Wafer bonding energy testing equipment

Abstract

The utility model relates to wafer bonding energy testing equipment, which comprises a shell, a wafer bearing platform, a slotting tool assembly, a camera and a protective cover, and is characterized in that the wafer bearing platform is fixedly arranged on the upper surface of the shell and is used for supporting and adsorbing wafer pairs to be tested; the slotting tool assembly is fixedly arranged on the upper surface of the shell and is spaced from the wafer bearing platform in the first direction; the slotting tool assembly comprises a driving part, the driving part is fixedly arranged on the shell, and a blade is fixedly arranged at the power output end of the driving part; the camera is positioned above the wafer bearing platform and is used for acquiring an image of a crack generated when the blade is inserted into the bonding position of the wafer pair to be detected; and the protective cover is made of a transparent material, is pivoted to the upper surface of the shell, and can be opened or shielded above the slotting tool assembly. According to the wafer bonding performance testing equipment provided by the utility model, the turnover protective cover is arranged, so that the blade is prevented from moving to scratch an operator; and the protective cover is made of a transparent material, so that the camera is not influenced to collect crack images, and the bonding energy can be analyzed conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer bonding energy testing device. Background Art

[0002] With the continuous development of the semiconductor industry, the demand for the integration and performance of ultra-large-scale integrated circuits has gradually increased to adapt to the trend of various electronic products becoming smaller and smaller and more powerful. Along with the gradual enhancement of chip functions and the gradual increase in integration, the technical requirements for various links in the process are getting higher and higher. The integration of transistors in the chip has gradually reached its upper limit, so 3D integrated circuit (IC) technology has emerged. 3D integrated circuit (IC) is defined as a system-level integrated structure. 3D integrated circuits realize vertical interconnection between multiple chips through bonding process, increase the space of the chip, improve the integration of transistors, and at the same time increase the working speed of the integrated circuit and reduce the power consumption of the integrated circuit. In this regard, in three-dimensional chip technology, it is necessary to test the interface bonding strength of the bonded wafers, which is of great significance to the subsequent process and final product performance.

[0003] Wafer bonding technology refers to the process of tightly bonding two mirror-polished homogeneous or heterogeneous wafers by chemical and physical action. After the wafers are bonded, the atoms on the interface react under the action of external forces to form covalent bonds to form a whole, and the bonding interface reaches a specific bonding strength. Due to the importance of bonding energy testing, the market demand for bonding energy testing equipment is gradually increasing, and higher requirements are put forward for the safety of the test equipment. Utility Model Content

[0004] The utility model provides a wafer bonding energy testing device, which is used to solve the technical problem in the prior art that the bonding device lacks a protective structure and operators are easily injured.

[0005] The utility model provides a wafer bonding energy testing device, comprising:

[0006] case;

[0007] A wafer carrying platform, which is fixedly mounted on the upper surface of the housing and is used to support and absorb the wafer pair to be tested;

[0008] A knife inserter assembly is fixedly mounted on the upper surface of the housing and is spaced apart from the wafer carrying platform along a first direction; the knife inserter assembly comprises a driving component, the driving component is fixedly mounted on the housing, a blade is fixedly mounted on a power output end of the driving component, and the blade can be driven to insert into the bonding position of the wafer pair to be tested to detect the bonding energy of the wafer pair to be tested;

[0009] a camera, located above the wafer carrying platform, for collecting images of cracks generated when the blade is inserted into the bonding position of the wafer pair to be tested; and

[0010] The protective cover is made of a transparent material and is pivotally connected to the upper surface of the shell, and can be opened or covered above the inserting blade assembly.

[0011] The utility model provides a wafer bonding energy testing device. By arranging a reversible protective cover above a knife inserting assembly, on the one hand, when the protective cover blocks the top of the knife inserting assembly, it prevents the blade from moving and scratching the operator, thereby improving the use safety of the wafer bonding energy testing device; on the other hand, the protective cover is set to be a transparent material, which does not affect the camera to collect the image of the crack generated by the blade inserting the bonding position of the wafer pair to be tested, thereby facilitating the analysis of the size of the bonding energy.

[0012] Furthermore, the shell has a cavity, a light source is arranged in the cavity; an opening is arranged on the upper surface of the shell, the positions of the opening, the light source and the camera correspond, and the opening is used to pass the light emitted by the light source. In this way, the light source makes the crack image clearly displayed in the field of view of the camera, providing a basis for analyzing the size of the bonding energy.

