Evaporator and cooling element

Abstract

According to one exemplary aspect, there is provided an evaporator (100) comprising: a base (110) extending along a first dimension (X) and a second dimension (Y) orthogonal with respect to the first dimension (X); and one or more evaporation chambers (130) formed in the base (110), the one or more evaporation chambers (130) being at least partially formed by two or more elongated holes (121, 122, 123) extending along the first dimension (X), wherein the elongated holes (121, 122, 123) overlap each other in the first dimension (X) and the center axes thereof are offset from each other in the second dimension (Y).

Description

Technical Field

[0001] This invention relates to an evaporator and a cooling element including the evaporator. The invention also relates to a method for manufacturing the evaporator and a method for manufacturing a cooling element including the evaporator. Background Technology

[0002] Cooling electrical and power electronic components (such as microprocessors, LEDs, IGBT modules, silicon carbide (SiC) based components, metal-core printed circuit boards (MCPCBs), power modules, etc.) is traditionally achieved by physically and thermally connecting a cooling element to the component. A typical such cooling element includes a base and a heat transfer device (e.g., a heat pipe) connected to the base, which transfers heat between two solid interfaces.

[0003] Heat pipes are typically joined to the base via mechanical press-fitting, adhesive bonding, brazing, welding, or threaded connections. Brazing or welding is more difficult because it requires precise control of the temperature and flow of the connecting alloy to avoid damaging the heat pipe while ensuring a permanent, tight bond between the joined components. Threaded connections, on the other hand, require complex machining of both the heat pipe and the base. This can lead to poor bonding between the joined components, thus hindering the operation of the cooling element.

[0004] When the evaporator is connected to the cooling elements, additional interfaces may form in the structure, which can impede heat transfer. In some applications, the evaporator can be integrated into the base. However, in this case, the evaporator structure may be more complex and difficult to manufacture, and its volume may be limited. Furthermore, the possibility of the evaporator tilting laterally can also hinder its operation.

[0005] Therefore, there is still a need to further develop evaporators and cooling elements without excessively increasing complexity, or at least to provide a useful alternative for the public. Summary of the Invention

[0006] According to a first aspect of this disclosure, an evaporator is provided, comprising:

[0007] A base extending along a first dimension and a second dimension orthogonal to the first dimension, and

[0008] One or more evaporation chambers are formed in the base, and the one or more evaporation chambers are at least partially formed by two or more elongated holes extending along the first dimension.

[0009] The elongated holes overlap each other in the first dimension, and their central axes are offset from each other in the second dimension.

[0010] Significant benefits can be achieved with this evaporator. The evaporator provides one or more large-volume evaporation chambers, which are at least partially formed by two or more elongated holes, thereby allowing heat to be collected from a large area. Since almost the entire volume of the base can be used to provide the evaporation chambers containing vapor and liquid, the evaporator has a large volume. Furthermore, the evaporator provides a large heated area for electronic or optical components attached to the mounting surface of the base. Therefore, the vast majority of the evaporator's volume can be used as an effective evaporator. Moreover, the one or more evaporation chambers are easy to manufacture, for example, by subtractive manufacturing processes (such as machining, e.g., drilling, milling, boring, and / or turning). Since the one or more evaporation chambers are formed in the base through overlapping elongated holes, there is no additional thermal interface between the one or more evaporation chambers and the base. Due to this special structure, the evaporator is less sensitive to lateral tilting. Therefore, the evaporator enables highly efficient heat transfer from electronic or optical components to the evaporation chambers.

[0011] One or more embodiments may include one or more features from the following list of items:

[0012] The base includes a first side and a second side opposite to it.

[0013] One or more of the one or more elongated holes extend from the first side toward the second side.

[0014] One or more of the one or more elongated holes extend from the second side toward the first side.

[0015] The elongated hole has a circular cross-section on the first side.

[0016] The elongated hole has a circular cross-section on the second side.

[0017] The elongated orifice includes a mechanical plug for sealing the orifice and forming a closed volume extending along the first dimension.

[0018] The elongated holes overlap each other in this second dimension.

[0019] The central axis of the elongated hole is offset in the third dimension.

[0020] The third dimension is orthogonal to the second dimension.

[0021] The elongated hole is integrated into the base.

[0022] The elongated hole is inseparable from the base.

[0023] The elongated hole is formed in the material of the base.

[0024] The elongated hole is a blind hole.

[0025] The elongated hole includes one or more grooves.

[0026] The base includes a mounting surface located in the XY plane.

[0027] The portion of the mounting surface covering the evaporation chamber is larger than the portion covering the base material.

[0028] The one or more evaporation chambers include one or more openings for connecting one or more profiles of the condenser to the evaporation chambers in fluid contact.

