Chip heat dissipation module, electronic equipment and data center
By designing radiators with variable cross-section and equal cross-section structures in electronic devices, the problem of airflow channel blockage is solved, the chip temperature equalization and heat dissipation effect are improved, the noise frequency is reduced, and the equipment performance is improved.
Patent Information
- Application Number
- CN202420580013.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-03-22
AI Technical Summary
The airflow channels in existing electronic equipment are easily blocked by foreign objects such as dust, resulting in unbalanced chip temperature and affecting equipment performance and heat dissipation effect.
Design a chip heat dissipation module, adopting a radiator extending along the airflow direction, including variable cross-sectional structures and equal cross-sectional structures. The cross-sectional surface of the variable cross-sectional structure gradually increases, reduces the end surface area, guides the flow of foreign materials such as dust, and passes through the inclined plane and The smooth convex curved surface structure reduces spoiler and improves the air flow diversion effect.
It effectively reduces the deposition of foreign objects such as dust on the end surface of the radiator, reduces the noise frequency, improves the overall heat dissipation performance and equipment performance, and makes the equipment in an ideal state.
Smart Images
Figure CN222146200U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, in particular to a chip heat dissipation module, electronic equipment and a data center. Background Art
[0002] The chips that are crucial in electronic devices generate a lot of heat during operation. If the heat is not conducted away in time, it will affect the performance and service life of each chip, and even cause the device to freeze, the system to crash, etc. In the prior art, cooling fans are set on the front and rear end walls of the electronic device housing to conduct the heat of each chip on the circuit board through airflow. However, there are many chips with high heat generation on the circuit board, especially in large servers and virtual currency mining machines, which are equipped with a large number of computing chips. These chips are arranged in the airflow channel. The temperature of the airflow is quite different when it flows through each chip, especially near the air inlet and the air outlet, resulting in uneven temperature of each chip, resulting in inconsistent performance even for the same chip, making it difficult for the electronic device to reach an ideal working state.
[0003] In order to make the temperature of each chip even, some electronic devices are equipped with a heat sink with heat dissipation fins just above the heat-generating chip on the circuit board. The heat of each chip can be transferred to the heat sink at the same time through the heat sink, and then the heat is transferred out under the action of the airflow. However, in this way, the airflow will inevitably carry dust and other foreign matter in the entire airflow channel, which can be easily blocked on the windward side of the heat sink when passing through the windward side, causing dust and other foreign matter to accumulate there, blocking the airflow channel, affecting the flow of airflow, and causing the heat on each chip to fail to achieve the ideal heat dissipation effect, thereby affecting the performance of the entire device. Utility Model Content
[0004] Based on the above situation, the main purpose of the utility model is to provide a chip heat dissipation module, electronic equipment and data center to solve the problem of air flow channels being blocked by foreign matter such as dust, and to improve the heat dissipation effect of the circuit board and the entire electronic equipment.
[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:
[0006] A first aspect of the utility model provides a chip heat dissipation module, including a circuit board and a heat sink;
[0007] The circuit board comprises a substrate and a plurality of heat generating chips, one side of the substrate has a chip area, and the plurality of heat generating chips are arranged in the chip area at intervals at least in a first direction;
[0008] The heat sink comprises heat dissipation fins extending along the first direction; the heat sink comprises a variable cross-section structure and a constant cross-section structure sequentially arranged along the first direction, the cross-section of the variable cross-section structure gradually increases along the first direction; the cross-section of the constant cross-section structure remains unchanged along the first direction;
[0009] The heat sink is provided at least on one side of the circuit board where the heat generating chip is arranged, wherein the uniform cross-section structure corresponds to the chip area; and in the first direction, the variable cross-section structure at least partially extends out of the chip area.
[0010] Optionally, an outer side surface of the variable cross-section structure away from the circuit board and the chip area is a smooth convex curved surface.
[0011] Optionally, an outer side surface of the variable cross-section structure away from the circuit board and the chip area is an inclined plane.
[0012] Optionally, the angle between the inclined plane and the substrate is 40° to 50°.
[0013] Optionally, the outer side surface of the variable cross-section structure away from the circuit board and the chip area includes an inclined plane and a smooth convex surface, the inclined plane is connected to the smooth convex surface in the first direction, and the inclined plane is farther away from the uniform cross-section structure than the smooth convex surface.
