Chip mounting head mechanism of chip mounter

By using transparent suction head and reflective mirror in the patch machine, combined with a deviation correction motor and sliding seat, the light occlusion problem is solved, high-precision patch and multi-piece absorption is achieved, and product quality and production efficiency are improved.

CN222170313UActive Publication Date: 2024-12-13GUANGDONG SENSSUN ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202420358242.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-26
Publication Date
2024-12-13
Estimated Expiration
2034-02-26

AI Technical Summary

Technical Problem

The patch head structure of traditional patch machines leads to light blocking, making it difficult to accurately observe and identify components, resulting in patch position deviations and affecting product quality.

Method used

The transparent suction head is equipped with a reflective mirror and a circumferential light source, combined with a deviation correction motor and sliding seat to ensure that the light is transparent and shadowless, real-time angle compensation and multi-piece absorption capacity.

Benefits of technology

It improves the accuracy and yield of the patch, reduces the number of bad products, and enhances product quality and production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The chip mounting head mechanism comprises a transparent chip suction head, a first air channel is arranged in the chip suction head, the bottom of the chip suction head is provided with a chip suction air port communicated with the first air channel, and the outer side of the chip suction head is provided with a light source surrounding the chip suction head along the circumferential direction. A reflective mirror surface capable of reflecting light emitted by a light source to the bottom of the suction piece head is arranged in the suction piece head, the suction piece head is transparent, the light source is arranged on the outer side of the suction piece head in the circumferential direction, and the reflective mirror surface capable of reflecting the light emitted by the light source to the bottom of the suction piece head is arranged in the suction piece head. Therefore, the light is reflected to the sheet taking area through the reflector surface, the visual field of product photographing is brighter, no black shadow or visual field blind area exists in the imaging center and the periphery of the photographed product, and the photographing recognition precision is high, so that the pasting accuracy is improved, the yield is improved, and the quality of the pasted product is improved.
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Description

Technical Field

[0001] The invention relates to the technical field of chip mounters, and in particular to a chip mount head mechanism of a chip mounter. Background Art

[0002] A chip mounter is a device used for surface mounting of electronic components. It is mainly used to accurately solder small electronic components such as strain gauges, resistors, capacitors, integrated circuits, etc. to printed circuit boards. The chip mounter generally uses an automated method to extract components from a feeder, accurately place them on the PCB, and connect them using heat or light-curing glue.

[0003] There are some automatic patch machines on the market, but this type of equipment is limited by the patch head structure. When the traditional film-taking mechanism is imaging, the light is blocked by the patch head structure, and there will be certain shadows and blind spots in the film-absorbing area, which makes it difficult to accurately observe and identify the characteristics of the product in the center area. As a result, the position of the patch deviates during patch placement, which reduces the quality of the product or increases the number of defective products.

[0004] The present invention is made based on the above situation. Summary of the invention

[0005] The present invention overcomes the shortcomings of the prior art and provides a film placement head mechanism that can reduce the influence of the shadow of the film suction head on film picking, thereby being able to better identify products and improve the accuracy of film placement.

[0006] The present invention is achieved through the following technical solutions:

[0007] A chip placement head mechanism of a chip placement machine comprises a transparent chip suction head, a first air channel is arranged inside the chip suction head, a chip suction air port connected to the first air channel is arranged at the bottom of the chip suction head, a light source surrounding the chip suction head in a circumferential direction is arranged outside the chip suction head, and a reflective mirror surface capable of reflecting light emitted by the light source toward the bottom of the chip suction head is arranged inside the chip suction head.

[0008] As described above, the chip head mechanism of a chip placement machine also includes a correction motor that can drive the chip suction head to rotate, a reflector sleeve is sleeved on the output shaft of the correction motor, the reflective mirror surface includes a conical surface located at the bottom of the reflector sleeve, and the chip suction head is sleeved on the reflector sleeve.