[0029] According to a second aspect of this disclosure, a method for manufacturing an evaporator is provided, comprising:

[0030] A base is provided that extends along a first dimension and a second dimension orthogonal to the first dimension, and

[0031] The base provides one or more evaporation chambers, which are at least partially formed by two or more elongated holes extending along the first dimension.

[0032] The elongated holes overlap each other in the first dimension and have central axes that are offset from each other in the second dimension.

[0033] According to a third aspect of this disclosure, a cooling element is provided, comprising:

[0034] The evaporator, and

[0035] A condenser comprising one or more profiles extending from the base, the profiles being in fluid contact with the elongated orifice.

[0036] According to a fourth aspect of this disclosure, a method for manufacturing a cooling element is provided, comprising:

[0037] Provide the evaporator,

[0038] Provides a condenser comprising one or more profiles, and

[0039] The profile is attached to the base so that it extends from the base.

[0040] According to a fifth aspect of this disclosure, a heat transfer system is provided, comprising:

[0041] The cooling element, and

[0042] The heat source connected to the base. Attached Figure Description

[0043] Figure 1An evaporator comprising six evaporation chambers according to at least some embodiments is shown, each evaporation chamber being formed by two elongated holes;

[0044] Figure 2 The illustration shows at least some embodiments Figure 1 The situation when the evaporator is tilted;

[0045] Figure 3 An evaporator comprising four evaporation chambers according to at least some embodiments is shown, each evaporation chamber being formed by three elongated holes;

[0046] Figure 4 The illustration shows at least some embodiments Figure 1 An evaporator, wherein the elongated orifice includes a groove;

[0047] Figure 5 The illustration shows at least some embodiments Figure 1 The manufacture of evaporators;

[0048] Figure 6 The illustration shows at least some embodiments Figure 3 The manufacture of evaporators;

[0049] Figure 7 The illustration includes, according to at least some embodiments Figure 1 The cooling elements of the evaporator;

[0050] Figure 8 The illustration includes, according to at least some embodiments Figure 1 The cooling elements of the evaporator;

[0051] Figure 9 The illustration includes, according to at least some embodiments Figure 3 The cooling elements of the evaporator; and

[0052] Figure 10 The illustration shows at least some embodiments Figure 9 The cooling element is shown with a large surface area for receiving heat. Detailed Implementation

[0053] In this article, "evaporator" refers to a device used to convert liquid into vapor. The evaporator may be a surface evaporator.

[0054] In this document, "integration" means that an element or feature is integrally formed as a component of another element or feature, such that these elements or features are inseparable from each other. Furthermore, the term also refers to elements or features formed in and from a bulk material.

[0055] In this document, "cooling element" refers to a device used to cool electrical or optical components. The cooling element is capable of transferring heat from the electrical or optical components to the ambient air.

[0056] In this article, "profile" refers to a heat transfer device that uses phase change to transfer heat between two solid interfaces. A profile can be a thermosiphon, a heat pipe in which a liquid returns to an evaporator by gravity or other accelerating forces. The profile can form the condenser section of a thermosiphon. The profile can be a tube closed at one end.

[0057] In this document, "groove" refers to a groove or pattern that can be formed on the inner surface of an elongated orifice. "Inner surface" refers to the surface of the elongated orifice configured to at least partially contact the heat-transferring phase-change fluid. The groove can be, for example, a helical groove, a thread, a microstructure, a groove pattern, a groove mesh structure, or a knurled pattern. The groove can be formed using a threading tool.

[0058] The cooling element may include an evaporator attached to or integrated into a base of the cooling element. The evaporator may include one or more vapor chambers for collecting heat from electrical or optical components. When the evaporator is attached to the base, additional thermal interfaces that impede heat transfer may be formed in the structure, potentially hindering cooling effectiveness. Some embodiments of the present invention provide solutions to at least some of the above-described problems.

[0059] According to one embodiment, an evaporator 100 is provided, comprising:

[0060] Base 110, which extends along a first dimension X and a second dimension Y orthogonal to the first dimension X, and

[0061] One or more evaporation chambers 130 are formed in the base 110, and the one or more evaporation chambers 130 are at least partially formed by two or more elongated holes 121, 122, 123 extending along the first dimension X.

[0062] The elongated holes 121, 122, and 123 overlap each other in the first dimension X, and their central axes are offset from each other in the second dimension Y.

[0063] The evaporator provides one or more large-volume evaporation chambers, which are at least partially formed by two or more overlapping elongated holes, such that the overlapping holes are in fluid communication with each other. Therefore, since almost the entire volume of the base can be used to provide the evaporation chambers—which have space for vapor and liquid—the evaporator has a large volume. Due to this special structure, the evaporator is less sensitive to lateral tilt. "Large tilt" refers to tilt in the XY plane.

