Automatic silicon wafer bagging machine

Abstract

The utility model relates to the field of bagging machines, in particular to an automatic silicon wafer bagging machine. The bagging machine comprises a first horizontal conveying mechanism, a partition paper output mechanism, a carrying mechanism, a pressing and fixing mechanism, a beating and aligning mechanism, a packaging bag stock bin, a packaging bag opening mechanism, a packaging bag carrying mechanism and a second horizontal conveying mechanism. The first silicon wafer horizontal conveying mechanism used for conveying the silicon wafers, the partition paper output mechanism used for outputting the partition paper and the second horizontal conveying mechanism used for conveying the silicon wafers pasted with the partition paper are all located below the carrying mechanism used for carrying the partition paper and the silicon wafers. According to the utility model, the separating paper conveyed by the separating paper output mechanism is carried to the silicon wafer on the horizontal conveying mechanism I through the carrying mechanism, then the silicon wafer pasted with the separating paper is carried to the horizontal conveying mechanism II, and the separating paper and the silicon wafer are patted to be aligned through the patting and aligning mechanism. The packaging bag is opened through the packaging bag opening mechanism, and the aligned silicon wafers are finally fed into the packaging bag. The silicon wafer bagging efficiency is improved, and the cost is saved.

Description

Technical Field

[0001] The utility model relates to the field of bagging machines, in particular to an automatic silicon wafer bagging machine. Background Art

[0002] In the production process of sheet products, silicon wafers need to be stacked, then placed with separator paper and neatly arranged, and then packed into packaging bags. The existing processing flow is all done manually. Since silicon wafers are thin, they are easily broken and scrapped due to uneven squeezing force during manual operation, which not only has low production efficiency, but also high production costs. Utility Model Content

[0003] The technical problem to be solved by the utility model is: in order to solve the technical problem described in the background technology, the utility model provides an automatic silicon wafer bagging machine. The separator paper transported by the separator paper output mechanism is transported to the silicon wafer on the horizontal conveying mechanism one by a transport mechanism, and then the silicon wafer with the separator paper is transported to the horizontal conveying mechanism two, and the separator paper and the silicon wafer are aligned by the aligning mechanism. The packaging bag is opened by the packaging bag opening mechanism, and the aligned silicon wafers are finally sent into the packaging bag. The application improves the efficiency of silicon wafer bagging and saves costs.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A silicon wafer automatic bagging machine comprises a horizontal conveying mechanism, a spacer paper output mechanism, a conveying mechanism, a clamping and fixing mechanism, an aligning mechanism, a packaging bag silo, a packaging bag opening mechanism, a packaging bag conveying mechanism, and a horizontal conveying mechanism. The silicon wafer horizontal conveying mechanism, the silicon wafer output mechanism, the spacer paper output mechanism, and the horizontal conveying mechanism for conveying silicon wafers with spacer paper attached are all located below the conveying mechanism for conveying spacer paper and silicon wafers. A packaging bag opening mechanism for opening the bag mouth of the packaging bag is provided at the discharge port of the horizontal conveying mechanism. The packaging bag opening mechanism and the packaging bag silo are both located below the packaging bag conveying mechanism. A clamping and fixing mechanism for clamping silicon wafers and spacer paper is installed on the horizontal conveying mechanism. The aligning mechanism for aligning silicon wafers and spacer paper is located above the horizontal conveying mechanism.

[0006] Specifically, the conveying mechanism includes a horizontal linear module 1, a suction cup, a suction cup rotating cylinder, a suction cup lifting cylinder, an X-axial cylinder clamp, a Y-axial pneumatic clamp, and a clamp lifting cylinder. The suction cup lifting cylinder and the X-axial cylinder clamp are respectively fixed on the slide seat of the horizontal linear module 1, the suction cup rotating cylinder is fixed on the piston rod of the suction cup lifting cylinder, several suction cups are fixed on the output shaft of the suction cup rotating cylinder, the clamp lifting cylinder is fixed on the cylinder body of the X-axial cylinder clamp, the Y-axial pneumatic clamp is fixed on the piston rod of the clamp lifting cylinder, and splints are fixed on the two fingers of the X-axial cylinder clamp and the two fingers of the Y-axial pneumatic clamp.

