Vertical wafer processing thinning machine
By adopting a limit structure driven by the support table and motor in the vertical wafer processing thinning machine, the problem of deviation of the wafer when the grinding table rotates is solved and the grinding efficiency is improved.
Patent Information
- Application Number
- CN202323550490.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2033-12-26
AI Technical Summary
When the existing vertical wafer thinning machine rotates, due to the lack of effective fixation, the wafer is prone to deviating and detaching from the vacuum suction cup, resulting in the problem of reducing grinding efficiency.
A vertical wafer processing thinning machine was designed, using support table, placing plate, motor, support column, rectangular slider, column slide rod, rubber block and ball structure, and the support column is driven to move up and down through the motor, using The cylinder slider and rubber block limit the wafer to prevent deviation and improve grinding efficiency.
It effectively prevents the wafer from deviating and detaching when the grinding table rotates, and improves the wafer grinding efficiency.
Smart Images
Figure CN222134386U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of thinning machines, in particular to a vertical wafer processing thinning machine. Background Art
[0002] Vertical wafer processing thinning machine is mainly used for thin precision parts of non-metallic and metal hard and brittle materials such as sapphire substrates, silicon wafers, ceramic wafers, optical glass, quartz crystals, and other semiconductor materials. It is also a common precision grinding equipment. This type of wafer thinning machine is mainly used for thinning and grinding of some wafer products. Because the thickness at the center and edge of the wafer product is inconsistent, it generally takes more time to thin and grind the center of the wafer product.
[0003] The existing vertical wafer thinning machine is mainly composed of a machine body, a grinding table, a vacuum suction cup and a grinding head. When in use, the wafer product is adsorbed on the vacuum suction cup. When grinding the center of the wafer product, due to no effective fixation, the wafer is easily deviated under the friction of the rotation of the grinding table, causing the vacuum suction cup to separate from the wafer and directly fall, thereby reducing the grinding efficiency. Therefore, a vertical wafer processing thinning machine is proposed to address the above problems. Utility Model Content
[0004] The utility model aims to provide a vertical wafer processing thinning machine to solve the problem that due to the lack of effective fixation, the wafer is easily deviated under the friction of the rotation of the grinding table, causing the vacuum suction cup to separate from the wafer and directly fall, thereby reducing the grinding efficiency.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A vertical wafer processing thinning machine comprises a vertical shell and a support table, the upper end of the vertical shell is fixedly connected to the support table, the upper end of the support table is fixedly connected to a placing plate, the inner side of the upper end of the vertical shell is provided with a grinding body, the inner side of the lower end of the support table is fixedly connected to a motor, the end of the motor spindle is fixedly connected to a threaded rod, the outer side of the threaded rod is spirally connected to a threaded ring, the outer side of the threaded ring is fixedly connected to a connecting rod, the upper end of the connecting rod is fixedly connected to a supporting column, the upper end of the supporting column is fixedly connected to a rotating block, the inner side of the rotating block is rotatably connected to a cylindrical rotating rod, the outer side of the upper end of the cylindrical rotating rod is rotatably connected to the inner side of a movable groove, the movable groove is arranged on the inner side of a rectangular slider, the outer side of the rectangular slider is fixedly connected to a sliding rectangular block, the inner side of the rectangular slider is provided with a telescopic groove, the inner side of the telescopic groove is fixedly connected to a spring, the upper end of the spring is fixedly connected to a cylindrical sliding rod, one side of the cylindrical sliding rod is fixedly connected to a rubber block, the upper end of the rubber block is fixedly connected to a ball groove block, the inner side of the ball groove block is provided with a ball, and the upper end of the placing plate is fixedly connected to a suction cup.
[0007] Preferably, the interior of the support platform is hollow, the motor is fixedly connected to the hollow groove inside the support platform, the thread ring is in the shape of a hollow cylinder, and a spiral groove is provided inside the thread ring.
[0008] Preferably, the number of connecting rods, support columns and rotating blocks are all several, the number of connecting rods, support columns and rotating blocks are the same, the rectangular slider is in the shape of a rectangular body, the outer side of the rectangular slider slides on the inner side of the rectangular groove through the sliding rectangular block, and the rectangular groove is opened on the inner side of the placement plate.
[0009] Preferably, the telescopic slot is shaped like a "convex" character, the column slide rod is shaped like a cylinder, the rubber block is fixed on the inner side of one end of the column slide rod, and the lower end of the column slide rod is fixedly connected with a conical limiting plate.
[0010] Preferably, the suction cup is located between the column slide rods, the number of the suction cups is the same as the supporting column, the outer side of the ball rolls inside the ball slot block, and a semi-spherical groove is provided on the inner side of the upper end of the ball slot block.