[0014] Optionally, an outer side surface of the variable cross-section structure away from the circuit board and the chip area is connected to a bottom surface of the heat sink facing the circuit board.
[0015] Optionally, the variable cross-section structure extends into the chip area in the first direction, and the extension size thereof is less than or equal to 1 / 4 of the size of the heat generating chip.
[0016] Optionally, one end of the variable cross-section structure close to the equal cross-section structure is aligned with a first edge of the chip area, the first edge is an edge on the chip area close to the starting end of the variable cross-section structure, and the starting end of the variable cross-section structure is an end of the variable cross-section structure away from the equal cross-section structure.
[0017] Optionally, on a side of the variable cross-section structure away from the uniform cross-section structure, the heat sink is flush with an end surface of the circuit board, and on a side of the uniform cross-section structure away from the variable cross-section structure, the circuit board extends out of the heat sink.
[0018] Optionally, a sealing strip is provided between a portion of the variable cross-section structure extending out of the chip area and the substrate.
[0019] The second aspect of the utility model provides an electronic device, comprising a shell and a chip heat dissipation module as described above, wherein an air flow channel is formed in the shell, the chip heat dissipation module is located in the air flow channel, and the variable cross-section structure is located upstream of the equal cross-section structure on the air flow channel.
[0020] A third aspect of the present invention provides a data center, comprising the electronic equipment described above.
[0021] The chip heat dissipation module of the present invention, on the one hand, by arranging a variable cross-section structure and a constant cross-section structure on the heat sink, and making the variable cross-section structure at least partially extend out of the chip area, thereby reducing the end face area of the heat sink at that location, reducing the obstruction of the end face to dust and other foreign matter when the airflow blows from there to the heat sink, so that dust and other foreign matter can be carried away with the airflow; and because the cross-section of the variable cross-section structure gradually increases, the outer side surface of the variable cross-section structure can also guide the airflow, so that dust and other foreign matter can also flow along the outer side surface of the variable cross-section structure as much as possible, further reducing the possibility of dust and other foreign matter being deposited on the end face of the entire heat sink; at the same time, the heat sink of the variable cross-section structure can also reduce the system impedance, and the airflow reduces the turbulence under the guiding effect of the outer side surface of the variable cross-section structure, so the noise is reduced. Compared with the high-frequency harsh noise generated by the heat sink with all constant cross-section structures, the heat sink of the present invention has reduced turbulence and the noise frequency is also reduced, thereby improving the noise effect of the entire electronic device and enhancing the comfort of human hearing. On the other hand, the utility model enables the variable cross-section structure to at least partially extend outside the chip area, and can also increase the heat dissipation area at the front end while basically not affecting the heat dissipation area above each heat-generating chip, thereby better improving the heat dissipation performance of the entire radiator, and thus making the entire electronic device as ideal as possible.
[0022] Other beneficial effects of the utility model will be explained through the introduction of specific technical features and technical solutions in the specific implementation manner. Through the introduction of these technical features and technical solutions, those skilled in the art should be able to understand the beneficial technical effects brought about by the technical features and technical solutions. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
[0024] Figure 1 A schematic structural diagram of a preferred implementation of a chip heat dissipation module provided by the utility model;
[0025] Figure 2 An exploded view of a preferred embodiment of the chip heat dissipation module provided by the utility model;
[0026] Figure 3A side view of a preferred embodiment of the chip heat dissipation module provided by the utility model;
[0027] Figure 4 for Figure 3 A partial enlarged view at point I in the middle;
[0028] Figure 5 A side view of another preferred embodiment of the chip heat dissipation module provided by the utility model;
[0029] Figure 6 for Figure 5 A partial enlarged view of point II in the middle.
[0030] In the figure:
[0031] 10. Circuit board; 11. Substrate; 111. Chip area; 12. Heat generating chip;
[0032] 20. Radiator; 21. Radiating fins; 22. Variable cross-section structure; 221. Outer side surface; 2211. Starting end; 2212. Ending end; 23. Equal cross-section structure; 24. Heat conducting plate. DETAILED DESCRIPTION
[0033] The present invention is described below based on embodiments, but the present invention is not limited to these embodiments. In the following detailed description of the present invention, some specific details are described in detail. In order to avoid confusing the essence of the present invention, known methods, processes, procedures, and components are not described in detail.
[0034] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.
[0035] Unless the context clearly requires otherwise, throughout the specification and claims, the words "include", "comprising" and similar words should be interpreted in an inclusive sense rather than an exclusive or exhaustive sense; that is, in the sense of "including but not limited to".