[0007] Specifically, the clamping and fixing mechanism includes a bracket, an L-shaped pressing plate, and a motor. Two motors are fixed on the bracket, and an L-shaped pressing plate is fixed on the output shaft of the motor.

[0008] Specifically, the aligning mechanism includes a connecting frame, a horizontal driving cylinder, a belt conveyor, and a clapper. The piston rod of the horizontal driving cylinder is fixed on the connecting frame, and the belt conveyor is installed on the connecting frame. The belt conveyor includes a motor 1, a belt, and a pulley. Both pulleys are rotatably connected to the connecting frame, and the belt is fitted on the two pulleys. The output shaft of motor 1 is fixed on one pulley, and both clappers are slidably connected to the connecting frame, and the two clappers are respectively fixed on two sides of the belt that are parallel to each other.

[0009] Specifically, the packaging bag silo includes a silo body, a lifting plate, and a lifting linear module. The lifting plate is slidably connected to the silo body, and a slide seat of the lifting linear module is fixedly connected to the lifting plate through a connecting block.

[0010] Specifically, the packaging bag opening mechanism includes a flat plate, a flat plate lifting cylinder, a horizontal frame, a suction cup, a suction cup lifting cylinder, and a suction cup horizontal driving cylinder. A flat plate is fixed on the piston rod of the flat plate lifting cylinder. Several suction holes are distributed on the flat plate, and the suction holes are connected to the vacuum pump. A horizontal frame is provided at the front end of the flat plate, and several suction cups are distributed on the horizontal frame in sequence. The horizontal frame is fixed on the piston rod of the suction cup lifting cylinder, and the cylinder body of the suction cup lifting cylinder is fixed on the piston rod of the suction cup horizontal driving cylinder.

[0011] Specifically, the packaging bag handling mechanism includes a first-level lifting cylinder, a second-level lifting cylinder, a suction cup, a slapping block, a slapping block lifting cylinder, and a horizontal linear module. The first-level lifting cylinder is fixed on the sliding seat of the horizontal linear module. The slapping block lifting cylinder and two second-level lifting cylinders are fixed on the piston rod of the first-level lifting cylinder. A slapping block is fixed on the piston rod of the slapping block lifting cylinder. Several suction cups are connected to the piston rod of the second-level lifting cylinder.

[0012] Specifically, the horizontal conveying mechanism 1 and the horizontal conveying mechanism 2 are both double-belt belt conveyors.

[0013] Specifically, the paper separation output mechanism is a card issuing machine.

[0014] The beneficial effect of the utility model is as follows: the utility model provides an automatic silicon wafer bagging machine. The separator paper delivered by the separator paper output mechanism is transported to the silicon wafer on the horizontal conveying mechanism one by a transport mechanism, and then the silicon wafer with the separator paper is transported to the horizontal conveying mechanism two, and the separator paper and the silicon wafer are aligned by an alignment mechanism. The packaging bag is opened by the packaging bag opening mechanism, and the aligned silicon wafers are finally sent into the packaging bag. The application improves the efficiency of silicon wafer bagging and saves costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the transport mechanism of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the pressing and fixing mechanism and the aligning mechanism of the utility model;

[0019] Figure 4 It is a structural schematic diagram of the packaging bag opening mechanism of the utility model;

[0020] In the figure, 1. Horizontal conveying mechanism 1, 2. Paper separation output mechanism, 3. Transport mechanism, 4. Pressing and fixing mechanism, 5. Alignment mechanism, 6. Bag silo, 7. Bag opening mechanism, 8. Bag transport mechanism, 9. Horizontal conveying mechanism 2, 31. Horizontal linear module 1, 32. Suction cup, 33. Suction cup rotating cylinder, 34. Suction cup lifting cylinder, 35. X-axis cylinder clamp, 36. Y-axis pneumatic clamp, 37.

