MOS tube support and MOS tube heat dissipation assembly

Abstract

The utility model relates to the technical field of MOS tube heat dissipation, in particular to an MOS tube support and an MOS tube heat dissipation assembly, the MOS tube support comprises a support body and an arch-shaped supporting part formed on the support body, and the arch-shaped supporting part and the support body are integrated plastic parts; the arch-shaped supporting part is exposed out of the support body and can generate elastic deformation under the action of external force, so that the arch-shaped supporting part generates reverse acting force on a product supported by the top of the arch-shaped supporting part. Compared with the prior art, the integrated plastic part is adopted and is different from the structure that a metal sheet is wrapped by the plastic part, the arc-shaped supporting part on the support body is used for supporting the MOS tube, the arc-shaped supporting part can generate slight elastic deformation, then counter-acting force is generated, the MOS tube is tightly attached to the radiator on the top of the MOS tube, the MOS tube and the radiator are more uniform, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The present application relates to the technical field of MOS tube heat dissipation, and in particular to a MOS tube bracket and a MOS tube heat dissipation component. Background Art

[0002] At present, a MOS tube (Metal-Oxide-Semiconductor Field-Effect Transistor, also known as MOSFET, is a commonly used semiconductor device) is installed on a circuit board through a bracket, and a heat dissipation space is formed between the MOS tube and the bracket by designing the bracket. However, the current bracket is a structure of a metal spring wrapped by an ordinary plastic part, and a reverse force is provided to the bracket by a structure of a crimped metal sheet position, so that the MOS tube is abutted against the heat sink above it, and then locked with screws. However, due to the plastic wrapping of the metal spring, this position often presents a rigid structure rather than an elastic structure, that is, it is impossible to provide a reverse force to the bracket at all, so that the bracket can be closely attached to the bottom of the heat sink, that is, it is easy to have a poor contact problem, and the heat dissipation effect of the MOS tube is poor, and the structure cost of the plastic wrapping of the metal spring is relatively high. Utility Model Content

[0003] The purpose of the present application is to provide a MOS tube bracket, which to a certain extent solves the technical problems that the bracket in the prior art is a structure in which the bracket is an ordinary plastic part wrapped with a metal spring, which is rigid and cannot provide a reverse force to the bracket, so that the bracket cannot be in close contact with the radiator, resulting in poor heat dissipation effect on the MOS tube, and the structural cost of the plastic wrapped metal spring is relatively high.

[0004] The present application provides a MOS tube bracket, comprising: a bracket body and an arched support portion formed on the bracket body, wherein the arched support portion and the bracket body are an integrated plastic part;

[0005] The arched support portion is exposed from the support body and can be elastically deformed under the action of an external force, so that the arched support portion generates a reverse force on the product supported by the top thereof.

[0006] In the above technical solution, further, the bracket body is formed with a mounting groove, and the bottom of the mounting groove along its height direction is formed with a mounting opening, any of the arched support parts is arranged at the mounting opening, and the two ends of any of the arched support parts are respectively connected to the opposite sides of the mounting opening.

[0007] In any of the above technical solutions, further, a reinforcing beam is provided in the region between any two adjacent arched support portions in the installation opening.

[0008] In any of the above technical solutions, further, a mounting hole is formed at the bottom of the mounting groove along its height direction.

[0009] In any of the above technical solutions, further, there are multiple installation grooves, and reinforcing ribs are connected between any two adjacent installation grooves.

[0010] In any of the above technical solutions, further, any two adjacent installation grooves are connected via a groove body, the reinforcing ribs are arranged in the internal hollow part of the groove body, and the reinforcing ribs are connected to the inner side wall and the inner bottom wall of the groove body.

[0011] In any of the above technical solutions, further, there are multiple arched support parts.

[0012] In any of the above technical solutions, further, a plurality of the arched support portions are arranged sequentially along a preset direction.

[0013] In any of the above technical solutions, further, a supporting plane is formed at the top of the arched support portion along its height direction.