[0036] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.
[0037] The utility model provides a chip heat dissipation module, which can be used in electronic equipment, such as a virtual currency mining machine. The utility model also provides an electronic device, including a housing and the chip heat dissipation module, wherein an air flow channel is formed in the housing, the chip heat dissipation module is located in the air flow channel, and the variable cross-section structure is located upstream of the equal cross-section structure.
[0038] like Figure 1-Figure 6 As shown, the chip heat dissipation module includes a circuit board 10 and a heat sink 20 .
[0039] The circuit board 10 includes a substrate 11 and a plurality of heat generating chips 12. A chip area 111 is provided on one side of the substrate 11. Figure 2 As shown, the substrate 11 is divided into a chip area 111 by a dotted line, and a plurality of heating chips 12 are arranged in the chip area 111 at intervals at least in the first direction X. That is to say, the substrate 11 has two opposite surfaces, which are respectively recorded as the first surface and the second surface. The chip area 111 is arranged on the first surface, and the plurality of heating chips 12 are all arranged in the chip area 111, that is, arranged on the same surface of the substrate 11. The plurality of heating chips 12 can be arranged at intervals along the first direction X; or they can be arranged at intervals in the second direction at the same time, that is, the plurality of chips are arranged at the same time along the first direction X and the second direction Y. The heating chips 12 arranged along the first direction X can be recorded as a chip group, and the plurality of chip groups are distributed at intervals in the second direction. Among them, the first direction X is the airflow direction, as shown by the arrow in the figure, and the second direction is perpendicular to the thickness direction Z of the substrate 11 and perpendicular to the first direction X.
[0040] The heat sink 20 includes a heat sink fin 21 extending along a first direction, that is, the heat sink fin 21 extends along the airflow direction. A plurality of heat sink fins 21 may be provided, and the plurality of heat sink fins 21 may be arranged at intervals along a second direction Y. Each heat sink fin 21 extends along the first direction X, so that an airflow channel is formed between two adjacent heat sink fins 21. The heat sink 20 has a variable cross-section structure 22 and a uniform cross-section structure 23 sequentially arranged along the first direction X, such as Figure 2-Figure 6 As shown in the figure, the heat sink 20 is divided into a variable cross-section structure 22 and a constant cross-section structure 23 by a dotted line. The cross section of the variable cross-section structure 22 gradually increases along the first direction X; the cross section of the constant cross-section structure 23 remains unchanged along the first direction X. The variable cross-section structure 22 and the constant cross-section structure 23 can be formed on the heat dissipation fin 21. When the heat sink 20 also includes other structures such as a heat conducting plate 24 (described in detail below), the heat dissipation fin 21 and the heat conducting plate 24 can also form a constant cross-section structure 23 and a variable cross-section structure 23 together with their respective corresponding parts. That is to say, the constant cross-section structure 23 and the variable cross-section structure 22 are relative to the entire heat sink 20, which is to limit the heat sink 20 along the first direction X. The cross-section of the variable cross-section structure 22 gradually increases, so that its outer side surface 221 (that is, the outer surface away from the heat conducting plate 24 and the chip area 111) forms a guide surface, and the outer side surface 221 is also the windward side of the heat sink 20, specifically, the surface of the variable cross-section structure 22 away from the circuit board 10 and facing the air inlet direction.
[0041] A heat sink 20 is provided at least on one side of the circuit board 10 where the heat generating chip 12 is arranged, that is, the heat sink 20 can be provided only on the side where the first surface of the substrate 11 is located, or the heat sink 20 can be provided on the first surface and the second surface of the substrate 11. When the circuit board 10 and the heat sink 20 are assembled together, the uniform cross-sectional structure 23 corresponds to the chip area 111; in the first direction X, the variable cross-sectional structure 22 at least partially extends out of the chip area 111, that is, the uniform cross-sectional structure 23 is opposite to the chip area 111, and the variable cross-sectional structure 22 can be close to the uniform cross-sectional structure 23. The part is opposite to the chip area 111, and the rest of the part extends out of the chip area 111; or the variable cross-sectional structure 22 can extend all of the chip area 111, that is, there is a distance between the chip area 111 and the end face of the variable cross-sectional structure 22 away from the uniform cross-sectional structure 23. It can be understood that when projected in the thickness direction of the substrate 11, the projection of the variable cross-sectional structure 22 extends out of the chip area 111 in the first direction X, that is, the variable cross-sectional structure 22 is at least partially located upstream of the chip area 111. It should be noted that the above cross section refers to a cross section perpendicular to the first direction X.