[0021] Gripper lifting cylinder, 41. Bracket, 42. L-shaped pressure plate, 43. Motor, 51. Connecting frame, 52. Horizontal drive cylinder, 53. Belt conveyor, 54. Clapper, 61. Warehouse, 62. Lifting plate, 63. Lifting linear module, 71. Flat plate, 72. Flat plate lifting cylinder, 73. Horizontal frame, 74. Suction cup 1, 75. Suction cup lifting cylinder 1, 76. Suction cup horizontal drive cylinder 1, 81. First-stage lifting cylinder, 82. Second-stage lifting cylinder, 83. Suction cup 2, 84. Clapper block, 85. Clapper block lifting cylinder, 86. Horizontal linear module 2. DETAILED DESCRIPTION

[0022] Now the utility model is further described in detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the utility model in a schematic manner, and therefore only show the components related to the utility model.

[0023] Figure 1 It is a structural schematic diagram of the utility model; Figure 2 It is a structural schematic diagram of the transport mechanism of the utility model; Figure 3 It is a structural schematic diagram of the pressing and fixing mechanism and the aligning mechanism of the utility model; Figure 4 It is a structural schematic diagram of the packaging bag opening mechanism of the utility model.

[0024] As attached Figure 1As shown, an automatic silicon wafer bagging machine includes a horizontal conveying mechanism 1, a spacer paper output mechanism 2, a conveying mechanism 3, a clamping and fixing mechanism 4, an aligning mechanism 5, a packaging bag silo 6, a packaging bag opening mechanism 7, a packaging bag conveying mechanism 8, and a horizontal conveying mechanism 29. The silicon wafer horizontal conveying mechanism 1 for conveying silicon wafers, the spacer paper output mechanism 2 for outputting spacer paper, and the horizontal conveying mechanism 29 for conveying silicon wafers with spacer paper attached are all located below the conveying mechanism 3 for conveying spacer paper and silicon wafers. A packaging bag opening mechanism 7 for opening the bag mouth of the packaging bag is provided at the discharge port of the horizontal conveying mechanism 29. The packaging bag opening mechanism 7 and the packaging bag silo 6 are both located below the packaging bag conveying mechanism 8. A clamping and fixing mechanism 4 for clamping silicon wafers and spacer paper is installed on the horizontal conveying mechanism 29. The aligning mechanism 5 for aligning silicon wafers and spacer paper is located above the horizontal conveying mechanism 29.

[0025] As attached Figure 2 As shown, the transport mechanism 3 includes a horizontal linear module 31, a suction cup 32, a suction cup rotating cylinder 33, a suction cup lifting cylinder 34, an X-axis cylinder clamp 35, a Y-axis pneumatic clamp 36, and a clamp lifting cylinder 37. The suction cup lifting cylinder 34 and the X-axis cylinder clamp 35 are respectively fixed on the slide seat of the horizontal linear module 31, the suction cup rotating cylinder 33 is fixed on the piston rod of the suction cup lifting cylinder 34, and several suction cups 32 are fixed on the output shaft of the suction cup rotating cylinder 33. The clamp lifting cylinder 37 is fixed on the cylinder body of the X-axis cylinder clamp 35, and the Y-axis pneumatic clamp 36 is fixed on the piston rod of the clamp lifting cylinder 37. Both fingers of the X-axis cylinder clamp 35 and the two fingers of the Y-axis pneumatic clamp 36 are fixed with splints.

[0026] The horizontal linear module 31 can drive the suction cup 32, the X-axis cylinder clamp 35, and the Y-axis pneumatic clamp 36 to move horizontally and linearly synchronously. The suction cup lifting cylinder 34 can drive the suction cup 32 to move linearly up and down. The clamp lifting cylinder 37 can drive the Y-axis pneumatic clamp 36 to move linearly up and down. The two clamps on the X-axis cylinder clamp 35 and the two clamps on the Y-axis pneumatic clamp 36 can clamp the silicon wafer from four directions: front, back, left, and right. When the paper separator output mechanism 2 transports the paper separator to the pickup position, the suction cup 32 sucks the paper separator and places the paper separator on the silicon wafer in the tray on the horizontal conveying mechanism 1. When the Y-axis pneumatic clamp 36 moves to above the silicon wafer in the tray, the clamp lifting cylinder 37 drives the Y-axis pneumatic clamp 36 to move downward and clamp the silicon wafer from the front and back directions and lift it upward. When it is lifted between the two clamping plates of the X-axis cylinder clamp 35, the X-axis cylinder clamp 35 drives the two clamps to clamp the silicon wafer from the left and right directions.

