Magnetron sputtering cylindrical target and magnetron sputtering coating equipment
By adopting the independently packaged central magnetic column and edge magnetic column structure in the magnetron sputtering cylindrical target, the problems of large sputtering angle and low magnetic flux in the prior art are solved, and the utilization rate of the target material and the uniformity of the coating are improved. effect.
Patent Information
- Application Number
- CN202323341015.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-08
- Publication Date
- 2024-12-06
- Estimated Expiration
- 2033-12-08
AI Technical Summary
The integrated packaging structure of the magnetic rod in the existing magnetron sputtering cylindrical target causes the increase of the sputtering angle, reduces the magnetic flux on the surface of the target, and thus reduces the utilization rate and collection rate, and increases costs.
The middle magnetic column and edge magnetic column structure are adopted independently packaged. Through the design of the middle packaging shell and edge packaging shell, the gap distance between the magnetic column and the inner wall of the target camera is reduced, the magnetic flux is increased, and the sputtering angle is reduced.
The magnetic flux on the surface of the target material is increased, the utilization and collection rate of the target material is increased, cost savings, and the uniformity and yield of the coating are improved.
Smart Images

Figure CN222119368U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of magnetron sputtering coating, in particular to a magnetron sputtering cylindrical target and magnetron sputtering coating equipment. Background Art
[0002] In the prior art, the magnetic rods in the magnetron sputtering cylindrical target are packaged together with the yoke and the magnetic array in an integrated package, which results in a large gap between the magnetic rods and the inner wall of the target barrel, thereby increasing the sputtering angle, reducing the magnetic flux on the target surface, and further reducing the utilization and collection rate of the target material, increasing the cost.
[0003] Therefore, it is urgent to design a magnetron sputtering cylindrical target and a magnetron sputtering coating equipment to solve the above technical problems. Utility Model Content
[0004] The first purpose of the utility model is to provide a magnetron sputtering cylindrical target, reduce the sputtering angle, increase the magnetic flux on the target surface, and thus improve the utilization rate and collection rate of the target, saving costs.
[0005] To achieve this purpose, the utility model adopts the following technical solutions:
[0006] The utility model provides a magnetron sputtering cylindrical target, comprising:
[0007] A magnetic yoke, wherein the magnetic yoke is provided with a middle packaging shell and at least two side packaging shells, the middle packaging shell is located between the at least two side packaging shells, a middle magnetic column is provided in the middle packaging shell, and a side magnetic column is provided in the side packaging shell; a side edge of each side packaging shell and an area between two side edges of the middle packaging shell jointly form an arc surface;
[0008] The target barrel is cylindrical and is sleeved on the circumference of the magnetic yoke. The center of the cross section of the target barrel coincides with the center of the circle where the arc surface is located.
[0009] As an optional technical solution for a magnetron sputtering cylindrical target, the magnetic poles of the middle magnetic column and the magnetic poles of the edge magnetic column are both perpendicular to the magnetic yoke.
[0010] As an optional technical solution for a magnetron sputtering cylindrical target, the central magnetic column is set as one column, and the side magnetic columns are set as two columns. The magnetic poles on the same side of the central magnetic column and the side magnetic column are in opposite directions, and the magnetic poles on the same side of the two side magnetic columns are in the same direction.
[0011] As an optional technical solution for a magnetron sputtering cylindrical target, the cross-sectional area of the middle magnetic column is equal to the sum of the cross-sectional areas of the two side magnetic columns.
[0012] As an optional technical solution for a magnetron sputtering cylindrical target, the edge packaging shells are provided in N numbers, N is an even number, and N>0, and the N edge packaging shells are symmetrically arranged about the axis of the middle packaging shell.
[0013] As an optional technical solution for a magnetron sputtering cylindrical target, the central magnetic array contacts the inner wall of the central packaging shell, and the side magnetic array contacts the inner wall of the side packaging shell.
[0014] As an optional technical solution for magnetron sputtering cylindrical targets, first blocking parts are provided at both ends of the middle packaging shell, and second blocking parts are provided at both ends of the side packaging shell.
