. Fabricating the ESD protection unit on the cover plate 1200 eliminates the need for separate fabrication on an additional wafer, thus reducing the fabrication difficulty and cost of the head assembly 1000. Furthermore, compared to fabricating the ESD protection unit on the flexible circuit board 1300 surrounding the head assembly 1000, the distance between the ESD protection unit and the head 1110 is shortened when the ESD protection unit is on the cover plate 1200, thereby enhancing the ESD protection unit's discharge capability.

[0114] In conjunction with the foregoing embodiments, the following describes a processing method for a magnetic head assembly 1000 according to an embodiment of this application. Please refer to... Figures 14a to 14g , Figures 14a to 14g This is a schematic diagram of the manufacturing process of the magnetic head assembly 1000 in an embodiment of this application. Figure 14a As shown, using the cover plate 1200 as a wafer, eight first units 1210 (i.e., the circuitry of the ESD protection unit) are processed on the first surface of the cover plate 1200. Figure 14b As shown, using substrate 1100 as a wafer, eight magnetic heads 1110 are processed on the first surface of substrate 1100.

[0115] Secondly, with Figure 14c As shown, Figure 14a The cover plate 1200 and Figure 14b The substrate 1100 is connected as a whole by hybrid bonding, and the first unit 1210 is electrically connected to the magnetic head 1110.

[0116] Again, such as Figure 14d As shown, in Figure 14c The second surface of the cover plate 1200 is ground, and then eight first through holes 1230 are formed using the TSV process. Each first through hole 1230 corresponds to a first unit 1210. A redistribution layer (i.e., first pad 1250) is formed at the corresponding position of the first through holes 1230 on the second surface of the cover plate 1200 using the Re-Distribution Layer (RDL) process, allowing the magnetic head 1110 and the first unit 1210 to be electrically connected to the redistribution layer through the first through holes 1230. Then, the block components of the cover plate 1200 and the substrate 1100 are ground and cut into bars.

[0117] Redistribution layer technology is one of the key interconnect processes in advanced packaging, enabling the integration of multiple chips into a single package. The process of creating a patterned metal layer on top of a dielectric layer redistributes the input / output (I / O) locations of the integrated circuit (IC) to new locations. These new locations are typically situated at the chip edge, allowing the IC to be connected to a printed circuit board using standard surface mount techniques.

[0118] Again, such as Figure 14e As shown, Figure 14d The substrate 1100 and cover plate 1200 are bonded to the base 1500.

[0119] Again, such as Figure 14f As shown, the substrate 1100 is subjected to a grinding step process to obtain the magnetic head 1110 step.

[0120] Finally, as Figure 14g As shown, a flexible circuit board 1300 is disposed on the cover plate 1200, and then the first pad 1250 and the second pad 1310 disposed on the flexible circuit board 1300 are electrically connected through a lead wire 1400. Optionally, a ball-mounting process can be used to achieve the electrical connection between the first pad 1250 and the second pad 1310 through the lead wire 1400.

[0121] In conjunction with the foregoing embodiments, this application also proposes a magnetic tape storage device, which includes the magnetic head assembly of the foregoing embodiments. For ease of understanding, please refer to... Figure 15 , Figure 15 This is a schematic diagram of a magnetic tape storage device according to an embodiment of this application. The magnetic tape storage device 2000 includes a head assembly 1000. The head assembly 1000 includes a plurality of magnetic heads 1110 and a head driver 210, the plurality of magnetic heads 1110 being disposed on the head driver 210. Optionally, the magnetic tape storage device may further include a magnetic tape 220, a roller 230, and a reel 240. The head driver 210 drives the magnetic heads 1110 to perform read or write operations on the magnetic tape 220. The magnetic tape 220 is loaded into the reel 240, and the rotation of the roller 230 causes the magnetic tape 220 to be wound into the reel 240.

[0122] Understandable, Figure 15 The illustrated magnetic tape storage device is merely an example and does not limit the specific structure of the magnetic tape storage device proposed in the embodiments of this application.