[0014] In any of the above technical solutions, further, a mounting plane is formed at the bottom of the bracket body along its height direction.

[0015] In any of the above technical solutions, further, the bracket body is formed with a snap-fit ​​portion.

[0016] The present application also provides a MOS tube heat dissipation assembly, comprising a MOS tube, a radiator, a fastening member, and a MOS tube bracket as described in any of the above technical solutions, wherein the MOS tube bracket is mounted on the circuit board, the MOS tube is mounted on the top of the arched support portion of the MOS tube bracket, the radiator is mounted on the top of the MOS tube, and is locked to the MOS tube bracket by the fastening member. Therefore, all the beneficial technical effects of 123 are achieved, and no further description is given here.

[0017] Compared with the prior art, the beneficial effects of this application are:

[0018] In summary, the MOS tube bracket provided in this application has the following structure and advantages:

[0019] The present application adopts an integrally molded plastic part, which is different from the structure of a plastic part wrapped around a metal sheet in the prior art, and uses an arched support part on the bracket body to support the MOS tube. The arched support part can produce a slight elastic deformation, thereby generating a reaction force, so that the MOS tube fits tightly and more evenly with the heat sink on its top, thereby improving the heat dissipation effect.

[0020] Moreover, the bracket body is formed with a mounting groove, and the bottom of the mounting groove along the height direction thereof is formed with a mounting opening, any arched support portion is arranged at the mounting opening, and the two ends of any arched support portion are respectively connected to the opposite sides of the mounting opening. It can be seen that the MOS tube is preferably installed in the mounting groove formed by the bracket body, and the side wall of the mounting groove serves to limit the heat sink on the top of the MOS tube, so as to avoid excessive squeezing of the MOS tube and damage thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 A schematic diagram of the structure of a MOS tube bracket provided in an embodiment of the present application;

[0023] Figure 2 Another structural schematic diagram of the MOS tube bracket provided in the embodiment of the present application;

[0024] Figure 3 Another structural schematic diagram of the MOS tube bracket provided in the embodiment of the present application;

[0025] Figure 4 An assembly diagram of a MOS tube bracket and a circuit board provided in an embodiment of the present application;

[0026] Figure 5 for Figure 4 A partial enlarged view of

[0027] Figure 6 An assembly diagram of a MOS tube bracket, a circuit board, and a heat sink provided in an embodiment of the present application;

[0028] Figure 7 for Figure 6 Cross-sectional view along section BB;

[0029] Figure 8 for Figure 7 Schematic diagram of the enlarged structure at C.

[0030] Reference numerals:

[0031] 10-MOS tube bracket, 1-bracket body, 11-installation groove, 12-installation port, 13-reinforcement beam, 14-installation hole, 15-installation plane, 2-arched support portion, 21-first support section, 22-second support section, 23-third support section, 24-support plane, 3-groove body, 4-reinforcement rib, 5-buckle portion, 20-MOS tube, 201-main body, 202-support foot, 30-heat sink, 40-fastening member, 50-circuit board. DETAILED DESCRIPTION

[0032] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0033] The components of the embodiments of the present application generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed, but merely represents the selected embodiments of the present application.

[0034] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of this application.

[0035] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0036] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] Refer to the following Figures 1 to 8 The present invention describes a MOS tube bracket and a MOS tube heat dissipation assembly according to some embodiments of the present application.

[0038] Embodiment 1

[0039] See also Figures 1 to 8 As shown, an embodiment of the present application provides a MOS tube bracket 10, comprising: a bracket body 1 and an arched support portion 2 formed on the bracket body 1, and the arched support portion 2 and the bracket body 1 are an integral plastic part; the arched support portion 2 is exposed from the bracket body 1, and the arched support portion 2 can be elastically deformed under the action of external force, so that the arched support portion 2 generates a reverse force on the product supported on its top, such as the MOS tube 20.

