Circuit board wave soldering device
By introducing components such as air pumps, filters, drives, brushes and vacuum cleaners into the wave solder, the problem of inconvenience in cleaning of the filter is solved, convenient waste gas treatment and equipment maintenance are achieved, and work efficiency and equipment life are improved. .
Patent Information
- Application Number
- CN202323645725.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2024-12-06
- Estimated Expiration
- 2033-12-29
AI Technical Summary
The filter mesh in existing wave soldering machines is inconvenient to clean, and workers need to clean it manually, which affects work efficiency.
A circuit board wave soldering device is designed, including a pump, a filter, a drive device, a brush and a vacuum cleaner. The filter can move in a vertical direction. The brush and a vacuum cleaner are used to clean solid impurities on the surface of the filter and spray them. The head and collection tank are used to relieve the treatment burden of brushes and water, and the screen is used to filter solid impurities in the water.
It realizes convenient cleaning of the filter, reduces the labor intensity of workers, improves the efficiency of waste gas treatment, prevents solid impurities from entering the air extraction machine, and extends the service life of the equipment.
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Figure CN222111237U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of circuit board production, and in particular to a circuit board wave soldering device. Background Art
[0002] Wave soldering is a process in which molten liquid solder is pumped to form a solder wave of a specific shape on the surface of the solder tank. The circuit board with components inserted is placed on a conveyor chain, and passes through the solder wave at a specific angle and a certain immersion depth to achieve soldering of the solder points. During the welding process, a large amount of waste gas is generated, which needs to be treated before it can be discharged.
[0003] A patent with announcement number CN217529535U discloses a wave soldering machine with waste gas treatment. In this device, the fan can transport the waste gas inside the welding machine body through the duct to the filter box. The waste gas first passes through the filter plate to intercept large particles of solid impurities to prevent the large particles of solid impurities from damaging the fan. The filtered waste gas then passes through the bellows into the waste gas treatment box for the next step of treatment. In this device, a large amount of large particles of solid impurities will be attached to the filter plate after being used for a period of time, so workers need to manually pull the filter plate out of the filter box for cleaning, which is more troublesome.
[0004] Therefore, the technical problem to be solved by the present application is: how to facilitate the cleaning of the filter. Utility Model Content
[0005] The purpose of this application is to address the above-mentioned problems existing in the prior art and to propose a circuit board wave soldering device, which solves the problem of inconvenience in cleaning the filter in the prior art. The technical effect of the present application is that it is easy to clean the filter.
[0006] The present application can be implemented through the following technical solutions: a circuit board wave soldering device, comprising a wave soldering machine body, a conduit, an exhaust fan, a filter, a driving device, a brush and a vacuum cleaner. The conduit is located beside the wave soldering machine body; the air inlet of the exhaust fan is connected to the inside of the conduit, and the exhaust fan can suck the waste gas generated by the wave soldering machine body; the filter is located at one end of the conduit close to the wave soldering machine body, and the filter can filter solid impurities in the waste gas; the driving device is used to drive the filter to move in a direction perpendicular to the axis of the conduit so that the filter is away from or close to the conduit; the brush is located beside the conduit and can contact the filter; the vacuum cleaner is located beside the brush.
[0007] In the above technical solution, welding waste gas is generated during the wave soldering process. The welding waste gas contains solid impurities such as metal oxides and metal particles. The welding waste gas needs to be treated during the wave soldering process. The vacuum pump can extract the waste gas generated during the wave soldering process and gather the waste gas in the conduit to facilitate further purification of the waste gas. The filter can filter the solid impurities in the waste gas to prevent the solid impurities from entering the vacuum pump through the conduit and causing the vacuum pump to malfunction. The drive device can drive the filter to move in a direction perpendicular to the axis of the conduit so that the filter is away from the conduit. During the horizontal movement of the filter, the brush can brush off the solid impurities on the surface of the filter. The vacuum cleaner can promptly remove the solid impurities brushed off by the brush, which is convenient and quick.