[0027] The tray loaded with silicon wafers has four notches on the front, back, left and right sides to avoid the clamps.

[0028] As attached Figure 3As shown, the clamping and fixing mechanism 4 includes a bracket 41, an L-shaped pressing plate 42, and a motor 43. Two motors 43 are fixed on the bracket 41, and the L-shaped pressing plate 42 is fixed on the output shaft of the motor 43. The bracket 41 is fixed on the slide seat of the horizontal conveying mechanism 29.

[0029] After the silicon wafer with the spacer paper attached is placed on the bracket 41 , the two motors 43 respectively drive the two L-shaped pressing plates 42 to swing inwards until the two L-shaped pressing plates 42 press the spacer paper and the silicon wafer tightly onto the bracket 41 .

[0030] The aligning mechanism 5 includes a connecting frame 51, a horizontal driving cylinder 52, a belt conveyor 53, and a clapper 54. The piston rod of the horizontal driving cylinder 52 is fixed on the connecting frame 51. The belt conveyor 53 is installed on the connecting frame 51. The belt conveyor 53 includes a motor 1, a belt, and a pulley. The two pulleys are both rotatably connected to the connecting frame 51. The belt is fitted on the two pulleys. The output shaft of the motor 1 is fixed on one pulley. The two clappers 54 are both slidably connected to the connecting frame 51. The two clappers 54 are respectively fixed on two sides of the belt that are parallel to each other.

[0031] The motor drives the pulley to rotate, and the rotating pulley can drive the belt to transmit back and forth along the two pulleys, and the transmission belt can drive the two clappers 54 to move in opposite directions or relatively.

[0032] When the silicon wafer with the spacer paper attached is moved between the two clapping plates 54, the two clapping plates 54 move toward the middle relative to each other until the spacer paper in the middle is aligned with the silicon wafer.

[0033] The packaging bag silo 6 comprises a silo body 61, a lifting plate 62, and a lifting linear module 63. The lifting plate 62 is slidably connected in the silo body 61, and a slide seat of the lifting linear module 63 is fixedly connected to the lifting plate 62 via a connecting block.

[0034] After a stack of packaging bags is placed in the bin body 61 , the lifting linear module 63 drives the lifting plate 62 to gradually rise, so that the packaging bags can be lifted one by one to the height for picking up.

[0035] As attached Figure 4 As shown, the packaging bag opening mechanism 7 includes a flat plate 71, a flat plate lifting cylinder 72, a horizontal frame 73, a suction cup 74, a suction cup lifting cylinder 75, and a suction cup horizontal driving cylinder 76. The flat plate 71 is fixed on the piston rod of the flat plate lifting cylinder 72. Several suction holes are distributed on the flat plate 71, and the suction holes are connected to the vacuum pump. A horizontal frame 73 is provided at the front end of the flat plate 71. Several suction cups 74 are distributed on the horizontal frame 73 in sequence. The horizontal frame 73 is fixed on the piston rod of the suction cup lifting cylinder 75, and the cylinder body of the suction cup lifting cylinder 75 is fixed on the piston rod of the suction cup horizontal driving cylinder 76.

[0036] After the packaging bag is placed on the flat plate 71, the vacuum pump generates negative pressure suction force at the suction holes on the flat plate 71 to suck the lower surface of the packaging bag. Then the suction cup horizontal driving cylinder 76 drives the suction cups 74 to move horizontally to the top of the bag opening of the packaging bag, and the suction cup lifting cylinder 75 drives the suction cups 74 to move downward and suck the upper surface of the bag opening of the packaging bag. Finally, the suction cup 74 moves upward to open the bag opening.

