Semiconductor carrying disc applicable to semiconductor elements with different specifications

Abstract

The utility model discloses a semiconductor carrier applicable to semiconductor elements of different specifications, which relates to the technical field of semiconductor carriers and comprises a workbench and a carrier, a groove is arranged in the carrier, a first spring is fixedly connected onto the inner wall, far away from the groove, of the carrier, and the other end of the first spring is fixedly connected with a clamping plate. A semiconductor element is placed between the clamping plates in the carrier through the grooves, the semiconductor element is more conveniently placed in the carrier through the grooves, the clamping plates and the first springs are matched, the clamping plates are made of semiconductor silica gel materials and have an excellent permanent antistatic function, the semiconductor element is fixed in the carrier, and the protective cover is arranged, so that the semiconductor element is fixed in the carrier through the protective cover. The first spring is arranged in the groove, so that the semiconductor element is not in contact with the first spring when being placed in the carrier, when the semiconductor element needs to be taken out, an operator only needs to pull the pull rod to take out the semiconductor element through the groove, and the technical problem of fixing semiconductors of different specifications during processing is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor carriers, in particular to a semiconductor carrier applicable to semiconductor elements of different specifications. Background Art

[0002] Matter exists in various forms, such as solid, liquid, gas, plasma, etc. We usually call materials with poor conductivity, such as coal, artificial crystal, amber, ceramics, etc., insulators. Metals with better conductivity, such as gold, silver, copper, iron, tin, aluminum, etc., are called conductors. Materials between conductors and insulators can be simply called semiconductors. Compared with conductors and insulators, semiconductor materials were discovered the latest. It was not until the 1930s, when the purification technology of materials was improved, that the existence of semiconductors was truly recognized by the academic community.

[0003] The existing patent (publication number: CN219286359U) proposes a semiconductor carrier that can be used for semiconductor components of different specifications, a workbench and a carrier body, the outer wall of the carrier body is provided with a plurality of through holes for air flow, the inner wall of the carrier body is provided with a plurality of chambers, the outer wall of the workbench is fixedly connected with a control valve for controlling the air pressure in the inner cavity of the carrier body, the control valve is externally connected with a vacuum pump, the inner cavity of the carrier body is provided with a first chamber, a second chamber and a third chamber, and the first chamber, the second chamber and the third chamber are not connected to each other, the inner wall of the first chamber is fixedly connected with a first air pipe, one end of the first air pipe extends to the inner wall of the control air valve, the inner wall of the second chamber is fixedly connected with a second air pipe, one end of the second air pipe extends to the inner wall of the control air valve, through the coordinated use of the above devices, wafers of different sizes can be adsorbed, thereby improving work efficiency.

[0004] The semiconductor carrier that can be used for semiconductor components of different specifications can adsorb the wafer by putting the inner cavity of the carrier body into negative pressure through a vacuum pump, and control the multiple chambers in the carrier body by controlling the gas valve to achieve the effect of adsorbing wafers of different sizes. Not only will negative pressure adsorption affect the processing of semiconductors, but it will also cause the semiconductor to move horizontally during processing. Therefore, we propose a semiconductor carrier that can be used for semiconductor components of different specifications. Utility Model Content

[0005] The utility model provides a semiconductor carrier which can be used for semiconductor elements of different specifications, and solves the technical problem of fixing semiconductors of different specifications during processing.

[0006] In order to solve the above technical problems, the utility model provides a semiconductor carrier that can be used for semiconductor components of different specifications, including a workbench and a carrier, a groove is opened inside the carrier, a first spring is fixedly connected to the inner wall of the carrier away from the groove, the other end of the first spring is fixedly connected to a clamping plate, a limiting groove is opened on the side of the clamping plate away from the first spring, a pull rod is fixedly installed on the side of the clamping plate close to the first spring, a protective cover is arranged on the outer side of the clamping plate, the protective cover is sleeved on the first spring, and the other end of the protective cover is fixed to the carrier.

[0007] The above technical solution is adopted: the operator pulls the pull rod to place the semiconductor component between the clamps in the carrier through the groove. The set groove makes it easier to place the semiconductor component in the carrier. The clamp and the first spring cooperate with each other. The clamp is made of semiconductor silicone material and has excellent permanent antistatic function. The semiconductor component is fixed inside the carrier. The protective cover is set so that the semiconductor component will not contact the first spring when placed in the carrier. When the semiconductor component needs to be taken out, the operator only needs to pull the pull rod to take out the semiconductor component through the groove, which solves the technical problem of fixing semiconductors of different specifications during processing.

