FCBGA packaging carrier plate

Abstract

The utility model discloses an FCBGA packaging carrier plate which comprises a core plate, stacking films arranged on the two opposite sides of the core plate, and first copper layers arranged on the sides, away from the core plate, of the stacking films. The dielectric loss of the core plate is less than 0.004, the core plate comprises a ceramic substrate and second copper layers arranged on two opposite sides of the ceramic substrate, and the thickness of the ceramic substrate is 0.2-1.5 mm. The FCBGA packaging carrier plate can reduce insertion loss and reduce energy consumption, and has good heat dissipation performance.

Description

Technical Field

[0001] The utility model relates to the field of chips, in particular to an FCBGA packaging carrier board. Background Art

[0002] FC-BGA (Flip Chip Ball Grid Array) is a packaging format known as flip chip ball grid array, which is also the most important packaging format for graphics acceleration chips and the main way to package high-end chips. In the existing FCBGA packaging technology, glass fiber substrate is mainly used as the core board material of the FCBGA packaging carrier.

[0003] For example, the Chinese invention patent CN116403913A discloses a FCBGA package core board, a package substrate and a preparation method thereof. The application records "a preparation method of a FCBGA package core board, the preparation method comprising: providing a glass substrate, the glass substrate being one of alkali-free glass, alkaline glass, aluminum oxide glass, high borosilicate glass and quartz glass, the thermal expansion coefficient of which is between 1ppm / ℃ and 10ppm / ℃, including the end value, and the thermal conductivity is between 1W / m·K and 5W / m·K, including the end value, and heat treating the glass substrate to relieve stress on the glass substrate; forming interconnection holes penetrating the glass substrate; forming a metal seed layer covering the opposite sides of the glass substrate and the surface of the interconnection holes; forming a metal interconnection layer covering the metal seed layer, and the metal interconnection layer fills the interconnection holes; patterning the metal interconnection layer and the metal seed layer until the surface of the glass substrate is exposed to form a FCBGA package core board". That is, in this application, the core substrate includes a glass substrate and metal seed layers disposed on both sides of the glass substrate.

[0004] When using a glass fiber substrate as a FCBGA package substrate, its signal consumption factor at 10Ghz frequency is greater than 0.01, and there are problems such as high insertion loss, high energy consumption, and poor heat dissipation. With the development of science and technology, the requirements for the operation frequency of chip products are getting higher and higher. Under the background of high frequency and high speed, the existing FCBGA package substrate has high signal insertion loss, high energy consumption, and poor heat dissipation, which have become problems that need to be solved urgently. Summary of the invention

[0005] In order to overcome the defects in the prior art, an embodiment of the utility model provides a FCBGA package carrier, which can reduce insertion loss, lower energy consumption, and has good heat dissipation performance.

[0006] To achieve the above object, the technical solution adopted by the utility model is: an FCBGA package carrier, characterized in that it includes a core board, a deposition film arranged on two opposite sides of the core board, and a first copper layer arranged on a side of the deposition film away from the core board;

[0007] The dielectric loss of the core board is less than 0.004, the core board comprises a ceramic substrate, a second copper layer arranged on two opposite sides of the ceramic substrate, the thickness of the ceramic substrate is 0.2 mm to 1.5 mm, and the ceramic content of the ceramic substrate is 85% to 96%.

[0008] By filling the substrate material with ceramic material, the ceramic substrate thus prepared has a more stable dielectric constant, low water absorption, and good moisture and heat resistance compared to the existing glass fiber substrate. The ceramic substrate is applied to the FCBGA package carrier, and the FCBGA package carrier thus prepared has the properties of low signal insertion loss, low energy consumption, good heat dissipation effect, etc., which can prevent the FCBGA package carrier from warping and deformation during use.