[0009] As described above, a patch head mechanism of a patch machine is provided with a second air duct on the reflector cover, and a third air duct is provided on the output shaft of the correction motor. The air inlet end of the second air duct is conductively connected to the first air duct, and the air inlet end of the third air duct is conductively connected to the air outlet end of the second air duct. The correction motor is also provided with a connecting pipe that can be connected to an air compressor, and the connecting pipe is provided with an air outlet end conductively connected to the third air duct.

[0010] In the chip mounting head mechanism of a chip mounting machine as described above, a lampshade surrounding the reflector sleeve in the circumferential direction is disposed on the outer side of the reflector sleeve, and the light source is disposed between the lampshade and the reflector sleeve.

[0011] As described above, a chip placement head mechanism of a chip placement machine also includes a frame, and the frame is also provided with a sliding seat that can slide up and down along the frame, a driving mechanism that can drive the sliding seat to slide is provided between the sliding seat and the frame, the correction motor is connected to the sliding seat, and the frame is also provided with a regulating component for controlling the sliding displacement of the sliding seat.

[0012] In the chip placement head mechanism of a chip placement machine as described above, the driving mechanism includes a cylinder connected to the frame and capable of pushing the sliding seat, and a reset spring for resetting the sliding seat is also provided between the frame and the sliding seat.

[0013] In the chip placement head mechanism of a chip placement machine as described above, the regulating component includes an induction sheet connected to the deviation correction motor or the sliding seat, and a sensor connected to the frame and capable of sensing the proximity of the induction sheet.

[0014] In the chip placement head mechanism of a chip placement machine as described above, a connecting plate and a control circuit board are connected to the frame, the control circuit board is electrically connected to the deviation correction motor, a sensor is provided on the connecting plate, the sensor is U-shaped, the induction sheet extends into the inner concave area of ​​the U-shape, and induction probes are provided at both ends of the sensor.

[0015] In the chip placement head mechanism of a chip placement machine as described above, the sensor includes a proximity optical coupling sensor.

[0016] In the chip placement machine's chip placement head mechanism as described above, the frame is provided with a plurality of sliding seats, each of which is provided with the chip placement machine's chip placement head mechanism.

[0017] Compared with the prior art, the present invention has the following advantages:

[0018] 1. The film suction head in this case is transparent, with a light source provided on the outside of the film suction head along the circumference, and a reflective mirror provided inside the film suction head that can reflect the light from the light source to the bottom of the film suction head, thereby reflecting the light to the film taking area through the reflective mirror, making the product photography field of view more transparent. After the photo is taken, there is no black shadow in the imaging center and around the product, no blind area of ​​vision, and the camera recognition accuracy is high, thereby improving the accuracy of the patch, improving the yield rate, and improving the quality of the patch products.

[0019] 2. The placement head mechanism also includes a correction motor that can drive the suction head to rotate. The correction motor can perform real-time angle compensation on the suction head to adsorb the product to be pasted, ensuring that each step of the process is accurate and controllable.

[0020] 3. A second air duct is provided on the reflector cover, a third air duct is provided on the output shaft of the correction motor, and the correction motor is also provided with a connecting pipe that can be connected to an air compressor. The air duct is built into the reflector cover and the correction motor, so there is no need for an external ventilation duct, which makes it easier to rotate the output shaft of the correction motor.

[0021] 4. A lampshade is provided on the outside of the reflector cover and surrounds it in the circumferential direction. The light source is provided between the lampshade and the reflector cover, and the lampshade enables the light source to better illuminate the reflector surface and the film taking area at the bottom of the film suction head.

[0022] 5. The frame is provided with a sliding seat which can slide up and down along the frame. The correction motor is connected to the sliding seat. The sliding seat slides so that the suction head is close to the sheet product for suction.

[0023] 6. An induction sheet is provided on the correction motor or the sliding seat, and a sensor on the frame can sense the proximity of the induction sheet. The sensor senses the induction sheet and sends a signal to the control circuit board to regulate the activity of the sliding seat.