[0008] Furthermore, two of the filter screens, brushes and vacuum cleaners are each configured, and the two vertical side walls relative to each other in the thickness direction of the two filter screens are fixedly connected, the two filter screens have the same thickness direction, and both filter screens can be directly opposite to one end of the duct close to the wave soldering machine body, the two brushes can contact the two filter screens one by one, and the two vacuum cleaners are located one by one beside the two brushes.
[0009] In the above technical solution, two filters, two brushes and two vacuum cleaners are configured, and the driving device can simultaneously drive the two filters to move in a direction perpendicular to the axis of the duct, so that the two filters can alternately face the end of the duct close to the wave soldering machine. When a brush cleans the filter, solid impurities will not be sucked into the duct by the vacuum pump.
[0010] Furthermore, the cross section of the conduit and the two filter screens are both square.
[0011] In the above technical solution, the cross-section of the conduit and the two filters are both square, so that during the horizontal linear movement of the two filters, the end of the conduit close to the wave soldering machine body can always contact with the corresponding one of the two filters, preventing solid impurities from entering the conduit during the alternation of the two filters.
[0012] Furthermore, it also includes a spray head, which can spray water on the bristles of the brush.
[0013] In the above technical solution, after the brush is used for a long time, solid impurities may accumulate inside the bristles of the brush, which will affect the cleaning effect of the brush on the filter. The spray head can spray water on the brush so that the solid impurities accumulated in the bristles of the brush can leave the brush with the water.
[0014] Furthermore, it also includes a collecting trough, which is located on the side of the brush close to the ground, and can collect water after the brush is sprayed.
[0015] In the above technical solution, the collecting trough can collect the water after the brush is sprayed, which is more convenient and reduces the labor intensity of the workers.
[0016] Furthermore, a screen is fixedly connected to one end of the collecting trough away from the ground, and the screen can filter solid impurities.
[0017] In the above technical solution, the spray water can enter the collection tank through the screen, and the screen can filter the solid impurities in the water after the spray brush, which makes it easier for workers to further process the water in the collection tank, such as reusing the water in the collection tank, etc. Workers do not need to manually filter the water in the collection tank, which is more convenient.
[0018] Furthermore, the screen is arranged to be inclined relative to the ground.
[0019] In the above technical solution, the solid impurities screened out by the screen can slide along the surface of the screen and leave the screen, and workers do not need to manually clean the screen regularly, which is more convenient.
[0020] Furthermore, it also includes a collecting bucket, which is located beside the collecting trough, and the end of the screen close to the collecting bucket is lower than the end of the screen away from the collecting bucket, so that solid impurities on the surface of the screen can enter the collecting bucket.
[0021] In the above technical solution, the collecting bucket can collect the solid impurities leaving the screen, which is more convenient.
[0022] In summary, the present application has the following technical effects: welding waste gas is generated during the wave soldering process, and the welding waste gas contains solid impurities such as metal oxides and metal particles. The welding waste gas needs to be treated during the wave soldering process. The vacuum pump can extract the waste gas generated during the wave soldering process and gather the waste gas in the conduit to facilitate further purification of the waste gas. The filter can filter the solid impurities in the waste gas to prevent the solid impurities from entering the vacuum pump through the inside of the conduit and causing the vacuum pump to malfunction. The drive device can drive the filter to move in a direction perpendicular to the axis of the conduit so that the filter is away from the conduit. During the horizontal movement of the filter, the brush can brush off the solid impurities on the surface of the filter, and the vacuum cleaner can promptly remove the solid impurities brushed off by the brush, which is convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 It is a schematic diagram of the overall structure of this application.
[0024] Description of reference numerals:
[0025] 1. Wave soldering machine body; 2. Conduit; 3. Vacuum pump; 4. Filter; 5. Driving device; 6. Brush; 7. Vacuum cleaner; 8. Spray head; 9. Collection tank; 10. Screen; 11. Collection bucket; 12. Mounting plate. DETAILED DESCRIPTION
[0026] Please refer to the attached drawings in the instruction manual. Figure 1An embodiment of the present application provides a circuit board wave soldering device, including a wave soldering machine body 1, a conduit 2 is placed next to the wave soldering machine body 1, and the inside of the conduit 2 is detachably connected to an exhaust fan 3. Welding waste gas is generated during the wave soldering process. The welding waste gas contains solid impurities such as metal oxides and metal particles. The welding waste gas needs to be treated during the wave soldering process. The exhaust fan 3 can extract the waste gas generated during the wave soldering process and gather the waste gas in the conduit 2 to facilitate further purification of the waste gas.