[0013] Furthermore, a vacuum pipeline is provided in the cavity, and a pressure regulating valve, a control valve and an electronic pressure gauge are provided on the vacuum pipeline in sequence, one end of the vacuum pipeline is connected to an external gas source, and the other end is connected to a vacuum adsorption groove of the wafer supporting platform, and the electronic pressure gauge is fixed to the side wall of the shell. In this way, the vacuum pipeline is arranged in the cavity, which improves the aesthetics of the bonding energy testing equipment.

[0014] Furthermore, a driver and a DC power supply are provided in the cavity, the driver is electrically connected to the driving component; the DC power supply is electrically connected to the light source, the driver and / or the electronic pressure gauge respectively. In this way, the driver and the DC power supply are provided in the cavity, which improves the aesthetics of the bonding energy testing device.

[0015] Furthermore, a light source control button is provided on the side wall of the housing, and the light source control button is electrically connected to the light source and is used to control the light source to be turned on or off or to adjust the brightness of the light source;

[0016] And / or, a side wall surface of the shell is provided with an adsorption button and a pressure regulating button, the adsorption button is connected to the control valve and is used to adsorb the wafer pair to be tested on the wafer supporting platform; the pressure regulating button is connected to the pressure regulating valve and is used to adjust the vacuum pressure value of the vacuum pipeline;

[0017] And / or, a driver control button is provided on the side wall of the shell, and the driver control button is electrically connected to the driver and is used to power on or off the driving component.

[0018] The utility model provides a wafer bonding energy testing device, which arranges a DC power supply, a driver, etc. in a cavity and arranges a button on the side wall of a shell. On the one hand, the internal space of the device is fully utilized, the device is miniaturized, the integration is high, and the floor space is reduced; on the other hand, it is convenient for operators to perform tests.

[0019] Furthermore, a fan is provided on the side wall of the housing, and the fan is electrically connected to the DC power supply. In this way, the fan is used to dissipate heat from the light source and the electrical components in the cavity, thereby reducing the temperature inside the cavity.

[0020] Furthermore, a communication interface is provided on the side wall of the housing, one end of the communication interface is electrically connected to the driver, and the other end is used to be electrically connected to an industrial computer;

[0021] And / or, the side wall surface of the shell is further provided with a vacuum air path interface, and the vacuum air path is connected to the external air source through the vacuum air path interface;

[0022] And / or, a side wall surface of the housing is further provided with a device power interface, and the DC power supply is electrically connected to the device power interface;

[0023] And / or, a side wall surface of the shell is also provided with a camera network port, one end of the camera network port is electrically connected to the camera, and the other end is electrically connected to the industrial computer.

[0024] The utility model provides a wafer bonding energy testing device, which is convenient for transferring the device and changing the placement position, thereby improving the flexibility of device use by arranging a communication interface, a camera network port, a vacuum air circuit interface and a device power supply interface on the side wall of the shell.

[0025] Furthermore, the wafer carrying platform is provided with a wafer positioning assembly, which is used to position the wafer pair to be tested; the wafer positioning assembly includes: a positioning block, which has two and is spaced apart along the second direction, and a guide slope is provided on one side adjacent to the two positioning blocks, and the guide slope is used to guide the wafer pair to be tested to be placed on the wafer carrying platform; and a positioning pin, which is spaced apart from the positioning block along the first direction, and has two and is spaced apart along the second direction; wherein the first direction and the second direction are perpendicular to each other. In this way, the positioning block and the positioning pin confine the wafer pair to be tested within the positioning area.

[0026] Further, the driving component includes a first driving member and a second driving member;

[0027] The housing is provided with a base, and the first driving member is mounted on the base;

[0028] The inserting blade assembly comprises: a first slide, which is slidably connected to the base, the first slide is connected to the power output end of the first driving member, and is used to drive the first slide to drive the blade to move along the first direction so that the blade is inserted into the bonding position of the wafer pair to be tested; a pressure sensor is provided between the first driving member and the first slide, and is used to detect the pressure value of the blade inserted into the bonding position of the wafer pair to be tested; the first slide is slidably connected to the second slide, the blade is fixed on the second slide, the second slide is connected to the second driving member, the second driving member is installed on the first slide, and the second driving member is used to drive the second slide to drive the blade to move along the third direction so that the blade and the bonding position of the wafer pair to be tested are at the same height;

[0029] Wherein, the third direction is perpendicular to the first direction.

