Power module, circuit system and vehicle

Abstract

The utility model discloses a power module, a circuit system and a vehicle, and the power module comprises a substrate, at least one surface of the substrate is provided with a conductive layer, and the conductive layer comprises a plurality of conductive regions which are arranged at intervals; the plurality of power chips are respectively arranged in the plurality of conductive regions, and the power chips comprise at least one first chip, at least one second chip, at least one third chip and at least one fourth chip; the first chip is electrically connected with a first conductive region in the plurality of conductive regions to form a first circuit; the second chip is electrically connected with a second conductive region in the plurality of conductive regions to form a second circuit; the third chip is electrically connected with a third conductive region in the plurality of conductive regions to form a third circuit, and the third circuit is used for supplying power to the high-voltage electric equipment; and the fourth chip is electrically connected with a fourth conductive region in the plurality of conductive regions to form a fourth circuit, and the fourth circuit is used for supplying power to the low-voltage electric equipment.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a power module, a circuit system and a vehicle. Background Art

[0002] Under the guidance of the green development concept of energy conservation and emission reduction, new energy electric vehicles have been favored by the majority of car owners for their low cost, convenient travel and low-carbon environmental protection. With the vigorous development of the electric vehicle industry, on-board electronic equipment is showing a trend of miniaturization, integration and high power density. In particular, the on-board charger (OBC) and DC-DC converter (DC / DC converter), as two independent control unit modules, occupy more space in the vehicle and have higher cost.

[0003] In the related art, multiple discrete semiconductor devices are fixed on a fixed bracket, and the multiple discrete semiconductor devices are respectively connected to the circuit board, and then the assembled structure is installed in a housing, thereby forming an integrated functional module of the vehicle-mounted OBC and DC / DC converter. However, with this integrated structure, since there are many wirings on the circuit board when multiple discrete devices are connected to the circuit board, the stray inductance of the entire functional module is increased, and the volume of the functional module is large, occupying the internal space of the vehicle. Utility Model Content

[0004] The present application aims to provide a power module, a circuit system and a vehicle, which at least solve the problem that the integrated functional modules of the vehicle-mounted OBC and DC / DC converter in the related art have large stray inductance and occupy the internal space of the vehicle.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a power module, including:

[0007] A substrate, at least one side of which is provided with a conductive layer, wherein the conductive layer includes a plurality of conductive areas arranged at intervals;

[0008] A plurality of power chips, wherein the plurality of power chips are respectively arranged in the plurality of conductive areas, and the power chips include: at least one first chip, at least one second chip, at least one third chip and at least one fourth chip;

[0009] The first chip is electrically connected to a first conductive area of ​​the plurality of conductive areas to form a first circuit, and the first circuit is used to connect to an external power source;

[0010] The second chip is electrically connected to a second conductive area among the plurality of conductive areas to form a second circuit, one end of the second circuit is electrically connected to the first circuit, and the other end of the second circuit is used to be electrically connected to the first transformer;

[0011] The third chip is electrically connected to a third conductive area among the plurality of conductive areas to form a third circuit, one end of the third circuit is used to be electrically connected to the first transformer, and the other end of the third circuit is used to be electrically connected to a high-voltage electrical device and a second transformer;

[0012] The fourth chip is electrically connected to a fourth conductive area among the plurality of conductive areas to form a fourth circuit, one end of the fourth circuit is electrically connected to the second transformer, and the other end of the fourth circuit is electrically connected to a low-voltage electrical device.

[0013] Optionally, the third conductive region includes a first sub-conductive region and a second sub-conductive region that are spaced apart, and the third chip includes at least one first sub-chip and at least one second sub-chip;

[0014] The first sub-chip is electrically connected to the first sub-conductive area to form a first sub-circuit, the second sub-chip is electrically connected to the second sub-conductive area to form a second sub-circuit, and the first sub-circuit is electrically connected to the second sub-circuit to form the third circuit;

[0015] The first sub-circuit is used to be electrically connected to the first transformer, and the second sub-circuit is used to be electrically connected to the second transformer; the first sub-circuit is also used to be electrically connected to the high-voltage electrical equipment.

[0016] Optionally, the substrate has a first direction and a second direction intersecting each other, the first conductive region and the fourth conductive region are arranged on one side of the substrate along the first direction, and the second conductive region and the third conductive region are arranged on the other side of the substrate along the first direction; the first conductive region and the fourth conductive region are arranged at intervals along the second direction, and the second conductive region and the third conductive region are arranged at intervals along the second direction.

[0017] Optionally, each of the conductive areas includes a plurality of plates arranged at intervals, each of the power chips is arranged on a corresponding plate, and each pole of each of the power chips is electrically connected to the corresponding plate by bonding wires or welding.

[0018] Optionally, the plurality of plates include a first plate, a second plate and a third plate, and each of the power chips includes a first electrode, a second electrode and a control electrode;

[0019] The power chip is arranged on the first plate, the first electrode is electrically connected to the first plate where the power chip is located, the second electrode is electrically connected to the second plate, and the control electrode is electrically connected to the third plate.

[0020] Optionally, in the first conductive area, the first plate extends along the first direction, the second plate is arranged on both sides of the first plate along the second direction, the third plate is also arranged on both sides of the first plate along the second direction, and the second plate is spaced apart from the third plate.

[0021] Optionally, there are multiple first chips, and at least one of the multiple first chips is arranged in the first plate; the first pole of the first chip is electrically connected to the first plate, the second pole of the first chip is electrically connected to the corresponding second plate, and the control pole of the first chip is electrically connected to the corresponding third plate.

[0022] Optionally, in the second conductive area, the first plate extends along the first direction, the second plate is arranged on both sides of the first plate along the second direction, the third plate is also arranged on both sides of the first plate along the second direction, and the second plate is spaced apart from the third plate.

[0023] Optionally, there are multiple second chips, and at least one of the multiple second chips is arranged in the first plate; the first pole of the second chip is electrically connected to the first plate, the second pole of the second chip is electrically connected to the corresponding second plate, and the control pole of the second chip is electrically connected to the corresponding third plate.

[0024] Optionally, in the third conductive area, the first plate extends along the first direction, and the second plate and the third plate are at least partially arranged around the circumferential outer side of the first plate.