[0009] Furthermore, the ceramic substrate includes at least one of a PTFE ceramic plate, a hydrocarbon ceramic plate, and a PPO ceramic plate. The PTFE ceramic plate is prepared by mixing a ceramic material and a polytetrafluoroethylene (PTFE) material. The hydrocarbon ceramic plate is prepared by mixing a ceramic material and a hydrocarbon material. The PPO ceramic plate is prepared by mixing a ceramic material and a polyphenylene ether (PPO) material. The content of the ceramic material in the above-mentioned plates is 85% to 96%. The PTFE ceramic plate, the hydrocarbon ceramic plate, and the PPO ceramic plate can be purchased directly from Shanghai Materials Research Institute Co., Ltd.

[0010] The second copper layer needs to be further processed on the ceramic substrate to prepare a core board, and the second copper layer in the core board is 20μm to 30μm. The core board prepared by the PTFE ceramic plate and the second copper layer has a dielectric constant of 2.6, a dielectric loss of 0.001, a thermal conductivity of 0.56, and a water absorption of 0.05 at 23°C and a frequency of 10Ghz. The dielectric constant of the hydrocarbon ceramic plate and the second copper layer at 23°C and a frequency of 10Ghz is 3.42, a dielectric loss of 0.003, a thermal conductivity of 0.66, and a water absorption of 0.05. The dielectric constant of the PPO ceramic plate at 23°C and a frequency of 10Ghz is 3.4, a dielectric loss of 0.003, a thermal conductivity of 0.52, and a water absorption of 0.09. By mixing ceramic materials in the substrate material, eliminating glass fiber materials, and reducing the dielectric constant and loss factor of the substrate, it has a lower thermal expansion coefficient.

[0011] The ceramic substrate is further improved so that the ceramic substrate is stacked by PTFE ceramic plates, hydrocarbon ceramic plates, and PPO ceramic plates. By stacking plates with multiple properties to form a ceramic substrate, the properties of each plate can be combined, so that the packaging carrier made of the ceramic substrate has better performance.

[0012] Furthermore, the thickness of the core board is 0.25 mm to 1.55 mm. The core board includes a ceramic substrate and a second copper layer disposed on opposite sides of the ceramic substrate. The second copper layer is an ultra-low profile copper foil. The profile Ra of the contact surface between the general electrolytic copper foil and the substrate insulating medium is 0.4 um, and the ultra-low profile copper foil Ra is about 0.15 um.

[0013] Furthermore, the deposited film is an ABF deposited film, and the thickness of the deposited film is 15 μm to 60 μm. ABF (Ajinomoto Build-up Film) material is an insulating material between circuit layers of a high-density package substrate produced by Japan's Ajinomoto Co., Ltd. In addition to using the materials provided by Japan's Ajinomoto Co., Ltd., domestic materials can also be used as substitutes.

[0014] Furthermore, the FCBGA package carrier board also includes a solder resist green paint layer disposed on a side of the first copper layer away from the deposited film.

[0015] Furthermore, a copper-plated through hole or copper-plated blind hole for inter-copper layer conduction is provided in the package carrier. The copper-plated through hole provided on the core board may include the following processes: drilling holes on the core board, three-in-one copper, copper plating, plugging holes, brushing, image transfer, etching, optical inspection, etc. The process is similar to using a standard glass fiber substrate, except that the processing parameter conditions need to be tested and refined to make it suitable for ceramic substrates. The above adjustments are routine modifications for those skilled in the art and can be obtained after multiple tests.

[0016] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0017] 1. In the present application, ceramic material is filled in the substrate material, and the prepared ceramic substrate is used to prepare the FCBGA package carrier, so that the prepared FCBGA package carrier has the properties of low signal insertion loss, low energy consumption, good heat dissipation effect, etc., which can prevent the FCBGA package carrier from warping and deformation during use.

[0018] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is a schematic diagram of the structure of the FCBGA package carrier in the first embodiment of the utility model;

[0021] Figure 2 It is a schematic diagram of the core board structure in the first embodiment of the utility model.