[0024] 7. The frame is provided with a plurality of sliding seats, each of which is provided with a patch head assembly, which can absorb a plurality of sheet products at one time. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The specific embodiments of the present invention are further described in detail below with reference to the accompanying drawings, wherein:

[0026] Figure 1 The structure of the present invention is schematically shown in FIG. Figure 1 ;

[0027] Figure 2 is a cross-sectional view of the present invention;

[0028] Figure 3 yes Figure 2 Enlarged view of part A in the middle;

[0029] Figure 4 This is a schematic diagram of the present invention. Figure 1 ;

[0030] Figure 5 It is a structural schematic diagram of the reflector cover in the present invention;

[0031] Figure 6 The structure of the present invention is schematically shown in FIG. Figure 2 ;

[0032] Figure 7 The structure of the present invention is schematically shown in FIG. Figure 2 ;

[0033] Figure 8 This is a schematic diagram of the present invention. Figure 2 . DETAILED DESCRIPTION

[0034] The present invention will be further described below in conjunction with the accompanying drawings:

[0035] like Figures 1 to 5 The chip placement head mechanism of a chip placement machine shown in the figure includes a transparent chip suction head 1, a first air channel 12 is provided in the chip suction head 1, a chip suction air port 11 connected to the first air channel 12 is provided at the bottom of the chip suction head 1, a light source 2 is provided circumferentially surrounding the chip suction head 1 on the outside of the chip suction head 1, and a reflective mirror 31 is provided inside the chip suction head 1 for reflecting light emitted by the light source 2 toward the bottom of the chip suction head 1.

[0036] The film suction head 1 in this case is transparent, and a light source 2 is provided on the outer side of the film suction head 1 along the circumferential direction. A reflective mirror 31 is provided inside the film suction head 1, which can reflect the light emitted by the light source 2 to the bottom of the film suction head 1, so that the light is reflected to the film taking area through the reflective mirror 31, and the field of view of the product is brighter. After taking the photo, there is no black shadow in the imaging center and the surrounding of the product, no blind area of ​​the field of view, and the recognition accuracy of the photo is high, thereby improving the accuracy of the patch, improving the yield rate, and improving the quality of the patch product.

[0037] Specifically, the conical surface is a conical surface, and the light source 2 can be an LED lamp bead or a light strip, or of course, other reflectors. The conical surface reflects the incident light toward the film suction head 1. Compared with the built-in light source 2, the light source 2 is arranged outside and reflected by the reflective mirror surface 31, so that the rotation of the film suction head 1 is not affected by the wires of the light source 2; at the same time, the light source 2 is generally more easily damaged than other mechanical structures, and the external placement of the light source 2 also facilitates the replacement of the light source 2.

[0038] In one embodiment, the angle between the hypotenuse of the conical surface and its axis is 45°, and the incident angle of the light source 2 on the reflective mirror surface 31 and the reflection angle of the light reflected to the film suction head 1 are both 45°, thereby making the overall structural layout more reasonable and compact.

[0039] The reflector cover 3 is provided with a second air passage 32, and the output shaft of the correcting motor 4 is provided with a third air passage 41, the air inlet end of the second air passage 32 is conductively connected to the first air passage 12, and the air inlet end of the third air passage 41 is conductively connected to the air outlet end of the second air passage 32. The correcting motor 4 is also provided with a connecting pipe 42 that can be connected to an air compressor, and the connecting pipe 42 is provided with an air outlet end that is conductively connected to the third air passage 41. The air passage is built into the reflector cover 3 and the correcting motor 4, so that there is no need for an external ventilation duct, so that the rotation of the output shaft of the correcting motor 4 is not affected by the duct, which is more convenient for the rotation of the output shaft of the correcting motor 4. Among them, the correcting motor 4 can be a stepping motor.