[0015] As an optional technical solution for a magnetron sputtering cylindrical target, the magnetic field strength of the central magnetic column is weaker than that of the side magnetic columns, and the magnetic field strengths of two side magnetic columns symmetrically arranged about the axis of the central magnetic column are the same.
[0016] As an optional technical solution for a magnetron sputtering cylindrical target, the central magnetic column is arranged in multiple columns, and a partition is arranged in the central packaging shell. The partition divides the central packaging shell into multiple accommodating spaces, and each of the accommodating spaces accommodates one column of the central magnetic column.
[0017] The second purpose of the utility model is to provide a magnetron sputtering coating device, which can reduce the sputtering angle, improve the utilization rate and collection rate of the target material, and save costs.
[0018] To achieve this purpose, the utility model adopts the following technical solutions:
[0019] The utility model provides a magnetron sputtering coating device, comprising the magnetron sputtering cylindrical target mentioned above.
[0020] The beneficial effects of the utility model include at least:
[0021] The utility model provides a magnetron sputtering cylindrical target, which comprises a magnetic yoke, a target barrel, a middle packaging shell and at least two side packaging shells. The magnetic yoke is provided with a middle packaging shell and at least two side packaging shells, the middle packaging shell is located between the at least two side packaging shells, a middle magnetic column is provided in the middle packaging shell, and a side magnetic column is provided in the side packaging shell; one side edge of each side packaging shell and the area between the two side edges of the middle packaging shell form an arc surface together. The target barrel is cylindrical, and the target barrel is sleeved on the circumference of the magnetic yoke, and the center of the cross section of the target barrel coincides with the center of the circle where the arc surface is located. Through the arrangement of the middle packaging shell and the side packaging shell, the middle magnetic column and the side magnetic column can be independently packaged, that is, the middle magnetic column is independently packaged in the middle shell, and each column of the side magnetic column is independently packaged in a corresponding side shell. Compared with the integrated packaging structure of the prior art, the independent packaging structure in the utility model can reduce the gap distance between the middle magnetic array and the edge magnetic array and the inner wall of the target tube, thereby increasing the magnetic flux on the target surface, reducing the sputtering angle, improving the utilization rate and collection rate of the target material, and saving costs.
[0022] The utility model also provides a magnetron sputtering coating device, which includes the magnetron sputtering cylindrical target. By adopting the magnetron sputtering cylindrical target, the sputtering angle can be reduced, the utilization rate and collection rate of the target material can be improved, and the cost can be saved. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.
[0024] Figure 1 This is a schematic structural diagram of a magnetron sputtering cylindrical target provided in Example 1 of the utility model;
[0025] Figure 2 A schematic diagram of the structure of the middle packaging shell and the edge packaging shell provided in the first embodiment of the utility model;
[0026] Figure 3 This is a schematic structural diagram of a magnetron sputtering cylindrical target provided in Example 2 of the utility model;
[0027] Figure 4 This is a schematic structural diagram of the middle packaging shell and the edge packaging shell provided in the second embodiment of the present utility model.
[0028] Reference numerals
[0029] 100, yoke; 200, middle packaging shell; 210, middle magnetic array; 220, partition; 300, edge packaging shell; 310, edge magnetic array; 400, arc surface; 500, target barrel; 600, adjustment assembly; 610, adjustment screw; 620, fixing tube; 630, adjustment nut. DETAILED DESCRIPTION
[0030] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clearly, the technical solutions of the present invention are further explained below with reference to the accompanying drawings and through specific implementation methods.
[0031] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0032] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0033] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.
[0034] Embodiment 1
[0035] This embodiment provides a magnetron sputtering cylindrical target, which can reduce the sputtering angle, increase the magnetic flux on the target surface, and further improve the utilization rate and collection rate of the target, thereby achieving the purpose of cost saving.