[0025] Optionally, the third chip is provided in plurality, and at least one of the plurality of the third chips is provided in the first plate; the first pole of the third chip is electrically connected to the first plate, the second pole of the third chip is electrically connected to the corresponding second plate, and the control pole of the third chip is electrically connected to the corresponding third plate.

[0026] Optionally, in the fourth conductive area, the first plate, the second plate and the third plate all extend along the second direction, the second plate is arranged on both sides of the first plate in the first direction, the third plate is also arranged on both sides of the first plate along the first direction, and the second plate and the third plate are spaced apart.

[0027] Optionally, the fourth chip is provided in plurality, and the plurality of the fourth chips are arranged on the first plate at intervals along the second direction; the first pole of the fourth chip is electrically connected to the first plate, the second pole of the fourth chip is electrically connected to the corresponding second plate, and the control pole of the fourth chip is electrically connected to the corresponding third plate.

[0028] Optionally, the power module further includes a plurality of connection terminals, which are sequentially arranged on the first plate, the second plate and the third plate, and the connection terminals are used to electrically connect the corresponding plates with external circuits or electrical components.

[0029] Optionally, the connection terminal includes a power terminal and a signal terminal;

[0030] The first plate is provided with the power terminal, and the power terminal is used to connect the first plate to an external power source or an electrical component;

[0031] The signal terminals are disposed on the second plate and the third plate, and the signal terminals are used to connect the second plate and / or the third plate to an external driving circuit.

[0032] Optionally, the power terminal includes a first power terminal and a second power terminal, the current carried by the first power terminal is greater than the current carried by the second power terminal, the first power terminal is arranged in the fourth conductive area, and the second power terminal is arranged in the remaining conductive areas of the multiple conductive areas.

[0033] Optionally, the substrate includes a copper-clad ceramic substrate or an aluminum-clad ceramic substrate.

[0034] In a second aspect, an embodiment of the present application provides a circuit system, comprising: a first transformer, a second transformer, and any of the power modules described above;

[0035] The output end of the second circuit is electrically connected to the primary side of the first transformer, the input end of the third circuit is electrically connected to the secondary side of the first transformer, the output end of the third circuit is electrically connected to the primary side of the second transformer, and the input end of the fourth circuit is electrically connected to the secondary side of the second transformer.

[0036] In a third aspect, an embodiment of the present application proposes a vehicle, comprising the above-mentioned circuit system.

[0037] In the embodiment of the present application, multiple spaced conductive areas are provided on the substrate, and in each conductive area, multiple power chips are connected to the conductive layer in the conductive area to form a corresponding circuit, thereby realizing deep integration of the on-board charger circuit and the DC converter circuit. In this way, the power module can directly realize energy transmission with the external power supply, high-voltage electrical equipment and low-voltage electrical equipment, which can better meet the requirements of the whole vehicle layout for miniaturization and lightweight of on-board devices, and can reduce stray inductance, so that when the power module is used in the vehicle, the vehicle's endurance can be improved, the vehicle's power consumption can be reduced, and the user's experience can be improved.

[0038] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0040] Figure 1 is a schematic diagram of a power module according to an embodiment of the present application;

[0041] Figure 2 is a cross-sectional view of a power module along its thickness direction according to an embodiment of the present application;

[0042] Figure 3 It is a schematic diagram of the structure of a discrete device in the related art;

[0043] Figure 4 It is a schematic diagram of the connection between a discrete device and a fixed bracket in the related art;

[0044] Figure 5 is one of the schematic diagrams of the layout of the power chip on the power module according to the embodiment of the present application;

[0045] Figure 6 This is a second schematic diagram of the layout of the power chip on the power module according to an embodiment of the present application;

[0046] Figure 7 is a schematic diagram of the layout of power chips and terminals on a power module according to an embodiment of the present application;

[0047] Figure 8 is a circuit topology diagram corresponding to the circuit system according to an embodiment of the present application;

[0048] Fig. 9 It is a schematic diagram of the layout of each section in the power module according to an embodiment of the present application.

[0049] Reference numerals:

[0050] 100: substrate; 110: conductive layer; 121: first conductive region; 122: second conductive region; 123: third conductive region; 123a: first sub-conductive region; 123b: second sub-conductive region; 124: fourth conductive region; 200: power chip; 210: first chip; 220: second chip; 230: third chip; 231: first sub-chip; 232: second sub-chip; 240: fourth chip; 130: plate; 131: first plate; 132: second plate; 133: third plate; 300: connection terminal; 310: power terminal; 311: first power terminal; 312: second power terminal; 320: signal terminal; 400: bonding wire; X: first direction; Y: second direction. DETAILED DESCRIPTION

[0051] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0052] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0053] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0054] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0055] The power module and vehicle provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0056] like Figure 1 and Figure 2 As shown, a power module according to some embodiments of the present application includes: a substrate 100, at least one side of the substrate 100 is provided with a conductive layer 110, the conductive layer 110 includes a plurality of conductive areas arranged at intervals; a plurality of power chips 200, the plurality of power chips 200 are respectively arranged in the plurality of conductive areas, the power chips 200 include: at least one first chip 210, at least one second chip 220, at least one third chip 230 and at least one fourth chip 240; the first chip 210 is electrically connected to a first conductive area 121 of the plurality of conductive areas to form a first circuit, the first circuit is used to be connected to an external power source; the second chip 220 is electrically connected to the plurality of conductive areas The second conductive area 122 in the electrical area is electrically connected to form a second circuit, one end of the second circuit is electrically connected to the first circuit, and the other end of the second circuit is used to be electrically connected to the first transformer; the third chip 230 is electrically connected to the third conductive area 123 in the multiple conductive areas to form a third circuit, one end of the third circuit is used to be electrically connected to the first transformer, and the other end of the third circuit is used to be electrically connected to the high-voltage electrical equipment and the second transformer; the fourth chip 240 is electrically connected to the fourth conductive area 124 in the multiple conductive areas to form a fourth circuit, one end of the fourth circuit is used to be electrically connected to the second transformer, and the other end of the fourth circuit is used to be electrically connected to the low-voltage electrical equipment.