[0011] Compared with the prior art, the beneficial effects of the utility model are:
[0012] In the utility model, by arranging a support table, a placement plate, a motor, a support column, a rectangular slider, a column slide rod, a rubber block and a ball bearing, during the use of the vertical wafer processing thinning machine, the motor is started to drive the support column to move up and down through the device, so that the column slide rods expand or contract at the same time, limit the wafer, prevent the wafer from deviating under the friction force of the rotation of the grinding table, prevent the wafer from detaching from the suction cup, and improve the grinding efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0014] Figure 2 This is a schematic diagram of the motor structure of the utility model;
[0015] Figure 3 This is a schematic diagram of the connecting rod structure of the utility model;
[0016] Figure 4 This is a schematic diagram of the cutaway structure of a rectangular slider of the utility model.
[0017] In the figure: 1. vertical housing; 2. support table; 3. placement plate; 4. grinding body; 5. motor; 6. threaded rod; 7. threaded ring; 8. connecting rod; 9. support column; 10. rotating block; 11. cylindrical rotating rod; 12. rectangular slider; 13. movable groove; 14. suction cup; 15. sliding rectangular block; 16. telescopic groove; 17. spring; 18. cylindrical slide rod; 19. rubber block; 20. ball groove block; 21. ball; 22. rectangular groove. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0019] See also Figure 1-4 , the utility model provides a technical solution:
[0020] A vertical wafer processing thinning machine comprises a vertical shell 1 and a support table 2, wherein the upper end of the vertical shell 1 is fixedly connected to the support table 2, the upper end of the support table 2 is fixedly connected to a placing plate 3, a grinding body 4 is arranged on the inner side of the upper end of the vertical shell 1, a motor 5 is fixedly connected to the inner side of the lower end of the support table 2, a threaded rod 6 is fixedly connected to the end of the main shaft of the motor 5, a threaded ring 7 is spirally connected to the outer side of the threaded rod 6, a connecting rod 8 is fixedly connected to the outer side of the threaded ring 7, a supporting column 9 is fixedly connected to the upper end of the connecting rod 8, a rotating block 10 is fixedly connected to the upper end of the supporting column 9, and a cylindrical body is rotatably connected to the inner side of the rotating block 10 The rotating rod 11, the outer side of the upper end of the cylindrical rotating rod 11 is rotatably connected to the inner side of the movable groove 13, the movable groove 13 is opened on the inner side of the rectangular slider 12, the outer side of the rectangular slider 12 is fixedly connected with a sliding rectangular block 15, the inner side of the rectangular slider 12 is opened with a telescopic groove 16, the inner side of the telescopic groove 16 is fixedly connected with a spring 17, the upper end of the spring 17 is fixedly connected with a columnar slide rod 18, one side of the columnar slide rod 18 is fixedly connected with a rubber block 19, the upper end of the rubber block 19 is fixedly connected with a ball groove block 20, the inner side of the ball groove block 20 is provided with a ball 21, and the upper end of the placement plate 3 is fixedly connected with a suction cup 14.
[0021] The interior of the support platform 2 is hollow, and the motor 5 is fixedly connected to the hollow groove inside the support platform 2. The thread ring 7 is in the shape of a hollow cylinder, and a spiral groove is provided inside the thread ring 7, which drives the thread ring 7 to move up and down through the threaded rod 6 when the main shaft of the motor 5 rotates. The number of connecting rods 8, support columns 9 and rotating blocks 10 is a certain number, and the number of connecting rods 8, support columns 9 and rotating blocks 10 is the same. The rectangular slider 12 is in the shape of a rectangular body, and the outer side of the rectangular slider 12 slides on the inner side of the rectangular groove 22 through the sliding rectangular block 15. The rectangular groove 22 is provided inside the placement plate 3, which plays a role in controlling the rectangular slider 12 when it moves. The limiting effect is that the telescopic groove 16 is shaped like a "convex" character, the column slide bar 18 is shaped like a cylinder, the rubber block 19 is fixed on the inner side of one end of the column slide bar 18, and the lower end of the column slide bar 18 is fixedly connected with a conical limiting piece, which has the effect of protecting the wafer. The suction cup 14 is between the column slide bars 18, and the number of suction cups 14 is the same as that of the support column 9. The outer side of the ball 21 rolls inside the ball groove block 20, and a semi-spherical groove is provided on the inner side of the upper end of the ball groove block 20, which has the effect of limiting the wafer when grinding wafers of different heights, and at the same time reduces the friction between the grinding body 4 and the ball 21.
