Folding rigid-flex board

Abstract

The utility model relates to the technical field of circuit boards, and discloses a foldable rigid-flex board, which comprises a first rigid printed board, a flexible printed board and a second rigid printed board, the first rigid printed board is provided with a first electronic component, and the edge of the first rigid printed board is provided with a plurality of first connecting holes arranged at equal intervals; one or more flexible printed boards are connected with the first rigid printed board, a plurality of second connecting holes corresponding to the first connecting holes in position are formed in the area, connected with the first rigid printed board, of the flexible printed board, and the second rigid printed board is bent to be close to the first electronic element. The second rigid printed board can be folded to any angle according to the installation requirements of circuit design, so that the electronic equipment is suitable for a complex internal space and can be better connected with other circuits, and the internal space of the electronic equipment is greatly saved.

Description

Technical Field

[0001] The utility model relates to the field of circuit board manufacturing, in particular to a foldable hard-flexible combined board. Background Art

[0002] In today's small electronic devices, the use of high-power electronic components has become more and more common due to the increase in performance requirements and technological development. Due to the limitation of internal installation space, it is difficult to install large-sized high-power electronic components on circuit boards. In order to solve this problem, designers usually reduce the performance requirements of the equipment and use multiple low-power electronic components to replace high-power components and install them in series on the circuit board. Although this can reduce the space occupied, it may sacrifice the performance and function of the equipment, so this solution has major defects. Alternatively, more circuit installation space is reserved for installing circuit boards with high-power and large-volume electronic components, but due to the small internal circuit space and complex line installation of electronic equipment (such as detectors and small drones), it is often impossible to design products with limited size.

[0003] Therefore, providing a circuit board for mounting large-volume electronic components on small devices has become an urgent problem to be solved. Utility Model Content

[0004] The main purpose of the utility model is to provide a foldable rigid-flexible board, aiming to solve the technical problem that there is insufficient space to install high-power and large-volume electronic components in small electronic equipment.

[0005] To achieve the above-mentioned purpose, the utility model provides a foldable rigid-flexible board, comprising: a first rigid printed board, a first electronic component is arranged on the first rigid printed board, and a plurality of first connection holes arranged equidistantly are arranged on the edge of the first rigid printed board; a flexible printed board, one or more of the flexible printed boards are connected to the first rigid printed board, and the flexible printed board is provided with a plurality of second connection holes corresponding to the positions of the first connection holes in the area connected to the first rigid printed board, the second connection holes are aligned with the first connection holes, and the first connection holes and the second connection holes after alignment have metallized holes inside, and the first rigid printed board and the flexible printed board are connected by The second rigid printed board is arranged at one end of the flexible printed board away from the first rigid printed board, and the second rigid printed board is provided with a plurality of third connection holes corresponding to the positions of the second connection holes at the connection with the flexible printed board, and the second connection holes are aligned with the third connection holes, and the third connection holes after alignment have metallized holes inside the second connection holes, and the second rigid printed board and the flexible printed board are electrically connected through the metallized holes; the second rigid printed board is moved toward the first electronic component by bending the flexible printed board, and the second rigid printed board provides rigid barrier protection for the first electronic component.

[0006] Preferably, the first rigid printed circuit board is provided with a plurality of heat dissipation copper blocks in the area around the first electronic component; and / or the second rigid printed circuit board is provided with a plurality of heat dissipation copper blocks in the area close to the first electronic component after the flexible printed circuit board is bent.

[0007] Preferably, the first rigid printed circuit board is provided with a mounting hole, and a second electronic component is mounted in the mounting hole.

[0008] Preferably, the installation height of the second electronic component is lower than the height of the installation hole.

[0009] Preferably, a first back hole is drilled on a surface of the first rigid printed circuit board facing away from the first electronic component.

[0010] Preferably, the first back hole is filled with epoxy resin.

[0011] Preferably, the flexible printed circuit board includes a first soft board and a second soft board respectively arranged at two ends of the first rigid printed circuit board, the first soft board and the second soft board are respectively connected to two second rigid printed circuit boards at one end away from the first rigid printed circuit board, and the first electronic component is arranged at the center of the first rigid printed circuit board.

[0012] Preferably, the flexible printed board further comprises a third flexible board connected to the first rigid printed board, and one end of the third flexible board away from the first rigid printed board is connected to one of the second rigid printed boards.