[0008] Preferably, a buckle is fixedly mounted on the outside of the carrier close to the groove.

[0009] By adopting the above technical solution, the carrier can be fixed in the carrier plate by means of the provided buckles.

[0010] Preferably, a clamping block is fixedly installed inside the buckle, a second spring is fixedly connected between the clamping blocks, and push rods are arranged on both sides of the clamping blocks.

[0011] The above technical solution is adopted: through the cooperation of the buckle, the card block, the second spring and the push rod, the operator presses the push rods on both sides of the buckle to put the card block into the card slot, and the card block is connected to the card slot through the force of the second spring. When the operator needs to take out the carrier, he only needs to press the push rods on both sides of the buckle to take out the carrier, which solves the technical problem that the carrier can be disassembled separately.

[0012] Preferably, a carrier plate is provided on the top of the workbench, and the carrier is arranged inside the carrier plate.

[0013] By adopting the above technical solution, the semiconductor element can be fixed on the workbench by providing a carrier and a carrier.

[0014] Preferably, a card slot is provided at the inner bottom of the carrier plate.

[0015] By adopting the above technical solution, the buckle is connected inside the slot through the provided slot, so that the carrier can be fixed inside the carrier plate.

[0016] Preferably, the buckle is snap-connected in the slot.

[0017] Compared with the related art, the utility model has the following beneficial effects:

[0018] 1. The operator pulls the pull rod to place the semiconductor component between the clamps in the carrier through the groove. The set groove makes it easier to place the semiconductor component in the carrier. The clamp and the first spring cooperate. The clamp is made of semiconductor silicone material and has excellent permanent antistatic function. The semiconductor component is fixed inside the carrier. The protective cover is set so that the semiconductor component will not contact the first spring when placed in the carrier. When the semiconductor component needs to be taken out, the operator only needs to pull the pull rod to take the semiconductor component out through the groove, which solves the technical problem of fixing semiconductors of different specifications during processing.

[0019] 2. Through the cooperation of the buckle, the card block, the second spring and the push rod, the operator presses the push rods on both sides of the buckle to put the card block into the card slot, and the card block is connected to the card slot through the force of the second spring. When the operator needs to take out the carrier, he only needs to press the push rods on both sides of the buckle to take out the carrier, which solves the technical problem that the carrier can be disassembled separately. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of a semiconductor carrier that can be used for semiconductor elements of different specifications;

[0021] Figure 2 A schematic diagram of the internal structure of a semiconductor carrier that can be used for semiconductor components of different specifications;

[0022] Figure 3 A schematic diagram of a carrier assembly structure of a semiconductor carrier applicable to semiconductor components of different specifications;

[0023] Figure 4 The present invention is a schematic diagram of a buckle assembly structure of a semiconductor carrier that can be used for semiconductor components of different specifications.

[0024] Numbers in the figure: 1. workbench; 2. carrier plate; 3. carrier; 4. groove; 5. first spring; 6. clamping plate; 7. limit groove; 8. pull rod; 9. protective cover; 10. buckle; 11. block; 12. second spring; 13. push rod; 14. slot. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Embodiment 1

[0027] like Figure 1-4 As shown, it includes a workbench 1 and a carrier 3, wherein a groove 4 is provided inside the carrier 3, a first spring 5 is fixedly connected to the inner wall of the carrier 3 away from the groove 4, a clamping plate 6 is fixedly connected to the other end of the first spring 5, a limiting groove 7 is provided on the side of the clamping plate 6 away from the first spring 5, a pull rod 8 is fixedly installed on the side of the clamping plate 6 close to the first spring 5, a protective cover 9 is provided on the outer side of the clamping plate 6, the protective cover 9 is sleeved on the first spring 5, and the other end of the protective cover 9 is fixed on the carrier 3, and the operator pulls the pull rod 8 to put the semiconductor component into the clamping plate in the carrier 3 through the groove 4. 6, the groove 4 is set so that the semiconductor element can be placed in the carrier 3 more conveniently. Through the cooperation of the clamping plate 6 and the first spring 5, the clamping plate 6 is made of semiconductor silicone material and has excellent permanent anti-static function, which fixes the semiconductor element in the carrier 3. Through the protective cover 9, the semiconductor element will not contact the first spring 5 when placed in the carrier 3. When the semiconductor element needs to be taken out, the operator only needs to pull the pull rod 8 to take the semiconductor element out through the groove 4, which solves the technical problem of fixing semiconductors of different specifications during processing.