[0040] In one embodiment, the film attachment head mechanism further includes a correction motor 4 capable of driving the film suction head 1 to rotate, a reflector sleeve 3 is sleeved on the output shaft of the correction motor 4, the reflector surface 31 includes a conical surface located at the bottom of the reflector sleeve 3, and the film suction head 1 is sleeved on the reflector sleeve 3. The correction motor 4 performs real-time angle compensation on the adsorption of the product to be attached on the film suction head 1, ensuring that each step of the process is accurately controllable. Among them, the reflector sleeve 3 can be connected to the output shaft of the correction motor 4 by other means such as threaded fasteners or glue. The reflector sleeve 3 can be divided into a sleeve section 33 and an air inlet section 34, the reflector surface 31 is arranged at the bottom of the air inlet section 34, the sleeve section 33 is sealed with the airway wall of the first airway 12 of the film suction head 1, an air outlet gap for gas circulation is provided between the air inlet section 34 and the airway wall of the first airway 12, and the air inlet end of the second airway 32 is arranged on the side wall of the air inlet section 34.

[0041] A lampshade 5 is provided on the outside of the reflector cover 3 and surrounds it circumferentially. The light source 2 is provided between the lampshade 5 and the reflector cover 3 . The lampshade 5 enables the light source 2 to better illuminate the reflector surface 31 and the film taking area at the bottom of the film suction head 1 .

[0042] like Figures 6 to 8 The chip placement head mechanism of a chip placement machine shown in the figure also includes a frame 6, a sliding seat 7 that can slide up and down along the frame 6 is also provided on the frame 6, a driving mechanism that can drive the sliding seat 7 to slide is provided between the sliding seat 7 and the frame 6, the deviation correction motor 4 is connected to the sliding seat 7, and a regulating component that controls the sliding displacement of the sliding seat 7 is also provided on the frame 6, and the suction head 1 is close to the sheet product for suction through the sliding of the sliding seat 7. The sliding seat 7 is slidably connected to the frame 6 through a slide rail component.

[0043] In one embodiment, the lampshade 5 is connected to the frame 6 by means of threaded fasteners or other connection methods such as snaps, and the light source 2 is connected to the inner wall of the lampshade 5 by means of glue or other connection methods such as threaded fasteners. The deviation correction motor 4 is connected to the sliding seat 7 by means of threaded fasteners or other connection methods. The lampshade 5 is in a tubular shape with upper and lower openings.

[0044] The driving mechanism includes a cylinder 8 connected to the frame 6 and capable of pushing the sliding seat 7, and a return spring 9 is provided between the frame 6 and the sliding seat 7 to return the sliding seat 7. The cylinder 8 is fixedly connected to the frame 1 by threaded fasteners or other connection methods. One end of the return spring 9 is connected to the frame 1, and the other end is connected to the sliding seat 7, and the sliding seat 7 is returned by the return spring 9.

[0045] The regulating component includes an induction sheet 43 connected to the deviation correction motor 4 or the sliding seat 7, and a sensor 45 connected to the frame 6 and capable of sensing the proximity of the induction sheet 43. The frame 6 is connected with a connecting plate 61 and a control circuit board 62, the control circuit board 62 is electrically connected to the deviation correction motor 4, and a sensor 45 is provided on the connecting plate 61. The sensor 45 is U-shaped, and the induction sheet 43 extends into the inner concave area of ​​the U-shape. Both ends of the sensor 45 are provided with induction probes 44. The sensor 45 senses the induction sheet 43 and sends a signal to the control circuit board 62 to regulate the movement of the sliding seat 7 through the cylinder 8.

[0046] Specifically, the sensor 45 includes a proximity photocoupler sensor, which abandons the traditional magnetic switch and proximity switch and adopts proximity photocoupler signal feedback, thereby eliminating electromagnetic interference and providing more accurate signal feedback.

[0047] Control circuits are provided on the control circuit board 62 and the connecting board 61, and signal wires and power supply wire circuits such as the light source 2, the deviation correction motor 4, the induction point signal, and the mechanism return to origin signal are integrated on the control circuit board 62 and the connecting board 61, so as to facilitate disassembly and maintenance and reduce complicated line routing.