[0030] The utility model provides a wafer bonding energy testing device, which realizes the insertion of the blade into the bonding position of the wafer pair to be tested by arranging a first driving member to drive the first slide to drive the blade forward or backward; and by arranging a second driving member to drive the second slide to drive the blade to rise and fall, and adjust the height of the blade so that the blade is flush with the bonding interface of the wafer pair to be tested, thereby improving the accuracy of the wafer bonding energy test; on the other hand, it can adapt to wafer pairs to be tested of different thicknesses, and improve the practicability of the device; in addition, by arranging a pressure sensor, it is convenient to detect the pressure value of the blade inserted into the wafer pair to be tested, and judge whether the blade is normally inserted into the bonding position of the wafer pair to be tested based on the pressure value.

[0031] Furthermore, a camera supporting assembly is provided on the shell, and the camera is installed on the camera supporting assembly.

[0032] Furthermore, the camera support assembly includes a first support rod and a second support rod perpendicular to each other, the lower end of the first support rod is fixed to the shell, the second support rod is connected to the first support rod, and the camera is arranged on the second support rod.

[0033] Further, the camera support assembly further comprises a first clamping seat, the first clamping seat comprises a first clamping hole and a second clamping hole, the first support rod is slidably connected to the first clamping hole, and the second support rod is slidably connected to the second clamping hole;

[0034] And / or, the camera support assembly further comprises a second clamping seat, the second clamping seat is slidably connected to the second support rod, and the camera is fixed to the second clamping seat. Such an arrangement facilitates the adjustment of the position of the camera.

[0035] Furthermore, a vertical plate is fixedly provided on the upper surface of the shell, and the protective cover is pivotally connected to the upper end of the vertical plate;

[0036] And / or, the housing is provided with a handle;

[0037] And / or, a foot is provided at the lower end of the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A schematic diagram of the assembly of a wafer bonding energy testing device provided by an embodiment of the utility model;

[0039] Figure 2 A schematic diagram of the interior of a cavity of a wafer bonding energy testing device provided by an embodiment of the utility model;

[0040] Figure 3 A schematic diagram of a protective cover in a wafer bonding energy testing device provided by an embodiment of the utility model;

[0041] Figure 4 An axial schematic diagram of a wafer bonding energy testing device provided by an embodiment of the utility model;

[0042] Figure 5 A schematic diagram of the structure of a wafer carrying platform in a wafer bonding energy testing device provided by an embodiment of the utility model;

[0043] Figure 6 A schematic diagram of the structure of a blade assembly in a wafer bonding energy testing device provided by an embodiment of the utility model;

[0044] Description of reference numerals:

[0045] 1. Shell; 2. Wafer carrying platform; 21. Vacuum adsorption groove; 22. Wafer positioning assembly; 221. Positioning block; 222. Positioning pin; 3. Wafer pair to be tested; 4. Base; 5. Insertion knife assembly; 50. Blade; 51. First driving member; 52. Second driving member; 53. First slide; 54. Pressure sensor; 55. Second slide; 6. Camera support assembly; 61. First support rod; 62. Second support rod; 63. First clamping seat; 64. Second clamping seat; 7. Camera; 8. Vertical plate; 9. Anti-static Protective cover; 10. Cavity; 101. Light source; 102. Driver; 103. DC power supply; 104. Electronic terminal board; 110. First side wall; 111. Main control button; 112. Light source control button; 113. Adsorption button; 114. Voltage adjustment button; 115. Driver control button; 116. Fan; 117. Electronic pressure gauge; 120. Second side wall; 121. Communication interface; 122. Vacuum air circuit interface; 123. Equipment power interface; 124. Camera network port; 13. Handle. DETAILED DESCRIPTION

[0046] In order to make the above-mentioned purpose, features and advantages of the present invention more obvious and easy to understand, the following is a brief description of the present invention in conjunction with the attached Figure 1-6 The specific embodiments of the present utility model are described in detail.

[0047] In the present invention, the terms "connection" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated structure.

[0048] In the present invention, terms such as "inside", "outside", "upper" and "lower" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present invention.