[0064] Furthermore, the evaporator provides a large heat-receiving area for electronic or optical components attached to the mounting surface 113 of the base 110 of the evaporator 100. Therefore, the evaporation chamber 130 is able to collect heat from a larger area. This is in Figure 10 As can be seen from the diagram, A1 represents a first region of the mounting surface 113, A2 represents a second region of the mounting surface 113, and A3 represents a third region of the mounting surface 113. The first region A1, the second region A2, and the third region A3 may be arranged alternately along the second dimension Y. The first region A1 may cover a portion of the volume of the evaporation chamber 130, which is configured to contain a heat transfer phase change fluid 230 in liquid form, and the heat transfer phase change fluid 230 may boil therein. The second region A2 may cover a portion of the volume of the evaporation chamber 130, which is configured to contain a heat transfer phase change fluid 230 in vapor form. Furthermore, the heat transfer phase change fluid 230 may "splash" onto the surface of the evaporation chamber 130 within the volume covered by the second region A2. Depending on the level of the heat transfer phase change fluid 230 within the evaporation chamber 130, the second region A2 may be smaller or larger than the first region A1. The portion of evaporator 100 covered by the third region A3 is not configured as an evaporator, but rather forms part of the material surrounding the base 110. The third region A3 can be a solid portion between any adjacent evaporation chambers 130. Electrical or optical components can be attached to the mounting surface 113 to at least partially cover it. These electrical or optical components may cover the first region A1, and optionally also the second region A2 and / or the third region A3. Preferably, the total area covered by the first region A1 and the second region A2 is greater than the third region A3. Therefore, the majority of the evaporator's volume can be used as an effective evaporator. Thus, the evaporator enables efficient heat transfer from the electronic or optical components to the evaporation chamber. It should be noted that the size and location of regions A1, A2, and A3 can vary depending on the specific application.

[0065] Furthermore, the one or more evaporation chambers are easy to manufacture, for example, by subtractive manufacturing processes (such as machining, e.g., drilling, milling, boring, and / or turning). Since the one or more evaporation chambers are formed in the base material through elongated holes, there is no additional thermal interface between the one or more evaporation chambers and the base.

[0066] As described above and as Figure 10 As shown, the base 110 may also include a mounting surface 113 located in the XY plane. This mounting surface 113 may be configured to accommodate one or more electrical or optical components. The portion of the mounting surface 113 covering the evaporation chamber 130 is larger than the portion covering the base 110 material. Therefore, the evaporator provides a larger heat-receiving area for electronic or optical components attached to the mounting surface 113, allowing the evaporation chamber 130 to collect heat from a larger area.

[0067] Preferably, the evaporator 100 includes more than one evaporation chamber 130. For example, such as Figures 1 to 6 As shown, the number of evaporation chambers can be four or six. However, the number of evaporation chambers can be selected based on the application of the evaporator and / or the volume of the base. The number of evaporation chambers can be even or odd.

[0068] The elongated holes 121, 122, and 123 may have a length along a first dimension X and a width along a second dimension Y. The length may be greater than the width. The elongated holes 121, 122, and 123 may have the same length or different lengths. Correspondingly, the elongated holes 121, 122, and 123 may have the same width or different widths. The "width" refers to the width of the portion of the evaporation chamber formed by the corresponding elongated hole along the second dimension Y.

[0069] The elongated holes 121, 122, and 123 can extend parallel to the first dimension X. Therefore, they can be readily provided by subtractive manufacturing (e.g., machining, such as drilling, milling, boring, and / or turning).

[0070] The elongated holes 121, 122, and 123 overlap each other in the first dimension X. Therefore, the elongated holes 121, 122, and 123 can at least partially cut off (cut off) each other in the first dimension X. For example, two adjacent elongated holes, namely the first elongated hole 121 and the second elongated hole 122, and correspondingly the second elongated hole 122 and the third elongated hole 123, can be as follows: Figure 3 The figures shown overlap.

[0071] Thus, the evaporation chamber 130 can be formed by a set of interconnected elongated holes 121, 122, and 123. These elongated holes 121, 122, and 123 collectively form the cavity of the evaporation chamber 130 constituting the evaporator 100. The base 110 may include multiple sets of elongated holes 121, 122, and 123, each set forming a separate evaporation chamber 130. These separate evaporation chambers 130 may not be in fluid contact with each other.

[0072] The elongated holes 121, 122, and 123 can overlap each other in the second dimension Y. Therefore, the elongated holes 121, 122, and 123 can cut (cut off) each other in the second dimension Y, but they do not completely overlap.

[0073] The evaporation chamber 130 may also include one or more openings 140 for connecting one or more profiles 210 of the condenser to the evaporation chamber 130 in fluid contact. This allows vapor to flow into the profiles 210, thereby dissipating heat from the electrical components into the environment.

[0074] The opening 140 may be a hole formed in the evaporation chamber 130, through which the profile 210 is connected to the evaporation chamber in fluid contact. Preferably, the number of openings 140 is the same as the number of profiles 210, and each opening 140 is connected to one profile 210.

