Video card wireless device

By using a thermal frame and a floating structure to connect the power supply PCB in the graphics card, and combining the removable backplane design, the signal interference and assembly error problems caused by the power supply lines of the traditional graphics card are solved, achieving higher installation convenience and maintenance convenience.

CN222167597UActive Publication Date: 2024-12-13SHENZHEN COLORFUL YUGONG TECH DEV CO LTD
View PDF 0 Cites 2 Cited by

Patent Information

Application Number
CN202422760072.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-13
Publication Date
2024-12-13
Estimated Expiration
2034-11-13

AI Technical Summary

Technical Problem

In traditional graphics card design, the power supply lines are directly arranged on the main PCB, resulting in signal interference and unstable power supply, and bolt-fixed installation is prone to assembly errors, affecting the installation and use of graphics cards.

Method used

Design a wireless device for graphics card, using a thermal frame and a floating structure to connect the power supply PCB, and realize the left and right offset and fixation of the power supply PCB through flexible parts and support rings. Combined with the removable backplane structure, the assembly tolerance and alignment error are eliminated, and the assembly tolerance and alignment error are improved. Easy to install and easy to repair.

Benefits of technology

The assembly convenience and stability of the graphics card are optimized, assembly errors are reduced, and the installation flexibility of the graphics card and the convenience of after-sales maintenance are improved.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222167597U_ABST
    Figure CN222167597U_ABST
Patent Text Reader

Abstract

The utility model relates to the technical field of computer equipment, in particular to a video card wireless device, which comprises a heat dissipation module with a heat conduction frame; the main PCB and the power supply PCB are installed below the heat conduction frame, and the power supply PCB is electrically connected with the main PCB; wherein a plurality of floating structures are distributed between the power supply PCB and the heat conduction frame, the power supply PCB is connected and fixed with the heat conduction frame through the floating structures, and the floating structures are adopted, so that the power supply PCB can shift left and right to eliminate the tolerance of each part in processing and assembling; meanwhile, the alignment error with the PCIE card slot of the mainboard can be adapted in a small range so as to optimize the assembly convenience, the main back plate and the auxiliary back plate both adopt a detachable structural design, and the two back plates are independently detachable without influencing the performance of the heat dissipation module, so that the convenience of internal maintenance and dust removal of the display card is improved, and the convenience of after-sales maintenance is improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of computer equipment, in particular to a graphics card wireless device. Background Art

[0002] With the development of electronic technology, graphics cards, as an important component of computers, are also constantly improving in performance and design. In the design of graphics cards, in order to improve performance and stability, it is often necessary to add additional power supply circuits. However, traditional graphics card designs usually place all power supply lines directly on the main PCB (printed circuit board), which not only increases the complexity of the PCB, but may also cause signal interference and unstable power supply.

[0003] To solve this problem, some new graphics card designs use a method of separating the main PCB from the power supply PCB. In this design, the power supply PCB is plugged into the motherboard through a specific interface to provide power to the main PCB. This design not only reduces the wiring on the main PCB, but also improves the installation flexibility and stability of the graphics card.

[0004] However, the existing connection method between the power supply PCB and the motherboard has certain limitations. Usually, this connection method uses bolts for fixed installation. During the assembly process, if errors occur, such as inaccurate bolt positions or inaccurate alignment between the power supply PCB and the motherboard, it may make it difficult to insert the power supply PCB into the PCIe card slot of the motherboard, thereby affecting the installation and use of the graphics card.

[0005] Therefore, in order to solve these problems in the prior art, we propose a graphics card wireless device. Utility Model Content

[0006] The utility model aims to solve the shortcomings of the prior art that the power supply PCB is fixedly installed by bolts, which easily causes assembly errors, and proposes a wireless device for a graphics card.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] Design a graphics card wireless device, including:

[0009] A heat dissipation module with a heat conducting frame;

[0010] and a main PCB and a power supply PCB installed below the heat conducting frame, wherein the power supply PCB is electrically connected to the main PCB;

[0011] Among them, a plurality of floating structures are distributed between the power supply PCB and the heat-conducting frame, and the power supply PCB is connected and fixed to the heat-conducting frame through the floating structures.