[0013] Preferably, a second back hole is provided on a side of the second rigid printed circuit board away from the first electronic component.

[0014] Preferably, the second back hole is filled with epoxy resin.

[0015] In the technical solution provided by the utility model, the first rigid printed board and the second rigid printed board are rigid PCB circuit boards, and the flexible printed board is an FPC flexible circuit board, and the three are electrically connected through metallized holes. The large-volume and high-power first electronic component is arranged on the first rigid printed board. The foldable second rigid printed board is more flexible to install in the three-dimensional space inside the small electronic device than a whole rigid PCB board. The second rigid printed board can be folded to any angle according to the installation requirements of the circuit design, which is suitable for complex internal spaces and better connected with other circuits, greatly saving the internal space of the electronic device. At the same time, when the second rigid printed board is folded above the first electronic component, a rigid barrier can be formed to protect the first electronic component in the electronic device, preventing the first circuit component from being loosened or damaged due to internal collisions. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] One or more embodiments are exemplarily described by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and the figures in the drawings do not constitute proportional limitations unless otherwise stated.

[0017] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the foldable rigid-flexible board of the utility model;

[0018] Figure 2 This is a schematic diagram of a top view of an embodiment of the foldable rigid-flexible board of the utility model;

[0019] Figure 3 The figure is a bottom view structural diagram of an embodiment of the foldable rigid-flexible board of the utility model.

[0020] In the figure: 1. Folding rigid-flex board; 2. First rigid printed board; 21. First electronic component; 22. Mounting hole; 221. Second electronic component; 23. First back hole; 24. First connecting hole; 3. Flexible printed board; 31. First soft board; 32. Second soft board; 34. Second connecting hole; 4. Second rigid printed board; 41. Second back hole; 42. Third connecting hole; 5. Heat dissipation copper block. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the utility model, the utility model is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element, or there can be one or more centered elements therebetween. When an element is described as "connected" to another element, it can be directly connected to another element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are only for illustrative purposes. In the description of the utility model, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; the meaning of "multiple" is two or more. The term "include" and any variation thereof means non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may be present or added.

[0022] In addition, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or a connection between two components. All technical and scientific terms used in this specification have the same meaning as those generally understood by technicians in the technical field of the present utility model. The terms used in the specification of the present utility model are only for the purpose of describing specific embodiments and are not used to limit the present utility model. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.

[0023] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0024] Please refer to Figures 1 to 3The utility model provides a foldable rigid-flexible board, comprising: a first rigid printed board 2, on which a first electronic component 21 is arranged, and a plurality of first connection holes 24 arranged equidistantly are arranged at the edge of the first rigid printed board 2; a flexible printed board 3, one or more flexible printed boards 3 are connected to the first rigid printed board 2, and the flexible printed board 3 is provided with a plurality of second connection holes 34 corresponding to the positions of the first connection holes 24 in the area connected to the first rigid printed board 2, and the second connection holes 34 are aligned with the first connection holes 24, and the first connection holes 24 and the second connection holes 34 after alignment have metallized holes inside, and the first rigid printed board 2 and the flexible printed board 3 are connected by The metallized holes are electrically connected; the second rigid printed board 4 is arranged at one end of the flexible printed board 3 away from the first rigid printed board 2, and the second rigid printed board 4 is provided with a plurality of third connection holes 42 corresponding to the positions of the second connection holes 34 at the connection with the flexible printed board 3, the second connection holes 34 are aligned with the third connection holes 42, and the aligned third connection holes 42 have metallized holes inside the second connection holes 34, and the second rigid printed board 4 and the flexible printed board 3 are electrically connected through the metallized holes; the second rigid printed board 4 is moved toward the first electronic component 21 by bending the flexible printed board 3, and the second rigid printed board 4 provides rigid barrier protection for the first electronic component 21.

[0025] In the technical solution provided by the utility model, the first rigid printed board 2 and the second rigid printed board 4 are rigid PCB circuit boards, and the flexible printed board 3 is an FPC flexible circuit board, and the three are electrically connected through metallized holes. The large-volume and high-power first electronic component 21 is arranged on the first rigid printed board 2. The foldable second rigid printed board 4 is more flexible to install in the three-dimensional space inside the small electronic device than a whole rigid PCB board. The second rigid printed board 4 can be folded to any angle according to the installation requirements of the circuit design, which is suitable for complex internal spaces and better connected with other circuits, greatly saving the internal space of the electronic device. At the same time, when the second rigid printed board 4 is folded above the first electronic component 21, a rigid barrier can be formed to protect the first electronic component 21 in the electronic device, preventing the first circuit component from being loosened or damaged due to internal collisions.

