BGA packaging device of NAND memory

Abstract

The utility model relates to the technical field of BGA packaging devices, in particular to a BGA packaging device of an NAND memory, which comprises a base, a tin scraping assembly and a tin ball positioning assembly, the base comprises a substrate, a mold core is fixed in the middle of the upper end face of the substrate, positioning columns are fixedly connected to the upper side and the lower side of the upper end face of the substrate, and the tin ball positioning assembly is fixedly connected to the upper side and the lower side of the upper end face of the substrate. A transverse groove with two open ends is formed in the middle of the upper end face of the mold core, a plurality of containing grooves are formed in the positions, located on the two sides of the transverse groove, of the upper end face of the mold core, a supporting assembly is arranged on the inner side of the transverse groove and comprises a transverse plate, and a plurality of supporting frames are fixedly connected to the two sides of the transverse plate. The two ends of the transverse plate extend out of the transverse groove and are fixedly connected with end heads; according to the utility model, the lifting assembly is arranged, so that when the chip needs to be taken out after ball mounting is completed, all chips can be taken out at one time, the chip can be taken out more conveniently, the time consumption of chip taking-out operation can be effectively reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of BGA packaging devices, in particular to a BGA packaging device for a NAND memory. Background Art

[0002] NAND memory uses flash memory chips to store data in pages, and has the characteristics of high density, low cost, fast read and write, etc. NAND memory is widely used in storage devices such as solid-state hard drives, flash memory cards, and USB flash drives.

[0003] When NAND memory is packaged in BGA, a series of process steps are required to package the chip in the BGA package to provide better electrical connection and protection, among which ball planting is one of the important steps. At present, when ball planting, multiple chips need to be placed on a substrate and balled uniformly, and then taken out after ball planting. When taking out, the chips are generally taken out from the slots of the substrate one by one manually, which is time-consuming and reduces productivity. Therefore, those skilled in the art provide a BGA packaging device for NAND memory to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the utility model is to provide a BGA packaging device for NAND memory to solve the following technical problems:

[0005] How to reduce the time spent on chip removal during BGA packaging and ball planting to improve production efficiency.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A BGA packaging device for a NAND memory comprises a base, a tin scraping assembly and a tin ball positioning assembly, wherein the base comprises a substrate, a mold core is fixed at the middle of the upper end surface of the substrate, and positioning columns are fixedly connected to both upper and lower sides of the upper end surface of the substrate;

[0008] A transverse groove with two ends open is provided at the middle of the upper end surface of the mold core, and a plurality of accommodating grooves are provided at both sides of the transverse groove on the upper end surface of the mold core, and a supporting component is provided inside the transverse groove;

[0009] The lifting assembly includes a horizontal plate, and a plurality of supporting frames are fixedly connected to both sides of the horizontal plate. Both ends of the horizontal plate extend out of the horizontal groove and are fixedly connected to the end head, and the upper end surface of the end head is provided with two pressing grooves;

[0010] The bottoms of the plurality of accommodating grooves are each provided with a receiving groove, and the plurality of supporting frames are respectively arranged inside the plurality of receiving grooves.

[0011] Further, the tin scraping assembly includes a first outer frame, a tin scraping steel mesh is fixedly connected to the inner side of the first outer frame, the lower end surface of the tin scraping steel mesh contacts the mold core after the first outer frame cover is arranged on the base plate, and first pressing plates are fixedly connected to the inner two sides of the first outer frame below the tin scraping steel mesh, and two first pressing blocks are fixedly connected to the lower end surfaces of the two first pressing plates, and the position of the first pressing block corresponds to the position of the pressing groove;

[0012] Furthermore, first positioning holes are provided on both upper and lower sides of the lower end surface of the first outer frame, and the positions of the first positioning holes correspond to the positions of the positioning posts;

[0013] Further, the solder ball positioning assembly includes a second outer frame, the inner side of the second outer frame is fixedly connected with a solder ball steel mesh, the lower end surface of the solder ball steel mesh contacts the mold core after the second outer frame cover is arranged on the substrate, the inner two sides of the second outer frame are fixedly connected with second pressing plates located below the solder ball steel mesh, the lower end surfaces of the two second pressing plates are fixedly connected with two second pressing blocks, and the position of the second pressing block corresponds to the position of the pressing groove;