[0022] Working process: When the device is in use, the external power supply is energized. When the wafer needs to be fixed, the wafer is placed at the center position of the suction cup 14 fixedly connected to the upper end of the placement plate 3, so that the suction cup 14 is adsorbed with the wafer, and the motor 5 fixedly connected to the inner side of the lower end of the support table 2 is started. The main shaft of the motor 5 rotates to drive the threaded rod 6 fixedly connected to the end of the main shaft to rotate, and the rotation of the threaded rod 6 drives the threaded ring 7 spirally connected on the outer side. Under the device limit at the upper end of the threaded ring 7, the threaded ring 7 moves, and the movement of the threaded ring 7 drives the connecting rod 8 fixedly connected to the upper end to move. The movement of the connecting rod 8 drives the supporting column 9 fixedly connected to the upper end to move. The movement of the supporting column 9 drives the rotating block 10 fixedly connected to the upper end to move. The movement of the rotating block 10 drives the cylindrical rotating rod 11 connected to the upper end to rotate and move. One end of the cylindrical rotating rod 11 rotates inside the movable groove 13. The movement of the cylindrical rotating rod 11 drives the rotatably connected rectangular slider 12 to move. The sliding rectangular block 15 fixedly connected to the outer side of the rectangular slider 12 is slidably connected to the inside of the rectangular groove 22 opened on the inner side of the placement plate 3. The sliding rectangular block 15 has the effect of limiting the position of the rectangular slider 12 when it moves. Multiple rectangular sliders 12 move simultaneously according to the above principle. The movement of the rectangular slider 12 drives the inner device to move. When the rubber block 19 fixedly connected to one side of the cylindrical slide bar 18 is in contact with the wafer, the rubber block 19 has the effect of protecting the wafer. When the wafer needs to be polished, the polishing body 4 is started to make the lower end of the polishing body 4 fit with the upper end of the wafer. When the polishing body 4 moves the polishing body 4 through the existing device, the polishing body 4 performs the ball 21. The ball 21 moves and drives the ball slot block 20 set at the lower end to move. The ball slot block 20 moves and drives the column slide bar 18 fixedly connected to the lower end to move. The column slide bar 18 moves and drives the spring 17 fixedly connected to the lower end to contract. The outer side of the column slide bar 18 slides on the inner side of the telescopic slot 16. When the grinding body 4 rotates, the ball 21 rotates in the inner groove of the ball slot block 20. The ball 21 has the effect of limiting the wafer when grinding wafers of different heights, and at the same time reduces the friction between the grinding body 4 and the ball 21.
[0023] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A vertical wafer processing thinning machine, comprising a vertical housing (1) and a support table (2), characterized in that: The upper end of the vertical shell (1) is fixedly connected to a support platform (2), the upper end of the support platform (2) is fixedly connected to a placement plate (3), the inner side of the upper end of the vertical shell (1) is provided with a grinding body (4), the inner side of the lower end of the support platform (2) is fixedly connected to a motor (5), the end of the main shaft of the motor (5) is fixedly connected to a threaded rod (6), the outer side of the threaded rod (6) is spirally connected to a threaded ring (7), the outer side of the threaded ring (7) is fixedly connected to a connecting rod (8), the upper end of the connecting rod (8) is fixedly connected to a support column (9), the upper end of the support column (9) is fixedly connected to a rotating block (10), the inner side of the rotating block (10) is rotatably connected to a cylindrical rotating rod (11), and the cylindrical rotating rod ( The outer side of the upper end of 11 is rotatably connected to the inner side of the movable groove (13), the movable groove (13) is provided on the inner side of the rectangular slider (12), a sliding rectangular block (15) is fixedly connected to the outer side of the rectangular slider (12), a telescopic groove (16) is provided on the inner side of the rectangular slider (12), a spring (17) is fixedly connected to the inner side of the telescopic groove (16), the upper end of the spring (17) is fixedly connected to a column slide rod (18), one side of the column slide rod (18) is fixedly connected to a rubber block (19), the upper end of the rubber block (19) is fixedly connected to a ball groove block (20), the inner side of the ball groove block (20) is provided with a ball (21), and the upper end of the placement plate (3) is fixedly connected to a suction cup (14).
2. A vertical wafer processing thinning machine according to claim 1, characterized in that: The interior of the support platform (2) is hollow, the motor (5) is fixedly connected to the hollow groove inside the support platform (2), the thread ring (7) is in the shape of a hollow cylinder, and a spiral groove is provided inside the thread ring (7).
3. A vertical wafer processing thinning machine according to claim 1, characterized in that: The number of the connecting rods (8), the supporting columns (9) and the rotating blocks (10) are all several, and the number of the connecting rods (8), the supporting columns (9) and the rotating blocks (10) are the same. The rectangular slider (12) is in the shape of a rectangular body. The outer side of the rectangular slider (12) slides on the inner side of the rectangular groove (22) through the sliding rectangular block (15), and the rectangular groove (22) is opened on the inner side of the placement plate (3).
4. A vertical wafer processing thinning machine according to claim 1, characterized in that: The telescopic slot (16) is shaped like a "convex" character, the column slide rod (18) is shaped like a cylinder, the rubber block (19) is fixed to the inner side of one end of the column slide rod (18), and the lower end of the column slide rod (18) is fixedly connected to a conical limiting plate.
5. The vertical wafer processing thinning machine according to claim 1, characterized in that: The suction cup (14) is located between the column slide bars (18), the number of the suction cups (14) is the same as the supporting column (9), the outer side of the ball (21) rolls inside the ball groove block (20), and a semi-spherical groove is provided on the inner side of the upper end of the ball groove block (20).