[0026] Please refer to Figures 1 to 3In one embodiment, the first rigid printed board 2 is provided with a plurality of heat dissipation copper blocks 5 in the area around the first electronic component 21; and / or, the second rigid printed board 4 is provided with a plurality of heat dissipation copper blocks 5 in the area near the first electronic component 21 after the flexible printed board 3 is bent. The heat dissipation copper blocks 5 on the first rigid printed board 2 are provided around the first electronic component 21, mainly to quickly dissipate heat from the first electronic component 21. After folding, the second rigid printed board 4 is above the first electronic component 21. The heat dissipated by the high-power first electronic component 21 will affect the circuit performance on the second rigid printed board 4 and increase the possibility of burning. Therefore, the heat dissipation copper blocks 5 are provided around the first electronic component 21, so that the heat is transferred to the bottom of the first rigid printed board 2 through the heat dissipation copper blocks 5, and does not affect the circuit on the second rigid printed board 4. The heat dissipation copper blocks 5 provided on the second rigid printed board 4 are to accelerate the heat transfer of the first electronic component 21 when it is close to the first electronic component 21 after folding, so as to prevent the circuit from being burned.

[0027] Please refer to Figures 1 to 3 In one embodiment, a mounting hole 22 is provided on the first rigid printed board 2, and a second electronic component 221 is installed in the mounting hole 22. The microstrip line or pad of the first printed board is exposed on the bottom surface of the mounting hole 22, and the second electronic component 221 is electrically connected to the first electronic component 21 by connecting to the microstrip line or pad to realize the circuit design function. When the second electronic component 221 is connected or superimposed with other chip circuits on the first rigid printed board 2, the depth of the mounting hole 22 reduces the final height of the product to facilitate assembly.

[0028] Please refer to Figures 1 to 3 In one embodiment, the mounting height of the second electronic component 221 is lower than the height of the mounting hole 22. When the second electronic component 221 is connected or stacked with other chip circuits on the first rigid printed circuit board 2, the final height is further reduced to facilitate circuit board assembly.

[0029] Please refer to Figures 1 to 3 In one embodiment, a first back hole 23 is drilled on a surface of the first rigid printed board 2 facing away from the first electronic component 21. Since there are metallized holes connecting different conductive layers on both the first rigid printed board 2 and the flexible printed board 3, the vias will produce equivalent series inductance in high-speed signal transmission. The provision of the first back hole 23 reduces the effective copper ring area around the vias, thereby reducing the inductance, improving the transmission quality of high-speed signals, and reducing signal delay and distortion.

[0030] Please refer to Figures 1 to 3 In one embodiment, epoxy resin is filled in the first back hole 23. Filling the first back hole 23 with epoxy resin can improve the mechanical strength, insulation performance, thermal stability and waterproof and moisture-proof performance of the first rigid printed circuit board 2, while reducing the capacitance effect and improving the transmission quality of high-speed signals.

[0031] Please refer to Figures 1 to 3 In one embodiment, the flexible printed board 3 includes a first soft board 31 and a second soft board 32 respectively arranged at both ends of the first rigid printed board 2, and the ends of the first soft board 31 and the second soft board 32 away from the first rigid printed board 2 are respectively connected to the two second rigid printed boards 4, and the first electronic component 21 is arranged at the center of the first rigid printed board 2. The first soft board 31 and the second soft board 32 are flexible circuit boards, which can be folded and rotated along the connection edge with the first rigid printed board 2, and respectively drive the second rigid printed board 4 to a suitable installation position.

[0032] Please refer to Figures 1 to 3 In one embodiment, the flexible printed board 3 further includes a third flexible board connected to the first rigid printed board 2, and one end of the third flexible board away from the first rigid printed board 2 is connected to a second rigid printed board 4. When the circuit design layout is too large, the third flexible board can be added to increase the installation area of ​​the circuit design. The third flexible board can be folded and rotated along the edge connected to the first rigid printed board 2 to drive the second rigid printed board 4 to a suitable installation position.