[0012] Further, the floating structure includes a first flexible member embedded in the heat-conducting frame, and a second flexible member embedded in the power supply PCB;

[0013] A fastener connected to the first flexible member is provided through the second flexible member.

[0014] Furthermore, the first flexible member and the second flexible member are both configured as T-shaped structures;

[0015] Through holes for at least partially passing the first flexible member and the second flexible member are provided on the end surfaces of the heat conducting frame and the power supply PCB.

[0016] Furthermore, a support ring is sleeved on the outer side of the first flexible member facing the end of the second flexible member, and the support ring is in contact with the power supply PCB.

[0017] Furthermore, the first flexible member and the second flexible member are silicone members.

[0018] Furthermore, conductive seats are installed on both the power supply PCB and the main PCB, and the two conductive seats are electrically connected via an electrical connector.

[0019] Furthermore, it also includes an upper cover installed above the heat dissipation module;

[0020] A plurality of holes are provided on the end surface of the upper cover, fans are fixedly installed in the holes, and the fans are electrically connected to the main PCB.

[0021] Furthermore, a main back plate and a secondary back plate are respectively covered on the lower sides of the main PCB and the power supply PCB, the main PCB is fixedly connected to the heat conducting frame via a locking member, and the secondary back plate is detachably connected to the heat dissipation module.

[0022] Furthermore, a plurality of magnets are distributed on the opposite surfaces of the secondary back plate and the heat dissipation module, and two opposite magnets are magnetically adsorbed.

[0023] Furthermore, an avoidance groove is provided at the bottom of the heat dissipation module, a bracket is fixedly connected in the avoidance groove, and the bracket contacts the middle part of the secondary back plate.

[0024] The utility model proposes a graphics card wireless device, which has the beneficial effects of: in the utility model, a floating structure design is adopted to realize that the power supply PCB can be offset left and right to eliminate the tolerances of various parts in processing and assembly, and at the same time, a small range of alignment errors with the motherboard PCIE card slot can be adapted to optimize the convenience of assembly; secondly, the main backplane and the auxiliary backplane are both designed with a detachable structure, and the two backplanes can be detached separately without affecting the performance of the heat dissipation module, so as to improve the convenience of inspection and cleaning of the inside of the graphics card, thereby improving the convenience of after-sales maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a three-dimensional diagram of the utility model;

[0026] Figure 2 The explosion structure of the utility model is shown in FIG. Figure 1 ;

[0027] Figure 3 This is a schematic diagram of the structure of the electrical connector of the utility model;

[0028] Figure 4 The explosion structure of the utility model is shown in FIG. Figure 2 ;

[0029] Figure 5 It is a structural schematic diagram of the floating structure of the utility model.

[0030] In the figure: 1. heat dissipation module; 11. heat conduction frame; 12. avoidance slot; 13. bracket; 2. main PCB; 3. power supply PCB; 4. floating structure; 41. first flexible part; 42. second flexible part; 43. fastener; 44. support ring; 5. conductive seat; 6. electrical connector; 7. upper cover; 71. fan; 8. main back plate; 9. auxiliary back plate; 91. magnet. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0032] Reference Figure 1-5 This is an embodiment of the utility model, which discloses a graphics card wireless device. Specifically, the device includes a heat dissipation module 1 with a heat conduction frame 11. The heat dissipation module 1 includes two heat dissipation fins and a heat conduction copper pipe connected between the two heat dissipation fins. The specific structure is a conventional method for technicians in the relevant field, and will not be described in detail here.

[0033] and a main PCB2 and a power supply PCB3 installed under the heat conducting frame 11, wherein the power supply PCB3 is electrically connected to the main PCB2 and is used to connect to the motherboard socket, so as to realize power supply to the main PCB2, so as to achieve a wireless effect without wiring, thereby improving the convenience of power supply to the graphics card and the overall aesthetics;

[0034] A plurality of floating structures 4 are distributed between the power supply PCB 3 and the heat-conducting frame 11 , and the power supply PCB 3 is connected and fixed to the heat-conducting frame 11 via the floating structures 4 .

[0035] Specifically, in this embodiment, the floating structure 4 is designed to achieve that the power supply PCB 3 can be offset left and right to eliminate the tolerances of various processing and assembly parts, and at the same time, it can adapt to the alignment error with the motherboard PCIE card slot in a small range to optimize assembly convenience.