[0049] The present invention provides a wafer bonding energy testing device, see attached Figure 1The wafer bonding energy testing device comprises a housing 1, a wafer carrying platform 2, a knife assembly 5, a camera 7 and a protective cover 9. The wafer carrying platform 2 is fixedly arranged on the upper surface of the housing 1, and is used to support and adsorb the wafer pair 3 to be tested; the knife assembly 5 is fixedly arranged on the upper surface of the housing 1 and is spaced from the wafer carrying platform 2 along a first direction; the knife assembly 5 comprises a driving component, the driving component is fixedly arranged on the housing 1, and a blade 50 is fixedly arranged at the power output end of the driving component, which can drive the blade 50 to be inserted into the bonding position of the wafer pair 3 to be tested to detect the bonding energy of the wafer pair 3 to be tested; the camera 7 is located above the wafer carrying platform 2, and is used to collect images of cracks generated by the blade 50 inserted into the bonding position of the wafer pair 3 to be tested; and the protective cover 9 is made of transparent material and is pivotally connected to the upper surface of the housing 1, and can be opened or blocked above the knife assembly 5.

[0050] It should be noted that, before the inserting blade assembly 5 is actuated, the protective cover 9 is flipped to a horizontal state so that the protective cover 9 covers the top of the inserting blade assembly 5 to prevent the blade 50 from scratching the operator when the driving component drives the blade 50 to move.

[0051] It should be noted that when a blade 50 is inserted into the wafer pair 3 to be tested for wafer bonding energy testing, when a blade 50 with a certain thickness is inserted into the bonding position of the wafer pair 3 to be tested, the bonding interface near the blade 50 is peeled off from each other to form a crack. From the direction perpendicular to the wafer surface, the crack presents a fan-like shape extending from the edge to the center of the bonding interface; and due to the entry of air, there is a clear boundary between the area corresponding to the entire crack and the bonding interface that has not been peeled off. The greater the bonding energy, the smaller the maximum distance between the front end of the blade 50 and the boundary of the crack area should be, that is, the smaller the degree of expansion of the crack area to the center of the bonding interface; conversely, the maximum distance between the front end of the blade 50 and the boundary of the crack area should be greater.

[0052] The embodiment of the utility model provides a wafer bonding energy testing device. By setting a reversible protective cover 9 above the inserter assembly 5, on the one hand, when the protective cover 9 blocks the inserter assembly 5, it prevents the blade 50 from moving and scratching the operator, thereby improving the safety of the wafer bonding energy testing device. On the other hand, the protective cover 9 is set to be a transparent material, which does not affect the camera 7 to collect the image of the crack generated by the blade 50 inserted into the bonding position of the wafer pair 3 to be tested, which is convenient for analyzing the size of the bonding energy.

[0053] In the embodiment of the utility model, the housing 1 has a cavity 10, and a light source 101 is arranged in the cavity 10; an opening is arranged on the upper surface of the housing 1, and the positions of the opening, the light source 101 and the camera 7 correspond to each other, and the opening is used to pass the light emitted by the light source 101. In this way, the light source 101 makes the crack image clearly displayed in the field of view of the camera 7, providing a basis for analyzing the size of the bonding energy.

[0054] In the embodiment of the utility model, a vacuum pipeline is provided in the cavity 10, and a pressure regulating valve, a control valve and an electronic pressure gauge 117 are provided on the vacuum pipeline in sequence. One end of the vacuum pipeline is connected to an external gas source, and the other end is connected to the vacuum adsorption groove 21 of the wafer supporting platform 2. The electronic pressure gauge 117 is fixedly mounted on the side wall of the housing 1. In this way, the vacuum pipeline is arranged in the cavity 10, which improves the aesthetics of the bonding energy testing equipment.

[0055] It should be noted that the pressure regulating valve is used to adjust the air pressure value of the vacuum pipeline that adsorbs the wafer pair 3 to be tested, and the air pressure value range is between -80KPa and -60KPa; the control valve is used to control the on-off of the vacuum pipeline and the external gas source; the electronic pressure gauge 117 is used to display the air pressure value of the vacuum pipeline, so as to determine whether the wafer pair 3 to be tested is firmly adsorbed.

[0056] See attached Figure 2 In the embodiment of the utility model, a driver 102 and a DC power supply 103 are arranged in the cavity 10, and the driver 102 is electrically connected to the driving component; the DC power supply 103 is electrically connected to the light source 101, the driver 102 and / or the electronic pressure gauge 117. In this way, the driver 102 and the DC power supply 103 are arranged in the cavity 10, which improves the aesthetics of the bonding energy test device.