[0057] The power chip 200 in the embodiment of the present application is provided with a plurality of spaced conductive areas on the substrate 100. In each conductive area, at least one power chip 200 is connected to the conductive layer 110 in the conductive area to form a corresponding circuit, thereby realizing deep integration of the on-board charger circuit and the DC converter circuit. In this way, the power module can directly realize energy transmission with an external power supply, high-voltage electrical equipment, and low-voltage electrical equipment, which can better meet the requirements of the whole vehicle layout for miniaturization and lightweight of on-board devices, and can reduce stray inductance, so that when the power module is used in a vehicle, the charging efficiency of the vehicle can be improved, the power consumption of the whole vehicle can be reduced, and the user experience can be improved.

[0058] Specifically, Figure 8 As shown, the power module in the embodiment of the present application can be used to form Figure 8 As shown in the circuit diagram, Q1 to Q22 are all power chips 200. A plurality of power chips 200 are integrated with a conductive layer 110 on a substrate 100 to form a corresponding circuit module on the substrate 100. When in use, it is only necessary to connect each circuit module in the power module of the present application to an external power supply, an external drive circuit, and electrical components, etc., to complete the assembly of the entire integrated OBC and DC / DC circuit. The operation is simple and convenient, and the volume of the power module is reduced, which is conducive to miniaturization and lightweight.

[0059] Among them, the voltage required by the high-voltage electrical equipment in this application is higher than the voltage required by the low-voltage electrical equipment. Exemplarily, the high-voltage electrical equipment can be a vehicle-mounted power battery, and the low-voltage electrical equipment can be an electrical component in the vehicle. Of course, the specific types of high-voltage electrical equipment and low-voltage electrical equipment can be selected according to the actual application scenario, and this application does not limit this.

[0060] It is understandable that if Figure 3 and Figure 4 As shown, Figure 3 FIG. 1 shows a schematic diagram of the structure of a discrete device in the related art. Figure 4 The figure shows a connection diagram of discrete devices and a fixing bracket in the related art. In the related art, in order to realize the integration of the on-board charger OBC and the DC / DC converter, multiple discrete devices are fixedly installed on the fixing bracket at the same time, and then the multiple discrete devices are connected to the circuit board at the same time, and then the assembled discrete devices, the fixing bracket and the circuit board are installed in the housing together to form an integrated functional module with OBC and DC / DC functions.

[0061] However, although the integrated functional module in the related art has achieved the integration effect of the on-board charger OBC and the DC / DC converter to a certain extent, it requires the use of multiple discrete devices, which has a high production cost. In addition, when connecting multiple discrete devices to the circuit board, it is necessary to arrange more wiring on the circuit board, which increases the stray inductance of the entire functional module. In addition, the integrated functional module in the related art is still large in size and occupies the internal space of the vehicle when used in the vehicle.

[0062] The power module in the embodiment of the present application adopts the method of integrating the power chip 200 with the metal-clad substrate 100. First, multiple power chips 200 are integrated in different conductive areas on the substrate 100 provided with the conductive layer 110, and then multiple circuit modules are formed on the substrate 100. When in use, it is only necessary to connect each circuit module in the power module with an external circuit or electrical component to obtain an integrated circuit of the on-board charger OBC and the DC / DC converter. In this way, it can avoid the increase of stray inductance caused by too much wiring during the circuit assembly process, and save the space occupied by the power module, which can better meet the needs of miniaturization and lightweight.

[0063] Specifically, Figure 1 and Figure 2 As shown, the substrate 100 in the present application is an insulating material plate, and a metal conductive layer 110 is provided on at least one side surface of the substrate 100. The metal conductive layer 110 can be divided into a plurality of conductive areas arranged at intervals. At least one power chip 200 is provided in each conductive area, so that the power chip 200 is electrically connected to the conductive layer 110 of the corresponding conductive area to form a corresponding circuit module.

[0064] In some embodiments, the substrate 100 may be a ceramic substrate or an aluminum-clad ceramic substrate, thereby ensuring that the substrate 100 has good thermal conductivity, insulation and mechanical properties to meet the use requirements of different scenarios. Of course, the substrate 100 in the present application may also be other types of metal-clad substrates 100, without limitation.

[0065] It is understandable that the substrate 100 and the conductive layer 110 can adopt a split structure, and the conductive layer 110 can be made of a metal-clad plate. The metal layer on the surface of the metal-clad plate is processed to form multiple conductive areas, and then the metal-clad plate with multiple conductive areas is connected and fixed to the substrate 100.

[0066] Alternatively, the substrate 100 and the conductive layer 110 may also be of an integrated structure, and a metal-clad substrate having a metal layer formed on at least one side surface is selected, and the metal layer on the surface of the metal-clad substrate is processed to form a conductive layer 110 having multiple conductive areas. Optionally, the power chip 200 in the present application is a transistor chip. Specifically, the power chip 200 may be selected from one or a combination of MOS chips and IGBT chips, wherein the MOS chip may include a silicon MOS chip or a silicon carbide MOS chip, etc. By setting the power chip 200, the use requirements of high power and high efficiency can be met.

[0067] Of course, the power chip 200 in the embodiment of the present application may also be other types of chips, and those skilled in the art may make a selection according to actual needs, and the present application does not impose any limitation on this.

[0068] In some embodiments, the power chip 200 and the conductive layer 110 in the corresponding conductive area may be connected by wire or by welding. The specific connection method may be set according to actual needs, and this application does not impose any restrictions on this.

[0069] In some embodiments, Figure 7 As shown, each power chip 200 can be electrically connected to the conductive layer 110 in the corresponding conductive area through a bonding wire 400, so that multiple power chips 200 can be integrated on the same substrate 100 to form an integrated power module.

[0070] In some embodiments, the conductive layers 110 in two conductive regions may be connected by bonding wires 400 to achieve electrical connection between different conductive regions. For example, the conductive layer 110 corresponding to the output end of the first circuit may be connected to the conductive layer 110 corresponding to the input end of the second circuit by bonding wires 400 to achieve electrical connection between the first circuit and the second circuit.

[0071] Alternatively, if Figure 5 and Figure 6 As shown, the third conductive area 123 includes a first sub-conductive area 123a and a second sub-conductive area 123b that are spaced apart, and the third chip 230 includes at least one first sub-chip 231 and at least one second sub-chip 232; the first sub-chip 231 is electrically connected to the first sub-conductive area 123a to form a first sub-circuit, the second sub-chip 232 is electrically connected to the second sub-conductive area 123b to form a second sub-circuit, and the first sub-circuit is electrically connected to the second sub-circuit to form a third circuit; the first sub-circuit is used to be electrically connected to the first transformer, and the second sub-circuit is used to be electrically connected to the second transformer; the first sub-circuit is also used to be electrically connected to high-voltage electrical equipment.