[0036] Reference Figure 5 In some embodiments, the floating structure 4 in the present utility model includes a first flexible member 41 embedded in the heat-conducting frame 11, and a second flexible member 42 embedded in the power supply PCB 3;

[0037] A fastener 43 connected to the first flexible member 41 is provided in the second flexible member 42. Preferably, the fastener 43 in this embodiment is a bolt, which is provided in the second flexible member 42 and is threadedly connected to the first flexible member 41. Obviously, both the first flexible member 41 and the second flexible member 42 should have a through hole, and a threaded portion is provided in the through hole of the second flexible member 42.

[0038] Reference Figure 5 On the basis of the above embodiment, in this embodiment, the first flexible member 41 and the second flexible member 42 are both configured as T-shaped structures. In addition, the first flexible member 41 and the second flexible member 42 are silicone members;

[0039] That is, the first flexible member 41 and the second flexible member 42 described in this embodiment are both configured as T-shaped rubber rings, and the power supply PCB 3 can be offset left and right by a small distance after installation by means of the deformation ability of the silicone rubber;

[0040] The end surfaces of the heat-conducting frame 11 and the power supply PCB3 are provided with through holes for at least partially passing the first flexible member 41 and the second flexible member 42, and the stopping portion of the T-shaped rubber ring is stopped on the end surfaces of the heat-conducting frame 11 and the power supply PCB3, and the above-mentioned at least part is the extended portion of the T-shaped rubber ring.

[0041] Reference Figure 5Furthermore, in the embodiment of the utility model, a support ring 44 is sleeved on the outer side of the first flexible member 41 toward the end of the second flexible member 42, and the support ring 44 is in contact with the power supply PCB3. Of course, the support ring 44 described in this embodiment is also set as a silicone ring, which is sleeved on the outer side of the extended part of the first flexible member 41 to support the power supply PCB3 and the heat conducting frame 11, so as to improve the installation stability of the power supply PCB3.

[0042] Reference Figure 2 , 4 In a preferred embodiment, the power supply PCB3 and the main PCB2 in the utility model are both equipped with a conductive seat 5, and the two conductive seats 5 are electrically connected through an electrical connector 6. The electrical connector 6 is plugged between the two conductive seats 5 to achieve electrical conduction. The specific structure of the electrical connector 6 and the conductive seat 5 is also the prior art, such as the connection method through a pin needle and a pin needle seat. Of course, in order to adapt to the small distance left and right movement of the power supply PCB3, the middle part of the electrical connector 6 described in this embodiment should have a flexible part to ensure the mobility of the power supply PCB3.

[0043] In addition, the utility model also includes an upper cover 7 installed above the heat dissipation module 1; there are a plurality of holes on the end surface of the upper cover 7, and fans 71 are fixedly installed in the holes. The fans 71 are electrically connected to the main PCB 2. In a preferred embodiment, three fans 71 are provided in the utility model, which are used to dissipate heat from the heat dissipation module 1 to ensure the stability of the operation. This method is a conventional means used by people in the field and will not be elaborated here.

[0044] Reference Figure 2 , 4 In some embodiments, in the utility model, the lower sides of the main PCB2 and the power supply PCB3 are respectively covered with a main backplane 8 and a sub-backplane 9, the main PCB2 is fixedly connected to the heat conducting frame 11 through a locking member, and the sub-backplane 9 is detachably connected to the heat dissipation module 1. Specifically, the locking member described in this embodiment is also configured as a bolt member, and the bolt member fixes the main backplane 8 under the main PCB2 to achieve protection. The sub-backplane 9 adopts a detachable connection method, which can realize the installation and disassembly and maintenance of the inner power supply PCB3, and realize the quick disassembly and assembly of the sub-backplane 9 without screw fixation.

[0045] Reference Figure 2 , 4On the basis of the above-mentioned embodiment, in this embodiment, a plurality of magnets 91 are distributed on the opposite surfaces of the sub-back plate 9 and the heat dissipation module 1, and the two opposite magnets 91 are magnetically adsorbed. Preferably, there are four magnet 91 matrix parts in this embodiment, and the magnet 91 is a ring structure, so that it can be installed and fixed with the help of bolts during installation. By adopting the adsorption method of the magnet 91, the sub-back plate 9 can be conveniently installed, thereby improving the convenience of after-sales maintenance.