[0037] The packaging bag handling mechanism 8 includes a first-stage lifting cylinder 81, a second-stage lifting cylinder 82, a suction cup 83, a slapping block 84, a slapping block lifting cylinder 85, and a horizontal linear module 86. The first-stage lifting cylinder 81 is fixed on the sliding seat of the horizontal linear module 86, the slapping block lifting cylinder 85 and two second-stage lifting cylinders 82 are fixed on the piston rod of the first-stage lifting cylinder 81, the slapping block 84 is fixed on the piston rod of the slapping block lifting cylinder 85, and several suction cups 83 are connected to the piston rod of the second-stage lifting cylinder 82.

[0038] The first-stage lifting cylinder 81 and the second-stage lifting cylinder 82 drive the second suction cup 83 to move down and suck the packaging bag. Since the second suction cup 83 may grab two packaging bags stuck together at one time, the slapping block lifting cylinder 85 drives the slapping block 84 to move up and down, so that the slapping block 84 can repeatedly slap the packaging bag, so that the two packaging bags stuck together can be separated.

[0039] The horizontal conveying mechanism 1 and the horizontal conveying mechanism 2 9 are both double-belt belt conveyors.

[0040] The paper separation output mechanism 2 is a card issuing machine.

[0041] The working method of the present application is as follows: a stack of silicon wafers are placed in a tray, and the tray is horizontally moved to the paper placement station by a horizontal conveying mechanism 1. Then the transporting mechanism 3 transports the spacer paper sent by the spacer paper output mechanism 2 and places it on the silicon wafer in the tray. The transporting mechanism 3 then grabs the stack of silicon wafers with the spacer paper attached and places it on the horizontal conveying mechanism 2 9, and the pressing and fixing mechanism 4 presses the spacer paper and silicon wafers and transports them horizontally forward to the aligning station, at which time the pressing and fixing mechanism 4 releases the silicon wafer, and the aligning mechanism 5 aligns the spacer paper and silicon wafer.

[0042] The bag bin 6 lifts the stack of bags one by one to the height for picking up the bags, and the bag transport mechanism 8 takes the bags one by one and places them on the bag opening mechanism 7, which opens the bag mouth. Then the horizontal driving cylinder 52 drives the two clappers 54 clamping the silicon wafer to move forward horizontally into the bag with the bag mouth opened, and finally the two clappers 54 release the silicon wafer and withdraw from the bag, thus completing the automated operation of attaching the silicon wafer to the spacer paper and bagging.

[0043] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without deviating from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A silicon wafer automatic bagging machine, characterized in that: The invention comprises a horizontal conveying mechanism (1), a spacer paper output mechanism (2), a conveying mechanism (3), a pressing and fixing mechanism (4), an aligning mechanism (5), a packaging bag silo (6), a packaging bag opening mechanism (7), a packaging bag conveying mechanism (8), and a horizontal conveying mechanism (9). The silicon wafer horizontal conveying mechanism (1) for conveying silicon wafers, the spacer paper output mechanism (2) for outputting spacer paper, and the horizontal conveying mechanism (9) for conveying silicon wafers with spacer paper attached are all located below the conveying mechanism (3) for conveying spacer paper and silicon wafers. A packaging bag opening mechanism (7) for opening the bag mouth of the packaging bag is provided at the discharge port of the horizontal conveying mechanism (9). The packaging bag opening mechanism (7) and the packaging bag silo (6) are both located below the packaging bag conveying mechanism (8). A pressing and fixing mechanism (4) for pressing silicon wafers and spacer paper is installed on the horizontal conveying mechanism (9). The aligning mechanism (5) for aligning silicon wafers and spacer paper is located above the horizontal conveying mechanism (9).