[0014] Furthermore, second positioning holes are provided on both upper and lower sides of the lower end surface of the second outer frame, and the positions of the second positioning holes correspond to the positioning posts;

[0015] Furthermore, a solder ball discharge port is provided on one side of the upper end surface of the second outer frame, and a slope is fixedly provided at the bottom of the solder ball discharge port;

[0016] Furthermore, both sides of the bottom of the transverse groove are provided with limiting holes, and both sides of the lower end surface of the transverse plate are fixedly connected with limiting heads, and the limiting heads are correspondingly plugged into the limiting holes;

[0017] Furthermore, the outer sides of the plurality of accommodating grooves are each provided with a notch;

[0018] Beneficial effects of the utility model:

[0019] In the utility model, a lifting component is arranged inside the base. When in use, each support frame of the lifting component is located at the bottom of each accommodating groove respectively. When the chip needs to be taken out after the ball planting is completed, the lifting component can be directly lifted through the two ends. When lifted, the chip is located above each support frame, so that all the chips can be taken out at one time, which is more convenient to take out. There is no need to take out the chips one by one. It can effectively reduce the time-consuming chip removal operation in the process of BGA packaging ball planting, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The utility model is further described below in conjunction with the accompanying drawings.

[0021] Figure 1 It is the overall structure diagram of the utility model;

[0022] Figure 2 It is a structural diagram of the base of the utility model;

[0023] Figure 3 It is a structural diagram of the lifting assembly of the utility model;

[0024] Figure 4 This is a bottom structural diagram of the tin scraping assembly of the utility model;

[0025] Figure 5 It is a bottom structural diagram of the solder ball assembly of the utility model.

[0026] Reference numerals:

[0027] 1. Base; 11. Base plate; 12. Mold core; 13. Accommodating groove; 14. Receiving groove; 15. Horizontal groove; 16. Notch; 17. Limiting hole; 18. Positioning head; 2. Lifting assembly; 21. Horizontal plate; 22. Support frame; 23. End; 24. Pressing groove; 25. Limiting head; 3. Tin scraping assembly; 31. First outer frame;

[0028] 32. Tin scraping steel mesh; 33. First pressing plate; 34. First pressing block; 35. First positioning hole; 4. Tin ball positioning assembly; 41. Second outer frame; 42. Tin ball steel mesh; 43. Tin ball discharge port; 44. Slope;

[0029] 45. Second pressing plate; 46. Second pressing block; 47. Second positioning hole. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] Please refer to the attached Figure 1-Figure 5 As shown, a BGA packaging device of a NAND memory in an embodiment of the utility model includes a base 1, a tin scraping assembly 3 and a tin ball positioning assembly 4. The base 1 is provided for positioning the chip, the tin scraping assembly 3 is used to apply solder paste at the chip planting position to facilitate the connection of the solder balls, and the tin ball positioning assembly 4 is provided for positioning the solder balls one by one at the planting positions.

[0032] The base 1 includes a substrate 11, a mold core 12 is fixed at the middle of the upper end surface of the substrate 11, and positioning columns 18 are fixedly connected to the upper and lower sides of the upper end surface of the substrate 11. The positioning columns 18 are provided to position when the tin scraping assembly 3 and the tin ball positioning assembly 4 are connected.

[0033] A transverse groove 15 with both ends open is provided in the middle of the upper end surface of the mold core 12, and multiple accommodating grooves 13 are provided on both sides of the upper end surface of the mold core 12. A lifting component 2 is provided on the inner side of the transverse groove 15. The lifting component 2 is used to quickly remove the chip from the accommodating groove 13. Multiple chips can be directly removed in one operation.

[0034] The lifting component 2 includes a horizontal plate 21, and multiple supporting frames 22 are fixedly connected to both sides of the horizontal plate 21. Both ends of the horizontal plate 21 extend out of the horizontal groove 15 and are fixedly connected to the end heads 23. Two pressing grooves 24 are provided on the upper end surface of the end heads 23. When taking out the chip, the lifting component 2 is lifted by the two end heads 23. When lifted, the chip is located above each supporting frame 22, so that all the chips can be taken out at one time. The setting of the two end heads 23 is convenient for use with both hands, which can improve stability during use and prevent chips from falling.