[0048] In one embodiment, a plurality of sliding seats 7 are disposed on the frame 6, and each of the sliding seats 7 is provided with a placement head mechanism of a placement machine, so that a plurality of sheet products can be absorbed at one time, thereby improving production efficiency.

Claims

1. A chip placement head mechanism of a chip placement machine, characterized in that: The invention comprises a transparent film suction head (1), wherein a first air passage (12) is provided inside the film suction head (1), a film suction air port (11) connected to the first air passage (12) is provided at the bottom of the film suction head (1), a light source (2) surrounding the film suction head (1) in a circumferential direction is provided on the outside of the film suction head (1), and a reflective mirror (31) capable of reflecting light emitted by the light source (2) toward the bottom of the film suction head (1) is provided inside the film suction head (1).

2. The chip placement head mechanism of a chip placement machine according to claim 1, characterized in that: The film attachment head mechanism further comprises a correction motor (4) capable of driving the film suction head (1) to rotate, a reflector sleeve (3) is sleeved on the output shaft of the correction motor (4), the reflector surface (31) comprises a conical surface located at the bottom of the reflector sleeve (3), and the film suction head (1) is sleeved on the reflector sleeve (3).

3. The chip placement head mechanism of a chip placement machine according to claim 2, characterized in that: The reflector cover (3) is provided with a second air passage (32), the output shaft of the deviation correction motor (4) is provided with a third air passage (41), the air inlet end of the second air passage (32) is conductively connected to the first air passage (12), the air inlet end of the third air passage (41) is conductively connected to the air outlet end of the second air passage (32), the deviation correction motor (4) is also provided with a connecting pipe (42) capable of connecting to an air compressor, and the connecting pipe (42) is provided with an air outlet end conductively connected to the third air passage (41).

4. The chip placement head mechanism of a chip placement machine according to claim 3, characterized in that: The outer side of the reflector sleeve (3) is provided with a lampshade (5) surrounding the reflector sleeve in the circumferential direction, and the light source (2) is arranged between the lampshade (5) and the reflector sleeve (3).

5. The chip placement head mechanism of a chip placement machine according to claim 4, characterized in that: The patch head mechanism also includes a frame (6), the frame (6) is also provided with a sliding seat (7) that can slide up and down along the frame (6), a driving mechanism that can drive the sliding seat (7) to slide is provided between the sliding seat (7) and the frame (6), the deviation correction motor (4) is connected to the sliding seat (7), and the frame (6) is also provided with a regulating component for controlling the sliding displacement of the sliding seat (7).

6. The chip placement head mechanism of a chip placement machine according to claim 5, characterized in that: The driving mechanism comprises a cylinder (8) connected to a frame (6) and capable of pushing a sliding seat (7); a return spring (9) for returning the sliding seat (7) is also provided between the frame (6) and the sliding seat (7).

7. The chip placement head mechanism of a chip placement machine according to claim 5, characterized in that: The regulating component comprises an induction sheet (43) connected to the deviation-correcting motor (4) or the sliding seat (7), and a sensor (45) connected to the frame (6) and capable of sensing the approach of the induction sheet (43).

8. The chip placement head mechanism of a chip placement machine according to claim 7, characterized in that: The frame (6) is connected to a connecting plate (61) and a control circuit board (62), the control circuit board (62) is electrically connected to the deviation correction motor (4), the connecting plate (61) is provided with a sensor (45), the sensor (45) is U-shaped, the induction sheet (43) extends into the inner concave area of ​​the U-shape, and induction probes (44) are provided at both ends of the sensor (45).

9. The chip placement head mechanism of a chip placement machine according to claim 8, characterized in that: The sensor (45) comprises a proximity optical coupling sensor.

10. A chip placement head mechanism of a chip placement machine according to any one of claims 5 to 9, characterized in that: The frame (6) is provided with a plurality of sliding seats (7), and each of the sliding seats (7) is provided with a chip placement head mechanism of a chip placement machine.