[0123] Figure 16 This is a structural schematic diagram of a computer device 1600 provided in this application. Figure 16 As shown, computer device 1600 includes processor 1610, communication interface 1620, bus 1630, and magnetic tape storage device 2000. Processor 1610, magnetic tape storage device 2000, and communication interface 1620 are connected via bus 1630.

[0124] It should be understood that in this embodiment, the processor 1610 may be a CPU, but it can also be other general-purpose processors, digital signal processors (DSPs), ASICs, FPGAs, or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor. The processor may also be a graphics processing unit (GPU), a neural network processing unit (NPU), a microprocessor, an ASIC, or one or more integrated circuits used to control the execution of the program according to the present application. As an example, the computer device 1600 may include multiple processors. A processor may be a multi-core (multi-CPU) processor. Here, a processor may refer to one or more devices, circuits, and / or computing units used to process data (e.g., computer program instructions).

[0125] The communication interface 1620 is used to enable communication between the computer device 1600 and external devices or components.

[0126] Bus 1630 may include a pathway for transmitting information between the aforementioned components. In addition to a data bus, bus 1630 may also include a power bus, control bus, and status signal bus. However, for clarity, all buses are labeled as bus 1630 in the diagram. Bus 1630 may be a Peripheral Component Interconnect Express (PCIe) bus, an Extended Industry Standard Architecture (EISA) bus, a Unified Bus (Ubus or UB), a Compute Express Link (CXL), a Cache Coherent Interconnect for Accelerators (CCIX), etc. Bus 1630 can be divided into address bus, data bus, control bus, etc.

[0127] It is worth noting that, Figure 16 Taking computer device 1600, which includes a processor 1610 and a magnetic tape storage device 2000, as an example, the processor 1610 and the magnetic tape storage device 2000 are used to indicate a type of device or equipment. In specific embodiments, the quantity of each type of device or equipment can be determined according to business needs.

[0128] Optionally, the computer device 1600 may also include a memory and / or RAM.

[0129] The memory can be a pool of volatile memory or a pool of non-volatile memory, or it can include both volatile and non-volatile memory. The non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory can be random access memory (RAM), which is used as an external cache.

[0130] The storage device can be a disk, such as a hard disk drive (HDD) or a solid-state drive (SSD). The magnetic tape storage device 2000 may include the magnetic head assembly described in the various embodiments above. The computer device 1600 described above can be a general-purpose device or a special-purpose device. For example, the computer device 1600 may be an edge device (e.g., a box carrying a chip with processing capabilities). Optionally, the computer device 1600 may also be a server or other device with computing capabilities.

[0131] This application also provides a storage system, which includes a processor and the magnetic tape storage device described in the above embodiments. The processor is used to generate data, and the magnetic tape storage device is used to store data.

[0132] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A magnetic head assembly, characterized in that, The magnetic head assembly includes: a base plate, a cover plate, N magnetic heads, and M first units; The substrate includes L first spaces, and the N magnetic heads are disposed in the L first spaces; The cover plate is disposed on the substrate, and the cover plate is used to encapsulate the N magnetic heads in the L first spaces; The cover plate includes K second spaces, and the M first units are disposed within the K second spaces; The M first units are electrically connected to the N magnetic heads. The first units are used to provide electrostatic discharge protection to the magnetic heads, where N is an integer greater than or equal to 1, M is an integer greater than or equal to 1, L is an integer greater than or equal to 1, and K is an integer greater than or equal to 1.

2. The magnetic head assembly according to claim 1, characterized in that, The cover plate includes the K second spaces, including: the second side of the cover plate includes the K second spaces; The magnetic head assembly specifically includes: The first surface of the substrate includes the L first spaces; The second side of the cover plate is disposed on the first side of the substrate, such that the L first spaces and the K second spaces are formed between the first side of the substrate and the second side of the cover plate.

3. The magnetic head assembly according to claim 2, characterized in that, The M first units are electrically connected to the N magnetic heads, including: One of the M first units is electrically connected to one of the N magnetic heads through hybrid bonding.

4. The magnetic head assembly according to claim 2 or 3, characterized in that, The cover plate also includes one or more first through holes, one end of which is connected to the first unit, and the other end of which includes a solder pad. One of the M first units is electrically connected to the pad through one of the one or more first through holes.