[0075] The base 110 may be rectangular and include four sides. However, the base may also have any other suitable shape, such as being circular.

[0076] The base 110 may include a first side 111 and an opposite second side 112, wherein:

[0077] One or more of the elongated holes 121 extend from the first side 111 toward the second side 112, and

[0078] One or more of the elongated holes 122, 123 extend from the second side 112 toward the first side 111.

[0079] Therefore, the elongated hole can be configured to extend inside the base 110 through the surface of the first side 111 and inside the base 110 through the surface of the second side 112.

[0080] The elongated holes 121, 122, and 123 may have circular cross-sections on the first side 111 and / or the second side 112. Therefore, the circular cross-sections may be located in the YZ plane of the base 110 surface.

[0081] The elongated orifices 121, 122, and 123 include mechanical plugs 150 for sealing the orifices and forming a closed volume or chamber extending along a first dimension X. The mechanical plugs are insertable into a first end of the elongated orifices 121, 122, and 123 located on a first side 121 or a second side 122 of the base 110. The cross-section of the elongated orifices 121, 122, and 123 located on the first side 121 or the second side 122 can be circular, therefore the cross-section of the mechanical plug 150 can also be circular. This makes sealing the elongated orifices easier than using other shapes. Furthermore, only compressive forces parallel to the radius of the mechanical plug act on it. The mechanical plugs prevent leakage from the elongated orifices 121, 122, and 123. Therefore, the mechanical plugs 150 protect the evaporator 100 from damage and enable the evaporator to operate efficiently.

[0082] The mechanical plug 150 may be made of metal, such as steel, stainless steel, aluminum, aluminum alloy, copper, or copper alloy (e.g., brass). The mechanical plug 150 made of steel may include a coating, such as a zinc plating.

[0083] The cross-sectional shape of the mechanical plug 150 can be basically the same as the shape of the elongated holes 121, 122, and 123, for example, they are all circular.

[0084] The mechanical plug 150 may be selected from, for example, a group consisting of plugs, cup-shaped plugs, threaded plugs, or any combination thereof.

[0085] Inserting the mechanical plug 150 into the elongated holes 121, 122, 123 may cause plastic deformation of the mechanical plug 150 and / or the elongated holes 121, 122, 123, thereby ensuring a fluid-tight fit. The mechanical plug 150 may include a seal located between the mechanical plug 150 and the elongated holes 121, 122, 123 (i.e., the material of the base 110).

[0086] Alternatively, elongated holes 121, 122, and 123 can also be sealed by brazing or welding of sealing components.

[0087] Figure 1 An evaporator 100 comprising six evaporation chambers 130 is shown, each chamber formed by two elongated orifices 121, 122. A base 110 includes a first side 111 and an opposing second side 112. The first elongated orifice 121 extends from the first side 111 toward the second side 112, and the second elongated orifice 122 extends from the second side 112 toward the first side 111. The elongated orifices 121, 122 overlap each other in a first dimension X, and their central axes are offset from each other in a second dimension Y. Each evaporation chamber 130 also includes a plurality of openings 140 for fluidly connecting a condenser profile to the evaporation chamber 130. The elongated orifices 121, 122 include mechanical plugs 150 for sealing the elongated orifices 121, 122 and forming a closed volume extending along the first dimension X. The evaporation chambers 130 contain a heat transfer phase change fluid 230 in both liquid and vapor states. The openings are substantially above the liquid surface in the second dimension Y. Therefore, the opening 140 is formed in the part of the evaporation chamber 130 that mainly contains the vapor.

[0088] Figure 2 It shows Figure 1 The evaporator 100 is tilted. Due to the special structure of the evaporation chamber 130 (formed by overlapping elongated holes 121, 122, 123), the evaporator 100 can be tilted in the XY plane without significantly affecting the function of the evaporator.

[0089] Figure 3An evaporator 100 is shown comprising four evaporation chambers 130, each chamber being formed by three elongated orifices 121, 122, and 123. A base 110 includes a first side surface 111 and an opposing second side surface 112. The first elongated orifice 121 extends from the first side surface 111 toward the second side surface 112, and the second elongated orifice 122 and the third elongated orifice 123 extend from the second side surface 112 toward the first side surface 111. The first elongated orifice 121 extends between the second elongated orifice 122 and the third elongated orifice 123. The elongated orifices 121, 122, and 123 overlap each other in a first dimension X, and their central axes are offset from each other in a second dimension Y. Each evaporation chamber 130 also includes a plurality of openings 140 for fluidly connecting a condenser profile to the evaporation chamber 130. The elongated orifices 121, 122, and 123 include mechanical plugs 150 for sealing the elongated orifices 121, 122, and 123 and forming a closed volume extending along the first dimension X. The evaporation chamber 130 contains the heat transfer phase change fluid 230 in both liquid and vapor states. The opening is substantially above the liquid surface in the second dimension Y. Therefore, the opening 140 is formed in the portion of the evaporation chamber 130 that primarily contains vapor.