[0042] The chip heat dissipation module of the utility model, on the one hand, is provided with a variable cross-section structure 22 and a uniform cross-section structure 23 on the heat sink 20, and the variable cross-section structure 22 is made to at least partially extend out of the chip area 111, that is, to extend out of the chip area 111 on a side close to the air inlet of the electronic device (described in detail below). When the chip heat dissipation module is installed in the electronic device, the airflow in the electronic device flows along the first direction X. When it just contacts the heat sink 20, since the end face area of the heat sink 20 at this place is reduced, it can reduce the obstruction of the end face to foreign matter such as dust when the airflow blows from there to the heat sink 20, so that foreign matter such as dust can continue to flow with the airflow and be taken away. And because the cross section of the variable cross-section structure 22 gradually increases, the outer side surface 221 of the variable cross-section structure 22 can also guide the airflow, that is, the outer side surface 221 forms a guide surface, so that dust and other foreign matter can also flow along the outer side surface 221 of the variable cross-section structure 22 as much as possible, further reducing the possibility of dust and other foreign matter being deposited on the end surface of the entire radiator 20; at the same time, the radiator of the variable cross-section structure 22 can also reduce the system impedance, and the airflow reduces the turbulence under the guiding effect of the outer side surface 221 of the variable cross-section structure 22, so the noise is reduced. Compared with the high-frequency harsh noise generated by the radiator of the entire equal cross-section structure, the radiator of the utility model has reduced turbulence and the noise frequency is also reduced, thereby improving the noise effect of the entire electronic device and improving the comfort of human hearing. On the other hand, the utility model makes the variable cross-section structure 22 at least partially extend out of the chip area 111, and can also increase the heat dissipation area of the front end while basically not affecting the heat dissipation area above each heat-generating chip 12, thereby better improving the heat dissipation performance of the entire radiator 20, and then making the entire electronic device as ideal as possible.
[0043] It can be understood that the electronic device includes a shell (not shown in the figure), and an air inlet and an air outlet are arranged on two end faces of the shell. Fans are arranged at the air inlet and the air outlet to form an air flow channel through the air inlet, the shell cavity and the air outlet. The chip heat dissipation module is installed in the shell, and the variable cross-section structure 22 is closer to the air inlet of the shell than the equal cross-section structure 23, so that in the air flow channel, the variable cross-section structure 22 is located upstream of the equal cross-section structure 23.
[0044] It is understandable that other components, such as other chips, traces, interface terminals, etc., are also disposed on the substrate 11 . These components may be disposed in the chip area 111 , or may not be disposed in the chip area 111 .
[0045] Specifically, in the variable cross-section structure 22, along the second direction Y, the heat dissipation fins 21 may be a triangular structure, a trapezoidal structure, or a structure including a curved surface; in the uniform cross-section structure 23, the heat dissipation fins 21 are generally rectangular structures. It can be understood that the heat sink 20 may include a heat conducting plate 24 in addition to the heat dissipation fins 21. The heat dissipation fins 21 may be connected to the same side of the heat conducting plate 24, and the other side of the heat conducting plate 24 faces the circuit board 10, and may be specifically attached to the multiple heat generating chips 121 on the circuit board 10 to conduct the heat from the heat generating chips 121 as quickly as possible.
[0046] Specifically, the outer side surface 221 of the variable cross-section structure 22 can be a convex curved surface, or an inclined plane, or include both a convex curved surface and an inclined plane. When the outer side surface is a curved surface, it can be a convex curved surface in the first direction X, or multiple sections of convex curved surfaces, that is, two adjacent sections of convex curved surfaces are connected; when the outer side surface is an inclined plane, it can be a section of inclined plane in the first direction X, or multiple sections of inclined planes; when the outer side surface 221 includes a curved surface and an inclined plane, it can include only one section of a convex curved surface and one section of an inclined plane, or it can include multiple sections of convex curved surfaces and multiple sections of inclined planes. All convex curved surfaces can be upstream of all inclined planes, or all convex curved surfaces can be downstream of all inclined planes, or multiple sections of convex curved surfaces and multiple sections of inclined planes can be distributed at intervals. Among them, the convex curved surface refers to a curved surface that protrudes as a whole toward the side away from the substrate 11, such as an arc surface, which can be a circular arc surface, an elliptical arc surface, etc., that is, in the projection along the second direction, the outer side surface 221 forms an arc, such as Figure 5 , Figure 6 As shown, it forms an arc line.