[0040] Based on the structure described above, it can be known that the MOS tube bracket 10 provided in the present application can be used to support between the circuit board 50 and the MOS tube 20. The specific installation structure is as follows:

[0041] The MOS tube bracket 10 is mounted on the circuit board 50 , the MOS tube 20 is mounted on the top of the arched support portion 2 of the MOS tube bracket 10 , and the heat sink 30 is mounted on the top of the MOS tube 20 and is locked to the MOS tube bracket 10 by a fastening member 40 such as a screw or bolt.

[0042] It can be seen that the present application adopts an integrally molded plastic part, which is different from the structure of a plastic part wrapped around a metal sheet in the prior art, and utilizes the arched support portion 2 on the bracket body 1 to support the MOS tube 20. The arched support portion 2 can produce a slight elastic deformation, thereby generating a reaction force, so that the MOS tube 20 fits tightly with the heat sink 30 on its top, thereby improving the heat dissipation effect.

[0043] It should be noted that the MOS tube bracket 10 provided in the present application can also be used in other environments, and the specific selection is based on actual needs.

[0044] In this embodiment, preferably, Figure 1 and Figure 2 As shown, the bracket body 1 is formed with a mounting groove 11, and a mounting opening 12 is formed at the bottom of the mounting groove 11 along its height direction. Any arched support part 2 is arranged at the mounting opening 12, and the two ends of any arched support part 2 are respectively connected to the opposite sides of the mounting opening 12.

[0045] According to the structure described above, the MOS tube 20 can be installed in the installation groove 11, and the side wall of the installation groove 11 serves to limit the heat sink 30 on the top of the MOS tube 20 to avoid excessive squeezing of the MOS tube 20 and causing damage.

[0046] It should be noted that: it is not limited to the above-mentioned structure, that is, it is not limited to setting the installation groove 11 on the bracket body 1, designing the arch support part 2 at the bottom of the installation groove 11, and it is also possible not to design the installation groove 11 on the bracket body 1. For example: the bracket body 1 is designed to be a plate structure or block structure or frame structure without the installation groove 11, and the arch support part 2 is directly designed on the top of the aforementioned plate structure or block structure or frame structure.

[0047] In this embodiment, preferably, Figures 1 to 3 As shown, a reinforcing beam 13 is provided in the region between any two adjacent arched support portions 2 in the installation opening 12 .

[0048] According to the structure described above, it can be known that the reinforcing beam 13 plays a role in increasing the strength to prevent the strength of the vacant area from being too low.

[0049] Further, preferably, the reinforcing beam 13 may be a long flat plate having the same thickness as the bottom wall of the mounting groove 11 , but is not limited thereto.

[0050] Further, preferably, a reinforcing beam 13 is provided between any two adjacent arched support portions 2. Of course, this is not limited to this, and two reinforcing beams 13 may also be designed, and so on.

[0051] In this embodiment, preferably, Figure 2 , Figure 3 and Figure 5 As shown, a mounting hole 14 is formed at the bottom of the mounting groove 11 along the height direction thereof.

[0052] According to the structure described above, the leg 202 of the MOS tube 20 can pass through the mounting hole 14 to abut against the circuit board 50 below the MOS tube bracket 10, and further, preferably, the leg 202 of the MOS tube 20 and the circuit board 50 can be connected by welding.

[0053] Further, preferably, the number of the mounting vias 14 can be multiple, which is specifically designed according to the number of the legs 202 of the MOS tube 20 .

[0054] Further, preferably, the MOS tube 20 includes a rectangular body and the aforementioned legs 202, the legs 202 are arranged on the side of the body, and preferably, the number of the legs 202 can be multiple, of course, not limited to this, the structure of the MOS tube 20 can also be designed according to actual needs.

[0055] In this embodiment, preferably, Figure 1 As shown, there are multiple installation grooves 11 , and a reinforcing rib 4 is connected between any two adjacent installation grooves 11 .

[0056] According to the structure described above, multiple MOS tubes 20 can be installed at the same time by using multiple installation slots 11, which can meet different needs and have a wider application range. Of course, it is not limited to this, and the number of installation slots 11 can also be one.