[0072] In the embodiment of the present application, the third conductive area 123 is divided into a first sub-conductive area 123a and a second sub-conductive area 123b, and a first sub-chip 231 is arranged in the first sub-conductive area 123a to form a first sub-circuit. When in use, the input end of the first sub-circuit is electrically connected to the secondary side of the first transformer, so that a high-voltage current can be output at the output end of the first sub-circuit to power high-voltage electrical equipment such as a high-voltage power battery.

[0073] Furthermore, a second sub-chip 232 is set in the second sub-conductive area 123b to form a second sub-circuit, and the input end of the second sub-circuit is electrically connected to the output end of the first sub-circuit, and the output end of the second sub-circuit is electrically connected to the primary side of the second transformer. The second sub-circuit can be used to connect the first sub-circuit with the primary circuit of the second transformer, and then step down through the second transformer to meet the low-voltage power supply requirements.

[0074] Alternatively, if Figure 1 As shown, the substrate 100 has an intersecting first direction X and a second direction Y, the first conductive region 121 and the fourth conductive region 124 are arranged on one side of the substrate 100 along the first direction X, and the second conductive region 122 and the third conductive region 123 are arranged on the other side of the substrate 100 along the first direction X; the first conductive region 121 and the fourth conductive region 124 are arranged at intervals along the second direction Y, and the second conductive region 122 and the third conductive region 123 are arranged at intervals along the second direction Y.

[0075] In the embodiment of the present application, by setting the distribution positions of each conductive area, the structural layout of the four conductive areas on the substrate 100 can be optimized, thereby improving the compactness of the layout of each conductive area, contributing to the miniaturization and lightweight of the power module, and at the same time, facilitating the connection of each conductive area with external electrical components.

[0076] In a specific application, the first conductive region 121 and the fourth conductive region 124 can be formed on the same metal-clad plate, and the second conductive region 122 and the third conductive region 123 can be formed on another metal-clad plate, and then the two metal-clad plates are fixed on the substrate 100 to obtain a power module, thereby facilitating the processing and manufacturing of the power module.

[0077] Alternatively, if Figure 1 and Figure 5 As shown, each conductive region includes a plurality of plates 130 disposed at intervals, each power chip 200 is disposed on a corresponding plate 130 , and a target electrode of each power chip 200 is electrically connected to a corresponding plate 130 .

[0078] In an embodiment of the present application, a plurality of spaced plates 130 are provided in each conductive area, and then each target pole of each power chip 200 is electrically connected to the corresponding plate 130 by bonding wires 400 or welding to achieve integration between the power chip 200 and the conductive layer 110 on the substrate 100, so that a circuit module is formed by the power chip 200 and the corresponding plate 130 in the conductive area.

[0079] Specifically, the conductive layer 110 in each conductive area is divided into a plurality of unconnected blocks 130, and each power chip 200 includes a plurality of target poles. Each target pole is connected to at least one block 130 to achieve electrical connection between the power chip 200 and the conductive layer 110 in each conductive area.

[0080] Alternatively, if Figure 1 and Figure 5As shown, the multiple plates 130 include a first plate 131, a second plate 132 and a third plate 133, and the target pole includes a first pole, a second pole and a control pole; the power chip 200 is arranged in the first plate 131, the first pole is electrically connected to the first plate 131 where the power chip 200 is located, the second pole is electrically connected to the second plate 132, and the control pole is electrically connected to the third plate 133.

[0081] In the embodiment of the present application, each conductive area includes a first plate 131, a second plate 132 and a third plate 133, and each power chip 200 includes a first pole, a second pole and a control pole. By connecting each pole of the power chip 200 to the corresponding plate 130, the integration between the power chip 200 and the conductive layer 110 on the substrate 100 is achieved.

[0082] Specifically, taking the power chip 200 as a MOS chip as an example, the MOS chip may include a source, a drain and a gate. In the embodiment of the present application, the first electrode is the drain, the second electrode is the source, and the control electrode is the gate. Of course, the first electrode may also be the source, the second electrode may be the drain, and the control electrode may be the gate. The connection method may be adjusted accordingly with reference to the present embodiment.

[0083] For example, Figure 1 and Figure 5 As shown, the first conductive region 121 includes a plurality of first plates 131, a plurality of second plates 132, and a plurality of third plates 133. The first chip 210 is set as a MOS chip, wherein one MOS chip is set on a corresponding first plate 131, the drain of the MOS chip is attached to the first plate 131, and the drain of the MOS chip is electrically connected to the first plate 131 through a bonding wire 400 or welding. The source of the MOS chip is electrically connected to a second plate 132 through a bonding wire 400, and the source of the MOS chip is also electrically connected to another first plate 131 through a bonding wire 400, and the gate of the MOS chip is electrically connected to a third plate 133 through a bonding wire 400, so that the connection between the three poles of the MOS chip and the corresponding plates 130 is realized.

[0084] It is understandable that when the power chip 200 is another type of chip, the connection method between the power chip 200 and each block 130 can be adjusted accordingly according to the actual power chip 200, and this application will not go into details here.

[0085] The power chip 200 may further include a target electrode in addition to the first electrode, the second electrode and the control electrode. The target electrode may be suspended or connected to other plates 130 . Those skilled in the art may make adaptive adjustments according to actual needs.

[0086] In addition, the first conductive area 121 is used as an example for explanation in the embodiment of the present application. The connection structure between each target pole of the power chip 200 and the corresponding plate 130 in other conductive areas can refer to the first conductive area 121 and will not be repeated here.

[0087] In some embodiments, one or more power chips 200 may be provided on the first plate 131, or no power chip 200 may be provided, but the first plate 131 may be connected to other first plates 131 to achieve connectivity between different circuits. The connection structure between the first plate 131 and the first power chip 200 may be set according to the actual circuit design, and this application does not limit this.