[0047] In one embodiment, the outer side surface 221 of the variable cross-section structure 22 away from the circuit board 10 and the chip area 111 is a smooth convex curved surface, such as Figure 5 , Figure 6As shown, the entire outer side surface 221 of the variable cross-section structure 22 is smoothly transitioned and is an entire convex surface. For example, the entire outer side surface is an arc surface or an elliptical arc surface, etc. In this way, by setting a smooth convex surface, the resistance of the outer side surface 221 to the airflow can be further reduced, and the guiding effect of the entire outer side surface 221 on the airflow can be increased, thereby improving the guidance of foreign matter such as dust, so that foreign matter such as dust can basically be blown out of the entire radiator 20 with the airflow, and then blown out of the shell.
[0048] In another embodiment, the outer side surface 221 of the variable cross-section structure 22 away from the circuit board 10 and the chip area 111 is an inclined plane. Figure 3 , Figure 4 As shown, the entire outer side surface 221 of the variable cross-section structure 22 is smoothly transitioned and is an entire inclined plane, and the terminal end close to the equal cross-section structure 23 is farther away from the substrate 11 than the other end, and the inclined plane forms an acute angle with the substrate 11. The use of this inclined plane structure makes the entire radiator 20 easier to process, and the accuracy of the outer side surface 221 of the entire variable cross-section structure 22 is easy to ensure, and the surface finish is better, thereby enhancing the guiding effect on the airflow and the guiding effect on foreign matter such as dust. Further, the angle is 30° to 60°, such as 30°, 35°, 40°, 42°, 45°, 48°, 50°, 55° or 60°, etc. Preferably, the angle is 40° to 50°, and more preferably, the angle is 45°. By selecting the angle setting in this range, it can be avoided that the angle is too large to block foreign matter such as dust, which is not conducive to blowing away, and it can also be avoided that the angle is too small to cause the heat dissipation area to increase limitedly, affecting the heat dissipation effect.
[0049] In another embodiment, the outer side surface 221 of the variable-section structure 22 away from the circuit board 10 and the chip area 111 includes an inclined plane and a smooth convex surface connected in the first direction X, and the inclined plane is farther away from the equal-section structure 23 than the smooth convex surface. That is to say, the outer side surface 221 includes both an inclined plane and a smooth convex surface, the inclined plane is connected to the smooth convex surface in the first direction X, and the inclined plane is located upstream of the smooth convex surface. In this way, when the airflow contacts the heat sink 20, it first passes through the inclined plane and then passes through the smooth convex surface, so that foreign matter such as dust can basically move upward and backward along the inclined plane when approaching the end face of the heat sink 20, thereby better blowing foreign matter such as dust out of the entire heat sink 20.
[0050] It should be noted that no matter which of the above structures is adopted for the outer side surface, the outer side surface 221 of the variable cross-section structure 22 away from the circuit board 10 can be smoothly transitioned, that is, the entire outer side surface 221 of the variable cross-section structure 22 is a smooth surface. Furthermore, the outer side surface 221 of the entire variable cross-section structure 22 and the outer side surface of the uniform cross-section structure 23 away from the circuit board 10 also have a smooth transition, that is, the terminal end of the variable cross-section structure 22 (that is, the end connected to the uniform cross-section structure 23) and the uniform cross-section structure 23 are flush on the side of the heat sink 20 away from the substrate 11.
[0051] The outer side surface 221 of the variable cross-section structure 22 away from the circuit board 10 and the chip area 111 is connected to the bottom surface of the heat sink 20 facing the circuit board 10. That is to say, if along the airflow direction, the end of the outer side surface 221 of the variable cross-section structure 22 located upstream is recorded as the starting end 2211, and the end located downstream is recorded as the ending end 2212, then the starting end 2211 of the outer side surface 221 is located near the side of the heat sink 20 facing the circuit board 10 (that is, the side is the bottom surface), as shown in FIG. Figure 5 , Figure 6 As shown, the starting end 2211 is basically located on the bottom surface of the heat sink 20. For example, when the outer side surface 221 is an arc surface, the variable cross-section structure 22 is basically the circumferential portion of the cylinder; for example, when the outer side surface 221 is an inclined plane, the variable cross-section structure 22 is basically a triangular prism structure. Of course, in actual processing, the outer side surface 221 of the variable cross-section structure 22 and the bottom surface of the heat sink 20 can be rounded, and this solution is also included in the protection scope of the present utility model. In another embodiment, the starting end 2211 of the outer side surface 221 is located at the junction of the heat sink fin 21 and the heat conducting plate 24, such as Figure 3 , Figure 4 shown.