[0090] Figure 1 , Figure 2 and Figure 3 The diagram shows that all evaporation chambers 130 are formed by two or more overlapping elongated holes 121, 122, 123. However, it is also possible for only one evaporation chamber (e.g., the one lowest in the second dimension Y) to be formed by two or more overlapping elongated holes, while the remaining evaporation chambers are formed by a single elongated hole. In this case, the evaporator may also include one or more connecting holes (not shown) extending along the second dimension Y, which intersect with the evaporation chambers and the single elongated holes connecting the evaporation chambers together. This allows vapor to flow from the evaporation chambers into the single elongated hole, condense into liquid therein, and then return to the evaporation chambers. This allows heat to be shared between the intersecting holes. For more information on connecting holes, see Finnish Patent Application No. 20235317, which is incorporated herein by reference.

[0091] The central axes of the elongated holes 121, 122, and 123 can be offset in a third dimension Z, which is orthogonal to the second dimension Y (not shown in the figure). Therefore, when viewed from the first side 111 or the second side 112 of the base 110, the center points of the elongated holes 121, 122, and 123 can be dispersed, meaning they are not located on the same straight line in the second dimension Y. This allows for the formation of evaporation chambers 130 with different shapes and sizes.

[0092] The elongated holes 121, 122, and 123 can be integrated into the base 110. This means that the elongated holes 121, 122, and 123 cannot be separated from the base 110. The elongated holes 121, 122, and 123 are formed as cavities in the material of the base 110.

[0093] like Figures 1 to 6 As shown, the elongated holes 121, 122, and 123 can be blind holes. Therefore, the elongated holes can extend from the first side 121 or the second side 122 into the interior of the base 110, but do not penetrate the base. The elongated holes 121, 122, and 123 can have a first end on the outer surface of the base 110 (i.e., the first side 121 or the second side 122), and a second end inside the base 110. Therefore, it is not necessary to seal the elongated holes 121, 122, and 123 from both ends; a mechanical plug 150 can be provided only at one end.

[0094] Alternatively, the elongated holes 121, 122, and 123 may extend through the base 110.

[0095] The elongated orifices 121, 122, and 123 may include one or more grooves. These grooves may be formed on the inner surface of the elongated orifices. The "inner surface" refers to the surface of the elongated orifice, which is configured to at least partially contact the heat transfer phase change fluid 230. The grooves can increase the surface area of ​​the elongated orifices 121, 122, and 123. This reduces the power density (W / cm²) on the boiling surface. 2 Lower power density reduces the so-called superheating phenomenon. Superheating refers to the phenomenon where the boiling surface must be above the boiling point of the liquid to initiate boiling. Superheating depends on the surface power density; the higher the power density, the more pronounced the superheating. Roughening the inner surfaces of the elongated orifices 121, 122, and 123 also helps promote boiling. Boiling requires the presence of some defects on the surface, where vapor bubbles can nucleate. This lowers the superheating temperature, thereby improving boiling.

[0096] One or more of the elongated holes 121, 122, and 123 may include one or more left-hand threads and / or one or more right-hand threads. For example, each or part of the elongated holes 121, 122, and 123 may include two threads. The first thread may be a left-hand thread, and the second thread may be a right-hand thread.

[0097] The elongated holes 121, 122, and 123 can be formed by subtractive manufacturing processes (such as machining, e.g., drilling, milling, boring, and / or turning). Subsequently, one or more grooves can be formed in one or more of the elongated holes 121, 122, and 123 by threading processes.

[0098] Figure 4 It shows Figure 1 The evaporator 130 has elongated holes 121 and 122 with grooves. The first elongated hole 121 has a first groove extending from a first side 111 toward a second side 112, and the second elongated hole 122 has a second groove extending from a second side 112 toward a first side 111.

[0099] According to one embodiment, a method for manufacturing an evaporator 100 is provided, comprising:

[0100] A base 110 is provided, which extends along a first dimension X and a second dimension Y orthogonal to the first dimension X, and

[0101] One or more evaporation chambers 130 are provided in the base 110, which are at least partially formed by two or more elongated holes 121, 122, 123 extending along the first dimension X.

[0102] The elongated holes 121, 122, and 123 overlap each other in the first dimension X, and their central axes are offset from each other in the second dimension Y.

[0103] This method provides an evaporator with at least one large-volume evaporation chamber capable of collecting heat from a large area. This, in turn, enables more efficient cooling of electrical or optical components. The one or more evaporation chambers 130 are easily manufactured, for example, by providing elongated holes 121, 122, 123 with offset central axes in the second dimension Y.

[0104] The method may include:

[0105] A base 110 is provided, which includes a first side 111 and a second side 112 opposite thereto.