[0036] like Figure 1-Figure 2 As shown, the magnetron sputtering cylindrical target mainly includes a magnetic yoke 100, a target barrel 500, a middle packaging shell 200 and at least two edge packaging shells 300. The magnetic yoke 100 is provided with a middle packaging shell 200 and at least two edge packaging shells 300, the middle packaging shell 200 is located between at least two edge packaging shells 300, a middle magnetic column 210 is arranged in the middle packaging shell 200, and an edge magnetic column 310 is arranged in the edge packaging shell 300; near one side of the target barrel 500, one side edge of each edge packaging shell 300 and the area between the two side edges of the middle packaging shell 200 jointly form an arc surface 400. The target barrel 500 is cylindrical, and the target barrel 500 is sleeved on the circumference of the magnetic yoke 100, and the center of the cross section of the target barrel 500 coincides with the center of the circle where the arc surface 400 is located.
[0037] Based on the above design, in this embodiment, the middle magnetic column 210 and the side magnetic column 310 are independently packaged, that is, the middle magnetic column 210 is independently packaged in the middle shell, and each column of the side magnetic column 310 is independently packaged in a corresponding side shell. Compared with the integrated packaging structure of the prior art, the independent packaging structure in this embodiment can reduce the gap distance between the middle magnetic column 210 and the side magnetic column 310 and the inner wall of the target barrel 500, thereby increasing the magnetic flux on the target surface, reducing the sputtering angle, improving the utilization rate and collection rate of the target, and saving costs.
[0038] In addition, the area between one side edge of each edge packaging shell 300 and two side edges of the middle packaging shell 200 in this embodiment jointly forms an arc surface 400. The target barrel 500 is sleeved on the circumference of the magnetic yoke 100, and the center of the cross section of the target barrel 500 coincides with the center of the circle where the arc surface 400 is located, which can not only further reduce the gap distance between the middle magnetic column 210, the edge magnetic column 310 and the inner wall of the target barrel 500, thereby reducing the sputtering angle, but also improve the uniformity of the sputtering coating and improve the yield rate.
[0039] Optionally, the middle packaging shell 200 and the edge packaging shell 300 in this embodiment can be made of stainless steel to improve strength, extend service life, and be less likely to be magnetized, thereby increasing reliability.
[0040] In this embodiment, the magnetic poles of the middle magnetic column 210 and the magnetic poles of the side magnetic column 310 are perpendicular to the magnetic yoke 100 .
[0041] Optionally, the central magnetic column 210 in this embodiment is set as one column, and the side magnetic column 310 is set as two columns. The magnetic poles on the same side of the central magnetic column 210 and the side magnetic column 310 are in opposite directions, and the magnetic poles on the same side of the two side magnetic columns 310 are in the same direction, so that closed magnetic flux lines can be formed, which is beneficial to improve the magnetic field strength and improve the efficiency of sputtering targets. In this embodiment, the central packaging shell 200 is set corresponding to the central magnetic column 210, and the side packaging shell 300 is set corresponding to the side magnetic column 310.
[0042] Optionally, in this embodiment, each column of the middle magnetic array 210 is composed of a plurality of magnets, and each column of the side magnets is composed of a plurality of magnets.
[0043] Preferably, the magnetic field strength of the middle magnetic column 210 is weaker than that of the side magnetic column 310, and the magnetic field strengths of the two side magnetic columns 310 symmetrically arranged about the axis of the middle magnetic column 210 are the same. In this way, the magnetic flux lines on both sides can be compressed toward the middle position of the middle magnetic column 210, thereby reducing the sputtering angle as much as possible while other conditions remain unchanged, improving the utilization rate and collection rate of the target material, and achieving the purpose of cost saving.
[0044] Exemplarily, the magnets of the middle magnetic array 210 are N45 or N48 brand magnets, and the magnets of the side magnetic array 310 are N52 or N55 brand magnets.
[0045] Optionally, the length of the middle magnetic column 210 and the length of the side magnetic column 310 can be flexibly adjusted according to actual needs.
[0046] Optionally, the cross-section of the middle magnetic column 210 and the cross-section of the side magnetic column 310 can both be set to be a rectangle or a square. Exemplarily, the side length of the square can be set to be between 10 mm and 15 mm.