5. The magnetic head assembly according to claim 1, characterized in that, The cover plate includes the K second spaces, including: the first surface of the cover plate includes the K second spaces; The magnetic head assembly specifically includes: The first surface of the substrate includes the L first spaces; The second side of the cover plate is disposed on the first side of the substrate, such that the L first spaces are formed between the first side of the substrate and the second side of the cover plate.

6. The magnetic head assembly according to claim 5, characterized in that, The M first units are electrically connected to the N magnetic heads, including: The cover plate also includes one or more second through holes; One of the M first units is electrically connected to one of the N magnetic heads through a second through hole.

7. The magnetic head assembly according to claim 5 or 6, characterized in that, One or more solder pads are provided on the cover plate; One of the M first units is electrically connected to the pad.

8. The magnetic head assembly according to any one of claims 5-7, characterized in that, The substrate and the cover plate are bonded together with adhesive.

9. The magnetic head assembly according to claim 4 or 7, characterized in that, The magnetic head assembly also includes a flexible circuit board, and the first unit and the magnetic head are electrically connected to the flexible circuit board via the pads.

10. The magnetic head assembly according to any one of claims 1-9, characterized in that, L equals N.

11. The magnetic head assembly according to any one of claims 2-9, characterized in that, K equals M.

12. The magnetic head assembly according to any one of claims 1-11, characterized in that, The first unit includes: a metal-oxide-semiconductor field-effect transistor (MOS transistor) or a transient voltage suppressor diode (TVS transistor).

13. The magnetic head assembly according to any one of claims 1-12, characterized in that, The cover plate is made of semiconductor materials.

14. The magnetic head assembly according to any one of claims 1-13, characterized in that, The substrate is made of either semiconductor material or insulating material.

15. The magnetic head assembly according to claim 13 or 14, characterized in that, The semiconductor material includes aluminum titanium carbon, silicon oxide, or silicon.

16. The magnetic head assembly according to any one of claims 1-15, characterized in that, The magnetic head specifically includes: a first electrode, a second electrode, a first shielding layer, a second shielding layer, and a magnetoresistive layer, wherein, The first shielding layer is disposed between the first surface of the substrate and the second surface of the first electrode corresponding to the first shielding layer, and the first shielding layer and the first electrode are isolated by an insulating material. The magnetoresistive layer is disposed between the first surface of the first electrode and the second surface of the second electrode; The second shielding layer is disposed on the first surface of the second electrode; The first electrode and the second electrode are used to provide voltage to the magnetic head.

17. The magnetic head assembly according to claim 16, characterized in that, The first shielding layer is made of nickel-iron or cobalt-iron material; The second shielding layer is made of nickel-iron or cobalt-iron material.

18. The magnetic head assembly according to any one of claims 16-17, characterized in that, The magnetoresistive layer comprises: two first sub-magnetoresistive layers and one second sub-magnetoresistive layer; The second sub-magnetoresistive layer is disposed between the two first sub-magnetoresistive layers, and the first sub-magnetoresistive layer and the second sub-magnetoresistive layer are isolated by an insulating material; The second sub-magnetoresistive layer includes two third sub-magnetoresistive layers, which are separated by an insulating material.

19. The magnetic head assembly according to claim 18, characterized in that, The first sub-magnetoresistive layer is made of hard magnetic material, and the third sub-magnetoresistive layer is made of soft magnetic material.

20. A magnetic tape storage device, characterized in that, The magnetic tape storage device includes a magnetic head assembly as claimed in any one of claims 1-19.

21. The magnetic tape storage device according to claim 20, characterized in that, The magnetic tape storage device further includes a magnetic tape, wherein the magnetic head assembly is used to perform read and write operations on the magnetic tape.

22. The magnetic tape storage device according to claim 20 or 21, characterized in that, The magnetic tape storage device further includes a drive unit for driving the magnetic head assembly to move.

23. A storage system, characterized in that, The storage system includes a processor and a magnetic tape storage device as described in any one of claims 20-22, wherein the processor is used to generate data and the magnetic tape storage device is used to store the data.

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