[0106] Provide one or more elongated holes 121 extending from a first side 111 toward a second side 112, and

[0107] One or more 122, 123 of an elongated hole are provided, which extend from the second side 112 toward the first side 111.

[0108] For example, an elongated hole 121 extending from the first side 111 toward the second side 112 may be provided first. Subsequently, elongated holes 122, 123 extending from the second side 112 toward the first side 111 may be provided.

[0109] The method may further include providing a mechanical plug for sealing the elongated orifices 121, 122, 123 and forming a closed volume extending along a first dimension X. The mechanical plug may be manufactured separately and then attached to the elongated orifices 121, 122, 123.

[0110] Alternatively, the elongated holes 121, 122, and 123 can be sealed by means of, for example, brazing or welding, to form a closed volume extending along the first dimension X.

[0111] The base 110 may be provided by an additive manufacturing process, and / or the one or more evaporation chambers 130 may be provided by a subtractive manufacturing process. The elongated holes 121, 122, 123 forming the one or more evaporation chambers 130 may be formed in the base 110 by machining (e.g., drilling, milling, boring and / or turning).

[0112] Figure 5 It shows Figure 1 The manufacturing process of the evaporator 100 is as follows: First, a first elongated hole 121 is formed in the base 110 using a tool 301 (e.g., a drill bit), which extends from the first side surface 111 to the interior of the second side surface 112 in the first dimension X. Then, a second elongated hole 122 is formed using a tool 302 (e.g., a drill bit), which extends from the second side surface 112 to the first side surface 111 in the first dimension X.

[0113] Figure 6 It shows Figure 3 The manufacturing process of the evaporator is as follows: First, a first elongated hole 121 is formed in the base 110 using a tool 301 (e.g., a drill bit). This hole extends from a first side surface 111 to a second side surface 112 along a first dimension X. Then, a second elongated hole 122 and a third elongated hole 123 are formed using tools 302 and 303 (e.g., drill bits). These holes extend along the first dimension, from the second side surface 112 to the first side surface 111. The second elongated hole 122 and the third elongated hole 123 can be formed sequentially using the same tool or simultaneously using different tools.

[0114] According to one embodiment, a cooling element 200 is provided, comprising:

[0115] The evaporator 100 according to any embodiment of this document, and

[0116] The condenser includes one or more profiles 210 extending from the base 110, the profiles 210 being in fluid contact with the elongated holes 121, 122, 123.

[0117] The profile 210 can be a separate component from and connected to the base 110. This allows for the individual components of the cooling element to be manufactured separately. These components can then be joined together to form the desired overall structure.

[0118] The profile 210 is preferably made of a thermally conductive material, such as aluminum or an aluminum alloy. The cross-section of the profile can be circular or any other suitable shape.

[0119] The profile 210 can be used as a heat pipe. The profile 210 may have a closed volume in which a heat transfer phase change fluid 230 is disposed and functions.

[0120] The elongated orifices 121, 122, and 123 can accommodate the heat transfer phase change fluid 230. The heat transfer phase change fluid is preferably a saturated vapor with very few or no impurities.

[0121] The first part of the evaporation chamber 130 can contain the heat transfer phase change fluid 230 in liquid form, and the second part of the evaporation chamber 130 can contain the heat transfer phase change fluid 230 in vapor form, wherein the profile 210 can be connected to the second part.

[0122] When the profile 210 is connected to the evaporation chamber 130, the evaporation chamber 130 can be configured to form an evaporator, and the profile 210 can be configured to form a condenser. This enables a thermosiphon cycle, where the liquid is converted into vapor in the evaporator, and the vapor reaching the profile 210 is converted back into liquid and flows back to the evaporation chamber 130.

[0123] The profile 210 may extend at an inclined angle relative to the base 110.

[0124] The tilt angle can be 5 to 45 degrees, preferably 10 to 15 degrees.

[0125] The cooling element 200 may further include a plurality of fins 220 connected to or formed on the profile 210. The profile 210 may extend through the fins 220, or the fins 220 may be connected to the profile 210 by brazing, gluing, or welding. Alternatively, the fins 220 and the profile 210 may be integral and inseparable components. The fins provide a large heat dissipation area for dissipating heat from electrical components to the environment.

[0126] The fins 220 can be plate-shaped planar or curved elements. The fins 220 can be cut or stamped from sheet metal. Holes for the profile 210 can also be formed by cutting or stamping. When the hole size is appropriate, the fins can be tightly press-fitted to the profile, thereby achieving good heat transfer. Optionally, to optimize heat transfer, the fins can be connected to the profile by brazing, gluing, or welding.