[0047] Preferably, the cross-sectional area of the middle magnetic column 210 in this embodiment is equal to the sum of the cross-sectional areas of the two side magnetic columns 310. This can ensure that the uniformity of the magnetic field intensity is improved while reducing the sputtering angle, thereby ensuring the uniformity of the coating and improving the product yield.
[0048] In this embodiment, there are N edge encapsulation shells 300, N is an even number, and N>0, and the N edge encapsulation shells 300 are symmetrically arranged about the axis of the middle encapsulation shell 200. For example, there can be 2, 4, 6, etc. edge encapsulation shells 300.
[0049] Furthermore, the middle magnetic column 210 contacts the inner wall of the middle packaging shell 200, and the side magnetic column 310 contacts the inner wall of the side packaging shell 300. In this way, the heat transfer area of the middle magnetic column 210 and the side magnetic column 310 can be increased, thereby improving the cooling effect. It should be noted that the magnetron sputtering cylindrical target in this embodiment also includes a cooling water pipe (not shown in the figure) for cooling the middle magnetic column 210 and the side magnetic column 310. Since the cooling water pipe belongs to a conventional setting in the prior art, the specific structure of this embodiment will not be repeated.
[0050] In this embodiment, first plugging parts (not shown in the figure) are provided at both ends of the middle encapsulation shell 200, and second plugging parts (not shown in the figure) are provided at both ends of the side encapsulation shell 300. The first plugging part and the second plugging part can be assembled by welding or gluing, which can improve the sealing performance of the middle encapsulation shell 200 and the side encapsulation shell 300, and further ensure that the middle magnetic array 210 and the side magnetic array 310 will not contact with cooling water, avoid corrosion of the magnets, and extend the service life.
[0051] like Figure 1 As shown, in this embodiment, the magnetron sputtering cylindrical target further includes an adjustment assembly 600, and the adjustment assembly 600 includes an adjustment screw 610, a fixing tube 620, and an adjustment nut 630. The adjustment screw 610 passes through the fixing tube 620 and is threadedly connected to the yoke 100, and the adjustment nut 630 is fixedly connected to an end of the adjustment screw 610 away from the yoke 100. Optionally, the adjustment screw 610 and the adjustment nut 630 are integrally formed. The adjustment screw 610 and the adjustment nut 630 are used to adjust the distance between the yoke 100 and the fixing tube 620.
[0052] Specifically, when it is necessary to adjust the distance between the yoke 100 and the fixed tube 620, the operator can rotate the adjusting nut 630 to drive the adjusting screw 610 to rotate, so that the adjusting screw 610 can drive the yoke 100 to move up or down, thereby changing the distance between the yoke 100 and the fixed tube 620, thereby adjusting the gap distance between the middle magnetic array 210 and the side magnetic array 310 and the inner wall of the target barrel 500, changing the magnetic field strength to which the target barrel 500 is subjected, and adjusting the coating thickness of the product, thereby improving compatibility and universality.
[0053] This embodiment also provides a magnetron sputtering coating device, which includes the above magnetron sputtering cylindrical target. By using the above magnetron sputtering cylindrical target, the sputtering angle can be reduced, the utilization rate and collection rate of the target barrel 500 (ie, the target material) can be improved, and the cost can be saved.
[0054] Embodiment 2
[0055] like Figure 3-Figure 4 As shown, this embodiment provides a magnetron sputtering cylindrical target. The main difference between the magnetron sputtering cylindrical target in this embodiment and that in the first embodiment is that the central magnetic column 210 of the magnetron sputtering cylindrical target in this embodiment is arranged in multiple columns, and a partition 220 is arranged in the central packaging shell 200. The partition 220 divides the central packaging shell 200 into multiple accommodating spaces, and each accommodating space accommodates one column of the central magnetic column 210.