[0088] Optionally, Fig. 9 As shown, in the first conductive area 121, the first plate 131 extends along the first direction X, the second plate 132 is arranged on both sides of the first plate 131 along the second direction Y, and the third plate 133 is also arranged on both sides of the first plate 131 along the second direction Y, and the second plate 132 and the third plate 133 are arranged at intervals.

[0089] In the embodiment of the present application, by reasonably setting the positions of the first plate 131, the second plate 132 and the third plate 133 in the first conductive area 121, the structural layout of each plate 130 in the first conductive area 121 can be optimized, and the compactness of each plate 130 in the first conductive area 121 can be improved, thereby contributing to the miniaturization and lightweight of the entire power module.

[0090] Among them, the first plate 131, the second plate 132 and the third plate 133 in the first conductive area 121 can be set to multiple, the multiple first plates 131 are arranged at intervals, the multiple second plates 132 and the multiple third plates 133 are respectively arranged on both sides of the multiple first conductive areas 121 along the second direction Y, and at the same time, the multiple second plates 132 and the multiple third plates 133 are arranged at intervals along the first direction X.

[0091] Alternatively, if Figure 8 and Fig. 9 As shown, the first chip 210 is provided in plurality, and at least one of the plurality of first chips 210 is provided in the first plate 131; the first pole of the first chip 210 is electrically connected to the first plate 131, the second pole of the first chip 210 is electrically connected to the corresponding second plate 132, and the control pole of the first chip 210 is electrically connected to the corresponding third plate 133.

[0092] In the embodiment of the present application, the first chip 210 is disposed in the first plate 131, and the first chip 210 is electrically connected to the second plate 132 and the third plate 133 respectively, so as to form a first circuit in the first conductive area 121. The input AC current can be converted into DC current through the first circuit, thereby realizing the integration of the first chip 210 and each plate 130, simplifying the circuit connection, and thus reducing stray inductance.

[0093] Alternatively, if Fig. 9 As shown, in the second conductive area 122 , the first plate 131 extends along the first direction X, the second plate 132 is arranged on both sides of the first plate 131 along the second direction Y, the third plate 133 is arranged on both sides of the first plate 131 along the second direction Y, and the second plate 132 and the third plate 133 are arranged at intervals.

[0094] In the embodiment of the present application, by reasonably setting the positions of the first plate 131, the second plate 132 and the third plate 133 in the second conductive area 122, the structural layout of each plate 130 in the second conductive area 122 can be optimized, and the compactness of each plate 130 in the second conductive area 122 can be improved, thereby contributing to the miniaturization and lightweight of the entire power module.

[0095] Alternatively, if Figure 8 and Fig. 9 As shown, the second chip 220 is provided in plurality, and at least one of the plurality of second chips 220 is provided in the first plate 131; the first pole of the second chip 220 is electrically connected to the first plate 131, the second pole of the second chip 220 is electrically connected to the corresponding second plate 132, and the control pole of the second chip 220 is electrically connected to the corresponding third plate 133.

[0096] In the embodiment of the present application, the second chip 220 is arranged on the first plate 131, and the second chip 220 is electrically connected to the second plate 132 and the third plate 133 respectively to form a second circuit in the second conductive area 122. The second circuit can then be used as a part of the LLC resonant circuit, thereby realizing the integration of the second chip 220 and each plate 130, simplifying the circuit connection, and thus reducing stray inductance.

[0097] Alternatively, if Fig. 9 As shown, in the third conductive region 123 , the first plate 131 extends along the first direction X, and the second plate 132 and the third plate 133 are at least partially disposed around the first plate 131 .

[0098] In the embodiment of the present application, by reasonably setting the positions of the first plate 131, the second plate 132 and the third plate 133 in the third conductive area 123, the structural layout of each plate 130 in the third conductive area 123 can be optimized, and the compactness of each plate 130 in the third conductive area 123 can be improved, thereby contributing to the miniaturization and lightweight of the entire power module.

[0099] Alternatively, if Figure 8 and Fig. 9 As shown, the third chip 230 is provided in plurality, and at least one of the plurality of third chips 230 is provided in the first plate 131; the first pole of the third chip 230 is electrically connected to the first plate 131, the second pole of the third chip 230 is electrically connected to the corresponding second plate 132, and the control pole of the third chip 230 is electrically connected to the corresponding third plate 133.

[0100] In the embodiment of the present application, by setting the third chip 230 in the first plate 131, and electrically connecting the third chip 230 to the second plate 132 and the third plate 133 respectively, a third circuit is formed in the third conductive area 123. The third circuit can be used as a part of the LLC resonant circuit, and then as a high-voltage charging circuit; at the same time, the third circuit can also be connected to the second transformer, and then can be used as a part of the DC / DC circuit. In this way, the third chip 230 is integrated with each plate 130, which can simplify the circuit connection and reduce the stray inductance.

[0101] Alternatively, if Fig. 9 As shown, in the fourth conductive area 124, the first plate 131, the second plate 132 and the third plate 133 all extend along the second direction Y, the second plate 132 is arranged on both sides of the first plate 131 along the first direction X, the third plate 133 is also arranged on both sides of the first plate 131 along the first direction X, and the second plate 132 and the third plate 133 are arranged at intervals.

[0102] In the embodiment of the present application, by reasonably setting the positions of the first plate 131, the second plate 132 and the third plate 133 in the fourth conductive area 124, the structural layout of each plate 130 in the fourth conductive area 124 can be optimized, and the compactness of each plate 130 in the fourth conductive area 124 can be improved, thereby contributing to the miniaturization and lightweight of the entire power module.

[0103] Alternatively, if Figure 8 and Fig. 9As shown, the fourth chip 240 is provided in plurality, and the plurality of fourth chips 240 are arranged on the first plate 131 at intervals along the second direction Y; the first pole of the fourth chip 240 is electrically connected to the first plate 131, the second pole of the fourth chip 240 is electrically connected to the corresponding second plate 132, and the control pole of the fourth chip 240 is electrically connected to the corresponding third plate 133.

[0104] In the embodiment of the present application, multiple fourth chips 240 are arranged on the first plate 131, and the fourth chips 240 are electrically connected to the corresponding second plate 132 and the third plate 133 respectively to form a fourth circuit in the fourth conductive area 124. The fourth circuit can be used as a part of the DC / DC circuit so as to serve as a low-voltage charging circuit, thereby realizing the integration of the fourth chip 240 and each plate 130, simplifying the circuit connection, and thus reducing stray inductance.