[0127] Figure 7 It shows including Figure 1 The evaporator 100 includes a cooling element 200. The cooling element 200 comprises multiple profiles 210 connected to a base 110. A first elongated orifice 121 primarily contains vapor, while a second elongated orifice 122 is filled with a heat transfer phase change fluid 230 in liquid form. The second elongated orifice 122 expands the evaporation zone and allows for better vapor escape. The profiles 210 are connected to the first elongated orifice 121, allowing vapor to enter the profiles 210 for thermosiphon circulation. When the vapor reaches the profiles 210, it transforms back into a liquid and flows back to the evaporation chamber 130. The cooling element 200 also includes multiple fins 220 through which the profiles extend.

[0128] Figure 8 It shows including Figure 1 The evaporator 100 includes a cooling element 200. A base 110 is rotated 90 degrees in the YZ plane to position it horizontally. A first elongated orifice 121 and a second elongated orifice 122 are partially filled with a heat transfer phase change fluid 230 in liquid form. Furthermore, the first elongated orifice 121 and the second elongated orifice 122 are partially empty of liquid, primarily containing vapor. Multiple profiles 210 are connected to the portion of the evaporation chamber 130 that primarily contains vapor. The cooling element 200 also includes multiple fins 220. The profiles extend through the fins 220.

[0129] Figure 9 It shows including Figure 3 The evaporator 100 includes a cooling element 200. The cooling element 200 comprises multiple profiles 210 connected to a base 110. A second elongated orifice 122 primarily accommodates a heat transfer phase change fluid 230 in vapor form, while the first and third elongated orifices are filled with heat transfer phase change fluid 230 in liquid form. A third elongated orifice 123 expands the evaporation zone and allows for better vapor escape. The profiles 210 are connected to the second elongated orifice 122, allowing vapor to enter the profiles 210 for thermosiphon circulation. When the vapor reaches the profiles 210, it transforms back into a liquid and flows back to the evaporation chamber 130. The cooling element 200 may also include multiple fins 220 through which the profiles extend.

[0130] According to one embodiment, a method for manufacturing a cooling element 200 is provided, comprising:

[0131] An evaporator 100 according to any embodiment herein is provided.

[0132] Provides condensers comprising one or more profiles 210, and

[0133] The profile 210 is connected to the base 110 so that it extends from the base 110.

[0134] The method may also include:

[0135] Provides multiple fins 220, and

[0136] The plurality of fins 220 are connected to the profile 210.

[0137] The fins 220 can be cut or stamped from a sheet metal. Holes for a profile can then be formed in the sheet metal by cutting or stamping. Finally, the profile 210 can be inserted into the holes. This provides a simple and low-cost way to manufacture and attach the fins to a profile. When the hole size is appropriate, the fins can be press-fitted tightly to the profile, thereby achieving good heat transfer.

[0138] Alternatively, the fins 220 can be connected to the profile by brazing, welding, or adhesive bonding. This allows for optimized heat transfer.

[0139] According to one embodiment, a heat transfer system is provided, including a cooling element 200 as described in any of the preceding embodiments, and a heat source connected to a base 110. The heat source may be an optical component or an electrical component.

[0140] It should be understood that the embodiments disclosed herein are not limited to the specific structures, process steps, or materials disclosed herein, but extend to their equivalents that would be recognized by those skilled in the art. It should also be understood that the terminology used herein is for describing particular embodiments only and is not intended to be limiting.

[0141] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Numerous specific details, such as examples of length, width, shape, etc., are provided in this specification to provide a thorough understanding of embodiments of the invention.

[0142] The verbs "comprising" and "including" as used herein are used as open-ended qualifiers, neither excluding nor requiring the presence of other features not listed. Unless otherwise expressly stated, the features recited in the dependent claims may be freely combined with each other. Furthermore, it should be understood that the use of the singular forms "a" or "one" herein does not preclude the existence of plural forms.

[0143] List of reference numerals

[0144] 100 Evaporator

[0145] 110 Base

[0146] 111 First side view

[0147] 112 Second side view

[0148] 113 Mounting Surface

[0149] 121, 122, 123 Elongated holes

[0150] 130 Evaporation Chamber

[0151] 140 opening

[0152] 150 Mechanical Plug

[0153] 200 Cooling Element

[0154] 210 profile

[0155] 220 fins

[0156] 230 Heat transfer phase change fluid

[0157] Tools 301, 302, and 303

Claims

1. An evaporator (100), comprising: • A base (110) extending along a first dimension (X) and a second dimension (Y) orthogonal to the first dimension (X), and • One or more evaporation chambers (130) formed in the base (110), said one or more evaporation chambers (130) being at least partially formed by two or more elongated holes (121, 122, 123) extending along a first dimension (X), The elongated holes (121, 122, 123) overlap each other in the first dimension (X) and their central axes are offset from each other in the second dimension (Y).

2. The evaporator (100) according to claim 1, wherein the base (110) includes a first side surface (111) and an opposing second side surface (112), and wherein: • One or more of the elongated holes (121) extend from the first side (111) toward the second side (112), and • One or more of the elongated holes (122, 123) extend from the second side (112) toward the first side (111).