[0022] The figure numbers of the above drawings are: 1, core board; 11, ceramic substrate; 12, second copper layer; 2, deposited film; 3, first copper layer; 4, through hole; 5, blind hole. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example 1: See Figures 1-2 As shown, a FCBGA package carrier comprises a core board 1, a deposition film 2 arranged on opposite sides of the core board 1, a first copper layer 3 arranged on the side of the deposition film 2 away from the core board 1, and a solder resist green paint arranged on the side of the first copper layer 3 away from the deposition film 2.

[0025] Among them, the dielectric loss of the core board 1 is less than 0.004, and the core board 1 includes a ceramic substrate 11 and a second copper layer 12 arranged on opposite sides of the ceramic substrate 11. The ceramic substrate 11 is formed by stacking a PTFE ceramic board and a PPO ceramic board. The PTFE ceramic board is prepared by mixing ceramic material and polytetrafluoroethylene (PTFE) material. The PPO ceramic board is prepared by mixing ceramic material and polyphenylene ether (PPO) material. The ceramic content in the PTFE ceramic board and the PPO ceramic board is 85% to 90%. The thickness of the ceramic substrate 11 is 0.8mm. The second copper layer 12 is an ultra-low profile copper foil. The manufacturing process of the core board is: using the existing ceramic substrate with copper foil, the surface copper foil is processed by copper reduction, copper plating etching and other processing processes to form a second copper layer 12 with a thickness of 20μm to 30μm. The thickness of the finished core board 1 is 0.25mm to 1.55mm. The core board 1 can be directly processed by drilling, three-in-one copper, copper plating, plugging, brushing, impact transfer, etching, optical inspection, etc. The process parameters in the above processing need to be adjusted accordingly according to the change of the ceramic substrate 11 material.

[0026] After drilling and copper plating are completed on the core board 1, the build-up layer deposition film 2 is pressed to form an ABF deposition film 2 on the upper and lower surfaces of the core board 1, respectively. The deposition film 2 has a thickness of 35 μm. After the deposition film 2 is set, a first copper layer 3 is formed on the deposition film 2 by electroplating, and a solder resist green paint is formed on the first copper layer 3. Finally, through holes 4, blind holes 5, etc. are processed to form an FCBGA package carrier.

[0027] Embodiment 2: A FCBGA package carrier. Embodiment 2 is basically similar to Embodiment 1, except that the ceramic substrate 11 is formed by stacking a PTFE ceramic plate, a hydrocarbon ceramic plate, and a PPO ceramic plate.

[0028] The present invention uses specific embodiments to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A FCBGA package carrier, characterized in that: It includes a core board, a deposition film disposed on two opposite sides of the core board, and a first copper layer disposed on a side of the deposition film away from the core board; The dielectric loss of the core board is less than 0.

004. The core board includes a ceramic substrate and a second copper layer arranged on two opposite sides of the ceramic substrate. The thickness of the ceramic substrate is 0.2 mm to 1.5 mm.

2. The FCBGA package carrier according to claim 1, characterized in that: The ceramic substrate includes at least one of a PTFE ceramic plate, a hydrocarbon ceramic plate, and a PPO ceramic plate.

3. The FCBGA package carrier according to claim 1, characterized in that: The ceramic substrate is formed by stacking a PTFE ceramic plate, a hydrocarbon ceramic plate, and a PPO ceramic plate.

4. The FCBGA package carrier according to claim 1, characterized in that: The thickness of the core plate is 0.25 mm to 1.55 mm.

5. The FCBGA package carrier according to claim 1, characterized in that: The deposited film is an ABF deposited film, and the thickness of the deposited film is 15 μm to 60 μm.

6. The FCBGA package carrier according to claim 1, characterized in that: The FCBGA package carrier also includes a solder resist green paint layer disposed on a side of the first copper layer away from the deposition film.

7. The FCBGA package carrier according to claim 1, characterized in that: Copper-plated through holes or copper-plated blind holes for conducting between copper layers are provided in the package carrier.

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