[0105] Alternatively, if Figure 7 As shown, the power module also includes a plurality of connection terminals 300, which are respectively arranged on the first plate 131, the second plate 132 and the third plate 133, and the connection terminals 300 are used to electrically connect the corresponding plate 130 with an external circuit or electrical component; wherein the external circuit includes an external power supply, and the electrical component includes a first transformer, a second transformer, high-voltage electrical equipment and low-voltage electrical equipment.

[0106] In the embodiment of the present application, a plurality of connection terminals 300 are provided, and the plurality of connection terminals 300 are respectively provided on the first plate 131, the second plate 132 and the third plate 133. The connection terminals 300 can be used to electrically connect each plate 130 to an external circuit or electrical component, so that when the power module is used, it can be directly assembled by connecting the connection terminals 300 to the external circuit or electrical component, which is convenient for operation.

[0107] It should be noted that the connection terminal 300 can be set as a pin, and the external circuit or electrical component can be provided with a connection end, which is provided with a plug-in structure compatible with the pin, so that when the power module is connected to the corresponding external circuit or electrical component, the pin and the plug-in structure can be directly plugged in, which can improve operational efficiency.

[0108] Specifically, among the multiple plates 130, one or more connecting terminals 300 can be provided on each plate 130, and one end of each connecting terminal 300 can be electrically connected to the corresponding plate 130 by welding or the like, while the other end of the connecting terminal 300 extends in a direction away from the substrate 100 so as to be used for connection with an external circuit or electrical component.

[0109] It should be noted that the number and position of the connection terminals 300 provided on each plate 130 can be determined according to the specific structural design of the power module, and the present application does not impose any limitation thereto.

[0110] Alternatively, if Figure 7 As shown, the external circuit also includes: an external drive circuit, the connection terminal 300 includes a power terminal 310 and a signal terminal 320; the first plate 131 is provided with a power terminal 310, and the power terminal 310 is used to connect the first plate 131 to an external power source or an electrical component; the second plate 132 and the third plate 133 are both provided with a signal terminal 320, and the signal terminal 320 is used to connect the second plate 132 and / or the third plate 133 to the external drive circuit.

[0111] In the embodiment of the present application, the connection terminal 300 includes a power terminal 310 and a signal terminal 320. The power terminal 310 is provided on the first plate 131, so that the power terminal 310 is used to connect the first plate 131 to an external power source or electrical component, and the signal terminal 320 is provided on the second plate 132 and the third plate 133, so that the signal terminal 320 is used to connect the second plate 132 and / or the third plate 133 to an external drive circuit. In this way, by providing different types of connection terminals 300 on different plates 130, the connection requirements of different target poles of the power chip 200 can be met.

[0112] For example, Figure 1 and Figure 7 As shown, in the first conductive area 121, taking the first chip 210 as a MOS chip as an example, the MOS chip is arranged on the first plate 131, the drain of the MOS chip is electrically connected to the first plate 131, a power terminal 310 is arranged on the first plate 131, the source of the MOS chip is electrically connected to the second plate 132, a signal terminal 320 is arranged on the second plate 132, the gate of the MOS chip is electrically connected to the third plate 133, and the signal terminal 320 is arranged on the third plate 133.

[0113] The power terminal 310 of the first block 131 can be used to connect to an external power source to introduce current into the first circuit. The signal terminals 320 on the second block 132 and the third block 133 are respectively used to connect to an external driving circuit to control the MOS chip.

[0114] It should be noted that when the power chip 200 is another type of chip, different connection terminals 300 may be provided according to the blocks 130 corresponding to the target poles of the specific power chip 200 , which will not be described in detail in the embodiment of the present application.

[0115] In addition, in practical applications, for the convenience of production and assembly, the power terminal 310 and the signal terminal 320 can be set to the same structure. When in use, the power terminal 310 and the signal terminal 320 can be marked to distinguish them, such as marking them with different colors. In this way, processing costs can be saved and production operations are convenient. Of course, the power terminal 310 and the signal terminal 320 can also use different structures, and this application does not limit this.

[0116] Alternatively, if Figure 7 As shown, the power terminal 310 includes a first power terminal 311 and a second power terminal 312. The current carried by the first power terminal 311 is greater than the current carried by the second power terminal 312. The first power terminal 311 is arranged in the fourth conductive area 124, and the second power terminal 312 is arranged in a conductive area other than the fourth conductive area 124 among multiple conductive areas.

[0117] In the embodiment of the present application, by setting the power terminal 310 to include a first power terminal 311 and a second power terminal 312, the current carried by the first power terminal 311 is greater than the current carried by the second power terminal 312, thereby meeting the circuit connection requirements of different conductive areas.

[0118] For example, Figure 7 As shown, six fourth chips 240 are provided in the fourth conductive area 124, wherein three power chips 200 are provided on the same first plate 131, and the other three power chips 200 are provided on the same first plate 131. Since three fourth chips 240 are provided in parallel on the first plate 131 at the same time, the current passing through the first plate 131 is relatively large. Therefore, a first power terminal 311 is provided on the first plate 131 to meet the connection requirements of a relatively large current.

[0119] In the first blocks 131 in the first conductive area 121 , the second conductive area 122 , and the third conductive area 123 , the current flowing through them is relatively small, so the second power terminals 312 are all used, which can save costs and facilitate actual installation.

[0120] It should be noted that the specific type of the power terminal 310 provided on the first plate 131 can be determined according to the connection structure between the power chip 200 and the corresponding first plate 131 , and the present application does not impose any limitation on this.

[0121] Alternatively, if Figure 8As shown, the present application also provides a circuit system, which includes: a first transformer, a second transformer and the power module in the above embodiment; the output end of the second circuit is electrically connected to the primary side of the first transformer, the input end of the third circuit is electrically connected to the secondary side of the first transformer, the output end of the third circuit is electrically connected to the primary side of the second transformer, and the input end of the fourth circuit is electrically connected to the secondary side of the second transformer.