[0056] For example, the middle magnetic array 210 in this embodiment is arranged in three rows, and the partitions 220 in the middle packaging shell 200 are arranged in two rows, and the two partitions 220 divide the middle packaging shell 200 into three accommodating spaces. This can improve the diversity of the arrangement of the middle magnetic array 210, that is, the operator can flexibly change the magnetic field strength of the middle magnetic array 210, thereby adjusting the film thickness of the product, and at the same time, can further reduce the sputtering angle, improve the utilization rate of the target material, and save costs.
[0057] The remaining structures of the magnetron sputtering cylindrical target in this embodiment are the same as those in the first embodiment, and will not be described in detail here.
[0058] This embodiment also provides a magnetron sputtering coating device, which includes the above magnetron sputtering cylindrical target. By using the above magnetron sputtering cylindrical target, the sputtering angle can be reduced, the utilization rate and collection rate of the target barrel 500 (ie, the target material) can be improved, and the cost can be saved.
[0059] Obviously, the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
[0060] Note that in the description of this specification, the reference terms "some embodiments", "other embodiments", etc., mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
Claims
1. Magnetron sputtering cylindrical target, characterized in that: include: A magnetic yoke (100), wherein a middle encapsulation shell (200) and at least two side encapsulation shells (300) are arranged on the magnetic yoke (100), the middle encapsulation shell (200) is located between at least two side encapsulation shells (300), a middle magnetic column (210) is arranged in the middle encapsulation shell (200), and a side magnetic column (310) is arranged in the side encapsulation shell (300); a side edge of each side encapsulation shell (300) and the area between two side edges of the middle encapsulation shell (200) jointly form an arc surface (400); The target barrel (500) is cylindrical and is sleeved on the circumference of the magnetic yoke (100). The center of the cross section of the target barrel (500) coincides with the center of the circle where the arc surface (400) is located.
2. The magnetron sputtering cylindrical target according to claim 1, characterized in that: The magnetic poles of the middle magnetic column (210) and the magnetic poles of the side magnetic column (310) are both perpendicular to the magnetic yoke (100).
3. The magnetron sputtering cylindrical target according to claim 2, characterized in that: The central magnetic column (210) is arranged as one column, and the side magnetic columns (310) are arranged as two columns. The magnetic poles on the same side of the central magnetic column (210) and the side magnetic column (310) are in opposite directions, and the magnetic poles on the same side of the two side magnetic columns (310) are in the same direction.
4. The magnetron sputtering cylindrical target according to claim 3, characterized in that: The cross-sectional area of the middle magnetic column (210) is equal to the sum of the cross-sectional areas of the two side magnetic columns (310).
5. The magnetron sputtering cylindrical target according to claim 1, characterized in that: The number of the edge encapsulation shells (300) is N, where N is an even number and N>0, and the N edge encapsulation shells (300) are symmetrically arranged about the axis of the middle encapsulation shell (200).
6. The magnetron sputtering cylindrical target according to claim 1, characterized in that: The middle magnetic array (210) contacts the inner wall of the middle packaging shell (200), and the side magnetic array (310) contacts the inner wall of the side packaging shell (300).
7. The magnetron sputtering cylindrical target according to claim 1, characterized in that: The two ends of the middle packaging shell (200) are both provided with a first blocking portion, and the two ends of the side packaging shell (300) are both provided with a second blocking portion.
8. The magnetron sputtering cylindrical target according to claim 1, characterized in that: The magnetic field strength of the middle magnetic column (210) is weaker than the magnetic field strength of the side magnetic column (310), and the magnetic field strengths of the two side magnetic columns (310) symmetrically arranged about the axis of the middle magnetic column (210) are the same.
9. The magnetron sputtering cylindrical target according to claim 1, characterized in that: The middle magnetic column (210) is arranged in multiple columns, and a partition (220) is arranged in the middle packaging shell (200). The partition (220) divides the middle packaging shell (200) into multiple accommodating spaces, and each of the accommodating spaces accommodates one column of the middle magnetic column (210).
10. Magnetron sputtering coating equipment, characterized in that: The invention comprises the magnetron sputtering cylindrical target according to any one of claims 1 to 9.