[0033] Please refer to Figures 1 to 3 In one embodiment, a second back hole 41 is provided on a side of the second rigid printed board 4 away from the first electronic component 21. Since there are metallized holes connecting different conductive layers on both the second rigid printed board 4 and the flexible printed board 3, the vias will produce equivalent series inductance in high-speed signal transmission. The provision of the second back hole 41 reduces the effective copper ring area around the vias, thereby reducing the inductance, improving the transmission quality of high-speed signals, and reducing signal delay and distortion.

[0034] Please refer to Figures 1 to 3 In one embodiment, epoxy resin is filled in the second back hole 41. Filling the second back hole 41 with epoxy resin can improve the mechanical strength, insulation performance, thermal stability and waterproof and moisture-proof performance of the second rigid printed circuit board 4, while reducing the capacitance effect and improving the transmission quality of high-speed signals.

[0035] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Under the concept of the present invention, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes in different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity. Although the present invention has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A foldable rigid-flex board, characterized in that: include: A first rigid printed board (2), wherein a first electronic component (21) is provided on the first rigid printed board (2), and a plurality of first connection holes (24) arranged at equal distances are provided on an edge of the first rigid printed board; A flexible printed circuit board (3), one or more of the flexible printed circuit boards (3) are connected to the first rigid printed circuit board (2), the flexible printed circuit board (3) is provided with a plurality of second connection holes (34) corresponding to the positions of the first connection holes (24) in the area connected to the first rigid printed circuit board (2), the second connection holes (34) are aligned with the first connection holes (24), the first connection holes (24) and the second connection holes (34) after alignment have metallized holes inside, and the first rigid printed circuit board (2) and the flexible printed circuit board (3) are electrically connected via the metallized holes; A second rigid printed board (4), the second rigid printed board (4) being arranged at one end of the flexible printed board (3) away from the first rigid printed board (2), the second rigid printed board (4) being provided with a plurality of third connection holes (42) corresponding to the positions of the second connection holes (34) at the connection with the flexible printed board (3), the second connection holes (34) being aligned with the third connection holes (42), the third connection holes (42) and the second connection holes (34) having metallized holes inside after alignment, and the second rigid printed board (4) and the flexible printed board (3) being electrically connected via the metallized holes; The second rigid printed board (4) is moved toward the first electronic component (21) by bending the flexible printed board (3), and the second rigid printed board (4) provides a rigid barrier protection for the first electronic component (21).

2. The foldable rigid-flex board according to claim 1, characterized in that: The first rigid printed circuit board (2) is provided with a plurality of heat dissipation copper blocks (5) in the area surrounding the first electronic component (21); And / or, the second rigid printed circuit board (4) is provided with a plurality of heat dissipation copper blocks (5) in an area close to the first electronic component (21) after the flexible printed circuit board (3) is bent.

3. The foldable rigid-flex board according to claim 2, characterized in that: The first rigid printed circuit board (2) is provided with a mounting hole (22), and a second electronic component (221) is mounted in the mounting hole (22).

4. The foldable rigid-flex board according to claim 3, characterized in that: The installation height of the second electronic component (221) is lower than the height of the installation hole (22).

5. The foldable rigid-flex board according to claim 1, characterized in that: A first back hole (23) is drilled on a surface of the first rigid printed circuit board (2) facing away from the first electronic component (21).

6. The foldable rigid-flex board according to claim 5, characterized in that: The first back hole (23) is filled with epoxy resin.

7. The foldable rigid-flex board according to claim 1, characterized in that: The flexible printed circuit board (3) comprises a first soft board (31) and a second soft board (32) which are arranged at two ends of the first rigid printed circuit board (2), and the ends of the first soft board (31) and the second soft board (32) which are away from the first rigid printed circuit board (2) are respectively connected to two of the second rigid printed circuit boards (4), and the first electronic component (21) is arranged at the center of the first rigid printed circuit board (2).

8. The foldable rigid-flex board according to claim 7, characterized in that: The flexible printed circuit board (3) further comprises a third soft board connected to the first rigid printed circuit board (2), and one end of the third soft board away from the first rigid printed circuit board (2) is connected to one of the second rigid printed circuit boards (4).

9. The foldable rigid-flex board according to claim 1, characterized in that: A second back hole (41) is provided on a side of the second rigid printed circuit board (4) away from the first electronic component (21).

10. The foldable rigid-flex board according to claim 9, characterized in that: The second back hole (41) is filled with epoxy resin.

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