[0035] The bottom of the plurality of receiving grooves 13 is provided with receiving grooves 14, and the plurality of supporting frames 22 are respectively arranged inside the plurality of receiving grooves 14. The supporting frames 22 are placed in the receiving grooves 14 so that the upper surface height of the supporting frames 22 is lower than the bottom surface height of the receiving grooves 13, which does not affect the placement of the chip.

[0036] The tin scraping assembly 3 includes a first outer frame 31, and a tin scraping steel mesh 32 is fixedly connected to the inner side of the first outer frame 31. After the first outer frame 31 is covered on the substrate 11, the lower end surface of the tin scraping steel mesh 32 contacts the mold core 12, and the inner two sides of the first outer frame 31 are fixedly connected with first pressing plates 33 below the tin scraping steel mesh 32. The lower end surfaces of the two first pressing plates 33 are fixedly connected with two first pressing blocks 34, and the positions of the first pressing blocks 34 correspond to the positions of the pressing grooves 24. After the chip is placed in the accommodating groove 13, the tin scraping assembly 3 is covered, and solder paste is scraped on the tin scraping steel mesh 32 of the tin scraping assembly 3. The solder paste is coated on the chip planting position through the mesh holes of the tin scraping steel mesh 32, and the first pressing plate 33 and the first pressing block 34 are pressed on the top of the two end heads 23 after the cover is put on, thereby stabilizing the holding assembly 2 to prevent it from causing the chip to deviate and affecting the processing effect.

[0037] First positioning holes 35 are formed on both upper and lower sides of the lower end surface of the first outer frame 31 . The positions of the first positioning holes 35 correspond to the positions of the positioning posts 18 .

[0038] The solder ball positioning assembly 4 includes a second outer frame 41, and a solder ball steel mesh 42 is fixedly connected to the inner side of the second outer frame 41. After the second outer frame 41 is covered on the substrate 11, the lower end surface of the solder ball steel mesh 42 contacts the mold core 12, and the inner two sides of the second outer frame 41 are located below the solder ball steel mesh 42 and are fixedly connected with second pressing plates 45. The lower end surfaces of the two second pressing plates 45 are fixedly connected with two second pressing blocks 46, and the positions of the second pressing blocks 46 correspond to the positions of the pressing grooves 24. After the solder paste coating is completed, the tin scraping assembly 3 is removed, and the solder ball positioning assembly 4 is covered on the base 1. The solder ball is poured onto the solder ball steel mesh 42, and the solder ball is positioned at the chip planting point through the mesh holes of the solder ball steel mesh 42. The second pressing plate 45 and the second pressing block 46 are also used to prevent the lifting assembly 2 from shaking.

[0039] Second positioning holes 47 are formed on both upper and lower sides of the lower end surface of the second outer frame 41 , and the positions of the second positioning holes 47 correspond to the positioning posts 18 .

[0040] A solder ball outlet 43 is provided on one side of the upper end surface of the second outer frame 41, and a slope 44 is fixedly provided at the bottom of the solder ball outlet 43. After the solder balls are positioned, excess solder balls are poured out through the solder ball outlet 43, and the slope 44 is set to be low inside and high outside, which can prevent the solder balls from rolling out of the solder ball outlet 43 when pouring in.

[0041] Limiting holes 17 are provided on both sides of the bottom of the transverse groove 15, and limiting heads 25 are fixedly connected on both sides of the lower end surface of the transverse plate 21. The limiting heads 25 are correspondingly plugged into the limiting holes 17. The setting of the limiting holes 17 and the limiting heads 25 can improve the stability of the transverse plate 21 during installation.

[0042] The outer sides of the plurality of receiving grooves 13 are each provided with a notch 16 , and the notch 16 is provided to leave space for placing the chip.