[0057] In this embodiment, preferably, Figure 1 As shown, any two adjacent mounting grooves 11 are connected via the groove body 3 , and the reinforcing ribs 4 are disposed in the inner hollow of the groove body 3 and connected to the inner side wall and the inner bottom wall of the groove body 3 .

[0058] According to the structure described above, any two adjacent installation grooves 11 are connected through the groove body 3, so that the contact area at the connection is larger and the strength is higher, and reinforcing ribs 4 are added inside the groove body 3 to further improve the overall strength.

[0059] In this embodiment, preferably, Figure 1 As shown, there are multiple arched support parts 2, and the multiple arched support parts 2 are arranged sequentially along a preset direction.

[0060] According to the structure described above, multiple arched support parts 2 are used to jointly support the MOS tube 20 to ensure the supporting effect and ensure that each arched support part 2 is not too wide, thereby ensuring micro-deformation and providing reverse force.

[0061] Of course, the multiple arched support parts 2 are not limited to being arranged sequentially along a preset direction, but can also be arranged randomly according to actual needs.

[0062] In this embodiment, preferably, Figure 1 and Figure 8 As shown, a supporting plane 24 is formed at the top of the arched supporting portion 2 along its height direction.

[0063] According to the structure described above, the support plane 24 cooperates with the bottom plane of the rectangular body of the MOS tube 20 so that the two fit more closely and evenly, which helps to improve the heat dissipation effect.

[0064] In this embodiment, preferably, Figure 1 As shown, the arched support portion 2 includes a first support segment 21, a second support segment 22 and a third support segment 23 connected in sequence, the upper surface of the second support segment 22 is the aforementioned support plane 24, the first support segment 21 and the third support segment 23 are symmetrically and inclined relative to the second support segment 22, and the first support segment 21 and the third support segment 23 are connected to the side of the installation opening 12 through a connecting segment protruding from the side.

[0065] Further, preferably, the first supporting segment 21, the second supporting segment 22 and the third supporting segment 23 are all strip plates.

[0066] Of course, the structure of the arched support portion 2 is not limited to the above, and it can also be a smooth arc-shaped structure with a support plane 24 formed on the top, which is specifically designed according to actual needs.

[0067] In this embodiment, preferably, Figure 3 As shown, a mounting plane 15 is formed at the bottom of the bracket body 1 along the height direction thereof.

[0068] According to the structure described above, it can be known that by using the mounting plane 15 to cooperate with the flat circuit board 50, the two can fit more tightly and evenly, thereby improving the stability of the overall assembly.

[0069] Furthermore, preferably, the mounting plane 15 and the supporting plane 24 are arranged in parallel to meet assembly requirements and facilitate molding. Of course, it is not limited to this. The structures of the mounting plane 15 and the supporting plane 24 are reasonably designed according to the circuit board 50 that matches the mounting plane 15 and the body of the MOS tube 20 that matches the supporting plane 24.

[0070] In this embodiment, preferably, Figure 3 As shown, the bracket body 1 is formed with a snap-on portion 5, and preferably, the outer wall of the bottom of the bracket body 1 along its height direction is formed with a snap-on portion 5, which can be snapped onto the edge of the mounting through hole opened on the circuit board 50, thereby realizing the connection between the bracket body 1 and the circuit board 50.

[0071] Further, preferably, there are multiple buckle parts 5, and they are arranged in a circular ring shape, so that the buckle effect is better. Of course, this is not limited to this, and the number of buckle parts 5 can also be one, which is selected according to actual needs.

[0072] Of course, the buckle portion 5 is not limited to being provided on the outer side wall of the bottom of the bracket body 1 , and the buckle portion 5 may also be provided on the side of the bracket body 1 , depending on actual needs.

[0073] Embodiment 2

[0074] Embodiment 2 of the present application further provides a MOS tube heat dissipation assembly, including the MOS tube bracket described in the above embodiment 1, and thus has all the beneficial technical effects of the MOS tube bracket, and the same technical features and beneficial effects are not repeated.