[0052] Continue to refer Figure 3 and Figure 4In one embodiment, in the first direction X, the dimension of the variable cross-section structure 22 extending into the chip area 111 is smaller than 1 / 4 of the dimension of the heating chip 121. That is to say, in this embodiment, looking along the thickness direction of the substrate 11, the variable cross-section structure 22 and the chip area 111 have an overlapping area at most at the first heating chip 121, and the dimension of the overlapping area in the first direction X is smaller than or equal to 1 / 4 of the dimension of the heating chip 121 in the first direction X, that is, the dimension d in the figure is smaller than or equal to 1 / 4 of the dimension D of the heating chip 121, such as d is equal to 0.25D, 0.2D, 0.1D, 0.05D or smaller, such as d is directly 0, that is, the termination end 2212 of the outer side surface 221 of the variable cross-section structure 22 is flush with the first edge of the first heating chip 121, and there is even a distance between the termination end 2212 of the outer side surface 221 of the variable cross-section structure 22 and the first heating chip 121, that is, the variable cross-section structure 22 is located on the upstream side of the chip area 111. By setting the relative positions of the variable cross-section structure 22 and the first heating chip 121, the possibility of dust and other foreign matter being deposited on the end surface of the radiator 20 can be reduced, and the heat dissipation area of the entire radiator 20 can be increased. At the same time, the temperature of each heating chip 121 along the first direction X can be balanced, so that the temperature of each heating chip 121 in the first direction X is basically the same, especially the temperature difference between the heating chips 121 located at the most upstream and the most downstream is reduced as much as possible, thereby better improving the performance of the entire circuit board 10 and making the life of each heating chip 121 as consistent as possible. Among them, the first heating chip 121 in the chip area 111 is the upstreammost heating chip 121 in the chip area 111 along the airflow direction, and the first edge refers to the upstream edge of the heating chip 121, that is, the edge of the heating chip 121 close to the starting end 2211 of the variable cross-section structure.
[0053] Preferably, if Figure 5 , Figure 6 As shown, one end of the variable cross-section structure 22 close to the equal cross-section structure 23 is aligned with the first edge of the chip area 111, that is, the terminal end 2212 of the outer side surface 221 of the variable cross-section structure 22 is aligned with the first edge of the first (the first row when multiple chip groups are arranged in the second direction) heating chip 121 in the chip area 111. With this structure, the temperature of each heating chip 121 in the first direction X can be better balanced, so that the temperature of each heating chip 121 is as balanced as possible.
[0054] In the above embodiments, on the side of the variable cross-section structure 22 away from the uniform cross-section structure 23, that is, on the side of the starting end 2211, the heat sink 20 is flush with the end surface of the circuit board 10, specifically flush with the substrate 11 of the circuit board, that is, on the upstream side of the entire chip heat dissipation module, the substrate 11 also includes an extension area in the first direction X, and the extension area can be used for the arrangement of other devices on the substrate 11, such as the wiring of the circuit board 10, so as to facilitate the spatial arrangement of the entire circuit board 10. On the side of the uniform cross-section structure 23 away from the variable cross-section structure 22, the circuit board 10 extends out of the heat sink 20, specifically the substrate 11 extends out of the heat sink 20, that is, on the downstream side of the entire chip heat dissipation module, the substrate 11 extends out of the heat sink 20, so that part of the structure of the substrate 11 is exposed to the entire chip heat dissipation module, thereby facilitating the arrangement of lines on the circuit board 10, as well as the setting of interfaces, etc. The circuit board 10 can also be connected to other devices or modules through the exposed area. In summary, by aligning the heat sink 20 with the circuit board 10 on the upstream side and extending the circuit board on the downstream side out of the heat sink 20, the resistance of the upstream side to the airflow can be reduced as much as possible, so that the airflow can flow along the channels between the heat sink fins 21 and the outer side of the variable cross-section structure 22 as much as possible, thereby allowing dust and other foreign matter to be better blown out of the entire chip heat dissipation module, and the structure of the entire integrated unit is more compact and regular, which is convenient for the arrangement of the integrated unit in the entire electronic device space, and can also facilitate the connection of the circuit board 10 with other components. Of course, in the second direction, the circuit board 10 can also partially extend out of the heat sink 20 or all of the heat sink 20 for connection with other components or modules of the electronic device.