[0057] See attached Figure 2 In the embodiment of the utility model, a terminal board 104 is further provided in the cavity 10 , and the DC power supply 103 is electrically connected to the light source 101 , the driver 102 and / or the electronic pressure gauge 117 through the terminal board 104 .

[0058] See attached Figure 3 In the embodiment of the utility model, a main control button 111 is provided on the side wall of the housing 1 , and the main control button 111 is electrically connected to the DC power supply 103 .

[0059] See attached Figure 3 In the embodiment of the utility model, a light source control button 112 is provided on the side wall of the housing 1 , and the light source control button 112 is electrically connected to the light source 101 for controlling the light source 101 to be turned on or off or adjusting the brightness of the light source 101 .

[0060] See attached Figure 3 In the embodiment of the utility model, the side wall of the shell 1 is provided with an adsorption button 113 and a pressure regulating button 114. The adsorption button 113 is connected to the control valve and is used to adsorb the wafer pair 3 to be tested on the wafer supporting platform 2; the pressure regulating button 114 is connected to the pressure regulating valve and is used to adjust the vacuum pressure value of the vacuum pipeline.

[0061] See attached Figure 3In the embodiment of the utility model, a driver control button 115 is provided on the side wall of the housing 1. The driver control button 115 is electrically connected to the driver 102 and is used to power on or off the driver component.

[0062] The embodiment of the utility model provides a wafer bonding energy testing device, which arranges a DC power supply 103, a driver 102, etc. in a cavity 10, and arranges a button on the side wall of a shell 1. On the one hand, the internal space of the device is fully utilized, the device is miniaturized, the integration is high, and the floor space is reduced; on the other hand, it is convenient for operators to perform tests.

[0063] See attached Figure 3 In the embodiment of the utility model, the side wall of the housing 1 is further provided with a fan 116, and the fan 116 is electrically connected to the DC power supply 103. In this way, the fan 116 is used to dissipate heat from the light source 101 and the electrical components in the cavity 10, thereby reducing the internal temperature of the cavity 10.

[0064] See attached Figure 3 In the embodiment of the utility model, the housing 1 includes a first side wall surface 110 , and a main control button 111 , a light source control button 112 , an adsorption button 113 , a voltage adjustment button 114 and a driver control button 115 are all disposed on the first side wall surface 110 .

[0065] See attached Figure 4 In the embodiment of the utility model, the side wall of the housing 1 is further provided with a communication interface 121, one end of the communication interface 121 is electrically connected to the driver 102, and the other end is used to be electrically connected to the industrial computer.

[0066] See attached Figure 4 In the embodiment of the utility model, the side wall of the shell 1 is further provided with a vacuum air path interface 122, and the vacuum air path is connected to the external air source through the vacuum air path interface 122.

[0067] See attached Figure 4 In the embodiment of the utility model, the side wall of the housing 1 is further provided with a device power interface 123 , and the DC power supply 103 is electrically connected to the device power interface 123 .

[0068] See attached Figure 4 In the embodiment of the utility model, the side wall of the housing 1 is further provided with a camera network port 124, one end of the camera network port 124 is electrically connected to the camera 7, and the other end is electrically connected to the industrial computer.

[0069] A wafer bonding energy testing device provided by an embodiment of the utility model has a communication interface, a camera network port 124, a vacuum air circuit interface 122 and a device power interface 123 on the side wall of the shell 1, which facilitates the transfer of the device and changes in the placement position, thereby improving the flexibility of the device.

[0070] See attached Figure 4 In an embodiment of the utility model, the shell 1 includes a second side wall 120 , the second side wall 120 is adjacent to the first side wall 110 , and the communication interface 121 , the camera network port 124 , the vacuum air circuit interface 122 and the device power interface 123 are all arranged on the second side wall 120 .

[0071] See attached Figure 5 In the embodiment of the utility model, the wafer carrying platform 2 is provided with a wafer positioning assembly 22, which is used to position the wafer pair 3 to be tested; the wafer positioning assembly 22 includes a positioning block 221 and a positioning pin 222, the positioning block 221 has two and is spaced apart along the second direction, and the adjacent side of the two positioning blocks 221 has a guiding slope, and the guiding slope is used to guide the wafer pair 3 to be tested to be placed on the wafer carrying platform 2; and the positioning pin 222 is spaced apart from the positioning block 221 along the first direction, and the positioning pin 222 has two and is spaced apart along the second direction; wherein the first direction and the second direction are perpendicular to each other. In this way, the positioning block 221 and the positioning pin 222 confine the wafer pair 3 to be tested within the positioning area.