[0046] Reference Figure 2 It should be noted that, in this embodiment, there is an avoidance slot 12 at the bottom of the heat dissipation module 1, and the avoidance slot 12 is used to avoid the position of each component to ensure the heat dissipation capacity while reducing the overall thickness of the graphics card. In addition, a bracket 13 is fixedly connected to the avoidance slot 12, and the bracket 13 is in contact with the middle part of the sub-back plate 9. The design of the bracket 13 is used to support the sub-back plate 9 to avoid the problem that the middle part of the sub-back plate 9 is prone to deformation due to long-term lack of support.

[0047] In summary, the utility model adopts the design of a floating structure 4 to achieve the power supply PCB3 being able to shift left and right to eliminate the tolerances of various parts in processing and assembly, and at the same time can adapt to the alignment error with the motherboard PCIE card slot in a small range to optimize the convenience of assembly. Secondly, the main backplane 8 and the auxiliary backplane 9 both adopt a detachable structure design. The two backplanes can be detached separately without affecting the performance of the heat dissipation module, so as to improve the convenience of inspection and cleaning of the internal part of the graphics card, thereby improving the convenience of after-sales maintenance.

[0048] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A graphics card wireless device, characterized in that: include: A heat dissipation module (1) having a heat conducting frame (11); and a main PCB (2) and a power supply PCB (3) installed below the heat conducting frame (11), wherein the power supply PCB (3) is electrically connected to the main PCB (2); A plurality of floating structures (4) are distributed between the power supply PCB (3) and the heat-conducting frame (11), and the power supply PCB (3) is connected and fixed to the heat-conducting frame (11) via the floating structures (4).

2. A graphics card wireless device according to claim 1, characterized in that: The floating structure (4) comprises a first flexible member (41) embedded in the heat-conducting frame (11), and a second flexible member (42) embedded in the power supply PCB (3); A fastener (43) connected to the first flexible member (41) is provided through the second flexible member (42).

3. A graphics card wireless device according to claim 2, characterized in that: The first flexible member (41) and the second flexible member (42) are both configured as T-shaped structures; Through holes are provided on the end surfaces of the heat-conducting frame (11) and the power supply PCB (3), through which the first flexible member (41) and the second flexible member (42) are at least partially inserted.

4. A graphics card wireless device according to claim 2, characterized in that: A support ring (44) is also sleeved on the outer side of the first flexible member (41) facing the end of the second flexible member (42), and the support ring (44) is in contact with the power supply PCB (3).

5. A graphics card wireless device according to any one of claims 2 to 4, characterized in that: The first flexible member (41) and the second flexible member (42) are silicone members.

6. A graphics card wireless device according to any one of claims 1 to 4, characterized in that: Conductive seats (5) are installed on both the power supply PCB (3) and the main PCB (2), and the two conductive seats (5) are electrically connected via an electrical connector (6).

7. A graphics card wireless device according to claim 1, characterized in that: It also includes an upper cover (7) installed above the heat dissipation module (1); A plurality of holes are provided on the end surface of the upper cover (7), fans (71) are fixedly installed in the holes, and the fans (71) are electrically connected to the main PCB (2).

8. The graphics card wireless device according to claim 1, characterized in that: A main back plate (8) and a secondary back plate (9) are respectively covered on the lower sides of the main PCB (2) and the power supply PCB (3); the main PCB (2) is fixedly connected to the heat-conducting frame (11) via a locking member; and the secondary back plate (9) is detachably connected to the heat dissipation module (1).

9. A graphics card wireless device according to claim 8, characterized in that: A plurality of magnets (91) are distributed on the opposing surfaces of the secondary back plate (9) and the heat dissipation module (1), and two opposing magnets (91) are magnetically attracted to each other.

10. The wireless device for displaying a graphics card according to claim 8, characterized in that: A relief groove (12) is provided at the bottom of the heat dissipation module (1), a bracket (13) is fixedly connected in the relief groove (12), and the bracket (13) is in contact with the middle of the secondary back plate (9).

Citation Information

Cited By

  • Automatic labeling and capping equipment for fan

    CN223990260U

  • Automatic lettering and loading equipment for fan

    CN223990556U