[0055] Furthermore, in order to prevent dust and other foreign matter from being deposited on the circuit board 10, especially near the heat-generating chip 121, a sealing strip (not shown in the figure) is arranged between the part of the variable-section structure 22 (that is, the heat sink 20) extending out of the chip area 111 and the substrate 11. In other words, the chip heat dissipation module of the present invention also includes a sealing strip.
[0056] The utility model also provides a data center, including the electronic device described in any of the above embodiments, which may include only one electronic device, or may include two or more electronic devices.
[0057] Those skilled in the art will appreciate that, without conflict, the above-mentioned preferred solutions can be freely combined and superimposed.
[0058] It should be understood that the above-mentioned embodiments are merely illustrative and not restrictive. Without departing from the basic principles of the present invention, various obvious or equivalent modifications or substitutions that can be made by technicians in this field to the above details will be included in the scope of the claims of the present invention.
Claims
1. A chip heat dissipation module, characterized in that: Including circuit board and heat sink; The circuit board comprises a substrate and a plurality of heat generating chips, one side of the substrate has a chip area, and the plurality of heat generating chips are arranged in the chip area at intervals at least in a first direction; The heat sink comprises heat dissipation fins extending along the first direction; the heat sink comprises a variable cross-section structure and a constant cross-section structure sequentially arranged along the first direction, the cross-section of the variable cross-section structure gradually increases along the first direction; the cross-section of the constant cross-section structure remains unchanged along the first direction; The heat sink is provided at least on one side of the circuit board where the heat generating chip is arranged, wherein the uniform cross-section structure corresponds to the chip area; and in the first direction, the variable cross-section structure at least partially extends out of the chip area.
2. The chip heat dissipation module according to claim 1, characterized in that: The outer side surface of the variable cross-section structure away from the circuit board and the chip area is a smooth convex curved surface.
3. The chip heat dissipation module according to claim 1, characterized in that: The outer side surface of the variable cross-section structure away from the circuit board and the chip area is an inclined plane.
4. The chip heat dissipation module according to claim 3, characterized in that: The included angle between the inclined plane and the substrate is 40° to 50°.
5. The chip heat dissipation module according to claim 1, characterized in that: The outer side surface of the variable cross-section structure away from the circuit board and the chip area includes an inclined plane and a smooth convex surface, the inclined plane is connected to the smooth convex surface in the first direction, and the inclined plane is farther away from the uniform cross-section structure than the smooth convex surface.
6. The chip heat dissipation module according to claim 1, characterized in that: The outer side surface of the variable cross-section structure away from the circuit board and the chip area is connected to the bottom surface of the heat sink facing the circuit board.
7. The chip heat dissipation module according to claim 1, characterized in that: In the first direction, the variable cross-section structure extends into the chip area, and the extension size thereof is less than or equal to 1 / 4 of the size of the heat generating chip.
8. The chip heat dissipation module according to claim 1, characterized in that: One end of the variable cross-section structure close to the equal cross-section structure is aligned with the first edge of the chip area, the first edge is the edge of the chip area close to the starting end of the variable cross-section structure, and the starting end of the variable cross-section structure is the end of the variable cross-section structure away from the equal cross-section structure.
9. The chip heat dissipation module according to any one of claims 1 to 8, characterized in that: On a side of the variable cross-section structure away from the uniform cross-section structure, the heat sink is flush with an end surface of the circuit board, and on a side of the uniform cross-section structure away from the variable cross-section structure, the circuit board extends out of the heat sink.
10. The chip heat dissipation module according to claim 9, characterized in that: A sealing strip is arranged between the portion of the variable cross-section structure extending out of the chip area and the substrate.
11. An electronic device, characterized in that: It comprises a shell and the chip heat dissipation module according to any one of claims 1 to 10, wherein an air flow channel is formed in the shell, the chip heat dissipation module is located in the air flow channel, and the variable cross-section structure is located upstream of the equal cross-section structure on the air flow channel.
12. A data center, characterized in that: The electronic device comprising claim 11.