[0028] Embodiment 2

[0029] like Figure 1-4As shown, a buckle 10 is fixedly installed on the outside of the carrier 3 near the groove 4. The carrier 3 can be fixed in the carrier 2 through the buckle 10. A clamping block 11 is fixedly installed inside the buckle 10. A second spring 12 is fixedly connected between the clamping blocks 11. Push rods 13 are arranged on both sides of the clamping blocks 11. Through the cooperation of the buckle 10, the clamping block 11, the second spring 12 and the push rod 13, the operator presses the push rods 13 on both sides of the buckle 10 to put the clamping block 11 into the clamping groove 14, and the clamping block 11 is clamped in the clamping groove 14 through the action of the second spring 12. When the operator needs to take out the carrier 3, he only needs to press the push rods 13 on both sides of the buckle 10 to take out the carrier 3, which solves the technical problem that the carrier 3 can be disassembled separately. A carrier tray 2 is arranged on the top of the workbench 1, and the carrier 3 is arranged inside the carrier tray 2. Through the arranged carrier tray 2 and the carrier 3, the semiconductor element can be fixed on the workbench 1, and a card slot 14 is opened at the bottom of the carrier tray 2. Through the arranged card slot 14, the buckle 10 is clamped in the card slot 14, so that the carrier 3 can be fixed in the carrier tray 2, and the buckle 10 is clamped in the card slot 14.

[0030] Working principle: Figure 1-4 As shown, first, the operator pulls the pull rod 8 to place the semiconductor component between the clamping plates 6 in the carrier 3 through the groove 4. The groove 4 makes it easier to place the semiconductor component in the carrier 3. The clamping plates 6 and the first spring 5 cooperate. The clamping plates 6 are made of semiconductor silicone and have excellent permanent antistatic function. The semiconductor component is fixed in the carrier 3. The protective cover 9 is set so that the semiconductor component will not contact the first spring 5 when it is placed in the carrier 3. When the semiconductor component needs to be taken out, the operator only needs to pull the pull rod 8 to remove the semiconductor component. The conductor element can be taken out through the groove 4, which solves the technical problem of fixing semiconductors of different specifications during processing. Through the cooperation of the buckle 10, the block 11, the second spring 12 and the push rod 13, the operator presses the push rods 13 on both sides of the buckle 10 to put the block 11 into the slot 14, and the block 11 is clamped in the slot 14 through the force of the second spring 12. When the operator needs to take out the carrier 3, he only needs to press the push rods 13 on both sides of the buckle 10 to take out the carrier 3, which solves the technical problem that the carrier 3 can be disassembled separately.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor carrier suitable for semiconductor components of different specifications, It is characterized in that The invention comprises a workbench (1) and a carrier (3), wherein a groove (4) is provided inside the carrier (3), a first spring (5) is fixedly connected to the inner wall of the carrier (3) away from the groove (4), the other end of the first spring (5) is fixedly connected to a clamping plate (6), a limiting groove (7) is provided on the side of the clamping plate (6) away from the first spring (5), a pull rod (8) is fixedly installed on the side of the clamping plate (6) close to the first spring (5), a protective cover (9) is provided on the outer side of the clamping plate (6), the protective cover (9) is sleeved on the first spring (5), and the other end of the protective cover (9) is fixed to the carrier (3).

2. A semiconductor carrier applicable to semiconductor devices of different specifications according to claim 1, It is characterized in that A buckle (10) is fixedly mounted on the outside of the carrier (3) on one side close to the groove (4).

3. A semiconductor carrier applicable to semiconductor devices of different specifications according to claim 2, It is characterized in that A clamping block (11) is fixedly installed inside the buckle (10), a second spring (12) is fixedly connected between the clamping blocks (11), and push rods (13) are arranged on both sides of the clamping blocks (11).

4. A semiconductor carrier applicable to semiconductor devices of different specifications according to claim 1, It is characterized in that A carrier plate (2) is arranged on the top of the workbench (1), and the carrier (3) is arranged inside the carrier plate (2).

5. A semiconductor carrier applicable to semiconductor devices of different specifications according to claim 4, It is characterized in that The bottom of the carrier plate (2) is provided with a card slot (14).

6. A semiconductor carrier applicable to semiconductor devices of different specifications according to claim 2, It is characterized in that The buckle (10) is snap-fitted into the slot (14).

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