[0027] Please refer to the attached drawings in the instruction manual. Figure 1 During the process of the vacuum pump 3 sucking the welding exhaust gas, the solid impurities in the welding exhaust gas will enter the vacuum pump 3, and long-term use will affect the normal operation of the vacuum pump 3. Two filters 4 are placed at the end of the conduit 2 close to the wave soldering machine body 1, and both filters 4 can filter the solid impurities in the exhaust gas. The two vertical side walls relative to each other in the thickness direction of the two filters 4 are detachably connected and parallel in the thickness direction. The two filters 4 can be opposite to the end of the conduit 2 close to the wave soldering machine body 1 at different times. The two filters 4 are driven by a driving device 5 to move in a direction perpendicular to the axis of the conduit 2. Exemplarily, the driving device 5 can be an electric push rod or other drive capable of telescopic movement, so that the two filters 4 can alternately face the end of the conduit 2 close to the wave soldering machine body 1.
[0028] Please refer to the attached drawings in the instruction manual. Figure 1 A brush 6 is placed beside the two filter screens 4. The two brushes 6 are detachably connected to the axial outer wall of the conduit 2. The two brushes 6 can contact the ends of the two filter screens 4 away from the conduit 2 one by one. After the filter screens 4 have been used for a period of time, the filter screens 4 will be blocked by solid impurities, thereby affecting the suction speed of the exhaust gas by the exhaust fan 3. During the linear movement of a filter screen 4 close to the conduit 2, the filter screen 4 located beside the filter screen 4 can contact the brush 6, and the brush 6 can brush off the solid impurities on the surface of the filter screen 4. By making the two filter screens 4 alternately facing the cross section of the conduit 2, when the brush 6 cleans the filter screen 4, the solid impurities will not be sucked into the conduit 2 by the exhaust fan 3.
[0029] Please refer to the attached drawings in the instruction manual. Figure 1 The end of the conduit 2 away from the ground is detachably mounted with a mounting plate 12, and a vacuum cleaner 7 is placed beside the two brushes 6. The two vacuum cleaners 7 are detachably connected to the end of the mounting plate 12 close to the ground. The two vacuum cleaners 7 can suck out the solid impurities brushed by the two brushes 6 one by one to prevent the solid impurities from floating in the air and damaging health. The cross section of the conduit 2 and the two filters 4 are both square, so that during the horizontal linear movement of the two filters 4, the end of the conduit 2 close to the wave soldering machine body 1 can always contact with the corresponding one of the two filters 4, preventing solid impurities from entering the conduit 2 during the alternation of the two filters 4.
[0030] Please refer to the attached drawings in the instruction manual. Figure 1 After the brush 6 is used for a long time, solid impurities may accumulate inside the bristles of the brush 6, which will affect the cleaning effect of the brush 6 on the filter 4. A spray head 8 is placed beside each brush 6. The two spray heads 8 are detachably connected to the end of the mounting plate 12 close to the ground. Each spray head 8 is supplied with water through a water pump. The two spray heads 8 can spray water to the two brushes 6 one by one, so that the solid impurities accumulated in the bristles of the brush 6 can leave the brush 6 with the water. A collection tank 9 is placed at the end of the two brushes 6 close to the ground. The collection tank 9 can collect the water after the brush 6 is sprayed, which reduces the labor intensity of individuals.
[0031] Please refer to the attached drawings in the instruction manual. Figure 1 A screen 10 is detachably installed at the end of the collecting trough 9 away from the ground. The screen 10 can filter solid impurities, and the screen 10 is placed obliquely relative to the ground. A collecting bucket 11 is placed next to the end of the screen 10 close to the ground. The water after spraying the brush 6 can enter the collecting trough 9 through the screen 10, and the solid impurities screened out by the screen 10 can slide along the screen 10 to the collecting bucket 11 for collection, which is more convenient.