[0072] See attached Figure 6 In the embodiment of the utility model, the driving component includes a first driving component 51 and a second driving component 52, the housing 1 is provided with a base 4, and the first driving component 51 is installed on the base 4; the inserting blade assembly 5 includes a first slide 53 slidably connected to the base 4, the first slide 53 is connected to the power output end of the first driving component, and is used to drive the first slide 53 to drive the blade 50 to move along the first direction so that the blade 50 is inserted into the bonding position of the wafer pair 3 to be tested; a pressure sensor 54 is provided between the first driving component 51 and the first slide 53, and is used to detect the pressure value of the blade 50 inserted into the bonding position of the wafer pair 3 to be tested; the first slide 53 is slidably connected to the second slide 55, the blade 50 is fixed on the second slide 55, the second slide 55 is connected to the second driving component 52, the second driving component 52 is installed on the first slide 53, and the second driving component 52 is used to drive the second slide 55 to drive the blade 50 to move along the third direction so that the blade 50 and the bonding position of the wafer pair 3 to be tested are at the same height; wherein the third direction is perpendicular to the first direction.

[0073] It should be noted that the first driving component is a motor or an electric push rod, and the second driving component is a manual drive or a motor or an electric push rod.

[0074] A wafer bonding energy testing device provided by an embodiment of the utility model, wherein a first driving member 51 is arranged to drive a first slide 53 to drive a blade 50 to move forward or backward, so that the blade 50 is inserted into the bonding position of the wafer pair 3 to be tested; a second driving member 52 is arranged to drive a second slide 55 to drive the blade 50 to rise and fall, and the height of the blade 50 is adjusted so that the blade 50 is flush with the bonding interface of the wafer pair 3 to be tested, thereby improving the accuracy of the wafer bonding energy test; on the other hand, it can adapt to wafer pairs 3 to be tested of different thicknesses, thereby improving the practicability of the device; in addition, by arranging a pressure sensor 54, it is convenient to detect the pressure value of the blade 50 inserted into the wafer pair 3 to be tested, and judge whether the blade 50 is normally inserted into the bonding position of the wafer pair 3 to be tested based on the pressure value.

[0075] See attached Figure 3 In the embodiment of the utility model, a camera supporting assembly 6 is provided on the housing 1 , and a camera 7 is installed on the camera supporting assembly 6 .

[0076] See attached Figure 3 In the embodiment of the utility model, the camera support assembly 6 includes a first support rod 61 and a second support rod 62 which are perpendicular to each other. The lower end of the first support rod 61 is fixed to the housing 1, the second support rod 62 is connected to the first support rod 61, and the camera 7 is fixed to the second support rod 62.

[0077] See attached Figure 3 In the embodiment of the utility model, the camera support assembly 6 further includes a first clamping seat 63, the first clamping seat 63 includes a first clamping hole and a second clamping hole, the first support rod 61 is slidably connected to the first clamping hole, and the second support rod 62 is slidably connected to the second clamping hole. This arrangement facilitates the adjustment of the position of the camera 7.

[0078] See attached Figure 3 In the embodiment of the utility model, the camera support assembly 6 further includes a second clamping seat 64, the second clamping seat 64 is slidably connected to the second support rod 62, and the camera 7 is fixed to the second clamping seat 64. Such a configuration facilitates the adjustment of the position of the camera 7.

[0079] See attached Figure 1 In the embodiment of the utility model, a vertical plate 8 is fixedly provided on the upper surface of the housing 1 , and a protective cover 9 is pivotally connected to the upper end of the vertical plate 8 .

[0080] See attached Figure 3 In the embodiment of the utility model, the housing 1 is provided with a handle 13. Such a configuration is convenient for carrying.

[0081] See attached Figure 2 In the embodiment of the utility model, the lower end of the housing 1 is provided with a foot 14. Such a setting facilitates leveling of the equipment.