3. The evaporator (100) according to claim 2, wherein the elongated holes (121, 122, 123) have a circular cross-section on the first side (111) and / or the second side (112).

4. The evaporator (100) according to claim 3, wherein the elongated orifice (121, 122, 123) includes a mechanical plug (150) for sealing the elongated orifice (121, 122, 123) and forming a closed volume extending along a first dimension (X).

5. The evaporator (100) according to any of the preceding claims, wherein the elongated holes (121, 122, 123) overlap each other in the second dimension (Y).

6. The evaporator (100) according to any of the preceding claims, wherein the central axis of the elongated holes (121, 122, 123) is offset in a third dimension (Z), which is orthogonal to the second dimension (Y).

7. The evaporator (100) according to any of the preceding claims, wherein the elongated holes (121, 122, 123) are integrated into the base (110).

8. The evaporator (100) according to any of the preceding claims, wherein the elongated holes (121, 122, 123) are blind holes.

9. The evaporator (100) according to any of the preceding claims, wherein the elongated hole (121, 122, 123) comprises one or more grooves.

10. The evaporator (100) according to any of the preceding claims, wherein the base (110) includes a mounting surface (113) located in the XY plane, wherein a portion of the mounting surface (113) covering the evaporation chamber (130) is larger than a portion covering the material of the base (110).

11. A method for manufacturing an evaporator (100), comprising: • Provide a base (110) extending along a first dimension (X) and a second dimension (Y) orthogonal to the first dimension (X), and • One or more evaporation chambers (130) are provided in the base (110), said one or more evaporation chambers (130) being formed at least in part by two or more elongated holes (121, 122, 123) extending along the first dimension (X), The elongated holes (121, 122, 123) overlap each other in the first dimension (X) and their central axes are offset from each other in the second dimension (Y).

12. The method of claim 11, comprising: • Provide a base (110) which includes a first side (111) and a second side (112) opposite thereto. • Provide one or more of the elongated holes (121) extending from the first side (111) toward the second side (112), and • Provide one or more of the elongated holes (122, 123) extending from the second side (112) toward the first side (111).

13. The method according to claim 12, wherein the elongated hole (121, 122, 123) has a circular cross-section on the first side (111) and / or the second side (112).

14. The method according to any one of claims 11 to 13, further comprising providing a mechanical plug for sealing the elongated orifice (121, 122, 123) and forming a closed volume extending along a first dimension (X).

15. The method according to any one of claims 11 to 14, wherein the elongated holes (121, 122, 123) overlap each other in the second dimension (Y).

16. The method according to any one of claims 11 to 15, wherein the central axis of the elongated hole (121, 122, 123) is offset in a third dimension (Z), which is orthogonal to the second dimension (Y).

17. The method according to any one of claims 11 to 16, wherein the elongated holes (121, 122, 123) are blind holes.

18. The method according to any one of claims 11 to 17, wherein the base (100) is provided by an additive manufacturing process, and / or the one or more evaporation chambers (130) are provided by a subtractive manufacturing process.

19. The method according to any one of claims 11 to 18, wherein the elongated holes (121, 122, 123) are provided by machining, for example, drilling, milling, boring and / or turning.

20. The method according to any one of claims 11 to 19, wherein the elongated hole (121, 122, 123) comprises one or more grooves.

21. A cooling element (200), comprising: • The evaporator (100) according to any one of claims 1 to 10, and • A condenser comprising one or more profiles (210) extending from a base (110) and in fluid contact with the elongated orifices (121, 122, 123).

22. The cooling element (200) according to claim 21, wherein the elongated orifice (121, 122, 123) contains a heat transfer phase change fluid (230).

23. The cooling element (200) according to claim 22, wherein a first portion of the evaporation chamber (130) contains a heat transfer phase change fluid (230) in liquid form, and a second portion of the evaporation chamber (130) is capable of containing a heat transfer phase change fluid (230) in vapor form, wherein the profile (210) is connected to the second portion.

24. The cooling element (200) according to any one of claims 21 to 23, wherein the profile (210) extends at an inclined angle relative to the base (110).

25. The cooling element (200) according to claim 24, wherein the tilt angle is 5 to 45 degrees, preferably 10 to 15 degrees.

26. The cooling element (200) according to any one of claims 21 to 25 further includes a plurality of fins (220) connected to the profile (210).

27. A method for manufacturing a cooling element (200), comprising: • Provide an evaporator (100) according to any one of claims 1 to 10. • Provides condensers comprising one or more profiles (210), and • Connect the profile (210) to the base (110) so that it extends from the base (110).

28. The method of claim 27, further comprising: • Provides multiple fins (220), and • Connect the plurality of fins (220) to the profile (210).

29. A heat transfer system, comprising: • The cooling element (200) according to any one of claims 21 to 26, and • A heat source connected to the base (110).

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