[0032] Working principle of this embodiment: When the vacuum pump 3 sucks the welding waste gas, the filter 4 can filter the solid impurities in the waste gas, thereby preventing the solid impurities from entering the vacuum pump 3. After a period of use, the filter 4 may be blocked by solid impurities. At this time, the driving device 5 can drive the filter 4 to move perpendicular to the axis of the conduit 2 and leave the conduit 2. At this time, the brush 6 can clean the filter 4, and the vacuum cleaner 7 can remove the solid impurities removed by the brush 6. At the same time, the other filter 4 is opposite to the cross section of the conduit 2. By making the two filter screens 4 alternately opposite to the cross section of the conduit 2, when the brush 6 cleans the filter 4, the solid impurities will not be sucked into the conduit 2 by the vacuum pump 3. The spray head 8 can spray water on the bristles of the brush 6, so that the solid impurities in the bristles of the brush 6 can leave the brush 6 with the spray water, and the solid impurities in the water after spraying can be screened out by the screen 10 and move along the surface of the screen 10 to the collection bucket 11. The spray water can pass through the screen 10 and enter the collection tank 9, which is more convenient.
[0033] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A circuit board wave soldering device, characterized in that: include: Wave soldering machine body (1); A conduit (2), wherein the conduit (2) is located beside the wave soldering machine body (1); An exhaust fan (3), the air inlet of the exhaust fan (3) being in communication with the interior of the conduit (2), and the exhaust fan (3) being capable of sucking waste gas generated by the wave soldering machine body (1); A filter screen (4), the filter screen (4) being located at one end of the conduit (2) close to the wave soldering machine body (1), and the filter screen (4) being capable of filtering solid impurities in the exhaust gas; A driving device (5), the driving device (5) being used to drive the filter screen (4) to move in a direction perpendicular to the axis of the conduit (2), so that the filter screen (4) moves away from or close to the conduit (2); a brush (6), the brush (6) being located beside the conduit (2) and being capable of contacting the filter screen (4); A vacuum cleaner (7), wherein the vacuum cleaner (7) is located beside the brush (6).
2. A circuit board wave soldering device according to claim 1, characterized in that: The filter screen (4), brush (6) and vacuum cleaner (7) are each configured in pairs. Two vertical side walls of the two filter screens (4) are fixedly connected in the thickness direction. The two filter screens (4) have the same thickness direction, and the two filter screens (4) can be directly opposite to one end of the conduit (2) close to the wave soldering machine body (1). The two brushes (6) can contact the two filter screens (4) in a one-to-one correspondence, and the two vacuum cleaners (7) are located in a one-to-one correspondence beside the two brushes (6).
3. A circuit board wave soldering device according to claim 2, characterized in that: The cross-section of the conduit (2) and the two filter screens (4) are both square.
4. A circuit board wave soldering device according to claim 1, characterized in that: It also comprises a spray head (8), and the spray head (8) is capable of spraying water onto the bristles of the brush (6).
5. A circuit board wave soldering device according to claim 4, characterized in that: It also comprises a collecting trough (9), which is located on a side of the brush (6) close to the ground, and is capable of collecting water after the brush (6) is sprayed.
6. A circuit board wave soldering device according to claim 5, characterized in that: A screen (10) is fixedly connected to one end of the collecting trough (9) away from the ground, and the screen (10) is capable of filtering solid impurities.
7. A circuit board wave soldering device according to claim 6, characterized in that: The screen (10) is arranged obliquely relative to the ground.
8. A circuit board wave soldering device according to claim 7, characterized in that: The invention also comprises a collecting bucket (11), the collecting bucket (11) being located beside the collecting tank (9), and the end of the screen (10) close to the collecting bucket (11) being lower than the end of the screen (10) away from the collecting bucket (11), so that solid impurities on the surface of the screen (10) can enter the collecting bucket (11).
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