[0122] In the embodiment of the present application, the power module is connected to the first transformer and the second transformer respectively to form an integrated OBC and DC / DC circuit, wherein the power module is provided with a plurality of spaced conductive areas on the substrate 100, and in each conductive area, a plurality of power chips 200 are connected to the conductive layer 110 in the conductive area to form a corresponding circuit, thereby realizing the deep integration of the on-board charger circuit and the DC converter circuit. In this way, the power module can directly realize the energy transmission between the external power supply, high-voltage electrical equipment and low-voltage electrical equipment, which can better meet the requirements of the whole vehicle layout for the miniaturization and lightweight of the on-board devices, and can reduce the stray inductance, so that when the power module is used in the vehicle, the charging efficiency of the vehicle can be improved, the power consumption of the whole vehicle can be reduced, and the user experience can be improved.

[0123] Specifically, Figure 8 As shown, Figure 8 The circuit topology diagram corresponding to the circuit system of the embodiment of the present application is shown, wherein Q1, Q2, Q3, Q4 are the first chip 210, Q5, Q6, Q7, Q8 are the second chip 220, Q9, Q10, Q11, Q12, Q13, Q14, Q15, Q16 are the third chip 230, Q17, Q18, Q19, Q20, Q21, Q22 are the fourth chip 240, TX1 is the first transformer, and TX2 is the second transformer.

[0124] Among them, the PFC circuit is composed of Q1, Q2, Q3, and Q4. The input end of the PFC circuit is AC current input, and the output is an LLC primary circuit composed of Q5, Q6, Q7, Q8, inductor Lr2, capacitor Cr1 and the primary side of the first transformer TX1. After boosting by the first transformer TX1, the output is an LLC secondary circuit composed of Q9, Q10, Q11, Q12, inductor Lr3, capacitor Cr2 and the secondary side of the first transformer TX1. The LLC secondary circuit is a high-voltage charging circuit and can be used to connect high-voltage electrical equipment such as high-voltage power batteries to meet high-voltage power supply requirements.

[0125] Among them, Q13, Q14, Q15, Q16 and the primary side of the second transformer TX2 constitute a DC primary circuit, the input end of the DC primary circuit is electrically connected to the output end of the LLC secondary circuit, and after being stepped down by the second transformer TX2, the output is a DC secondary circuit composed of Q17, Q18, Q19, Q20, Q21, Q22, inductor Lr4 and the secondary side of the second transformer TX2. The DC secondary circuit is a low-voltage charging circuit and can be used to connect low-voltage electrical equipment such as low-voltage batteries and low-voltage devices to meet low-voltage power supply requirements.

[0126] In a specific application, when the OBC is working, the AC current input passes through, and after the PFC circuit power factor is calibrated, it is supplied to the LLC primary circuit. Q6 and Q7 in the LLC primary circuit are turned on at the same time, and the resonant current charges the excitation current of the first transformer TX1; Q6 and Q7 are turned off at the same time, and the excitation current continues to supply power to the outside. Q5 and Q8 are turned on at the same time, and the resonant current continues to reversely charge the excitation current; Q5 and Q8 are turned off at the same time, and the excitation current continues to supply power to the outside.

[0127] Furthermore, when OBC and DC / DC work simultaneously, as described above, OBC outputs voltage normally, and at the same time, the current output by OBC enters the DC primary circuit, and after being stepped down by the second transformer TX2, supplies power to the DC secondary circuit, and the DC secondary circuit continues to supply power to the outside.

[0128] The first transformer TX1 is a step-up transformer, and the second transformer TX2 is a step-down transformer. The specific types of the first transformer TX1 and the second transformer TX2 can be selected according to actual needs, and the embodiment of the present application does not limit this.

[0129] In some embodiments, the circuit system may further include inductors and capacitors, wherein the number and connection method of the inductors and capacitors may be set according to actual needs of the circuit and are not limited here.

[0130] It should be noted that the circuit system in the present application may include the power module in any of the above embodiments. The specific structure of the power module can be found in the above content, and the present application will not repeat it here.

[0131] Optionally, an embodiment of the present application also provides a vehicle, which includes the circuit system in the above embodiment.

[0132] In an embodiment of the present application, the vehicle includes a circuit system, which is composed of a power module. The power chip 200 in the present application is formed by setting a plurality of spaced conductive areas on the substrate 100. In each conductive area, a plurality of power chips 200 are connected to the conductive layer 110 in the conductive area to form a corresponding circuit, thereby realizing the deep integration of the on-board charger circuit and the DC converter circuit. In this way, the power module can directly realize energy transmission with an external power supply, high-voltage electrical equipment, and low-voltage electrical equipment, which can better meet the requirements of the whole vehicle layout for miniaturization and lightweight of on-board devices, and can reduce stray inductance, so that when the power module is used in the vehicle, the charging efficiency of the vehicle can be improved, the power consumption of the whole vehicle can be reduced, and the user experience can be improved.

[0133] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0134] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A power module, characterized in that: include: A substrate (100), wherein at least one side of the substrate (100) is provided with a conductive layer (110), and the conductive layer (110) comprises a plurality of conductive areas arranged at intervals; A plurality of power chips (200), wherein the plurality of power chips (200) are respectively arranged in the plurality of conductive areas, and the power chips (200) include: at least one first chip (210), at least one second chip (220), at least one third chip (230) and at least one fourth chip (240); The first chip (210) is electrically connected to a first conductive area (121) among the plurality of conductive areas to form a first circuit, wherein the first circuit is used to be connected to an external power source; The second chip (220) is electrically connected to a second conductive area (122) among the plurality of conductive areas to form a second circuit, one end of the second circuit is electrically connected to the first circuit, and the other end of the second circuit is used to be electrically connected to the first transformer; The third chip (230) is electrically connected to a third conductive area (123) among the plurality of conductive areas to form a third circuit, one end of the third circuit is used to be electrically connected to the first transformer, and the other end of the third circuit is used to be electrically connected to a high-voltage electrical device and a second transformer; The fourth chip (240) is electrically connected to a fourth conductive area (124) among the plurality of conductive areas to form a fourth circuit, one end of the fourth circuit is used to be electrically connected to the second transformer, and the other end of the fourth circuit is used to be electrically connected to a low-voltage electrical device.