[0082] The working principle of a wafer bonding energy testing device provided by the embodiment of the utility model is as follows:

[0083] (1) The communication interface 121 and the camera network port 124 are electrically connected to the industrial computer respectively; the vacuum air circuit interface 122 is connected to the external air source, and the device power interface 123 is electrically connected to the external power supply;

[0084] (2) Press the main control button 111 to power on the DC power supply 103;

[0085] (3) Press the driver control button 115 to power on the driver component; press the light source control button 112 to power on the light source 101;

[0086] (4) Flip the protective cover 9 to a horizontal state to cover the top of the inserting blade assembly 5;

[0087] (5) placing the wafer pair 3 to be tested on the wafer carrying platform 2 so that the edges of the wafer pair 3 to be tested abut against the positioning pins 222 and the positioning blocks 221;

[0088] (6) Pressing the wafer button causes the wafer pair 3 to be adsorbed onto the wafer carrying platform 2;

[0089] (7) Controlling the driving component through the control software of the industrial computer to drive the inserter to insert into the bonding position of the wafer pair 3 to be tested;

[0090] (8) The camera 7 is controlled by the control software of the industrial computer to collect images of the blade 50 and the cracks generated when the blade 50 is inserted into the bonding position of the wafer pair 3 to be tested, and the bonding energy of the wafer pair 3 to be tested is calculated based on the images;

[0091] (9) Press the adsorption button 113 again to release the vacuum adsorption, remove the tested wafer pair from the wafer supporting platform 2, and complete the wafer bonding energy test.

[0092] A wafer bonding energy testing device provided by an embodiment of the utility model, on the one hand, by providing a protective cover 9, it is prevented that the operator is scratched during the movement of the inserter, thereby improving the safety of the bonding energy testing device; on the other hand, the power supply, the driver 102, the vacuum pipeline, etc. are arranged in the cavity 10, and the button is arranged on the side wall of the shell 1, so as to make full use of the internal space of the device, the device is compact, the test process is simple and fast, and it is convenient for the operator to test; in addition, the side wall of the shell 1 is provided with a communication interface, a camera network port 124, a vacuum air circuit interface 122 and a device power interface 123, which are convenient for the transfer of the device and the change of the placement position, thereby improving the flexibility of the device.

[0093] Although the utility model is disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the scope defined by the claims.

Claims

1. A wafer bonding energy testing device, It is characterized in that include: Housing (1); A wafer carrying platform (2) is fixedly mounted on the upper surface of the housing (1) and is used to support and absorb the wafer pair (3) to be tested; A blade inserter assembly (5) is fixedly mounted on the upper surface of the housing (1) and is spaced apart from the wafer carrying platform (2) along a first direction; the blade inserter assembly (5) comprises a driving component, the driving component is fixedly mounted on the housing (1), a blade (50) is fixedly mounted on a power output end of the driving component, and the blade (50) can be driven to insert into the bonding position of the wafer pair (3) to be tested so as to detect the bonding energy of the wafer pair (3) to be tested; a camera (7), located above the wafer carrying platform (2), for collecting images of cracks generated when the blade (50) is inserted into the bonding position of the wafer pair (3) to be tested; and The protective cover (9) is made of a transparent material and is pivotally connected to the upper surface of the housing (1), and can be opened or covered above the inserting blade assembly (5).

2. The wafer bonding energy testing device according to claim 1, It is characterized in that The housing (1) has a cavity (10), a light source (101) is arranged in the cavity (10); an opening is arranged on the upper surface of the housing (1), the positions of the opening, the light source (101) and the camera (7) correspond to each other, and the opening is used to transmit light emitted by the light source (101); And / or, a vacuum pipeline is provided in the cavity (10), a pressure regulating valve, a control valve and an electronic pressure gauge (117) are provided on the vacuum pipeline in sequence, one end of the vacuum pipeline is connected to an external gas source, and the other end is connected to a vacuum adsorption groove (21) of the wafer supporting platform (2), and the electronic pressure gauge (117) is fixedly mounted on the side wall of the shell (1); And / or, a driver (102) and a direct current power supply (103) are provided in the cavity (10), and the driver (102) is electrically connected to the driving component; and the direct current power supply (103) is electrically connected to the light source (101), the driver (102) and / or the electronic pressure gauge (117), respectively.