2. The automatic silicon wafer bagging machine according to claim 1, characterized in that: The transport mechanism (3) comprises a horizontal linear module (31), a suction cup (32), a suction cup rotating cylinder (33), a suction cup lifting cylinder (34), an X-axis cylinder clamp (35), a Y-axis pneumatic clamp (36), and a clamp lifting cylinder (37). The suction cup lifting cylinder (34) and the X-axis cylinder clamp (35) are respectively fixed on the slide seat of the horizontal linear module (31). The suction cup rotating cylinder (33) is fixed on the piston rod of the suction cup lifting cylinder (34). Several suction cups (32) are fixed on the output shaft of the suction cup rotating cylinder (33). The clamp lifting cylinder (37) is fixed on the cylinder body of the X-axis cylinder clamp (35). The Y-axis pneumatic clamp (36) is fixed on the piston rod of the clamp lifting cylinder (37). Two fingers of the X-axis cylinder clamp (35) and two fingers of the Y-axis pneumatic clamp (36) are fixed with clamping plates.

3. The automatic silicon wafer bagging machine according to claim 1, characterized in that: The clamping and fixing mechanism (4) comprises a bracket (41), an L-shaped pressing plate (42), and a motor (43); two motors (43) are fixed on the bracket (41), and an L-shaped pressing plate (42) is fixed on the output shaft of the motor (43).

4. The automatic silicon wafer bagging machine according to claim 1, characterized in that: The aligning mechanism (5) comprises a connecting frame (51), a horizontal driving cylinder (52), a belt conveyor (53), and a clapper (54). The piston rod of the horizontal driving cylinder (52) is fixed on the connecting frame (51). The belt conveyor (53) is installed on the connecting frame (51). The belt conveyor (53) comprises a motor 1, a belt, and a pulley. The two pulleys are both rotatably connected to the connecting frame (51). The belt is fitted on the two pulleys. The output shaft of the motor 1 is fixed on one pulley. The two clappers (54) are both slidably connected to the connecting frame (51). The two clappers (54) are respectively fixed on two sides of the belt that are parallel to each other.

5. The automatic silicon wafer bagging machine according to claim 1, characterized in that: The packaging bag silo (6) comprises a silo body (61), a lifting plate (62), and a lifting linear module (63); the lifting plate (62) is slidably connected in the silo body (61), and a sliding seat of the lifting linear module (63) is fixedly connected to the lifting plate (62) via a connecting block.

6. The automatic silicon wafer bagging machine according to claim 1, characterized in that: The packaging bag opening mechanism (7) comprises a flat plate (71), a flat plate lifting cylinder (72), a horizontal frame (73), a suction cup (74), a suction cup lifting cylinder (75), and a suction cup horizontal driving cylinder (76). The flat plate (71) is fixed on the piston rod of the flat plate lifting cylinder (72). The flat plate (71) is provided with a plurality of suction holes, which are connected to a vacuum pump. A horizontal frame (73) is provided at the front end of the flat plate (71). A plurality of suction cups (74) are sequentially distributed on the horizontal frame (73). The horizontal frame (73) is fixed on the piston rod of the suction cup lifting cylinder (75). The cylinder body of the suction cup lifting cylinder (75) is fixed on the piston rod of the suction cup horizontal driving cylinder (76).

7. The automatic silicon wafer bagging machine according to claim 1, characterized in that: The packaging bag handling mechanism (8) comprises a primary lifting cylinder (81), a secondary lifting cylinder (82), a second suction cup (83), a slapping block (84), a slapping block lifting cylinder (85), and a second horizontal linear module (86); the primary lifting cylinder (81) is fixed on the slide seat of the second horizontal linear module (86); the slapping block lifting cylinder (85) and two secondary lifting cylinders (82) are fixed on the piston rod of the primary lifting cylinder (81); the slapping block (84) is fixed on the piston rod of the slapping block lifting cylinder (85); and a plurality of second suction cups (83) are connected to the piston rod of the second lifting cylinder (82).

8. The automatic silicon wafer bagging machine according to claim 1, characterized in that: The horizontal conveying mechanism one (1) and the horizontal conveying mechanism two (9) are both double-belt belt conveyors.

9. The automatic silicon wafer bagging machine according to claim 1, characterized in that: The paper separation output mechanism (2) is a card issuing machine.

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