2. The power module according to claim 1, characterized in that: The third conductive region (123) comprises a first sub-conductive region (123a) and a second sub-conductive region (123b) which are arranged at intervals, and the third chip (230) comprises a first sub-chip (231) and a second sub-chip (232); The first sub-chip (231) is electrically connected to the first sub-conductive area (123a) to form a first sub-circuit, the second sub-chip (232) is electrically connected to the second sub-conductive area (123b) to form a second sub-circuit, and the first sub-circuit is electrically connected to the second sub-circuit to form the third circuit; The first sub-circuit is used to be electrically connected to the first transformer, and the second sub-circuit is used to be electrically connected to the second transformer; the first sub-circuit is also used to be electrically connected to the high-voltage electrical equipment.

3. The power module according to claim 1, characterized in that: The substrate (100) has a first direction (X) and a second direction (Y) intersecting each other; the first conductive region (121) and the fourth conductive region (124) are arranged on one side of the substrate (100) along the first direction (X); and the second conductive region (122) and the third conductive region (123) are arranged on the other side of the substrate (100) along the first direction (X); The first conductive region (121) and the fourth conductive region (124) are arranged at intervals along the second direction (Y), and the second conductive region (122) and the third conductive region (123) are arranged at intervals along the second direction (Y).

4. The power module according to claim 3, characterized in that: Each of the conductive areas comprises a plurality of plates (130) arranged at intervals, each of the power chips (200) is arranged on a corresponding plate (130), and a target pole of each of the power chips (200) is electrically connected to a corresponding plate (130).

5. The power module according to claim 4, characterized in that: The plurality of plates (130) include a first plate (131), a second plate (132) and a third plate (133), and the target pole includes a first pole, a second pole and a control pole; The power chip (200) is arranged on the first plate (131), the first electrode is electrically connected to the first plate (131) where the power chip (200) is located, the second electrode is electrically connected to the second plate (132), and the control electrode is electrically connected to the third plate (133).

6. The power module according to claim 5, characterized in that: In the first conductive area (121), the first plate (131) extends along the first direction (X), the second plate (132) is arranged on both sides of the first plate (131) along the second direction (Y), the third plate (133) is also arranged on both sides of the first plate (131) along the second direction (Y), and the second plate (132) and the third plate (133) are arranged at intervals.

7. The power module according to claim 6, characterized in that: The first chip (210) is provided in plurality, and at least one of the plurality of the first chips (210) is provided in the first plate (131); the first pole of the first chip (210) is electrically connected to the first plate (131), the second pole of the first chip (210) is electrically connected to the corresponding second plate (132), and the control pole of the first chip (210) is electrically connected to the corresponding third plate (133).

8. The power module according to claim 5, characterized in that: In the second conductive area (122), the first plate (131) extends along the first direction (X), the second plate (132) is arranged on both sides of the first plate (131) along the second direction (Y), the third plate (133) is also arranged on both sides of the first plate (131) along the second direction (Y), and the second plate (132) and the third plate (133) are arranged at intervals.

9. The power module according to claim 8, characterized in that: The second chip (220) is provided in plurality, and at least one of the plurality of second chips (220) is provided on the first plate (131); the first pole of the second chip (220) is electrically connected to the first plate (131), the second pole of the second chip (220) is electrically connected to the corresponding second plate (132), and the control pole of the second chip (220) is electrically connected to the corresponding third plate (133).

10. The power module according to claim 5, characterized in that: In the third conductive area (123), the first plate (131) extends along the first direction (X), and the second plate (132) and the third plate (133) are at least partially arranged around the first plate (131).

11. The power module according to claim 10, characterized in that: The third chip (230) is provided in plurality, and at least one of the plurality of third chips (230) is provided in the first plate (131); a first pole of the third chip (230) is electrically connected to the first plate (131), a second pole of the third chip (230) is electrically connected to the corresponding second plate (132), and a control pole of the third chip (230) is electrically connected to the corresponding third plate (133).

12. The power module according to claim 5, characterized in that: In the fourth conductive area (124), the first plate (131), the second plate (132) and the third plate (133) all extend along the second direction (Y); the second plate (132) is arranged on both sides of the first plate (131) along the first direction (X); the third plate (133) is also arranged on both sides of the first plate (131) along the first direction (X); and the second plate (132) and the third plate (133) are arranged at intervals.

13. The power module according to claim 12, characterized in that: The fourth chip (240) is provided in plurality, and the plurality of fourth chips (240) are arranged on the first plate (131) at intervals along the second direction (Y); a first pole of the fourth chip (240) is electrically connected to the first plate (131), a second pole of the fourth chip (240) is electrically connected to the corresponding second plate (132), and a control pole of the fourth chip (240) is electrically connected to the corresponding third plate (133).

14. The power module according to claim 5, characterized in that: The power module further comprises a plurality of connection terminals (300), the plurality of connection terminals (300) being respectively arranged on the first plate (131), the second plate (132) and the third plate (133), the connection terminals (300) being used to electrically connect the corresponding plate (130) to an external circuit or electrical component; wherein the external circuit comprises an external power supply, and the electrical component comprises a first transformer, a second transformer, a high-voltage electrical device and a low-voltage electrical device.

15. The power module according to claim 14, characterized in that: The external circuit further comprises: an external driving circuit, wherein the connection terminal (300) comprises a power terminal (310) and a signal terminal (320); The first plate (131) is provided with the power terminal (310), and the power terminal (310) is used to connect the first plate (131) to an external power source or an electrical component; The second plate (132) and the third plate (133) are both provided with the signal terminal (320), and the signal terminal (320) is used to connect the second plate (132) and / or the third plate (133) to an external driving circuit.

16. The power module according to claim 15, characterized in that: The power terminal (310) comprises a first power terminal (311) and a second power terminal (312); the current carried by the first power terminal (311) is greater than the current carried by the second power terminal (312); the first power terminal (311) is arranged in the fourth conductive area (124); and the second power terminal (312) is arranged in a conductive area other than the fourth conductive area (124) among the plurality of conductive areas.

17. The power module according to claim 1, characterized in that: The substrate (100) comprises a copper-clad ceramic substrate or an aluminum-clad ceramic substrate.

18. A circuit system, characterized in that: include: A first transformer, a second transformer, and a power module as claimed in any one of claims 1 to 17; The second circuit is electrically connected to the first transformer, one end of the third circuit is electrically connected to the first transformer, the other end of the third circuit is electrically connected to the second transformer, and the fourth circuit is electrically connected to the second transformer.

19. A vehicle, characterized in that: Comprising the circuit system of claim 18.

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