3. The wafer bonding energy testing device according to claim 2, It is characterized in that A light source control button (112) is provided on a side wall surface of the housing (1); the light source control button (112) is electrically connected to the light source (101) and is used to control the light source (101) to be turned on or off or to adjust the brightness of the light source (101); And / or, a side wall surface of the housing (1) is provided with an adsorption button (113) and a pressure regulating button (114); the adsorption button (113) is connected to the control valve and is used to adsorb the wafer pair (3) to be tested onto the wafer supporting platform (2); the pressure regulating button (114) is connected to the pressure regulating valve and is used to adjust the vacuum pressure value of the vacuum pipeline; And / or, a driver control button (115) is provided on a side wall surface of the housing (1), and the driver control button (115) is electrically connected to the driver (102) and is used to power on or off the driving component; And / or, a fan (116) is further provided on the side wall surface of the housing (1), and the fan (116) is electrically connected to the DC power supply (103).

4. The wafer bonding energy testing device according to claim 2, It is characterized in that The side wall surface of the housing (1) is also provided with a communication interface (121), one end of the communication interface (121) is electrically connected to the driver (102), and the other end is used to be electrically connected to an industrial computer; And / or, the side wall surface of the housing (1) is further provided with a vacuum air path interface (122), and the vacuum air path is connected to the external air source through the vacuum air path interface (122); And / or, a side wall surface of the housing (1) is further provided with a device power interface (123), and the DC power supply (103) is electrically connected to the device power interface (123); And / or, the side wall surface of the shell (1) is also provided with a camera network port (124), one end of the camera network port (124) is electrically connected to the camera (7), and the other end is electrically connected to the industrial computer.

5. The wafer bonding energy testing device according to claim 1, It is characterized in that The wafer carrying platform (2) is provided with a wafer positioning component (22) for positioning the wafer pair (3) to be tested; the wafer positioning component (22) comprises: two positioning blocks (221) arranged at intervals along the second direction, the two adjacent sides of the positioning blocks (221) having a guiding slope, the guiding slope being used to guide the wafer pair (3) to be tested to be placed on the wafer carrying platform (2); and A positioning pin (222) which is spaced apart from the positioning block (221) along the first direction, and two positioning pins (222) are spaced apart from each other along the second direction; The first direction and the second direction are perpendicular to each other.

6. The wafer bonding energy testing device according to claim 1, It is characterized in that The driving component comprises a first driving member (51) and a second driving member (52); The housing (1) is provided with a base (4), and the first driving member (51) is mounted on the base (4); The inserting blade assembly (5) comprises: a first slide (53) which is slidably connected to the base (4); the first slide (53) is connected to the power output end of the first driving member (51) and is used to drive the first slide (53) to drive the blade (50) to move along the first direction so that the blade (50) is inserted into the bonding position of the wafer pair (3) to be tested; a pressure sensor (54) is provided between the first driving member (51) and the first slide (53) to detect whether the blade (50) is inserted into the wafer pair to be tested. (3); the first slide (53) is slidably connected to a second slide (55), the blade (50) is fixed on the second slide (55), the second slide (55) is connected to the second driving member (52), the second driving member (52) is installed on the first slide (53), and the second driving member (52) is used to drive the second slide (55) to drive the blade (50) to move along the third direction so that the bonding position of the blade (50) and the wafer pair (3) to be tested is at the same height; Wherein, the third direction is perpendicular to the first direction.

7. The wafer bonding energy testing device according to claim 1, It is characterized in that The housing (1) is provided with a camera support assembly (6), and the camera (7) is mounted on the camera support assembly (6).

8. The wafer bonding energy testing device according to claim 7, It is characterized in that The camera support assembly (6) comprises a first support rod (61) and a second support rod (62) which are perpendicular to each other, the lower end of the first support rod (61) is fixed to the housing (1), the second support rod (62) is connected to the first support rod (61), and the camera (7) is arranged on the second support rod (62).

9. The wafer bonding energy testing device according to claim 8, It is characterized in that The camera support assembly (6) further comprises a first clamping seat (63), the first clamping seat (63) comprising a first clamping hole and a second clamping hole, the first support rod (61) being slidably connected to the first clamping hole, and the second support rod (62) being slidably connected to the second clamping hole; And / or, the camera support assembly (6) further comprises a second clamping seat (64), the second clamping seat (64) is slidably connected to the second support rod (62), and the camera (7) is fixedly mounted on the second clamping seat (64).

10. The wafer bonding energy testing device according to claim 1, It is characterized in that A vertical plate (8) is fixedly provided on the upper surface of the housing (1), and the protective cover (9) is pivotally connected to the upper end of the vertical plate (8); And / or, the housing (1) is provided with a handle (13); And / or, a foot (14) is provided at the lower end of the shell (1).

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