[0075] In this embodiment, preferably, Figures 4 to 8As shown, the MOS tube heat dissipation assembly also includes a MOS tube 20, a heat sink 30 and a fastening member 40; wherein, the MOS tube bracket 10 is mounted on the circuit board 50, the MOS tube 20 is mounted on the top of the arched support portion 2 of the MOS tube bracket 10, the heat sink 30 is mounted on the top of the MOS tube 20, and is locked to the MOS tube bracket 10 by a fastening member 40 such as a bolt or a screw, and preferably, the fastening member 40 can also connect the MOS tube 20, the MOS tube bracket 10 and the circuit board 50 together, of course, not limited to this.

[0076] According to the structure described above, the MOS tube 20 is installed on the circuit board 50 through the MOS tube bracket 10, and the MOS tube 20 can be specifically installed on the arched support part 2 on the MOS tube bracket 10, and the arched support part 2 can produce a slight elastic deformation, thereby generating a reaction force, so that the MOS tube 20 fits more closely with the heat sink 30 on its top, thereby improving the heat dissipation effect.

[0077] Moreover, preferably, the main body 201 of the MOS tube 20 can be installed in the installation groove 11, and the side wall of the installation groove 11 serves to limit the heat sink 30 on the top of the MOS tube 20 to avoid excessive squeezing of the MOS tube 20 and causing damage. In addition, the support leg 202 of the MOS tube bracket 10 can pass through the installation through hole 14 at the bottom of the installation groove 11 to contact the circuit board 50, and preferably, can be connected by welding, so that the structure is more reliable.

[0078] In addition, the heat sink 30 is fixed on the top of the MOS tube 20 and is locked by a fastening member 40 such as a screw or a bolt, so that the overall structure is more stable and firm.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A MOS tube bracket, It is characterized in that include: A bracket body and an arched support portion formed on the bracket body, wherein the arched support portion and the bracket body are an integral plastic part; The arched support portion is exposed from the support body and can be elastically deformed under the action of an external force, so that the arched support portion generates a reverse force on the product supported by the top thereof.

2. The MOS tube bracket according to claim 1, It is characterized in that The bracket body is formed with a mounting groove, and the bottom of the mounting groove along its height direction is formed with a mounting opening, any of the arched support parts is arranged at the mounting opening, and the two ends of any of the arched support parts are respectively connected to the opposite sides of the mounting opening.

3. The MOS tube bracket according to claim 2, It is characterized in that A reinforcing beam is arranged in the region between any two adjacent arched support portions in the installation opening.

4. The MOS tube bracket according to claim 2, It is characterized in that A mounting through hole is formed at the bottom of the mounting groove along the height direction thereof.

5. The MOS tube bracket according to claim 2, It is characterized in that There are multiple installation grooves, and reinforcing ribs are connected between any two adjacent installation grooves.

6. The MOS tube bracket according to claim 5, It is characterized in that Any two adjacent installation grooves are connected via a groove body, the reinforcing ribs are arranged in the inner hollow of the groove body, and the reinforcing ribs are connected to the inner side wall and the inner bottom wall of the groove body.

7. The MOS tube bracket according to claim 1, It is characterized in that The number of the arched support parts is plural.

8. The MOS tube bracket according to claim 7, It is characterized in that The plurality of arched support portions are arranged sequentially along a preset direction.

9. The MOS tube bracket according to claim 1, It is characterized in that A support plane is formed on the top of the arched support portion along its height direction; and / or A mounting plane is formed at the bottom of the bracket body along its height direction; and / or The bracket body is formed with a buckle portion.

10. A MOS tube heat dissipation component, installed on a circuit board, It is characterized in that The MOS tube heat dissipation assembly comprises a MOS tube, a radiator, a fastening member and a MOS tube bracket according to any one of claims 1 to 9; wherein the MOS tube bracket is mounted on the circuit board, the MOS tube is mounted on the top of the arched support portion of the MOS tube bracket, the radiator is mounted on the top of the MOS tube and is locked to the MOS tube bracket by the fastening member.

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