[0043] Working principle: When in use, first place the NAND memory chip without ball implantation in the accommodating groove 13, then cover it with the tin scraping assembly 3, scrape the solder paste on the tin scraping steel mesh 32 of the tin scraping assembly 3, and the solder paste is coated on the chip implantation position through the mesh of the tin scraping steel mesh 32, then remove the tin scraping assembly 3, cover it with the solder ball positioning assembly 4, pour solder balls on the solder ball steel mesh 42, remove the solder ball positioning assembly 4 after all the solder balls are positioned, and then heat and fix the solder balls. When the chips are taken out after completion, lift the lifting assembly 2 through the two ends 23. When lifted, the chips are located above each support frame 22, so that all the chips can be taken out at one time.

[0044] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A BGA packaging device for a NAND memory, comprising a base (1), a tin scraping assembly (3) and a tin ball positioning assembly (4), characterized in that: The base (1) comprises a base plate (11), a mold core (12) is fixed at the middle of the upper end surface of the base plate (11), and positioning columns (18) are fixedly connected to both upper and lower sides of the upper end surface of the base plate (11); A transverse groove (15) with two ends open is provided in the middle of the upper end surface of the mold core (12); a plurality of accommodating grooves (13) are provided on both sides of the upper end surface of the mold core (12) of the transverse groove (15); and a supporting assembly (2) is provided inside the transverse groove (15); The supporting assembly (2) comprises a transverse plate (21), a plurality of supporting frames (22) are fixedly connected to both sides of the transverse plate (21), both ends of the transverse plate (21) extend out of the transverse groove (15) and are fixedly connected to end heads (23), and the upper end surface of the end head (23) is provided with two pressing grooves (24); The bottoms of the plurality of accommodating grooves (13) are each provided with a receiving groove (14), and the plurality of supporting frames (22) are respectively arranged inside the plurality of receiving grooves (14).

2. The BGA packaging device of a NAND memory according to claim 1, characterized in that: The tin scraping assembly (3) comprises a first outer frame (31), a tin scraping steel mesh (32) is fixedly connected to the inner side of the first outer frame (31), the lower end surface of the tin scraping steel mesh (32) contacts the mold core (12) after the first outer frame (31) is covered on the base plate (11), and first pressing plates (33) are fixedly connected to the inner sides of the first outer frame (31) below the tin scraping steel mesh (32), and two first pressing blocks (34) are fixedly connected to the lower end surfaces of the two first pressing plates (33), and the position of the first pressing blocks (34) corresponds to the position of the pressing groove (24).

3. The BGA packaging device of a NAND memory according to claim 2, characterized in that: First positioning holes (35) are provided on both upper and lower sides of the lower end surface of the first outer frame (31), and the position of the first positioning hole (35) corresponds to the position of the positioning column (18).

4. The BGA packaging device of a NAND memory according to claim 1, characterized in that: The solder ball positioning assembly (4) comprises a second outer frame (41), the inner side of which is fixedly connected to a solder ball steel mesh (42), and after the second outer frame (41) is covered on the substrate (11), the lower end surface of the solder ball steel mesh (42) contacts the mold core (12), and the inner two sides of the second outer frame (41) located below the solder ball steel mesh (42) are fixedly connected to second pressing plates (45), and the lower end surfaces of the two second pressing plates (45) are fixedly connected to two second pressing blocks (46), and the position of the second pressing blocks (46) corresponds to the position of the pressing groove (24).

5. The BGA packaging device of a NAND memory according to claim 4, characterized in that: Second positioning holes (47) are provided on both upper and lower sides of the lower end surface of the second outer frame (41), and the position of the second positioning hole (47) corresponds to the positioning column (18).

6. The BGA packaging device of a NAND memory according to claim 4, characterized in that: A solder ball discharge port (43) is provided on one side of the upper end surface of the second outer frame (41), and a slope (44) is fixedly provided at the bottom of the solder ball discharge port (43).

7. The BGA packaging device of a NAND memory according to claim 1, characterized in that: Limiting holes (17) are provided on both sides of the bottom of the transverse groove (15), and limiting heads (25) are fixedly connected to both sides of the lower end surface of the transverse plate (21), and the limiting heads (25) are correspondingly plugged into the limiting holes (17).

8. The BGA packaging device of a NAND memory according to claim 1, characterized in that: The outer sides of the plurality of accommodating grooves (13) are each provided with a notch (16).

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